Heating elements, atomizers and electronic atomizing devices

By introducing preheating and high-temperature atomization heating elements into the heating body of the electronic atomization device, the problems of dry burning of the heating body and liquid leakage are solved, and a more efficient and safe atomization effect is achieved.

CN110447966BActive Publication Date: 2025-02-18SHENZHEN SMOORE TECH LTD
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Patent Information

Application Number
CN201910738955.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-08-12
Publication Date
2025-02-18
Estimated Expiration
2039-08-12

AI Technical Summary

Technical Problem

In existing electronic atomization devices, the heating element is prone to dry burning and produces harmful substances, while the liquid is prone to leak out, affecting the user experience.

Method used

A heating element is designed, including a base body, a first heating element and a second heating element. The first heating element is arranged on the liquid absorbing surface for preheating the liquid to reduce viscosity; the second heating element is arranged on the atomization surface for high-temperature atomization. The working time of the heating element is controlled through a parallel circuit to ensure that the liquid reaches the atomized surface in time and avoid dry burning.

Benefits of technology

It effectively avoids dry burning of the heating body and leakage of liquid, improves the user experience of the electronic atomization device, and ensures the safety and efficiency of the device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a heating element, an atomizer and an electronic atomization device. The heating element comprises: a substrate having a liquid absorption surface, the liquid absorption surface being used to introduce liquid; a first heating element, which is arranged on the liquid absorption surface and is used to preheat the liquid to be introduced, reduce the viscosity of the liquid so that the liquid can penetrate into the substrate; and a second heating element, which is arranged on the substrate, the heating temperature of the second heating element is higher than the preheating temperature of the first heating element, and is used to heat and atomize the liquid introduced into the substrate. The transmission speed of the liquid with reduced viscosity in the substrate is increased, thereby avoiding dry burning in the substrate due to insufficient liquid penetration per unit time. At the same time, when the first heating element and the second heating element stop working, the liquid returns to a higher viscosity at room temperature relative to the working state, thereby preventing the liquid from penetrating from the liquid absorption surface into the interior of the substrate and leaking from other surfaces of the substrate.
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Description

Technical Field

[0001] The present invention relates to the technical field of electronic atomization, and in particular to a heating element, an atomizer and an electronic atomization device. Background Art

[0002] Electronic atomizers have a similar appearance and taste to ordinary cigarettes, but usually do not contain tar, suspended particles and other harmful components in cigarettes. Therefore, electronic atomizers are widely used as substitutes for cigarettes. In existing electronic atomizers, liquid is usually transported to the atomization surface of the porous heating element by capillary action for atomization. When inhaling, the liquid often fails to reach the atomization surface in time, causing the heating element to burn dry and produce burnt smell and other harmful substances. When placed, it is easy to leak liquid, which affects the user experience. Summary of the invention

[0003] A technical problem solved by the present invention is how to prevent the heating element from burning dry and leaking liquid.

[0004] A heating element for atomization, comprising:

[0005] A substrate having a liquid absorbing surface, wherein the liquid absorbing surface is used for introducing liquid;

[0006] A first heating element, disposed on the liquid absorbing surface and used to preheat the liquid to be introduced, reduce the viscosity of the liquid so that the liquid can penetrate into the substrate; and

[0007] The second heating element is arranged on the substrate. The heating temperature of the second heating element is higher than the preheating temperature of the first heating element. The second heating element is used to heat and atomize the liquid introduced into the substrate.

[0008] In one embodiment, the substrate further includes an atomizing surface opposite to the liquid absorbing surface, and the second heating element is embedded in the substrate or directly attached to the atomizing surface.

[0009] In one embodiment, the first heating element and the second heating element form a parallel circuit, and the resistance of the first heating element is greater than the resistance of the second heating element.

[0010] In one embodiment, it also includes a first electrical connector for connecting to the positive pole of a power supply and a second electrical connector for connecting to the negative pole of a power supply, wherein the first electrical connector is connected to one end of the first heating element and the second heating element, and the second electrical connector is connected to the other end of the first heating element and the second heating element.

[0011] In one embodiment, the first and second electrical connectors are respectively disposed on two opposite surfaces of the substrate.

[0012] In one embodiment, a through hole is provided in the base, and the base also has an atomization surface for setting the second heating element. The through hole penetrates the liquid absorption surface and the atomization surface at the same time, and the first and second electrical connectors are respectively arranged in different through holes.

[0013] In one embodiment, the first and second electrical connecting members are in the shape of films or lines.

[0014] In one embodiment, the first heating element is in the shape of a membrane or a line; the second heating element is in the shape of a membrane or a line.

[0015] In one embodiment, the first heating element is embedded in the substrate or directly attached to the liquid absorbing surface.

[0016] In one embodiment, both the first heating element and the second heating element are connected to the substrate by a printing process or a spraying process.

[0017] In one embodiment, the liquid absorption surface and the atomization surface are parallel to each other.

[0018] In one embodiment, the preheating temperature of the first heating element is 50°C to 180°C, and the heating temperature of the second heating element is 190°C to 260°C.

[0019] In one embodiment, the substrate is a porous ceramic substrate.

[0020] An atomizer comprises an atomizing chamber and a liquid storage chamber for storing liquid, and the atomizer comprises any one of the heating elements described above.

[0021] In one embodiment, the liquid absorbing surface is in direct contact with the liquid in the liquid storage chamber.

[0022] An electronic atomization device comprises a power supply and a control circuit. The electronic atomization device further comprises a power supply and an atomizer as described above. The power supply is connected to the atomizer. The control circuit is used to control the heating of a first heating element and a second heating element.

[0023] In one embodiment, the control circuit controls the first heating element to start heating for a preset time and then starts the second heating element to start heating.

[0024] A technical effect of an embodiment of the present invention is that when the first heating element generates heat, the preheating temperature of the first heating element can preheat the liquid to be introduced into the substrate and reduce the viscosity of the liquid, thereby reducing the resistance of the liquid flowing through the inside of the substrate, so that the transmission speed of the liquid with reduced viscosity in the substrate is increased, so that the liquid can reach the vicinity of the second heating element in time to be heated and atomized by the second heating element, avoiding dry burning in the substrate due to insufficient liquid penetration per unit time. At the same time, when the first heating element and the second heating element stop working, the liquid returns to a higher viscosity at room temperature relative to the working state, thereby increasing the resistance of the liquid flowing through the inside of the substrate, making it difficult for the liquid to penetrate into the inside of the substrate from the liquid absorption surface and leak from other surfaces of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of the cross-sectional structure of an atomizer provided in an embodiment;

[0026] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure of the substrate in the atomizer shown;

[0027] Figure 3 for Figure 1 A schematic diagram of the three-dimensional structure of the heating element in the atomizer shown;

[0028] Figure 4 for Figure 3 A schematic cross-sectional view of a first example of a heating element shown in FIG.

[0029] Figure 5 for Figure 3 A second exemplary cross-sectional structural diagram of the heating element shown in FIG.

[0030] Figure 6 for Figure 1 Schematic diagram of the circuit connections in the atomizer shown. DETAILED DESCRIPTION

[0031] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0032] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "inside", "outside", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0033] See also Figures 1 to 5 The electronic atomization device provided by one embodiment of the present invention includes a power supply, a control circuit 30 and an atomizer 20. The power supply and the atomizer 20 are electrically connected, and the power supply is used to provide electrical energy for the atomizer 20. A liquid storage chamber 201 and an atomization chamber 202 are provided in the atomizer 20. The liquid storage chamber 201 and the atomization chamber 202 are isolated from each other and are not connected. The liquid storage chamber 201 is used to store a liquid represented by an aerosol generating matrix, and the smoke formed after the liquid is atomized overflows from the atomization chamber 202. The atomizer 20 is also provided with an air inlet channel 204 and an air inhalation channel 203. The air inlet channel 204 connects the outside world and the atomization chamber 202, and the air inhalation channel 203 also connects the outside world and the atomization chamber 202. The outside air enters the atomization chamber 202 through the air inlet channel 204 to carry the smoke in the atomization chamber 202, and then the smoke passes through the air inhalation channel 203 to be inhaled by the user. The atomizer 20 includes a heat generating body 10 , and the heat generating body 10 includes a base 100 , a first heating element 200 , and a second heating element 300 .

[0034] In some embodiments, the substrate 100 is a porous ceramic substrate, that is, the substrate 100 is made of porous ceramic material, so the substrate 100 contains a large number of micropores and has a certain porosity. The porosity can be defined as the percentage of the volume of the pores in the object to the total volume of the material in the natural state. The porosity of the substrate 100 is relatively low, for example, the porosity of the substrate 100 is 10% to 20%. At the same time, the viscosity of the liquid at room temperature is relatively large, and the value range of the viscosity can be 50mPa.S to 1200mPa.S. Since the porosity of the substrate 100 is low and the viscosity of the liquid is high, at room temperature when the entire atomizer 20 stops working, the resistance along the flow of the liquid in the micropores increases, and it is difficult or even impossible for the liquid to penetrate into the substrate 100 through the micropores, so that the liquid cannot leak out from the surface of the substrate 100, thereby avoiding the waste of liquid in the liquid storage chamber 201; at the same time, it also prevents the liquid leaked from the substrate 100 from further flowing into the power supply, thereby avoiding the atomization pollution of the leaked liquid and the corrosion of related electronic components in the power supply, ensuring that the electronic atomization device can work normally. Furthermore, the substrate 100 made of porous ceramic material has good high temperature resistance, and the liquid in the liquid storage chamber 201 will not react chemically with the substrate 100 under high temperature conditions, preventing the liquid from being wasted due to participating in unnecessary chemical reactions.

[0035] The substrate 100 has a liquid absorption surface 110 and an atomization surface 120. The liquid absorption surface 110 defines a part of the boundary of the liquid storage chamber 201, so the liquid in the liquid storage chamber 201 can contact the liquid absorption surface 110. Since the substrate 100 has a certain porosity, the substrate 100 can form a capillary action, and the entire substrate 100 can absorb the liquid in the liquid storage chamber 201 into the inside of the substrate 100 through the liquid absorption surface 110. The liquid inside the substrate 100 will eventually reach the atomization surface 120 to be atomized to form smoke. The atomization surface 120 defines a part of the boundary of the atomization chamber 202, so that the smoke atomized on the atomization surface 120 will first overflow into the atomization chamber 202, and then be sucked by the user through the air inhalation channel 203. In other embodiments, the liquid absorption surface 110 may not form a direct contact relationship with the liquid in the liquid storage chamber 201, for example, the liquid absorption surface 110 introduces liquid from the liquid storage chamber 201 through a cotton liquid absorption rod.

[0036] When the viscosity of the liquid at room temperature is large enough, the porosity of the substrate 100 can be appropriately increased to prevent the substrate 100 from leaking liquid at room temperature, and to facilitate the liquid to quickly reach the atomization surface 120 when the atomizer 20 is working. On the contrary, when the viscosity of the liquid at room temperature is low, in order to prevent the liquid from easily penetrating into the surface of the substrate 100 and leaking, the porosity of the substrate 100 can be appropriately reduced.

[0037] In some embodiments, the first heating element 200 is disposed on the liquid absorption surface 110, and the first heating element 200 can form a certain preheating temperature to preheat the liquid in the liquid storage chamber 201. The preheating temperature may range from 50°C to 180°C, for example, the preheating temperature may be 50°C, 60°C, 150°C or 180°C. When the atomizer 20 is working, the first heating element 200 preheats the liquid so that the temperature of the liquid near the liquid absorption surface 110 is appropriately increased relative to the normal temperature. Since the viscosity of the liquid is inversely proportional to the temperature, the viscosity of the preheated liquid will be lower than the viscosity of the liquid at normal temperature. At this time, the liquid with reduced viscosity will reach the atomization surface 120 through the micropores inside the substrate 100 at a relatively faster speed in a short time for atomization. The first heating element 200 may be a diaphragm-shaped preheating film, or a linear preheating wire. The first heating element 200 can be directly attached to the liquid absorbing surface 110. Obviously, the first heating element 200 protrudes from the liquid absorbing surface 110 by a set height. A portion of the liquid absorbing surface 110 can also be recessed to form a groove, and the first heating element 200 cooperates with the groove, that is, the first heating element 200 is embedded in the substrate 100, and the surface of the first heating element 200 in the embedded state can also be kept flush with the non-recessed portion of the liquid absorbing surface 110. According to the needs of the actual situation, the first heating element 200 can be connected to the substrate 100 through a printing process, a spraying process or an electroplating process. The first heating element 200 can be made of a metal material.

[0038] In some embodiments, the second heating element 300 is disposed on the atomizing surface 120, and the second heating element 300 can form a heating temperature for liquid atomization, so the heating temperature of the second heating element 300 will be higher than the preheating temperature of the first heating element 200. The value range of the heating temperature of the second heating element 300 can be 190°C to 260°C, for example, the heating temperature value is 190°C, 220°C, 230°C or 260°C. The second heating element 300 can be a diaphragm-shaped heating film, or a linear heating wire. The second heating element 300 can be directly attached to the atomizing surface 120, and obviously, the second heating element 300 protrudes a set height relative to the liquid absorption surface 110. A portion of the atomizing surface 120 may also be recessed to form a groove, and the second heating element 300 cooperates with the groove, that is, the second heating element 300 is embedded in the substrate 100, and the surface of the second heating element 300 in the embedded state may also be kept flush with the non-recessed portion of the atomizing surface 120; of course, the second heating element 300 embedded in the substrate 100 may be completely hidden inside the substrate 100, and at this time, the second heating element 300 is arranged close to the atomizing surface 120. For the same reason, the first heating element 200 may also be completely hidden in the substrate 100 at a position close to the liquid absorption surface 110. According to the actual needs, the second heating element 300 may be connected to the substrate 100 by a printing process, a spraying process or an electroplating process. The second heating element 300 may be made of stainless steel, titanium metal or titanium alloy.

[0039] See also Figures 1 to 6 In some embodiments, the heating element 10 further includes a first electrical connector 410 and a second electrical connector 420. The first electrical connector 410 is used to be electrically connected to the positive electrode of the power supply through the electrode 500, and the second electrical connector 420 is used to be connected to the negative electrode of the power supply through the electrode 500. The first electrical connector 410 is connected to one end of the first heating element 200 and the second heating element 300, and the second electrical connector 420 is connected to the other end of the first heating element 200 and the second heating element 300. At this time, through the joint action of the first electrical connector 410 and the second electrical connector 420, the first heating element 200 and the second heating element 300 form a parallel circuit. The first heating element 200 and the second heating element 300 can be regarded as two resistors arranged in parallel in the circuit, and the power supply supplies power to the parallel circuit. The resistance of the first heating element 200 is higher than that of the second heating element 300. Since the voltages applied to the first heating element 200 and the second heating element 300 are equal, the heat generated by the second heating element 300 is higher than the heat generated by the first heating element 200 in the same period of time, so that the heating temperature of the second heating element 300 is higher than the preheating temperature of the first heating element 200.

[0040] In other embodiments, for example, the first heating element 200 and the second heating element 300 may also form a series circuit. In this case, in order to ensure that the heating temperature of the second heating element 300 is higher than the preheating temperature of the first heating element 200 at the same time, the resistance of the second heating element 300 may be greater than the resistance of the first heating element 200. For another example, the first heating element 200 and the second heating element 300 may be separately connected to the power supply through different electrical connectors, so that the power supply can load the voltage on the first heating element 200 and the second heating element 300 at different times, so that the first heating element 200 works for a set time before the second heating element 300, so that the liquid with reduced viscosity can reach the atomizing surface 120 in time before the second heating element 300 generates heat, thereby preventing the second heating element 300 from burning dry. Furthermore, according to the actual viscosity of the liquid and the required smoke concentration, the preheating temperature of the first heating element 200 and the heating temperature of the second heating element 300 can also be automatically adjusted. When the viscosity of the liquid increases and the smoke concentration required by the user for inhalation increases, it means that a larger amount of liquid must reach the atomization surface 120 per unit time. At this time, the preheating temperature can be increased by increasing the voltage loaded by the power supply to further reduce the liquid concentration and increase the flow rate of the liquid in the substrate 100; at the same time, the heating temperature is increased so that the second heating element 300 can atomize more liquid per unit time.

[0041] The first electrical connector 410 and the second electrical connector 420 can be both a sheet-shaped electrical connector film or a linear electrical connector wire. In this case, the sheet-shaped or linear first electrical connector 410 and the second electrical connector 420 can be attached to two opposite surfaces of the substrate 100, respectively. Of course, a through hole 130 can also be provided in the substrate 100. The through hole 130 is a through hole and simultaneously penetrates the liquid absorption surface 110 and the atomization surface 120. The number of the through holes 130 is two, and the linear first electrical connector 410 can be passed through one of the through holes 130, and the linear second electrical connector 420 can be passed through the other through hole 130. The first electrical connector 410 and the second electrical connector 420 can also be connected to the substrate 100 by a printing process, a spraying process or an electroplating process.

[0042] In some embodiments, the substrate 100 is roughly in the shape of a cuboid, and the substrate 100 has an upper side 101, a lower side 102, a front side 103, a rear side 104, a right end face 105, and a left end face 106. The upper side 101 of the substrate 100 is a liquid absorption surface 110, that is, the first heating element 200 is located on the upper side 101; the lower side 102 of the substrate 100 is an atomization surface 120, that is, the second heating element 300 is located on the lower side 102, at this time, the liquid absorption surface 110 and the atomization surface 120 are parallel to each other. The first electrical connector 410 can be located on the left end face 106, and the second electrical connector 420 can be located on the right end face 105. Of course, the front side 103 or the rear side 104 of the substrate 100 can be the liquid absorption surface 110, and the lower side 102 of the substrate 100 is still the atomization surface 120, at this time, the liquid absorption surface 110 and the atomization surface 120 are perpendicular to each other. In other embodiments, the shape of the substrate 100 may be cylindrical or the like.

[0043] When the atomizer 20 is working, the voltage of the power supply is loaded on the first heating element 200 and the second heating element 300, so that the first heating element 200 and the second heating element 300 work and generate heat. Under the effect of the preheating temperature of the first heating element 200, the viscosity of the liquid is reduced, so that the liquid can quickly reach the atomization surface 120 from the liquid absorption surface 110 through the micropores inside the substrate 100 in time. In order to avoid the atomization surface 120 being in a dry burning state due to insufficient liquid infiltration per unit time, prevent the generation of burnt smell and other harmful substances, and improve user experience, the control circuit 30 can start the first heating element 200 to heat for a preset time, and then start the second heating element 300, and the preset time is preferably 0.2 seconds to 0.5 seconds. When the atomizer 20 stops working, the first heating element 200 and the second heating element 300 stop generating heat. At this time, the liquid in the liquid storage chamber 201 returns to room temperature, the viscosity of the liquid increases, and then increases the resistance along the way of liquid penetration in the micropores, preventing the liquid from leaking from the atomization surface 120. Therefore, by providing the heating element 10, on the one hand, it can prevent the atomizer 20 from dry burning during operation, and on the other hand, it can prevent liquid leakage after the atomizer 20 stops working. In short, the atomizer 20 can be prevented from dry burning and leakage at the same time.

[0044] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0045] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A heating element for atomization, characterized in that: include: A substrate, wherein the substrate is a porous ceramic substrate having a liquid absorption surface, wherein the liquid absorption surface is used to introduce liquid, and the liquid absorption surface is the outer surface of the substrate and is used to define a part of the boundary of the liquid storage cavity; A first heating element, disposed on the liquid absorbing surface and used to preheat the liquid to be introduced, reduce the viscosity of the liquid so that the liquid can penetrate into the substrate; and A second heating element is disposed on the substrate, the heating temperature of the second heating element is higher than the preheating temperature of the first heating element, and is used to heat and atomize the liquid introduced into the substrate; The substrate also includes an atomizing surface opposite to the liquid absorbing surface, the atomizing surface and the liquid absorbing surface are parallel to each other, and the second heating element is arranged on the atomizing surface.

2. The heating element according to claim 1, characterized in that: The second heating element is embedded in the substrate or directly attached to the atomizing surface.

3. The heating element according to claim 1, characterized in that: The first heating element and the second heating element form a parallel circuit, and a resistance of the first heating element is greater than a resistance of the second heating element.

4. The heating element according to claim 3, characterized in that: It also includes a first electrical connector for connecting to the positive pole of a power supply and a second electrical connector for connecting to the negative pole of a power supply, wherein the first electrical connector is connected to one end of the first heating element and the second heating element, and the second electrical connector is connected to the other end of the first heating element and the second heating element.

5. The heating element according to claim 4, characterized in that: The first and second electrical connectors are respectively arranged on two opposite surfaces of the base.

6. The heating element according to claim 4, characterized in that: The base is provided with a through hole, and the base also has an atomizing surface for arranging the second heating element. The through hole penetrates the liquid absorption surface and the atomizing surface at the same time, and the first and second electrical connectors are respectively arranged in different through holes.

7. The heating element according to claim 4, characterized in that: The first and second electrical connecting members are in the shape of membranes or lines.

8. The heating element according to claim 1, characterized in that The first heating element is in the shape of a film or a line; the second heating element is in the shape of a film or a line.

9. The heating element according to claim 1, characterized in that: The first heating element is embedded in the substrate or directly attached to the liquid absorbing surface.

10. The heating element according to claim 1, characterized in that Both the first heating element and the second heating element are connected to the substrate by a printing process or a spraying process.

11. The heating element according to claim 1, characterized in that: The preheating temperature of the first heating element is 50°C to 180°C, and the heating temperature of the second heating element is 190°C to 260°C.

12. The heating element according to claim 1, characterized in that: The substrate is a porous ceramic substrate.

13. An atomizer having an atomizing chamber and a liquid storage chamber for storing liquid, characterized in that: The atomizer comprises the heating element according to any one of claims 1 to 12.

14. The atomizer according to claim 13, characterized in that The liquid absorbing surface is in direct contact with the liquid in the liquid storage chamber.

15. An electronic atomization device, comprising a power supply and a control circuit, characterized in that: The electronic atomization device further comprises a power source and an atomizer as described in any one of claims 13 to 14, wherein the power source is connected to the atomizer, and the control circuit is used to control the first heating element and the second heating element to generate heat.

16. The electronic atomization device according to claim 15, characterized in that: The control circuit controls the first heating element to start heating for a preset time and then starts the second heating element to start heating.

Citation Information

Patent Citations

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  • Heating body, atomizer and electronic atomization device

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