A novel microphone structure and flip-type electronic device

Abstract

The present invention discloses a novel microphone structure and a flip-top electronic device, which include: a first layer board, an acoustic sensor and a circuit chip are connected to the first layer board; a second layer board, the second layer board is covered on the first layer board; the first layer board and the second layer board constitute a microphone acoustic cavity, the microphone acoustic cavity is provided with two acoustic through holes, and the two acoustic through holes are located on two opposite sides or two adjacent sides of the microphone acoustic cavity. The beneficial effect of the technical solution of the present invention is that: the microphone acoustic cavity in the novel microphone structure is provided with two acoustic through holes, and the two acoustic through holes are located on two opposite sides or two adjacent sides of the microphone acoustic cavity, and by changing the installation position of the novel microphone structure, the sound received inside and outside when using the flip-top electronic device is consistent, and when the flip cover of the flip-top electronic device is closed, the outside world can receive the sound.

Description

Technical Field

[0001] The present invention relates to the field of micro-electromechanical technology, and in particular to a novel microphone structure and a flip-type electronic device. Background Art

[0002] With the development of mobile multimedia technology, electronic products are constantly moving towards miniaturization and integration. In electronic products in the field of electroacoustics, microphones are used to convert sound signals into electrical signals.

[0003] At present, laptops have more and more functions, and some laptops have functions such as voice input, network voice communication applications and recording, that is, laptops have sound applications. Traditional laptop panels are provided with sound holes, and the opening direction of the sound holes is set in the direction of the computer screen. When the laptop is closed, the sound holes are pressed and cannot effectively receive sound, which brings inconvenience to the user. Summary of the invention

[0004] In view of the above problems existing in the prior art, a new microphone structure and a flip-type electronic device are provided for receiving sounds both inside and outside.

[0005] The specific technical solutions are as follows:

[0006] A novel microphone structure, comprising:

[0007] A first layer board, wherein an acoustic sensor and a circuit chip are connected to the first layer board;

[0008] A second layer of board, the second layer of board is covered on the first layer of board;

[0009] The first layer board and the second layer board form a microphone acoustic cavity, and the microphone acoustic cavity is provided with two acoustic through holes, and the two acoustic through holes are located on two opposite sides or two adjacent sides of the microphone acoustic cavity.

[0010] Preferably, a first acoustic through hole is arranged on the first layer of the board, a second acoustic through hole is arranged on the first surface of the second layer of the board, and the first acoustic through hole and the second acoustic through hole are respectively arranged on two opposite surfaces of the acoustic cavity of the microphone.

[0011] Preferably, the first acoustic through hole and the second acoustic through hole are aligned with each other.

[0012] Preferably, a first acoustic through hole is arranged on the first layer of the board, a second acoustic through hole is arranged on the second surface of the second layer of the board, and the first acoustic through hole and the second acoustic through hole are respectively arranged on two adjacent surfaces of the acoustic cavity of the microphone.

[0013] Preferably, a first acoustic through hole is arranged on the first surface of the second layer board, a second acoustic through hole is arranged on the second surface of the second layer board, and the first acoustic through hole and the second acoustic through hole are respectively arranged on two adjacent surfaces of the microphone acoustic cavity.

[0014] Preferably, the first layer board is a printed circuit board, and a solder pad is arranged at the bottom of the printed circuit board.

[0015] Preferably, the acoustic sensor is connected to the circuit chip via leads.

[0016] A flip-top electronic device includes a foldable cover plate, wherein at least two through holes are arranged on the cover plate, and at least two through holes are arranged on two opposite sides or two adjacent sides of the cover plate, and any one of the novel microphone structures described above is installed in the through holes.

[0017] Preferably, at least two of the through holes are respectively aligned with the two acoustic through holes that penetrate the novel microphone structure.

[0018] Preferably, the clamshell electronic device is a notebook computer.

[0019] The beneficial effect of the technical solution of the present invention is that two acoustic through holes are provided on the microphone acoustic cavity in the new microphone structure, and the two acoustic through holes are located on two opposite sides or two adjacent sides of the microphone acoustic cavity. By changing the installation position of the new microphone structure, the sounds received inside and outside are consistent when using a flip-type electronic device, and when the flip cover of the flip-type electronic device is closed, the sound can be received by the outside world. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The embodiments of the present invention will be described more fully with reference to the attached drawings, which are provided for illustration and description only and are not intended to limit the scope of the present invention.

[0021] Figure 1 A structural diagram of Embodiment 1 of a novel microphone structure of the present invention;

[0022] Figure 2 It is a structural diagram of Example 2 of a novel microphone structure of the present invention;

[0023] Figure 3 It is a structural diagram of Embodiment 3 of a novel microphone structure of the present invention;

[0024] Figure 4 A partial front exploded view of a clamshell electronic device in an embodiment of the present invention;

[0025] Figure 5 It is a partial exploded view of the back side of a clamshell electronic device in an embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0029] The present invention comprises a novel microphone structure, which comprises:

[0030] A first layer board 1, on which an acoustic sensor 10 and a circuit chip 11 are connected;

[0031] A second layer of board 2, the second layer of board 2 is covered on the first layer of board 1;

[0032] The first layer board 1 and the second layer board 2 form a microphone acoustic cavity 3 . The microphone acoustic cavity 3 is provided with two acoustic through holes. The two acoustic through holes are located on two opposite surfaces or two adjacent surfaces of the microphone acoustic cavity 3 .

[0033] Through the above-mentioned novel microphone structure, such as Figure 1 As shown, first, the acoustic sensor 10 is used to convert the sound wave signal into a voltage signal, and the circuit chip 11 processes the output voltage signal and performs analog-to-digital conversion to finally obtain a digital signal; secondly, the first layer board 1 and the second layer board 2 constitute a microphone acoustic cavity 3, and the microphone acoustic cavity 3 is provided with two acoustic through holes, and the two acoustic through holes are located on two opposite sides or two adjacent sides of the microphone acoustic cavity 3. By converting the installation position of the new microphone structure, it can be applied to various flip-type electronic devices, so that the inside of the microphone acoustic cavity 3 is connected with the outside world, and finally the sound signal is transmitted to the outside world.

[0034] In a preferred embodiment, a first acoustic through hole 12 is provided on the first layer board 1, and a second acoustic through hole 20a is provided on the first surface 2a of the second layer board 2. The first acoustic through hole 12 and the second acoustic through hole 20a are respectively provided on two opposite surfaces of the microphone acoustic cavity 3.

[0035] In a preferred embodiment, the first acoustic through hole 12 is aligned with the second acoustic through hole 20a.

[0036] Specifically, in this embodiment 1, Figure 1 As shown, a first acoustic through hole 12 is arranged on the first layer 1, and a second acoustic through hole 20a is arranged on the first surface 2a of the second layer 2. The first acoustic through hole 12 and the second acoustic through hole 20a are respectively arranged on two opposite surfaces of the microphone acoustic cavity 3, and the first acoustic through hole 12 and the second acoustic through hole 20a are aligned so that the sounds received by the first acoustic through hole 10 and the second acoustic through hole 20a inside and outside are consistent.

[0037] In a preferred embodiment, a first acoustic through hole 12 is arranged on the first layer board 1, and a second acoustic through hole 20b is arranged on the second surface 2b of the second layer board 2. The first acoustic through hole 12 and the second acoustic through hole 20b are respectively arranged on two adjacent surfaces of the microphone acoustic cavity 3.

[0038] Specifically, in this embodiment 2, Figure 2 As shown, a first acoustic through hole 12 is arranged on the first layer board 1, and a second acoustic through hole 20b is arranged on the second surface 2b of the second layer board 2. The first acoustic through hole 12 and the second acoustic through hole 20b are respectively arranged on two adjacent surfaces of the microphone acoustic cavity 3. By changing the installation position of the new microphone structure, the new microphone structure is applicable to a wider range of flip-type electronic devices.

[0039] In a preferred embodiment, a first acoustic through hole 20a is provided on the first surface 2a of the second layer 2, and a second acoustic through hole 20b is provided on the second surface 2b of the second layer 2. The first acoustic through hole 20a and the second acoustic through hole 20b are respectively provided on two adjacent surfaces of the microphone acoustic cavity 3.

[0040] Specifically, in this embodiment 3, Figure 3 As shown, a first acoustic through hole 20a is arranged on the first surface 2a of the second layer board 2, and a second acoustic through hole 20b is arranged on the second surface 2b of the second layer board 2. The first acoustic through hole 20a and the second acoustic through hole 20b are respectively arranged on two adjacent surfaces of the microphone acoustic cavity 3. By changing the installation position of the new microphone structure, the new microphone structure is suitable for a wider range of flip-type electronic devices.

[0041] In a preferred embodiment, the first layer board 1 is a printed circuit board, and a soldering pad is arranged at the bottom of the printed circuit board.

[0042] In a preferred embodiment, the acoustic sensor 10 is connected to the circuit chip 11 by wires. The acoustic sensor 10 and the circuit chip 11 on the first layer are connected to an external power supply through a printed circuit board and wires to form a complete loop for signal conversion.

[0043] It should be noted that the acoustic sensor 10 and the circuit chip 11 are technologies in the art and will not be described in detail herein.

[0044] A flip-top electronic device includes a foldable cover plate 4, on which at least two through holes 40 are arranged. The at least two through holes 40 are arranged on two opposite sides or two adjacent sides of the cover plate 4, and any of the above-mentioned novel microphone structures is installed in the through holes 40.

[0045] In a preferred embodiment, at least two through holes 40 are respectively aligned with two acoustic through holes that penetrate the novel microphone structure.

[0046] In a preferred embodiment, the clamshell electronic device is a notebook computer.

[0047] Specifically, Figure 4 As shown, the front part of the laptop exploded view, Figure 5 As shown, a partial exploded view of the back of the laptop computer;

[0048] Furthermore, the user can select the new microphone structure of embodiment 1, embodiment 2 or embodiment 3, and by changing the installation position of the new microphone structure, the two opposite sides or two adjacent sides of the cover 4 of the flip-type electronic device can receive the same sound, and when the laptop computer is closed, the outside world can receive the sound.

[0049] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A novel microphone structure, characterized in that: For use in clamshell electronic devices, including: A first layer board, an acoustic sensor and a circuit chip are connected to the first layer board; A second layer of board, the second layer of board is covered on the first layer of board; The first layer board and the second layer board form a microphone acoustic cavity, and the microphone acoustic cavity is provided with two acoustic through holes, the two acoustic through holes are located on two adjacent surfaces of the microphone acoustic cavity, and the two acoustic through holes are respectively aligned with the two through holes that penetrate the flip-type electronic device.

2. The microphone structure according to claim 1, characterized in that: A first acoustic through hole is arranged on the first layer board, a second acoustic through hole is arranged on the second surface of the second layer board, and the first acoustic through hole and the second acoustic through hole are arranged on two adjacent surfaces of the microphone acoustic cavity respectively.

3. The microphone structure according to claim 1, characterized in that: A first acoustic through hole is disposed on the first surface of the second layer board, a second acoustic through hole is disposed on the second surface of the second layer board, and the first acoustic through hole and the second acoustic through hole are respectively disposed on two adjacent surfaces of the microphone acoustic cavity.

4. The microphone structure according to claim 1, characterized in that: The first layer board is a printed circuit board, and a solder pad is arranged at the bottom of the printed circuit board.

5. The microphone structure according to claim 1, characterized in that: The acoustic sensor is connected to the circuit chip via leads.

6. A flip-type electronic device, characterized in that: It comprises a foldable cover plate, wherein at least two through holes are arranged on the cover plate, and at least two of the through holes are arranged on two adjacent sides of the cover plate, and the novel microphone structure according to any one of claims 1-5 is installed in the through holes.

7. The clamshell electronic device according to claim 6, characterized in that: At least two of the through holes are respectively aligned with the two acoustic through holes that penetrate the novel microphone structure.

8. The clamshell electronic device according to claim 6, characterized in that: The clamshell electronic device is a notebook computer.

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