Dielectric heat transfer windows, and systems and methods using the same
a technology of dielectric heat transfer and dielectric components, applied in the direction of contact heating/cooling, substation/switching arrangement details, basic electric elements, etc., can solve the problems of premature activation of trip mechanisms, damage to components, and variable events to occur, so as to reduce temperatures
Active Publication Date: 2017-09-28
EATON INTELLIGENT POWER LTD
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Problems solved by technology
This heat, if it becomes excessive, can cause various events to occur, including but not limited to damage to components, other devices, premature activation of trip mechanisms, and other malfunctions.
Likewise, as electrical distribution assemblies and electrical switching devices therein are developed with greater complexity, the heat generated throughout the electrical distribution assembly and electrical components may increase.
As a result of this potential increase in heat, it may become somewhat difficult for the electrical distribution assemblies and electrical switching devices to operate within the given temperature ranges established by various safety organizations as an industry standard.
However, due to cost constraints, potential structural weakness, and various other inefficiencies related to these thermally conductive materials, a better thermally conductive material for performing the vital task of heat transfer is needed.
However, PPO and epoxy resin insulation products often lack the desirable strength to maintain structural integrity under extreme conditions for desirable periods of time, and as such have a tendency to break apart.
Additionally, in some instances relating to electrical distribution assemblies involving electrical conductors, TIMs may provide insufficient thermal conductivity unless they are of a sufficiently thermally conductive variety that tends to be prohibitively expensive.
Additionally, TIMs generally are limited to a thermal conductivity of roughly 1 W / (m·K) before becoming prohibitively expensive.
Method used
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[0021]The disclosed concept may take form in various components and arrangements of components, and in various techniques, methods, or procedures and arrangements of steps. The referenced drawings are only for the purpose of illustrated embodiments, and are not to be construed as limiting the present invention. Various inventive features are described below that can each be used independently of one another or in combination with other features.
[0022]Directional phrases used herein, such as, for example, left, right, front, back, top, bottom, and derivatives thereof, relate to the orientation of the elements shown in the drawings and are not limiting upon the claims unless expressly recited therein.
[0023]As employed herein, the singular form of “a”, “an”, and “the” include plural references unless the context clearly dictates otherwise. Still further, as used herein, the term “number” shall mean one or an integer greater than one (e.g., a plurality).
[0024]As employed herein, the ter...
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Devices, systems, and methods for dissipating heat from electrical distribution assemblies and electrical switching devices are described herein. In one non-limiting embodiment, a dielectric material of relatively high thermal conductivity can be thermally coupled to electrical switching devices to act as a dielectric heat transfer window that dissipates heat. The dielectric heat transfer window includes at least a first portion thermally coupled to a heat generating component within an electrical switching device, and a second portion disposed external to the electrical distribution assembly or electrical switching device. Among other benefits, this allows heat generated within the electrical switching device to escape the interior of the electrical switching device to an environment external to the electrical switching device.
Description
BACKGROUND[0001]Field[0002]The disclosed concept relates generally to electrical power systems and, more particularly, to electrical distribution assemblies. The disclosed concept relates to dielectric materials of high thermal conductivity that can be molded or assembled into electrical distribution assemblies to act as heat transfer windows that dissipate heat generated in and / or around electrical distribution assemblies. The disclosed concept further relates to methods for removing heat from an electrical switching device.[0003]Background Information[0004]Electrical distribution assemblies generally include electrical switching devices. When current runs through an electrical switching device, heat is generated by components of the electrical switching device. As a result of this heat, the temperature within and around the electrical switching device, and more generally the electrical distribution assembly, tends to increase. This heat, if it becomes excessive, can cause various ...
Claims
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IPC IPC(8): H02B1/56H02B1/46
CPCH02B1/46H02B1/56H01H1/62H01H9/52
InventorFRITZ, PETER JAMES
OwnerEATON INTELLIGENT POWER LTD