Melt cooling device

Abstract

The present invention provides a melting cooling device, which comprises: a melting pot for accommodating a material to be melted; an electromagnetic induction coil wound around the outside of the melting pot, through which the melting pot and the material to be melted in the melting pot are heated; and a cooling head, which is arranged above the melting pot, and the cooling head and the melting pot can move close to each other so that the cooling head contacts the material to be melted in the melting pot. According to the melting cooling device of the present invention, the material to be melted can be made to not stick to the pot, cool quickly, and be well shaped, thereby avoiding splashing of the material to be melted during cooling after melting.

Description

Technical Field

[0001] The present application relates to the field of cooling of molten metal, and in particular to a molten cooling device. Background Art

[0002] Generally, most precious metals such as gold have beautiful colors, strong chemical stability, and are not easy to react with other chemical substances under normal conditions. As precious metals such as gold have played an important role in the jewelry industry, electronics industry, modern communications, aerospace industry and other sectors, how to effectively recycle the above precious metals has become a relatively important issue.

[0003] Usually, a high frequency electric furnace or an ultra-high frequency electric furnace is used to melt precious metals such as gold, and a graphite crucible or a quartz crucible is used to carry the precious metals. After the precious metals such as gold are melted in liquid form, they are poured into a corresponding mold while hot and cooled to shape. However, if the amount of precious metal to be melted is small, it is very easy to splash during cooling. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide a melt cooling device to ensure that the molten material can be quickly cooled and shaped after melting, so as to avoid splashing of the molten material during cooling after melting.

[0005] A first aspect of the present invention provides a melt cooling device, wherein the melt cooling device comprises:

[0006] A melting pot, used to contain the material to be melted;

[0007] an electromagnetic induction coil, which is wound around the outside of the melting pot, and heats the melting pot and the material to be melted in the melting pot through the electromagnetic induction coil; and

[0008] A cooling head is arranged above the melting pot, and the cooling head and the melting pot can move close to each other so that the cooling head contacts the object to be melted in the melting pot.

[0009] Preferably, the cooling head is formed of graphite and is formed into a columnar body.

[0010] Preferably, the melt cooling device also includes a cooling pipe, which is arranged on the cooling head and connected to a storage tank for storing coolant, and the coolant can circulate in the cooling pipe to cool the cooling head, the melting pot and the material to be melted in the melting pot.

[0011] Preferably, the cooling tube is a hollow copper tube.

[0012] Preferably, the coolant in the cooling pipe is an antifreeze coolant.

[0013] Preferably, the melt cooling device further comprises:

[0014] A support member, wherein a first end of the support member is fixedly connected to a fixing portion, the cooling pipe is fixedly mounted on the fixing portion, and the support member is arranged in a cantilever manner relative to the fixing portion;

[0015] a first connecting member, a first end of the first connecting member being fixedly connected to the cooling head, and a second end of the first connecting member being connected to a second end of the supporting member;

[0016] The cooling pipe is arranged around the first connecting member.

[0017] Preferably, the cooling head includes a columnar base and a columnar hollow portion arranged on the columnar base, the first end of the first connecting member is arranged inside the columnar hollow portion, and the outer peripheral wall of the columnar hollow portion is formed with an open portion, and the first end of the first connecting member is fixed to the outer peripheral wall of the columnar hollow portion facing the open portion by a first positioning member.

[0018] Preferably, the molten cooling device further comprises a second connecting member, a first end of the second connecting member is connected to a second end of the first connecting member in a relatively movable manner, and a second end of the second connecting member is connected to a second end of the supporting member.

[0019] Preferably, the second end of the second connecting member is movably inserted into a through hole opened at the second end of the supporting member;

[0020] The melt cooling device further comprises a displacement trigger and a sensor, wherein the displacement trigger is fixedly connected to the second end of the second connecting member, and the displacement trigger is arranged above the supporting member, and the displacement trigger moves synchronously with the second connecting member, and when the displacement trigger contacts the upper surface of the supporting member, the second connecting member can be restricted from moving downward in the vertical direction;

[0021] The sensor is disposed on the fixing portion, and when the melting pot and the cooling head are in contact with each other, the sensor detects the displacement of the displacement triggering member and stops the movement of the melting pot.

[0022] Preferably, the first connecting member is a double-layer clamping plate formed of copper, and the double-layer clamping plate is formed with a plurality of first positioning holes;

[0023] The second connecting member is a copper column formed of copper, the copper column is formed with a plurality of second positioning holes, and the copper column is partially inserted between the double-layer clamping plate members;

[0024] The second positioning member can be inserted into the first positioning hole and the second positioning hole to fix the copper column between the double-layer clamping plate members.

[0025] Preferably, the melting pot is a graphite pot formed using graphite.

[0026] Preferably, the molten cooling device further comprises a quartz protective sleeve sleeved on the outside of the graphite pot.

[0027] Preferably, the electromagnetic induction coil is wound around the outer side of the quartz protective sleeve and connected to a high-frequency melting furnace.

[0028] Preferably, the electromagnetic induction coil is a hollow copper tube.

[0029] Preferably, the molten cooling device further comprises a quartz base arranged at the bottom of the quartz protective sleeve, for matching the winding height of the electromagnetic induction coil.

[0030] Preferably, the surface of the graphite pot is coated with an anti-oxidation film.

[0031] Preferably, the molten cooling device further comprises a quartz cover, and when the molten cooling device is in a non-working state, the quartz cover covers the top of the graphite pot.

[0032] Preferably, the material to be melted is a metal product made of at least one of gold, silver, ruthenium, rhodium, palladium, osmium, iridium and platinum.

[0033] The melt cooling device of the present invention can achieve the effects that the material to be melted does not stick to the pan, has a fast cooling speed and good shaping, thereby avoiding splashing of the material to be melted when cooling after melting.

[0034] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 is a schematic diagram showing a melt cooling device according to an embodiment of the present invention;

[0037] Figure 2 is another schematic diagram showing a melt cooling device according to an embodiment of the present invention.

[0038] Icons: 10-graphite pot; 11-quartz protective cover; 12-quartz base; 20-high frequency furnace; 21-electromagnetic induction coil; 30-cooling head; 31-columnar base; 32-columnar hollow part; 40-first connecting member; 41-second connecting member; 42-supporting member; 43-displacement trigger; 50-sensor; 60-fixing part; 70-cooling tube. DETAILED DESCRIPTION

[0039] The following specific embodiments are provided to help the reader obtain a comprehensive understanding of the methods, devices and / or systems described herein. However, after understanding the disclosure of the present application, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent. For example, the order of operations described herein is merely an example, and is not limited to the order set forth herein, but in addition to the operations that must occur in a particular order, changes that will be apparent after understanding the disclosure of the present application may be made. In addition, in order to improve clarity and brevity, descriptions of features known in the art may be omitted.

[0040] The features described herein may be implemented in different forms and should not be interpreted as being limited to the examples described herein. Rather, the examples described herein have been provided only to illustrate some of the many possible ways of implementing the methods, devices and / or systems described herein that will be apparent after understanding the disclosure of the present application.

[0041] Throughout the specification, when an element (such as a layer, a region, or a substrate) is described as being “on”, “connected to”, “bound to”, “over”, or “covering” another element, it may be directly “on”, “connected to”, “bound to”, “over”, or “covering” another element, or one or more other elements may be present between them. In contrast, when an element is described as being “directly on”, “directly connected to”, “directly bound to”, “directly over”, or “directly covering” another element, there may be no other elements present between them.

[0042] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0043] Although terms such as "first," "second," and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions are not limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Therefore, without departing from the teachings of the examples described herein, the first member, component, region, layer, or portion referred to may also be referred to as the second member, component, region, layer, or portion.

[0044] For ease of description, spatial relational terms such as "above", "upper", "below", and "lower" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Such spatial relational terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "upper" relative to another element will subsequently be "below" or "lower" relative to the other element. Therefore, the term "above" includes both "above" and "below" orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relational terms used herein will be interpreted accordingly.

[0045] The terms used herein are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "include", "comprise" and "have" list the stated features, quantities, operations, components, elements and / or their combinations that exist, but do not exclude the existence or addition of one or more other features, quantities, operations, components, elements and / or their combinations.

[0046] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.

[0047] The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.

[0048] Figure 1 is a schematic diagram showing a melt cooling device according to an embodiment of the present invention. Figure 2 is another schematic diagram showing a melt cooling device according to an embodiment of the present invention.

[0049] According to an aspect of the present invention, a melt cooling device is provided, such as Figure 1 and Figure 2 As shown, the melting cooling device according to the embodiment includes a melting pot, an electromagnetic induction coil 21 , a cooling head 30 , a cooling pipe 70 , a supporting member 42 , a first connecting member 40 , a second connecting member 41 , a displacement trigger 43 and a sensor 50 .

[0050] Hereinafter, the specific structures of the above-mentioned components of the melt cooling device according to the present embodiment will be described.

[0051] In an embodiment, the melting pot of the melting and cooling device can be used to accommodate the material to be melted, for example, the material to be melted can be a metal product made of at least one of gold, silver, ruthenium, rhodium, palladium, osmium, iridium and platinum. That is to say, in this embodiment, the material to be melted can be a metal product made of precious metals (including metal jewelry, recyclable parts used in the aviation field and precision electronic instruments, etc.). However, it is not limited to this, and the melting pot according to this embodiment can also accommodate other materials to be melted that have recycling value.

[0052] In addition, in the present embodiment, the melting pot may be a graphite pot 10 formed of graphite. In addition, a quartz protective sleeve 11 is assembled or sleeved on the outside of the graphite pot 10, so as to avoid the graphite pot 10 being directly clamped by a clamping tool (not shown) during subsequent operations, thereby effectively protecting the graphite pot 10, and the quartz protective sleeve 11 can maintain the high temperature of the graphite pot 10 to a certain extent, thereby efficiently melting the material to be melted.

[0053] In addition, as shown in the figure, the electromagnetic induction coil 21 can be wound around the outside of the quartz protective sleeve 11 and connected to the high-frequency melting furnace 20. In the embodiment, the electromagnetic induction coil 21 can be, for example, a hollow copper tube. When the graphite pot 10 and the material to be melted in the graphite pot 10 need to be heated, the high-frequency melting furnace 20 is turned on, and an eddy current is generated in the electromagnetic induction coil 21, thereby generating a strong magnetic flux with an instantaneous change of polarity in the electromagnetic induction coil 21. The strong magnetic flux will penetrate the entire graphite pot 10 and the material to be melted in the graphite pot 10, and generate a corresponding large eddy current inside the graphite pot 10 and the material to be melted in the graphite pot 10. The resistance of the graphite pot 10 and the material to be melted is used to generate a lot of Joule heat, so as to achieve rapid heating of the graphite pot 10 and the material to be melted in the graphite pot 10, so that the material to be melted quickly reaches a molten state.

[0054] In addition, in this embodiment, the electromagnetic induction coil 21 is wound around the outside of the quartz protective sleeve 11, which means that the electromagnetic induction coil 21 is only wound around the outer wall of the quartz protective sleeve 11, but not in contact with the outer wall of the quartz protective sleeve 11, that is, the electromagnetic induction coil 21 is wound around the outside of the quartz protective sleeve 11 in a fixed posture and separately from the quartz protective sleeve 11. In other words, the electromagnetic induction coil 21 is substantially wound around the outside of the quartz protective sleeve 11 in a non-contact manner with the outer wall of the quartz protective sleeve 11, so that when the quartz protective sleeve 11 is clamped by a clamping tool, the quartz protective sleeve 11 can be moved away from the area where the electromagnetic induction coil 21 is located with the graphite pot 10.

[0055] In addition, it should be noted that although a quartz protective sleeve 11 is provided on the outside of the graphite pot 10 in the embodiment, it is not limited thereto, and other protective components may also be used as long as they can reduce the direct clamping of the graphite pot 10 by the clamping tool and maintain the high temperature of the graphite pot 10.

[0056] In addition, if Figure 1 and Figure 2 As shown, in order to match the winding height of the electromagnetic induction coil 21, a quartz base 12 can also be provided at the bottom of the quartz protective sleeve 11 to adjust the height of the quartz protective sleeve 11 and the graphite pot 10. Of course, according to the different required winding heights of the electromagnetic induction coil 21 connected to the high-frequency melting furnace 20, quartz bases 12 with different heights can be selected.

[0057] In addition, it should be noted that the surface of the graphite pot 10 can be coated with an anti-oxidation film, thereby increasing the service life of the graphite pot 10. In the embodiment of the present application, the material of the anti-oxidation film is not specifically limited, as long as the anti-oxidation film can effectively prevent the surface of the graphite pot 10 from being oxidized.

[0058] In addition, in order to further reduce the oxidation of the graphite pot 10 and thus increase the service life of the graphite pot 10, the melting and cooling device according to the present invention may also include a quartz cover (not shown). In the embodiment, when the melting and cooling device is in a non-working state (i.e., when the melting and cooling device is not used), the quartz cover covers the top of the graphite pot 10 to cooperate with the quartz protective sleeve 11, thereby surrounding the entire graphite pot 10; when the melting and cooling device is used to melt the material to be melted in the graphite pot 10, the clamping tool will first clamp the quartz cover and transfer the quartz cover to other predetermined positions, and then the material to be melted will be introduced into the graphite pot, and finally the quartz cover will be re-covered on the top of the graphite pot 10, so that it can be ensured that the contact between the graphite pot 10 and the air is reduced when the material to be melted is melted, thereby reducing the oxidation of the graphite pot 10.

[0059] In addition, if Figure 1 and Figure 2As shown, the first end of the support member 42 can be fixedly connected to the fixing portion 60, and the fixing portion 60 is fixedly mounted with a cooling pipe 70. When the melting cooling device according to the present invention is placed in a device with a specific function or purpose, the fixing portion 60 can be a fixed wall or other component in the device. In addition, the fixing method of the cooling pipe 70 relative to the fixing portion 60 is not limited, as long as the cooling pipe 70 can be fixed relative to the fixing portion 60.

[0060] In addition, if Figure 1 and Figure 2 As shown, the support member 42 is disposed in a cantilever manner relative to the fixing portion 60 for supporting the first connection member 40 , the second connection member 41 and the cooling head 30 as described below.

[0061] In addition, if Figure 1 and Figure 2 As shown, the first end of the first connecting member 40 may be fixedly connected to the cooling head 30 , and the second end of the first connecting member 40 may be detachably connected to the first end of the second connecting member 41 .

[0062] The second end of the second connecting member 41 is connected to the second end of the supporting member 42 in the following manner: a through hole is provided at the second end of the supporting member 42, and the second end of the second connecting member 41 can be inserted into the through hole so as to move relative to the second end of the supporting member 42. Figure 1 and Figure 2 As shown, the displacement trigger 43 is fixedly connected to the second end of the second connection member 41, and the displacement trigger 43 is arranged above the support member 42, and the displacement trigger 43 can move synchronously with the second connection member 41. When the displacement trigger 43 contacts the upper surface of the support member 42, the second connection member 41 can be restricted from moving downward in the vertical direction; when the second end of the second connection member 41 moves upward in the through hole of the second end of the support member 42 in the vertical direction, the displacement trigger 43 will also move upward in the vertical direction.

[0063] In an embodiment of the present invention, when the graphite pot 10 and the cooling head 30 are in contact with each other, the sensor 50 disposed on the fixing portion 60 can detect the displacement of the displacement trigger 43 and stop the movement of the graphite pot 10 through a controller or the like.

[0064] exist Figure 1 and Figure 2 In the embodiment shown in , the first connecting member 40 is a double-layer clamping member formed of copper, and the second connecting member 41 is a copper column formed of copper, which can improve the heat conduction efficiency and effectively cool the melt in the graphite pot 10 and the cooling head 30. Figure 1 and Figure 2As shown, the double-layered clamping plate can be formed with a plurality of first positioning holes, and the copper column can be formed with a plurality of second positioning holes, and the copper column is partially inserted between the double-layered clamping plate; the second positioning member can be inserted into the first positioning hole and the second positioning hole, so as to fix the copper column between the double-layered clamping plate. By using the plurality of first positioning holes on the double-layered clamping plate and the plurality of second positioning holes of the copper column, the insertion depth of the copper column relative to the double-layered clamping plate can be effectively adjusted, so that the cooling head 30 can be positioned at a desired height.

[0065] In addition, if Figure 1 and Figure 2 As shown, the cooling head 30 may include a columnar base 31 and a columnar hollow portion 32 disposed on the columnar base 31. The first end of the first connecting member 40 (i.e., the double-layer plywood member) may be disposed inside the columnar hollow portion 32, and the outer peripheral wall of the columnar hollow portion 32 is formed with an open portion. The operator uses the open portion to fix the first end of the first connecting member 40 to the outer peripheral wall of the columnar hollow portion 32 facing the open portion through the first positioning member, so that the cooling head 30 and the first connecting member 40 can be firmly fixed.

[0066] In an embodiment, Figure 1 and Figure 2 As shown, the cooling pipe 70 may be disposed around the first connecting member 40. Figure 1 and Figure 2 In the embodiment, the cooling pipe 70 is wound around the first connecting member 40 in the horizontal direction, but is not limited to this. As long as the cooling pipe 70 can effectively cool the graphite pot 10, the graphite cooling head and the melt such as gold, the cooling pipe 70 can also be wound around the first connecting member 40 in the vertical direction.

[0067] Although not shown in the figure, the cooling pipe can be connected to a storage tank storing coolant, and the storage tank can be placed at a position close to the melt cooling device. When the cooling pipe 70 is needed to cool the cooling head 30, the graphite pot 10 and the object to be melted in the graphite pot 10, the coolant stored in the storage tank can circulate in the cooling pipe 70, so that the above parts are cooled.

[0068] In addition, in order to effectively accelerate heat conduction, the cooling pipe 70 can be formed of a material with high thermal conductivity. In this embodiment, the cooling pipe 70 can preferably be a hollow copper tube. In addition, in order to make the melting cooling device according to the present invention adapt to different external temperature environments, the coolant in the storage tank can be an antifreeze coolant, similar to the antifreeze coolant used in automobiles.

[0069] Then, if Figure 1 and Figure 2As shown, the cooling head 30 of the melt cooling device is located above the graphite pot 10. In the embodiment, when the material to be melted in the graphite pot 10 is heated for a predetermined time (i.e., the material to be melted becomes a molten state), the clamping tool first removes the quartz cover, then clamps the graphite pot 10, and moves the graphite pot 10 toward the cooling head 30, so that the cooling head 30 contacts (abuts) the material to be melted in the graphite pot 10, thereby achieving rapid shaping and cooling of the material to be melted.

[0070] After the cooling head 30 completes shaping and cooling of the object to be melted in the graphite pot 10 , the clamping tool moves the graphite pot 10 away from the cooling head 30 , that is, the cooling head 30 leaves the object to be melted in the graphite pot 10 .

[0071] In this embodiment, if Figure 1 and Figure 2 As shown, the cooling head 30 can be a columnar body formed of graphite. The cooling head 30 is formed as a columnar body, so that the material to be melted in the graphite pot 10 can be effectively shaped; the cooling head 30 is formed of graphite that has fast thermal conductivity and does not adhere to the material to be melted, such as gold, so that the cooling head 30 constructed in this way can achieve the effects of non-stick pan, fast cooling speed and good shaping.

[0072] In addition, if Figure 1 and Figure 2 As shown, at least a portion of the cooling tube 70 is inside the cylindrical hollow portion 32 of the cooling head 30 and surrounds the outside of the first connecting member 40, so that the coolant that can circulate in the cooling tube 70 is used to cool the material to be melted in the graphite pot 10, thereby facilitating the rapid shaping of the material to be melted. At the same time, the coolant in the cooling tube 70 can also cool the cooling head 30 and the graphite pot 10 formed of graphite, thereby reducing the oxidation of the graphite and increasing the service life of the graphite.

[0073] Hereinafter, the operation of the melt cooling apparatus according to the present invention will be described in detail.

[0074] First, the clamping tool moves the quartz cover to a predetermined position, and then the material to be melted, such as precious metals, is placed in the graphite pot 10 and the quartz cover is covered on the top of the graphite pot 10 again by the clamping tool, and then the high-frequency melting furnace 20 is powered on, and then the graphite pot 10 and the material to be melted in the graphite pot 10 are heated by the electromagnetic induction coil 21; after the material to be melted is heated for a predetermined time so that the material to be melted is in a molten state, the quartz cover is moved to a predetermined position by the clamping tool, and the quartz protective sleeve 11 is clamped, and the graphite pot 10 is moved upward in a vertical direction, so that the melt in the graphite pot 10 contacts the graphite cooling head 30, and in addition, the graphite pot 10 is heated by the electromagnetic induction coil 21. Before the molten material in the graphite pot 10 contacts the graphite cooling head 30, the coolant in the storage tank has been circulating in the cooling tube 70; after the graphite cooling head 30 completes the cooling and shaping of the molten material in the graphite pot 10, the quartz protective sleeve 11 is clamped by a clamping tool, and the graphite pot 10 is moved upward in the vertical direction, so that the molten material in the graphite pot 10 leaves the graphite cooling head 30; then the molten and shaped objects in the graphite pot 10 are transferred to a predetermined position; finally, the quartz protective sleeve 11 and the graphite pot 10 are reset, and the quartz cover is covered on the top of the graphite pot 10 again by the clamping tool, and the operation of the melting cooling device is completed.

[0075] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A melt cooling device, characterized in that: The melt cooling device comprises: A melting pot, used to contain the material to be melted; an electromagnetic induction coil, which is wound around the outside of the melting pot, and heats the melting pot and the material to be melted in the melting pot through the electromagnetic induction coil; and A cooling head is arranged above the melting pot, and the cooling head and the melting pot can move close to each other so that the cooling head contacts the material to be melted in the melting pot. The melt cooling device also includes: A support member, wherein a first end of the support member is fixedly connected to a fixing portion, a cooling pipe is fixedly mounted on the fixing portion, and the support member is arranged in a cantilever manner relative to the fixing portion; a first connecting member, a first end of the first connecting member being fixedly connected to the cooling head, and a second end of the first connecting member being connected to a second end of the supporting member; The cooling pipe is arranged around the first connecting member. The molten cooling device further comprises a second connecting member, a first end of the second connecting member is connected to a second end of the first connecting member in a relatively movable manner, and a second end of the second connecting member is connected to a second end of the supporting member. The second end of the second connecting member is movably inserted into a through hole opened at the second end of the supporting member; The melt cooling device further comprises a displacement trigger and a sensor, wherein the displacement trigger is fixedly connected to the second end of the second connecting member, and the displacement trigger is arranged above the supporting member, and the displacement trigger moves synchronously with the second connecting member, and when the displacement trigger contacts the upper surface of the supporting member, the second connecting member can be restricted from moving downward in the vertical direction; The sensor is disposed on the fixing portion, and when the melting pot and the cooling head are in contact with each other, the sensor detects the displacement of the displacement triggering member and stops the movement of the melting pot.

2. The melt cooling device according to claim 1, characterized in that: The cooling head is formed of graphite and is formed into a columnar body.

3. The melt cooling device according to claim 1, characterized in that: The melt cooling device also includes a cooling pipe, which is arranged on the cooling head and connected to a storage tank storing a coolant. The coolant can circulate in the cooling pipe to cool the cooling head, the melting pot and the material to be melted in the melting pot.

4. The melt cooling device according to claim 3, characterized in that: The cooling tube is a hollow copper tube.

5. The melt cooling device according to claim 3, characterized in that: The coolant in the cooling pipe is an antifreeze coolant.

6. The melt cooling device according to any one of claims 3 to 5, characterized in that: The cooling head includes a columnar base and a columnar hollow portion arranged on the columnar base, the first end of the first connecting member is arranged inside the columnar hollow portion, and the outer peripheral wall of the columnar hollow portion is formed with an open portion, and the first end of the first connecting member is fixed to the outer peripheral wall of the columnar hollow portion facing the open portion by a first positioning member.

7. The melt cooling device according to claim 6, characterized in that: The first connecting member is a double-layer clamping plate made of copper, and the double-layer clamping plate is formed with a plurality of first positioning holes; The second connecting member is a copper column formed of copper, the copper column is formed with a plurality of second positioning holes, and the copper column is partially inserted between the double-layer clamping plate members; The second positioning member can be inserted into the first positioning hole and the second positioning hole to fix the copper column between the double-layer clamping plate members.

8. The melt cooling device according to any one of claims 1 to 5, characterized in that: The melting pot is a graphite pot formed by graphite.

9. The melt cooling device according to claim 8, characterized in that: The molten cooling device also includes a quartz protective sleeve which is sleeved on the outside of the graphite pot.

10. The melt cooling device according to claim 9, characterized in that: The electromagnetic induction coil is wound around the outer side of the quartz protective sleeve and connected to the high-frequency melting furnace.

11. The melt cooling device according to claim 10, characterized in that: The electromagnetic induction coil is a hollow copper tube.

12. The melt cooling device according to claim 9, characterized in that: The molten cooling device also includes a quartz base arranged at the bottom of the quartz protective sleeve, which is used to match the winding height of the electromagnetic induction coil.

13. The melt cooling device according to claim 8, characterized in that: The surface of the graphite pot is coated with an anti-oxidation film.

14. The melt cooling device according to claim 8, characterized in that: The molten cooling device further comprises a quartz cover. When the molten cooling device is in a non-working state, the quartz cover covers the top of the graphite pot.

15. The melt cooling device according to any one of claims 1 to 5, characterized in that: The material to be melted is a metal product made of at least one of gold, silver, ruthenium, rhodium, palladium, osmium, iridium and platinum.

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