Production system for encapsulated metal housing relays

Abstract

The invention relates to a manufacturing system for an encapsulated metal shell relay, comprising a metal shell relay having a shell (34) in which an electrical module is installed in an inner cavity, a graphite plate (61) is arranged on the shell (34), a groove (62) is processed on the graphite plate (61), a ceramic insulator (63) is placed in parallel in the groove (62), a 4J42 nickel-plated cover plate (65) located above the ceramic insulator (63) is arranged on the graphite plate (61), a Ag72Cu28 solder (64) with a diameter of 2.7 mm is placed above the ceramic insulator (63), a 4J42 nickel-plated cover (65) located above the Ag72Cu28 solder (64) is placed above the graphite plate (61), and a bent molybdenum sheet (66) is arranged between the 4J42 nickel-plated cover (65) and the graphite plate (61). The invention has a reasonable design, a compact structure and is easy to use.

Description

Technical Field

[0001] The invention relates to a manufacturing system for encapsulating a metal shell relay. Background Art

[0002] At present, ceramic insulators for relay packaging are the most important components of ceramic metal packaging shells and are widely used in the field of optoelectronic communications. The side of the ceramic insulator for relay packaging needs to have a metallization layer, that is, a layer of metal film that is firmly bonded to the ceramic but not easily melted is added on its side, so that the ceramic insulator and the metal parts can be welded together with high-temperature solder here. The quality of the metallization of the ceramic insulator depends on the quality of the ceramic itself and the metallization process. The factors affecting the quality of the metallization in the metallization process are mainly the thickness of the metallization layer, its uniformity, the sintering method, etc. If the ceramic metallization layer is not firm, when the metal-ceramic shell is sintered, it will cause the shell to have poor air tightness, and the insulation and withstand voltage will not meet the serious consequences of the use conditions. In the prior art, there is no specific method for testing the firmness of the metallization layer of the ceramic insulator. The metallization layer of the ceramic insulator cannot be batch-tested for firmness before use, and the products produced are at risk of failure.

[0003] Ag72Cu28 solder is the most commonly used solder on relay packaging shells. It has a low melting point and good fluidity, and the weld formed has good thermal and electrical conductivity. In the brazing process of relay packaging shells, the fluidity of silver-copper solder has an important impact on the appearance, airtightness, reliability, etc. of the device.

[0004] Under the same soldering system, the silver-copper solder dispersion is properly controlled and the solder is spread evenly, which can achieve a smooth and tight bonding interface, ensure airtightness during bonding, and achieve high reliability. Excessive dispersion of the silver-copper solder and excessive solder spreading area will cause a cold solder joint at the bonding interface, affecting airtightness and reliability, and affecting the bonding strength and appearance of the coating after the shell is plated. If the solder disperses to the end of the tube leg, it will affect the bonding performance of the tube leg, etc. The present invention can solve the problem that the solder dispersion is too large during silver-copper solder brazing, which affects the performance, quality, reliability and appearance of the relay package shell.

[0005] At present, most of the high-power three-phase solid-state relays produced by domestic and foreign manufacturers are plastic-sealed. Since plastic is formed by vulcanization, it will produce a draft angle. In order to improve the strength, the wall thickness is large, and the size is about 105mm×75mm×35mm. In addition, the use environment is limited. If the wall thickness is reduced, the shell of the electrical component will be greatly reduced. In addition, its heat dissipation is poor, static electricity is easily accumulated, and the shell is easily oxidized, which seriously damages the electrical components.

[0006] At present, electronic packaging metal shells are widely used in various military and civilian fields such as aviation, aerospace, ships, radars, missiles, weapons, instruments, communications, etc. Due to the limitations of surface treatment materials and process technology, after completing the surface treatment process, the pin length of most metal shells needs to meet technical requirements and the surface must be free of damage. In addition, the shape and structure of the shells are different. When some models of electronic packaging metal shells are mass-produced, the previous cutting device cannot meet the production schedule and process requirements, which brings inefficiency to production.

[0007] The existing common cutters are slow to cut, unsafe, inefficient, and prone to producing defective products, which cannot guarantee the stability and reliability of product quality. In the past, cutting devices were all cut manually with common cutters, which were slow and easy to fatigue. The safety of the cutters was also poor. Once the product was shaken during cutting, it might cause damage to the surface of the product, and defective products were prone to appear, which led to low efficiency of the production process and could not meet the production schedule and process requirements of the metal shell. Summary of the invention

[0008] The technical problem to be solved by the present invention is generally to provide a system for manufacturing a metal-encapsulated relay. The present invention provides a specific and operable inspection method for inspecting the firmness of the metallized layer of the ceramic insulator used in the current metal-ceramic housing.

[0009] To solve the above problems, the technical solution adopted by the present invention is:

[0010] A system for manufacturing a packaged metal shell relay comprises a metal shell relay in which a shell of an electrical module is installed in an inner cavity, a graphite plate is arranged on the shell, a groove is processed on the graphite plate, ceramic insulators are placed in parallel in the groove, a 4J42 nickel-plated cover plate is arranged on the graphite plate and is located above the ceramic insulator, Ag72Cu28 solder with a diameter of 2.7 mm is placed above the ceramic insulator, a 4J42 nickel-plated cover is placed above the Ag72Cu28 solder above the graphite plate, and a bent molybdenum sheet is arranged between the 4J42 nickel-plated cover and the graphite plate.

[0011] As a further improvement of the above technical solution:

[0012] The molybdenum sheet is a trapezoidal structure with an open upper end. The lower bottom plate of the molybdenum sheet contacts the lower surface of the graphite plate. The upper corners of the two beveled edges of the molybdenum sheet are provided with lower elbows for pressure contact with the two sides of the upper surface of the 4J42 nickel-plated cover.

[0013] An oxide film is provided on the housing, the cover or the pins.

[0014] The metal shell relay comprises a cover plate sealed and buckled on the shell, a process through hole is arranged on the cover plate, a bottom welding bracket with mesh holes which is sealed and welded on the inner side wall of the cover plate and is located directly below the process through hole, an upper gap-adjusting diaphragm arranged on the bottom welding bracket and located below the process through hole, a water-isolating membrane located in the process through hole and above the upper gap-adjusting diaphragm, an upper pressure grid mounted on the cover plate by bolts, and a gap-adjusting diaphragm arranged between the upper pressure grid and the upper gap-adjusting diaphragm and having the same structure as the upper gap-adjusting diaphragm; the sum of the thicknesses of the upper gap-adjusting diaphragm, the water-isolating membrane and the gap-adjusting diaphragm is greater than the depth of the process through hole; and the membrane pore diameter of the water-isolating membrane is smaller than the diameter of a water molecule;

[0015] The thickness of the upper gap-adjusting diaphragm, the water-isolating membrane and the gap-adjusting diaphragm are selected according to the depth of the process through hole; the upper pressure grid is externally connected to a filter, and the filter is externally connected to a filter.

[0016] The shell and cover are electroplated or sprayed with corresponding anti-corrosion layers according to working conditions;

[0017] A U-shaped inlet is arranged at the four corners of the bottom plate of the housing, and a process expansion opening on both sides with a width greater than that of the U-shaped inlet is arranged inside the U-shaped inlet; the U-shaped inlet and the process expansion opening on both sides form a mushroom-shaped gap, and injection-molded gaskets for connecting bolts are thermoformed on the inner side walls and upper and lower surfaces of the expansion opening on both sides of the process;

[0018] The electrical module includes mutually electrically connected printed boards arranged on the bottom plate of the inner cavity of the housing; a power component is welded or inserted on one side of the printed board, and a copper-clad area is provided on the other side of the printed board;

[0019] The power assembly includes an isolation input module, a zero-crossing detection module, and an output circuit module which are electrically connected in sequence;

[0020] The input circuit of the isolated input module uses a constant current source control method, and the input voltage range is 6VDC-32VDC;

[0021] The zero-crossing detection module uses an optical coupler;

[0022] The output circuit module as power output includes a plurality of anti-parallel unidirectional thyristors, and an RC absorption loop is electrically connected at both ends of the unidirectional thyristors.

[0023] The invention has reasonable design, low cost, strong durability, safety and reliability, simple operation, time and labor saving, money saving, compact structure and convenient use. The invention effectively controls the diffusivity of silver-copper solder brazing while ensuring the brazing effect, thereby improving the brazing performance and product reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is an assembly diagram of the method for testing the firmness of the metallization layer of ceramic insulators.

[0025] Figure 2 is the sintering curve in this method.

[0026] Figure 3 It is a reference diagram for comparing the actual welding effects of the present invention.

[0027] Figure 4 It is a schematic diagram of curve 1-3 of the present invention.

[0028] Figure 5 It is a schematic diagram of curves 4-6 of the present invention.

[0029] Figure 6 It is a schematic diagram of curves 7-9 of the present invention.

[0030] Figure 7 It is a structural schematic diagram of the present invention.

[0031] Figure 8 It is a structural schematic diagram of the first viewing angle of the present invention.

[0032] Fig. 9 It is a structural schematic diagram of the second viewing angle of the present invention.

[0033] Fig.10 It is a schematic diagram of the improved structure of the present invention.

[0034] Fig.11 It is a circuit schematic diagram of the present invention.

[0035] Among them: 31, printed circuit board; 32, power components; 33, cover plate; 34, shell; 35, process through hole; 36, bottom welding bracket; 37, upper gap adjustment diaphragm; 38, water-proof membrane; 39, upper pressure grid; 40, U-shaped inlet; 41, process two-side expansion; 42, injection molding liner. 61, graphite plate; 62, groove; 63, ceramic insulator; 64, Ag78Cu22 solder; 65, 4J42 nickel-plated cover plate; 66, molybdenum sheet. DETAILED DESCRIPTION

[0036] like Figure 1-11 As shown, the manufacturing system of the packaged metal shell relay of the present embodiment includes a metal shell relay having a shell 34 in which an electrical module is installed in its inner cavity, a graphite plate 61 is arranged on the shell 34, a groove 62 is processed on the graphite plate 61, a ceramic insulator 63 is placed in parallel in the groove 62, a 4J42 nickel-plated cover plate 65 located above the ceramic insulator 63 is arranged on the graphite plate 61, a Ag72Cu28 solder 64 with a diameter of 2.7 mm is placed above the ceramic insulator 63, a 4J42 nickel-plated cover 65 located above the Ag72Cu28 solder 64 is placed above the graphite plate 61, and a bent molybdenum sheet 66 is arranged between the 4J42 nickel-plated cover 65 and the graphite plate 61.

[0037] The molybdenum sheet 66 is a trapezoidal structure with an open upper end. The lower base plate of the molybdenum sheet 66 contacts the lower surface of the graphite plate 61. The upper corners of the two side bevels of the molybdenum sheet 66 are provided with lower elbows for pressure contact with the two sides of the upper surface of the 4J42 nickel-plated cover 65.

[0038] An oxide film is provided on the housing 34, the cover plate 33 or the pins.

[0039] A metal housing relay comprises a cover plate 33 sealed and fastened on a housing 34, a process through hole 35 is arranged on the cover plate 33, a bottom welding bracket 36 with mesh holes which is sealed and welded on the inner wall of the cover plate 33 and is located directly below the process through hole 35, an upper gap adjusting diaphragm 37 arranged on the bottom welding bracket 36 and located below the process through hole 35, a water-isolating membrane 38 located in the process through hole 35 and above the upper gap adjusting diaphragm 37, an upper pressure grid frame 39 installed on the cover plate 33 by bolts, and a gap adjusting diaphragm arranged between the upper pressure grid frame 39 and the upper gap adjusting diaphragm 37 and having the same structure as the upper gap adjusting diaphragm 37; the sum of the thicknesses of the upper gap adjusting diaphragm 37, the water-isolating membrane 38 and the gap adjusting diaphragm is greater than the depth of the process through hole 35; the membrane pore diameter of the water-isolating membrane 38 is smaller than the diameter of a water molecule;

[0040] The thickness of the upper gap-adjusting membrane 37 , the water-blocking membrane 38 and the gap-adjusting membrane are selected according to the depth of the process through hole 35 ; the upper pressure grid 39 is externally connected to a filter, and the filter is externally connected to a filter.

[0041] The housing 34 and the cover plate 33 are electroplated or sprayed with corresponding anti-corrosion layers according to the working conditions;

[0042] A U-shaped inlet 40 is provided at the four corners of the bottom plate of the housing 34, and a process flared opening 41 with a width greater than that of the U-shaped inlet 40 is provided inside the U-shaped inlet 40; the U-shaped inlet 40 and the process flared opening 41 form a mushroom-shaped gap, and an injection-molded gasket 42 for connecting bolts is thermoformed on the inner side wall and the upper and lower surfaces of the process flared opening 41;

[0043] The electrical module includes mutually electrically connected printed boards 31 arranged on the bottom plate of the inner cavity of the housing 34; a power component 32 is welded or inserted on one side of the printed board 31, and the other side of the printed board 31 is a copper-clad area;

[0044] The power assembly 32 includes an isolation input module, a zero-crossing detection module, and an output circuit module that are electrically connected in sequence;

[0045] The input circuit of the isolated input module uses a constant current source control method, and the input voltage range is 6VDC-32VDC;

[0046] The zero-crossing detection module uses an optical coupler;

[0047] The output circuit module as power output includes a plurality of anti-parallel unidirectional thyristors, and an RC absorption loop is electrically connected at both ends of the unidirectional thyristors.

[0048] The method for manufacturing the packaged metal housing relay of this embodiment includes first manufacturing a metal oxide layer of the ceramic insulator 63 ; and then welding the ceramic insulator 63 to the housing 34 through the metal oxide layer.

[0049] In the step of manufacturing the metal oxide layer of the ceramic insulator 63, the following steps are performed:

[0050] Step I, selecting a graphite plate 61;

[0051] Step II, machining a groove 62 in the center of the graphite plate 61;

[0052] Step III, select a ceramic insulator 63 and place it in the groove 62, with the ceramic insulator hole being placed parallel to the groove of the graphite plate 61;

[0053] Step IV, place Ag72Cu28 solder 64 with a diameter above the ceramic insulator 63;

[0054] Step V, using a 4J42 nickel-plated cover 65 plate to be placed on top of the Ag72Cu28 solder 64;

[0055] Step VI: First, the molybdenum sheet 66 is bent and shaped; then, the bent molybdenum sheet 66 fixes the 4J42 nickel-plated cover 65 on the graphite plate 61;

[0056] Step VII, placing the workpiece of step VI in a gas-protected sintering furnace for sintering;

[0057] Step VIII: Take out the sintered ceramic insulator 63, and use a preset force to pull the ceramic insulator 63. If the ceramic insulator 63 is separated from the 4J42 nickel-plated cover plate 65, the firmness is poor, otherwise, the firmness is good.

[0058] In the process of welding the ceramic insulator 63 to the housing 34 through the metal oxide layer, the specific steps are as follows:

[0059] Step A: cleaning the surfaces of the ceramic insulator 63 and the housing 34 to remove impurities;

[0060] Step B, coating the housing 34 with electroplated nickel;

[0061] Step C, placing the shell 34 in a furnace protected by nitrogen and performing pretreatment in groups;

[0062] Step D, after the housing 34 is assembled, brazing is performed;

[0063] Step E, visually inspect the solder under a microscope and calculate the solder flowability;

[0064] Step F: According to the standard, a sealing test is performed, and the test results of each group are less than 1×10-9Pa·m3 / s;

[0065] Step G: According to the test results, the sealing pressure is less than 1×10-9Pa·m3 / s, which proves that the brazing effect of each group of experiments is good.

[0066] In step VII, the workpiece of step VI is placed in a gas-protected sintering furnace according to Figure 2 Sintering is performed according to the sintering curve in the curve table;

[0067] In step C, the housing (34) is placed in a furnace protected by nitrogen and pre-treated according to the groups shown in the following table;

[0068] Component Status Frontal diffusion area (cm2) Lead wire dispersion length (mm) Original treatment plan 1.9-2.1 5-6 Curve 1 0.3-0.6 2mm Curve 2 0.2-0.4 1-2 Curve 3 0.1-0.2 <1mm Curve 4 0.4-0.6 1-2.5 Curve 5 0.2-0.5 1.2 Curve 6 0.1-0.3 1-1.5 Curve 7 0.5-0.8 2-3 Curve 8 0.3-0.5 1-3 Curve 9 0.2-0.3 1-2

[0069] Wherein, in step C, the following curves are set in each table of the furnace for preprocessing;

[0070] Curves 1-3, such as Figure 4 The curve is preprocessed; in curves 4-6, such as Figure 5 The curve is preprocessed; in curves 7-9, Figure 6 The curve is preprocessed; in step F, a sealing test is performed according to GJB 548B-2005 method 1014 and test condition A4, and the test results are all less than 1×10-9Pa·m3 / s;

[0071] In step G, according to GJB 548B-2005 method 1010 condition F, -65°C-175°C, 100 temperature cycles were performed, and the sealing results after the temperature cycle were all less than 1×10-9Pa·m3 / s. This test proved that the brazing effects of the 9 groups of experiments were all good;

[0072] After step G, execute step H, statistical conclusion, and perform component preprocessing according to curve 3 based on the experimental results.

[0073] Before or after the ceramic insulator (63) is welded to the housing (34) through the metal oxide layer, a metal housing relay assembly is encapsulated in the mounting housing (34); the steps include:

[0074] Step 1: First, install the electronic component printed circuit board (31) on the housing (34); then, install the injection molding gasket (42) on the U-shaped inlet (40) at the four corners of the housing (34);

[0075] Step 2, first, install the bottom welding bracket (36) on the process through hole (35) of the cover plate (33); then, place the upper gap adjustment diaphragm (37) on the bottom welding bracket (36); secondly, place the water-proof membrane (38) on the upper gap adjustment diaphragm (37); thirdly, install the gap adjustment diaphragm on the water-proof membrane (38) so that the upper surface of the gap adjustment diaphragm is higher than the upper end of the process through hole (35); then, install the upper pressure grid (39) on the gap adjustment diaphragm.

[0076] As a preference, Figure 1-2 , a manufacturing system for encapsulating metal shell relays, inspection principle: use Ag78Cu22 solder (64) and 4J42 nickel-plated cover plate (65) to sinter together according to a certain sintering curve, and after sintering, apply a certain force to the insulator. If the ceramic insulator (63) and the 4J42 nickel-plated cover plate (65) fall off, it means that the metallization layer of the ceramic insulator (63) has poor firmness, otherwise it means that the metallization layer of the insulator has good firmness.

[0077] A graphite plate (61) is arranged on the housing (34), a groove (62) is processed on the graphite plate (61), a ceramic insulator (63) is placed in parallel in the groove (62), a 4J42 nickel-plated cover plate (65) is arranged on the graphite plate (61) and is located above the ceramic insulator (63), a Ag72Cu28 solder (64) with a diameter of 2.7 mm is placed above the ceramic insulator (63), and an Ag72Cu28 solder (64) with a diameter of 2.7 mm is placed above the graphite plate (61). A 4J42 nickel-plated cover (65) is disposed above the 72Cu28 solder (64); a bent molybdenum sheet (66) is disposed between the 4J42 nickel-plated cover (65) and the graphite plate (61); the molybdenum sheet (66) is in a trapezoidal structure with an open upper end; a lower bottom plate of the molybdenum sheet (66) is in contact with a lower surface of the graphite plate (61); lower elbows for pressure contact with two sides of the upper surface of the 4J42 nickel-plated cover (65) are disposed at the upper corners of the two side bevels of the molybdenum sheet (66);

[0078] As a specific example, in Example 1, step 1, a graphite plate (61) with a length, width and height of 60 mm×22 mm×6 mm is selected, as shown in the attached Figure 1 As shown in 1;

[0079] Step 2: Use sandpaper to grind a groove (62) with a diameter of 1.5 mm in the center of the graphite plate (61). Figure 1 Step 3: Select a ceramic insulator (63) with a diameter of 2.7 mm and place it in the groove (62). The ceramic insulator hole is placed parallel to the groove of the graphite plate (61). Figure 1 As shown in 3;

[0080] Step 4: Place Ag72Cu28 solder (64) with a diameter of 2.7 mm on top of the ceramic insulator (63). Figure 1 As shown in 4;

[0081] Step 5: Place a 60mm long, 2mm wide, 0.4mm thick 4J42 nickel-plated cover (65) on top of the Ag72Cu28 solder (64). Figure 1 As shown in 5;

[0082] Step 6: Use the bent molybdenum sheet (66) to fix the 4J42 nickel-plated cover (65) on the graphite plate (61). Figure 1 As shown in 6;

[0083] Step 7: Place the assembled workpiece in a sintering furnace protected by nitrogen atmosphere for sintering. Figure 2 The sintering curve of

[0084] Step 8: Take out the sintered ceramic insulator (63), and pull the insulator with a force of 10N. If the insulator is separated from the 4J42 nickel-plated cover plate (65), the firmness is poor, otherwise the firmness is good.

[0085] The present invention solves the problem of testing the firmness of the metallization layer of a ceramic insulator (63), thereby avoiding the problem that ceramic insulators (63) produced in the same batch have poor air tightness of the metal-ceramic shell and the insulation withstand voltage cannot meet the use requirements due to the loose metallization layer.

[0086] The invention discloses a method for manufacturing a metal-encapsulated relay. The welding principle is that after pretreatment, a dense iron-based oxide film is formed on the surface of the lead wire and the shell (34). The oxide film is dissolved in the glass and the metal or alloy as a binder. The sealing is a gradual structural transformation between the oxide tightly attached to the surface of the metal or alloy and the glass, forming a transition layer structure, so that the diffusion range of the solder is reduced during packaging, and the packaging effect is better.

[0087] Embodiment 2, step 1, cleaning the surface of the weldment to remove impurities such as oil, oxides, etc.

[0088] Step 2: Plate a layer of electroplated nickel on the relay package housing, with a thickness controlled at 0.5-1.5 microns.

[0089] Step 3: Place the shell, lead wire and other components in a furnace protected by a nitrogen atmosphere, set the furnace as shown below, and pre-treat them in 9 groups.

[0090] Step 4: Assemble the pre-treated parts and braze them.

[0091] Step 5: Visually inspect under a microscope and count the solder flowability. The statistical results are as follows.

[0092] Component Status Frontal diffusion area (cm2) Lead wire dispersion length (mm) Original treatment plan 1.9-2.1 5-6 Curve 1 0.3-0.6 2mm Curve 2 0.2-0.4 1-2 Curve 3 0.1-0.2 <1mm Curve 4 0.4-0.6 1-2.5 Curve 5 0.2-0.5 1.2 Curve 6 0.1-0.3 1-1.5 Curve 7 0.5-0.8 2-3 Curve 8 0.3-0.5 1-3 Curve 9 0.2-0.3 1-2

[0093] Step 6: Perform sealing test according to GJB 548B-2005 method 1014 and test condition A4. The test results are all less than 1×10-9Pa·m3 / s

[0094] Step 7: According to GJB 548B-2005 method 1010 condition F, -65℃-175℃, 100 temperature cycles, the sealing results after temperature cycle are all less than 1×10-9Pa·m3 / s, the test proves that the brazing effect of the 9 groups of experiments is good

[0095] Step 8, statistical conclusion, according to the experimental results, after the parts are pre-treated according to curve 3, the relay package shell has a good brazing effect and effectively controls the solder dispersion. The present invention effectively controls the dispersion of silver-copper solder brazing while ensuring the brazing effect, thereby improving the brazing performance and product reliability.

[0096] like Figure 7-10 As shown, the metal shell relay of the present embodiment 3 includes a shell 34 in which an electrical module is installed in the inner cavity, and a printed circuit board is installed to achieve support. A small-volume shell can be made by cold pressing, punching, welding and other methods. The metal has good thermal conductivity and can perform heat exchange in time to avoid overheating of the components. At the same time, the static electricity accumulated inside is output to avoid breakdown or short circuit of the components. It has good rigidity and elastic memory. The cover plate 33 sealed and buckled on the shell 34 adopts a split structure with reasonable design. A process through hole 35 is set on the cover plate 33 for easy installation. The bottom welding with mesh is welded on the inner wall of the cover plate 33 and is located directly below the process through hole 35. The bracket 36 is pre-installed to support the waterproof and breathable membrane, and includes an upper gap-adjusting diaphragm 37 which is arranged on the bottom welding bracket 36 and located below the process through hole 35, a waterproof membrane 38 which is located in the process through hole 35 and above the upper gap-adjusting diaphragm 37, an upper pressure grid 39 which is installed on the cover plate 33 by bolts, and a gap-adjusting diaphragm which is arranged between the upper pressure grid 39 and the upper gap-adjusting diaphragm 37 and has the same structure as the upper gap-adjusting diaphragm 37; the gap is adjusted through the diaphragm to ensure flexible contact on both sides of the waterproof membrane, thereby preventing it from being suspended in the air, and the waterproof membrane will not be deformed due to pressure changes, and the force it receives will be transmitted through the diaphragm, so that the waterproof membrane is stressed, and the design is reasonable.

[0097] The sum of the thicknesses of the upper gap-adjusting diaphragm 37, the water-blocking membrane 38 and the gap-adjusting diaphragm is greater than the depth of the process through hole 35, thereby achieving pressure contact between the upper and lower surfaces. The membrane pore diameter of the water-blocking membrane 38 is smaller than the diameter of a water molecule, allowing gas molecules with a diameter smaller than that of a water molecule to enter, thereby ensuring that the interior of the shell is dry and preventing the components from getting wet. The present invention solves the technical problems that have long plagued metal packaging, solves the problem of unbalanced internal and external pressures, and avoids deformation of the thin shell due to pressure changes, causing leakage of the seal under pressure differences.

[0098] The thickness of the upper gap adjustment membrane 37, the water-isolating membrane 38 and the gap adjustment membrane are selected according to the depth of the process through hole 35, so as to ensure that the upper and lower surfaces of the water-isolating membrane are in pressure contact.

[0099] The upper pressure grid frame 39 is externally connected to a filter, and the filter is externally connected to a filter, thereby achieving pre-filtration and preventing the water-proof membrane from being attached with debris in an unclean environment.

[0100] The housing 34 and the cover plate 33 are electroplated or sprayed with corresponding anti-corrosion layers according to working conditions, and have good versatility and expansibility.

[0101] U-shaped inlets 40 are provided at the four corners of the bottom plate of the shell 34 to facilitate the rapid entry and exit of the bolts, and process flares 41 with a width greater than that of the U-shaped inlet 40 are provided inside the U-shaped inlet 40; the U-shaped inlet 40 and the process flares 41 form a mushroom-shaped gap, and injection-molded gaskets 42 for connecting bolts are thermoformed on the inner side walls and the upper and lower surfaces of the process flares 41, so that the small-width inlet is used to block the plastic gasket from detaching from the opening, and also to prevent it from detaching from the upper and lower surfaces, and at the same time, the plastic gasket is used to block the transmission of static electricity or leakage.

[0102] As an introduction to the circuit, the electrical module includes mutually electrically connected printed circuit boards 31 arranged on the bottom plate of the inner cavity of the shell 34; a power component 32 is welded or inserted on one side of the printed circuit board 31, and the other side of the printed circuit board 31 is a copper-clad area.

[0103] Preferably, the power component 32 includes an isolation input module, a zero-crossing detection module (which can be a universal circuit) and an output circuit module which are electrically connected in sequence; the input circuit of the isolation input module is controlled by a constant current source, and the input voltage range is 6VDC-32VDC; the zero-crossing detection module adopts an optical coupler; the output circuit module as a power output includes a plurality of anti-parallel unidirectional thyristors, and an RC absorption circuit is electrically connected at both ends of the unidirectional thyristors.

[0104] For example, a relay designed for a deep-sea submersible is a high-power metal fully sealed three-phase solid-state relay with a design current of 10A, wide voltage input, isolation detection, voltage zero-crossing conduction, zero-crossing area ±15V, built-in RC absorption circuit, more reliable operation, and a maximum size of only 66mm×33mm×17mm. The volume of the present invention is much smaller than that of the high-power three-phase solid-state relay of the same type of products on the market.

[0105] As a preferred embodiment, the module is a DC input-AC output type module in principle, and the circuit mainly consists of three parts: an isolated input module, a zero-crossing detection module, and an output circuit module. The input circuit uses a constant current source control method, and the input circuit can be applied to a wider input voltage range; the zero-crossing detection module circuit uses an "optical coupler", which has sensitive action, high response speed, and high isolation and withstand voltage level between the input / output terminals; the output circuit module is composed of six unidirectional thyristors in anti-parallel as power output, and an RC absorption circuit is designed at both ends of the thyristor to suppress surge voltage and improve static dv / dt indicators.

[0106] The invention designs a high-power metal fully sealed three-phase solid-state relay with a current of 10A, a wide voltage input, isolation detection, voltage zero-crossing conduction, a zero-crossing area of ​​±15V, a built-in RC absorption circuit, and a more reliable operation.

[0107] The volume of the present invention is much smaller than similar products (about one seventh of the volume of the same type), saving a lot of installation space for users; the metal fully sealed package can adapt to more severe application environments.

[0108] The structural design adopts a new metal fully sealed structure with legs on the side. The power components are sintered on the metal tube shell, and the control part is fixed above the power using PCB, which greatly reduces the volume.

Claims

1. A system for manufacturing a packaged metal housing relay, characterized in that: A metal housing relay comprising a housing (34) in which an electrical module is installed in an inner cavity, a graphite plate (61) is arranged on the housing (34), a groove (62) is processed on the graphite plate (61), a ceramic insulator (63) is placed in parallel in the groove (62), a 4J42 nickel-plated cover plate (65) is arranged on the graphite plate (61) and is located above the ceramic insulator (63), a Ag72Cu28 solder (64) with a diameter of 2.7 mm is placed above the ceramic insulator (63), a 4J42 nickel-plated cover plate (65) is placed above the graphite plate (61) and is located above the Ag72Cu28 solder (64), and a bent molybdenum sheet (66) is arranged between the 4J42 nickel-plated cover plate (65) and the graphite plate (61); The molybdenum sheet (66) is in a trapezoidal structure with an open top, the bottom plate of the molybdenum sheet (66) contacts the bottom surface of the graphite sheet (61), and lower elbows for pressure contact with the top surfaces of the 4J42 nickel-plated cover plate (65) are provided at the upper corners of the two side bevels of the molybdenum sheet (66); The metal housing relay comprises a cover plate (33) sealed and fastened on the housing (34), a process through hole (35) provided on the cover plate (33), a bottom welding bracket (36) with mesh holes and sealed and welded on the inner side wall of the cover plate (33) and located directly below the process through hole (35), an upper gap adjustment membrane (37) provided on the bottom welding bracket (36) and located below the process through hole (35), a water-proof membrane (38) located in the process through hole (35) and above the upper gap adjustment membrane (37), an upper pressure grid frame (39) installed on the cover plate (33) by bolts, and a gap adjustment membrane provided between the upper pressure grid frame (39) and the upper gap adjustment membrane (37) and having the same structure as the upper gap adjustment membrane (37); the sum of the thicknesses of the upper gap adjustment membrane (37), the water-proof membrane (38) and the gap membrane is greater than the depth of the process through hole (35); and the membrane pore diameter of the water-proof membrane (38) is smaller than the diameter of a water molecule; The thicknesses of the upper gap-adjusting diaphragm (37), the water-blocking membrane (38) and the gap-adjusting diaphragm are selected according to the depth of the process through hole (35); the upper pressure grid frame (39) is externally connected to a filter, and the filter is externally connected to a filter.

2. The system for manufacturing a packaged metal housing relay according to claim 1, characterized in that An oxide film is provided on the housing (34), the cover plate (33) or the pin.

3. The system for manufacturing a packaged metal housing relay according to claim 2, characterized in that : The housing (34) and the cover plate (33) are electroplated or sprayed with corresponding anti-corrosion layers according to working conditions; A U-shaped inlet (40) is provided at the four corners of the bottom plate of the housing (34), and a process flared opening (41) having a width greater than that of the U-shaped inlet (40) is provided inside the U-shaped inlet (40); the U-shaped inlet (40) and the process flared opening (41) form a mushroom-shaped gap, and an injection-molded gasket (42) for connecting bolts is thermoformed on the inner side wall and upper and lower surfaces of the process flared opening (41); The electrical module comprises mutually electrically connected printed boards (31) arranged on the bottom plate of the inner cavity of the housing (34); a power component (32) is welded or inserted on one side of the printed board (31), and the other side of the printed board (31) is a copper-clad area; The power component (32) comprises an isolation input module, a zero-crossing detection module and an output circuit module which are electrically connected in sequence; The input circuit of the isolated input module uses a constant current source control method, and the input voltage range is 6VDC-32VDC; The zero-crossing detection module uses an optical coupler; The output circuit module as power output includes a plurality of anti-parallel unidirectional thyristors, and an RC absorption loop is electrically connected at both ends of the unidirectional thyristors.

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