Micro stamping die in-situ manufacturing device

A manufacturing device and micro-stamping technology, applied in the field of precision machinery manufacturing, can solve problems such as difficulty in ensuring the uniformity of blanking gaps

CN102489802BActive Publication Date: 2013-05-08HARBIN INST OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2013-05-08

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Abstract

A micro stamping die in-situ manufacturing device belongs to the field of precision machine manufacturing. The device achieves the in-situ manufacturing of a micro punch and a female die through a micro EDM (Electric Discharge Machining) method, and omits the operation that the micro punch and the female die in a micro stamping die are assembled secondarily, and ensures the uniformity of the gap between the punch and a working hole on the female die. The micro stamping die adopts a split-type three-layer structure; four sets of guide mechanisms are uniformly distributed between a connecting plate and a lower die holder; the lower end of each precision guide pole is fixedly mounted on a female die fixing plate; each precision guide pole passes through the second layer; the upper end of each precision guide pole can be matched with the first layer; each precision guide pole is in interference fit with two guide sleeves on each precision guide pole; four sets of blank holder devices are uniformly distributed between an upper die holder and a pressure plate; and four ejection springs are positioned between the second layer and a third layer. The invention can achieves the multiple micro forming processes such as micro punching, micro drawing, micro bulging and the like, and is particularly suitable for low-cost batch manufacture of micropore parts and microcup parts.
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Description

technical field

[0001] The invention relates to an in-situ manufacturing device for a micro-stamping die, which is particularly suitable for high-quality manufacturing of micro-holes and belongs to the field of precision machinery manufacturing. Background technique

[0002] Microporous parts are widely used in the fields of microelectronic integrated circuits, biomedicine, printing and dyeing textiles, etc., and the size or feature size of the parts is in the submillimeter or micron level. At the same time, with the development of micro-system technology and its gradual practical application, the miniaturization of products has put forward higher requirements for the dimensional accuracy, section quality and production efficiency of micro-porous parts.

[0003] The invention patent with the publication number CN101406914B, the publication date is June 16, 2010, and the name is "Micro-Punching Die" proposes a micro-punching die, which can Effectively improve the efficiency ...

Examples

specific Embodiment approach 1

[0013] Specific implementation mode one: as Figure 1-10As shown, the in-situ manufacturing device described in this embodiment includes an XY precision mobile platform 1, a high-resolution CCD vision system 4 and a block electrode 5, and the block electrode 5 is installed on the working arm 1-1 on the XY precision mobile platform 1 Above, the high-resolution CCD vision system 4 is fixed on the XY precision mobile platform 1, and the in-situ manufacturing device also includes a micro-EDM spindle system 2 and a micro-stamping die 3; The positions of the punches 2-8 of the micro-stamping die of the system 2 are consistent; the micro-EDM spindle system 2 includes a DC motor 2-1, a DC motor pulley 2-2, a DC motor connecting plate 2-5, and a rotating spindle 2 -6, driven pulley 2-4, main shaft clamping body 2-7, carbon brush 2-3, punch 2-8 of micro stamping die, rotating main shaft chuck 2-9, main shaft insulating plate 2-10 and Main shaft L-shaped support 2-12; The lower end of r...

specific Embodiment approach 2

[0018] Specific implementation mode two: as Figures 16-18 As shown, the in-situ manufacturing device in this embodiment further includes a sheet electrode 6 , and the sheet electrode 6 is arranged on the upper end surface of the bulk electrode 5 . Other components and connections are the same as those in the first embodiment.

specific Embodiment approach 3

[0019] Specific implementation mode three: as Figure 1~2 As shown, the in-situ manufacturing device in this embodiment further includes a fixed seat 9 on which the XY precision mobile platform 1 is mounted. Other compositions and connections are the same as those in Embodiment 1 or 2.