Radiator and water heater combined structure

Abstract

The present invention provides a radiator and water heater combination structure, including: a thermal superconducting plate, with interconnected sealed channels formed inside, and the sealed channels are filled with heat transfer medium; a liquid-cooled radiator, located on the surface of the thermal superconducting plate, with a liquid channel formed inside the liquid-cooled radiator, and a liquid inlet and a liquid outlet are provided on the liquid-cooled radiator; a water heater body, with water to be heated inside; a heat exchanger, located inside the water heater body; a first circulation pipe, one end of which is connected to the liquid inlet and the other end is connected to the heat exchanger; a second circulation pipe, one end of which is connected to the liquid outlet and the other end is connected to the heat exchanger; a circulation pump, which is located on the first circulation pipeline or the second circulation pipeline. In the present invention, when the power device is working normally, the thermal superconducting plate and the liquid-cooled radiator can reasonably utilize the heat generated by the power device, which can be used to heat the cold water in the water heater body to generate hot water for domestic use or heating, saving energy consumption and improving the quality of life.

Description

Technical Field

[0001] The invention belongs to the technical field of heat transfer, and in particular relates to a combined structure of a radiator and a water heater. Background Art

[0002] Traditional profile radiators have the disadvantage that the heat dissipation efficiency at the tail end of the heat dissipation fins is low due to the excessive height of the heat dissipation fins. Summary of the invention

[0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a radiator and water heater combination structure to solve the problem that the heat dissipation capacity of the radiator in the prior art is limited, the high-power device cannot be effectively cooled, and the reasonable utilization of the heat generated by the high-power radiator is restricted.

[0004] In order to achieve the above-mentioned object and other related objects, the present invention provides a radiator and water heater combination structure, the radiator and water heater combination structure comprising:

[0005] A thermal superconducting plate, wherein the thermal superconducting plate has mutually communicating sealed channels formed therein, wherein the sealed channels are filled with a heat transfer medium; and a heat source installation area is provided on the surface of the thermal superconducting plate;

[0006] a liquid cooling radiator, located on the surface of the thermal superconducting plate and outside the heat source installation area, wherein a liquid channel is formed in the liquid cooling radiator, and a liquid inlet and a liquid outlet connected to the liquid channel are provided on the liquid cooling radiator;

[0007] The water heater body contains water to be heated; the water heater body is provided with a water inlet and a water outlet connected to the interior of the water heater body;

[0008] a heat exchanger, located in the water heater body;

[0009] A first circulation pipe, one end of which is connected to the liquid inlet, and the other end of which is connected to the heat exchanger;

[0010] a second circulation pipe, one end of which is connected to the liquid outlet, and the other end of which is connected to the heat exchanger;

[0011] A circulation pump is located on the first circulation pipeline or the second circulation pipeline.

[0012] As a preferred embodiment of the present invention, the liquid-cooled radiator includes a first guide plate and a liquid channel cover plate; a receiving groove is formed on one surface of the liquid channel cover plate, and the surface of the liquid channel cover plate formed with the receiving groove is attached to the surface of the thermal superconducting plate to form a liquid channel chamber between the liquid channel cover plate and the thermal superconducting plate; the first guide plate is located in the liquid channel chamber and is fixed to the surface of the thermal superconducting plate to form the liquid channel interconnected with the first guide plate, the thermal superconducting plate and the liquid channel cover plate; the liquid inlet and the liquid outlet are both located on the liquid channel cover plate.

[0013] As a preferred embodiment of the present invention, the containing tank includes a first containing tank and a second containing tank, and the first containing tank and the second containing tank both include a first end and a second end opposite to each other; there are two first guide plates, and the first guide plates are respectively located in the first containing tank, and the other first guide plate is located in the second containing tank; the liquid inlet is located at the first end of the first containing tank and is connected to the first containing tank, and the liquid outlet is located at the first end of the second containing tank and is connected to the second containing tank; the second end of the first containing tank is connected to the second end of the second containing tank.

[0014] As a preferred solution of the present invention, the first guide plate comprises:

[0015] A plurality of first guide strips, wherein the first guide strips extend in a wave shape or a square wave shape along a direction perpendicular to the first end of the first containing groove to the second end of the first containing groove, and the plurality of first guide strips are arranged in parallel along a direction from the first end of the first containing groove to the second end of the first containing groove;

[0016] The first connecting parts are located at two ends of the first guide bars and are integrally connected to each of the first guide bars.

[0017] As a preferred solution of the present invention, the first guide plate includes a plurality of flat-plate-shaped first guide strips, and the plurality of first guide strips are arranged in parallel and spaced apart in a direction perpendicular to the first end of the first accommodating groove to the second end of the first accommodating groove.

[0018] As a preferred solution of the present invention, the radiator and water heater combination structure further includes:

[0019] A first heat dissipation fin is located on at least one surface of the thermal superconducting plate and outside the heat source installation area, wherein a plurality of first heat dissipation channels arranged in parallel and spaced apart are formed in the first heat dissipation fin;

[0020] A second heat dissipation fin is located on a surface of the liquid cooling radiator away from the thermal superconducting plate; a plurality of second heat dissipation channels arranged in parallel and spaced apart are formed in the second heat dissipation fin, and the second heat dissipation channel is parallel to the first heat dissipation channel;

[0021] A partition, wherein the partition is placed on the thermal superconducting plate to divide the thermal superconducting plate into a first part and a second part; wherein the first part is located above the partition, and the second part is located below the partition; the first heat dissipation fin is located on the surface of the first part, and the liquid cooling radiator is located on the surface of the first part; and the heat source installation area is located on the surface of the second part;

[0022] A power device, wherein the power device is located on the surface of the thermal superconducting plate and is located in the heat source installation area;

[0023] A sealed box body is formed with an opening on one side of the sealed box body, and the sealed box body is placed on the periphery of the power device and the second part through the opening sleeve; the width of the opening is less than or equal to the width of the partition, and the length of the opening is less than or equal to the length of the partition.

[0024] As a preferred solution of the present invention, the radiator and water heater combination structure further includes:

[0025] A shell, which is placed on the top and outside of the thermal superconducting plate, the liquid cooling radiator, the first heat dissipating fins and the second heat dissipating fins, so as to form an air duct between the thermal superconducting plate and the shell;

[0026] At least one fan is located at one end of the first heat dissipation fin and outside the shell, and an air outlet surface of the fan faces the first heat dissipation fin and is perpendicular to an extension direction of the first heat dissipation channel.

[0027] As a preferred solution of the present invention, the radiator and water heater combination structure further includes:

[0028] An electric heating system, the electric heating system comprising: a heating device and an electrical connection line, the heating device is located in the water heater body; one end of the electrical connection line is connected to the heating device;

[0029] One end of the temperature measuring probe is inserted into the water heater body.

[0030] As a preferred embodiment of the present invention, the radiator and water heater combination structure further includes a circulating liquid tank containing circulating liquid; the end of the first circulation pipeline away from the liquid inlet is connected to the heat exchanger via the circulating liquid tank.

[0031] As a preferred solution of the present invention, the thermal superconducting plate comprises: an annular frame, a first cover plate, a second cover plate and at least one second guide plate; wherein,

[0032] The first cover plate is attached to a surface of the annular frame, and the second cover plate is attached to a surface of the annular frame away from the first cover plate, so as to form a sealed chamber between the first cover plate and the second cover plate;

[0033] The second guide plate is located in the sealed chamber; the second guide plate includes a plurality of protrusions arranged at intervals along a first direction and extending along a second direction, wherein the first direction is perpendicular to the second direction, the bottoms of adjacent protrusions in the first direction are integrally connected, and there are gaps on the inner sides of the protrusions and between adjacent protrusions, so that the sealed channel is formed between the second guide plate and the first cover plate and the second cover plate.

[0034] As a preferred embodiment of the present invention, the thermal superconducting plate includes at least two second guide plates, the length of the second guide plates is the same as the length of the inner side of the annular frame; there is a gap between adjacent second guide plates to form a first balance channel for the heat transfer medium between adjacent second guide plates, and the first balance channel extends along the first direction; a second guide plate adjacent to the annular frame has a gap with the annular frame to form a second balance channel for the heat transfer medium between the second guide plate and the annular frame, and the second balance channel extends along the first direction; the height of the second guide plate is the same as the height of the annular frame.

[0035] As a preferred solution of the present invention, the side walls of the convex portion are each provided with a plurality of guide holes, and the guide holes penetrate the second guide plate along the thickness direction of the second guide plate.

[0036] As a preferred solution of the present invention, at least one reserved gap is provided in the second guide plate; the thermal superconducting plate further comprises at least one pad, which is located in the reserved gap; the height of the pad is the same as that of the second guide plate, and a first mounting through hole is provided in the pad which passes through along its height direction; the first cover plate is further provided with at least one second mounting through hole which passes through along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is further provided with at least one third mounting through hole which passes through along its thickness direction, and the third mounting through hole is arranged corresponding to the first mounting through hole.

[0037] As a preferred solution of the present invention, at least one reserved gap is provided in the second guide plate; at least one stamped boss is provided on the first cover plate or the second cover plate, and the stamped boss is protruded from the inner surface of the first cover plate or the second cover plate in the preset gap, the height of the stamped boss is the same as the height of the second guide plate, and a first mounting through hole is provided in the stamped boss that passes through along its height direction, and at least one second mounting through hole is also provided on the second cover plate or the first cover plate that passes through along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole.

[0038] As a preferred solution of the present invention, the thermal superconducting plate comprises:

[0039] first cover plate;

[0040] The second cover plate comprises a cover plate body and an annular convex edge, wherein the annular convex edge is integrally connected to the cover plate body; the first cover plate is attached to a surface of the annular convex edge away from the cover plate body, so as to form a sealed chamber between the first cover plate and the cover plate body;

[0041] At least one second guide plate is located in the sealed chamber; the second guide plate includes a plurality of protrusions arranged at intervals along a first direction and extending along a second direction, wherein the first direction is perpendicular to the second direction, the bottoms of adjacent protrusions in the first direction are integrally connected, and there are gaps on the inner sides of the protrusions and between adjacent protrusions, so that the sealed channel is formed between the second guide plate and the first cover plate and the second cover plate.

[0042] As a preferred solution of the present invention, the thermal superconducting plate includes at least two second guide plates, the length of the second guide plates is the same as the length of the inner side of the annular convex edge; there is a gap between adjacent second guide plates to form a first balance channel for the heat transfer medium between adjacent second guide plates, and the first balance channel extends along the first direction; a second guide plate adjacent to the annular convex edge has a gap with the annular convex edge to form a second balance channel for the heat transfer medium between the second guide plate and the annular convex edge, and the second balance channel extends along the first direction; the height of the second guide plate is the same as the height of the annular convex edge.

[0043] As a preferred solution of the present invention, the side walls of the convex portion are each provided with a plurality of guide holes, and the guide holes penetrate the second guide plate along the thickness direction of the second guide plate.

[0044] As a preferred solution of the present invention, at least one reserved gap is provided in the second guide plate; the thermal superconducting plate further comprises at least one pad, which is located in the reserved gap; the height of the pad is the same as that of the second guide plate, and a first mounting through hole is provided in the pad which passes through along its height direction; the first cover plate is further provided with at least one second mounting through hole which passes through along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is further provided with at least one third mounting through hole which passes through along its thickness direction, and the third mounting through hole is arranged corresponding to the first mounting through hole.

[0045] As a preferred solution of the present invention, at least one reserved gap is provided in the second guide plate; at least one stamped boss is provided on the first cover plate or the second cover plate, and the stamped boss is protruded from the inner surface of the first cover plate or the second cover plate in the preset gap, the height of the stamped boss is the same as the height of the second guide plate, and a first mounting through hole is provided in the stamped boss that passes through along its height direction, and at least one second mounting through hole is also provided on the second cover plate or the first cover plate that passes through along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole.

[0046] As described above, the radiator and water heater combination structure of the present invention has the following beneficial effects:

[0047] 1. By attaching the power device to the surface of the thermal superconducting plate, and arranging a liquid cooling radiator connected to the circulating liquid tank through a circulation pipe on the surface of the thermal superconducting plate, and the circulation pipe part is located in the water heater body, when the power device is working normally, the thermal superconducting plate and the liquid cooling radiator can reasonably utilize the heat generated by the power device, which can be used to heat the cold water in the water heater body to generate hot water for domestic use or heating, saving energy consumption and improving the quality of life;

[0048] 2. The liquid cooling radiator is provided with a first guide plate. In addition to enhancing liquid disturbance and increasing heat exchange area, thereby improving heat dissipation capacity, the guide plate also acts as a reinforcing rib, which can reduce the thickness of the liquid cooling cover plate, thereby reducing the overall weight of the radiator;

[0049] 3. The sealed cavity inside the thermal superconducting plate is filled with heat transfer medium, which relies on phase change of the heat transfer medium to transfer heat or phase change to inhibit heat transfer, forming a thermal superconducting characteristic of rapid heat conduction. The equivalent thermal conductivity can reach more than 4000W / m℃, making the temperature of the entire thermal superconducting plate uniform, reducing the temperature difference between each power device and the maximum temperature of the radiator;

[0050] 4. By setting a fan, two forced cooling methods, water cooling and air cooling, can be used to dissipate heat for power devices. The thermal superconducting plate has fast heat conduction and uniform temperature. Under the same heat dissipation conditions, the entire structure is small in size and light in weight. It can achieve high heat exchange at very low wind speed, achieving the purpose of low noise or silence. At the same time, two cooling systems, air cooling and liquid cooling, are used. When the cold water in the water heater body is heated to a predetermined temperature, the circulation pump stops working and the liquid cooling radiator stops dissipating heat. At this time, the fan is started, and the heat dissipation mode of the power device is naturally switched from water cooling to air cooling mode, which has higher reliability.

[0051] 5. The thermal superconducting plate is welded with heat dissipating fins, which can quickly take away the heat conducted by the thermal superconducting plate through the air and dissipate it. The heat dissipating fins not only increase the heat exchange area with the air, reduce the thermal resistance of the system, and improve the heat dissipation capacity, but also play the role of strengthening the thermal superconducting plate, so as to reduce the material thickness of the thermal superconducting plate, improve the strength, reduce the weight, and reduce the cost; the double-sided welding heat dissipating fins are adopted to avoid the defects of the traditional profile radiator due to the excessive height of the heat dissipating fins and the low heat dissipation efficiency at the tail end of the heat dissipating fins, thereby improving the heat dissipation efficiency of the heat dissipating fins;

[0052] 6. The power devices are arranged on the two opposite surfaces of the thermal superconducting plate, with compact structure, small volume and good heat dissipation effect;

[0053] 7. A partition is arranged on the thermal superconducting plate, which divides the thermal superconducting plate into a first part and a second part at the top and bottom. A power device is arranged on the surface of the second part at the bottom, and the second part is sealed by arranging a sealing box to achieve full sealing of the power device, thereby improving the protection level and reliability;

[0054] 8. The interior of the thermal superconducting plate is a sealed cavity, and a second guide plate is provided. The second guide plate inside welds the first cover plate and the second cover plate together, which plays a reinforcing role. The thickness of the cover plates on both sides is thinned, the pressure bearing capacity is increased, the strength is improved, the weight and thickness of the thermal superconducting plate are reduced, and the internal heat exchange area is increased, thereby enhancing the thermal conductivity of the thermal superconducting plate;

[0055] 9. By setting up an electric heating system, the cold water in the water heater body can be heated using two heating systems, the heat exchanger and the electric heating system. When one of them fails, the other can replace it, which has high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 and Figure 2 Shown is a three-dimensional structural schematic diagram of the radiator and water heater combination structure provided in the first embodiment of the present invention.

[0057] Figure 3Shown is a schematic diagram of the exploded structure of a portion of the radiator and water heater combination structure provided in the first embodiment of the present invention.

[0058] Figure 4 Shown is a three-dimensional structural schematic diagram of a portion of the structure of the radiator and water heater combination structure provided in the first embodiment of the present invention.

[0059] Figures 5 to 7 Shown is a schematic diagram of the three-dimensional structure of the liquid-cooled radiator in the radiator and water heater combination structure provided in the first embodiment of the present invention.

[0060] Figure 8 Shown is a schematic diagram of the exploded structure of the thermal superconducting plate in the radiator and water heater combination structure provided in the first embodiment of the present invention.

[0061] Fig. 9 Shown is a schematic diagram of the three-dimensional structure of the thermal superconducting plate in the radiator and water heater combination structure provided in the first embodiment of the present invention.

[0062] Figures 10 to 15 Shown are structural schematic diagrams of guide plates of different examples in the thermal superconducting plate in the radiator and water heater combination structure provided in the first embodiment of the present invention; wherein, Fig.11 for Fig.10 The front view of Fig.13 for Fig.12 The front view of Fig.15 for Fig.14 Front view of .

[0063] Fig.16 Shown is a schematic diagram of a partial cross-sectional structure of the edge portion of the radiator and water heater combination structure provided in the first embodiment of the present invention.

[0064] Figures 17 to 21 Shown are three-dimensional structural schematic diagrams of different examples of heat dissipation fins in the radiator and water heater combination structure provided in the first embodiment of the present invention.

[0065] Fig. 22 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a reserved gap in the combined structure of a radiator and a water heater provided in the second embodiment of the present invention.

[0066] Fig.23 It is a schematic diagram of a partial cross-sectional structure of a radiator and water heater combination structure provided in the second embodiment of the present invention having a pad portion.

[0067] Fig.24 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a stamped boss in the combined structure of a radiator and a water heater provided in the second embodiment of the present invention.

[0068] Fig.25It shows a schematic diagram of the exploded structure of the thermal superconducting plate in the combined structure of the radiator and water heater provided in the third embodiment of the present invention.

[0069] Fig.26 It is a schematic diagram of a top view of the structure in which the guide plate in the thermal superconducting plate in the combined structure of the radiator and water heater provided in the third embodiment of the present invention is placed in an annular frame.

[0070] Fig. 27 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a reserved gap and a spacer in the combined structure of a radiator and a water heater provided in the fourth embodiment of the present invention.

[0071] Fig.28 It is a schematic diagram of a top view of the structure in which the guide plate in the thermal superconducting plate in the combined structure of the radiator and water heater provided in the fourth embodiment of the present invention is placed in an annular frame.

[0072] Fig.29 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a stamped boss in the combined structure of a radiator and a water heater provided in the fourth embodiment of the present invention.

[0073] Fig.30 Shown is a schematic diagram of the exploded structure of the thermal superconducting plate in the radiator and water heater combination structure provided in the fifth embodiment of the present invention.

[0074] Fig.31 It shows a schematic diagram of the exploded structure of the thermal superconducting plate with a reserved gap in the combined structure of the radiator and water heater provided in the sixth embodiment of the present invention.

[0075] Fig.32 It shows a schematic diagram of the exploded structure of the thermal superconducting plate in the combined structure of the radiator and water heater provided in the seventh embodiment of the present invention.

[0076] Fig.33 It is a schematic diagram of a top view of the structure in which the guide plate in the thermal superconducting plate in the radiator and water heater combination structure provided in the seventh embodiment of the present invention is located on the inner side of the annular convex edge of the second cover plate.

[0077] Fig.34 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a reserved gap and a spacer in the combined structure of a radiator and a water heater provided in the eighth embodiment of the present invention.

[0078] Fig.35 It is a schematic diagram of a top view of the structure in which the guide plate in the thermal superconducting plate in the radiator and water heater combination structure provided in the eighth embodiment of the present invention is located on the inner side of the annular convex edge of the second cover plate.

[0079] Fig.36It shows a schematic diagram of the exploded structure of the thermal superconducting plate with stamped bosses in the combined structure of the radiator and water heater provided in the eighth embodiment of the present invention. DETAILED DESCRIPTION

[0080] The following is a description of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0081] See also Figures 1 to 36 . It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content. Example

[0082] See also Figures 1 to 15 The present invention provides a heat sink and water heater combination structure, the heat sink and water heater combination structure comprising: a thermal superconducting plate 10, wherein the thermal superconducting plate 10 is formed with mutually connected sealed channels 106, wherein the sealed channels 106 are filled with a heat transfer medium 1061; a heat source installation area 119 is provided on the surface of the thermal superconducting plate 10; a liquid cooling heat sink 30, wherein the night cooling heat sink 30 is located on the surface of the thermal superconducting plate 10 and outside the heat source installation area 119, wherein a liquid channel is formed in the liquid cooling heat sink 30, wherein the liquid cooling heat sink 30 is provided with a liquid inlet 3023 and a liquid outlet 3024 connected to the liquid channel; and a water heater body 60, wherein the water heater body 60 Water 602 to be heated is contained inside; the water heater body 60 is provided with a water inlet (not shown) and a water outlet 601 which are connected to the inside of the water heater body 60; a heat exchanger 701, the heat exchanger 701 is located inside the water heater body 60; a first circulation pipe 702, one end of the first circulation pipe 702 is connected to the liquid inlet 3023, and the other end is connected to the heat exchanger 701; a second circulation pipe 703, one end of the second circulation pipe 703 is connected to the liquid outlet 3024, and the other end is connected to the heat exchanger 701; a circulation pump 704, the circulation pump 704 is located on the first circulation pipe 702 or the second circulation pipe 703.

[0083] It should be noted that the thermal superconducting heat transfer technology includes a heat pipe technology that realizes thermal superconducting heat transfer by filling a working medium in a closed interconnected micro-channel system and realizing thermal superconducting heat transfer through the evaporation and condensation phase change of the working medium; and a phase change inhibition (PCI) heat transfer technology that realizes efficient heat transfer by controlling the microstructural state of the working medium in the closed system, that is, in the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and on this basis, the consistency of the microstructure of the working medium is achieved to achieve the consistency of the microstructure of the working medium. In this embodiment, the thermal superconducting plate can be a phase change inhibition heat sink. At this time, the boiling or condensation of the heat transfer working medium in the thermal superconducting plate is suppressed during the heat transfer process, and on this basis, the consistency of the microstructure of the working medium is achieved to achieve heat transfer. In this embodiment, the thermal superconducting plate can also be a heat pipe heat transfer plate. At this time, the heat transfer working medium in the thermal superconducting plate continuously performs a phase change cycle of evaporation heat absorption and condensation heat release during the heat transfer process to achieve rapid heat transfer.

[0084] As an example, the heat transfer medium 1061 is a fluid. Preferably, the heat transfer medium 1061 can be a gas or a liquid or a mixture of a gas and a liquid. More preferably, in this embodiment, the heat transfer medium 1061 is a mixture of a liquid and a gas.

[0085] As an example, combine Figure 1 Continue reading Figures 5 to 7 As shown, the liquid-cooled radiator 30 includes a first guide plate 301 and a liquid channel cover plate 302; a surface of the liquid channel cover plate 302 is formed with a receiving groove, and the surface of the liquid channel cover plate 302 formed with the receiving groove is attached to the surface of the thermal superconducting plate 10 to form a liquid channel chamber between the liquid channel cover plate 302 and the thermal superconducting plate 10; the first guide plate 301 is located in the liquid channel chamber and is fixed to the surface of the thermal superconducting plate 10 to form the liquid channel that is interconnected between the first guide plate 301 and the thermal superconducting plate 10 and the liquid channel cover plate 302; the liquid inlet 3023 and the liquid outlet 3024 are both located on the liquid channel cover plate 302; the liquid inlet 2034 is connected to a liquid inlet pipe 119, and the liquid outlet 3024 is connected to a liquid outlet pipe 120.

[0086] As an example, the receiving tank includes a first receiving tank 3021 and a second receiving tank 3022, and the first receiving tank 3021 and the second receiving tank 3022 both include a first end and a second end relative to each other; the number of the first guide plates 301 is two, one of the first guide plates 301 is located in the first receiving tank 3021, and the other of the first guide plates 301 is located in the second receiving tank 3022; the liquid inlet 3023 is located at the first end of the first receiving tank 3021 and is connected to the first receiving tank 3021, the liquid outlet 3024 is located at the first end of the second receiving tank 3022 and is connected to the second receiving tank 3022; the second end of the first receiving tank 3021 is connected to the second end of the second receiving tank 3022.

[0087] In one example, if Figure 5 and Figure 6 As shown, the first guide plate 301 includes: a plurality of first guide strips 3011 and a first connecting portion 3012, the first guide strips 3011 extending in a wave shape or a square wave shape along a direction perpendicular to the first end of the first receiving groove 3021 to the second end of the first receiving groove 3021, and a plurality of the first guide strips 3011 are arranged in parallel along a direction from the first end of the first receiving groove 3011 to the second end of the first receiving groove 3011; specifically, taking the direction from the first end of the first receiving groove 3021 to the first end of the first receiving groove 3021 as the length direction of the liquid channel cover plate 302 as an example, a plurality of the first guide strips 3011 extend in a wave shape or a square wave shape along the width direction of the liquid channel cover plate 302, and a plurality of the first guide strips 3011 are arranged in parallel along the length direction of the liquid channel cover plate 302; the first connecting portion 3012 is located at both ends of the first guide strips 3011, and is integrally connected to each of the first guide strips 3011.

[0088] In another example, if Figure 7 As shown, the first guide plate 301 includes a plurality of flat-plate-shaped first guide strips 3011, and the plurality of first guide strips 3011 are arranged in parallel and spaced apart in a direction perpendicular to the first end of the first receiving groove 3021 to the second end of the first receiving groove 3021; ​​specifically, taking the direction from the first end of the first receiving groove 3021 to the first end of the first receiving groove 3021 as the length direction of the liquid channel cover plate 302 as an example, the plurality of first guide strips 3011 extend along the length direction of the liquid channel cover plate 302, and are arranged in parallel and spaced apart in the width direction of the liquid channel cover plate 302.

[0089] As an example, Figure 8 and Fig. 9As shown, the thermal superconducting plate 10 comprises: an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one second guide plate 103, wherein the first cover plate 100 is attached to a surface of the annular frame 102, and the second cover plate 101 is attached to a surface of the annular frame 102 away from the first cover plate 100, so as to form a sealed chamber between the first cover plate 100 and the second cover plate 101; the second guide plate 103 is located in the sealed chamber; the second guide plate 10 3 comprises a plurality of convex portions 1031 arranged at intervals along a first direction and extending along a second direction, wherein the first direction is perpendicular to the second direction, the bottoms of the adjacent convex portions 1031 in the first direction are integrally connected, and there are gaps inside the convex portions 1031 and between the adjacent convex portions 1031, so that a sealing channel 106 communicating with each other is formed between the second guide plate 103 and the first cover plate 100 and the second cover plate 101; the sealing channel 106 is filled with a heat transfer medium 1061. It should be noted that, Fig.10 , Fig.12 and Fig.14 The direction indicated by the arrow a is the first direction, and the direction indicated by the arrow b is the second direction; the first direction can be the length direction of the second guide plate 103, in which case the second direction is the width direction of the second guide plate 103; the first direction can also be the width direction of the second guide plate 103, in which case the second direction is the length direction of the second guide plate 103.

[0090] It should be noted that since the inner side of the annular frame 102 is a hollow area, after the first cover plate 100 and the second cover plate 101 are placed on the upper and lower surfaces of the annular frame 102, a closed chamber will be formed inside the first cover plate 100, the second cover plate 101 and the annular frame 102.

[0091] Specifically, the bottoms of adjacent protrusions 1031 in the first direction are integrally connected, and there are gaps below the protrusions 1031 and between adjacent protrusions 1031, so that the second guide plates 103 can be arranged in convex and concave shapes with alternating intervals along their length direction.

[0092] As an example, Fig.16As shown, the thermal superconducting plate 10 also includes a first solder layer 104 and a second solder layer 105; wherein the first solder layer 104 is located between the first cover plate 100 and the annular frame 102 and the second guide plate 103, so as to weld the first cover plate 100, the annular frame 102 and the second guide plate 103 together; the second solder layer 105 is located between the second cover plate 101, the annular frame 102 and the second guide plate 103, so as to weld the second cover plate 101, the annular frame 102 and the second guide plate 103 together.

[0093] As an example, the height of the second guide plate 103 is the same as the height of the annular frame 102. Setting the height of the second guide plate 103 to be the same as the height of the annular frame 102 can ensure that the welding area of ​​the second guide plate 103 and the first solder layer 104 and the second solder layer 105 is maximized, thereby increasing the welding strength.

[0094] As an example, Figure 8 As shown, a filling hole 1021 penetrating the side wall is provided on one side of the annular frame 102. After the first cover plate 100, the second cover plate 101, the annular frame 102 and the second guide plate 103 are welded together, one end of a filling tube 114 is inserted into the filling hole 1021 to fill the sealing channel 106 with the heat transfer medium 1061. After the heat transfer medium 1061 is filled, the filling hole 1021 should be closed to make the sealing channel 106 sealed.

[0095] In one example, the second guide plate 103 may be, but is not limited to, formed by stamping a sheet of material. Figure 8 and Fig.10 As shown, the length of the second guide plate 103 is the same as the length of the inner side of the annular frame 102, and the width of the second guide plate 103 is the same as the width of the inner side of the annular frame 102; the side wall of the convex portion 1031 is provided with a plurality of guide holes 1032, and the guide holes 1032 penetrate the second guide plate 103 along the thickness direction of the second guide plate 103. Specifically, as Fig.10 and Fig.11As shown, along the first direction, the second guide plate 103 may extend in a square wave shape, that is, the second guide plate 103 includes a plurality of convex portions 1031 arranged at intervals along the first direction, and the bottoms of adjacent convex portions 1031 along the first direction are connected to each other, and there is a concave shape between adjacent convex portions 1031. Of course, in other examples, the second guide plate 103 may also extend in a wave shape along the first direction, but it is preferred that the second guide plate 103 extends in a square wave shape along the first direction, so that the upper surface (i.e., the top surface of the convex portion 1031) and the lower surface (i.e., the bottom surface of the concave portion between adjacent convex portions 1031) of the second guide plate 103 are both planar, so that the contact area between the second guide plate 103 and the first solder layer 104 and the second solder layer 105 is as large as possible, thereby improving the welding strength. After the first cover plate 100, the second cover plate 101, the annular frame 102 and the second guide plate 103 are welded together, the gap between the protrusion 1031 of the second guide plate 103 and the second solder layer 105, the gap between the recess between the protrusions 1031 and the first solder layer 104 and the guide holes 1032 together constitute the sealed channel 106. In this example, the protrusion 1031 penetrates the second guide plate 103 along the second direction, that is, the protrusion 1031 extends along the second direction to penetrate the second guide plate 103, that is, the length of the protrusion 1031 is the same as the second direction. Each of the protrusions 1031 is provided with a plurality of guide holes 1032, and the guide holes 1032 on each of the protrusions 1031 are arranged in a single row or multiple rows along the extension direction of the protrusion 1031, and the guide holes 1032 are provided on the side walls on both sides of each of the protrusions 1031. The guide holes 1032 on each of the protrusions 1031 can be as follows: Fig.10 The one-to-one correspondence shown can also be arranged in a staggered manner. Since there is a sufficient gap between the second guide plate 103 and the first solder layer 104 and the second solder layer 105 along the second direction, the heat transfer medium 1061 flows very smoothly along the second direction, while the heat transfer medium 1061 is blocked along the first direction (i.e., the direction in which the convex portions 1031 are arranged at intervals). By providing the guide holes 1032 on the convex portions 1031, the flow of the heat transfer medium 1061 along the first direction can be increased, thereby increasing the heat transfer effect along the first direction, so that the heat transfer medium 1061 has almost the same fluidity along the first direction and along the second direction, so that the entire thermal superconducting plate has the same heat dissipation effect in all directions, so that the temperature of each area of ​​the thermal superconducting plate 10 is the same, thereby effectively avoiding the occurrence of overheating of a local area of ​​the thermal superconducting plate 10 due to poor heat dissipation effect in one or more directions.

[0096] In another example, if Fig.12 and Fig.13 As shown, the second guide plate 103 includes: a plurality of second guide bars 1033 and a second connection portion 1034 arranged in parallel along the second direction, the second guide bar 1033 includes a plurality of protrusions 1031 arranged at intervals along the first direction; the second guide bars 1033 located on both sides are in contact with the inner side of the annular frame 102; the second connection portion 1034 is located at both ends of the second guide bar 1033, and is integrally connected with a plurality of second guide bars 1033; the side of the second connection portion 1034 away from the second guide bar 1033 is in contact with the inner side of the annular frame 102. In this example, the width of the second guide plate 103 is the same as the width of the inner side of the annular frame 102, and the length of the second guide plate 103 is the same as the length of the inner side of the annular frame 102. The second guide bar 1033 may extend in a square wave shape or a wave shape along the first direction (generally the length direction of the second guide bar 1033), that is, the second guide bar 1033 includes a plurality of convex portions 1031 arranged at intervals along the first direction, the bottoms of adjacent convex portions 1031 along the first direction are connected to each other, and there is a concave shape between adjacent convex portions 1031. Preferably, in this embodiment, the second guide bar 1033 extends in a square wave shape along the first direction, so that the upper surface and the lower surface of the second guide bar 1033 are both planes, that is, the upper surface (i.e. the top surface of the convex portion 1031) and the lower surface (i.e. the surface opposite to the top of the convex portion 1031) of the second guide plate 103 are both planes, so that the contact area between the second guide plate 103 and the first solder layer 104 and the second solder layer 105 is as large as possible, thereby improving the welding strength. After the first cover plate 100, the second cover plate 101, the annular frame 102 and the second guide plate 103 are welded together, the gap between the protrusion 1031 of the second guide bar 1033 and the second solder layer 105, the gap between the depression between the protrusions 1031 and the first solder layer 104, and the gap between adjacent second guide bars 1033 together constitute the sealing channel 106.

[0097] As an example, the convex portions 1031 on two adjacent rows of the second guide bars 1033 may be arranged in one-to-one correspondence, that is, along the second direction (that is, the direction in which the second guide bars 1033 are arranged), the convex portions 1031 on each of the second guide bars 1033 may be arranged in one-to-one correspondence. Of course, in other examples, the convex portions 1031 on two adjacent rows of the second guide bars 1033 may also be arranged in a staggered manner. The so-called staggered arrangement of the convex portions 1031 on two adjacent rows of the second guide bars 1033 means that the sides of the convex portions 1031 on two adjacent rows of the second guide bars 1033 are staggered, such as Fig.12 and Fig.13 As shown; the distance between the convex portions 1031 of two adjacent rows of the second guide strips 1033 may be smaller than the width of the convex portion 1031, as shown Fig.12 and Fig.13 As shown, the distance between the staggered convex portions 1031 of two adjacent rows of the second guide bars 1033 may also be equal to the width of the convex portions 1031. At this time, the convex portions 1031 of one row of the second guide bars 1033 are aligned with the concave portions between the convex portions 1031 of the adjacent row of the second guide bars 1033. It should be noted that when the convex portions 1031 on two adjacent rows of the second guide bars 1033 are staggered, the convex portions 1031 on the alternate rows of the second guide bars 1033 are arranged in a one-to-one correspondence, that is, the convex portions 1031 on the odd-numbered rows of the second guide bars 1033 are staggered with the convex portions 1031 on the even-numbered rows of the second guide bars 1033, and the convex portions 1031 on each odd-numbered row of the second guide bars 1033 are arranged in a one-to-one correspondence, and the convex portions 1031 on each even-numbered row of the second guide bars 1033 are also arranged in a one-to-one correspondence.

[0098] As an example, Fig.14 and Fig.15As shown, the side walls of the protrusions 1031 may be provided with guide holes 1032 , and the guide holes 1032 penetrate the second guide bar 1033 along the thickness direction of the second guide bar 1033 . Since there is a sufficient gap between the second guide bar 1033 and the first solder layer 104 and the second solder layer 105 along the second direction, the heat transfer medium 1061 flows very smoothly along the second direction, while the flow of the heat transfer medium 1061 along the first direction (i.e., the direction in which the second guide bar 1033 extends) is blocked. By providing the guide hole 1032 on the convex portion 1031, the flow of the heat transfer medium 1061 along the first direction can be increased, thereby increasing the heat transfer effect along the first direction, so that the heat transfer medium 1061 has almost the same fluidity along the first direction and along the second direction, so that the entire thermal superconducting plate 10 has the same heat dissipation effect in all directions, so that the temperature of each area of ​​the thermal superconducting plate 10 is the same, thereby effectively avoiding the occurrence of overheating of a local area of ​​the thermal superconducting plate 10 due to poor heat dissipation effect in one or more directions.

[0099] As an example, the side walls on both sides of each convex portion 1031 on each of the second guide bars 1033 are provided with the guide holes 1032. Along the extending direction of the second guide bars 1033, the guide holes 1032 on each of the convex portions 1031 can be as follows: Fig.14 The one-to-one correspondence shown can also be arranged in a staggered manner.

[0100] As an example, see Figures 1 to 4, the radiator and water heater combination structure also includes: a first heat dissipation fin 20, the first heat dissipation fin 20 is located on at least one surface of the thermal superconducting plate 10 and is located outside the heat source installation area 119, and a plurality of first heat dissipation channels 201 arranged in parallel and spaced apart are formed in the first heat dissipation fin 20; a second heat dissipation fin 50, the second heat dissipation fin 50 is located on the surface of the liquid-cooled radiator 30 away from the thermal superconducting plate 10; a plurality of second heat dissipation channels 501 arranged in parallel and spaced apart are formed in the second heat dissipation fin 50, and the second heat dissipation channels 501 are parallel to the first heat dissipation channels 201; a partition 403, the partition 403 is sleeved on the thermal superconducting plate 10 to divide the thermal superconducting plate 10 into a first part 117 and a second part 118; wherein the first part 117 is located above the partition 403, and the second part 118 is located below the partition 403; the first heat dissipation fin 20 is located on the surface of the first part 117, and the first heat dissipation fin 20 can be only located On the surface of the first part 117, or respectively on two opposite surfaces of the first part 117, in this case, the first heat dissipation fin 20 located on one surface of the thermal superconducting plate 10 can be located on the surface of the first part 117 and the surface of the second part 118 at the same time; the liquid cooling radiator 30 is located on the surface of the first part 117; the heat source installation area 119 is located on the surface of the second part 118; the power device 404, the power device 404 is located on the surface of the thermal superconducting plate 10, and is located in the heat source installation area 119; the sealed box 405, an opening is formed on one side of the sealed box 405, and the sealed box 405 is placed on the periphery of the power device 404 and the second part 117 through the opening; the width of the opening is less than or equal to the width of the partition 403, and the length of the opening is less than or equal to the length of the partition 403. Preferably, in this embodiment, the width of the opening is greater than the width of the partition 403, and the length of the opening is equal to the length of the partition 403. It should be noted that, Figure 3 For the sake of convenience in display, the sealed box 405 is not placed around the power device 404 and the second portion 118 , but is deliberately moved to the bottom of the second portion 118 .

[0101] In one example, the first heat dissipation fins 20 may be wavy in the horizontal direction (eg Fig.17 ), or it can extend in a square wave shape in the horizontal direction (as shown in Fig.18 The first heat dissipation fins 20 extend in a wavy or square wave shape in the horizontal direction, which can maximize the surface area of ​​the first heat dissipation fins 20 within a limited space, thereby increasing the heat dissipation effect.

[0102] In another example, the first heat dissipation fins 20 may also extend in a wave shape or a square wave shape along the vertical direction, wherein: Fig.19 Taking the first heat dissipation fins 20 extending in a wave shape along the vertical direction as an example, the first heat dissipation fins 20 extending in a wave shape or a square wave shape along the vertical direction can further increase the surface area of ​​the first heat dissipation fins 20 .

[0103] In another example, the first heat dissipation fins 20 may further include a plurality of flat plate fins, or may include a plurality of L-shaped fins 202, wherein the plurality of flat plate fins or the L-shaped fins 202 are arranged in parallel and spaced apart in the horizontal direction, such as Fig. 20 It should be noted that, at this time, the first heat dissipation fin 20 also includes a plurality of reinforcing bars 203, and the reinforcing bars 203 extend along the arrangement direction of the flat fins or the L-shaped fins 202 to connect and fix the flat fins or L-shaped fins 202 in series to increase their mechanical strength.

[0104] In another example, the first heat dissipation fin 20 may further include a plurality of heat dissipation bars 204 arranged in parallel and spaced apart, and the ends of each of the heat dissipation bars 204 are integrally connected, such as Fig.21 shown.

[0105] As an example, Fig.16 As shown, the first heat dissipation fin 20 can be fixed to two opposite surfaces of the thermal superconducting plate 10 by welding via the third solder layer 115 and the solder layer 116. Of course, in other examples, the first heat dissipation fin 20 can also be located only on one surface of the thermal superconducting plate 10.

[0106] As an example, the specific structure of the second heat dissipation fins 50 may be completely the same as the specific structure of the first heat dissipation fins 20 , and will not be described again here.

[0107] As an example, the radiator and water heater combination structure further includes: a shell 402 and at least one fan 401, the shell 402 is placed on the top and outside of the thermal superconducting plate 10, the liquid cooling radiator 30, the first heat dissipation fin 20 and the second heat dissipation fin 50 to form an air duct between the thermal superconducting plate 10 and the shell 402; the fan 401 is located at one end of the first heat dissipation fin 20 and outside the shell 402, the air outlet surface of the fan 401 faces the first heat dissipation fin 20 and is perpendicular to the extension direction of the first heat dissipation channel 201. It should be noted that the bottom of the shell 402 and the two end surfaces of the shell 402 perpendicular to the first heat dissipation channel 201 are both open to ensure that the shell 402 can be placed on the top and outside of the thermal superconducting plate 10 and the first heat dissipation fin 20, and to ensure that the shell 402 will not affect the forced air cooling and heat dissipation of the radiator and water heater combination structure.

[0108] As an example, the number of fans 401 can be set according to actual needs. Figures 1 to 3 The number of the fans 401 is two as an example, but is not limited thereto in actual examples.

[0109] In one example, if Figure 1 and Figure 4 As shown, the heat source installation area 117 is provided on two opposite surfaces of the thermal superconducting plate 10 , the power device 404 is located on two opposite sides of the thermal superconducting plate 10 ; and the heat dissipation fins 20 are located on two opposite sides of the thermal superconducting plate 10 .

[0110] In another example, if Figure 2 and Figure 3 As shown, a surface of the thermal superconducting plate 10 is provided with the heat source installation area 117 , the power device 404 is located on one side of the thermal superconducting plate 10 ; and the heat dissipation fins 20 are located on two opposite sides of the thermal superconducting plate 10 .

[0111] As an example, see Figure 1 and Figure 2, the radiator and water heater combination structure also includes an electric heating system, and the electric heating system includes: a heating device 801 and an electrical connection line 802, wherein the heating device 801 is located in the water heater body 60; one end of the electrical connection line 802 is connected to the heating device 801. The other end of the electrical connection line 802 is electrically connected to a power source, and after the electrical connection line 802 electrically connects the heating device 801 to the power source, the heating device 801 heats the water 602 in the water heater body 60. The heating device 802 may include but is not limited to thermocouples and the like. By setting up the electric heating system, the two heating systems of the heat exchanger 701 and the electric heating system can be used to heat the cold water in the water heater body 60. When one of them fails, the other can replace it, which has high reliability. It should be noted that Figure 2 The electric heating device 801 is not shown.

[0112] As an example, see Figure 1 and Figure 2 The radiator and water heater combination structure also includes a temperature measuring probe 803, one end of which is inserted into the water heater body 60 to detect the temperature of the water 602 in the water heater body 60 in real time.

[0113] In one example, the circulating liquid of the liquid cooling radiator 30 for dissipating the heat transferred by the thermal superconducting plate 10 can be enclosed in the first circulation pipe 702, the heat exchanger 701 and the second circulation pipe 703. Driven by the circulation pump 704, the circulating liquid circulates to achieve heat exchange. Figure 1 shown.

[0114] In another example, the radiator and water heater combination structure further includes a circulating liquid tank 705, in which a circulating liquid 706 is contained; the end of the first circulating pipeline 702 away from the liquid inlet 3023 is connected to the heat exchanger 701 via the circulating liquid tank 705, that is, one end of the first circulating pipeline 702 is connected to the liquid inlet 3023, and the other end is connected to the circulating liquid tank 705. At this time, the circulating liquid 706 in the circulating liquid tank 705 will circulate among the first circulating pipeline 702, the liquid channel, the second circulating pipeline 703, the heat exchanger 701 and the circulating liquid tank 705 under the drive of the circulating pump 704 to achieve heat dissipation and heat exchange.

[0115] The working principle of the combined structure of the heat sink and water heater of the present invention is as follows: when the power device 404 is working, the thermal superconducting plate 10 is locally heated, and the heat is quickly transferred to the entire thermal superconducting plate 10 via the heat transfer medium 1061, and then transferred to the first heat dissipating fins 20 by heat conduction, and also transferred to the liquid-cooled heat sink 30; when the temperature of the water 602 in the water heater body 60 is low, the circulating pump 704 works, driving the circulating liquid 706 to enter the liquid-cooled heat sink 30 via the liquid inlet 3023, and flows through the The first guide plate 301 takes away the heat and heats it up. The heated circulating liquid 706 flows out through the liquid outlet 3024 and enters the heat exchanger 701 in the water heater body 60 for heat exchange to heat the water in the water heater body 60. The water temperature in the water heater body 60 increases, and the temperature of the circulating liquid 706 decreases, and then continues to circulate through the first circulation pipeline 702 and the first circulation pipeline 703. In this way, the heat generated by the power device 404 can be used to heat the cold water in the water heater body 60. When the temperature of the water in the water heater body 60 reaches a predetermined temperature, the circulation pump 704 stops working, and at the same time, the fan 401 starts, and the cold air flows through the surface of the first heat dissipation fin 20 and the surface of the second heat dissipation fin 50 driven by the fan 401, that is, the cold air flows through the first heat dissipation channel 201 in the first heat dissipation fin 20 and the second heat dissipation channel 501 in the second radiator 50, and the heat is taken away by convection, and the hot air dissipates the heat to the surrounding environment. The hot air can be blown into the room in winter for indoor heating, and is directly discharged to the outside in summer. Example

[0116] Please combine Figures 1 to 21 See also Figure 22 to Figure 24 This embodiment also provides a heat sink and water heater combination structure. The structure of the heat sink and water heater combination structure described in this embodiment is substantially the same as that of the heat sink and water heater combination structure described in Embodiment 1. The difference between the two is that the specific structure of the thermal superconducting plate 10 is different: the thermal superconducting plate 10 described in this embodiment is provided with at least one reserved gap 1035 in the second guide plate 103 compared with the thermal superconducting plate 10 described in Embodiment 1. At the same time, the thermal superconducting plate 10 also includes at least one pad 109 or at least one stamping boss 113 is provided on the first cover plate 100 or the second cover plate 101. The other structures of the thermal superconducting plate 10 described in this embodiment are exactly the same as those of the thermal superconducting plate 10 described in Embodiment 1. Please refer to Embodiment 1 for details, and no further description is given here.

[0117] In one example, if Fig. 22 and Fig.23As shown, the second guide plate 103 in the thermal superconducting plate 10 is provided with a plurality of reserved gaps 1035, wherein: Fig. 22 Taking the second guide plate 103 having four reserved gaps 1035 as an example, in the actual example, the number of the reserved gaps 1035 is not limited thereto; the thermal superconducting plate 10 further includes a plurality of pads 109, the number of the pads 109 is the same as the number of the reserved gaps 1035, and the pads 109 are arranged in each of the reserved gaps 1035 in a one-to-one correspondence; the height of the pads 109 is the same as the height of the second guide plate 103, and each of the pads 109 is provided with a first mounting through hole 110 that penetrates along its height direction; the first cover plate 100 The second cover plate 101 is also provided with a plurality of second mounting through holes 111 penetrating along the thickness direction of the first cover plate 100, the number of the second mounting through holes 111 is the same as the number of the first mounting through holes 110, and the second mounting through holes 111 are arranged one-to-one with the first mounting through holes 110; the second cover plate 101 is also provided with a plurality of third mounting through holes 112 penetrating along the thickness direction of the second cover plate 101, the number of the third mounting through holes 112 is the same as the number of the first mounting through holes 110, and the third mounting through holes 112 are arranged one-to-one with the first mounting through holes 110. It should be noted that, in order to facilitate the illustration of the reserved gap 1035, Fig. 22 The pad 109 is not shown in the figure. Meanwhile, for the convenience of display, Fig. 22 The first solder layer 104 and the second solder layer 105 are not shown in the figure. Since the surface of the thermal superconducting plate 10 needs to be installed with a fixed heat generating power device, and the sealed channel 106 in the thermal superconducting plate 10 is a sealed pipeline, it is not possible to directly drill a mounting hole at the location of the thermal superconducting plate 10 corresponding to the sealed channel 106 to prevent the heat transfer medium 1061 in the sealed channel 106 from leaking; the present invention reserves the reserved gap 1035 in the second guide plate 103, and sets the cushion block 109 with the same height as the second guide plate 103 in the reserved gap 1035, The first mounting through hole 110 is formed in the block 109, so after the second mounting through hole 111 is formed on the first cover plate 100 and the third mounting through hole 112 is formed on the second cover plate 101, the power device 404 can be fixed to the thermal superconducting plate 10 by using the first mounting through hole 110, the second mounting through hole 111 and the third mounting through hole 112 with the help of fixing devices such as bolts, and at the same time, it can be ensured that the sealing channel 106 is in a sealed state and the heat transfer medium 1061 will not leak.

[0118] In another example, if Fig.24As shown, a plurality of the reserved gaps 1035 are provided in the second guide plate 103 of the thermal superconducting plate 10, wherein: Fig.24 In the example, four reserved gaps 1035 are provided in the second guide plate 103. In the actual example, the number of the reserved gaps 1035 is not limited thereto; a plurality of stamping bosses 113 are provided on the first cover plate 100 or the second cover plate 101, wherein: Fig.24 In the figure, the second cover plate 101 is provided with a plurality of stamping bosses 113 as an example; the stamping bosses 113 are protruded from the inner surface of the first cover plate 100 or the second cover plate 101 into the reserved gap 1035, the height of the stamping boss 113 is the same as the height of the second guide plate 103, the number of the stamping bosses 113 is the same as the number of the reserved gaps 1035, and they are arranged one-to-one with the reserved gaps 1035, and a first mounting through hole 110 is provided in the stamping boss 113 that passes through along its height direction, and the second cover plate 101 or the first cover plate 100 is also provided with a plurality of second mounting through holes 111 that pass through along its thickness direction, the number of the second mounting through holes 111 is the same as the number of the first mounting through holes 110, and they are arranged one-to-one with the first mounting through holes 110. It should be noted that if the stamping boss 113 is disposed on the second cover plate 101, the second mounting through hole 111 is located on the first cover plate 100. Fig.24 If the stamping boss 113 is disposed on the first cover plate 100, the second mounting through hole 111 is located on the second cover plate 101. It should be further explained that, for the convenience of display, Fig.24 The first solder layer 104 and the second solder layer 105 are not shown in the figure. The present invention reserves the reserved gap 1035 in the second guide plate 103, and sets a plurality of stamping bosses 113 protruding in the reserved gap 1035 and having the same height as the second guide plate 103 on the first cover plate 100 or the second cover plate 12, and sets the first mounting through hole 110 in the stamping boss 113. In this way, after the second mounting through hole 111 is set on the second cover plate 101 or the first cover plate 100, the power device can be fixed to the thermal superconducting plate by using the first mounting through hole 110 and the second mounting through hole 111 with the help of fixing devices such as bolts, and at the same time, it can ensure that the sealing channel 106 is in a sealed state, and the heat transfer medium 1061 will not leak.

[0119] It should be noted that Figure 22 to Figure 24 In the embodiment, the second guide plate 103 is as in the embodiment 1 Fig.10 and Fig.11The second guide plate 103 shown in the figure is provided with a whole second guide plate after the reserved gap 1035. Of course, in other examples, the second guide plate 103 can also be as shown in the first embodiment. Figures 12 to 15 The second guide plate 103 shown is provided with the second guide plate after the reserved gap 1035 . Example

[0120] Please combine Figures 1 to 21 See also Figure 25 to Figure 26The present embodiment further provides a radiator and water heater combination structure. The structure of the radiator and water heater combination structure described in the present embodiment is substantially the same as that of the radiator and water heater combination structure described in the first embodiment. The difference between the two is that the structure of the thermal superconducting plate 10 is different: the number of the second guide plate 103 described in the thermal superconducting plate 10 described in the first embodiment is one, while the number of the second guide plates 103 described in the present embodiment is at least two, and there is a gap between adjacent second guide plates 103 to form the first balance channel 107 of the heat transfer medium 1061 between adjacent second guide plates 103. The first balance channel 107 extends along the first direction, that is, the extension direction of the first balance channel 107 is parallel to the first direction; the second guide plate 103 adjacent to the annular frame 102 has a gap with the annular frame 102, so as to form a second balance channel 108 of the heat transfer medium 1061 between the second guide plate 103 and the annular frame 102, and the second balance channel 108 extends along the first direction, that is, the extension direction of the second balance channel 108 is parallel to the end face of the convex portion 31; the height of the second guide plate 103 is the same as the height of the annular frame 102. The other structures of the thermal superconducting plate 10 described in this embodiment are exactly the same as the other structures of the thermal superconducting plate 10 described in the first embodiment. Please refer to the first embodiment for details, and no further description is given here. The first balance channel 107 can be used as a gas-liquid balance channel to enhance the flow of the heat transfer medium 1061 in a gas state, the heat transfer medium 1061 in a liquid state, or the heat transfer medium 1061 in a gas-liquid mixed state along the length direction of the second guide plate 103; the second balance channel 108 can be used as a liquid balance channel to enhance the flow of the heat transfer medium 1061 in a liquid state along the first direction. Since the second direction is the main channel direction in the thermal superconducting plate 10, and the flow resistance of the heat transfer medium 1061 along the first direction is large and the fluidity is poor, by adding the first balance channel 107 and the second balance channel 108, the fluidity of the heat transfer medium 1061 along the first direction can be enhanced, so that the entire thermal superconducting plate 10 has the same heat dissipation effect in all directions, so that the temperature of each area of ​​the thermal superconducting plate 10 is the same, thereby effectively avoiding the occurrence of overheating of a local area of ​​the thermal superconducting plate 10 due to poor heat dissipation in one or more directions. Example

[0121] Please combine Figures 1 to 24 See also Figure 27 to Figure 29The present embodiment further provides a radiator and water heater combination structure. The structure of the radiator and water heater combination structure described in the present embodiment is substantially the same as that of the radiator and water heater combination structure described in the second embodiment. The difference between the two is that the structure of the thermal superconducting plate 10 is different: the number of the second guide plate 103 described in the thermal superconducting plate 10 described in the second embodiment is one, while the number of the second guide plates 103 described in the present embodiment is at least two, and there is a gap between adjacent second guide plates 103 to form the first balance channel 107 of the heat transfer medium 1061 between adjacent second guide plates 103. The first balance channel 107 extends along the first direction, that is, the extension direction of the first balance channel 107 is parallel to the first direction; the second guide plate 103 adjacent to the annular frame 102 has a gap with the annular frame 102, so as to form a second balance channel 108 of the heat transfer medium 1061 between the second guide plate 103 and the annular frame 102, and the second balance channel 108 extends along the first direction, that is, the extension direction of the second balance channel 108 is parallel to the end face of the convex portion 31; the height of the second guide plate 103 is the same as the height of the annular frame 102. The other structures of the thermal superconducting plate 10 described in this embodiment are exactly the same as the other structures of the thermal superconducting plate 10 described in the second embodiment. Please refer to the second embodiment for details, and no further description is given here. The first balance channel 107 can be used as a gas-liquid balance channel to enhance the flow of the heat transfer medium 1061 in a gas state, the heat transfer medium 1061 in a liquid state, or the heat transfer medium 1061 in a gas-liquid mixed state along the length direction of the second guide plate 103; the second balance channel 108 can be used as a liquid balance channel to enhance the flow of the heat transfer medium 1061 in a liquid state along the first direction. Since the second direction is the main channel direction in the thermal superconducting plate 10, and the flow resistance of the heat transfer medium 1061 along the first direction is large and the fluidity is poor, by adding the first balance channel 107 and the second balance channel 108, the fluidity of the heat transfer medium 1061 along the first direction can be enhanced, so that the entire thermal superconducting plate 10 has the same heat dissipation effect in all directions, so that the temperature of each area of ​​the thermal superconducting plate 10 is the same, thereby effectively avoiding the occurrence of overheating of a local area of ​​the thermal superconducting plate 10 due to poor heat dissipation in one or more directions.

[0122] It should be noted that Fig. 27 and Fig.28 It is a schematic diagram showing the structure of a thermal superconducting plate 10 with a reserved gap 1035 and a spacer 109 in a combined structure of a radiator and a water heater. Fig.29 It is a schematic structural diagram of a thermal superconducting plate 10 with a stamped boss 113 in a combined structure of a radiator and a water heater.

[0123] It should be further explained that the reserved gap 1035 formed in the second guide plate 103 in this embodiment is located in the second guide plate 103 that is most adjacent to the second balancing channel 108. Figure 27 to Figure 29 As shown. Among them, Figure 27 to Figure 29 The second guide plate 103 is used as the Fig.12 and Fig.13 The second guide plate 103 shown in the figure is provided with the reserved gap 1035, and includes a plurality of second guide strips 1033 and a second connecting portion 1034. The number of the second guide plates 103 is two, and the second guide plate 103 also includes the cushion block 109 as an example; of course, in other examples, the second guide plate 103 can also be as in the first embodiment. Fig.10 and Fig.11 or Fig.14 and Fig.15 The second guide plate 103 shown is provided with the reserved gap 1035. When the second guide plate 103 does not include the cushion block 109, the first cover plate 11 or the second cover plate 21 may also be provided with the stamping protrusion 113. The number of the second guide plates 103 may be set according to actual needs and is not limited to two.

[0124] It should be further explained that the arrangement of the reserved gaps 1035 can be arranged according to actual needs. For example, a plurality of the reserved gaps 1035 shown can be arranged as follows: Figure 27 to Figure 29 The arrangement shown in FIG. 1 is in a straight line, and the arrangement can also be as shown in Example 2. Fig. 22 and Fig.24 The shown arrangement is in an array. Example

[0125] Please combine Figures 1 to 21 See also Fig.30The present invention also provides a radiator and water heater combination structure. The specific structure of the radiator and water heater combination structure described in this embodiment is roughly the same as the specific structure of the radiator and water heater combination structure described in Example 1. The difference between the two lies in the specific structure of the thermal superconducting plate 10: In Example 1, the thermal superconducting plate 10 includes: an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one second guide plate 103, wherein the first cover plate 100 is attached to a surface of the annular frame 102, and the second cover plate 101 is attached to a surface of the annular frame 102 away from the first cover plate 100, so as to form a sealed chamber between the first cover plate 100 and the second cover plate 101. In this embodiment, the thermal superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a second guide plate 103; the second cover plate 101 includes a cover plate body 1011 and an annular flange 1012, and the annular flange 1012 is integrally connected to the cover plate body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

[0126] It should be noted that, in this embodiment, the first cover plate 100 may include a cover plate body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the first embodiment; in this case, the second cover plate 101 is placed on the annular convex edge.

[0127] The specific structure of the second guide plate 103 in the thermal superconducting plate 10 described in this embodiment is completely the same as the specific structure of the second guide plate 103 in the thermal superconducting plate 10 described in the first embodiment, and will not be described here. Similarly, the other structures of the radiator and water heater combination structure described in this embodiment, except for the thermal superconducting plate 10, are completely the same as the corresponding structures in the radiator and water heater combination structure described in the first embodiment, and will not be described here.

[0128] In this embodiment, the second cover plate 101 can be formed into the cover plate body 1011 and the annular flange 1012 by a stamping process, without the need for an additional annular frame, thereby reducing the weight of the thermal superconducting plate 10 and reducing the cost. Example

[0129] Please combine Figures 1 to 24 See also Fig.31The present invention further provides a radiator and water heater combination structure. The specific structure of the radiator and water heater combination structure described in this embodiment is roughly the same as the specific structure of the radiator and water heater combination structure described in Example 2. The difference between the two lies in the specific structure of the thermal superconducting plate 10: In Example 2, the thermal superconducting plate 10 includes: an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one second guide plate 103, wherein the first cover plate 100 is attached to a surface of the annular frame 102, and the second cover plate 101 is attached to a surface of the annular frame 102 away from the first cover plate 100, so as to form a sealed chamber between the first cover plate 100 and the second cover plate 101. In this embodiment, the thermal superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a second guide plate 103; the second cover plate 101 includes a cover plate body 1011 and an annular flange 1012, and the annular flange 1012 is integrally connected to the cover plate body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

[0130] It should be noted that, in this embodiment, the first cover plate 100 may include a cover plate body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the second embodiment; in this case, the second cover plate 101 is placed on the annular convex edge.

[0131] The specific structure of the second guide plate 103 in the thermal superconducting plate 10 described in this embodiment is completely the same as the specific structure of the second guide plate 103 in the thermal superconducting plate 10 described in the second embodiment, and will not be described here. Similarly, the other structures of the radiator and water heater combination structure described in this embodiment, except for the thermal superconducting plate 10, are completely the same as the corresponding structures in the radiator and water heater combination structure described in the second embodiment, and will not be described here.

[0132] In this embodiment, the second cover plate 101 can be formed into the cover plate body 1011 and the annular flange 1012 by a stamping process, without the need for an additional annular frame, thereby reducing the weight of the thermal superconducting plate 10 and reducing the cost. Example

[0133] Please combine Figures 1 to 26 See also Figure 32 to Figure 33The present invention also provides a radiator and water heater combination structure. The specific structure of the radiator and water heater combination structure described in this embodiment is roughly the same as the specific structure of the radiator and water heater combination structure described in Example 3. The difference between the two lies in the specific structure of the thermal superconducting plate 10: In Example 3, the thermal superconducting plate 10 includes: an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one second guide plate 103, wherein the first cover plate 100 is attached to a surface of the annular frame 102, and the second cover plate 101 is attached to a surface of the annular frame 102 away from the first cover plate 100, so as to form a sealed chamber between the first cover plate 100 and the second cover plate 101. In this embodiment, the thermal superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a second guide plate 103; the second cover plate 101 includes a cover plate body 1011 and an annular flange 1012, and the annular flange 1012 is integrally connected to the cover plate body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

[0134] It should be noted that, in this embodiment, the first cover plate 100 may include a cover plate body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the third embodiment; in this case, the second cover plate 101 is placed on the annular convex edge.

[0135] The specific structure of the second guide plate 103 in the thermal superconducting plate 10 described in this embodiment is completely the same as the specific structure of the second guide plate 103 in the thermal superconducting plate 10 described in the third embodiment, and will not be described here. Similarly, the other structures of the radiator and water heater combination structure described in this embodiment, except for the thermal superconducting plate 10, are completely the same as the corresponding structures in the radiator and water heater combination structure described in the third embodiment, and will not be described here.

[0136] In this embodiment, the second cover plate 101 can be formed into the cover plate body 1011 and the annular flange 1012 by a stamping process, without the need for an additional annular frame, thereby reducing the weight of the thermal superconducting plate 10 and reducing the cost. Example

[0137] Please combine Figures 1 to 29 See also Figure 34 to Figure 36The present invention also provides a radiator and water heater combination structure. The specific structure of the radiator and water heater combination structure described in this embodiment is roughly the same as the specific structure of the radiator and water heater combination structure described in Example 4. The difference between the two lies in the specific structure of the thermal superconducting plate 10: In Example 4, the thermal superconducting plate 10 includes: an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one second guide plate 103, wherein the first cover plate 100 is attached to a surface of the annular frame 102, and the second cover plate 101 is attached to a surface of the annular frame 102 away from the first cover plate 100, so as to form a sealed chamber between the first cover plate 100 and the second cover plate 101. In this embodiment, the thermal superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a second guide plate 103; the second cover plate 101 includes a cover plate body 1011 and an annular flange 1012, and the annular flange 1012 is integrally connected to the cover plate body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

[0138] It should be noted that, in this embodiment, the first cover plate 100 may include a cover plate body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in Embodiment 4; in this case, the second cover plate 101 is placed on the annular convex edge.

[0139] The specific structure of the second guide plate 103 in the thermal superconducting plate 10 described in this embodiment is completely the same as the specific structure of the second guide plate 103 in the thermal superconducting plate 10 described in the fourth embodiment, and will not be repeated here. Similarly, the other structures of the radiator and water heater combination structure described in this embodiment, except for the thermal superconducting plate 10, are completely the same as the corresponding structures in the radiator and water heater combination structure described in the fourth embodiment, and will not be repeated here.

[0140] In this embodiment, the second cover plate 101 can be formed into the cover plate body 1011 and the annular flange 1012 by a stamping process, without the need for an additional annular frame, thereby reducing the weight of the thermal superconducting plate 10 and reducing the cost.

[0141] In summary, the present invention provides a radiator and water heater combination structure, the radiator and water heater combination structure comprising: a thermal superconducting plate, wherein the thermal superconducting plate is formed with mutually connected sealed channels, wherein the sealed channels are filled with a heat transfer medium; a heat source installation area is provided on the surface of the thermal superconducting plate; a liquid cooling radiator is located on the surface of the thermal superconducting plate and outside the heat source installation area, wherein a liquid channel is formed in the liquid cooling radiator, wherein a liquid inlet and a liquid outlet connected to the liquid channel are provided on the liquid cooling radiator; a water heater body, wherein water to be heated is contained; the water heater body is provided with a water inlet and a water outlet connected to the inside of the water heater body; a heat exchanger is located in the water heater body; a first circulation pipe, wherein one end is connected to the liquid inlet, and the other end is connected to the heat exchanger; a second circulation pipe, wherein one end is connected to the liquid outlet, and the other end is connected to the heat exchanger; a circulation pump is located on the first circulation pipeline or the second circulation pipeline. The radiator and water heater combination structure of the present invention has the following beneficial effects: 1. By attaching the power device to the surface of the thermal superconducting plate, and arranging a liquid cooling radiator connected to the circulating liquid tank through a circulation pipe on the surface of the thermal superconducting plate, and the circulation pipe part is located in the water heater body, when the power device works normally, the thermal superconducting plate and the liquid cooling radiator can reasonably utilize the heat generated by the power device, which can be used to heat the cold water in the water heater body to generate hot water for domestic use or heating, saving energy consumption and improving the quality of life; 3. Liquid The cold radiator is provided with a first guide plate. In addition to enhancing liquid disturbance and increasing heat exchange area, thereby improving heat dissipation capacity, the guide plate also acts as a reinforcing rib, which can reduce the thickness of the liquid cooling cover plate, thereby reducing the overall weight of the radiator; 4. The sealed cavity inside the thermal superconducting plate is filled with a heat transfer medium, which relies on phase change of the heat transfer medium to transfer heat or phase change to inhibit heat transfer, forming a thermal superconducting characteristic of rapid heat conduction. The equivalent thermal conductivity can reach more than 4000W / m℃, making the temperature of the entire thermal superconducting plate uniform, reducing the temperature difference between each power device and the maximum temperature of the radiator; 5. By setting a fan, two forced cooling methods, water cooling and air cooling, can be used to cool the power device. The thermal superconducting plate has fast heat conduction and uniform temperature. Under the same heat dissipation conditions, the entire structure is small in size and light in weight. It can achieve high heat exchange at very low wind speeds, achieving the purpose of low noise or silence. At the same time, two cooling systems, air cooling and liquid cooling, are used. When the cold water in the water heater body is heated to a predetermined temperature, the circulation pump stops working and the liquid cooling radiator stops cooling. At this time, the fan is started, and the heat dissipation mode of the power device is naturally switched from water cooling to air cooling mode, which has higher reliability. 6.The thermal superconducting plate is welded with heat dissipating fins, which can quickly take away the heat conducted by the thermal superconducting plate through the air and dissipate it. The heat dissipating fins not only increase the heat exchange area with the air, reduce the thermal resistance of the system, and improve the heat dissipation capacity, but also play the role of strengthening the thermal superconducting plate, so as to reduce the material thickness of the thermal superconducting plate, improve the strength, reduce the weight, and reduce the cost; the double-sided welding heat dissipating fins are adopted to avoid the defects of the traditional profile heat sink due to the excessive height of the heat dissipating fins and the low heat dissipation efficiency of the heat dissipating fins, and improve the heat dissipation efficiency of the heat dissipating fins; 7. The power devices are arranged on the two opposite surfaces of the thermal superconducting plate, which has a compact structure, small size, and good heat dissipation effect; 8. A partition is set on the thermal superconducting plate, which divides the thermal superconducting plate into the upper and lower first and second parts. The power device is set on the surface of the second part located at the bottom, and the second part is sealed by setting a sealed box to achieve full closure of the power device, thereby improving the protection level and reliability; 9. The interior of the thermal superconducting plate is a sealed cavity, and a second guide plate is set. The internal second guide plate welds the first cover plate and the second cover plate together, which plays a reinforcing role, and the thickness of the cover plates on both sides is thinned, the pressure bearing capacity is increased, the strength is improved, the weight and thickness of the thermal superconducting plate are reduced, and the internal heat exchange area is increased, and the thermal superconducting heat conductivity is enhanced; 10. By setting an electric heating system, the two heating systems of the heat exchanger and the electric heating system can be used to heat the cold water in the water heater body. When one of them fails, the other can replace it, which has high reliability. .

[0142] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A radiator and water heater combination structure, characterized in that: The radiator and water heater combined structure comprises: A thermal superconducting plate, wherein the thermal superconducting plate has mutually communicating sealed channels formed therein, wherein the sealed channels are filled with a heat transfer medium; and a heat source installation area is provided on the surface of the thermal superconducting plate; a liquid cooling radiator, located on the surface of the thermal superconducting plate and outside the heat source installation area, wherein a liquid channel is formed in the liquid cooling radiator, and a liquid inlet and a liquid outlet connected to the liquid channel are provided on the liquid cooling radiator; The water heater body contains water to be heated; the water heater body is provided with a water inlet and a water outlet connected to the interior of the water heater body; a heat exchanger, located in the water heater body; A first circulation pipe, one end of which is connected to the liquid inlet, and the other end of which is connected to the heat exchanger; a second circulation pipe, one end of which is connected to the liquid outlet, and the other end of which is connected to the heat exchanger; a circulation pump, located on the first circulation pipe or the second circulation pipe; The liquid cooling radiator comprises a first guide plate and a liquid channel cover plate; a receiving groove is formed on one surface of the liquid channel cover plate, and the surface of the liquid channel cover plate formed with the receiving groove is attached to the surface of the thermal superconducting plate to form a liquid channel chamber between the liquid channel cover plate and the thermal superconducting plate; the first guide plate is located in the liquid channel chamber and is fixed to the surface of the thermal superconducting plate to form the liquid channel interconnected with the first guide plate, the thermal superconducting plate and the liquid channel cover plate; the liquid inlet and the liquid outlet are both located on the liquid channel cover plate; The thermal superconducting plate includes: an annular frame, a first cover plate, a second cover plate and at least one second guide plate; wherein, the first cover plate is attached to a surface of the annular frame, and the second cover plate is attached to a surface of the annular frame away from the first cover plate, so as to form a sealed chamber between the first cover plate and the second cover plate; the second guide plate is located in the sealed chamber; the second guide plate includes a plurality of convex portions arranged at intervals along a first direction and extending along a second direction, wherein the first direction is perpendicular to the second direction, the bottoms of adjacent convex portions in the first direction are integrally connected, and there are gaps between the inner sides of the convex portions and the adjacent convex portions, so as to form the sealed channel between the second guide plate and the first cover plate and the second cover plate; the second guide plate welds the first cover plate and the second cover plate together.

2. The radiator and water heater combination structure according to claim 1, characterized in that: The receiving tank includes a first receiving tank and a second receiving tank, and the first receiving tank and the second receiving tank both include a first end and a second end opposite to each other; there are two first guide plates, and the first guide plates are respectively located in the first receiving tank, and the other first guide plate is located in the second receiving tank; the liquid inlet is located at the first end of the first receiving tank and is connected to the first receiving tank, and the liquid outlet is located at the first end of the second receiving tank and is connected to the second receiving tank; the second end of the first receiving tank is connected to the second end of the second receiving tank.

3. The radiator and water heater combination structure according to claim 2, characterized in that: The first guide plate comprises: A plurality of first guide strips, wherein the first guide strips extend in a wave shape or a square wave shape along a direction perpendicular to the first end of the first containing groove to the second end of the first containing groove, and the plurality of first guide strips are arranged in parallel along a direction from the first end of the first containing groove to the second end of the first containing groove; The first connecting parts are located at two ends of the first guide bars and are integrally connected to each of the first guide bars.

4. The radiator and water heater combination structure according to claim 2, characterized in that: The first guide plate includes a plurality of flat-plate-shaped first guide strips, and the plurality of first guide strips are arranged in parallel and spaced apart in a direction perpendicular to a direction from a first end of the first accommodating groove to a second end of the first accommodating groove.

5. The radiator and water heater combination structure according to claim 1, characterized in that: The radiator and water heater combined structure also includes: A first heat dissipation fin is located on at least one surface of the thermal superconducting plate and outside the heat source installation area, wherein a plurality of first heat dissipation channels arranged in parallel and spaced apart are formed in the first heat dissipation fin; A second heat dissipation fin is located on a surface of the liquid cooling radiator away from the thermal superconducting plate; a plurality of second heat dissipation channels arranged in parallel and spaced apart are formed in the second heat dissipation fin, and the second heat dissipation channel is parallel to the first heat dissipation channel; A partition, wherein the partition is placed on the thermal superconducting plate to divide the thermal superconducting plate into a first part and a second part; wherein the first part is located above the partition, and the second part is located below the partition; the first heat dissipation fin is located on the surface of the first part, and the liquid cooling radiator is located on the surface of the first part; and the heat source installation area is located on the surface of the second part; A power device, wherein the power device is located on the surface of the thermal superconducting plate and is located in the heat source installation area; A sealed box body is formed with an opening on one side of the sealed box body, and the sealed box body is placed on the periphery of the power device and the second part through the opening sleeve; the width of the opening is less than or equal to the width of the partition, and the length of the opening is less than or equal to the length of the partition.

6. The radiator and water heater combination structure according to claim 5, characterized in that: The radiator and water heater combined structure also includes: A shell, which is placed on the top and outside of the thermal superconducting plate, the liquid cooling radiator, the first heat dissipating fins and the second heat dissipating fins, so as to form an air duct between the thermal superconducting plate and the shell; At least one fan is located at one end of the first heat dissipation fin and outside the shell, and an air outlet surface of the fan faces the first heat dissipation fin and is perpendicular to an extension direction of the first heat dissipation channel.

7. The radiator and water heater combination structure according to claim 1, characterized in that: The radiator and water heater combined structure also includes: An electric heating system, the electric heating system comprising: a heating device and an electrical connection line, the heating device is located in the water heater body; one end of the electrical connection line is connected to the heating device; One end of the temperature measuring probe is inserted into the water heater body.

8. The radiator and water heater combination structure according to claim 1, characterized in that: The radiator and water heater combination structure further comprises a circulating liquid tank, wherein the circulating liquid tank contains circulating liquid; an end of the first circulating pipeline away from the liquid inlet is connected to the heat exchanger via the circulating liquid tank.

9. The radiator and water heater combination structure according to claim 1, characterized in that: The thermal superconducting plate includes at least two second guide plates, the length of the second guide plates is the same as the length of the inner side of the annular frame; there is a gap between adjacent second guide plates to form a first balance channel for the heat transfer medium between adjacent second guide plates, and the first balance channel extends along the first direction; a second guide plate adjacent to the annular frame has a gap with the annular frame to form a second balance channel for the heat transfer medium between the second guide plate and the annular frame, and the second balance channel extends along the first direction; the height of the second guide plate is the same as the height of the annular frame.

10. The radiator and water heater combination structure according to claim 1, characterized in that: The side walls of the convex parts are each provided with a plurality of guide holes, and the guide holes penetrate the second guide plate along the thickness direction of the second guide plate.

11. The radiator and water heater combination structure according to claim 1, characterized in that: At least one reserved gap is provided in the second guide plate; the thermal superconducting plate also includes at least one pad, which is located in the reserved gap; the height of the pad is the same as that of the second guide plate, and a first mounting through hole is provided in the pad that runs through the height direction thereof; at least one second mounting through hole is also provided on the first cover plate that runs through the thickness direction thereof, and the second mounting through hole is arranged correspondingly to the first mounting through hole; at least one third mounting through hole is also provided on the second cover plate that runs through the thickness direction thereof, and the third mounting through hole is arranged correspondingly to the first mounting through hole.

12. The radiator and water heater combination structure according to claim 1, characterized in that: At least one reserved gap is provided in the second guide plate; at least one stamped boss is provided on the first cover plate or the second cover plate, and the stamped boss is protruded from the inner surface of the first cover plate or the second cover plate in the reserved gap, the height of the stamped boss is the same as the height of the second guide plate, and a first mounting through hole is provided in the stamped boss that passes through along its height direction, and at least one second mounting through hole is also provided on the second cover plate or the first cover plate that passes through along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole.

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