SMD electronic component and preparation method thereof

Abstract

The embodiment of the present invention provides a chip-type electronic component and a preparation method thereof. The chip-type electronic component includes a magnetic core, a coil winding and a plurality of end electrodes. The plurality of end electrodes and the coil winding are formed by etching a conductive layer formed on the magnetic core. The coil winding includes a primary winding and a plurality of secondary windings arranged side by side on the magnetic core along the length direction of the magnetic core, and the plurality of end electrodes are respectively arranged at both ends of the magnetic core. A conductive layer is formed on the surface of the magnetic core, and the conductive layer is etched to form the coil winding and the end electrode. In this way, there is no solder joint at the connection between the end electrode and the coil winding, which effectively improves the performance consistency and reliability of the chip-type electronic component, reduces the process of winding the coil winding and assembling the coil winding with the end electrode, and improves production efficiency. In addition, the coil winding is formed by etching the conductive layer, and the coil winding is extended radially along the magnetic core to reduce the volume, which is convenient for miniaturization of the chip-type electronic component.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular provides a surface mount electronic component and a preparation method thereof. Background Art

[0002] With the continuous advancement of science and technology and the rapid development of the information industry, large-scale and ultra-large-scale integrated circuits have become the mainstream and trend of development. SMD electronic components have the characteristics of small size and high space utilization, and are suitable for surface assembly and high-density mounting. They can well meet the requirements of integrated circuits and have high practical value. At present, common-mode inductors, RF transformers, power dividers and other SMD electronic components are mainly prepared based on lamination and winding processes. Among them, electronic components prepared based on lamination have certain advantages in small size and size standardization, but cannot well meet the requirements of high inductance and high current; electronic components prepared based on winding process have the characteristics of wide inductance coverage and large working current, but product performance consistency, production efficiency and small size cannot well meet the use requirements, which hinders the widespread application and promotion of SMD electronic components. Summary of the invention

[0003] The purpose of the present invention is to provide a chip-type electronic component, aiming to solve the technical problems of large size, low production efficiency and poor performance consistency of the chip-type electronic component in the prior art.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a surface-mount electronic component is provided, including a magnetic core, a coil winding arranged on the magnetic core, and a plurality of end electrodes electrically connected to the lead ends of the coil winding, the plurality of end electrodes and the coil winding are formed by etching a conductive layer formed on the magnetic core, the coil winding includes a primary winding and a plurality of secondary windings arranged side by side on the magnetic core along the length direction of the magnetic core, and the plurality of end electrodes are respectively arranged at both ends of the magnetic core.

[0005] Optionally, the number of the secondary winding is one, and the secondary winding and the primary winding are arranged in a double-thread structure along the length direction of the magnetic core; or,

[0006] There are multiple secondary windings, and the multiple secondary windings and the primary winding are arranged side by side along the axial direction of the magnetic core.

[0007] Optionally, the magnetic core includes a base for supporting the coil winding and two support seats for carrying the base, and the two support seats are symmetrically arranged at two ends of the base.

[0008] Optionally, each of the support seats is provided with end electrodes on both sides of the end of the magnetic core, and each of the end electrodes is electrically connected to the lead-out end of the corresponding coil winding.

[0009] Optionally, the end electrode includes a first connection portion electrically connected to the lead-out end of the coil winding and a second connection portion extending from the free end of the first connection portion to the side surface of the support body, the first connection portion is arranged on the surface of the support base facing the coil winding, and the second connection portion covers the side surface of the support base facing away from the coil winding.

[0010] Optionally, the surface-mount electronic component further includes a protective layer covering the circumference of the coil winding, and chamfers are respectively provided at four corners of the protective layer.

[0011] Optionally, the electronic component further includes a shell for protecting the magnetic core, and the magnetic core is accommodated in a receiving cavity of the shell.

[0012] Optionally, the shell is formed by curing magnetic glue or plastic glue.

[0013] An object of the present invention is to provide a method for preparing a surface mount electronic component, comprising the following steps:

[0014] S1: providing a magnetic core, and covering an outer surface of the magnetic core with a conductive layer;

[0015] S2: removing excess metal on the conductive layer, leaving a conductive pattern forming a coil winding and a plurality of end electrodes on the magnetic core, wherein the coil winding includes a primary winding and a plurality of secondary windings arranged side by side on the magnetic core along the length direction of the magnetic core, and the plurality of end electrodes are respectively arranged at both ends of the magnetic core;

[0016] S3: Use curing glue to cover or encapsulate the main body of the surface-mount electronic component.

[0017] Optionally, after forming the conductive pattern, the method further includes S21:

[0018] The conductive pattern is thickened.

[0019] Beneficial effects of the present invention: Compared with the prior art, the chip-type electronic component of the present invention forms a conductive layer on the surface of the magnetic core and etches the conductive layer to form a coil winding and a plurality of end electrodes, so that the end electrodes and the coil winding are integrally formed, and there are no connection solder joints or heterogeneous connection points at the connection between the end electrodes and the coil winding, which effectively improves the performance consistency and reliability of the chip-type electronic component, reduces the process of winding the coil winding and assembling the coil winding with the end electrode, and improves production efficiency; in addition, the coil winding is etched by the conductive layer, and the coil winding is extended radially along the magnetic core to reduce the volume, thereby ensuring that the chip-type electronic component is small in size and facilitating the miniaturization of the chip-type electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 A schematic diagram of the structure of a surface mount electronic component provided by an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of the structure of the surface mount electronic component after packaging provided by an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of the structure of a SMD electronic component after packaging provided by another embodiment of the present invention;

[0024] Figure 4 A schematic diagram of a surface mount electronic component provided by an embodiment of the present invention;

[0025] Figure 5 A schematic diagram of a surface mount electronic component provided by another embodiment of the present invention;

[0026] Figure 6 An embodiment of the present invention provides a schematic flow chart of a method for preparing a surface-mount electronic component.

[0027] Among them, the main marks of the drawings in the figure are:

[0028] 1-magnetic core; 11-base; 12-support seat;

[0029] 2-coil winding; 21-primary winding; 22-secondary winding;

[0030] 3-terminal electrode; 31-first connecting portion; 32-second connecting portion;

[0031] 4-Signage plate;

[0032] 5-protective layer; 51-chamfer;

[0033] 6- Shell. DETAILED DESCRIPTION

[0034] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] Please also read Figure 1 to Figure 2, the chip-type electronic component of the embodiment of the present invention is now described. The adjustable chip-type electronic component comprises a magnetic core 1, a coil winding 2 and a plurality of end electrodes 3, wherein the coil winding 2 is arranged on the magnetic core 1, and the end electrode 3 is electrically connected to each lead-out end of the coil winding 2, so that an external current passes through the coil winding 2. Specifically, the magnetic core 1 can be composed of a soft magnetic core or a non-magnetic core, a soft magnetic core such as a ferrite core, an iron powder core, a soft magnetic powder doped polymer material core, etc., a non-magnetic core such as an alumina ceramic core, a dielectric ceramic core, and a non-magnetic polymer material. Specifically, the coil winding 2 and the plurality of end electrodes 3 are formed by etching a conductive layer (not shown) formed on the magnetic core 1. It can be understood that a conductive paste is coated on the surface of the magnetic core 1 to form a conductive layer having a certain thickness, and then excess metal material on the conductive layer is removed to form the coil winding 2 and the plurality of end electrodes 3. In this way, the end electrode 3 and the coil winding 2 are integrally formed, and there are no connection solder joints or heterogeneous connection points at the connection between the end electrode 3 and the coil winding 2, which effectively improves the performance consistency and reliability of the surface-mount electronic components, reduces the process of winding the coil winding 2 and assembling the coil winding 2 with the end electrode 3, and improves production efficiency. The coil winding 2 includes a primary winding 21 and a plurality of secondary windings 22, wherein the secondary winding 22 may be one or more, and the primary winding 21 and the secondary winding 22 are arranged side by side on the magnetic core 1 along the length direction of the magnetic core 1, and a plurality of end electrodes 3 are respectively arranged at both ends of the magnetic core 1 to reduce the volume, thereby ensuring that the volume of the chip-type electronic component is small, and facilitating the miniaturization of the chip-type electronic component.

[0039] The surface-mount electronic component of the embodiment of the present invention has such a structure compared with the prior art, by processing the conductive layer on the outer surface of the magnetic core 1, and then etching the conductive layer on the magnetic core 1 in a spiral line manner or a coil pattern, leaving a number of guide bars or windings in the spiral channel as required, and the guide bars and windings form a coil winding 2, and then etching the conductive layer at both ends of the magnetic core 1 to form an end electrode 3. It can be understood that after the coil winding 2 is completed, the end electrode 3 is etched outward along the end of the coil winding 2, so that the coil winding 2 and the end electrode 3 are formed by the same conductive The layers are integrally processed and formed, so there are no connection solder joints or heterogeneous connection points at the connection between the coil winding 2 and the end electrode 3, which effectively improves the performance consistency and reliability of the chip-type electronic components, and reduces the process of winding the coil winding 2 and assembling the coil winding 2 with the end electrode 3, thereby improving production efficiency; in addition, the coil winding 2 includes a primary winding 21 and a plurality of secondary windings 22 etched from the conductive layer, and the primary winding 21 and the plurality of secondary windings 22 extend along the radial direction of the magnetic core 1, so as to reduce the volume of the chip-type electronic component and facilitate the miniaturization of the chip-type electronic component.

[0040] Specifically, the conductive layer can be made of conductive paste, for example, silver paste, copper paste, gold paste, carbon-based composite paste, graphene-doped composite paste, carbon nanotube-doped composite paste, and can be coated on the surface of the magnetic core 1 by screen printing, directional coating, groove filling, coating technology, chemical deposition technology, physical vapor deposition technology, surface spraying technology, or a combination of mask and surface spraying technology or physical vapor deposition technology, or by using conductive paste coating technology, chemical deposition technology, physical vapor deposition technology, or surface spraying technology, so that a conductive layer is formed on the outer surface of the magnetic core 1. Of course, the conductive layer can also be made of metal powder. Specifically, firstly, a certain thickness of conductor powder is applied to the surface of the magnetic core 1, and then a surface cladding technology is used to melt and coat part of the conductor powder on the surface of the magnetic core 1 to form a conductor layer of a certain thickness. Preferably, the conductive layer is a metal layer, such as copper or aluminum.

[0041] Optionally, please also refer to Figures 1 to 5 As a specific implementation of the surface-mount electronic component of the embodiment of the present invention, the number of secondary windings 22 is one, and one secondary winding 22 and the primary winding 21 are arranged in a double-threaded structure along the length direction of the upper magnetic core 1, and the two ends of the secondary winding 22 and the primary winding 21 are respectively connected to the corresponding end electrodes 3, then the number of turns of the secondary winding 22 is the same as the number of turns of the primary winding 21, thus forming a common-mode inductor.

[0042] When there are multiple secondary windings 22, specifically, the number of the secondary windings 22 is two or three, multiple primary windings 21 are arranged side by side with the primary winding 21 along the axial direction of the magnetic core 1, wherein the turns ratio of the primary winding 21 and each secondary winding 22 can be changed to manufacture electronic components such as radio frequency transformers or power dividers. In this embodiment, the primary winding 21 and the secondary winding 22 are etched from the conductive layer, and the primary winding 21 and the secondary winding 22 are extended radially along the magnetic core 2 to reduce the volume, thereby ensuring that the volume of the chip-type electronic component is small, and facilitating the miniaturization of the chip-type electronic component.

[0043] Optionally, please also refer to Figure 1 to Figure 2 As a specific implementation of the surface-mount electronic component of an embodiment of the present invention, the magnetic core 1 includes a substrate 11 and two support seats 12, and the two support seats 12 are symmetrically arranged at both ends of the substrate 11, wherein the coil winding 2 is wound on the outer surface of the substrate 11 so that the substrate 11 supports the coil winding 2, and the support seat 12 and the substrate 11 are both rectangular structures, and the height of the substrate 11 is less than the height of the support seat 12, so that the two support seats 12 bear the weight of the substrate 11, so that the substrate 11 is suspended, so that the coil winding 2 wrapped on the substrate 11 is suspended, and then the coil winding 2 is separated from the printed circuit board when the electronic component is installed on the printed circuit board.

[0044] Optionally, please also refer to Figures 1 to 3 As a specific implementation of the surface-mount electronic component of the embodiment of the present invention, each support seat 12 is provided with a terminal electrode 3 at both ends, and each terminal electrode 3 is electrically connected to the lead-out end of the corresponding coil winding 2. In this way, by providing the terminal electrodes 3 at the two end surfaces of the support seat 12, the efficiency of identifying the terminal electrodes 3 in the automated production process of the product is effectively improved, thereby improving the production efficiency. In addition, by providing the terminal electrodes 3 at the two end surfaces of the support seat 12, that is, the two ends of the coil winding 2 have multiple output ends, so that the electronic component can output signals in multiple channels, thereby achieving electrical connection with multiple external devices at the same time.

[0045] Optionally, please also refer to Figure 1 to Figure 2 As a specific implementation of the surface-mount electronic component of the embodiment of the present invention, each terminal electrode 3 includes a first connection portion 31 and a second connection portion 32, and the second connection portion 32 extends from the first connection portion 31 to the side surface of the support base 12, wherein the first connection portion 31 is closely attached to the surface of the support base 12 facing the coil winding 2, and is electrically connected to the lead-out end of the coil winding 2, and the second connection portion 32 covers the side surface of the support base 12 away from the coil winding 2. By providing the second connection portion 32 on the terminal electrode 3, the terminal electrode 3 is electrically connected to the lead-out end of the coil winding 2, and the first connection portion 31 close to one side of the coil winding 2 directly extends to the lead-out end of the coil winding 2, thereby eliminating the length of the connection portion between the coil winding 2 and the terminal electrode 3, thereby eliminating the parasitic loss that causes the reduction of the Q value and the reduction of the inductance value, so that the electronic component and the coil winding 2 have substantially equal inductance and Q value.

[0046] Optionally, please also refer to Figures 1 to 3 As another specific implementation of the chip-type electronic component of the embodiment of the present invention, the chip-type electronic component also includes a protective layer 5, which covers the peripheral side of the coil winding 2, effectively reduces the influence of the diffuse magnetic flux, and protects the coil winding 2. The protective layer 5 can be made of magnetic glue or plastic sealing glue, so that the stress of the protective layer 5 is small and has a good buffering effect, thereby improving the vibration and impact resistance of the electronic component. Preferably, the four corners of the protective layer 5 are respectively provided with chamfers 51, so as to reduce the stress concentration at the transition of the protective layer 5 and extend the service life of the protective layer 5.

[0047] Optionally, please also refer to Figures 4 to 5As another specific implementation of the SMD electronic component of the embodiment of the present invention, the SMD electronic component also includes a shell 6, the shell 6 is used to protect the magnetic core 1, the magnetic core 1 is accommodated in the accommodating cavity of the shell 6 (not shown), wherein the depth of the accommodating cavity is less than the height of the magnetic core 1, specifically, the depth of the accommodating cavity is half of the height of the magnetic core 1, so that when the shell 6 is covered on the magnetic core 1, a part of the magnetic core 1 will be exposed to the external environment, so that while protecting the electronic component, it is also convenient for the electronic component to be attached to the printed circuit board. Preferably, the shell 6 can be solidified and formed by magnetic glue or plastic glue, wherein the use of plastic glue can protect and reinforce the main body of the electronic component, thereby effectively improving the reliability of the electronic component; the use of magnetic glue can not only improve the inductance performance index and play a role in magnetic shielding, but also protect and reinforce the main body of the electronic component, thereby effectively improving the electrical performance index, environmental adaptability and reliability of the electronic component.

[0048] Optionally, please also refer to Figure 2 and Figure 3 As a specific implementation of the chip-type electronic component of the embodiment of the present invention, the chip-type electronic component also includes an identification plate 4, which is arranged on the magnetic core 1. Specifically, the identification plate 4 is arranged on the shell 6 or the protective layer 5, and the electronic component mark can be formed on the surface of the coating or package by printing ink, spraying paint, laser etching, mechanical precision carving, etc. For example, "100 / 100" is engraved on the identification plate 4, where the two "100"s both represent the nominal inductance of 1 turn, which makes it easy to distinguish and identify electronic components with different electrical performance indicators.

[0049] In the present invention, a method for preparing a patch type electronic component is also provided, such as Figure 1 and Figure 6 Specifically, the preparation method comprises the following steps:

[0050] S1: providing a magnetic core 1, and covering the outer surface of the magnetic core 1 with a conductive layer;

[0051] Specifically, the magnetic core 1 can be made of a soft magnetic core or a non-magnetic core, wherein the soft magnetic core is such as a ferrite core, an iron powder core, a soft magnetic powder doped polymer core, etc., and the non-magnetic core is such as an alumina ceramic core, a dielectric ceramic core, a non-magnetic polymer core, etc., which are not limited here. The conductive layer covering the magnetic core 1 can be sintered by a conductive paste, such as silver paste, copper paste, gold paste, carbon-based composite paste, graphene-doped composite paste, carbon nanotube-doped composite paste, etc., and can be specifically coated on the surface of the magnetic core 1 by screen printing, directional coating, groove filling, coating technology, chemical deposition technology, physical vapor deposition technology, surface spraying technology, or a combination of mask and surface spraying technology or physical vapor deposition technology, or by using conductive paste coating technology, chemical deposition technology, physical vapor deposition technology, or surface spraying technology, so that the outer surface of the magnetic core 1 forms a conductive layer with a certain thickness. Of course, the conductive layer can also be made of metal powder. Specifically, firstly, a certain thickness of conductive powder is applied on the surface of the magnetic core 1, and then a surface cladding technology is used to melt part of the conductive powder and coat it on the surface of the magnetic core 1 to form a conductive layer of a certain thickness.

[0052] S2: removing excess metal from the conductive layer, leaving a conductive pattern forming a coil winding 2, a plurality of end electrodes 3 and the like on the magnetic core 1, wherein the coil winding 2 includes a primary winding 21 and a plurality of secondary windings 22, the primary winding 21 and the plurality of secondary windings 22 are arranged side by side along the length direction of the magnetic core 1, and the plurality of end electrodes 3 are respectively arranged at both ends of the magnetic core 1;

[0053] Specifically, high-energy beam modification etching technology or yellow light etching technology can be used to remove excess metal from the surface of the magnetic core. It can be understood that the conductive layer is etched in the form of a spiral line or a coil pattern on the magnetic core 1, leaving a number of guide bars or windings in the spiral channel as required, and the guide bars and windings form the coil winding 2. Then, the conductive layer on both ends of the magnetic core 1 is etched to form an end electrode 3. That is, after the coil winding 2 is completed, the ends of the coil winding 2 are etched outward to form a sheet-like end electrode 3 at both ends of each support seat 12, so that the coil winding 2 and the end electrode 3 is integrally formed by the same conductive layer, so there is no connection solder joint or heterogeneous connection point at the connection between the coil winding 2 and the end electrode 3, which effectively improves the performance consistency and reliability of the chip-type electronic component, and reduces the process of winding the coil winding 2 and assembling the coil winding 2 and the end electrode 3, thereby improving production efficiency; in addition, the coil winding 2 is a primary winding 21 and a plurality of secondary windings 22 formed by etching the conductive layer, and the primary winding 21 and the plurality of secondary windings 22 extend along the radial direction of the magnetic core 1, so as to reduce the volume of the chip-type electronic component and facilitate the miniaturization of the chip-type electronic component.

[0054] S3: Use curing glue to cover or encapsulate the main body of the surface-mount electronic component.

[0055] Specifically, in this embodiment, a curing glue such as a plastic sealant or a magnetic glue can be used to coat or encapsulate the main body of the electronic component, that is, a protective layer 5 or a shell 6 is formed on the outer surface of the coil winding 2 to protect the magnetic core, thereby protecting the electronic component and improving the pressure resistance and impact resistance of the electronic component. The use of plastic sealant can protect and reinforce the electronic components, thereby effectively improving the reliability of the electronic components; the use of magnetic glue can not only improve the inductance performance index and play a role in magnetic shielding, but also protect and reinforce the electronic components, thereby effectively improving the electrical performance index, environmental adaptability and reliability of the electronic components. Wherein, the coating or encapsulation is completed, and it also includes the use of printing ink, spray paint, laser etching, mechanical precision carving and other methods to form a sign 4 on the surface of the coating layer or the encapsulation layer. The sign 4 records the information such as the nominal inductance of the electronic component, which is convenient for distinguishing and identifying electronic components with different electrical performance indicators.

[0056] Optionally, a method for preparing a surface-mount electronic component further comprises S21 after forming the conductive pattern:

[0057] Thickening the conductive pattern.

[0058] Specifically, the conductive layer may be thickened by using an electrodeposition technique, that is, the diameter of each winding in the coil winding 2 and the diameter of the end electrode 3 may be increased to reduce the resistance of the coil winding 2 and improve the electrical performance index.

[0059] In the present invention, the conductive layer is processed on the outer surface of the magnetic core 1, and then the conductive layer is etched on the substrate 11 in a spiral line or coil pattern, leaving a number of guide bars or windings in the spiral channel as required, and the guide bars and windings form the coil winding 2, and then the conductive layer on each support seat 12 is etched to form the end electrode 3. It can be understood that after the coil winding 2 is completed, the conductive layer on the two ends of each magnetic core 1 is etched outward along the end of the coil winding 2 to form the end electrode 3, so that the coil winding 2 and the end electrode 3 are integrally formed by the same conductive layer. After processing and forming, there are no connection solder joints or heterogeneous connection points at the connection between the coil winding 2 and the end electrode 3, which effectively improves the performance consistency and reliability of the chip-type electronic components, and reduces the process of winding the coil winding 2 and assembling the coil winding 2 with the end electrode 3, thereby improving production efficiency; in addition, the coil winding 2 includes a primary winding 21 and a plurality of secondary windings 22 formed by etching a conductive layer, and the primary winding 21 and the plurality of secondary windings 22 extend along the radial direction of the magnetic core 1, so as to reduce the volume of the chip-type electronic component and facilitate the miniaturization of the chip-type electronic component.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A surface-mount electronic component, comprising a magnetic core, a coil winding arranged on the magnetic core, and a plurality of terminal electrodes electrically connected to each lead-out end of the coil winding, characterized in that: The plurality of end electrodes and the coil windings are formed by etching the same conductive layer formed on the magnetic core, the coil windings include a primary winding and a plurality of secondary windings arranged side by side on the magnetic core along the axial direction of the magnetic core, and the plurality of end electrodes are respectively arranged at both ends of the magnetic core; the conductive layer is made of conductive paste, the conductive paste is coated on the surface of the magnetic core by conductive paste coating technology or chemical deposition technology or physical vapor deposition technology, and the conductive paste is silver paste, copper paste or gold paste; The magnetic core comprises a base for supporting the coil winding and two support seats for carrying the base, the two support seats are symmetrically arranged at two ends of the base, wherein the coil winding is wound on the outer surface of the base, and the height of the base is less than the height of the support seats; The end electrode comprises a first connection portion electrically connected to the lead-out end of the coil winding and a second connection portion extending from the first connection portion to the side surface of the support base; the first connection portion is closely attached to the surface of the support base facing the coil winding, and the second connection portion covers the side surface of the support base facing away from the coil winding; The surface-mount electronic component also includes a protective layer covering the circumference of the coil winding, and chamfers are respectively arranged at the four corners of the protective layer; the protective layer is formed by curing magnetic glue or plastic sealing glue.

2. A method for preparing the surface mount electronic component according to claim 1, characterized in that: The steps include: S1: providing a magnetic core, and covering an outer surface of the magnetic core with a conductive layer; S2: using yellow light etching technology to remove excess metal on the conductive layer, leaving conductive patterns forming coil windings and a plurality of end electrodes on the magnetic core; S3: Use curing glue to cover or encapsulate the main body of the surface-mount electronic component to form a protective layer on the outer surface of the coil winding.

3. The method for preparing a surface mount electronic component according to claim 2, characterized in that: After forming the conductive pattern, the method further includes S21: The conductive pattern is thickened.

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