A kind of inductively read heterogeneous layer structure position sensitive anode and its manufacturing method

Abstract

The present invention provides a position-sensitive anode with a heterogeneous structure for inductive reading and a method for manufacturing the same, which solves the problem that the existing position-sensitive anode processing requires the use of high-precision microelectronic processes or laser etching equipment, and the processing cycle and processing cost are relatively high. The position-sensitive anode includes an anode substrate, a W electrode, an S electrode and a Z electrode, wherein the W electrode and the S electrode are located in the same plane layer and are located on the top layer of the anode substrate; the Z electrode is located in another plane layer and is located on the bottom layer of the anode substrate. Placing the three electrodes in two different plane layers respectively reduces the requirements for manufacturing equipment and manufacturing processes, greatly simplifies the difficulty of manufacturing the position-sensitive anode, and shortens the manufacturing cycle of the position-sensitive anode; increases the width of the insulating channel between the electrodes, avoids the insulating channel between the two electrodes being too narrow, reduces the risk of conduction between the two electrodes, and improves the reliability of the detector.

Description

Technical Field

[0001] The invention belongs to weak and extremely weak light detection technology, and specifically relates to an inductively readout heterolayer structure position-sensitive anode and a manufacturing method thereof. Background Art

[0002] The photon counting method uses the natural discrete characteristics of the output electrical signal of the photon detector under weak light irradiation, and uses pulse discrimination technology and digital counting technology to identify and extract extremely weak signals. The photon counting imaging detector based on microchannel plate and position-sensitive anode readout has the advantages of high signal-to-noise ratio, good drift resistance, and good time stability, and has been widely used in astronomy, high-energy physics, biomedicine and other fields.

[0003] The position-sensitive anode detector uses a position-sensitive anode to collect the electron cloud output by the microchannel plate, and decodes the position of the incident event based on the electron signals collected by different electrodes of the anode. There are two ways to read out the imaging charge of the position-sensitive anode detector: direct charge collection readout and charge induction readout (also known as the mirror charge method). The difference between the two methods is that the charge induction readout (mirror charge method) is to collect the imaging charge output by the microchannel plate (MCP) by the semiconductor germanium layer with high impedance characteristics, and then couple the charge collected on the germanium layer to the position-sensitive anode through charge induction; while the direct charge collection method is to directly collect the imaging charge output by the microchannel plate (MCP) by the position-sensitive anode. Compared with the direct readout method of the direct charge collection method, the inductive readout method of the charge induction readout has many obvious advantages, such as effectively reducing the distributed noise generated by the charge-splitting position-sensitive anode and greatly simplifying the vacuum packaging process of the anode detector, etc. For details, see the Chinese patent application number 200810184963.6.

[0004] The position-sensitive anodes used to collect electrons output from the microchannel plate mainly include resistive anode, multi-anode microchannel array (MAMA / Multi-Anode Microchannel Array), wedge and strip anode (WSA / Wedge and strip anode), vernier anode (Vernier), cross-strip (Cross-Strip), etc. Among them, the WSA position-sensitive anode is the most widely used.

[0005] like Figure 1As shown in the figure, a geometric diagram of a WSA anode with three electrodes is given. The wedge-shaped position-sensitive anode belongs to the charge-splitting type anode, which includes three electrodes, namely a wedge-shaped electrode (W electrode 01), a stripe electrode (S electrode 02), and a zigzag electrode (Z electrode 04) between W and S. W electrode 01, S electrode 02, and Z electrode 04 are metal electrodes separated by an insulating channel. The S electrode is a strip, and its width increases along the X direction. W is a wedge, and its width increases along the Y direction. Z is an electrode between W and S. The WSA anode has periodicity. The decoding formula of the heterolayer structure position-sensitive anode read out by induction is:

[0006] X=2*Qs / (Qw+Qs+Qz), Y=2*Qw / (Qw+Qs+Qz);

[0007] Where: Qw, Qs, Qz are the electric charges collected by the W, S, and Z electrodes respectively.

[0008] At present, there are two main methods for making WSA position-sensitive anodes. The anode pattern is etched on a metal film attached to an insulating material. The three electrodes of the position-sensitive anode are distributed on the same plane. The anode substrate 03 is generally made of quartz glass or ceramics. The processing methods mainly use microelectronic photolithography and laser processing. The literature (Journal of Photonics, 2008, 37(1): 11-16) introduces the method of microelectronic photolithography in detail, which is divided into two types: "photolithography etching first and then electroplating thickening" and "electroplating thickening first and then photolithography etching". The laser processing method is to directly etch the metal film layer attached to the substrate to obtain the required pattern.

[0009] The conventional position-sensitive anode structure is to evaporate a metal film layer on an insulating substrate, and then photolithograph or laser etch the required anode pattern on the metal film layer. Since the insulating channel between the electrodes of the anode is narrow (generally between a dozen to dozens of μm), the anode processing requires the use of high-precision microelectronics technology or laser etching equipment, and the processing cycle and processing cost are relatively high. In addition, too narrow insulating channels are also prone to the attachment of conductive particles, causing the electrode to conduct, affecting the reliability of the detector. Summary of the invention

[0010] In order to solve the technical problem that the existing position-sensitive anode processing requires the use of high-precision microelectronic technology or laser etching equipment, and has high processing cycle and processing cost, the present invention provides an inductively read heterogeneous structure position-sensitive anode and a manufacturing method thereof, which can improve the reliability of the detector.

[0011] To achieve the above purpose, the technical solution provided by the present invention is:

[0012] A position-sensitive anode with a heterogeneous structure for inductive reading is special in that it includes an anode substrate, a W electrode, an S electrode and a Z electrode, wherein the W electrode and the S electrode are located in the same plane layer and are located on the top layer of the anode substrate; and the Z electrode is located in another plane layer and is located on the bottom layer of the anode substrate.

[0013] Furthermore, the two planar layers are provided with extraction electrodes;

[0014] The anode substrate is provided with an electrode lead-out hole matched with the lead-out electrode;

[0015] The anode substrate is also provided with a first marking hole for positioning the two plane layers to ensure the accuracy of the pattern positions on the two plane layers.

[0016] Further, it includes a support ring connected to the top layer or the bottom layer of the anode substrate;

[0017] The outer contour size of the support ring is matched with that of the anode substrate, and the inner diameter of the support ring is larger than the outer diameter of the collection area of ​​the electrode; the material of the support ring is the same as that of the anode substrate.

[0018] Furthermore, the anode substrate is a double-sided copper-clad laminate; the base material of the double-sided copper-clad laminate is FR4 or PTFE sheet material, the base material thickness is 0.1 to 0.3 mm, and the copper thickness is 2 μm to 17 μm.

[0019] Furthermore, an adhesive is provided between the anode substrate and the support ring;

[0020] The support ring is provided with a second marking hole matched with the first marking hole.

[0021] At the same time, the present invention provides a method for manufacturing a position-sensitive anode with a heterogeneous structure for inductive reading, which is special in that it comprises the following steps:

[0022] 1) Determine the electrode distribution location

[0023] According to the required pattern of the position-sensitive anode and the decoding formula of the position-sensitive anode, the electrodes distributed on the top layer and the bottom layer of the position-sensitive anode are determined;

[0024] The electrodes include a W electrode, an S electrode, and a Z electrode;

[0025] The decoding formula of the position sensitive anode is:

[0026] X=2*Q s / (Q w +Q s +k*Q z ), Y = 2*Q w / (Q w +Q s +k*Qz );

[0027] Among them, Q w , Q s , Q z The W electrode, S electrode, and Z electrode collect the electricity of three electric pulses respectively;

[0028] X and Y refer to the coordinates of the center of mass of the electron cloud received by the anode;

[0029] k is the correction factor;

[0030] 2) Make a mask

[0031] A top electrode pattern mask and a bottom electrode pattern mask are respectively manufactured according to the required position-sensitive anode dimensions;

[0032] The top electrode pattern mask includes a W electrode and an S electrode, and the bottom electrode pattern mask is a Z electrode;

[0033] 3) Processing anode substrate

[0034] 3.1) Processing the anode substrate according to the size of the required position-sensitive anode, so that the size of the processed anode substrate matches the required position-sensitive anode external size;

[0035] 3.2) Use the top electrode pattern mask to photolithograph the patterns of the W electrode and the S electrode on the top layer of the anode substrate; use the bottom electrode pattern mask to photolithograph the pattern of the Z electrode on the bottom layer of the anode substrate.

[0036] Furthermore, it also includes:

[0037] Step 4) Install the support ring

[0038] 4.1) Processing a corresponding support ring according to the size of the anode substrate, wherein the outer contour size of the support ring is adapted to the outer contour size of the anode substrate, and the inner diameter of the support ring is larger than the outer diameter of the collection area of ​​the electrode;

[0039] The material of the support ring is the same as that of the anode substrate;

[0040] 4.2) Fixing the anode substrate processed in step 3.2) and the support ring processed in step 4.2) together.

[0041] Furthermore, step 2) further includes processing marks on the top electrode pattern mask and the bottom electrode pattern mask;

[0042] Step 3.2) further includes machining a first marking hole on the anode substrate to match the marking;

[0043] A second marking hole matching the first marking hole is processed on the support ring;

[0044] Step 4.1) also includes step 4.2), which is specifically: adding adhesive between the anode substrate and the support ring, and pressing the anode substrate and the support ring under a certain pressure and temperature; during the bonding and pressing process, ensure that the first marking hole on the anode substrate is aligned with the second marking hole on the support ring.

[0045] Furthermore, step 4.1) further includes drilling a small hole in the electrode on the anode substrate on which the support ring is installed, and metallizing the small hole to form a conductive via.

[0046] Further, in step 3.1), the anode substrate is a double-sided copper-clad laminate;

[0047] The substrate of the double-sided copper-clad laminate is FR4 or PTFE sheet material, the substrate thickness is 0.1-0.3 mm, and the copper thickness is 2 μm-17 μm.

[0048] Compared with the prior art, the advantages of the present invention are:

[0049] 1. In the position-sensitive anode of the present invention, the three electrodes are respectively located in two different plane layers, which reduces the requirements for manufacturing equipment and manufacturing process, greatly simplifies the manufacturing difficulty of the position-sensitive anode, and shortens the manufacturing cycle of the position-sensitive anode;

[0050] The heterogeneous distribution structure of several electrodes of the position-sensitive anode greatly increases the width of the insulating channel between the electrodes, avoids the insulating channel between the two electrodes being too narrow, reduces the risk of conduction between the two electrodes, and improves the reliability of the detector.

[0051] 2. The anode substrate of the present invention is provided with a marking hole for aligning the electrode patterns on the two plane layers.

[0052] 3. The anode substrate in the position-sensitive anode of the present invention can be a double-sided copper-clad laminate, and the electrode can be processed on the copper surface of the double-sided copper-clad laminate, which greatly simplifies the manufacturing process of the position-sensitive anode, reduces the manufacturing cost, and makes mass production possible. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 This is a diagram of the existing wedge-shaped anode structure;

[0054] Figure 1 In the drawings, the reference numerals are as follows:

[0055] 01-W electrode, 02-S electrode, 03-anode substrate, 04-Z electrode.

[0056] Figure 2 It is a schematic diagram of the explosion of the position-sensitive anode with a heterogeneous structure sensed by the present invention (without a support plate);

[0057] Figure 3 yes Figure 2 A cross-sectional view of

[0058] Figure 4 It is a schematic diagram of the structure of a position-sensitive anode with a support ring of the present invention;

[0059] Figure 5 yes Figure 4 Exploded diagram of

[0060] Figure 6 yes Figure 4 AA section view;

[0061] Figure 7 Schematic diagram of the application of the hetero-layer structure position-sensitive anode sensed by the present invention;

[0062] Figures 2 to 7 In the drawings, the reference numerals are as follows:

[0063] 1-W electrode, 2-S electrode, 3-anode substrate, 4-Z electrode, 5-first marking hole, 6-support ring, 7-electrode lead-out hole, 8-lead electrode, 9-second marking hole, 11-input window, 12-photocathode, 13-microchannel plate, 14-high resistance film, 15-ceramic substrate, 16-position-sensitive anode, 17-soldering pad. DETAILED DESCRIPTION

[0064] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0065] The existing wedge-shaped position-sensitive anode belongs to the charge-splitting anode, which includes three electrodes, a wedge-shaped (W) electrode, a stripe (S) electrode, and a zigzag (Z) electrode between the wedge-shaped (W) electrode and the stripe (S) electrode. The electrodes are located in the same plane, and the decoding formula is X = 2*Q s / (Q w +Q s +Q z ), Y = 2*Q w / (Q w +Q s +Q z ); Conventional design and manufacturing method: etching an anode pattern on a metal film attached to an insulating material, the three electrodes of the position-sensitive anode are distributed on the same plane, the substrate is generally made of quartz glass or ceramics, and the processing method mainly adopts microelectronics technology or laser processing technology.

[0066] The imaging charge of the position-sensitive anode detector adopts the charge induction readout method. Its principle is to use the mirror charge technology. The high-resistance film 14 evaporated on the ceramic substrate 15 collects the electron cloud output by the MCP. At the same time, the position-sensitive anode located on the back of the ceramic substrate 15 senses the corresponding charge cloud. According to the principle of induced charge, the position-sensitive anode can be innovatively designed and processed to optimize the processing technology of the position-sensitive anode and improve the reliability of the detector. According to the pattern of the position-sensitive anode and the decoding formula of the position-sensitive anode, the electrodes distributed on the top and bottom layers are determined. The amount of charge collected by the W electrode 1 and the S electrode 2 determines the center of mass position of the electron cloud. According to the principle of induced charge, the Z electrode 4 can be placed on other planes. In this way, after inductive readout, the induced signal of the Z electrode 4 will be slightly weaker than the induced signal of the same plane structure. When decoding the center of mass of the electron cloud, it can be corrected by the correction factor, that is, the decoding formula becomes X=2*Q s / (Q w +Q s +k*Q z ), Y = 2*Q w / (Q w +Q s +k*Q z ), where k is a correction factor, which is related to the thickness, material and relative dielectric constant of the anode substrate 3, and the specific value can be determined based on experiments.

[0067] like Figures 2 to 6 As shown, an inductively read heterogeneous structure position-sensitive anode includes an anode substrate 3 and a metal electrode; the electrode pattern and the number of electrodes of the metal electrode vary according to different decoding principles of each anode, and the specific decoding principle refers to charge-splitting-based decoding, the anode is a charge-splitting-type position-sensitive anode, specifically a wedge-shaped anode and related design deformations according to specific applications, such as the anode can be circular, square, rectangular, fan-shaped and many other structures; the number of electrodes includes a three-electrode structure and a four-electrode structure.

[0068] The electrodes of the anode are distributed in different planes, specifically in two different plane layers, and the two electrode layers share the anode substrate 3 (insulating medium). For the wedge-type anode, the insulating medium layer is in the middle of the two electrode layer plane layers, and the metal electrodes include W electrode 1, S electrode 2, and Z electrode 4. The W electrode 1 and S electrode 2 used to determine the two-dimensional position of the photon are located in the same plane layer and are located on the top layer of the anode substrate 3. The remaining Z electrode 4 is located in another plane layer and is located at the bottom layer of the anode substrate 3; when the three electrode patterns are located in the same plane, a conventional position-sensitive anode can still be formed.

[0069] The metal electrode material can be copper, gold, aluminum and other metal materials with good conductivity. The electrode thickness is 1μm to 17μm. If copper and other easily oxidized metal materials are used, gold must be plated on the surface of the electrode pattern to prevent oxidation of the anode panel.

[0070] The anode substrate 3 is FR4, PTFE or other insulating materials, with a relative dielectric constant generally between 2 and 5 and a thickness of 0.1 to 0.3 mm. In addition, the anode substrate 3 is also a double-sided copper-clad laminate; the substrate of the double-sided copper-clad laminate is FR4 or PTFE sheet material, the substrate thickness is 0.1 to 0.3 mm, and the copper thickness is 2 μm to 17 μm. The copper foil of the double-sided copper-clad laminate is photolithographically processed to form W electrode 1, S electrode 2, and Z electrode 4, which greatly simplifies the manufacturing process of the position-sensitive anode, reduces the manufacturing difficulty and improves the reliability of the position-sensitive anode.

[0071] Marks are provided on both plane layers; anode substrate 3 is provided with a plurality of first marking holes 5 matching the marks, for aligning the electrode patterns on the two plane layers.

[0072] The position-sensitive anode of this embodiment also includes a support ring 6, the outer contour size of the support ring 6 is adapted to (slightly larger than) the outer contour size of the anode substrate 3, and the inner diameter of the support ring 6 is larger than the outer diameter of the collection area of ​​the electrode; the material of the support ring 6 is the same as that of the anode substrate 3, and its thickness is 1 to 3 mm. An adhesive is provided between the anode substrate 3 and the support ring 6, and the anode substrate 3 and the support ring 6 are pressed together under a certain pressure and temperature. A second marking hole 9 is provided on the support ring 6. During the bonding and pressing process, attention should be paid to the alignment mark to ensure that the positions of the pressure ring copper electrode and the position-sensitive anode lead electrode correspond to each other.

[0073] This embodiment also provides a method for manufacturing a position-sensitive anode with a heterogeneous structure for inductive reading, comprising the following steps:

[0074] 1) Determine the electrode distribution location

[0075] According to the required pattern of the position-sensitive anode and the decoding formula of the position-sensitive anode, the electrodes distributed on the top layer and the bottom layer of the position-sensitive anode are determined;

[0076] The electrodes include a W electrode 1, an S electrode 2, and a Z electrode 4;

[0077] The decoding formula of the position sensitive anode is:

[0078] X=2*Q s / (Q w +Q s +k*Q z ), Y = 2*Q w / (Q w +Q s +k*Q z );

[0079] Among them, Q w , Q s , Q zThe W, S, and Z electrodes 4 collect the electricity of three electric pulses respectively;

[0080] X and Y refer to the coordinates of the center of mass of the electron cloud received by the position-sensitive anode;

[0081] k is a correction factor, which is related to the thickness, material and relative dielectric constant of the anode substrate 3 , and the specific value can be determined based on experiments.

[0082] 2) Make a mask

[0083] According to the required position-sensitive anode dimensions, a top electrode pattern mask and a bottom electrode pattern mask are respectively manufactured, and markings are processed on the top electrode pattern mask and the bottom electrode pattern mask;

[0084] The top electrode pattern mask includes a W electrode 1 and an S electrode 2, and the bottom electrode pattern mask includes a Z electrode 4;

[0085] 3) Processing anode substrate 3

[0086] 3.1) Take out the double-sided copper-clad laminate, the basic parameters of which meet the following requirements: the substrate is FR4 or PTFE sheet, the substrate thickness is 0.1mm-0.3mm, the copper foil thickness is 2μm-17μm, and it is cut according to the size of the position-sensitive anode. The size of the cut sheet is slightly larger than the required size of the position-sensitive anode, and the first marking hole 5 is made on the sheet to match the markings on the top electrode pattern mask and the bottom electrode pattern mask to ensure the positioning accuracy of the top electrode pattern and the bottom electrode pattern and the correctness of the pattern;

[0087] 3.2) Use the top electrode pattern mask to photolithograph the patterns of the W electrode 1 and the S electrode 2 on the top layer of the anode substrate 3; use the bottom electrode pattern mask to photolithograph the pattern of the Z electrode 4 on the bottom layer of the anode substrate 3. During photolithography, alignment is required according to the mask mark and the first mark hole 5 of the copper-clad laminate substrate to ensure the accuracy of the pattern position of the two layers.

[0088] 4) Processing support ring 6:

[0089] The corresponding support ring 6 is processed according to the required position-sensitive anode size. The support ring 6 needs to have a certain width to cover the lead-out electrode hole of the position-sensitive anode. The inner diameter of the support ring 6 needs to be larger than the outer diameter of the collection area of ​​the position-sensitive anode to avoid affecting the anode sensing signal. The support ring 6 has a second marking hole 9 corresponding to the first marking hole 5 of the copper-clad laminate substrate. A circular copper electrode is photoetched at the position corresponding to the anode electrode lead-out hole 7 of the support ring to facilitate subsequent metal vias and lead welding;

[0090] The material of the support ring 6 is the same as that of the anode substrate 3 , and the thickness of the substrate is 1 mm to 3 mm.

[0091] 5) Fix the support ring 6 and the anode substrate 3

[0092] Adhesive is added between the anode substrate 3 and the support ring 6, and the position-sensitive anode and the support ring 6 are pressed together under a certain pressure and temperature. During the bonding and pressing process, the first marking hole 5 on the anode substrate 3 is aligned with the second marking hole 9 on the support ring 6, so that the positions of the pressure ring copper electrode and the position-sensitive anode lead electrode correspond to each other.

[0093] 6) Make conductive vias

[0094] A small hole is made on the anode substrate 3 with the support ring 6, the hole diameter of which is Φ0.5mm-Φ1mm, and the hole is metallized to form a conductive via.

[0095] 7) Gold plating

[0096] The formed position-sensitive anode is gold-plated. The specific method can be electroplating or chemical plating to avoid oxidation of the copper electrode. The finished position-sensitive anode for induction reading is as follows: Figures 4 to 6 shown.

[0097] The manufacturing method shortens the manufacturing cycle of the position-sensitive anode, reduces the manufacturing cost, and makes it possible to manufacture anodes in large quantities. At the same time, the width of the insulating channel between the anode electrodes is increased, thereby improving reliability.

[0098] like Figure 7 As shown, the prepared position-sensitive anode 16 is assembled into the photon counting imaging detector, and the anode signal is led out from each pad 17 in the position-sensitive anode support ring 6 and enters the readout electronics. The light passes through the input window 11 to reach the photocathode 12 and generates a photoelectric effect. The electrons emitted by the photoelectric effect enter the microchannel 13 and then multiply and output the electron cloud. The high-resistance film 14 (Ge) evaporated on the ceramic substrate 15 collects the electron cloud output by the MCP. At the same time, the position-sensitive anode 16 located on the back of the ceramic substrate 15 simultaneously senses the corresponding electron cloud signal. The electrode at the top layer of the anode (close to the Ge layer substrate) senses the signal through the ceramic substrate medium, and the electrode at the bottom layer of the anode senses the signal through the ceramic substrate and the anode substrate medium. Therefore, the sensing signal of the electrode at the bottom layer of the anode is slightly weaker than that of the top layer. When calculating the photon event position, the attenuation of the electrode signal at the bottom layer needs to be taken into account. The attenuation of the sensing signal at the bottom layer of the position-sensitive anode 16 is corrected by the k value, and the imaging result of the detector is obtained after the readout electronics and related data processing software. The photon counting imaging detector belongs to weak signal detection. The distance between the front-end electronics and the position-sensitive anode 16 needs to be as short as possible to reduce electronic noise. The position-sensitive anode 16 and the front-end electronics can also be integrated into a comprehensive design and manufactured on the same PCB board to further reduce the front-end electronic noise and improve the imaging performance of the detector.

[0099] The above is only a description of the preferred implementation mode of the present invention, and the technical solution of the present invention is not limited thereto. Any known deformation made by those skilled in the art on the basis of the main technical concept of the present invention belongs to the technical scope to be protected by the present invention.

Claims

1. A method for manufacturing a position-sensitive anode with a heterogeneous structure for inductive reading, characterized in that: The following steps are involved: 1) Determine the electrode distribution location According to the required pattern of the position-sensitive anode and the decoding formula of the position-sensitive anode, the electrodes distributed on the top layer and the bottom layer of the position-sensitive anode are determined; The electrodes include a W electrode (1), an S electrode (2), and a Z electrode (4); The decoding formula of the position sensitive anode is: X=2*Q s / (Q w +Q s +k*Q z ),Y=2*Q w / (Q w +Q s +k*Q z ); Among them, Q w , Qs, Qz are the electric quantities collected by the W electrode (1), S electrode (2), and Z electrode (4) respectively; X and Y refer to the coordinates of the center of mass of the electron cloud collected by the anode; k is the correction factor; 2) Make a mask A top electrode pattern mask and a bottom electrode pattern mask are respectively manufactured according to the required position-sensitive anode dimensions; The top electrode pattern mask includes a W electrode (1) and an S electrode (2), and the bottom electrode pattern mask includes a Z electrode (4); 3) Processing of anode substrate (3) 3.1) processing the anode substrate (3) according to the size of the required position-sensitive anode, so that the size of the processed anode substrate (3) matches the outer size of the required position-sensitive anode; 3.2) using the top electrode pattern mask to photoetch the pattern of the W electrode (1) and the S electrode (2) on the top layer of the anode substrate (3); using the bottom electrode pattern mask to photoetch the pattern of the Z electrode (4) on the bottom layer of the anode substrate (3); Step 4) Install the support ring (6) 4.1) processing a corresponding support ring (6) according to the size of the anode substrate (3), wherein the outer contour size of the support ring (6) is adapted to the outer contour size of the anode substrate (3), and the inner diameter of the support ring (6) is larger than the collection area of ​​the electrode; The material of the support ring (6) is the same as that of the anode base (3); 4.2) Fixing the anode substrate (3) processed in step 3.2) and the support ring (6) processed in step 4.2).

2. The method for manufacturing a position-sensitive anode with a heterogeneous structure with inductive readout according to claim 1, characterized in that: Step 2) also includes processing marks on the top electrode pattern mask and the bottom electrode pattern mask; Step 3.2) further includes machining a first marking hole (5) on the anode substrate (3) to match the marking; Step 4.1) further includes machining a second marking hole (9) on the support ring (6) to match the first marking hole (5); Step 4.2) specifically includes adding adhesive between the anode substrate (3) and the support ring (6), and pressing the anode substrate (3) and the support ring (6) together at a certain pressure and temperature; during the bonding and pressing process, ensure that the first marking hole (5) on the anode substrate (3) is aligned with the second marking hole (9) on the support ring (6).

3. The method for manufacturing a position-sensitive anode with a heterogeneous structure for inductive reading according to claim 2, characterized in that: Step 4.1) also includes drilling small holes for electrodes on the support ring (6), and metallizing the small holes to form conductive vias.

4. The method for manufacturing a position-sensitive anode with a heterogeneous structure for inductive reading according to any one of claims 1 to 3, characterized in that: In step 3.1), the anode substrate (3) is a double-sided copper-clad laminate; The substrate of the double-sided copper-clad laminate is FR4 or PTFE sheet material, the substrate thickness is 0.1-0.3 mm, and the copper thickness is 2 μm-17 μm.

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