A hole depth measuring device and method

Abstract

The present invention provides a hole depth measurement device and method, comprising a frame, a positioning and feeding mechanism arranged on the frame, and a detection mechanism arranged above the positioning and feeding mechanism; the positioning and feeding mechanism comprises a feeding Y-axis module arranged on the frame and a bearing unit connected to the feeding Y-axis module in a transmission manner. The bearing unit carries the product to be measured, and the feeding Y-axis module of the positioning and feeding mechanism transmits and feeds the product to the bottom of the detection mechanism. After the detection mechanism detects and calculates multiple points on the surface of the product to obtain a reference plane, it measures the hole depth of the product to obtain the hole depth of the product, thereby realizing the automatic measurement of the hole depth of the product, and the measurement is efficient and convenient with high measurement accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic product production, and in particular to a hole depth measuring device and method. Background Art

[0002] In the production process of electronic products such as mobile phones and watches, it is necessary to measure the hole depth on the product buttons. Manual measurement has low test accuracy, low efficiency and waste of manpower. The hole depth needs to be measured downward according to the reference plane on the product surface to obtain the hole depth. Summary of the invention

[0003] The technical problem solved by the present invention is to provide a hole depth measuring device and method.

[0004] In order to solve the above technical problems, the present invention provides a hole depth measuring device, including a frame, a positioning and feeding mechanism arranged on the frame, and a detection mechanism arranged above the positioning and feeding mechanism; the positioning and feeding mechanism includes a feeding Y-axis module arranged on the frame and a bearing unit transmission-connected to the feeding Y-axis module.

[0005] Furthermore, the carrying unit includes a carrying plate, a receiving groove arranged in the carrying plate, a second Y-axis slide rail arranged in the receiving groove, a first sliding plate slidingly matched with the second Y-axis slide rail, wedge blocks arranged on both sides of the first sliding plate, two groups of holding molds respectively abutting against the two wedge blocks, a Y-axis guide block arranged on the first sliding plate, a carrier plate group abutting against the Y-axis guide block, a handle arranged at the front end of the first sliding plate, a first return spring arranged at the rear end of the first sliding plate, a clamp arranged on one side of the receiving groove, and a clamp cylinder arranged at the bottom of the carrying plate to drive the clamp to clamp.

[0006] Furthermore, side plates are respectively arranged around the bearing plate, the first return spring is in contact with the side plates, wherein a through hole is arranged on the front end of the side plate, and the handle extends out of the through hole.

[0007] Furthermore, each group of the holding modules includes a holding X-axis slide rail arranged on the supporting plate, a second sliding plate slidably matched with the holding X-axis slide rail, a pressure block arranged at the front end of the second sliding plate, a second bearing arranged below the pressure block, and a second return spring arranged at the rear end of the second sliding plate.

[0008] Furthermore, two ends of the second return spring are respectively in contact with the second sliding plate and the corresponding side plate.

[0009] Furthermore, a bearing mounting seat connected to the second sliding plate is arranged below the pressing block, and the second bearing is installed in the bearing mounting seat.

[0010] Furthermore, the carrier plate group includes a main board, a guide block arranged in the main board, a floating carrier plate arranged in the Y-axis guide block, a first bearing arranged at the bottom of the floating carrier plate, and a third return spring tensioned between the floating carrier plate and the main board; the first bearing and the Y-axis guide block are abutted.

[0011] Furthermore, the feed Y-axis module includes a Y-axis slide rail, a feed sliding plate slidably matched with the Y-axis slide rail, a feed motor driving the feed sliding plate to slide along the Y-axis slide rail, a slide cylinder arranged on the feed sliding plate, a vertical plate arranged at the output end of the slide cylinder, a lifting slide rail vertically arranged on the vertical plate, a pressure plate slidably matched with the lifting slide rail, a holding cylinder driving the pressure plate to rise and fall along the lifting slide rail, a pressure head arranged at the front end of the pressure plate, and a support plate connected to the feed sliding plate.

[0012] Furthermore, the detection mechanism includes a detection frame, an X-axis module arranged on the detection frame, a Z-axis module slidably matched with the X-axis module, and a test probe connected to the Z-axis module.

[0013] The present invention also provides a hole depth measurement method, comprising the hole depth measurement device as described in any one of the above, the method comprising the following steps:

[0014] a) Place the product in the carrying unit;

[0015] b) The Y-axis module drives the carrying unit to move forward to the bottom of the detection mechanism;

[0016] c) The testing organization tests multiple points on the product surface and takes the average value as the reference plane, then tests the depth of the bottom of the hole and compares it with the reference plane to determine the hole depth.

[0017] In the hole depth measuring device of the present invention, the carrying unit carries the product to be measured, and the feeding Y-axis module of the positioning feeding mechanism transfers the product to the bottom of the detection mechanism. After the detection mechanism detects multiple points on the surface of the product to calculate the reference plane, it measures the hole depth of the product to obtain the hole depth of the product, thereby realizing automatic measurement of the hole depth of the product, and the measurement is efficient and convenient with high measurement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of a hole depth measuring device of the present invention;

[0019] Figure 2 It is a structural schematic diagram of the hole depth measuring device of the present invention;

[0020] Figure 3 A schematic diagram of a feed Y-axis module of a hole depth measuring device of the present invention;

[0021] Figure 4 A schematic diagram of the feed Y-axis module of the hole depth measuring device of the present invention in another direction;

[0022] Figure 5 A schematic diagram of a bearing unit of a hole depth measuring device of the present invention;

[0023] Figure 6 A schematic diagram of the bearing unit of the hole depth measuring device of the present invention in another direction;

[0024] Figure 7 A schematic diagram of a carrier plate assembly of a hole depth measuring device of the present invention;

[0025] Figure 8 It is a schematic diagram of the detection mechanism of the hole depth measuring device of the present invention;

[0026] The figures are marked as follows: frame 1, positioning feeding mechanism 2, feeding Y-axis module 21, Y-axis slide rail 210, feeding sliding plate 211, feeding motor 212, slide cylinder 213, vertical plate 214, lifting slide rail 215, pressing plate 216, holding cylinder 217, pressing head 218, supporting plate 219, bearing unit 22, bearing plate 220, side plate 2201, through hole 2202, receiving groove 221, first sliding plate 222, handle 2221, wedge block 223, holding module 224, holding X-axis slide Rail 2240, second sliding plate 2241, pressure block 2242, second bearing 2243, second return spring 2244, bearing mounting seat 2245, Y-axis guide block 225, carrier plate group 226, main board 2261, guide block 2262, floating carrier plate 2263, first bearing 2264, third return spring 2265, first return spring 227, clamp 228, clamp cylinder 229, detection mechanism 3, detection frame 31, X-axis module 32, Z-axis module 33, test probe 34. DETAILED DESCRIPTION

[0027] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0028] The following is combined with Figures 1 to 8 As shown, the technical solution provided by the embodiments of the invention is described in detail.

[0029] This embodiment provides a hole depth measuring device, including a frame 1, a positioning and feeding mechanism 2 arranged on the frame 1, and a detection mechanism 3 arranged above the positioning and feeding mechanism 2; the positioning and feeding mechanism 2 includes a feeding Y-axis module 21 arranged on the frame 1 and a bearing unit 22 that is transmission-connected to the feeding Y-axis module 21. The bearing unit 22 carries the product to be measured, and the feeding Y-axis module 21 of the positioning and feeding mechanism 2 transfers the product to the bottom of the detection mechanism 3. After the detection mechanism 3 detects and calculates multiple points on the surface of the product to obtain a reference plane, it measures the hole depth of the product to obtain the hole depth of the product, thereby realizing the automatic measurement of the hole depth of the product, and the measurement is efficient and convenient.

[0030] The carrying unit 22 includes a carrying plate 220, a receiving groove 221 arranged in the carrying plate 220, a second Y-axis slide rail (not marked) arranged in the receiving groove 221, a first sliding plate 222 slidingly matched with the second Y-axis slide rail, wedge blocks 223 arranged on both sides of the first sliding plate 222, two groups of holding mold groups 224 respectively abutting against the two wedge blocks 223, a Y-axis guide block 225 arranged on the first sliding plate 222, a carrier plate group 226 abutting against the Y-axis guide block 225, a handle 2221 arranged at the front end of the first sliding plate 222, a first return spring 227 arranged at the rear end of the first sliding plate 222, a clamping claw 228 arranged on one side of the receiving groove 221, and a clamping claw cylinder 229 arranged at the bottom of the carrying plate 220 for driving the clamping claw 228 to clamp. The handle 2221 is pushed inward, the first sliding plate 222 moves forward, the two wedge blocks 223 respectively drive the two groups of the holding mold groups 224 to open outward, and the Y-axis guide block 225 drives the carrier group 226 to rise, so as to facilitate placing the product on the carrier group 226. After the product is placed, the first return spring 227 drives the first sliding plate 222, the Y-axis guide block 225 and the two wedge blocks 223 to return to their original positions, the carrier group 226 descends, and the two groups of holding mold groups 224 return to their original positions to hold both ends of the product and position the product.

[0031] The supporting plate 220 is provided with side plates 2201 around it, the first return spring 227 is in contact with the side plates 2201 , wherein a through hole 2202 is provided on the front end of the side plates 2201 , and the handle 2221 extends out of the through hole 2202 .

[0032] Each group of the pressing mold assembly 224 includes a pressing X-axis slide rail 2240 disposed on the carrier plate 220, a second sliding plate 2241 slidably matched with the pressing X-axis slide rail 2240, a pressing block 2242 disposed at the front end of the second sliding plate 2241, a second bearing 2243 disposed below the pressing block 2242, and a second return spring 2244 disposed at the rear end of the second sliding plate 2241. When the first sliding plate 222 moves forward, the second bearing 2243 abuts against the wedge block 223, and the two wedge blocks 223 respectively drive the two second bearings 2243, the pressing block 2242, and the second sliding plate 2241 to slide and open toward both ends along the pressing X-axis slide rail 2240. When the first sliding plate 222 is reset, the two second return springs 2244 respectively drive the second bearing 2243, the pressing block 2242, and the second sliding plate 2241 to reset and approach each other to hold the product, and the structure is simple and stable.

[0033] Two ends of the second return spring 2244 are respectively in contact with the first and second sliding plates 2241 and the corresponding side plate 2201 .

[0034] A bearing mounting seat 2245 connected to the second sliding plate 2241 is disposed below the pressing block 2242 , and the second bearing 2243 is installed in the bearing mounting seat 2245 .

[0035] The carrier plate assembly 226 includes a main plate 2261, a guide block 2262 disposed in the main plate 2261, a floating carrier plate 2263 disposed in the Y-axis guide block 225, a first bearing 2264 disposed at the bottom of the floating carrier plate 2263, and a third return spring 2265 tensioned between the floating carrier plate 2263 and the main plate 2261; the first bearing 2264 abuts against the Y-axis guide block 225. When the product is placed on the floating carrier plate 2263, the first bearing 2264 abuts against the Y-axis guide block 225. When the first sliding plate 222 moves forward, the Y-axis guide block 225 drives the first bearing 2264 to rise; when the pressing die set 224 descends to press the product, the third return spring 2265 plays a role of buffer protection.

[0036] The feeding Y-axis module 21 includes a Y-axis slide rail 210, a feeding sliding plate 211 that slides with the Y-axis slide rail 210, a feeding motor 212 that drives the feeding sliding plate 211 to slide along the Y-axis slide rail 210, a slide cylinder 213 arranged on the feeding sliding plate 211, a vertical plate 214 arranged at the output end of the slide cylinder 213, a lifting slide rail 215 vertically arranged on the vertical plate 214, a pressing plate 216 that slides with the lifting slide rail 215, a holding cylinder 217 that drives the pressing plate 216 to rise and fall along the lifting slide rail 215, a pressing head 218 arranged at the front end of the pressing plate 216, and a support plate 219 connected to the feeding sliding plate 211. The support plate 219 supports the support plate 220 of the support unit 22, the slide cylinder 213 drives the feed slide plate 211 to slide along the Y-axis slide rail 210, and the holding cylinder 217 drives the pressing plate 216 and the pressing head 218 to descend along the lifting slide rail 215 to hold the product.

[0037] The detection mechanism 3 includes a detection frame 31, an X-axis module 32 disposed on the detection frame 31, a Z-axis module 33 slidably matched with the X-axis module 32, and a test probe 34 connected to the Z-axis module 33. The X-axis module 32 and the Z-axis module 33 drive the test probe 34 to move in the X-axis direction, and the Z-axis module 33 drives the test probe 34 to descend to measure the height of the product.

[0038] The present invention also provides a hole depth measurement method, comprising the hole depth measurement device as described in any one of the above, the method comprising the following steps:

[0039] a) placing the product in the carrying unit 22; specifically, pushing the handle 2221 inward, the first sliding plate 222 moves forward, the two wedge blocks 223 respectively drive the two groups of the holding mold sets 224 to open outward, and the Y-axis guide block 225 drives the carrier plate set 226 to rise, so as to facilitate placing the product on the carrier plate set 226. After the product is placed, the first return spring 227 drives the first sliding plate 222, the Y-axis guide block 225 and the two wedge blocks 223 to return to their original positions, the carrier plate set 226 descends, and the two groups of holding mold sets 224 return to their original positions to hold both ends of the product and position the product.

[0040] b) The Y-axis module 21 drives the carrying unit 22 to move forward to the bottom of the detection mechanism; specifically, the support plate 219 supports the carrying plate 220 of the carrying unit 22, the slide cylinder 213 drives the feed sliding plate 211 to slide along the Y-axis slide rail 210, and the holding cylinder 217 drives the pressing plate 216 and the pressing head 218 to descend along the lifting slide rail 215 to hold the product.

[0041] c) The detection mechanism detects multiple points on the product surface and takes the average value as the reference plane, then detects the depth of the bottom of the hole, and compares it with the reference plane to get the hole depth. The X-axis module 32 and the Z-axis module 33 drive the test probe 34 to move in the X-axis direction, and the Z-axis module 33 drives the test probe 34 to descend, detects multiple points on the product surface and takes the average value as the reference plane, then detects the depth of the bottom of the hole, and compares it with the reference plane to get the hole depth. This method has high measurement accuracy.

[0042] In the hole depth measuring device of the present invention, the carrying unit 22 carries the product to be measured, and the feeding Y-axis module 21 of the positioning feeding mechanism 2 transfers the product to the bottom of the detection mechanism 3. After the detection mechanism 3 detects multiple points on the surface of the product to calculate the reference plane, it measures the hole depth of the product to obtain the hole depth of the product, thereby realizing the automatic measurement of the hole depth of the product, and the measurement is efficient and convenient with high measurement accuracy.

[0043] The above is only the best embodiment of the present invention and does not limit the present invention in any form. Any technician familiar with the field can make many possible changes and modifications to the technical solution of the present invention by using the method disclosed above without departing from the scope of the technical solution of the present invention, which all fall within the scope of protection of the claims.

Claims

1. A hole depth measuring device, characterized in that: The invention comprises a frame, a positioning and feeding mechanism arranged on the frame, and a detection mechanism arranged above the positioning and feeding mechanism; the positioning and feeding mechanism comprises a feeding Y-axis module arranged on the frame and a bearing unit drivingly connected to the feeding Y-axis module; the bearing unit comprises a bearing plate, a receiving groove arranged in the bearing plate, a second Y-axis slide rail arranged in the receiving groove, a first sliding plate slidingly matched with the second Y-axis slide rail, wedge blocks arranged on both sides of the first sliding plate, two groups of holding dies respectively abutting against the two wedge blocks, and a first sliding plate arranged on the first sliding plate. The y-axis guide block, a carrier plate group abutting against the y-axis guide block, a handle arranged at the front end of the first sliding plate, a first return spring arranged at the rear end of the first sliding plate, a clamping claw arranged on one side of the receiving groove, and a clamping claw cylinder arranged at the bottom of the carrier plate to drive the clamping claw to clamp; side plates are respectively arranged around the carrier plate, the first return spring abuts against the side plates, wherein a through hole is arranged on the side plate at the front end, and the handle extends out of the through hole; each group of the holding mold groups respectively includes a holding x-axis slide rail arranged on the carrier plate, a second slide slidably matched with the holding x-axis slide rail The second sliding plate is provided with a movable plate, a pressure block arranged at the front end of the second sliding plate, a second bearing arranged below the pressure block, and a second return spring arranged at the rear end of the second sliding plate; the two ends of the second return spring are respectively in contact with the second sliding plate and the corresponding side plate; a bearing mounting seat connected to the second sliding plate is arranged below the pressure block, and the second bearing is installed in the bearing mounting seat; the carrier plate group includes a main board, a guide block arranged in the main board, a floating carrier plate arranged in the Y-axis guide block, a first bearing arranged at the bottom of the floating carrier plate, and a first bearing tensioned between the floating carrier plate and the second bearing The third return spring between the main boards; the first bearing and the Y-axis guide block are in abutment; the feed Y-axis module includes a Y-axis slide rail, a feed slide plate slidably matched with the Y-axis slide rail, a feed motor driving the feed slide plate to slide along the Y-axis slide rail, a slide cylinder arranged on the feed slide plate, a vertical plate arranged at the output end of the slide cylinder, a lifting slide rail vertically arranged on the vertical plate, a pressure plate slidably matched with the lifting slide rail, a holding cylinder driving the pressure plate to rise and fall along the lifting slide rail, a pressure head arranged at the front end of the pressure plate and a support plate connected to the feed slide plate.

2. The hole depth measuring device according to claim 1, characterized in that: The detection mechanism includes a detection frame, an X-axis module arranged on the detection frame, a Z-axis module slidably matched with the X-axis module, and a test probe connected to the Z-axis module.

3. A hole depth measurement method, characterized in that: The hole depth measuring device according to any one of claims 1 to 2, wherein the method comprises the following steps: Place the product in the carrying unit; The Y-axis module drives the carrying unit to move forward to the bottom of the detection mechanism; The testing agency tests multiple points on the product surface and takes the average value as the reference plane. It then tests the depth of the bottom of the hole and compares it with the reference plane to determine the hole depth.

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