Preparation process of conductive silver powder special for glass-based circuit board

Abstract

This invention provides a process for preparing conductive silver powder specifically for glass-based circuit boards, comprising the following steps: melting solid pure silver or silver alloy into liquid silver; introducing the liquid silver into a nitrogen atmosphere atomization chamber with a nitrogen concentration ≥99.99%; atomizing nozzles spraying high-pressure atomizing gas onto the introduced liquid silver to atomize it; before the atomized material solidifies, a low-temperature nitrogen nozzle located in the atomization chamber performs a burst spray at a frequency of 3-10 Hz onto the unsolidified atomized material; under the impact of the burst sprayed low-temperature nitrogen gas, the atomized material becomes irregular in shape, and the low temperature of the nitrogen gas causes the atomized material to solidify rapidly while deforming, forming conductive silver powder specifically for glass-based circuit boards. The conductive silver powder particles provided by this invention have irregular shapes, irregular contact points between particles, and disordered force transmission when subjected to force, resulting in tight bonding between silver powder particles. When used as a basic ingredient in the preparation of glass-based conductive circuits, it can significantly enhance the conductivity of the circuit.