Camera module and method for manufacturing the camera module

Abstract

A camera module according to an embodiment of the present invention is provided with: a first component mounting substrate; a second component mounting substrate; and a spacer component. The first component mounting substrate has an imaging element. The second component mounting substrate is electrically connected to the first component mounting substrate. The spacer component is disposed between the first component mounting substrate and the second component mounting substrate. The spacer component has a component body made of a first insulating material. The component body has: a first main surface part which has three or more first reference surfaces, and which comes into contact with the first component mounting substrate; a second main surface part which has three or more second reference surfaces, and which comes into contact with the second component mounting substrate; and a bottomed or bottom-less component storage part which is provided to at least one of the first and second main surface parts.

Description

Technical Field

[0001] The present technology relates to a camera module applicable to in-vehicle cameras, mobile phones, etc., a spacer component, and a method for manufacturing the camera module.

Background Art

[0002] In in-vehicle cameras, mobile phones, etc., a plurality of substrates are connected using a board-to-board (hereinafter referred to as BtoB) connector (for example, Patent Documents 1 and 2). At the time of this connection, in order to prevent damage due to the load during attachment and vibration after attachment applied to the plurality of substrates, it is important to ensure that the distance (parallelism) between the substrates is constant. Moreover, it is difficult to secure space for adding components for maintaining the parallelism between small and highly dense substrates such as in-vehicle cameras.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] Conventionally, generally, in order to ensure flatness, a plurality of block-shaped spacer components are arranged at positions away from the BtoB connector portion. However, when assembling using a plurality of spacer components due to space constraints, the cumulative tolerance including the individual differences and assembly variations of each spacer component becomes large, the parallelism decreases, and there is a risk of damaging the substrate. In addition, if an attempt is made to ensure sufficient clearance (distance) to avoid short circuits between the substrates, the design difficulty, including the design of peripheral components, increases. Moreover, due to the small size of the components, there is also the problem of difficult handling.

[0005] In view of the above circumstances, an object of the present technology is to provide a camera module, a spacer component, and a method for manufacturing a camera module that are easy to handle and can improve the parallelism between a plurality of substrates.

Means for Solving the Problems

[0006] To achieve the above object, a camera module according to one embodiment of the present technology includes a first component mounting substrate, a second component mounting substrate, and a spacer component. The first component mounting substrate has an imaging element. The second component mounting substrate is electrically connected to the first component mounting substrate. The spacer component is disposed between the first component mounting substrate and the second component mounting substrate. The spacer component has a component body made of a first insulating material. The component body has a first main surface portion that contacts the first component mounting substrate and has three or more first reference surfaces, a second main surface portion that contacts the second component mounting substrate and has three or more second reference surfaces, and a bottomed or bottomless component accommodating portion provided on at least one of the first main surface portion and the second main surface portion.

[0007] The plurality of first and second reference surfaces may be provided at the peripheral portions of the first and second main surface portions, respectively.

[0008] The component accommodating portion includes a first component accommodating portion formed of a through hole. The first component mounting substrate may further have a first connector component accommodated in the component accommodating portion. The second component mounting substrate may have a second connector component accommodated in the component accommodating portion and connected to the first connector component.

[0009] The component body may further have a plurality of engaging protrusions for regulating displacement between the spacer component and the first component mounting substrate.

[0010] The plurality of engaging protrusions may each have a shaft portion provided at two mutually opposing side edge portions of the first main surface portion, and a claw portion provided at the tip of the shaft portion and engaging with a surface of the first component mounting substrate on the side opposite to the surface facing the spacer component.

[0011] The first component mounting substrate may have a plurality of recesses provided at two mutually opposing side edge portions respectively through which the shaft portions are inserted.

[0012] The component housing portion may further include a bottomed second component housing portion, and the spacer component may further have a coating layer made of a second insulating material different from the first insulating material and forming the inner surface of the second component housing portion.

[0013] The second insulating material may be made of a composite material containing a radio wave absorbing material.

[0014] The second component housing portion may be provided at a portion facing the imaging element in the thickness direction of the spacer component.

[0015] The second insulating material may have higher thermal conductivity than the first insulating material.

[0016] The spacer component may further have an interlayer connection portion provided inside the component body for electrically connecting between the first component mounting substrate and the second component mounting substrate.

[0017] It may further include a casing for integrally housing a laminate of the first component mounting substrate, the spacer component, and the second component mounting substrate.

[0018] A spacer component according to one embodiment of the present technology includes a component body made of an insulating material. The component body has a first main surface portion that contacts the first component mounting substrate and has a plurality of first reference surfaces, a second main surface portion that contacts the second component mounting substrate and has a plurality of second reference surfaces, and a bottomed or bottomless component accommodating portion provided on at least one of the first main surface portion and the second main surface portion.

[0019] A method for manufacturing a camera module according to an aspect of the present technology prepares a spacer component made of an insulating material, the spacer component having a first main surface portion that contacts a first component mounting substrate having an imaging element and has a plurality of first reference surfaces, a second main surface portion that contacts a second component mounting substrate and has a plurality of second reference surfaces, and a bottomless component accommodating portion provided on at least one of the first main surface portion and the second main surface portion. Snap-fit couple the first component mounting substrate to the spacer component. By placing the first component mounting substrate on the plurality of first reference surfaces, a first connector component mounted on the first component mounting substrate is accommodated in the component accommodating portion. Invert the spacer component upside down. By placing a second component mounting substrate on the plurality of second reference surfaces, a second connector component mounted on the second component mounting substrate is connected to the first connector component within the component accommodating portion.

Brief Description of the Drawings

[0020]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0021] Hereinafter, embodiments according to the present technology will be described with reference to the drawings.

[0022] [Configuration of Camera Module] FIG. 1 is an exploded perspective view of a camera module according to an embodiment of the present technology. The camera module 100 is used, for example, as an in-vehicle camera. Of course, the present technology described below is applicable to any camera module used for other purposes. Hereinafter, the left - right direction, front - rear direction (optical axis direction), and height direction of the camera module 100 will be described as the X - direction, Y - direction, and Z - direction respectively. Of course, the description is not limited to such a direction setting.

[0023] The camera module 100 has, in the order of the positive Y - axis direction, a front case 10, an O - ring 6, a camera unit 4, and a rear case 13. The camera unit 4 has, in the order of the positive Y - axis direction, a lens assembly 7, a shield case 8 for electromagnetic shielding, a dust - proof sheet 9, a substrate unit 5, a heat - dissipation sheet 18, and a spacer cushion 19. The substrate unit 5 has, in the order of the positive Y - axis direction, a front substrate (first component mounting substrate) 2, a spacer component 1, and a rear substrate (second component mounting substrate) 3.

[0024] The front case 10 has a front surface portion 101 formed substantially perpendicular to the front - rear direction (Y - direction), and a side surface portion 102 extending rearward from the periphery of the front surface portion 101. In this embodiment, the shape of the front surface portion 101 as viewed from the Y - direction is substantially rectangular. The front case 10 is configured to be hollow, and the region surrounded by the front surface portion 101 and the side surface portion 102 is a space portion.

[0025] The rear case 13 is a shield case for electromagnetic shielding, and has a rear surface portion 131 arranged substantially perpendicular to the front - rear direction (Y - direction), and a side surface portion 132 extending forward from the periphery of the rear surface portion 131. The shape of the rear surface portion 131 as viewed from the Y - direction is substantially rectangular and is substantially equal to the shape of the front surface portion 101. The rear case 13 is configured to be hollow, and the region surrounded by the rear surface portion 131 and the side surface portion 132 is a space portion. In this embodiment, the front case 10 and the rear case 13 correspond to the casing.

[0026] The front case 10 and the rear case 13 are typically connected to each other by ultrasonic welding. Thereby, an internal space including the space portion of the front case 10 and the space portion of the rear case 13 is formed. The camera unit 4 is arranged in this internal space.

[0027] As shown in FIG. 1, a through hole 103 is formed in the central portion of the front surface portion 101 of the front case 10, and the lens portion 71 of the lens assembly 7 is passed through the through hole 103, so that the lens assembly 7 is assembled to the front case 10. The camera unit 4 is arranged such that the imaging optical axis O passes through the approximate center of the lens assembly 7. The camera unit 4 can capture an image based on the light incident through the lens assembly 7.

[0028] As the camera unit 4, for example, a digital camera including an image sensor such as a CMOS (Complementary Metal - Oxide Semiconductor) sensor or a CCD (Charge Coupled Device) sensor is used. Any other camera may be used. In the present embodiment, the camera unit 4 corresponds to the imaging unit.

[0029] A connector portion 135 is provided on the rear surface portion 131 of the rear case 13. This connector portion 135 is a coaxial connector such as an FPC (Flexible Printed Circuit) or an FFC (Flexible Flat Cable). By connecting a cable (not shown) to the connector portion 135, power supply to the camera unit 4 and output of an image signal from the camera unit 4 are realized. The configuration of the connector portion 135 may be arbitrarily designed.

[0030] An O - ring 6 is arranged over the entire circumference inside the front case 10. This O - ring 6 functions to seal between the front case 10 and the camera unit 4 (lens assembly 7). Thereby, intrusion of raindrops or the like from the through hole 103 of the front case 10 into the casing interior is prevented. As the material of the O - ring 6, for example, any elastic material such as rubber or plastic may be used. In the present embodiment, the O - ring 6 corresponds to the elastic member.

[0031] The front case 10 and the rear case 13 are made of an insulating material such as resin or ceramic. As the resin material, for example, general-purpose resins such as (acrylonitrile-butadiene-styrene) resin, PC (polycarbonate) resin, engineering plastics such as a mixed resin of ABS and PC, etc. are used. Without being limited to these, the material and color (transparency) of the molded resin can be appropriately selected.

[0032] Note that the application of this technology is not limited to resin materials, and as the front case 10 and the rear case 13, for example, die-cast parts made of metal materials may be used. Also, the forming method of the front case 10 and the rear case 13 is not limited, and for example, it can be formed using any molding technology.

[0033] [Substrate unit] FIG. 2 is a schematic side cross-sectional view of the state where the spacer part 1 is assembled to the front substrate 2 and the rear substrate 3. The spacer part 1 is disposed between the front substrate 2 and the rear substrate 3. The spacer part 1 has a surface 11 (first main surface portion) that supports the front substrate 2 and a back surface 12 (second main surface portion) that supports the rear substrate 3, and keeps the distance between the front substrate 2 and the rear substrate 3 constant at a distance corresponding to the thickness T of the spacer part 1.

[0034] The spacer part 1 is composed of a single layer of a plate-shaped part body 110 having a predetermined shape with a thickness T along the Y direction. The part body 110 is an insulator and is made of, for example, an injection molded body of a synthetic resin material (first insulating material) such as ABS resin molding, polycarbonate (PCB), or ceramic. In this embodiment, since the spacer part 1 is composed of a single layer of the part body 110, in the following description, unless otherwise specified, the spacer part 1 also means the part body 110. As will be described later, the spacer part may be configured to include the part body and a layer made of a different material integrally formed therewith.

[0035] The front substrate 2 is a rectangular double-sided component mounting substrate with rigidity. The front substrate 2 has electronic components including the imaging element 22 mounted on its front surface (the upper surface in FIG. 2), and in addition to various electronic components that drive the imaging element 22 on its back surface (the lower surface in FIG. 2), a first connector component 23 for B-to-B connection is mounted. The imaging element 22 is composed of a solid-state imaging element such as a CMOS or CCD image sensor.

[0036] The rear substrate 3 is a rectangular double-sided component mounting substrate with rigidity. The rear substrate 3 is typically formed to the same size as the front substrate 2. The rear substrate 3 has, on its front surface (the upper surface in FIG. 2), in addition to other electronic components that drive the imaging element 22, a second connector component 31 that is electrically connected to the first connector component 23 mounted.

[0037] As the electronic components mounted on the front substrate 2 and the rear substrate 3, in addition to the above-described imaging element 22 and connector components 23, 31, there are IC components that constitute a DSP (Digital Signal Processor), a CPU (Central Processing Unit), a power supply circuit, etc., and furthermore, passive components such as coils, resistors, and capacitors are included.

[0038] The spacer component 1 has a component housing portion 115 that houses the first connector component 23 and the second connector component 31. The component housing portion 115 is composed of a bottomless recess or a through hole of a predetermined shape that penetrates the component body 110. The spacer component 1 is further provided on its front and back surfaces with escape portions (recesses) to prevent interference with various electronic components mounted on the back surface of the front substrate 2 and the front surface of the rear substrate 3.

[0039] The front substrate 2 and the rear substrate 3 are mechanically and electrically connected to each other via the first connector component 23 and the second connector component 31. When the first connector component 23 and the second connector component 31 are connected to each other, the front substrate 2 contacts the front surface 11 of the spacer component 1, and the rear substrate 3 contacts the back surface 14 of the spacer component 1.

[0040] Next, the details of the spacer component 1 will be described. FIG. 3 is a top perspective view of the spacer component 1. FIG. 4(A) is a bottom perspective view of the state where the spacer component 1 is assembled to the front substrate 2, and FIG. 4(B) is a top perspective view of the state where the spacer component 1 is assembled to the rear substrate 3. FIG. 5(A) is a top perspective view of the state where the spacer component 1 is assembled to the front substrate 2 and the rear substrate 3, FIG. 5(B) is a cross-sectional perspective view thereof, and FIG. 5(C) is a side cross-sectional view thereof.

[0041] The spacer component 1 has a generally rectangular external shape. The size of the spacer component 1 is not particularly limited, but typically, it is formed to be approximately the same size as the front substrate 2 and the rear substrate 3.

[0042] The surface 11 of the spacer component 1 is formed by a plurality of reference planes (first reference planes). As shown in FIGS. 3 and 4(B), the plurality of reference planes include four reference planes 111, 112, 113, and 114. These plurality of reference planes 111 to 114 are flat portions belonging to the same plane (surface 11), and contact the back surface of the front substrate 2 when laminated with the front substrate 2 (see FIG. 5(C)). Note that the plurality of reference planes 111 to 114 may not belong to the same plane and may each be in a different plane.

[0043] The formation positions of the reference planes 111 to 114 are not particularly limited and can be appropriately set according to the positions and sizes of the components mounted on the back surface of the front substrate 2. Typically, the reference planes 111 to 114 are formed at the peripheral portions of the surface 11 of the spacer component 1 so as to support the regions on the back surface of the front substrate 2 where no components are mounted. In the present embodiment, the reference planes 111 to 114 are respectively formed at the four corner positions of the surface 11 of the spacer component 1. The shapes and sizes of the reference planes 111 to 114 are not particularly limited, and typically, each reference plane is formed in a different shape and size. In the present embodiment, the reference plane 111 and the reference plane 113 are formed in a rectangular island shape, the reference plane 112 is formed linearly, and the reference plane 114 is formed in a shape having a bent portion. Note that the surface 11 of the spacer component 1 is not limited to being formed by the above-described four reference planes 111 to 114, and may be formed by at least three reference planes. Thereby, the front substrate 2 can be stably supported.

[0044] Each of the reference planes 111 to 114 is formed by providing recesses of an arbitrary depth in an arbitrary region of the surface 11 of the spacer component 1. In the present embodiment, mainly two recesses 161 and 162 are formed. The formation regions of the recesses 161 and 162 correspond to the thin portions of the spacer component 1. The recess 161 is formed deeper than the recess 162. The recess 161 is formed so as to connect between the reference plane 111, the reference plane 112, and the reference plane 114. The recess 162 is formed so as to connect between the reference plane 112, the reference plane 113, and the reference plane 114.

[0045] The spacer component 1 has a component housing portion 130 (first component housing portion) that houses the above-described first connector component 23 and second connector component 31 (see FIG. 2). As shown in FIG. 3, the component housing portion 130 is a substantially rectangular through-hole that penetrates the recess 162. The component housing portion 130 corresponds to the component housing portion 115 in FIG. 2. In addition, the spacer component 1 has a component housing portion 133 that can house electronic components other than the first connector component 23 and the second connector component 31. As shown in FIG. 3, the component housing portion 133 is a substantially rectangular through-hole that penetrates the recess 161. Furthermore, the spacer component 1 has a missing portion 136 in which a part of the recess 161 is missing. The missing portion 136 is provided between the reference plane 111 and the reference plane 114. The recesses 161 and 162 and the missing portion 136 function as relief portions for preventing interference with the component group mounted on the back surface of the front substrate 2 (see FIG. 4(A)). On the other hand, the component housing portion 133 functions as a relief portion for preventing interference with the electronic components mounted on the surface of the rear substrate 3 (see FIG. 4(B)).

[0046] On the surface 11 of the spacer component 1, a plurality of engaging protrusions 116, 117 for restricting the displacement between the spacer component 1 and the front substrate 2 are provided. Each of the engaging protrusions 116, 117 has shaft portions 116a, 117a provided on two side edge portions 126, 127 of the main surface 11 of the spacer component 1 facing each other in the X direction, and claw portions 116b, 117b provided at the tips of the shaft portions 116a, 117a. The shaft portions 116a, 116b may be provided so as to face each other in the X direction, or may be provided at positions offset in the Z direction as shown in FIG. 3. The claw portions 116b, 117b are formed to protrude in parallel with the X direction from the tips of the shaft portions 116a, 116b so as to be engageable with the surface of the front substrate 2. The claw portions 116b, 117b are not particularly limited as long as the spacer component 1 can be snap-fitted to the front substrate 2. The number of these engaging protrusions is not limited to two, and may be three or more.

[0047] On the side edge portions of the front substrate 2 facing each other, recesses 201, 202 into which the shaft portions 116a, 117a of the engaging protrusions 116, 117 are inserted are respectively provided (see FIGS. 4(A) and 5(B)). These recesses 201, 202 have an opening width substantially equal to the shaft diameter of the shaft portions 116a, 117a, and the insertion of the shaft portions 116a, 117a restricts the displacement of the front substrate 2 in the in-plane direction of the XZ plane with respect to the spacer component 1.

[0048] Receiving portions 118, 119, 120, 121 are formed in the vicinity of the shaft portions 116a, 117a of the engaging protrusions 116, 117 (see FIGS. 3 and 4(B)). These receiving portions 118 to 121 belong to the same plane as the reference planes 111 to 114, and support the back surface of the front substrate 2 together with the reference planes 111 to 114 when the engaging protrusions 116, 117 are engaged with the front substrate 2.

[0049] On the other hand, a plurality of reference surfaces (second reference surfaces) are similarly provided on the back surface 14 of the spacer component 1. As shown in FIG. 4(A), the plurality of reference surfaces include four reference surfaces 141, 142, 143, and 144. These plurality of reference surfaces 141 to 144 are each a planar portion belonging to the same plane and come into contact with the surface of the rear substrate 3 during lamination with the rear substrate 3 (see FIG. 5(C)). Note that the plurality of reference surfaces 141 to 144 may not belong to the same plane and may each be in a different plane.

[0050] The formation positions of the respective reference surfaces 141 to 144 are not particularly limited and can be appropriately set according to the positions and sizes of the components mounted on the surface of the rear substrate 3. Typically, the reference surfaces 141 to 144 are formed at the peripheral portions of the back surface 12 of the spacer component 1 so as to support the regions on the surface of the rear substrate 3 where no components are mounted. In the present embodiment, the reference surfaces 141 to 144 are respectively formed at the four corner positions of the back surface 14 of the spacer component 1. The shapes and sizes of the reference surfaces 141 to 144 are not particularly limited. In the present embodiment, they are formed as disk-shaped seat portions that protrude by a predetermined height in the Y direction from the back surface 14. Note that the number of the reference surfaces 141 to 144 is not limited to four, and at least three are sufficient. Thereby, the rear substrate 3 can be stably supported.

[0051] By assembling the above-described spacer component 1 to the front substrate 2 and the rear substrate 3 (described later), the parallelism between the front substrate 2 and the rear substrate 3 can be improved and maintained. By using one component (spacer component 1) to regulate the distance between the front substrate 2 and the rear substrate 3, the number of components can be reduced (reduction of component and assembly variation factors). By integrating the spacer block between the substrates 2 and 3 into one component, height regulation of the entire component becomes possible, which can contribute to the regulation of the inclination of the substrates 2 and 3, and the component itself can be enlarged, improving the assembly workability.

[0052] By designing the spacer component 1 according to the layouts of the front substrate 2 and the rear substrate 3, the contact area for receiving the front substrate 2 and the rear substrate 3 can be increased, the inclination between the substrates 2 and 3 can be suppressed, and further, during the B-to-B connection operation, the load applied to the connector is reduced. Moreover, damage caused by the vibration of the camera module 100 after the connector is attached is reduced.

[0053] By adding the snap-fit shaped engaging protrusions 116 and 117, the fixing operation using adhesives, adhesive tapes, etc. to the front substrate 2 becomes unnecessary, and handling becomes easier. The shaft portions 116a and 116b of the engaging protrusions 116 and 117 respectively assembled in the recesses 201 and 202 of the front substrate 2 serve as guides during assembly, making the handling during the B-to-B connection between the substrates 2 and 3 easier (improvement in workability).

[0054] [Manufacturing Method of Camera Module] Subsequently, a manufacturing method (assembly method) of the camera module according to an embodiment of the present technology will be described. FIGS. 6 to 8 are perspective views of each step for explaining the manufacturing method of the camera module 100.

[0055] First, as shown in FIGS. 6(A) and (B), by assembling the spacer component 1 to the front substrate 2, the front substrate 2 is placed on the main surface 11 (reference surfaces 111 to 114) of the spacer component 1. At this time, the shaft portions of the engaging protrusions 116 and 117 of the spacer component 1 are passed through the recesses 201 and 202 of the front substrate 2 in the Y-axis direction and assembled respectively (snap-fit connection). The claw portions 116b and 117b of the engaging protrusions 116 and 117 engage with the surface of the front substrate 2 opposite to the surface facing the spacer component 1, thereby integrating the spacer component 1 and the front substrate 2. As a result, even when the spacer component 1 is inverted up and down, the front substrate 2 is prevented from falling off the spacer component 1, and handling becomes easier (improvement in workability).

[0056] Subsequently, as shown in FIG. 7(A), the spacer component 1 is turned upside down, and the laminate 501 of the spacer component 1 and the front substrate 2 is assembled to the rear substrate 2. As a result, the rear substrate 3 is placed on the back surface 14 (reference surfaces 141 to 144) of the spacer component 1, and the front substrate 2 and the rear substrate 3 are electrically and mechanically connected via the first connector component 23 and the second connector component 31.

[0057] Next, as shown in FIG. 7(B), the laminate 502 (substrate unit 5) of the spacer component 1, the front substrate 2, and the rear substrate 3 is assembled to the lens assembly 7 via the shield case 8 and the dustproof sheet 9 (this is referred to as laminate 503). Subsequently, as shown in FIG. 8(A), the rear case 13 is assembled to the laminate 503 via the heat dissipation sheet 18 and the spacer cushion 19. Then, as shown in FIG. 8(B), the combination 504 of the laminate 503 and the rear case 13 is assembled to the front case 10 via the O-ring 6, thereby manufacturing the camera module 100. In the present embodiment, the rear case 13 and the front case 10 are integrated by ultrasonic welding, thereby forming a casing that integrally houses various components such as the substrate unit 5.

[0058] Inside the casing, the substrate unit 5 is sandwiched between the front case 10 and the rear case 13 by the elastic force of the spacer cushion 19. At this time, the front substrate 2 is supported by a plurality of reference surfaces 111 to 114 on the surface 11 of the spacer component 1, and the rear substrate 3 is supported by a plurality of reference surfaces 141 to 144 on the back surface 14 of the spacer component 1.

[0059] [Other Embodiments of the Spacer Component] As another embodiment, the spacer component may have the following additional functions by partially changing the material. Figures 9 to 11 are schematic side sectional views of spacer parts showing other embodiments thereof. A front substrate 2 and a rear substrate 3 are assembled to each spacer part. Note that the embodiments of FIGS. 9 to 11 may be combined with each other.

[0060] FIG. 9 shows a substrate unit 5A including a spacer part 1A. The spacer part 1A has a part body 110 and a coating layer 151. The part body 110 has a bottomed part housing part 134 (second part housing part) on its back surface 14. The coating layer 154 forms the inner surface of the part housing part 134 by covering the part housing part 134.

[0061] The coating layer 151 is made of an insulating material (second insulating material) different from the material (first insulating material) constituting the part body 110. In the present embodiment, the coating layer 151 is made of an insulating material having radio wave absorption properties. Examples of such materials include composite materials such as synthetic resins and elastomers containing radio wave absorbing materials such as soft magnetic particles. Thereby, it is possible to suppress the leakage of electromagnetic waves radiated from the electronic component 32 housed in the part housing part 134 to the outside of the part housing part 134. Therefore, even when the part housing part 134 is provided at a portion facing the imaging element 22 in the thickness direction of the spacer part 1A as shown in the figure, it is possible to reduce the influence of electromagnetic wave noise from the electronic component 32 to the imaging element 22.

[0062] The method for forming the coating layer 151 is not particularly limited. In the present embodiment, it is integrally formed on the part body 110 by a two-color molding method. Alternatively, a pre-formed coating layer 151 may be joined to the inner surface of the part housing part 134.

[0063] FIG. 10 shows a substrate unit 5B including a spacer part 1B. The spacer component 1B has a component main body 110 and an interlayer connection part 152. The interlayer connection part 152 penetrates the component main body 110 in its thickness direction and electrically connects between the front substrate 2 supported on the front surface 11 of the component main body 110 and the rear substrate 3 supported on the rear surface 14 of the component main body 110. The interlayer connection part 152 is formed of a metal material or a conductive plastic material containing metal particles, and is integrally formed with the component main body 110 by an insert molding method, a two-color molding method, or the like. The interlayer connection part 152 can be configured as a part of the wirings of the front substrate 2 and the rear substrate 3, and is configured as, for example, the ground line of the substrate unit 5.

[0064] FIG. 11 shows a substrate unit 5C including a spacer component 1C. The spacer component 1C has a component main body 110 and a coating layer 153. The component main body 110 has a bottomed component housing part 138 (second component housing part) on its rear surface 14. The coating layer 154 forms the inner surface of the component housing part 138 by covering the component housing part 138.

[0065] The coating layer 153 is made of an insulating material (second insulating material) different from the material (first insulating material) constituting the component main body 110. In the present embodiment, the coating layer 153 is made of an insulating material having a higher thermal conductivity (heat conductivity) than the component main body 110. Examples of such materials include composite materials such as synthetic resins or elastomers containing metal fillers. Thereby, the heat dissipation property of the electronic component 33 having a relatively large calorific value accommodated in the component housing part 138 is enhanced.

[0066] The method for forming the coating layer 153 is not particularly limited. In the present embodiment, it is integrally formed with the component main body 110 by a two-color molding method. In addition to this, a previously formed coating layer 151 may be joined to the inner surface of the component housing part 134. Further, by connecting the coating layer 153 to a metal chassis 16 or the like constituting a part of the casing, further improvement in heat dissipation property can be achieved.

[0067] <Application Example> The technology according to the present disclosure can be applied to various products. For example, the technology according to the present disclosure may be realized as a camera module mounted on any type of moving body such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility device, an airplane, a drone, a ship, a robot, a construction machine, an agricultural machine (tractor), etc.

[0068] Each component such as the camera module, the front case, the rear case, the packing, etc. described with reference to each drawing is merely one embodiment, and can be arbitrarily deformed without departing from the gist of the present technology. That is, any other arbitrary configuration for implementing the present technology may be adopted.

[0069] In the present disclosure, concepts such as "substantially central", "central part", "central portion", "substantially equal", "vertical", "substantially vertical", "rectangular shape", "substantially rectangular shape", "circular shape", etc. include concepts such as "substantially at the center", "substantially at the center", "substantially equal", "substantially at the center". For example, states included in a predetermined range (for example, a range of ±10%) based on "completely central", "completely at the center", "completely equal", "completely at the center", "completely vertical", "completely rectangular shape", "completely circular shape", etc. are also included.

[0070] In addition, the present technology can also adopt the following configurations. (1) A first component mounting substrate having an imaging element, A second component mounting substrate electrically connected to the first component mounting substrate, A spacer component disposed between the first component mounting substrate and the second component mounting substrate and comprising The spacer component has a component body made of a first insulating material, which has a first main surface portion having three or more first reference surfaces in contact with the first component mounting substrate, a second main surface portion having three or more second reference surfaces in contact with the second component mounting substrate, and a bottomed or non-bottomed component accommodating portion provided on at least one of the first main surface portion and the second main surface portion. A camera module. (2) The camera module according to (1) above, The plurality of first and second reference planes are respectively provided at the peripheral edges of the first and second main surface portions. Camera module. (3) The camera module according to (1) or (2) above, The component housing portion includes a first component housing portion formed of a through hole. The first component mounting substrate further has a first connector component housed in the component housing portion. The second component mounting substrate has a second connector component housed in the component housing portion and connected to the first connector component. Camera module. (4) The camera module according to any one of (1) to (3) above, The component body further has a plurality of engaging protrusions for regulating displacement between the spacer component and the first component mounting substrate. Camera module. (5) The camera module according to (4) above, The plurality of engaging protrusions include shaft portions respectively provided on two opposing side edges of the first main surface portion, and claw portions provided at the tips of the shaft portions and engaging with a surface of the first component mounting substrate opposite to the surface facing the spacer component. Camera module. (6) The camera module according to (4) or (5) above, The first component mounting substrate has recesses respectively provided on two opposing side edges thereof and through which the shaft portions are inserted. Camera module. (7) The camera module according to any one of (1) to (6) above, The component housing portion further includes a second component housing portion with a bottom. The spacer component is made of a second insulating material different from the first insulating material and further has a coating layer forming the inner surface of the second component housing portion. Camera module. (8) The camera module according to (7) above, wherein the second insulating material is a composite material containing a radio wave absorbing material Camera module. (9) The camera module according to (7) or (8) above, wherein the second component housing portion is provided at a portion facing the imaging element in the thickness direction of the spacer component Camera module. (10) The camera module according to any one of (7) to (9) above, wherein the second insulating material has higher thermal conductivity than the first insulating material Camera module. (11) The camera module according to any one of (1) to (10) above, wherein the spacer component is provided inside the component body and further has an interlayer connection portion that electrically connects between the first component mounting substrate and the second component mounting substrate Camera module. (12) The camera module according to any one of (1) to (11) above, further comprising a casing that integrally houses a laminate of the first component mounting substrate, the spacer component, and the second component mounting substrate Camera module. (13) A component body made of an insulating material, having a first main surface portion that contacts the first component mounting substrate and has a plurality of first reference surfaces, a second main surface portion that contacts the second component mounting substrate and has a plurality of second reference surfaces, and a bottomed or bottomless component housing portion provided on at least one of the first main surface portion and the second main surface portion Spacer component comprising. Prepare a spacer component made of an insulating material, having a first main surface portion that contacts the first component mounting substrate having the imaging element and has a plurality of first reference surfaces, a second main surface portion that contacts the second component mounting substrate and has a plurality of second reference surfaces, and a bottomless component housing portion provided on at least one of the first main surface portion and the second main surface portion, Snap-fit couple the first component mounting substrate to the spacer component, By placing the first component mounting substrate on the plurality of first reference surfaces, the first connector component mounted on the first component mounting substrate is accommodated in the component accommodating portion, Invert the spacer component up and down, By placing the second component mounting substrate on the plurality of second reference surfaces, the second connector component mounted on the second component mounting substrate is connected to the first connector component within the component accommodating portion A method for manufacturing a camera module.

Explanation of Signs

[0071] 1, 1A, 1B, 1C... Spacer component 2... Front substrate (first component mounting substrate) 3... Rear substrate (second component mounting substrate) 5, 5A, 5B, 5C... Substrate unit 10... Front case (casing) 11... Surface of the spacer component (first main surface) 13... Rear case (casing) 14... Back surface of the spacer component (second main surface) 22... Image sensor 23... First connector component 31... Second connector component 100... Camera module 110... Component body 111~114... First reference surface 115, 130... Component accommodating portion (first component accommodating portion) 116, 117... Engaging protrusion 134, 138... Component accommodating portion (second component accommodating portion) 141~144... Second reference surface 151, 153... Coating layer 152... Interlayer connection portion

Claims

1. A first component mounting substrate having an imaging element, a second component mounting substrate electrically connected to the first component mounting substrate, and a spacer component disposed between the first component mounting substrate and the second component mounting substrate and comprising: The spacer component has a first main surface that contacts the first component mounting substrate and has three or more first reference surfaces, a second main surface that contacts the second component mounting substrate and has three or more second reference surfaces, and a bottomed or bottomless component accommodating portion provided on at least one of the first main surface and the second main surface, and has a component body made of a first insulating material Camera module.

2. The camera module according to claim 1, wherein the plurality of first and second reference surfaces are respectively provided at the peripheral edges of the first and second main surfaces Camera module.

3. The camera module according to claim 1, wherein the component accommodating portion includes a first component accommodating portion formed of a through hole, the first component mounting substrate further has a first connector component accommodated in the component accommodating portion, and the second component mounting substrate has a second connector component accommodated in the component accommodating portion and connected to the first connector component Camera module.

4. The camera module according to claim 1, wherein the component body further has a plurality of engaging protrusions for regulating displacement between the spacer component and the first component mounting substrate Camera module.

5. The camera module according to claim 4, wherein the plurality of engaging protrusions are shaft portions respectively provided on two opposing side edges of the first main surface, and claw portions provided at the tips of the shaft portions and engaging with a surface of the first component mounting substrate opposite to the surface facing the spacer component Camera module.

6. The camera module according to claim 5, wherein the first component mounting substrate has recesses respectively provided on two opposing side edges and through which the shaft portions are inserted Camera module.

7. The camera module according to claim 1, wherein the component accommodating portion further includes a bottomed second component accommodating portion, and the spacer component further has a coating layer made of a second insulating material different from the first insulating material and forming the inner surface of the second component accommodating portion Camera module.

8. The camera module according to claim 7, wherein the second insulating material is made of a composite material containing a radio wave absorbing material Camera module.

9. The camera module according to claim 8, wherein the second component accommodating portion is provided at a portion facing the imaging element in the thickness direction of the spacer component Camera module.

10. The camera module according to claim 7, wherein the second insulating material has higher thermal conductivity than the first insulating material Camera module.

11. The camera module according to claim 1, wherein the spacer component is provided inside the component body and further has an interlayer connection portion that electrically conducts between the first component mounting substrate and the second component mounting substrate Camera module.

12. The camera module according to claim 1, further comprising a casing that integrally houses a laminate of the first component mounting substrate, the spacer component, and the second component mounting substrate Camera module.

13. Prepare a spacer component made of an insulating material, having a first main surface portion having a plurality of first reference surfaces that contact the first component mounting substrate having an imaging element, a second main surface portion having a plurality of second reference surfaces that contact the second component mounting substrate, and a bottomless component accommodating portion provided on at least one of the first main surface portion and the second main surface portion, snap-fit connect the first component mounting substrate to the spacer component, by placing the first component mounting substrate on the plurality of first reference surfaces, accommodate a first connector component mounted on the first component mounting substrate in the component accommodating portion, invert the spacer component up and down, and by placing the second component mounting substrate on the plurality of second reference surfaces, connect a second connector component mounted on the second component mounting substrate to the first connector component within the component accommodating portion Method for manufacturing a camera module.

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