Circuit board film rolling device

Abstract

The present invention provides a circuit board film rolling device, including two hot pressing rollers and a frame, the two hot pressing rollers are respectively an upper pressing roller and a lower pressing roller arranged side by side, the frame is provided with supports for supporting the two ends of the upper pressing roller respectively, each support can be lifted and slidably installed on both sides of the frame, the circuit board film rolling device also includes a cylinder for pushing the support to lift, each support is provided with a vibration source for driving the upper pressing roller to vibrate at a high frequency. The present invention slides the supports on both sides of the frame, and the upper pressing roller is supported on the frame by the supports, and the frame is provided with a cylinder to adjust the film laminating pressure; and a vibration source is provided on each support, so that when laminating, the upper pressing roller vibrates at a high frequency, and the vibration energy is transmitted to the dry film resist, so that the fluidity of the dry film resist is greatly improved, thereby improving the ability and speed of filling the deep pit, improving the adhesion between the dry film and the copper foil, and thus ensuring the film laminating quality and improving the film laminating speed.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board manufacturing, and more specifically, relates to a circuit board film laminating rolling device. Background Art

[0002] In the film laminating industry, dry films with resist are usually laminated on circuit boards by hot pressing; especially in the process of laminating dry films for precision circuit boards (PCB) and flexible circuit boards (FPC), the quality of dry films is mainly affected by the uniformity of temperature and pressure and the coordination of speed. When the temperature uniformity of laminating (laminated) films is ±1°, the pressure difference at both ends of the hot pressing roller is ±0.01kgf.

[0003] The copper foil surface on the circuit board has defects such as unevenness, pinholes, and scratches. When laminating, the hot pressing roller and the dry film do not fit well, which will form interface voids, and defects such as defective products and open circuits will occur during etching. Wet lamination can form a layer of water film on the surface of the copper foil to increase the fluidity of the dry film when under pressure, reduce the viscosity of the dry film, and thus improve the filling effect of the dry film. Whether it is dry lamination or wet lamination, the adhesion between the dry film and the copper foil directly determines the quality of the lamination. The adhesion between the dry film and the copper foil on the circuit board is proportional to the pressure of the lamination roller and inversely proportional to the lamination speed. How to improve the stability of the lamination quality and production efficiency has always been a problem explored and discussed by various manufacturers. Summary of the invention

[0004] The object of the present invention is to provide a circuit board film laminating rolling device to solve the problem in the prior art that the film laminating quality and efficiency cannot be achieved at the same time.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide a circuit board film laminating rolling device, including two hot pressing rollers for hot pressing a dry film onto a circuit board and a frame supporting the two hot pressing rollers, the two hot pressing rollers are respectively an upper pressing roller and a lower pressing roller arranged side by side up and down, the two ends of the lower pressing roller are respectively axially connected to the frame, the frame is provided with supports respectively used to support the two ends of the upper pressing roller, each of the supports can be lifted and slidably installed on both sides of the frame, the circuit board film laminating rolling device also includes a cylinder for pushing the supports to lift, and each of the supports is provided with a vibration source for driving the upper pressing roller to vibrate at a high frequency.

[0006] Furthermore, the vibration source is a pneumatic vibrator, an electric vibration motor or an ultrasonic vibrator.

[0007] Furthermore, a support platform is installed on the support, and the vibration source is installed on the support platform.

[0008] Furthermore, a reinforcing plate is installed on the support, and the support platform is installed on the reinforcing plate.

[0009] Furthermore, a slide rail for guiding the support to be lifted and lowered is installed on the frame, a slider is installed on the support, and the slider is slidably installed on the slide rail.

[0010] Furthermore, the support is arranged on the outer side of the frame, and an opening is provided on the frame corresponding to the upper pressing roller for the end of the upper pressing roller to extend out.

[0011] Furthermore, support seats are mounted on the frame, respectively used to support both ends of the lower pressure roller.

[0012] Furthermore, a sprocket is installed at one end of each of the hot pressing rollers.

[0013] Furthermore, the circuit board film laminating roller pressing device also includes a pressure sensor for monitoring the pressure of the upper pressing roller pressing against the lower pressing roller and a controller for controlling the cylinder driving air pressure according to the pressure monitored by the pressure sensor.

[0014] Furthermore, each of the hot pressing rollers includes a hot pressing roller body for hot pressing the dry film onto the circuit board, the hot pressing roller body is in the shape of a circular tube, and has a center hole, sealing covers are respectively installed at both ends of the hot pressing roller body, a heating tube is installed in the center hole, the center hole is also filled with heat transfer oil, the heating tube is supported at the center axis of the center hole, and the heating tube is fixedly connected to the sealing cover.

[0015] The beneficial effects of the circuit board film laminating roller pressing device provided by the present invention are as follows: compared with the prior art, the present invention slides and installs supports on both sides of the frame, and the upper pressing roller is slidably supported on the frame by the supports, and a cylinder is arranged on the frame to adjust the film laminating pressure; and a vibration source is arranged on each support, so that when laminating, the upper pressing roller vibrates at a high frequency, and the vibration energy is transmitted to the dry film resist, so that the fine particles in the dry film resist are in a forced vibration state, thereby greatly reducing the adhesion and internal friction between the particles, and greatly improving the fluidity of the dry film resist, thereby improving the ability and speed of filling deep pits, and improving the adhesion between the dry film and the copper foil, thereby ensuring the film laminating quality and improving the film laminating speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 A schematic diagram of the structure of the circuit board film laminating rolling device provided by the embodiment of the present invention Figure 1 ;

[0018] Figure 2 A schematic diagram of the structure of the circuit board film laminating rolling device provided by the embodiment of the present invention Figure 2 ;

[0019] Figure 3 for Figure 1 Schematic diagram of the structure of the hot pressing roller in the circuit board film pressing device Figure 1 ;

[0020] Figure 4 for Figure 1 Schematic diagram of the structure of the hot pressing roller in the circuit board film pressing device Figure 2 ;

[0021] Figure 5 for Figure 4 The cross-sectional structure of the hot pressing roller shown is shown Figure 1 ;

[0022] Figure 6 for Figure 4 The cross-sectional structure of the hot pressing roller shown is shown Figure 2 .

[0023] Among them, the main marks of the drawings in the figure are:

[0024] 10-hot pressing roller; 10a-upper pressing roller; 10b-lower pressing roller; 11-hot pressing roller body; 111-center hole; 112-heat conductive protective sleeve; 12-heating tube; 13-sealing cover; 131-shaft cylinder; 132-coupling platform; 133-connecting hole; 134-connecting head; 14-support tube; 141-support plate; 151-first sealing ring; 152-second sealing ring; 21-vibration source; 31-support ;311-upper bearing;312-support platform;313-reinforcement plate;314-slide rail;315-slider;32-cylinder;321-fixed seat;33-pressure sensor;331-guide sleeve;34-support seat;341-lower bearing;35-sprocket;41-support plate;411-opening;42-blowing mechanism;43-liquid collection box;431-discharge pipe;50-frame;511-opening; DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The meaning of "several" is one or more, unless otherwise clearly and specifically defined.

[0028] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Please also read Figures 1 to 6The circuit board film laminating roller pressing device provided by the present invention is now described. The circuit board film laminating roller pressing device comprises two hot pressing rollers 10, a frame 50 and a cylinder 32. The two hot pressing rollers 10 are used to hot press the dry film onto the circuit board; the two hot pressing rollers 10 are respectively an upper pressing roller 10a and a lower pressing roller 10b, and the upper pressing roller 10a and the lower pressing roller 10b are arranged side by side up and down, so that when the circuit board and the dry film pass between the upper pressing roller 10a and the lower pressing roller 10b, the dry film is hot pressed onto the circuit board. The two ends of the lower pressing roller 10b are respectively axially connected to the frame 50 to support the lower pressing roller 10b through the frame 50 and enable the lower pressing roller 10b to rotate in the frame 50; two supports 31 are installed on the frame 50, and the two supports 31 can be lifted and slidably installed on both sides of the frame 50, and the two ends of the upper pressing roller 10a are respectively axially connected to the two supports 31 to support the upper pressing roller 10a on the frame 50 through the two supports 31; the cylinder 32 is installed on the frame 50, and the cylinder 32 is used to push the support 31 to rise and fall, thereby adjusting the distance from the upper pressing roller 10a to the lower pressing roller 10b, and thus the roller pressure can be adjusted when the film is applied. A vibration source 21 is installed on each support 31. The vibration source 21 is used to generate vibration energy of a certain frequency, amplitude and exciting force to drive the upper pressure roller 10a to vibrate at a high frequency, and then transmit the vibration energy to the dry film resist during film lamination, so that the fine particles in the dry film resist are in a forced vibration state, thereby greatly reducing the adhesion and internal friction between the particles, improving the fluidity of the dry film resist, and improving the adhesion between the dry film and the copper foil, thereby ensuring the film lamination quality and improving the film lamination speed.

[0031] Compared with the prior art, the circuit board film laminating rolling device provided by the present invention has supports 31 slidably installed on both sides of a frame 50, and the upper pressing roller 10a is slidably supported on the frame 50 by the supports 31, and a cylinder 32 is arranged on the frame 50 to adjust the film laminating pressure; and a vibration source 21 is arranged on each support 31, so that when laminating, the upper pressing roller vibrates at a high frequency, and the vibration energy is transmitted to the dry film resist, so that the fine particles in the dry film resist are in a forced vibration state, thereby greatly reducing the adhesion and internal friction between the particles, and greatly improving the fluidity of the dry film resist, thereby improving the ability and speed of filling deep pits, and improving the adhesion between the dry film and the copper foil, thereby ensuring the film laminating quality and improving the film laminating speed.

[0032] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating roller pressing device provided by the present invention, the vibration source 21 is a pneumatic vibrator, which generates vibration by compression. Of course, in some other embodiments, the vibration source 21 can also be an electric vibration motor or an ultrasonic vibrator. The driving mode of the vibration source 21 includes pneumatic, electric, ultrasonic, etc.

[0033] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating rolling device provided by the present invention, a support platform 312 is installed on the support 31, and the vibration source 21 is installed on the support platform 312. The support platform 312 is provided to install and support the vibration source 21.

[0034] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating rolling device provided by the present invention, a reinforcing plate 313 is also installed on the support 31, and the support platform 312 is installed on the reinforcing plate 313. The reinforcing plate 313 is provided to fix the support platform 312 on the support 31 more stably.

[0035] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating roller pressing device provided by the present invention, a slide rail 314 for guiding the support 31 to rise and fall is installed on the frame 50, and a slider 315 is installed on the support 31, and the slider 315 is slidably installed on the slide rail 314. The slide rail 314 is arranged on the frame 50 to guide the support 31 to rise and fall, thereby driving the upper pressing roller 10a to move smoothly.

[0036] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating roller pressing device provided by the present invention, the support 31 is arranged on the outer side of the frame 50, and an opening 511 is provided on the frame 50 corresponding to the upper pressing roller 10a for the end of the upper pressing roller 10a to extend out. This structure is not only convenient for installing the support 31, but also convenient for arranging the cylinder 32. The opening 511 is provided on the frame 50 so that the end of the upper pressing roller 10a can be lifted and lowered in the opening 511.

[0037] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating roller pressing device provided by the present invention, support seats 34 for supporting both ends of the lower pressing roller 10b are installed on the frame 50. The support seats 34 are arranged on the frame 50 so as to support the lower pressing roller 10b on the frame 50 for easy assembly.

[0038] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film rolling device provided by the present invention, a sprocket 35 is installed at one end of each hot pressing roller 10 so as to connect the driving motor through a chain, thereby conveniently driving the two hot pressing rollers 10 to rotate; and a chain is set and connected by a chain, so that the upper pressing roller 10a can be driven to rotate while the cylinder 32 drives the upper pressing roller 10a to rise and fall.

[0039] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating roller pressing device provided by the present invention, the circuit board film laminating roller pressing device also includes a pressure sensor 33 and a controller (not shown in the figure); the pressure sensor 33 is installed on the support 31, and the pressure sensor 33 is used to monitor the pressure of the upper pressing roller 10a against the lower pressing roller 10b. The controller controls the driving air pressure of the cylinder 32 according to the pressure monitored by the pressure sensor 33. The pressure during film laminating is monitored in real time by the pressure sensor 33, so that the controller can adjust the driving air pressure of the cylinder 32 in time, thereby controlling the pressure during film laminating and improving the film laminating quality.

[0040] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating roller pressing device provided by the present invention, the pressure sensor 33 is installed between the cylinder 32 and the support 31, and the piston of the cylinder 32 is connected to the pressure sensor 33. The pressure sensor 33 is pushed by the cylinder 32, and then the support 31 is pushed by the pressure sensor 33, and then the upper pressing roller 10a is pushed to move, so that the pressure sensor 33 can conveniently monitor the film laminating pressure. Of course, in some other embodiments, a stop structure can also be installed on the frame 50 to press the pressure sensor 33 to monitor the film laminating pressure.

[0041] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film rolling device provided by the present invention, the pressure sensor 33 is placed on the support platform 312 to support the pressure sensor 33. At the same time, when the cylinder 32 pushes the pressure sensor 33, it is convenient for the pressure sensor 33 to push the support platform 312, thereby driving the support 31 to move up and down.

[0042] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating rolling device provided by the present invention, the circuit board film laminating rolling device also includes a guide sleeve 331 for guiding the pressure sensor 33 to rise and fall. The pressure sensor 33 is installed in the guide sleeve 331, and the guide sleeve 331 is installed on the support platform 312. The guide sleeve 331 is provided to guide the pressure sensor 33 when it rises and falls, so that the pressure sensor 33 can monitor more accurately. In addition, the guide sleeve 331 can also protect the pressure sensor 33.

[0043] Please also refer to Figure 1 and Figure 2As a specific embodiment of the circuit board film laminating roller pressing device provided by the present invention, each support 31 is provided with an upper shaft hole (not shown in the figure), and an upper bearing bush 311 is provided in the upper shaft hole, and the upper bearing bush 311 is mounted on the upper pressing roller 10a. The upper bearing bush 311 is arranged in the upper shaft hole to reduce friction and facilitate the flexible rotation of the upper pressing roller 10a relative to the support 31. At the same time, the upper bearing bush 311 can make the support 31 support the upper pressing roller 10a more stably, reduce the vibration between the support 31 and the upper pressing roller 10a, and then facilitate the pressure sensor 33 to more accurately monitor the pressure during film laminating. Of course, in some other embodiments, a bearing can also be installed in the upper shaft hole, and the bearing is mounted on the upper pressing roller 10a.

[0044] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating roller pressing device provided by the present invention, pressure sensors 33 are installed on both supports 31, and cylinders 32 are installed on both sides of the frame 50. The two cylinders 32 are respectively arranged to push the supports 31 at both ends of the upper pressing shaft, so as to keep both sides of the upper pressing roller 10a rising and falling smoothly, and ensure that the upper pressing roller 10a is parallel to the lower pressing roller 10b. In addition, a pressure sensor 33 is arranged on each support 31, so as to more accurately monitor the laminating pressure.

[0045] Furthermore, a lower shaft hole (not shown in the figure) is provided in the support seat 34, and a lower bearing bush 341 is provided in the lower shaft hole, and the lower bearing bush 341 is sleeved on the lower pressure roller 10b. The lower bearing bush 341 is provided in the lower shaft hole to reduce friction and facilitate the flexible rotation of the lower pressure roller 10b relative to the support seat 34. Of course, in some other embodiments, a bearing can also be installed in the lower shaft hole, and the bearing is sleeved on the lower pressure roller 10b.

[0046] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film laminating rolling device provided by the present invention, a support plate 41 for supporting the circuit board after film laminating is also installed on the frame 50. The support plate 41 is located at a corresponding position between the two hot pressing rollers 10 so as to support the circuit board during film laminating to facilitate hot pressing film laminating.

[0047] Please also refer to Figure 1 and Figure 2 As a specific embodiment of the circuit board film rolling device provided by the present invention, a blowing mechanism 42 is also installed on the frame 50 for air-drying the circuit board after film lamination, so as to cool the circuit board and the dry film after hot pressing film lamination, so that the dry film can be fixed faster.

[0048] Furthermore, a fixing seat 321 is installed on the frame 50 , and the cylinder 32 is installed on the fixing seat 321 so as to fix the cylinder 32 on the frame 50 .

[0049] Furthermore, there are two sets of air blowing mechanisms 42, which are respectively located at the upper and lower sides of the support, so that during double-sided film lamination, the dry films on both sides of the circuit board can be blown, cooled and shaped at the same time.

[0050] Furthermore, a plurality of openings 411 are formed on the support plate 41 to reduce weight and allow airflow to pass through the support plate 41 to reduce vibration of the support plate 41 .

[0051] Further, the air blowing mechanism 42 includes a support box mounted on the frame 50 and a fan mounted in the support box, so that the fan is mounted on the frame 50 through the support box.

[0052] Furthermore, a liquid collecting box 43 is installed on the frame 50, and the liquid collecting box 43 is arranged below the lower pressing roller 10b to recover the water on the circuit board during film lamination. Furthermore, a discharge pipe 431 is installed on the liquid collecting box 43 to discharge the recovered water.

[0053] Please also refer to Figures 3 to 6 As a specific embodiment of the circuit board film laminating device provided by the present invention, each hot pressing roller 10 includes a hot pressing roller body 11 and a heating tube 12. The hot pressing roller body 11 is in a round tube shape and has a center hole 111. When the circuit board is filmed, the dry film is hot-pressed onto the circuit board through the hot pressing roller body 11. The heating tube 12 is installed in the center hole 111, and the heating tube 12 is supported at the center axis of the center hole 111; sealing covers 13 are respectively installed at both ends of the hot pressing roller body 11 to seal the center hole 111 of the hot pressing roller body 11, and the center hole 111 of the hot pressing roller body 11 is filled with heat transfer oil, so that the two sealing covers 13 seal the heat transfer oil in the center hole 111 of the hot pressing roller body 11, and because the heating tube 12 is provided in the center hole 111, and the heating tube 12 is placed at the center axis of the center hole 111, the heating tube 12 is prevented from directly heating the pressing roller 11, and the heat transfer oil is heated by the heating tube 12, and the heat transfer oil will flow in the center hole 111 due to the temperature difference, so that the temperature of the heat transfer oil can be more uniform everywhere, and then when the heat transfer oil transfers heat to the hot pressing roller body 11, the side of the hot pressing roller body 11 can be evenly heated, so that the dry film can be evenly heated when the film is applied. The heating tube 12 is fixedly connected to the sealing cover 13 so that the heating tube 12 is supported by the sealing cover 13 .

[0054] Please also refer to Figures 3 to 6As a specific embodiment of the circuit board film laminating roller pressing device provided by the present invention, a support tube 14 is installed in the central hole 111 of the hot pressing roller body 11, and the two ends of the support tube 14 are respectively sealed and connected with two sealing covers 13, and the central hole 111 of the hot pressing roller body 11 is filled with medium heat transfer oil in the area outside the support tube 14. The support tube 14 is supported by the sealing cover 13, and the heating tube 12 is placed in the support tube 14. The heating tube 12 can be supported by the support tube 14, which is convenient for assembly and can better support the heating tube 12. In addition, this structure can also protect the heating tube 12 and prevent the heat transfer oil from corroding the heating tube 12. Of course, in some other embodiments, the heating tube 12 can also be directly fixed on the sealing cover 13, such as each sealing cover 13 supports a heating tube 12; of course, a heating tube 12 with a length equal to that of the hot pressing roller body 11 can also be set, and the two ends of the heating tube 12 are fixedly connected with the two sealing covers 13 to support the heating tube 12.

[0055] Please also refer to Figures 3 to 6 As a specific embodiment of the circuit board film rolling device provided by the present invention, a connecting hole 133 is opened in the center of each sealing cover 13, and the connecting hole 133 on the sealing cover 13 is connected with the support tube 14, so that the heating tube 12 can be easily inserted into the support tube 14, which is convenient for assembling the heating tube 12 and also convenient for repairing and replacing the heating tube 12.

[0056] Furthermore, the length of the heating tube 12 is greater than the length of the hot pressing roller body 11 , and both ends of the heating tube 12 are respectively inserted into the supporting holes of the corresponding sealing cover 13 so as to support the heating tube 12 .

[0057] Please also refer to Figures 3 to 6 As a specific embodiment of the circuit board film rolling device provided by the present invention, support plates 141 are respectively provided at both ends of the support tube 14, and the support plates 141 are placed in the center hole 111. The support plates 141 are annular, and each support plate 141 is sealed and connected to the adjacent sealing cover 13. The annular support plate 141 is provided so as to support the support tube 14 at the center axis of the center hole 111 of the hot pressing roller body 11, and then support the heating tube 12 at the center axis of the center hole 111 of the hot pressing roller body 11; at the same time, the structure also facilitates the sealing connection of the two sealing covers 13 with both ends of the support tube 14. In addition, by providing the support plates 141 at both ends of the support tube 14, it is possible to prevent the support plates 141 from directly heating the side of the pressing roller 11, and then the side of the hot pressing roller body 11 is heated by the heat transfer oil, so that the side of the hot pressing roller body 11 is heated more evenly.

[0058] Please also refer to Figures 3 to 6As a specific embodiment of the circuit board film rolling device provided by the present invention, a first sealing ring 151 is further provided between each support disk 141 and the corresponding sealing cover 13, and a first positioning groove (not shown in the figure) for positioning the first sealing ring 151 is provided on each support disk 141. The first sealing ring 151 is provided to seal the support disk 141 and the sealing cover 13 well, and at the same time, the processing accuracy of the support disk 141 and the sealing cover 13 can be reduced. The first positioning groove is provided on the support disk 141 to facilitate positioning of the first sealing ring 151 for assembly. In other embodiments, the sealing cover 13 can be matched with the plane of the support disk 141, and the sealing cover 13 can be closely matched with the support disk 141 to seal the sealing cover 13 and the support disk 141. In other embodiments, a first positioning groove can also be provided on the sealing cover 13 to position the first sealing ring 151.

[0059] Please also refer to Figures 3 to 6 As a specific embodiment of the circuit board film rolling device provided by the present invention, the support plate 141 and the support tube 14 are integrally formed to ensure good connection strength between the support plate 141 and the support tube 14, and at the same time, the support plate 141 and the support tube 14 are sealed.

[0060] Please also refer to Figures 3 to 6 As a specific embodiment of the circuit board film laminating roller pressing device provided by the present invention, the hot pressing roller body 11 is made of aluminum, that is, the hot pressing roller body 11 is an aluminum hot pressing roller body 11. Due to the good thermal conductivity of aluminum, the heat conducting oil can better heat the pressing roller 11. Specifically, the hot pressing roller body 11 can be made of AL7075 material.

[0061] Furthermore, the support tube 14 is made of aluminum, that is, the support tube 14 is an aluminum tube. Due to the good thermal conductivity of aluminum, the heating tube 12 can heat the support tube 14 well, and then heat the heat transfer oil through the support tube 14. Specifically, the support tube 14 can be made of AL7075 material.

[0062] Please also refer to Figures 3 to 6As a specific embodiment of the circuit board film laminating rolling device provided by the present invention, a second sealing ring 152 is provided between the two end faces of the hot pressing roller body 11 and the adjacent sealing cover 13, and a second positioning groove (not shown in the figure) for positioning the second sealing ring 152 is respectively provided on the two end faces of the hot pressing roller body 11. The second sealing ring 152 is provided to seal the end face of the hot pressing roller body 11 with the corresponding sealing cover 13 well, and at the same time, the processing accuracy of the end face of the hot pressing roller body 11 and the sealing cover 13 can be reduced. The second positioning groove is provided on the end face of the hot pressing roller body 11 to facilitate the positioning of the second sealing ring 152 for assembly. In other embodiments, the sealing cover 13 can be matched with the plane of the end face of the hot pressing roller body 11, and the sealing cover 13 can be closely matched with the end face of the hot pressing roller body 11 to seal the sealing cover 13 with the end face of the hot pressing roller body 11. In other embodiments, a second positioning groove can also be provided on the sealing cover 13 to position the second sealing ring 152.

[0063] Please also refer to Figures 3 to 6 As a specific embodiment of the circuit board film rolling device provided by the present invention, a shaft cylinder 131 is provided on the outer side of each sealing cover 13, and the shaft cylinder 131 is located at the center of the corresponding sealing cover 13, and the shaft cylinder 131 is coaxially arranged with the hot pressing roller body 11 so that the hot pressing roller body 11 can be rotatably supported by the shaft cylinder 131.

[0064] Furthermore, a coupling platform 132 is provided on the shaft cylinder 131. The coupling platform 132 is formed by the side surface of the support shaft extending outward in the radial direction of the support shaft. The coupling platform 132 is annular to facilitate processing and manufacturing, and is also easy to install on a medium such as a fixed plate to support the hot pressing roller body 11 and facilitate the rotation of the hot pressing roller body 11.

[0065] Furthermore, the sealing cover 13, the shaft cylinder 131 and the support shaft are integrally formed to increase the connection strength between the sealing cover 13 and the support shaft and facilitate manufacturing.

[0066] Furthermore, at least one free end of the shaft cylinder 131 is provided with a connector 134 to be connected to an external motor, thereby facilitating the rotation of the hot pressing roller body 11. In this embodiment, a connector 134 is provided on one shaft cylinder 131. In other embodiments, connectors 134 may also be provided on both shaft cylinders 131.

[0067] Please also refer to Figures 3 to 6As a specific embodiment of the circuit board film rolling device provided by the present invention, a heat-conductive protective sleeve 112 is mounted on the hot pressing roller body 11. The heat-conductive protective sleeve 112 is arranged on the hot pressing roller body 11 to protect the hot pressing roller body 11. Preferably, the heat-conductive protective sleeve 112 can be a copper sleeve to achieve good heat conduction and can adhere the dry film to the circuit board. In some other embodiments, the heat-conductive protective sleeve 112 can also be a heat-conductive rubber sleeve to play the role of elastic buffer, which can not only better adhere the dry film to the circuit board, but also prevent the circuit board from being crushed. In some other embodiments, the heat-conductive protective sleeve 112 can also be an aluminum sleeve.

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board film laminating roller pressing device, comprising two hot pressing rollers for hot pressing a dry film onto a circuit board and a frame supporting the two hot pressing rollers, wherein the two hot pressing rollers are an upper pressing roller and a lower pressing roller arranged side by side in an upper and lower direction, and characterized in that: The two ends of the lower pressing roller are respectively connected to the frame, and the frame is equipped with supports for supporting the two ends of the upper pressing roller, and each of the supports can be lifted and slidably installed on both sides of the frame. The circuit board film rolling device also includes a cylinder for pushing the supports to lift, and each of the supports is equipped with a vibration source for driving the upper pressing roller to vibrate at a high frequency; The frame is provided with a support plate for supporting the circuit board after film lamination, and the support plate is located at a corresponding position between the two hot pressing rollers; the frame is provided with an air blowing mechanism for air-drying the circuit board after film lamination, so as to cool and shape the circuit board and the dry film, and the support plate is provided with a plurality of openings for air flow.

2. The circuit board film laminating rolling device according to claim 1, characterized in that: The vibration source is a gas vibrator, an electric vibration motor or an ultrasonic vibrator.

3. The circuit board film laminating rolling device according to claim 1, characterized in that: A support platform is installed on the support, and the vibration source is installed on the support platform.

4. The circuit board film laminating rolling device according to claim 3, characterized in that: A reinforcing plate is also installed on the support, and the supporting platform is installed on the reinforcing plate.

5. The circuit board film laminating rolling device according to any one of claims 1 to 4, characterized in that: The frame is provided with a slide rail for guiding the support to be lifted and lowered. The support is provided with a slide block, and the slide block is slidably installed on the slide rail.

6. The circuit board film laminating rolling device according to any one of claims 1 to 4, characterized in that: The support is arranged on the outer side of the frame, and an opening is provided on the frame corresponding to the upper pressing roller for the end of the upper pressing roller to extend out.

7. The circuit board film laminating rolling device according to any one of claims 1 to 4, characterized in that: The frame is provided with support seats respectively used for supporting the two ends of the lower pressing roller.

8. The circuit board film laminating rolling device according to any one of claims 1 to 4, characterized in that: A sprocket is installed at one end of each of the hot pressing rollers.

9. The circuit board film laminating rolling device according to any one of claims 1 to 4, characterized in that: The circuit board film laminating roller pressing device further includes a pressure sensor for monitoring the pressure of the upper pressing roller pressing against the lower pressing roller and a controller for controlling the cylinder driving air pressure according to the pressure monitored by the pressure sensor.

10. The circuit board film laminating rolling device according to any one of claims 1 to 4, characterized in that: Each of the hot pressing rollers includes a hot pressing roller body for hot pressing a dry film onto a circuit board. The hot pressing roller body is in the shape of a circular tube and has a center hole. Sealing covers are respectively installed at both ends of the hot pressing roller body. A heating tube is installed in the center hole. The center hole is also filled with heat transfer oil. The heating tube is supported at the center axis of the center hole. The heating tube is fixedly connected to the sealing cover.

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