A chip inserting device and chip inserting method for large-size silicon chips

Abstract

The present invention discloses a wafer insertion device and a wafer insertion method for large-size silicon wafers. The wafer insertion device comprises a first transmission device, a placement device equipped with silicon wafers, a rotating suction cup, and a wafer basket. The wafer basket is provided with a vertical slot with an upward opening for vertical insertion of the silicon wafer on the rotating suction cup. The silicon wafers in the placement device are moved to the first transmission device one by one. The rotating suction cup absorbs the silicon wafer on the first transmission device and drives the silicon wafer to rotate. When the silicon wafer rotates to a vertical state, it is vertically inserted into the slot of the wafer basket, thereby realizing vertical wafer insertion. The middle part of the silicon wafer will not bend downward and deform, thereby not only avoiding the occurrence of two adjacent silicon wafers sticking to each other, but also avoiding the breakage caused by the deformation of the middle of the silicon wafer.

Description

Technical Field

[0001] The present invention relates to the field of silicon wafer processing, and in particular to a wafer inserting device and a wafer inserting method for large-size silicon wafers. Background Art

[0002] Silicon rods are cut into silicon wafers, and the cut silicon wafers go through several processes such as degumming, inserting, cleaning, and inspection to produce qualified silicon wafers. In the current inserting process, the inserting method adopted is horizontal inserting, that is, the inserting device includes a transmission device 10, and the clip 30 containing the silicon wafers 10 and the wafer basket 40 to be loaded with silicon wafers are respectively placed on both sides of the transmission device 10, and the slots of the wafer basket are horizontally facing the transmission device, that is, the slots are arranged horizontally, and the silicon wafers in the clip are moved to the transmission device piece by piece by water pressure, and then inserted into the slots of the wafer basket piece by piece as the transmission device is conveyed (such as Figure 1 As shown in the figure, a silicon wafer is inserted, and the wafer basket rises a certain distance so that the next slot faces the transmission device, until all the slots of the wafer basket are inserted with silicon wafers, so that the silicon wafers in the wafer basket are all arranged horizontally.

[0003] The above-mentioned horizontal insertion method is suitable for small-sized silicon wafers, because water is carried on the surface of the silicon wafer during the insertion process, which increases the weight of the silicon wafer, and the silicon wafers are arranged horizontally, so the middle of the silicon wafer will bend downward and deform, so that the two adjacent silicon wafers above and below can easily stick together, that is, sticking occurs. This will not only cause watermarks and dirt to appear on the bonding parts of the cleaned silicon wafers, but also as the size of the silicon wafer increases and the thickness of the wafer becomes thinner, the deformation of the silicon wafer itself will further increase, making it easier for the two adjacent silicon wafers above and below to stick together, and excessive deformation can easily cause the silicon wafer to break. Summary of the invention

[0004] The object of the present invention is to provide a wafer inserting device and a wafer inserting method for large-sized silicon wafers, which can prevent the large-sized silicon wafers from sticking and breaking during the wafer inserting process.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is:

[0006] A wafer inserting device for large-size silicon wafers, comprising a first transmission device for transmitting the silicon wafers, a placement device containing silicon wafers, wherein the silicon wafers in the placement device can be moved to the first transmission device, and the wafer inserting device further comprises

[0007] A rotating suction cup, which can absorb the silicon wafer on the first transmission device and drive the silicon wafer to rotate;

[0008] The wafer basket is provided with a vertical slot opening upward for vertically inserting the silicon wafer on the rotating suction cup.

[0009] The placing device and the rotating suction cup are respectively arranged at two ends of the first transmission device. The first transmission device drives the silicon wafer to move toward the rotating suction cup. The wafer basket is placed under the rotating suction cup.

[0010] The wafer insertion device further includes a second transmission device placed under the rotating suction cup, and the wafer basket is placed on the second transmission device. When a silicon wafer adsorbed by the rotating suction cup is inserted into one of the slots of the wafer basket, the second transmission device drives the wafer basket to move so that the adjacent empty slot moves to the corresponding position for the next silicon wafer adsorbed by the rotating suction cup to be vertically inserted.

[0011] The rotating suction cup includes a rotating shaft that can rotate around the Z axis, one or more suction cup devices connected to the rotating shaft at intervals in the circumferential direction, the suction cup device includes a connecting piece with one end connected to the circumferential direction of the rotating shaft, one or more vacuum suction cups arranged on the connecting piece, and each of the suction cup devices is connected to a corresponding vacuum generator.

[0012] The distance between one end of the first transport device facing the rotating shaft and the rotating shaft is not less than the length of the connecting member.

[0013] The suction cup is arranged on the upper side of the connecting member, and the rotating suction cup rotates counterclockwise; or, the suction cup is arranged on the lower side of the connecting member, and the rotating suction cup rotates clockwise.

[0014] A method for inserting silicon wafers using the inserting device, wherein the rotating suction cup absorbs the silicon wafer transmitted by the first transmission device and drives the silicon wafer to rotate, and when the silicon wafer rotates to be vertically aligned with an empty slot in the wafer basket, the silicon wafer is vertically inserted into the empty slot.

[0015] The silicon wafers in the placement device are moved one by one to the first transmission device, and the first transmission device drives the silicon wafer to move toward the rotating suction cup. The rotating suction cup absorbs the silicon wafer on the first transmission device and drives the silicon wafer to rotate. When the silicon wafer is vertically aligned with the empty slot corresponding to the wafer basket, the rotating suction cup releases the absorption of the silicon wafer, and the silicon wafer is vertically inserted into the empty slot.

[0016] When the silicon wafer adsorbed on one of the suction cup devices of the rotating suction cup is inserted into one of the slots of the wafer basket, the suction cup device at another corresponding position on the rotating suction cup adsorbs a silicon wafer on the first transmission device at the same time.

[0017] After a silicon wafer adsorbed by the rotating suction cup is inserted into one of the empty slots of the wafer basket, the wafer basket moves driven by a second transmission device. When the silicon wafer adsorbed by the next rotating suction cup is in a vertical state as the rotating suction cup rotates, the adjacent empty slot on the wafer basket also moves to be vertically aligned with the silicon wafer in the vertical position.

[0018] The beneficial effects of the present invention are:

[0019] 1. The inserting device and inserting method of the present invention realizes the vertical inserting of silicon wafers. The silicon wafers inserted into the slots of the wafer basket are placed vertically. Thus, the middle of the silicon wafer will not bend downward and deform, thereby avoiding the occurrence of the sticking of two adjacent silicon wafers and the breakage caused by the deformation of the middle of the silicon wafer.

[0020] 2. Before the silicon wafer is inserted into the wafer basket, it rotates with the suction cup. During the rotation of the suction cup, most of the water attached to the silicon wafer flows down, so that there is little or no water on the silicon wafer. This further ensures that the silicon wafer will not stick or break due to deformation in the middle after vertical insertion. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the traditional horizontal insertion method;

[0022] Figure 2 A schematic diagram of one embodiment of a wafer inserting device for large-sized silicon wafers according to the present invention;

[0023] Figure 3 It is an enlarged schematic diagram of the rotating suction cup of the wafer inserting device of the present invention when a silicon wafer is sucked thereon;

[0024] Figure 4 It is an enlarged schematic diagram of one of the suction cup devices and the rotating shaft of the inserting device of the present invention;

[0025] Figure 5 FIG. 4 is a schematic diagram of another embodiment of the inserting device of the present invention. Specific implementation methods

[0026] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings.

[0027] like Figure 2 As shown, the present invention discloses a wafer inserting device for large-size silicon wafers, which includes a first transmission device 2 for transmitting the silicon wafer 1, and a placement device 3 for placing the silicon wafer 1. The silicon wafer 1 in the placement device 3 can be moved to the first transmission device 2. The wafer inserting device also includes

[0028] A rotating suction cup 4, which can absorb the silicon wafer 1 on the first transmission device 2 and drive the silicon wafer 1 to rotate around the Z axis;

[0029] The wafer basket 5 is provided with an upwardly opening vertical slot 51 for vertically inserting the silicon wafer 1 on the rotating suction cup 4 .

[0030] In this embodiment, preferably, the placing device 3 and the rotating suction cup 4 are respectively arranged at two ends of the first transmission device 2, and the first transmission device 2 drives the silicon wafer 1 to move toward the rotating suction cup 4, and the wafer basket 5 is placed under the rotating suction cup 4.

[0031] The inserting device for large-size silicon wafers 1 also includes a second transmission device 6 placed under the rotating suction cup 4, and the wafer basket 5 is placed on the second transmission device 6. When a silicon wafer 1 adsorbed by the rotating suction cup 4 is inserted into one of the slots 51 of the wafer basket 5, the second transmission device 6 drives the wafer basket 5 to move so that the adjacent empty slot 51 moves to the corresponding position for the next silicon wafer 1 adsorbed by the rotating suction cup 4 to be vertically inserted.

[0032] Preferably, the first transmission device 2 is arranged horizontally, so as to drive the silicon wafer 1 to move horizontally toward the rotating suction cup 4 .

[0033] Preferably, the sheet basket 5 is also placed horizontally, thereby further ensuring the vertical arrangement of the slot 51 .

[0034] Preferably, the second transmission device 6 is also arranged horizontally, so as to drive the sheet basket 5 to move horizontally.

[0035] Combination Figure 3 , 4 As shown, the rotating suction cup 4 includes a rotating shaft 41 that can rotate around the Z axis, one or more suction cup devices 42 arranged at intervals along the circumference of the rotating shaft 41, and the suction cup device 42 includes a connecting piece 421 connected to the circumference of the rotating shaft 41 at one end, and one or more vacuum suction cups 422 arranged on the connecting piece 421, and each of the suction cup devices 42 is correspondingly connected to a vacuum generator (not shown in the figure). That is, the vacuum suction cup 422 on a suction cup device 42 is connected to a vacuum generator through a pipeline, and the vacuum suction cup 422 of another suction cup device 42 is connected to another vacuum generator through a pipeline, and one vacuum generator controls one suction cup device 42.

[0036] With such an arrangement, the suction cup devices 42 at different positions can perform different actions according to actual conditions. Specifically, during operation, one suction cup device 42 adsorbs the silicon wafer 1 on the first transmission device 2 under the control of the corresponding vacuum generator; at the same time, the other suction cup device 42 releases the adsorption of the silicon wafer 1 under the control of the corresponding vacuum generator, so that the silicon wafer 1 is vertically inserted into the slot 51 of the wafer basket 5; at the same time, the other suction cup devices 42 keep adsorbing the silicon wafer 1 thereon under the control of the corresponding vacuum generator; and at this time, there are still some suction cup devices 42 without the silicon wafer 1, and under the control of the corresponding vacuum generator, the air pressure in the suction cups thereon keeps zero pressure or slightly positive pressure.

[0037] In addition, such a configuration can also synchronize the states of all vacuum suction cups 422 on each suction cup device 42, so that all suction cups on a connecting member 421 can simultaneously adsorb or detach from the silicon wafer 1, thus ensuring smooth adsorption and detachment of each silicon wafer 1.

[0038] All vacuum suction cups 422 on each suction cup device 42 can be connected to a vacuum generator through a pipeline respectively; or, the connecting piece 421 of each suction cup device 42 is provided with an internal cavity, and the internal cavity is connected to a vacuum generator through a pipeline, and each suction cup on the connecting piece 421 is connected to the internal cavity of the connecting piece. In this way, the internal cavity is evacuated or inflated by the vacuum generator, so that the suction cup can adsorb the silicon wafer 1 and release the adsorption of the silicon wafer 1.

[0039] Preferably, a plurality of vacuum suction cups 422 are arranged at intervals on each of the connecting members 421, so that the force on the silicon wafer 1 during adsorption can be ensured to be uniform, and when the suction cup device 42 rotates, the silicon wafer 1 adsorbed thereon will not be damaged. In this embodiment, six vacuum suction cups 422 are arranged on each connecting member 421, and the six vacuum suction cups 422 are arranged in 2 rows × 3 columns. In other embodiments, different numbers of vacuum suction cups 422 can also be arranged on each connection according to actual conditions.

[0040] Preferably, a plurality of the suction cup devices are arranged in an annular array in the circumferential direction of the rotating shaft 41 .

[0041] In this embodiment, the connecting member 421 includes a connecting rod 4211 connected to the rotating shaft 41 and a connecting plate 4222 connected to the end of the connecting rod 4211 away from the rotating shaft 41, and the suction cup is connected to the connecting plate 4222. If the connecting member 421 is in the form of an internal cavity, the internal cavity is set in the connecting plate 4222. In other embodiments, the connecting member 421 can be a direct plate state.

[0042] The connection method of the connecting plate 4222, the vacuum suction cup 422, the pipeline, and the vacuum generator can adopt any known and feasible structure.

[0043] The connecting member 421 can be integrally formed with the rotating shaft 41, or connected by other means, such as providing a latch hole on the rotating shaft 41, and providing an elastic finger-shaped latch at one end of the connecting member 421, which is latched into the latch hole and buckled on the inner wall of the latch hole to achieve the connection between the connecting member 421 and the rotating shaft 41.

[0044] The rotating shaft 41 may be connected to an output shaft of a motor, and the rotation and pause of the rotating shaft 41 may be controlled by the motor.

[0045] The inserting device further includes a bracket, and the placing device 3, the first transport device, the second transport device, and the rotating suction cup 4 are all connected to the large bracket. The specific structure of the large bracket is not limited, as long as it can realize the connection function and does not interfere with the movement of the placing device, the first transport device, the second transport device, and the rotating suction cup 4. Those skilled in the art can design a specific bracket structure based on the above description.

[0046] The placing device 3 containing the silicon wafers 1 is configured as a well-known clip, or it can be other well-known and feasible devices; the wafer basket 5 can be a well-known and feasible structure, but it is changed from the original traditional vertical placement to a horizontal placement, so that the slot 51 also presents a vertical setting with an upward opening; the silicon wafers 1 in the clip can be moved one by one to the first transmission device 2 through hydraulic separation, so the first and second transmission devices 6 can also be any well-known and feasible structures, such as conveyor belts and other similar mechanisms, and these are not the focus of the present invention, so they will not be described in detail here.

[0047] The working principle of the inserting device is as follows:

[0048] The silicon wafer 1 in the clip is moved piece by piece to the first transmission device 2 by hydraulic separation. With the transmission of the first transmission device 2, the silicon wafer 1 moves toward the rotating suction cup 4. When the silicon wafer 1 extends out of the first transmission device 2 by a certain distance toward the side of the rotating suction cup 4, one of the suction cup devices 42 just rotates to the bottom of the silicon wafer 1. At this time, the rotating suction cup 4 stops rotating, and the vacuum generator sucks, so that negative air pressure is generated in the suction cup on the suction cup device 42, so that the suction cup sucks the silicon wafer 1 and rotates with the silicon wafer 1. When the suction cup device 42 rotates to a certain position, the silicon wafer 1 is in a vertical state and is vertically aligned with one of the empty slots 51 of the wafer basket 5. At this time, the rotating suction cup 4 stops rotating again, and the vacuum generator works to steadily inflate the suction cup of the suction cup device 42, so that the negative air pressure in the suction cup becomes zero air pressure or slightly positive air pressure, the suction cup is separated from the silicon wafer 1, and the silicon wafer 1 is vertically inserted into the corresponding slot 51.

[0049] Preferably, after a suction cup device 42 absorbs and rotates a silicon wafer 1 on the first transmission device 2, the next silicon wafer 1 on the first transmission device 2 continues to move toward the wafer basket 5, and the next suction cup device 42 also rotates upward. When the next silicon wafer 1 moves to the side facing the rotating suction cup 4 and extends a certain distance outside the first transmission device 2, the next suction cup device 42 also rotates just below the next silicon wafer 1 and absorbs the silicon wafer 1. In this way, multiple suction cup devices 42 absorb silicon wafers 1 one by one. When the rotating suction cup 4 rotates to a certain angle, the first silicon wafer 1 absorbed is vertically aligned with one of the slots 51 of the wafer basket 5. After the silicon wafer 1 is vertically inserted into the slot 51, the rotation of the suction cup 4 continues, and the second transmission device 6 moves horizontally to drive the wafer basket 5 to move horizontally; when the rotating suction cup 4 rotates to a certain angle, the second silicon wafer 1 absorbed is also vertically aligned with the slot 51 adjacent to the previous slot 51; at this time, the second transmission device 6 stops rotating for the silicon wafer 1 to be inserted into the aligned slot 51.

[0050] Because the rotating suction cup 4 has to stop rotating when sucking the silicon wafer 1, and also has to stop rotating when the silicon wafer 1 is inserted into the wafer basket 5, in order to reduce the pause time of the rotating suction cup 4, preferably, when the silicon wafer 1 sucked on one of the suction cup devices 42 of the rotating suction cup 4 is inserted into one of the slots 51 of the wafer basket 5, the suction cup device 42 at another corresponding position on the rotating suction cup 4 simultaneously sucks a silicon wafer 1 on the first transmission device 2. That is to say, the rotating suction cup 4 pauses once, and the sucked silicon wafer 1 can be inserted and the new silicon wafer 1 can be sucked at the same time, thus greatly improving the efficiency of inserting wafers.

[0051] In this embodiment, the vacuum suction cup 422 is arranged on the upper side of the connecting member 421, and the rotating suction cup 4 rotates counterclockwise; in other embodiments, the vacuum suction cup 422' may be arranged on the lower side of the connecting member 421', and the rotating suction cup 4' may rotate clockwise (such as Figure 5 shown).

[0052] The distance between the end of the first transport device facing the rotating shaft 41 and the rotating shaft 41 is not less than the length of the connecting member 421 , so that interference between the rotating suction cup 4 and the first transport device is avoided when the rotating suction cup 4 rotates.

[0053] In another embodiment (not shown), the rotating suction cup 4 can not only rotate around the Z axis, but also move relative to the first transport device 2, so that the rotating suction cup 4 can be relatively close to or away from the first transport device 2. Under this setting, the distance between the end of the first transport device facing the rotating shaft 41 and the rotating shaft 41 is not limited. The rotating suction cup 4 is close to the first transport device. When the two adjacent suction cup devices 42 clamp the first transport device toward the side of the rotating suction cup 4, one of the suction cup devices 42 absorbs a silicon wafer 1 on the first transport device, and then the rotating suction cup 4 moves to the side of the original first transport device. When the connecting member 421 rotates and no longer interferes with the first transport device, the rotating suction cup 4 rotates to vertically insert the absorbed silicon wafer 1 into the wafer basket 5.

[0054] The present invention also discloses a method for inserting a large-size silicon wafer 1, which comprises: a slot 51 of a wafer basket 5 is vertically arranged and opens upward, a rotating suction cup absorbs the transferred silicon wafer and drives the silicon wafer to rotate, and when the silicon wafer rotates to be vertically aligned with an empty slot in the wafer basket, the silicon wafer is vertically inserted into the empty slot.

[0055] Furthermore, the silicon wafers 1 in the placement device 3 are moved one by one to the first transmission device 2, and the first transmission device 2 drives the silicon wafer 1 to move toward the rotating suction cup 4, and the rotating suction cup 4 absorbs the silicon wafer 1 on the first transmission device 2 and drives the silicon wafer 1 to rotate around the Z axis. When the silicon wafer 1 is vertically aligned with the empty slot 51 corresponding to the wafer basket 5, the rotating suction cup 4 releases the absorption of the silicon wafer 1, and the silicon wafer 1 is vertically inserted into the empty slot 51. When the rotating suction cup 4 absorbs the silicon wafer 1 and the silicon wafer 1 is inserted into the wafer basket 5, the rotating suction cup 4 stops rotating.

[0056] When the silicon wafer 1 sucked on one of the sucker devices 42 of the rotating sucker 4 is inserted into one of the slots 51 of the wafer basket 5, the sucker device 42 at another corresponding position on the rotating sucker 4 simultaneously sucks a silicon wafer 1 on the first transmission device 2. In this way, the efficiency of inserting wafers is improved.

[0057] Preferably, after a silicon wafer 1 sucked by the rotating suction cup 4 is inserted into one of the empty slots 51 of the wafer basket 5, the wafer basket 5 is moved driven by a second transmission device 6. When the next silicon wafer 1 is in a vertical state as the rotating suction cup 4 rotates, the adjacent empty slot 51 on the wafer basket 5 is also moved to be vertically aligned with the silicon wafer 1 in the vertical state.

[0058] The inserting device and inserting method are used in the inserting process after the silicon wafer 1 is debonded. That is, the processing process of the silicon wafer 1 includes debonding, inserting, cleaning, etc., and the inserting device and inserting method are used in the inserting process after the debonding.

[0059] The description of the above embodiments is only used to help understand the technical solution and core ideas of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made to the present invention without departing from the principles of the present invention. These improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A wafer inserting device for large-size silicon wafers, comprising a first transmission device for transmitting the silicon wafers, and a placement device containing silicon wafers, wherein the silicon wafers in the placement device can be moved to the first transmission device, characterized in that: The inserting device also includes: A rotating suction cup, comprising a rotating shaft rotatable around the Z axis, and a plurality of suction cup devices connected to the rotating shaft at intervals in the circumferential direction, each of the suction cups can absorb the silicon wafer on the first transmission device and drive the silicon wafer to rotate around the Z axis; A wafer basket is provided with a vertical slot opening upward for vertically inserting the silicon wafer on the rotating suction cup; The placing device and the rotating suction cup are respectively arranged at two ends of the first transmission device, the first transmission device drives the silicon wafer to move toward the rotating suction cup, and the wafer basket is placed under the rotating suction cup; When the side of the silicon wafer facing the rotating suction cup extends out of the first transmission device by a certain distance, one of the suction cup devices just rotates to the bottom of the silicon wafer; at this time, the rotating suction cup stops rotating, and the suction cup sucks the silicon wafer and rotates with the silicon wafer; after a suction cup device sucks and rotates a silicon wafer on the first transmission device, the next silicon wafer on the first transmission device continues to move toward the wafer basket, and the next suction cup device also rotates upward, and when the next silicon wafer moves to the side of the silicon wafer facing the rotating suction cup extending out of the first transmission device by a certain distance, the next suction cup device also rotates to the bottom of the next silicon wafer and sucks the silicon wafer; thus, multiple suction cup devices suck the silicon wafers one by one, and when the rotating suction cup rotates When it turns to a certain angle, the first silicon wafer to be adsorbed is vertically aligned with one of the slots of the wafer basket, the negative air pressure in the suction cup becomes zero pressure or slightly positive air pressure, the suction cup is separated from the silicon wafer, and the silicon wafer is vertically inserted into the corresponding slot. When the silicon wafer is inserted into one of the slots of the wafer basket, the suction cup device at another corresponding position on the rotating suction cup simultaneously adsorbs a silicon wafer on the first transmission device; and after the silicon wafer is vertically inserted into the slot, the rotating suction cup continues to rotate, and the wafer basket moves horizontally; when the rotating suction cup rotates to a certain angle, the second silicon wafer to be adsorbed is also vertically aligned with the slot adjacent to the previous slot, and at this time the second transmission device stops rotating for the silicon wafer to be inserted into the aligned slot.

2. The wafer inserting device for large-size silicon wafers according to claim 1, characterized in that: It further includes a second transmission device placed under the rotating suction cup, and the wafer basket is placed on the second transmission device. When a silicon wafer adsorbed by the rotating suction cup is inserted into one of the slots of the wafer basket, the second transmission device drives the wafer basket to move so that the adjacent empty slot moves to the corresponding position for the next silicon wafer adsorbed by the rotating suction cup to be vertically inserted.

3. The wafer inserting device for large-size silicon wafers according to claim 1 or 2, characterized in that: The suction cup device comprises a connecting piece with one end connected to the circumference of the rotating shaft, one or more vacuum suction cups arranged on the connecting piece, and each of the suction cup devices is correspondingly connected to a vacuum generator.

4. The wafer inserting device for large-size silicon wafers according to claim 3, characterized in that: The distance between one end of the first transport device facing the rotating shaft and the rotating shaft is not less than the length of the connecting member.

5. The wafer inserting device for large-size silicon wafers according to claim 4, characterized in that: The suction cup is arranged on the upper side of the connecting member, and the rotating suction cup rotates counterclockwise; or, the suction cup is arranged on the lower side of the connecting member, and the rotating suction cup rotates clockwise.

6. A method for inserting silicon wafers using the inserting device described in any one of claims 1 to 5, characterized in that: the silicon wafers to be inserted are moved one by one onto the first transmission device, and the first transmission device drives the silicon wafers to move toward the rotating suction cup; the rotating suction cup absorbs the silicon wafer transmitted by the first transmission device and drives the silicon wafer to rotate around the Z axis, and when the silicon wafer rotates to be vertically aligned with one of the empty slots in the wafer basket, the silicon wafer is vertically inserted into the empty slot; when the silicon wafer absorbed on one of the suction cup devices of the rotating suction cup is inserted into one of the empty slots of the wafer basket, the suction cup device at another corresponding position on the rotating suction cup simultaneously absorbs a silicon wafer on the first transmission device.

7. The inserting method according to claim 6, characterized in that: When the silicon wafer is vertically aligned with the empty slot corresponding to the wafer basket, the rotating suction cup releases the suction of the silicon wafer and the silicon wafer is vertically inserted into the empty slot. When the rotating suction cup sucks the silicon wafer and the silicon wafer is inserted into the wafer basket, the rotating suction cup stops rotating.

8. The inserting method according to claim 6 or 7, characterized in that: After a silicon wafer adsorbed by the rotating suction cup is inserted into one of the empty slots of the wafer basket, the wafer basket is moved driven by a second transmission device. When the silicon wafer adsorbed by the next rotating suction cup is in a vertical state as the rotating suction cup rotates, the adjacent empty slot on the wafer basket is also moved to be vertically aligned with the silicon wafer in the vertical state.

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