Optical sensing device and electronic device

Abstract

The present application discloses an optical sensing device and an electronic device. The optical sensing device includes an image sensor chip and a lens module. The image sensor core includes a plurality of pixel units for receiving a light beam and converting the received light beam into a corresponding electrical signal, and a surface on one side of the image sensor chip for sensing the light beam is defined as a photosensitive surface. The lens module includes: a plurality of first lenses, arranged on the image sensor chip, the plurality of first lenses are arranged at intervals from each other and each first lens is facing a plurality of the pixel units, and the plurality of first lenses are used to converge the light beam to the plurality of pixel units; a light shielding portion, arranged on the image sensor chip, the light shielding portion is located in the interval area between the plurality of first lenses and is not shorter than the first lens in height, or is shorter than the first lens but not shorter than 10 microns, and the light shielding portion is used to block the light beam. The electronic device includes the optical sensing device.

Description

Technical Field

[0001] The present application relates to the field of optoelectronic technology, and in particular to an optical sensing device with ultra-thin size and an electronic device having the optical sensing device. Background Art

[0002] With the advancement of technology and the improvement of people's living standards, users require more functions and fashionable appearance for electronic devices such as mobile phones, tablets, and cameras. At present, the development trend of electronic devices such as mobile phones is to have a high screen-to-body ratio and functions such as fingerprint detection. In order to achieve a full-screen or near-full-screen effect, so that electronic devices have a high screen-to-body ratio, under-screen fingerprint detection technology came into being. Since the internal space of electronic devices such as mobile phones is limited, and the imaging device that uses traditional lenses to achieve optical imaging is large in size and volume, it occupies a large space, so it is necessary to provide a smaller device for imaging. Summary of the invention

[0003] In view of this, the present application provides an optical sensing device and an electronic device that can solve or improve the problems of the prior art.

[0004] The present application provides an optical sensing device, comprising:

[0005] An image sensor chip, comprising a plurality of pixel units, wherein the pixel units are used to receive a light beam and convert the received light beam into a corresponding electrical signal, and a surface of one side of the image sensor chip used to sense the light beam is defined as a photosensitive surface; and

[0006] Lens module, including:

[0007] A plurality of first lenses are disposed on the image sensor chip, the plurality of first lenses are spaced apart from each other and each first lens faces the plurality of pixel units, and the plurality of first lenses are used to converge light beams to the plurality of pixel units; and

[0008] A shading portion is arranged on the image sensor chip, the shading portion is located in the interval area between the multiple first lenses and is not shorter than the first lens in height, or is shorter than the first lens but not shorter than 10 microns, and the shading portion is used to block the light beam.

[0009] In some embodiments, the highest height from the light-shielding portion to the photosensitive surface is not lower than the highest height from the first lens to the photosensitive surface; or, the highest height from the light-shielding portion to the photosensitive surface is lower than the highest height from the first lens to the photosensitive surface, and the height difference between the highest height from the first lens to the photosensitive surface and the highest height from the light-shielding portion to the photosensitive surface is not greater than 10 microns.

[0010] In some embodiments, the area on the multiple pixel units that can receive the light beam through the first lens is defined as an effective photosensitive area, each effective photosensitive area is opposite to one of the first lenses, and the light beam passing through the first lens converges to the effective photosensitive area opposite to the first lens.

[0011] In some embodiments, the light shielding portion is used to prevent part or all of the light beam passing through one of the first lenses from being transmitted to the effective light-sensitive area facing the adjacent or remaining first lenses.

[0012] In some embodiments, the light shielding portion includes a blocking wall and a light shielding layer, the blocking wall is located between the image sensor chip and the light shielding layer, and the light shielding layer is used to shield the light beam.

[0013] In some embodiments, the blocking wall and the first lens are made of the same light-transmitting material.

[0014] In some embodiments, the light-shielding portion includes a blocking wall and a light-shielding layer, the light-shielding layer is formed on the image sensor chip and has a plurality of openings exposing the photosensitive surface, the plurality of first lenses are formed above the light-shielding layer, the first lens is directly opposite to one of the openings and overlaps with an edge portion of the light-shielding layer, the blocking wall is formed on the light-shielding layer and is located in the spacing area between the first lenses, wherein the light-shielding layer and the blocking wall are used to block light beams.

[0015] In certain embodiments, for two adjacent first lenses and a shading portion between the two adjacent first lenses: the shading portion is not lower in height than the two adjacent first lenses, or the shading portion is lower than the two adjacent first lenses but not less than 10 microns, so that part or all of the light beam passing through one of the first lenses will not be transmitted to the effective photosensitive area directly facing the other first lens.

[0016] In some embodiments, the highest height from the blocking wall to the photosensitive surface is higher than the highest height from the first lens to the photosensitive surface.

[0017] In some embodiments, the light shielding portion is higher than the first lens by any value between 5 micrometers and 100 micrometers.

[0018] In some embodiments, the light shielding portion is higher than the first lens by any value between 5 micrometers and 10 micrometers.

[0019] In some embodiments, the pitch between adjacent first lenses is any value between 300 microns and 500 microns.

[0020] In some embodiments, the plurality of first lenses are arranged in an array, and the plurality of pixel units are arranged in an array.

[0021] In some embodiments, the lens module further includes a first substrate, the first substrate includes a relative upper surface and a lower surface, one side of the upper surface is above the first substrate, and one side of the lower surface is below the substrate, and the image sensor chip is located below the first substrate; the multiple first lenses and the shading portion are arranged on the upper surface of the first substrate, and the image sensor chip is fixed to the lens module by dispensing.

[0022] In some embodiments, the optical sensing device further includes a plurality of second lenses, the plurality of second lenses are located between the plurality of first lenses and the plurality of pixel units, and the plurality of second lenses are directly opposite to the plurality of pixel units one by one, and the plurality of second lenses are used to converge light beams to the plurality of pixel units.

[0023] In some embodiments, air is spaced between the second lens and the first substrate, and a refractive index of the second lens is greater than a refractive index of air.

[0024] In some embodiments, the optical sensing device further includes a filter layer disposed above the multiple pixel units, the filter layer being used to transmit the light beam in the target band and filter out the light beam outside the target band, and the multiple pixel units being used to receive the light beam in the target band and convert the light beam in the target band into a corresponding electrical signal.

[0025] In some embodiments, the optical sensing device further includes a filter layer disposed above the multiple pixel units, the filter layer is used to transmit the light beam of the target band and filter out the light beam of the second preset band, and the shading portion is used to filter out the light beam of the first preset band, wherein the first preset band is completely different from, completely the same as, or partially the same as the second preset band.

[0026] In some embodiments, when the first preset wavelength band is partially identical to the second preset wavelength band, the first preset wavelength band includes the second preset wavelength band.

[0027] In some embodiments, the first preset waveband includes a visible light waveband and a near infrared light waveband, and the second preset waveband includes a near infrared light waveband.

[0028] In some embodiments, an area of ​​an orthographic projection of the effective photosensitive region on the first substrate is smaller than an area of ​​an orthographic projection of the first lens on the first substrate.

[0029] In some embodiments, the plurality of second lenses are arranged in an array, the plurality of first lenses are of the same size, the plurality of second lenses are of the same size, and some or all of the plurality of first lenses are respectively opposite to the plurality of second lenses.

[0030] In some embodiments, the optical sensing device further includes a supporting structure supported between the image sensor chip and the first substrate.

[0031] In some embodiments, the optical sensing device further includes a reinforcement plate and a flexible circuit board, the flexible circuit board is provided with an opening, the image sensor chip is disposed in the opening of the flexible circuit board and is fixed to the reinforcement plate, and the image sensor chip is electrically connected to the flexible circuit board.

[0032] In some embodiments, the image sensor chip converts the received light beam into a corresponding electrical signal to obtain biometric information of an external object, or the optical sensing device is used to sense biometric information of an external object.

[0033] In some embodiments, the plurality of first lenses are spherical lenses or aspherical lenses.

[0034] In some embodiments, the plurality of second lenses are spherical lenses or aspherical lenses.

[0035] In some embodiments, the filter layer is formed on the upper surface and the lower surface of the first substrate, respectively.

[0036] The present application also provides an electronic device, comprising a display screen and an optical sensing device as described in any one of the above items, wherein the display screen is used to display images, and the optical sensing device is arranged below the display screen to receive a light beam returned by an external object through the display screen to perform biometric information sensing.

[0037] The beneficial effect of the present application is that the lens module of the optical sensing device includes a plurality of first lenses for converging light beams to a photosensitive module. Compared with the large lenses in the prior art, the plurality of first lenses have a smaller thickness and a smaller focal length, so that the optical sensing device has a compact, small volume and size, and can be used in electronic devices with limited internal space.

[0038] Furthermore, the lens module further includes a light shielding portion arranged in the interval area between the plurality of first lenses, the light shielding portion is not shorter than the first lens in height, or is shorter than the first lens but not shorter than 10 microns, so as to avoid or reduce the crosstalk of the light beam and improve the sensing accuracy. In addition, when pressure is applied to the lens module from top to bottom, the light shielding portion can bear all or most of the pressure, and the first lens will not be deformed or damaged due to the pressure, so as not to affect the optical imaging.

[0039] The optical sensing device can be used as an ultra-thin camera. In addition, it can also be applied under a display screen to realize optical information detection under the screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a schematic structural diagram of an embodiment of an electronic device of the present application.

[0041] Figure 2 It is a partial exploded schematic diagram of the optical sensing device according to the first embodiment of the present application.

[0042] Figure 3 for Figure 2 The optical detection device shown is along II-II ’ Schematic diagram of a partial cross section of the line.

[0043] Figure 4 Schematic diagrams of imaging of a large lens in the prior art and a first lens of the present application are shown.

[0044] Figure 5 1 is a schematic top view and a partial cross-sectional view of an optical sensing device according to a first embodiment of the present application.

[0045] Figure 6 It is a partial cross-sectional schematic diagram of an optical sensing device according to a second embodiment of the present application.

[0046] Figure 7 It is a partial cross-sectional schematic diagram of an optical sensing device according to the third embodiment of the present application.

[0047] Figure 8 It is a partial cross-sectional schematic diagram of an optical sensing device according to a fourth embodiment of the present application.

[0048] Fig. 9 It is a partial cross-sectional schematic diagram of an optical sensing device according to a fifth embodiment of the present application.

[0049] Fig.10 It is a partial cross-sectional schematic diagram of an optical sensing device according to a sixth embodiment of the present application.

[0050] Fig.11It is a partial cross-sectional schematic diagram of an optical sensing device according to the seventh embodiment of the present application. DETAILED DESCRIPTION

[0051] In the specific description of the embodiments of the present application, it should be understood that when a substrate, sheet, layer or pattern is referred to as being "on" or "under" another substrate, another sheet, another layer or another pattern, it may be "directly" or "indirectly" on another substrate, another sheet, another layer or another pattern, or one or more intermediate layers may also exist. For the purpose of clarity, the thickness and size of each layer in the drawings of the specification may be exaggerated, omitted or schematically indicated. In addition, the size of the elements in the drawings does not fully reflect the actual size.

[0052] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0053] Further, the described features and structures may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided so that the embodiments of the present application can be fully understood. However, those skilled in the art will appreciate that, even without one or more of the specific details, or by adopting other structures, components, etc., the technical scheme of the present application may also be put into practice. In other cases, known structures or operations are not shown or described in detail to avoid blurring the key points of the present application.

[0054] See also Figure 1 , Figure 1This is a schematic diagram of the structure of an embodiment of an electronic device of the present application. The electronic device 1000 includes an optical sensing device 1 and a display screen 2. The display screen 2 is used to display a picture. The optical sensing device 1 is located below the display screen 2, and is used to receive a light beam returned by an external object through the display screen 2, and convert the received light beam into a corresponding electrical signal to perform corresponding information sensing. The optical sensing device 1 is used, for example, to perform biometric information sensing, and the biometric information includes, for example but not limited to, fingerprint information, palm print information and other pattern feature information, and / or, blood oxygen information, heartbeat information, pulse information and other living body information. However, the present application is not limited to this, and the optical sensing device 1 can also be used to perform other information sensing, for example, for performing depth information sensing, proximity sensing, etc. In the present application, the optical sensing device 1 is mainly used to perform biometric information sensing as an example. The display screen 2 is, for example but not limited to, an OLED display screen or an LCD display screen. The display screen 2 can be used as an excitation light source to provide a light beam for detection, or an additional excitation light source is provided in the electronic device 1000 to provide a light beam for detection.

[0055] The electronic device 1000 may be, for example but not limited to, suitable types of electronic products such as consumer electronic products, home electronic products, vehicle-mounted electronic products, and financial terminal products. Among them, consumer electronic products may be, for example, mobile phones, tablet computers, laptop computers, desktop monitors, all-in-one computers, etc. Home electronic products may be, for example, smart door locks, televisions, refrigerators, etc. Vehicle-mounted electronic products may be, for example, vehicle-mounted navigation systems, vehicle-mounted DVD players, etc. Financial terminal products may be, for example, ATM machines and self-service terminals, etc.

[0056] It should be noted in advance that in the present application, the optical sensing device 1 has a plurality of different embodiments. For the sake of clarity, the optical sensing device 1 in different embodiments is marked with different reference numerals 1a, 1b, 1c, 1d, 1e, 1f, 1g for distinction. Furthermore, for the convenience of description, the same reference numerals in different embodiments of the optical sensing device 1 may represent the same elements, or may represent similar elements that may be changed, replaced, expanded, or combined.

[0057] Please also read Figure 2 and Figure 3 , Figure 2 It is a partial exploded schematic diagram of the optical sensing device 1 a according to the first embodiment of the present application. Figure 3 for Figure 2 The optical detection device 1a shown is along II-II ’The optical sensing device 1a includes a lens module 10 and a photosensitive module 20 located below the lens module 10. The lens module 10 is used to converge a light beam to the photosensitive module 20. The photosensitive module 20 is used to convert the received light beam into a corresponding electrical signal.

[0058] The lens module 10 includes a plurality of first lenses 110 and a light shielding portion 111. The plurality of first lenses 110 and the light shielding portion 111 are disposed on the photosensitive module 20. The plurality of first lenses 110 are arranged at intervals from each other. The plurality of first lenses 110 are used to converge light beams onto the photosensitive module 20. The light shielding portion 111 is disposed in the interval area between the plurality of first lenses 110 and is higher than the first lenses 110 in height. The light shielding portion 111 is used to shield light beams.

[0059] Optionally, the lens module 10 further includes a first substrate 12. The first substrate 12 includes an upper surface 121 and a lower surface 122 opposite to each other, one side of the upper surface 121 is above the first substrate 12, and one side of the lower surface 122 is below the first substrate 12. The lens module 20 is disposed below the first substrate 12 and faces the lower surface 122. The plurality of first lenses 110 and the light shielding portion 111 are disposed on the upper surface 121 of the first substrate 12. The highest height of the light shielding portion 111 relative to the first surface 121 is higher than the highest height of the first lens 110 relative to the first surface 121.

[0060] Optionally, the upper surface 121 and / or the lower surface 122 of the first substrate 12 are planes. Further optionally, the upper surface 121 and the lower surface 122 are planes parallel to each other.

[0061] Optionally, the first substrate 12 is a transparent substrate, such as but not limited to, a transparent glass substrate or a transparent resin substrate.

[0062] However, alternatively, in some embodiments, the first substrate 12 may be omitted.

[0063] Optionally, when the first substrate 12 is omitted, the first connecting layer 41 can also be omitted. When manufacturing the lens module 10, the photosensitive module 20 is used as a supporting substrate, and the first lens 110 is formed on the photosensitive module 20 through a stamping process. As a result, the first substrate 12 and the first connecting layer 41 are saved, and the thickness of the optical sensing device 1a is made thinner.

[0064] Optionally, the plurality of first lenses 110 are arranged in a regular array. Further optionally, the plurality of first lenses 110 are arranged in, for example but not limited to, a rectangular array. However, alternatively, in some embodiments, the plurality of first lenses 110 may also be arranged irregularly.

[0065] Optionally, the light shielding portion 111 is only located between some adjacent first lenses 110 , or the light shielding portion 111 is disposed between any adjacent first lenses 110 .

[0066] Optionally, the light shielding portion 111 is higher than the first lens 110 by any value between 5 micrometers and 100 micrometers. Further optionally, the light shielding portion 111 is higher than the first lens 110 by any value between 5 micrometers and 10 micrometers. However, the present application is not limited thereto, as long as the light shielding portion 111 is higher than the first lens 110 in height, it shall fall within the protection scope of the present application.

[0067] Optionally, the plurality of first lenses 110 are convex lenses. Further optionally, the plurality of first lenses 110 are spherical lenses or aspherical lenses.

[0068] Optionally, the plurality of first lenses 110 are made of a transparent material, such as but not limited to transparent acrylic resin, transparent glass, UV adhesive material, etc.

[0069] Optionally, the plurality of first lenses 110 are, for example, completely identical. However, alternatively, in some embodiments, the plurality of first lenses 110 may not be completely identical.

[0070] The photosensitive module 20 includes a plurality of pixel units 212. The plurality of pixel units 212 are used to receive light beams through the lens module 10 and convert the received light beams into corresponding electrical signals to obtain the external object 1001 (see Figure 1 ) The external object 1001 is, for example but not limited to, a finger or palm of a user. The pixel unit 212 is, for example but not limited to, a photodiode.

[0071] Optionally, the plurality of pixel units 212 are arranged in a regular array. However, alternatively, in some embodiments, the plurality of pixel units 212 may also be arranged in an irregular array.

[0072] Optionally, each of the first lenses 110 is respectively opposite to the plurality of pixel units 212. However, alternatively, in some embodiments, the plurality of first lenses 110 may also be opposite to the plurality of pixel units 212 one by one.

[0073] Compared with each first lens 110 facing only one pixel unit 212 , each first lens 110 in the embodiment of the present application faces multiple pixel units 212 , and its photosensitive area can be increased. The sensing accuracy of the latter is higher than that of the former.

[0074] The area on the plurality of pixel units 212 that can receive the light beam through the first lens 110 is defined as an effective photosensitive area 211. The effective photosensitive area 211 can convert the light beam into a corresponding electrical signal.

[0075] Optionally, each effective photosensitive area 211 is opposite to one of the first lenses 110. The light beam passing through the first lens 110 converges to the effective photosensitive area 211 opposite to the first lens 110. The effective photosensitive areas 211 opposite to each first lens 110 are arranged at intervals from each other. The area of ​​the effective photosensitive area 211 is smaller than the area of ​​the orthographic projection of the first lens 110 on the photosensitive surface 210.

[0076] Optionally, the light beams can reach the plurality of pixel units 212 after being converged by the first lenses 110. That is, the effective photosensitive area 211 includes the area where the plurality of pixel units 212 are located.

[0077] The light shielding portion 111 is higher than the first lens 110 , so that part or all of the light beam 101 passing through the first lens 110 will not be transmitted to the effective photosensitive area 211 adjacent to or facing other first lenses 110 .

[0078] Optionally, the plurality of pixel units 121 are integrated in an image sensor chip (Die) 21. Further optionally, the thickness of the image sensor chip 21 may be about 100 micrometers.

[0079] The surface of the image sensor chip 21 that can sense the light beam is defined as the photosensitive surface 210, and the lens module 10 is located on the photosensitive surface 210. The highest height from the light shielding layer 111 to the photosensitive surface 210 is higher than the highest height from the first lens 110 to the photosensitive surface 210.

[0080] Optionally, a first connection layer 41 is provided between the photosensitive module 20 and the lens module 10, and the first connection layer 41 is, for example but not limited to, DAF (die attach film), solid glue, liquid glue, optical glue, or any other suitable adhesive. The first connection layer 41 fills and covers the corresponding portion between the lens module 10 and the photosensitive module 20.

[0081] Optionally, the optical sensing device 1a further includes a filter layer 13. The filter layer 13 is disposed above the plurality of pixel units 212.

[0082] In some embodiments, the filter layer 13 is used to transmit the light beam in the target band and filter out the light beam outside the target band, thereby reducing the interference of stray light on the sensing accuracy. The light beam in the target band is, for example, visible light.

[0083] Alternatively, in some other embodiments, the filter layer 13 is used to filter out light beams in a second preset band, and the shading portion 111 is used to filter out light beams in a first preset band, wherein the first preset band is completely different from, completely the same as, or partially the same as the second preset band.

[0084] When the first preset band is partially the same as the second preset band, the first preset band includes the second preset band. For example, the first preset band includes a visible light band and a near infrared light band, and the second preset band includes a near infrared light band. The filter layer 13 is, for example, an infrared cutoff filter.

[0085] In some embodiments, the filter layer 13 is disposed on the photosensitive module 20, or / and, the filter layer 13 is disposed on the lens module 10. Specifically, for example, the filter layer 13 is disposed on the plurality of first lenses 110 and the light shielding layer 111. Alternatively, the filter layer 13 is disposed on the upper surface 121 and / or the lower surface 122 of the first substrate 12. Alternatively, the filter layer 13 and the plurality of pixel units 212 are integrated in the image sensor chip 21.

[0086] In particular, when the filter layer 13 is respectively formed on the upper surface 121 and the lower surface 122 of the first substrate 12, the upper surface 121 and the lower surface 122 of the first substrate 12 are affected by factors such as the tension of the filter layer 13 in roughly the same way, thereby reducing the problem of warping of the optical sensing device 1a due to being too thin to a certain extent.

[0087] Optionally, the filter layer 13 is formed on the photosensitive surface 210 of the image sensor chip 21 by, for example, an evaporation process.

[0088] Optionally, the filter layer 13 has a thickness of 1 micron to 5 microns.

[0089] Optionally, the optical sensing device 1a further includes a second substrate 30 located below the photosensitive module 20. The second substrate 30 is used, for example, to provide support for the photosensitive module 20 and to electrically connect to an external circuit. The second substrate 30 is, for example, a flexible circuit board or a rigid circuit board.

[0090] Optionally, the optical sensing device 1a also includes a second connecting layer 42 located between the photosensitive module 20 and the second substrate 30, the second connecting layer 42 is used to connect the photosensitive module 20 and the second substrate 30, and the second connecting layer 42 is located between the photosensitive module 20 and the second substrate 30 and covers the relative parts between the photosensitive module 20 and the second substrate 30.

[0091] Please refer to Figure 3 , Figure 3 Two adjacent first lenses 110 are shown, and their corresponding optical centers are G1 and G2, respectively. The distance LP between the optical centers G1 and G2 is the pitch. Optionally, the pitch can be any value between 300 microns and 500 microns, for example but not limited to, the pitch can be 350 microns, 400 microns, or 450 microns.

[0092] Optionally, the maximum width LR or diameter of the first lens 110 is, for example but not limited to, 100 micrometers.

[0093] The first lens 110 includes a curved surface 1101, and the curved surface 1101 can converge the light beam 101 entering the first lens 110. Optionally, in some embodiments, the first lens 110 can be a mini-lens, and the mini-lens includes the curved surface 1101 and a lens bottom surface 1102 connected to the curved surface, the curved surface 1101 is a convex surface, and the lens bottom surface 1102 is located on the upper surface 121 of the first substrate 12. For example but not limited to, the sag H1 of the mini-lens can be 20 microns, the lens bottom surface 1102 can be a circle with a diameter of 100 to 150 microns, and the curved surface 1101 can be a spherical surface with a radius of 80 to 100 microns.

[0094] Optionally, the light shielding portion 111 includes a blocking wall 1111 and a light shielding layer 1112. The blocking wall 1111 is located in the spacing area between the plurality of first lenses 110. The light shielding layer 1112 is located above the blocking wall 1111 and covers the spacing area between the first lenses 110. The light shielding layer 1112 is used to shield the light beam 101. For example, the light shielding layer 1112 prevents the light beam 101 from passing through the spacing area between the first lenses 110.

[0095] Optionally, the retaining wall 1111 and the first lens 110 may be made of the same transparent material. The transparent material may be, for example but not limited to, transparent acrylic resin, transparent glass, UV adhesive material, etc. The retaining wall 1111 and the first lens 110 may be formed at one time by a stamping process. Thus, the process production flow can be shortened, the production efficiency can be improved, and the product cost can be reduced.

[0096] Figure 3 This is just an example. In an actual product, the retaining wall 1111 and the first lens 110 may be integrated. There is no disconnection between the retaining wall 1111 and the plurality of first lenses 110 and they are formed integrally from the same material.

[0097] When the first substrate 12 and the first connection layer 41 are omitted, the image sensor chip 21 serves as a carrier substrate, and the plurality of first lenses 110 and the retaining wall 1111 in the lens module 10 are formed on the image sensor chip 21 by, for example but not limited to, a stamping process. Due to the use of the stamping process, the manufacturing cost of the optical sensing device 1a is relatively low.

[0098] However, alternatively, in some embodiments, the retaining wall 1111 and the plurality of first lenses 101 may be made of different materials, and the retaining wall 1111 and the plurality of first lenses 101 may be separately manufactured and formed one after another. The present application does not impose any limitation on this.

[0099] Optionally, the material of the light shielding layer 1112 is an opaque resin material or other opaque material, and the light beam 101 cannot pass through the light shielding layer 1112. Optionally, the light shielding layer 1112 can be made by coating, spraying, evaporation, embossing or other suitable processes, and its thickness can be 1 micron to 5 microns.

[0100] Optionally, a height H2 of the retaining wall 1111 relative to the upper surface 121 is greater than a height H1 of the first lens 110 relative to the upper surface 121 .

[0101] Taking two adjacent first lenses 110 with the shading portion 111 disposed between the two adjacent first lenses 110 as an example, the shading portion 111 is used to prevent part or all of the light beam 101 passing through one of the first lenses 110 from reaching the effective photosensitive area 211 directly facing the other first lens 110.

[0102] However, alternatively, in some embodiments, the light shielding layer 1112 is omitted, and the retaining wall 1111 is made of a light-proof material.

[0103] The retaining wall 1111 may have different structures, positions or quantities, all of which should fall within the protection scope of the present application.

[0104] In the present application, the shading portion 111 is higher than the first lens 110 in height, so that part or all of the light beam passing through the first lens 110 will not be transmitted to the effective photosensitive area 211 directly facing the adjacent or remaining first lenses 110. Thus, it is possible to reduce or avoid mutual interference of light beams and improve sensing accuracy. In addition, since the shading portion 111 is higher than the first lens 110 in height, when pressure is applied to the lens module 10 from top to bottom, the shading portion 111 can bear all or most of the pressure, and the first lens 110 will not be deformed or damaged due to the pressure, thereby not affecting optical imaging.

[0105] For example but not limited to, when forming the filter layer 13 on the lower surface 122 of the first substrate 12, when connecting the lens module 10 and the photosensitive module 20, and when connecting the photosensitive module 20 and the second substrate 30, pressure may be applied to the lens module 10. Since the shielding portion 111 is higher than the first lens 110, the first lens 110 will not be damaged due to the pressure.

[0106] However, in some embodiments, the light shielding portion 111 may be flush with the first lens 110 or completely lower than the first lens 110 in height. For example, the highest height of the light shielding portion 111 relative to the photosensitive surface 210 is equal to or lower than the highest height of the first lens 110 relative to the photosensitive surface 210.

[0107] Optionally, when the light shielding portion 111 is lower than the first lens 110 in height, the first lens 110 cannot be higher than the light shielding portion 111 by 10 micrometers. In this way, the interference of the light beam after passing through each first lens 110 is small and the light flux is high, thereby improving the sensing accuracy.

[0108] For example, the difference between the highest height of the first lens 110 relative to the photosensitive surface 210 and the highest height of the light shielding portion 111 relative to the photosensitive surface 210 is not greater than 10 micrometers.

[0109] See also Figure 4 , Figure 4 Schematic diagrams of imaging of the large lens 1002 of the prior art and the first lens 110 of the present application are shown. The light incident surface of the large lens 1002 is the convex surface of a single lens. The first lens 110 of the optical sensing device 1a described in the embodiment of the present application adopts a mini-lens. The curved surfaces 1101 of the multiple first lenses 110 of the optical sensing device 1a simultaneously serve as light incident surfaces. It should be noted that the lenses described in the present application document all refer to convex lenses. The focal length of the lens can be determined based on the viewing angle of the electronic device 1000 and the size of the lens. For example, when the viewing angle is fixed, the focal length can increase in proportion to the size of the lens.

[0110] Taking fingerprint detection as an example, in order to obtain sufficient fingerprint characteristic information, the large lens 1002 and the small lens 110 need to converge the light beam in the detection area VA for imaging. For example, but not limited to, the detection area VA may be a rectangular area of ​​4 mm*4 mm to 10 mm*10 mm, or the detection area VA may be a circle with a diameter greater than or equal to 4 mm and less than or equal to 10 mm. Of course, the detection area VA may have other configurations, which are not limited in the embodiments of the present application.

[0111] The diameter of the large lens 1002 in the prior art may generally be 1 mm or larger, while the diameter of the first lens 110 in the present application may be 100 μm, which is only 1 / 10 of the diameter of the large lens 1002, and the focal length of the first lens 110 is smaller than that of the large lens 1002. In addition, in the optical sensing device 1a, each different first lens 110 is used to collect a portion of the detection area VA. For example Figure 4 As shown, three different first lenses 110 are respectively used to converge and image the light beam 101 passing through the sub-detection areas V1, V2, and V3, and the sub-detection areas V1, V2, and V3 are local areas of the detection area VA, and the sub-detection areas V1, V2, and V3 may overlap or not overlap. In contrast, the large lens 1002 in the prior art needs to converge and image the light beam 101 passing through the entire detection area VA. When the viewing angle is basically the same, the distance between the optical center of the first lens 110 and the detection area VA is smaller than the distance between the optical center of the large lens 1002 and the detection area VA, and the distance between the optical center of the first lens 110 and the photosensitive surface 210 of the photosensitive module 20 is smaller than the distance between the optical center of the large lens 1002 and the photosensitive surface 210 of the image sensor chip 21.

[0112] Therefore, the distance between the detection area VA in the prior art and the photosensitive surface 210 of the image sensor chip 21 is greater than the distance between the detection area VA and the photosensitive surface 210 of the image sensor chip 21 when the optical sensing device 1a in the embodiment of the present application is used for fingerprint detection. It can be seen that compared with the prior art, the optical sensing device 1a of the present application has a more compact and small volume and size, and can be used in electronic devices 1000 that have more stringent requirements on the internal space occupation, such as mobile phones, tablet computers, smart watches, etc. The module thickness of the optical sensing device 1a of the present application ( Figure 3 The thickness from the retaining wall 1111 to the second substrate 30 can be less than 0.5 mm, such as 0.4 mm, 0.35 mm or less. The optical sensing device 1a can be used as an ultra-thin camera or applied to the display screen 2 (see Figure 1 ) to enable under-screen optical biometric detection.

[0113] See also Figure 5 , Figure 5 1 is a schematic top view and a partial cross-sectional view of the optical sensing device 1 a. Figure 5 The middle symbol PA represents a plurality of pixel units 212 of the image sensor chip 21 (see Figure 3 ) is located, and the label BA represents the peripheral area of ​​the image sensor chip 21. The peripheral area BA is located around the pixel area PA. The optical sensing device 1a also includes a wire 22, and the image sensor chip 21 is electrically connected to the second substrate 30 through the wire 22. The second substrate 30 can be electrically connected to an external integrated circuit. The first connection layer 41 of the optical sensing device 1a is located between the lens module 10 and the photosensitive module 20, and basically covers the relative surface between the lens module 10 and the image sensor chip 21. The second connection layer 42 of the optical sensing device 1a connects the image sensor chip 21 and the second substrate 30.

[0114] See also Figure 6 , Figure 6 1 is a partial cross-sectional schematic diagram of an optical sensing device 1b of the second embodiment of the present application. The optical sensing device 1b has a substantially identical structure to the optical sensing device 1a, with the main difference being that the first connection layer 41a of the optical sensing device 1b is located between the lens module 10 and the image sensor chip 21, and is directly opposite to the edge of the lens module 10 and the image sensor chip 21. There is air 1003 between the lens module 10 and the image sensor chip 21. The first connection layer 41a is formed, for example but not limited to, between the edge of the lens module 10 and the image sensor chip 21 by a dispensing process.

[0115] See also Figure 7 , Figure 7 This is a partial cross-sectional schematic diagram of an optical sensing device 1c of the third embodiment of the present application. The structure of the optical sensing device 1c is basically the same as that of the optical sensing device 1a. The main difference between the two is that the first connection layer 41b of the optical sensing device 1c is connected to at least part of the outer edge of the lens module 10, part of the peripheral area BA, part of the outer edge of the image sensor chip 21, and the upper surface of the second substrate 30 (i.e., the surface of the second substrate 30 adjacent to the image sensor chip 21). At this time, the lens module 10 and the image sensor chip 21 are facing each other and in direct contact. The first connection layer 41b is, for example but not limited to, made by a dispensing process.

[0116] Alternatively, a portion of the edge of the lens module 10 extends beyond the edge of the image sensor chip 21 , and the first connecting layer 41 b can be connected to at least a portion of the outer edge of the lens module 10 , a portion of the peripheral area BA, and the upper surface of the second substrate 30 .

[0117] See also Figure 8 , Figure 8 1 is a partial cross-sectional schematic diagram of an optical sensing device 1d according to a fourth embodiment of the present application. The optical sensing device 1d has a substantially similar structure to the optical sensing device 1b, with the main difference being that the photosensitive module 20 further includes a support structure 23 disposed between the image sensor chip 21 and the lens module 10. The support structure 23 is located between the plurality of pixel units 212 (see FIG. 1 ) of the image sensor chip 21. Figure 3 ), and the support structure 23 is arranged in the spacing area opposite to the first lens 110. The support structure 23 can be made of transparent or opaque material, and is used to maintain a certain gap between the lens module 10 and the image sensor chip 21, and the support structure 23 can play a supporting role. The support structure 23 can also be used to maintain the spacing distance between the lens module 10 and the image sensor chip 21, so that the lens module 10 will not be obviously higher on one side and lower on the other side relative to the image sensor chip 21.

[0118] See also Fig. 9 , Fig. 9 30c is a partial cross-sectional schematic diagram of an optical sensing device 1e according to the fifth embodiment of the present application. The optical sensing device 1e has a substantially identical structure to the optical sensing device 1a, with the main difference being that the flexible circuit board 50 of the optical sensing device 1e has an opening 51, the photosensitive module 20 is disposed on the reinforcing plate 30c, and the lens module 10 and the photosensitive module 20 are located in the opening 51. Since there is no flexible circuit board 50 between the photosensitive module 20 and the reinforcing plate 30c, the overall thickness (or height) of the optical sensing device 1e is relatively small.

[0119] Optionally, the thickness of the flexible circuit board 50 is 0.1 mm, and the thickness of the optical sensing device 1c can be reduced by 0.1 mm compared to the flexible circuit board 50 without the opening 51. Optionally, the reinforcing plate 30c is a metal substrate, such as but not limited to: an aluminum substrate, a stainless steel substrate, etc.

[0120] See also Fig.10 , Fig.10 1 is a partial cross-sectional schematic diagram of an optical sensing device 1f according to the sixth embodiment of the present application. For ease of description, the structure of the optical sensing device 1f is substantially the same as that of the optical sensing devices 1a to 1e, and the main difference is that the structure of the lens module 10a of the optical sensing device 1f is different from that of the lens module 10 of the optical sensing devices 1a to 1e.

[0121] The light shielding portion 111a of the lens module 10a includes a light shielding layer 1112a and a blocking wall 1111a. The light shielding layer 1112a is located between the blocking wall 1111a and the upper surface 121 of the first substrate 12. An opening K is formed on the light shielding layer 1112a to expose the upper surface 121, and the first lens 110 is formed above the opening K and overlaps with the edge portion of the light shielding layer 1112a. The blocking wall 1111a is formed directly above the light shielding layer 1112a, and the blocking wall 1111a and the light shielding layer 1112a are both used to shield the light beam. The blocking wall 1111a prevents part or all of the light beam 101 passing through the first lens 110 from being transmitted to the effective photosensitive area 211 directly facing the adjacent or other first lenses 110.

[0122] In this embodiment, the retaining wall 1111a itself is made of a material that cannot transmit the light beam 101. The material of the light shielding layer 1112b is an opaque resin material or other opaque material, and the light beam 101 cannot pass through the light shielding layer 1112b.

[0123] Optionally, the light shielding layer 1112a can be formed on the first substrate 12 by an evaporation process, and then an opening K corresponding to the arrangement position of the first lens 110 is formed by a photolithography process, and the opening K exposes the upper surface 121 of the first substrate 12. The first lens 110 and the retaining wall 1111a are then formed by multiple photolithography processes.

[0124] It should be noted that the shielding of the light beam in the present application may be absorption and / or reflection of the light beam. Optionally, shielding the light beam may include a light beam transmittance of less than 10%, 5%, 1%, or equal to.

[0125] The light shielding portion 111 a is higher in height than the first lens 110 . For example, the highest height of the light shielding portion 111 a relative to the photosensitive surface 210 is higher than the highest height of the first lens 110 relative to the photosensitive surface 210 .

[0126] However, in some embodiments, the light shielding portion 111a may be flush with the first lens 110 or completely lower than the first lens 110 in height. For example, the highest height of the light shielding portion 111a relative to the photosensitive surface 210 is equal to or lower than the highest height of the first lens 110 relative to the photosensitive surface 210.

[0127] Optionally, when the light shielding portions 111a are all lower in height than the first lens 110, the first lens 110 is, for example, not higher than the light shielding portion 111a by 10 micrometers. In this way, the interference of the light beam after passing through each first lens 110 is small and the light flux is high, thereby improving the sensing accuracy.

[0128] For example, the difference between the highest height of the first lens 110 relative to the photosensitive surface 210 and the highest height of the light shielding portion 111 a relative to the photosensitive surface 210 is not greater than 10 micrometers.

[0129] Please also read Figure 3 and Fig.11 , Fig.11 1 is a partial cross-sectional schematic diagram of an optical sensing device 1g according to the seventh embodiment of the present application. The optical sensing device 1g may have substantially the same structure as the optical sensing devices 1a to 1f of the above-mentioned embodiments, with the main difference being that the photosensitive module 20 of the optical sensing device 1g further includes a plurality of second lenses 213. The plurality of second lenses 213 are disposed between the image sensor chip 21 and the lens module 10. The plurality of second lenses 213 are used to converge light beams to the image sensor chip 21. The second lenses 213 are disposed on the first substrate 12 (see FIG. 1 ) of the lens module 10. Figure 3 ) is smaller than the area of ​​the orthographic projection of the first lens 110 on the first substrate 12. The focal length of the second lens 213 is smaller than the focal length of the first lens 110.

[0130] Optionally, the plurality of second lenses 213 are arranged in a regular array, such as a rectangular array. However, alternatively, in some embodiments, the plurality of second lenses 213 may also be arranged irregularly. Further optionally, the plurality of second lenses 213 are identical and are all convex lenses.

[0131] Optionally, the second mirror 213 is made of a transparent material, such as but not limited to transparent acrylic resin, transparent glass, UV adhesive material, etc.

[0132] Preferably, the second lens 213 is a micro lens. The plurality of second lenses 213 and the plurality of pixel units 212 (see Figure 3 Each first lens 110 faces a plurality of the pixel units 212 and / or a plurality of the second lenses 213 .

[0133] Optionally, the area occupied by each microlens 213 is not larger than the area occupied by a single pixel unit 212 .

[0134] However, in some embodiments, the plurality of second lenses 213 may be opposite to the plurality of first lenses 110 one by one, and respectively opposite to the plurality of pixel units 212. Alternatively, the plurality of first lenses 110 are opposite to the plurality of pixel units 212 one by one, and the plurality of second lenses 213 are opposite to the plurality of first lenses 110 one by one. As long as the area of ​​the orthographic projection of the second lens 213 on the first substrate 12 is smaller than the area of ​​the orthographic projection of the first lens 110 on the first substrate 12, various embodiments shall fall within the protection scope of the present application.

[0135] Optionally, the first connection layer 41a allows air 1003 to be provided between the lens module 10 and the image sensor chip 21. A space 1002 is provided between the second lens 213 and the lens module 10. Due to the different refractive indices of the air 1001 and the second lens 213, the light beam is refracted when entering the second lens 213 from the air 1003. The second lens 213 is a convex lens, and the light beam 101 is converged and gathered by the second lens 213 after being refracted, so that more light beams 101 can be received by the pixel unit 212, thereby having better optical imaging quality.

[0136] However, if Figure 5 As shown, the first connecting layer 41 can also replace the first connecting layer 41a and be formed between the lens module 10 and the image sensor chip 21, and the first connecting layer 41 directly contacts and covers the multiple second lenses 213, and there is no air between the lens module 10 and the image sensor 21.

[0137] Or, if Figure 7 As shown, the first connection layer 41b may replace the first connection layer 41a and be formed outside the edge of the lens module 10 and the image sensor chip 21, etc. This is also possible.

[0138] It should be noted that part or all of the structures, functions, and methods of the embodiments of the present application can be applied in other or modified embodiments, and are not limited to the embodiments described in the corresponding descriptions, and all embodiments obtained thereby belong to the protection scope of the present application. In addition, in the embodiments of the present application, the light beam can be visible light or invisible light, and the invisible light can be, for example, near-infrared light. The words "overlap", "coincide", and "overlap" that may appear in the description of the present application should be understood to have the same meaning and can be replaced with each other.

[0139] It should be noted that those skilled in the art can understand that, without paying any creative labor, part or all of the implementation methods of the present application, as well as part or all of the deformation, replacement, change, splitting, combination, expansion, etc. of the implementation methods should be considered to be covered by the application creative idea of ​​the present application and belong to the protection scope of the present application.

[0140] Any reference in this specification to "one embodiment", "an embodiment", "an example embodiment", etc. indicates that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present application. Such phrases appearing in different places in this specification do not necessarily all refer to the same embodiment. In addition, when a particular feature or structure is described in conjunction with any embodiment, it is claimed that it is within the technical scope of those skilled in the art to implement such feature or structure in conjunction with other embodiments of these embodiments.

[0141] The orientation or positional relationship indicated by “length”, “width”, “up”, “down”, “left”, “right”, “front”, “rear”, “back”, “front”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, etc. that may appear in the specification of this application is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the implementation methods of this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on this application. Similar numbers and letters represent similar items in the drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms “first”, “second”, etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of this application, the meaning of “multiple” or “multiple” is at least two or two, unless otherwise clearly and specifically defined. In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, "setting", "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0142] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. The terms used in the claims should not be understood to limit the application to the specific implementations disclosed in this specification. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. An optical sensing device, characterized in that: include: An image sensor chip, comprising a plurality of pixel units, wherein the pixel units are used to receive a light beam and convert the received light beam into a corresponding electrical signal, and a surface of one side of the image sensor chip used to sense the light beam is defined as a photosensitive surface; and Lens module, including: A plurality of first lenses are disposed on the image sensor chip, the plurality of first lenses are spaced apart from each other and each first lens faces the plurality of pixel units, and the plurality of first lenses are used to converge light beams to the plurality of pixel units; and A light shielding portion is arranged on the image sensor chip, the light shielding portion is located in the interval area between the plurality of first lenses and is not shorter than the first lens in height, or is shorter than the first lens but not shorter than 10 microns, and the light shielding portion is used to shield the light beam; wherein, The lens module further includes a first substrate, the first substrate includes an upper surface and a lower surface opposite to each other, one side of the upper surface is above the first substrate, one side of the lower surface is below the substrate, and the image sensor chip is located below the first substrate; the plurality of first lenses and the light shielding portion are arranged on the upper surface of the first substrate, and the image sensor chip is fixed to the lens module by dispensing glue; The optical sensing device further includes a plurality of second lenses, the plurality of second lenses are located between the plurality of first lenses and the plurality of pixel units, and the plurality of second lenses are directly opposite to the plurality of pixel units one by one, the plurality of second lenses are used to converge light beams to the plurality of pixel units, air is spaced between the second lenses and the first substrate, and a refractive index of the second lenses is greater than a refractive index of air.

2. The optical sensing device according to claim 1, wherein: The highest height from the light-shielding portion to the photosensitive surface is not lower than the highest height from the first lens to the photosensitive surface; or, the highest height from the light-shielding portion to the photosensitive surface is lower than the highest height from the first lens to the photosensitive surface, and the height difference between the highest height from the first lens to the photosensitive surface and the highest height from the light-shielding portion to the photosensitive surface is not greater than 10 microns.

3. The optical sensing device according to claim 1, wherein: The areas on the plurality of pixel units that can receive the light beam through the first lens are defined as effective photosensitive areas. Each effective photosensitive area is opposite to one of the first lenses. The light beam passing through the first lens converges to the effective photosensitive area opposite to the first lens.

4. The optical sensing device according to claim 3, wherein: The shading portion is used to prevent part or all of the light beam passing through the first lens from being transmitted to the effective photosensitive area directly facing the adjacent or remaining first lenses.

5. The optical sensing device according to claim 1, wherein: The light shielding portion includes a blocking wall and a light shielding layer, the blocking wall is located between the image sensor chip and the light shielding layer, and the light shielding layer is used to shield the light beam.

6. The optical sensing device according to claim 5, wherein: The blocking wall and the first lens are made of the same light-transmitting material.

7. The optical sensing device according to claim 1, wherein: The light-shielding portion includes a blocking wall and a light-shielding layer, wherein the light-shielding layer is formed on the image sensor chip and has a plurality of openings exposing the photosensitive surface, wherein the plurality of first lenses are formed above the light-shielding layer, wherein the first lens is directly opposite to one of the openings and overlaps with an edge portion of the light-shielding layer, and the blocking wall is formed on the light-shielding layer and is located in a spacing area between the first lenses, wherein the light-shielding layer and the blocking wall are used to block light beams.

8. The optical sensing device according to claim 3, wherein: For the light shielding portion located between two adjacent first lenses and the light shielding portion between the two adjacent first lenses: the light shielding portion is not lower than the two adjacent first lenses in height, or the light shielding portion is lower than the two adjacent first lenses but not less than 10 microns, so that part or all of the light beam passing through one of the first lenses will not be transmitted to the effective photosensitive area directly facing the other first lens.

9. The optical sensing device according to claim 5 or 7, wherein: The highest height from the blocking wall to the photosensitive surface is higher than the highest height from the first lens to the photosensitive surface.

10. The optical sensing device according to claim 1, wherein: The light shielding portion is higher than the first lens in height by any value between 5 micrometers and 100 micrometers.

11. The optical sensing device according to claim 10, wherein: The light shielding portion is higher than the first lens by any value between 5 micrometers and 10 micrometers.

12. The optical sensing device according to claim 5 or 7, wherein: The pitch between adjacent first lenses is any value in the range of 300 micrometers to 500 micrometers.

13. The optical sensing device according to claim 1, wherein: The plurality of first lenses are arranged in an array, and the plurality of pixel units are arranged in an array.

14. The optical sensing device according to claim 1, wherein: The optical sensing device further includes a filter layer disposed above the plurality of pixel units, the filter layer being used to transmit the light beam in the target band and filter out the light beam outside the target band, the plurality of pixel units being used to receive the light beam in the target band and convert the light beam in the target band into a corresponding electrical signal.

15. The optical sensing device according to claim 1, wherein: The optical sensing device further includes a filter layer, which is arranged above the multiple pixel units, and the filter layer is used to transmit the light beam of the target band and filter out the light beam of the second preset band. The shading portion is used to filter out the light beam of the first preset band, wherein the first preset band is completely different from, completely the same as, or partially the same as the second preset band.

16. The optical sensing device according to claim 15, wherein: When the first preset band is partially identical to the second preset band, the first preset band includes the second preset band.

17. The optical sensing device according to claim 16, wherein: The first preset waveband includes a visible light waveband and a near infrared light waveband, and the second preset waveband includes a near infrared light waveband.

18. The optical sensing device according to claim 3, wherein: An area of ​​an orthographic projection of the effective photosensitive region on the first substrate is smaller than an area of ​​an orthographic projection of the first lens on the first substrate.

19. The optical sensing device according to claim 1, wherein: The plurality of second lenses are arranged in an array, the plurality of first lenses are of the same size, the plurality of second lenses are of the same size, and some or all of the plurality of first lenses are respectively facing the plurality of second lenses.

20. The optical sensing device according to claim 1, wherein: The optical sensing device further includes a supporting structure supported between the image sensor chip and the first substrate.

21. The optical sensing device according to claim 1, wherein: The optical sensing device further includes a reinforcing plate and a flexible circuit board. The flexible circuit board is provided with an opening. The image sensor chip is arranged in the opening of the flexible circuit board and is fixed to the reinforcing plate. The image sensor chip is electrically connected to the flexible circuit board.

22. The optical sensing device according to claim 1, wherein: The image sensor chip converts the received light beam into a corresponding electrical signal to obtain the biometric information of the external object, or the optical sensing device is used to sense the biometric information of the external object.

23. The optical sensing device according to claim 1, wherein: The plurality of first lenses are spherical lenses or aspherical lenses.

24. The optical sensing device according to claim 1, wherein: The plurality of second lenses are spherical lenses or aspherical lenses.

25. The optical sensing device according to claim 15, wherein: The filter layers are formed on the upper surface and the lower surface of the first substrate respectively.

26. An electronic device, characterized in that: The electronic device includes a display screen and the optical sensing device described in any one of claims 1 to 25, wherein the display screen is used to display images, and the optical sensing device is arranged below the display screen to receive a light beam returned by an external object through the display screen to perform biometric information sensing.

Images