Optoelectronic device and method for manufacturing an optoelectronic device

Abstract

Optoelectronic device (500) with a printed circuit board (600) designed as a DCB (direct copper bonding) printed circuit board with a layered composite of copper, an insulator and another layer of copper or as a metal core board, and with a plurality of optoelectronic components (100), wherein the optoelectronic components (100) each have a housing (110) comprising a base (200) with a top (201) and a bottom (202) and a cap (300), wherein the optoelectronic components (100) each have a laser chip (400) which is arranged between the top (201) of the socket (200) and the cap (300), wherein a first solder contact surface (210) and a second solder contact surface (220) are formed on the underside (202) of the base (200) of each optoelectronic component (100), wherein the laser chip (400) of each optoelectronic component (100) has a second electrical contact surface (420), wherein the second electrical contact surface (420) is electrically connected by means of a second bond wire (225) to a section of the base (200) which is electrically connected to the second solder contact surface (220), wherein the optoelectronic components (100) are arranged in an electrical series circuit (630) on a surface (601) of the circuit board (600), wherein the base (200) of each optoelectronic component (100) has an approximately rectangular shape and the housings (110) of the optoelectronic components (100) are arranged close together.

Description

[0001] The present invention relates to an optoelectronic device according to claim 1 and a method for manufacturing an optoelectronic device according to claim 10.

[0002] It is known to design semiconductor-based laser components with housings in which laser diodes are hermetically sealed to protect them from moisture and contaminants. It is also known to equip the housings of such laser components with wire contacts for through-hole mounting. The wire contacts can be inserted into designated contact openings in a printed circuit board and electrically connected, for example, by wave soldering. Furthermore, it is known to connect the housings of such laser components using mechanical clamping or adhesive bonding to dissipate heat generated during operation of the laser component.

[0003] DE 102 47 315 ​​A1 describes a TO package for high-frequency applications with a stamped base closed by a cup-shaped cover, in which electrical leads are routed into the interior of the cover. A wiring carrier connected to the stamped base is proposed, through which the leads run and exit to connect to conductors on a circuit board. The wiring carrier is a ceramic body consisting of multiple layers, with vias for the leads provided within.

[0004] US 2007 / 0228405A1 describes an electronic component comprising an electronic element, a first conductive base, a second conductive base, an insulator, and a terminal. The insulator isolates the first conductive base from the second conductive base.

[0005] US patent 2004 / 0026757A1 describes a semiconductor device with a base and a top. Several conductors extend through the base.

[0006] One object of the present invention is to provide an optoelectronic device. This object is achieved by an optoelectronic device having the features of claim 1. A further object of the present invention is to provide a method for manufacturing an optoelectronic device. This object is achieved by a method having the features of claim 10. Various embodiments are specified in the dependent claims.

[0007] An optoelectronic component comprises a housing consisting of a base with a top and bottom surface, and a cap. The optoelectronic component also includes a laser chip located between the top surface of the base and the cap. A first and a second solder pad are provided on the bottom surface of the base. This optoelectronic component is advantageously suitable for surface mounting. The first and second solder pads of the optoelectronic component can be electrically connected, for example, by reflow soldering. Furthermore, heat can be dissipated from the optoelectronic component via the electrically connected solder pads on the bottom surface of the base housing.Advantageously, the assembly of this optoelectronic component can be automated with minimal effort, which enables cost-effective use of the optoelectronic component in mass-produced devices.

[0008] In one embodiment of the optoelectronic component, an electrically conductive pin extends through the socket between the top and bottom surfaces. The pin is electrically insulated from the other sections of the socket. The pin is also electrically connected to the first solder pad. Advantageously, the pin thus provides an electrically conductive connection from the first solder pad on the bottom of the socket to the top surface of the socket. The pin can, for example, be embedded in the socket of the optoelectronic component's housing.

[0009] In one embodiment of the optoelectronic component, the laser chip has a first electrical contact surface. This first electrical contact surface is electrically connected to the pin by means of a first bond wire. The pin and the first bond wire thus establish an electrically conductive connection between the first solder contact surface on the underside of the socket of the optoelectronic component housing and the first electrical contact surface of the laser chip. This allows the laser chip of the optoelectronic component to be electrically contacted via the first solder contact surface on the underside of the socket of the optoelectronic component housing.

[0010] The laser chip has a second electrical contact surface. This second electrical contact surface is electrically connected via a second bond wire to a section of the socket, which is electrically connected to the second solder contact surface. Advantageously, this creates an electrically conductive connection between the second solder contact surface on the underside of the socket of the optoelectronic component's housing and the second electrical contact surface of the laser chip of the optoelectronic component, via the socket and the second bond wire. This allows the laser chip to be electrically contacted via the second solder contact surface.

[0011] In one embodiment of the optoelectronic component, the second solder contact surface surrounds the first solder contact surface in a ring-like fashion. Advantageously, this allows the first and second solder contact surfaces to jointly occupy a large portion of the underside of the base of the optoelectronic component's housing. As a result, the first and second solder contact surfaces together form a large thermal contact area of ​​the optoelectronic component, enabling effective heat dissipation.

[0012] In one embodiment of the optoelectronic component, a pedestal is formed on the upper side of the base. The laser chip is mounted on this pedestal. The pedestal can simultaneously serve for thermal and electrical contacting of the laser chip. The shape of the pedestal also determines the orientation of the laser chip relative to the underside of the base of the optoelectronic component's housing.

[0013] In one embodiment of the optoelectronic component, the laser chip is arranged such that one emission direction of the laser chip is oriented perpendicular to the underside of the socket. Advantageously, this allows the optoelectronic component to be arranged on a printed circuit board such that one emission direction of the optoelectronic component is oriented perpendicular to the circuit board. This enables a particularly space-saving arrangement of the optoelectronic component.

[0014] In one embodiment of the optoelectronic component, the base and / or the cap are made of steel. Advantageously, the cap and the base can then be hermetically welded together.

[0015] In one embodiment of the optoelectronic component, the cap has a window. The window can, for example, be glazed into the cap. A laser beam emitted by the laser chip of the optoelectronic component can thus exit the housing of the optoelectronic component through the window in the cap.

[0016] In one embodiment of the optoelectronic component, the cap is welded to the base. Advantageously, this protects the laser chip of the optoelectronic component, which is located between the cap and the base, from moisture and contamination.

[0017] An optoelectronic device comprises a printed circuit board and a plurality of optoelectronic components of the aforementioned type. The optoelectronic components are arranged on a surface of the printed circuit board. Advantageously, the optoelectronic components can be arranged on the surface of the printed circuit board and electrically contacted using a surface-mount method. For example, the optoelectronic components can be electrically contacted by reflow soldering. This enables cost-effective manufacturing of the optoelectronic device with a high degree of automation.

[0018] The optoelectronic components are arranged in a series circuit. Advantageously, this allows the optoelectronic device to exhibit high optical output power. Because the optoelectronic components can be surface-mounted on the printed circuit board, they can be densely packed. This advantageously enables the optoelectronic device to be designed with compact external dimensions.

[0019] A method for manufacturing an optoelectronic device comprises steps for providing a printed circuit board (PCB), providing optoelectronic components of the aforementioned type, and arranging the optoelectronic components in series on a surface of the PCB. Advantageously, the arranging of the optoelectronic components on the surface of the PCB can be automated, for example, using a surface-mount technology (SMT) placement machine. The arranging of the optoelectronic components on the surface of the PCB can be performed in a single operation with the arranging of other components on the surface of the PCB. This advantageously makes the method cost-effective.

[0020] In one embodiment of the method, the optoelectronic components are arranged on the surface of the printed circuit board by means of surface mounting.

[0021] In one embodiment of the method, the optoelectronic components are arranged on the surface of the printed circuit board by means of re-soldering. Advantageously, self-centering of the optoelectronic components can occur. During the melting of a solder, the optoelectronic components are precisely aligned at their target position by surface tension.

[0022] The properties, features, and advantages of this invention described above, as well as the manner in which they are achieved, will become clearer and more readily understandable in connection with the following description of the exemplary embodiments, which are explained in more detail in conjunction with the drawings. These drawings show, in schematic form: Fig. 1 a base of a housing of an optoelectronic component; Fig. 2 a first view of the housing of the optoelectronic component; Fig. 3 a second view of the housing of the optoelectronic component; Fig. 4 a printed circuit board of an optoelectronic device; Fig. 5 the circuit board with optoelectronic components arranged on it; and Fig. 6 a section through the circuit board and the optoelectronic components of the optoelectronic device.

[0023] Fig. Figure 1 shows a schematic perspective view of a base 200 of a housing 110 of an optoelectronic component 100. Fig. Figure 2 shows a schematic perspective view of a cap 300 of the housing 110 of the optoelectronic component 100. Fig. Figure 3 shows a schematic perspective view of the housing 110 of the optoelectronic component 100, in which the base 200 and the cap 300 of the housing 110 are joined together.

[0024] The optoelectronic component 100 can, for example, be a laser component. For example, the optoelectronic component 100 can be a laser component designed to emit a laser beam with a wavelength from the short-wavelength visible spectral range.

[0025] The socket 200 of the housing 110 of the optoelectronic component 100 can also be referred to as the header. The socket 200 comprises an electrically conductive material, preferably a metal. The socket 200 can, for example, comprise an iron or nickel alloy. For example, the socket 200 can comprise steel.

[0026] The base 200 has a top surface 201 and a bottom surface 202 opposite the top surface 201. In the Fig. In the example shown, the base 200 has an approximately rectangular shape, which allows the housing 110 of the optoelectronic component 100, which includes the base 200, to be arranged in close proximity to other similar housings 110 of further optoelectronic components 100. However, the base 200 could also have, for example, a circular or hexagonal shape.

[0027] An electrically conductive pin 260 is embedded in the socket 200, extending from the underside 202 of the socket 200 through the socket 200 to beyond the top side 201 of the socket 200. A portion of the electrically conductive pin 260 projecting beyond the top side 201 of the socket 200 is oriented perpendicular to the top side 201 of the socket 200. The electrically conductive pin 260 is made of an electrically conductive material, for example, a metal. The electrically conductive pin 260 can be made of the same material as the other sections of the socket 200.

[0028] The electrically conductive pin is electrically insulated from the other sections of the base 200 by means of an insulator 265. The insulator 265 can, for example, be designed as a glass insert. Preferably, the electrically conductive pin 260 is hermetically sealed within the base 200 by the insulator 265.

[0029] A pedestal 230 is formed on the upper surface 201 of the socket 200 of the housing 110 of the optoelectronic component 100. The pedestal 230 can also be referred to as the pedestal. The pedestal 230 can be formed integrally with the other sections of the socket 200, made of the same material. In any case, the pedestal 230 is made of an electrically conductive material and is electrically connected to those parts of the socket 200 that are electrically insulated from the electrically conductive pin 260. The pedestal 230 has a chip-receiving surface 235, which is preferably oriented approximately perpendicular to the upper surface 201 of the socket 200 and thus also perpendicular to the lower surface 202 of the socket 200.

[0030] The optoelectronic component 100 includes a laser chip 400. The laser chip 400 is configured as a semiconductor-based laser diode. The laser chip 400 is configured to emit a laser beam. For example, the laser chip 400 can be configured to emit a laser beam with a wavelength from the short-wavelength visible spectral range, such as a laser beam with a wavelength from the blue spectral range.

[0031] The laser chip 400 has a top surface 401 and a bottom surface 402 opposite the top surface 401. A first electrical contact surface 410 is formed on the top surface 401 of the laser chip 400. A second electrical contact surface 420 is formed on the bottom surface 402 of the laser chip 400. During operation of the laser chip 400, an electrical voltage can be applied to the laser chip 400 between the first electrical contact surface 410 and the second electrical contact surface 420.

[0032] The laser chip 400 of the optoelectronic component 100 is arranged on the chip mounting surface 235 of the pedestal 230 of the base 200 of the housing 110 of the optoelectronic component 100 such that the emission direction 430 of the laser chip 400 is oriented approximately perpendicular to the top surface 201 of the base 200 and thus also perpendicular to the bottom surface 202 of the base 200. During operation, the laser chip 400 emits a laser beam in the emission direction 430.

[0033] The emission direction 430 of the laser chip 400 is in the example of the Fig. The laser chip 400 is oriented parallel to the top surface 401 of the laser chip 400. The laser chip 400 is designed as an edge emitter. However, it is also possible to design the laser chip 400 as a surface emitter. In this case as well, the laser chip 400 should be arranged on the pedestal 230 of the socket 200 of the housing 110 of the optoelectronic component 100 such that the emission direction 430 of the laser chip 400 is oriented perpendicular to the top surface 201 and thus also perpendicular to the bottom surface 202 of the socket 200. The pedestal 230 can then optionally be omitted.

[0034] The laser chip 400 is arranged on a carrier 240. The carrier 240 can also be referred to as a submount. The carrier 240 preferably comprises an electrically insulating and thermally conductive material. An electrically conductive metallization is arranged on one upper surface of the carrier 240. The laser chip 400 is arranged on the upper surface of the carrier 240 such that the underside 402 of the laser chip 400 faces the upper surface of the carrier 240. The second electrical contact surface 420 of the laser chip 400, formed on the underside 402 of the laser chip 400, is in electrically conductive contact with the electrically conductive metallization on the upper surface of the carrier 240.

[0035] The carrier 240 is arranged on the chip receiving surface 235 of the pedestal 230 of the base 200 such that a lower side of the carrier 240, opposite the upper side of the carrier 240, faces the chip receiving surface 235. Preferably, there is a thermally conductive connection between the carrier 240 and the pedestal 230.

[0036] The first electrical contact surface 410 of the laser chip 400, formed on the upper surface 401 of the laser chip 400, is electrically connected to the electrically conductive pin 260 by means of a plurality of first bond wires 215. The electrically conductive metallization on the upper surface of the carrier 240 is electrically connected to the pedestal 230 of the socket 200 by means of a plurality of second bond wires 225, and thus also electrically connected to those sections of the socket 200 that are electrically insulated from the electrically conductive pin 260. Since the metallization formed on the top of the carrier 240 is electrically conductively connected to the second electrical contact surface 420 on the underside 402 of the laser chip 400, there is thus an electrically conductive connection between the second electrical contact surface 420 of the laser chip 400 and the sections of the base 200 that are electrically insulated from the electrically conductive pin 260.

[0037] It is also possible to make the carrier 240 from electrically conductive material. In this case, an electrically conductive metallization on the top surface of the carrier 240 can be omitted. The laser chip 400 is then arranged on the top surface of the carrier 240 such that the second electrical contact surface 420 formed on the underside 402 of the laser chip 400 is electrically connected to the carrier 240. The carrier 240 is arranged on the chip receiving surface 235 of the pedestal 230 such that the carrier 240 is electrically connected to the pedestal 230. The second bond wires 225 can be omitted in this case.

[0038] It is also possible to completely dispense with the carrier 240. In this case, the laser chip 400 is positioned directly on the chip mounting surface 235 of the pedestal 230 such that the underside 402 of the laser chip 400 faces the chip mounting surface 235 and the second electrical contact surface 420 formed on the underside 402 of the laser chip 400 is in electrically conductive connection with the pedestal 230. In this case as well, the second bond wires 225 can be omitted.

[0039] A cavity 250 is arranged on the upper surface 201 of the socket 200. The cavity 250 is formed as a recess in the upper surface 201 of the socket 200. The cavity 250 can serve to accommodate a photodiode. The photodiode can be designed to detect laser light emitted by the laser chip 400. However, the photodiode can also be omitted. In that case, the cavity 250 can also be omitted.

[0040] In Fig. Figure 3 shows the underside 202 of the socket 200 of the housing 110 of the optoelectronic component 100. The underside 202 of the socket 200 is essentially planar. A first solder contact surface 210 and a second solder contact surface 220 are formed on the underside 202 of the socket 200. The first solder contact surface 210 and the second solder contact surface 220 are arranged in a common plane. The first solder contact surface 210 is formed at the longitudinal end of the electrically conductive pin 260 and is electrically connected to it. The second solder contact surface 220 surrounds the first solder contact surface 210 in an annular manner and is electrically connected to those sections of the socket 200 that are electrically insulated from the electrically conductive pin 260.

[0041] The first solder contact surface 210 and the second solder contact surface 220 of the socket 200 of the housing 110 of the optoelectronic component 100 are suitable for surface mounting, for example for surface mounting by reflow soldering.

[0042] The cap 300 of the housing 110 of the optoelectronic component 100 can, for example, be made of a deep-drawn sheet of steel.

[0043] The cap 300 is designed to be positioned on the upper surface 201 of the base 200 of the housing 110 of the optoelectronic component 100 such that the pedestal 230 and the laser chip 400, which is arranged on the chip mounting surface 235 of the pedestal 230, are covered by the cap 300. Preferably, the laser chip 400 is hermetically sealed from the environment of the housing 110 of the optoelectronic component 100. This protects the laser chip 400 from moisture and contaminants. This can increase the service life of the laser chip 400 and thus the service life of the entire optoelectronic component 100.

[0044] The cap 300 can be connected to the base 200 of the housing 110 by means of a weld 320. The weld 320 between the cap 300 and the base 200 of the housing 110 of the optoelectronic component 100 can, for example, be produced by pulse welding. The cap 300 can have an annular cutting edge on its side facing the top 201 of the base 200, which is melted during the production of the weld 320.

[0045] The cap 300 has a window 310 arranged such that a laser beam emitted by the laser chip 400 of the optoelectronic component 100 can exit the housing 110 of the optoelectronic component 100 through the window 310 when the laser chip 400 is covered by the cap 300. For this purpose, the window 310 comprises a material that is essentially transparent to laser radiation emitted by the laser chip 400. Preferably, the window 310 is hermetically sealed within the cap 300.

[0046] Fig. Figure 4 shows a schematic perspective view of a printed circuit board 600 of an optoelectronic device 500. The optoelectronic device 500 can, for example, be a laser device.

[0047] The circuit board 600 has a surface 601 and a back surface 602 opposite surface 601. In the Fig. In the example shown, the printed circuit board 600 is designed as a DCB (direct copper bonding) board and has a layered composite of copper, an insulator, and another copper layer. The insulator can be made of, for example, aluminum oxide or aluminum nitride. However, the printed circuit board 600 could also be designed as an FR4 board with integrated thermal vias or as a metal core board.

[0048] On surface 601 of circuit board 600 are in Fig. In the example shown, five series-connected strands 630 are arranged, each designed to accommodate five optoelectronic components 100. Of course, the circuit board 600 could also have a different number of series-connected strands 630. The series-connected strands 630 could also be designed to accommodate fewer or more than five optoelectronic components 100 each.

[0049] Each series circuit strand 630 has a plurality of first mating contact surfaces 610 and second mating contact surfaces 620, which are formed in a metallization on the surface 601 of the printed circuit board 600. Every second mating contact surface 620 of a series circuit strand 630, except for the last second mating contact surface 620 of the respective series circuit strand 630, is integrally connected to a subsequent first mating contact surface 610 of the same series circuit strand 630. Conversely, every first mating contact surface 610 of a series circuit strand 630, except for the first mating contact surface 610 of the respective series circuit strand 630, is integrally connected to a preceding second mating contact surface 620 of the same series circuit strand 630.The first mating contact surface 610 of each series circuit 630 is electrically connected to a first outer terminal surface 615 of the respective series circuit 630. The last mating contact surface 620 of each series circuit 630 is electrically connected to a second outer terminal surface 625 of the respective series circuit 630.

[0050] Fig. Figure 5 shows a schematic perspective view of the circuit board 600 of the optoelectronic device 500 with optoelectronic components 100 arranged on it. Fig. Figure 6 shows a schematic cutaway view of part of the circuit board 600 and the optoelectronic components 100 of the optoelectronic device 500.

[0051] Five optoelectronic components 100 are arranged on each of the five series-connected strands 630 of the printed circuit board 600. Each optoelectronic component 100 is arranged such that the underside 202 of the socket 200 of the housing 110 of the respective optoelectronic component 100 faces the surface 601 of the printed circuit board 600 of the optoelectronic device 500. The first solder contact surface 210 on the underside 202 of the socket 200 of the housing 110 of each optoelectronic component 100 is in electrically conductive contact with a first mating contact surface 610 of the printed circuit board 600. The second solder contact surface 220 on the underside 202 of the socket 200 of the housing 110 of each optoelectronic component 100 is in electrically conductive contact with a second mating contact surface 620 on the surface 601 of the circuit board 600.This means that the optoelectronic components 100 of a series circuit string 630 are each electrically connected in series.

[0052] The optoelectronic components 100 were arranged on the surface 601 of the printed circuit board 600 by a surface mounting method. For example, the optoelectronic components 100 could have been arranged on the surface 601 of the printed circuit board 600 by reflow soldering.

[0053] An electrically conductive solder is arranged between the first solder pad 210 of each optoelectronic component 100 and the corresponding first mating pad 610 of the printed circuit board 600. Similarly, a solder is also arranged between the second solder pad 220 of each optoelectronic component 100 and the corresponding second mating pad 620 of the printed circuit board 600.

[0054] In the transition areas between the second mating contact surfaces 620 and the respective subsequent first mating contact surfaces 610 of each series circuit strand 630 of the printed circuit board 600, as well as in the transition area between the first outer contact surface 615 and the subsequent first mating contact surface 610 of each series circuit strand 630, a solder resist is arranged which electrically isolates the respective section of the first mating contact surface 610 from the second solder contact surface 220 of the respective associated optoelectronic component 100.

[0055] To mount the optoelectronic components 100 onto the surface 601 of the printed circuit board 600 of the optoelectronic device 500, solder paste is first applied to the mating contact surfaces 610, 620 on the surface 601 of the printed circuit board 600. The solder paste comprises solder balls, flux, and solvent. Simultaneously, a solder mask is applied to the aforementioned areas of the first mating contact surfaces 610. The application of the solder paste and the solder mask can be carried out, for example, by screen printing or stencil printing. The solder mask can also be applied during the manufacturing of the printed circuit board and structured by photostructuring. Subsequently, the optoelectronic components 100 are positioned on the surface 601 of the printed circuit board 600. This can be done, for example, using an SMT placement machine. Finally, the optoelectronic components 100 are soldered in a reflow or vapor phase oven.The optoelectronic device 500 can then be washed to remove excess flux.

[0056] Simultaneously with the arrangement of the optoelectronic components 100 on the surface 601 of the circuit board 600, other components can be arranged on the surface 601 of the circuit board 600 and electrically connected to it.

[0057] In each series circuit 630 of the optoelectronic device 500, an electrical voltage can be applied between the first outer terminal surface 615 and the second outer terminal surface 625 in order to operate the optoelectronic components 100 of the respective series circuit 630.

[0058] During operation of the optoelectronic device 500, waste heat is generated in the laser chips 400 of the optoelectronic components 100. The waste heat generated in the laser chips 400 can dissipate from each optoelectronic component 100 via the underside 402 of the laser chip 400 and the carrier 240 into the socket 200 of the respective optoelectronic component 100. From the socket 200, the waste heat can dissipate via the first solder contact surface 210 and the second solder contact surface 220 on the underside 202 of the socket 200 of the respective optoelectronic component 100, the solder joints between the solder contact surfaces 210, 220 and the mating contact surfaces 610, 620 of the circuit board 600, and the mating contact surfaces 610, 620 of the circuit board 600 into the circuit board 600.The dissipation of the waste heat generated in the optoelectronic components 100 is supported by the large-area contact between the underside 202 of the socket 200 of each optoelectronic component 100 and the surface 601 of the printed circuit board 600. The solder joints between the solder contact pads 210, 220 of the optoelectronic components 100 and the mating contact pads 610, 620 of the printed circuit board 600 advantageously exhibit only a low thermal resistance.

[0059] The invention has been illustrated and described in more detail with reference to preferred embodiments. However, the invention is not limited to the disclosed examples. Rather, other variations can be derived from them by a person skilled in the art without departing from the scope of protection of the invention. Reference symbol list 100 optoelectronic components 110 cases 200 sockets 201 Top 202 Subpage 210 first solder contact surface 215 first bond wire 220 second solder contact surface 225 second bond wire 230 podium 235 chip mounting area 240 carriers 250 cavities 260 electrically conductive pin 265 Insulator 300 cap 310 windows 320 weld joint 400 laser chips 401 Top 402 Underside 410 first electrical contact surface 420 second electrical contact surface 430 Beam direction 500 Optoelectronic device 600 circuit boards 601 Surface 602 reverse 610 first counter-contact surface (anode) 615 first outer connection surface 620 second counter-contact surface (cathode) 625 second outer connection surface 630 series circuit

Claims

[1] Optoelectronic device (500) with a printed circuit board (600) designed as a DCB (direct copper bonding) printed circuit board with a layered composite of copper, an insulator and another layer of copper or as a metal core board, and with a plurality of optoelectronic components (100), wherein the optoelectronic components (100) each have a housing (110) comprising a base (200) with a top (201) and a bottom (202) and a cap (300), wherein the optoelectronic components (100) each have a laser chip (400) which is arranged between the top (201) of the socket (200) and the cap (300), wherein a first solder contact surface (210) and a second solder contact surface (220) are formed on the underside (202) of the base (200) of each optoelectronic component (100), wherein the laser chip (400) of each optoelectronic component (100) has a second electrical contact surface (420), wherein the second electrical contact surface (420) is electrically connected by means of a second bond wire (225) to a section of the base (200) which is electrically connected to the second solder contact surface (220), wherein the optoelectronic components (100) are arranged in an electrical series circuit (630) on a surface (601) of the circuit board (600), wherein the base (200) of each optoelectronic component (100) has an approximately rectangular shape and the housings (110) of the optoelectronic components (100) are arranged close together. [2] Optoelectronic device (500) according to claim 1, wherein a cavity (250) formed as a recess in the top (201) of the base (200) of each optoelectronic component (100) is arranged on the top (201) of the base (200). [3] Optoelectronic device (500) according to any one of the preceding claims, wherein in each optoelectronic component (100) an electrically conductive pin (260) extends through the socket (200) between the top (201) and the bottom (202), wherein the pin (260) is electrically insulated from the other sections of the base (200), wherein the pin (260) is electrically connected to the first solder contact surface (210). [4] Optoelectronic device (500) according to claim 3, wherein the first solder contact surface (210) is formed at the longitudinal end of the electrically conductive pin (260). [5] Optoelectronic device (500) according to one of the preceding claims, wherein the underside (202) of the base (200) is substantially planar for each optoelectronic component (100). [6] Optoelectronic device (500) according to one of the preceding claims, wherein the base (200) of each optoelectronic component (100) comprises an electrically conductive material, in particular a metal. [7] Optoelectronic device (500) according to one of the preceding claims, wherein the base (200) and / or the cap (300) of each optoelectronic component (100) is made of steel. [8] Method for manufacturing an optoelectronic device (500) with the following steps: - Providing a printed circuit board (600) designed as a DCB (direct copper bonding) printed circuit board with a layered composite of copper, an insulator and another layer of copper, or as a metal core board; - Providing a plurality of optoelectronic components (100), wherein the optoelectronic components (100) each have a housing (110) comprising a base (200) with a top (201) and a bottom (202) and a cap (300), wherein the optoelectronic components (100) each have a laser chip (400) which is arranged between the top (201) of the socket (200) and the cap (300), wherein a first solder contact surface (210) and a second solder contact surface (220) are formed on the underside (202) of the base (200) of each optoelectronic component (100), wherein the laser chip (400) of each optoelectronic component (100) has a second electrical contact surface (420), wherein the second electrical contact surface (420) is electrically connected by means of a second bond wire (225) to a section of the base (200) which is electrically connected to the second solder contact surface (220); - Arranging the optoelectronic components (100) in an electrical series circuit (630) on a surface (601) of the printed circuit board (600), wherein the base (200) of each optoelectronic component (100) has an approximately rectangular shape and the housings (110) of the optoelectronic components (100) are arranged close together. [9] Method according to claim 8, wherein the optoelectronic components (100) are arranged by surface mounting on the surface (601) of the printed circuit board (600). [10] Method according to claim 9, wherein the optoelectronic components (100) are arranged on the surface (601) of the printed circuit board (600) by means of re-soldering.

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