Circuit board roll laminating device

Abstract

The present invention provides a circuit board roller film laminating device, including a film supply mechanism, two hot pressing rollers and a frame, wherein the two hot pressing rollers are respectively an upper pressing roller and a lower pressing roller arranged side by side, and a support is installed on the frame. The circuit board roller film laminating device also includes a cylinder, a pressure sensor, a controller for controlling the cylinder driving air pressure, and a vibration source for driving the upper pressing roller to vibrate at a high frequency. The present invention slides the support on both sides of the frame, and the upper pressing roller is slidably supported on the frame by the support, and a cylinder is arranged on the frame to adjust the film laminating pressure; a pressure sensor is arranged on the support to monitor the film laminating pressure in real time, and then control the film laminating pressure; and a vibration source is arranged on each support, so that when laminating, the upper pressing roller vibrates at a high frequency, thereby greatly improving the fluidity of the dry film resist, improving the ability and speed of filling deep pits, and improving the adhesion between the dry film and the copper foil, thereby ensuring the film laminating quality and improving the film laminating speed.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board manufacturing, and more specifically, relates to a circuit board rolling film laminating device. Background Art

[0002] In the film laminating industry, a dry film with a resist is generally hot-pressed onto a circuit board; especially in the dry film laminating process for precision circuit boards (PCBs) and flexible circuit boards (FPCs), the quality of the dry film laminating is mainly subject to the uniformity of temperature and pressure and the coordination of speed. The adhesion between the dry film and the copper foil directly determines the quality of the film laminating. The adhesion between the dry film and the copper foil on the circuit board is proportional to the pressure of the film laminating roller and inversely proportional to the film laminating speed. During the current film laminating process, the distance between the upper and lower hot pressing rollers is generally adjusted by a cylinder to adjust the pressure of the hot pressing roller during film laminating. This makes it difficult to control the film laminating pressure, resulting in a decrease in quality, and in improving efficiency, it will further affect the film laminating quality. Summary of the invention

[0003] The object of the present invention is to provide a circuit board roller laminating device to solve the problem that the circuit board laminating device in the prior art is difficult to control the pressure and improve the bonding force.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide a circuit board roller-pressing film laminating device, comprising a film supply mechanism for supplying dry film, two hot pressing rollers for hot pressing the dry film to fit the circuit board, and a frame supporting the two hot pressing rollers, wherein the film supply mechanism is installed on the frame, the two hot pressing rollers are respectively an upper pressing roller and a lower pressing roller arranged side by side up and down, the two ends of the lower pressing roller are respectively axially connected to the frame, the frame is provided with supports respectively used to support the two ends of the upper pressing roller, each of the supports can be lifted and slidably installed on both sides of the frame, the circuit board roller-pressing film laminating device also includes a cylinder for pushing the support to lift and lower, a pressure sensor for monitoring the pressure of the upper pressing roller against the lower pressing roller, a controller for controlling the cylinder driving air pressure according to the pressure monitored by the pressure sensor, and a vibration source for driving the upper pressing roller to vibrate at a high frequency, the cylinder is installed on the frame, the pressure sensor is installed on the support, and the vibration source is installed on each of the supports.

[0005] Furthermore, the pressure sensor is installed between the cylinder and the support, and the piston of the cylinder is connected to the pressure sensor.

[0006] Furthermore, a support platform is installed on the support, the pressure sensor is placed on the support platform, and the vibration source is installed on the support platform.

[0007] Furthermore, the circuit board roller laminating device also includes a guide sleeve for guiding the pressure sensor to rise and fall, the pressure sensor is installed in the guide sleeve, and the guide sleeve is installed on the support platform.

[0008] Furthermore, a slide rail for guiding the support to be lifted and lowered is installed on the frame, a slider is installed on the support, and the slider is slidably installed on the slide rail.

[0009] Furthermore, each of the hot pressing rollers includes a hot pressing roller body for hot pressing the dry film onto the circuit board, the hot pressing roller body is in the shape of a circular tube, and has a center hole, sealing covers are respectively installed at both ends of the hot pressing roller body, a heating tube is installed in the center hole, the center hole is also filled with heat transfer oil, the heating tube is supported at the center axis of the center hole, and the heating tube is fixedly connected to the sealing cover.

[0010] Furthermore, a support tube is installed in the central hole, and both ends of the support tube are respectively sealed and connected to the two sealing covers, and the heat transfer oil is filled in the area of ​​the central hole outside the support tube.

[0011] Furthermore, support plates are respectively provided at both ends of the support tube, the support plates are placed in the central hole, the support plates are annular, and each of the support plates is sealed and connected to the adjacent sealing cover.

[0012] Furthermore, the film supply mechanism includes a rotating shaft for supporting the dry film roll, a separation shaft for separating the dry film on the dry film roll from the protective film, a recovery shaft for recovering the protective film and a recovery motor for driving the recovery shaft to rotate, one end of the rotating shaft is pivotally connected to the frame, both ends of the separation shaft are pivotally connected to the frame, and one end of the recovery shaft is pivotally connected to the frame.

[0013] Furthermore, there are two sets of film supply mechanisms, which are respectively placed at the upper and lower ends of the frame.

[0014] The beneficial effects of the circuit board roller laminating device provided by the present invention are as follows: compared with the prior art, the present invention provides a film supply mechanism and two hot pressing rollers, so that when the dry film and the circuit board pass between the two hot pressing rollers, the dry film can be laminated to the circuit board; supports are slidably installed on both sides of the frame, and the upper pressing roller is slidably supported on the frame by the supports, and a cylinder is provided on the frame to adjust the laminating pressure; a pressure sensor is provided on the support to monitor the laminating pressure in real time, and then control the laminating pressure; at the same time, a vibration source is provided on each support, so that when laminating, the upper pressing roller vibrates at a high frequency, thereby greatly improving the fluidity of the dry film resist, improving the ability and speed of filling deep pits, and improving the adhesion between the dry film and the copper foil, thereby ensuring the laminating quality and improving the laminating speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 A schematic diagram of the structure of the circuit board roll laminating device provided by the embodiment of the present invention Figure 1 ;

[0017] Figure 2 A schematic diagram of the structure of the circuit board roll laminating device provided by the embodiment of the present invention Figure 2 ;

[0018] Figure 3 A schematic diagram of the structure of the circuit board roll laminating device provided by the embodiment of the present invention Figure 3 ;

[0019] Figure 4 for Figure 3 The schematic diagram of the structure of part of the circuit board roll laminating device shown in FIG. Figure 1 ;

[0020] Figure 5 for Figure 3 The schematic diagram of the structure of part of the circuit board roll laminating device shown in FIG. Figure 2 ;

[0021] Figure 6 for Figure 5 Schematic diagram of the structure of the hot pressing roller in the circuit board roller pressing film laminating device Figure 1 ;

[0022] Figure 7 for Figure 5 Schematic diagram of the structure of the hot pressing roller in the circuit board roller pressing film laminating device Figure 2 ;

[0023] Figure 8 for Figure 7 The cross-sectional structure of the hot pressing roller shown is shown Figure 1 ;

[0024] Fig. 9 for Figure 7 The cross-sectional structure of the hot pressing roller shown is shown Figure 2 ;

[0025] Fig.10 for Figure 3 The schematic diagram of the structure of the frame in the circuit board roller laminating device is shown.

[0026] Among them, the main marks of the drawings in the figure are:

[0027] 10-hot pressing roller; 10a-upper pressing roller; 10b-lower pressing roller; 11-hot pressing roller body; 111-center hole; 112-heat conductive protective sleeve; 12-heating tube; 13-sealing cover; 131-shaft cylinder; 132-coupling platform; 133-connecting hole; 134-connecting head; 14-support tube; 141-support plate; 151-first sealing ring; 152-second sealing ring; 21-vibration source; 31-support; 311-upper bearing; 312-support platform; 313-reinforcement plate; 314-slide rail; 315-slider; 32-cylinder; 321-fixed seat; 33-pressure sensor; 331-guide sleeve; 34-support seat; 341-lower bearing; 35-sprocket; 41-support plate; 411-opening; 42-blowing mechanism; 43-liquid collection box; 431-discharge pipe; 50-frame; 501-opening; 51-first mounting plate; 52-second mounting plate; 53-connecting beam; 60-film supply mechanism; 61-recovery shaft; 62-separation shaft; 63-guide shaft; 64-recovery motor; 65-transmission mechanism; 91-dry film roll; 92-dry film; 93-protective film. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The meaning of "several" is one or more, unless otherwise clearly and specifically defined.

[0031] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] Please also read Figures 1 to 10, the circuit board roller laminating device provided by the present invention is now described. The circuit board roller laminating device comprises a film supply mechanism 60, two hot pressing rollers 10, a frame 50, a cylinder 32, a pressure sensor 33 and a controller (not shown in the figure); the film supply mechanism 60 is used to supply a dry film 92. When in use, a dry film roll 91 can be arranged on the film supply mechanism 60, and the dry film 92 in the dry film roll 91 is supplied between the two hot pressing rollers 10 through the film supply mechanism 60. The two hot pressing rollers 10 are used to hot press the dry film 92 onto the circuit board; the two hot pressing rollers 10 are respectively an upper pressing roller 10a and a lower pressing roller 10b, and the upper pressing roller 10a and the lower pressing roller 10b are arranged side by side up and down, so that when the circuit board and the dry film 92 pass between the upper pressing roller 10a and the lower pressing roller 10b, the dry film 92 is hot pressed onto the circuit board. The two ends of the lower pressing roller 10b are respectively connected to the frame 50, so that the lower pressing roller 10b can be supported by the frame 50 and can be rotated in the frame 50; two supports 31 are installed on the frame 50, and the two supports 31 can be lifted and slidably installed on both sides of the frame 50, and the two ends of the upper pressing roller 10a are respectively connected to the two supports 31, so that the upper pressing roller 10a can be supported on the frame 50 through the two supports 31; the cylinder 32 is installed on the frame 50, and the cylinder 32 is used to push the support 31 to move up and down, thereby adjusting the distance from the upper pressing roller 10a to the lower pressing roller 10b, and then the roller pressure can be adjusted when the film is applied. The pressure sensor 33 is installed on the support 31, and the pressure sensor 33 is used to monitor the pressure of the upper pressing roller 10a against the lower pressing roller 10b, and the controller controls the driving air pressure of the cylinder 32 according to the pressure monitored by the pressure sensor 33. The pressure during film pasting is monitored in real time by the pressure sensor 33, so that the controller can adjust the driving air pressure of the cylinder 32 in time, thereby controlling the pressure during film pasting and improving the film pasting quality. A vibration source 21 is installed on each support 31, and the vibration source 21 is used to generate vibration energy of a certain frequency, amplitude and excitation force to drive the upper pressure roller 10a to vibrate at a high frequency, and then during film pasting, the vibration energy is transmitted to the dry film 92 resist, so that the fine particles in the dry film 92 resist are in a forced vibration state, thereby greatly reducing the adhesion and internal friction between the particles, improving the fluidity of the dry film 92 resist, so as to improve the adhesion between the dry film 92 and the copper foil, thereby ensuring the film pasting quality and improving the film pasting speed.

[0034] Compared with the prior art, the circuit board roller laminating device provided by the present invention is provided with a film supply mechanism 60 and two hot pressing rollers 10, so that when the dry film 92 and the circuit board pass between the two hot pressing rollers 10, the dry film 92 can be laminated on the circuit board; the supports 31 are slidably installed on both sides of the frame 50, and the upper pressing roller 10a is slidably supported on the frame 50 by the supports 31, and the frame 50 is provided with a cylinder 32 to adjust the laminating pressure; and the pressure sensor 33 is provided on the support 31 to monitor the pressure of the upper pressing roller 10a against the lower pressing roller 10b, so that when the circuit board passes through the upper pressing roller 10a and the lower pressing roller 10b, the pressure sensor 33 can be adjusted. When the upper pressure roller 10b is between the rollers 10a and 10b, the roller pressure can be monitored in real time, and the driving pressure of the cylinder 32 can be controlled in real time by the controller, so as to ensure the processing quality of the circuit board; and a vibration source 21 is set on each support 31, so that when the film is pasted, the upper pressure roller vibrates at a high frequency, and the vibration energy is transmitted to the dry film 92 resist, so that the fine particles in the dry film 92 resist are in a forced vibration state, thereby greatly reducing the adhesion and internal friction between the particles, and greatly improving the fluidity of the dry film 92 resist, thereby improving the ability and speed of filling the deep pit, and improving the adhesion between the dry film 92 and the copper foil, thereby ensuring the film pasting quality and improving the film pasting speed.

[0035] Please also refer to Figures 1 to 3 As a specific embodiment of the circuit board roller laminating device provided by the present invention, there are two sets of film supply mechanisms 60, and the two sets of film supply mechanisms 60 are respectively placed at the upper and lower ends of the frame, so that when laminating, dry film 92 can be supplied to both sides of the circuit board at the same time, thereby realizing simultaneous laminating of both sides of the circuit board.

[0036] Please also refer to Figures 1 to 3 As a specific embodiment of the circuit board roller laminating device provided by the present invention, the film supply mechanism 60 includes a rotating shaft (not shown in the figure), a separation shaft 62, a recovery shaft 61 and a recovery motor 64; one end of the rotating shaft is pivotally connected to the frame 50, both ends of the separation shaft 62 are pivotally connected to the frame 50, and one end of the recovery shaft 61 is pivotally connected to the frame 50. The rotating shaft is used to support the dry film roll 91, the separation shaft 62 is used to separate the dry film 92 from the protective film 93 on the dry film roll, the recovery shaft 61 is used to recover the protective film 93, and the recovery motor 64 drives the recovery shaft 61 to rotate; when in use, the dry film roll 91 is placed on the rotating shaft, so that the protective film 93 is wound around the recovery shaft 61 after passing through the separation shaft 62, and the dry film 92 is placed between the upper pressure roller 10a and the lower pressure roller 10b through the separation shaft 62, and the recovery motor 64 drives the recovery shaft 61 to rotate, and when the upper pressure roller 10a and the lower pressure roller 10b rotate, the dry film 92 is pulled, and at the same time, the recovery shaft 61 will pull the protective film 93 for recovery.

[0037] Please also refer to Figures 1 to 3As a specific embodiment of the circuit board roller laminating device provided by the present invention, the film supply mechanism 60 also includes a guide shaft 63, both ends of the guide shaft 63 are respectively pivoted to the frame, and the guide shaft 63 is arranged on the front side of the hot pressing roller to guide the dry film 92 after the protective film 93 is separated, so as to facilitate guiding the dry film 92 between the two hot pressing rollers.

[0038] Please also refer to Figures 1 to 3 As a specific embodiment of the circuit board roller laminating device provided by the present invention, the film supply mechanism 60 also includes a transmission mechanism 65, and the two ends of the transmission mechanism 65 are respectively connected to the recovery motor 64 and the recovery shaft 61, so that the recovery motor 64 drives the recovery shaft 61 to rotate through the transmission mechanism 65.

[0039] Further, the transmission mechanism 65 includes a driving wheel connected to the recovery motor 64, a driven wheel connected to the recovery shaft 61, and a belt connecting the driving shaft and the driven shaft. Of course, in some other embodiments, other transmission mechanisms 65, such as a gear box, etc., can also be used.

[0040] Please also refer to Figures 1 to 5 As a specific embodiment of the circuit board roll laminating device provided by the present invention, the vibration source 21 is a pneumatic vibrator, which generates vibration by compression. Of course, in some other embodiments, the vibration source 21 can also be an electric vibration motor or an ultrasonic vibrator. The driving mode of the vibration source 21 includes pneumatic, electric, ultrasonic, etc.

[0041] Please also refer to Figures 1 to 5 As a specific embodiment of the circuit board roll laminating device provided by the present invention, a support platform 312 is installed on the support 31, a pressure sensor 33 is placed on the support platform 312, and a vibration source 21 is installed on the support platform 312. The support platform 312 is provided to install and support the vibration source 21 and the pressure sensor 33.

[0042] Please also refer to Figure 4 and Figure 5 As a specific embodiment of the circuit board roll laminating device provided by the present invention, a reinforcing plate 313 is also installed on the support 31, and the support platform 312 is installed on the reinforcing plate 313. The reinforcing plate 313 is provided to fix the support platform 312 on the support 31 more stably.

[0043] Please also refer to Figure 4 and Figure 5As a specific embodiment of the circuit board roller laminating device provided by the present invention, a slide rail 314 for guiding the support 31 to rise and fall is installed on the frame 50, and a slider 315 is installed on the support 31, and the slider 315 is slidably installed on the slide rail 314. The slide rail 314 is arranged on the frame 50 to guide the support 31 to rise and fall, thereby driving the upper pressing roller 10a to move smoothly.

[0044] Please also refer to Figure 4 and Figure 5 As a specific embodiment of the circuit board roller laminating device provided by the present invention, the support 31 is arranged on the outer side of the frame 50, and an opening 501 for the end of the upper pressing roller 10a to extend out is provided on the frame 50 corresponding to the upper pressing roller 10a. This structure is not only convenient for installing the support 31, but also convenient for arranging the cylinder 32. The opening 501 is provided on the frame 50 so that the end of the upper pressing roller 10a can move up and down in the opening 501.

[0045] Please also refer to Figure 4 and Figure 5 As a specific embodiment of the circuit board roll laminating device provided by the present invention, support seats 34 for supporting both ends of the lower pressing roller 10b are installed on the frame 50. The support seats 34 are arranged on the frame 50 so as to support the lower pressing roller 10b on the frame 50 for easy assembly.

[0046] Please also refer to Figure 4 and Figure 5 As a specific embodiment of the circuit board roller laminating device provided by the present invention, a sprocket 35 is installed at one end of each hot pressing roller 10 so as to connect the driving motor through a chain, thereby conveniently driving the two hot pressing rollers 10 to rotate; and a chain is set and connected by a chain, so that the upper pressing roller 10a can be driven to rotate while the cylinder 32 drives the upper pressing roller 10a to rise and fall.

[0047] Please also refer to Figure 4 and Figure 5 As a specific embodiment of the circuit board roller laminating device provided by the present invention, the pressure sensor 33 is installed between the cylinder 32 and the support 31, and the piston of the cylinder 32 is connected to the pressure sensor 33. The pressure sensor 33 is pushed by the cylinder 32, and then the support 31 is pushed by the pressure sensor 33, and then the upper pressing roller 10a is pushed to move, so that the pressure sensor 33 can conveniently monitor the laminating pressure. Of course, in some other embodiments, a stop structure can also be installed on the frame 50 to press the pressure sensor 33 to monitor the laminating pressure.

[0048] Please also refer to Figure 4 and Figure 5As a specific embodiment of the circuit board roll laminating device provided by the present invention, the circuit board roll laminating device further includes a guide sleeve 331 for guiding the pressure sensor 33 to rise and fall. The pressure sensor 33 is installed in the guide sleeve 331, and the guide sleeve 331 is installed on the support platform 312. The guide sleeve 331 is provided to guide the pressure sensor 33 when it rises and falls, so that the pressure sensor 33 can monitor more accurately. In addition, the guide sleeve 331 can also protect the pressure sensor 33.

[0049] Please also refer to Figure 4 and Figure 5 As a specific embodiment of the circuit board roller laminating device provided by the present invention, each support 31 is provided with an upper shaft hole (not shown in the figure), and an upper bearing 311 is provided in the upper shaft hole, and the upper bearing 311 is mounted on the upper pressure roller 10a. The upper bearing 311 is arranged in the upper shaft hole to reduce friction and facilitate the flexible rotation of the upper pressure roller 10a relative to the support 31. At the same time, the upper bearing 311 can make the support 31 support the upper pressure roller 10a more stably, reduce the vibration between the support 31 and the upper pressure roller 10a, and then facilitate the pressure sensor 33 to more accurately monitor the pressure during laminating. Of course, in some other embodiments, a bearing can also be installed in the upper shaft hole, and the bearing is mounted on the upper pressure roller 10a.

[0050] Please also refer to Figure 4 and Figure 5 As a specific embodiment of the circuit board roller laminating device provided by the present invention, pressure sensors 33 are installed on both supports 31, and cylinders 32 are installed on both sides of the frame 50. The two cylinders 32 are respectively arranged to push the supports 31 at both ends of the upper pressing shaft, so as to keep both sides of the upper pressing roller 10a rising and falling smoothly, and ensure that the upper pressing roller 10a is parallel to the lower pressing roller 10b. In addition, the pressure sensors 33 are arranged on each support 31, so as to more accurately monitor the laminating pressure.

[0051] Please also refer to Figure 4 and Figure 5 As a specific embodiment of the circuit board roller laminating device provided by the present invention, a lower shaft hole (not shown in the figure) is opened in the support seat 34, and a lower bearing bush 341 is arranged in the lower shaft hole, and the lower bearing bush 341 is sleeved on the lower pressing roller 10b. The lower bearing bush 341 is arranged in the lower shaft hole to reduce friction and facilitate the flexible rotation of the lower pressing roller 10b relative to the support seat 34. Of course, in some other embodiments, a bearing can also be installed in the lower shaft hole, and the bearing is sleeved on the lower pressing roller 10b.

[0052] Please also refer to Figure 4 and Figure 5As a specific embodiment of the circuit board roller laminating device provided by the present invention, a support plate 41 for supporting the circuit board after laminating is also installed on the frame 50. The support plate 41 is located at a corresponding position between the two hot pressing rollers 10 so as to support the circuit board during laminating to facilitate hot pressing laminating.

[0053] Please also refer to Figure 4 and Figure 5 As a specific embodiment of the circuit board roller laminating device provided by the present invention, a blowing mechanism 42 is also installed on the frame 50 for air-drying the circuit board after laminating, so as to cool the circuit board and the dry film 92 after hot pressing laminating, so that the dry film 92 can be fixed faster.

[0054] Furthermore, a fixing seat 321 is installed on the frame 50 , and the cylinder 32 is installed on the fixing seat 321 so as to fix the cylinder 32 on the frame 50 .

[0055] Furthermore, there are two sets of air blowing mechanisms 42, which are respectively located at the upper and lower sides of the support, so that during double-sided film lamination, the dry films 92 on both sides of the circuit board can be blown, cooled and shaped at the same time.

[0056] Furthermore, a plurality of openings 411 are formed on the support plate 41 to reduce weight and allow airflow to pass through the support plate 41 to reduce vibration of the support plate 41 .

[0057] Further, the air blowing mechanism 42 includes a support box mounted on the frame 50 and a fan mounted in the support box, so that the fan is mounted on the frame 50 through the support box.

[0058] Furthermore, a liquid collecting box 43 is installed on the frame 50, and the liquid collecting box 43 is arranged below the lower pressing roller 10b to recover the water on the circuit board during film lamination. Furthermore, a discharge pipe 431 is installed on the liquid collecting box 43 to discharge the recovered water.

[0059] Please also refer to Figures 6 to 9As a specific embodiment of the circuit board roller laminating device provided by the present invention, each hot pressing roller 10 includes a hot pressing roller body 11 and a heating tube 12. The hot pressing roller body 11 is in a cylindrical shape and has a center hole 111. When laminating the circuit board, the dry film 92 is hot-pressed onto the circuit board through the hot pressing roller body 11. The heating tube 12 is installed in the center hole 111, and the heating tube 12 is supported at the center axis of the center hole 111; sealing covers 13 are respectively installed at both ends of the hot pressing roller body 11 to seal the center hole 111 of the hot pressing roller body 11, and the center hole 111 of the hot pressing roller body 11 is filled with heat transfer oil, so that the two sealing covers 13 seal the heat transfer oil in the center hole 111 of the hot pressing roller body 11, and because the heating tube 12 is provided in the center hole 111, and the heating tube 12 is placed at the center axis of the center hole 111, the heating tube 12 is prevented from directly heating the pressing roller 11, and the heat transfer oil is heated by the heating tube 12, and the heat transfer oil will flow in the center hole 111 due to the temperature difference, so that the temperature of the heat transfer oil can be more uniform everywhere, and then when the heat transfer oil transfers heat to the hot pressing roller body 11, the side of the hot pressing roller body 11 can be evenly heated, so that the dry film 92 can be evenly heated when the film is applied. The heating tube 12 is fixedly connected to the sealing cover 13 so that the heating tube 12 is supported by the sealing cover 13 .

[0060] Please also refer to Figures 6 to 9 As a specific embodiment of the circuit board roller laminating device provided by the present invention, a support tube 14 is installed in the central hole 111 of the hot pressing roller body 11, and the two ends of the support tube 14 are respectively sealed and connected with two sealing covers 13, and the central hole 111 of the hot pressing roller body 11 is filled with heat transfer oil in the area outside the support tube 14. The support tube 14 is supported by the sealing cover 13, and the heating tube 12 is placed in the support tube 14. The heating tube 12 can be supported by the support tube 14, which is convenient for assembly and can better support the heating tube 12. In addition, this structure can also protect the heating tube 12 and prevent the heat transfer oil from corroding the heating tube 12. Of course, in some other embodiments, the heating tube 12 can also be directly fixed on the sealing cover 13, such as each sealing cover 13 supports a heating tube 12; of course, a heating tube 12 with a length equal to that of the hot pressing roller body 11 can also be set, and the two ends of the heating tube 12 are fixedly connected with the two sealing covers 13 to support the heating tube 12.

[0061] Please also refer to Figures 6 to 9 As a specific embodiment of the circuit board roller laminating device provided by the present invention, a connecting hole 133 is opened in the center of each sealing cover 13, and the connecting hole 133 on the sealing cover 13 is connected with the support tube 14, so that the heating tube 12 can be easily inserted into the support tube 14, which is convenient for assembling the heating tube 12 and also convenient for repairing and replacing the heating tube 12.

[0062] Furthermore, the length of the heating tube 12 is greater than the length of the hot pressing roller body 11 , and both ends of the heating tube 12 are respectively inserted into the supporting holes of the corresponding sealing cover 13 so as to support the heating tube 12 .

[0063] Please also refer to Figures 6 to 9 As a specific embodiment of the circuit board roller laminating device provided by the present invention, support plates 141 are respectively provided at both ends of the support tube 14, and the support plates 141 are placed in the center hole 111. The support plates 141 are annular, and each support plate 141 is sealed and connected with the adjacent sealing cover 13. The annular support plate 141 is provided so as to support the support tube 14 at the center axis of the center hole 111 of the hot pressing roller body 11, and then support the heating tube 12 at the center axis of the center hole 111 of the hot pressing roller body 11; at the same time, the structure also facilitates the sealing connection of the two sealing covers 13 with both ends of the support tube 14. In addition, by providing the support plates 141 at both ends of the support tube 14, it is possible to prevent the support plates 141 from directly heating the side of the pressing roller 11, and then the side of the hot pressing roller body 11 is heated by the heat transfer oil, so that the side of the hot pressing roller body 11 is heated more evenly.

[0064] Please also refer to Figures 6 to 9 As a specific embodiment of the circuit board roller laminating device provided by the present invention, the support plate 141 and the support tube 14 are integrally formed to ensure good connection strength between the support plate 141 and the support tube 14, and at the same time, the support plate 141 and the support tube 14 are sealed.

[0065] Please also refer to Figures 6 to 9 As a specific embodiment of the circuit board roller laminating device provided by the present invention, the hot pressing roller body 11 is made of aluminum, that is, the hot pressing roller body 11 is an aluminum hot pressing roller body 11. Due to the good thermal conductivity of aluminum, the heat conducting oil can better heat the pressing roller 11. Specifically, the hot pressing roller body 11 can be made of AL7075 material.

[0066] Please also refer to Figures 6 to 9 As a specific embodiment of the circuit board roll laminating device provided by the present invention, the support tube 14 is made of aluminum, that is, the support tube 14 is an aluminum tube. Due to the good thermal conductivity of aluminum, the heating tube 12 can heat the support tube 14 well, and then heat the heat transfer oil through the support tube 14. Specifically, the support tube 14 can be made of AL7075 material.

[0067] Please also refer to Figures 6 to 9As a specific embodiment of the circuit board roller laminating device provided by the present invention, a second sealing ring 152 is provided between the two end faces of the hot pressing roller body 11 and the adjacent sealing cover 13, and a second positioning groove (not shown in the figure) for positioning the second sealing ring 152 is respectively provided on the two end faces of the hot pressing roller body 11. The second sealing ring 152 is provided to seal the end face of the hot pressing roller body 11 with the corresponding sealing cover 13 well, and at the same time, the processing accuracy of the end face of the hot pressing roller body 11 and the sealing cover 13 can be reduced. The second positioning groove is provided on the end face of the hot pressing roller body 11 to facilitate the positioning of the second sealing ring 152 for assembly. In other embodiments, the sealing cover 13 can be matched with the plane of the end face of the hot pressing roller body 11, and the sealing cover 13 can be closely matched with the end face of the hot pressing roller body 11 to seal the sealing cover 13 with the end face of the hot pressing roller body 11. In other embodiments, a second positioning groove can also be provided on the sealing cover 13 to position the second sealing ring 152.

[0068] Please also refer to Figures 6 to 9 As a specific embodiment of the circuit board roll laminating device provided by the present invention, a shaft cylinder 131 is provided on the outer side of each sealing cover 13, and the shaft cylinder 131 is located at the center of the corresponding sealing cover 13, and the shaft cylinder 131 is coaxially arranged with the hot pressing roller body 11, so that the hot pressing roller body 11 is rotatably supported by the shaft cylinder 131.

[0069] Please also refer to Figures 6 to 9 As a specific embodiment of the circuit board roller laminating device provided by the present invention, a coupling platform 132 is arranged on the shaft cylinder 131. The coupling platform 132 is formed by the side surface of the support shaft extending outward along the radial direction of the support shaft. The coupling platform 132 is annular to facilitate processing and manufacturing, and is easy to be installed on a medium such as a fixed plate to support the hot pressing roller body 11 and facilitate the rotation of the hot pressing roller body 11.

[0070] Furthermore, the sealing cover 13, the shaft cylinder 131 and the support shaft are integrally formed to increase the connection strength between the sealing cover 13 and the support shaft and facilitate manufacturing.

[0071] Furthermore, at least one free end of the shaft cylinder 131 is provided with a connector 134 to be connected to an external motor, thereby facilitating the rotation of the hot pressing roller body 11. In this embodiment, a connector 134 is provided on one shaft cylinder 131. In other embodiments, connectors 134 may also be provided on both shaft cylinders 131.

[0072] Please also refer to Figures 6 to 9As a specific embodiment of the circuit board roller laminating device provided by the present invention, a heat-conductive protective sleeve 112 is mounted on the hot pressing roller body 11. The heat-conductive protective sleeve 112 is arranged on the hot pressing roller body 11 to protect the hot pressing roller body 11. Preferably, the heat-conductive protective sleeve 112 can be a copper sleeve to achieve good heat conduction and can adhere the dry film 92 to the circuit board. In some other embodiments, the heat-conductive protective sleeve 112 can also be a heat-conductive rubber sleeve to play the role of elastic buffer, which can not only better adhere the dry film 92 to the circuit board, but also prevent the circuit board from being crushed. In some other embodiments, the heat-conductive protective sleeve 112 can also be an aluminum sleeve.

[0073] Please also refer to Fig.10 As a specific embodiment of the circuit board roll laminating device provided by the present invention, the frame 50 includes a first mounting plate 51, a second mounting plate 52 and a connecting beam 53 connecting the first mounting plate 51 and the second mounting plate 52. The frame of this structure is simple in structure, easy to manufacture and low in cost. Furthermore, the height of the second mounting plate 52 is greater than the height of the first mounting plate 51, so that the recovery shaft 61 and the end of the rotating shaft can be mounted on the second mounting plate 52. Of course, in some other embodiments, the structures of the first mounting plate 51 and the second mounting plate 52 can also be set to be the same.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board roller laminating device, comprising a film supply mechanism for supplying a dry film, two hot pressing rollers for hot pressing the dry film onto a circuit board, and a frame supporting the two hot pressing rollers, wherein the film supply mechanism is mounted on the frame, and the two hot pressing rollers are an upper pressing roller and a lower pressing roller arranged side by side in an upper and lower direction, characterized in that: The two ends of the lower pressing roller are respectively axially connected to the frame, and the frame is equipped with supports for supporting the two ends of the upper pressing roller, and each of the supports can be lifted and slidably installed on both sides of the frame. The circuit board roller laminating device also includes a cylinder for pushing the support to lift, a pressure sensor for monitoring the pressure of the upper pressing roller against the lower pressing roller, a controller for controlling the cylinder driving air pressure according to the pressure monitored by the pressure sensor, and a vibration source for driving the upper pressing roller to vibrate at a high frequency. The cylinder is installed on the frame, the pressure sensor is installed on the support, and the vibration source is installed on each of the supports; Each of the hot pressing rollers comprises a hot pressing roller body for hot pressing a dry film on a circuit board, the hot pressing roller body is in a round tube shape, has a center hole in the hot pressing roller body, sealing covers are respectively installed at both ends of the hot pressing roller body, a heating pipe is installed in the center hole, the center hole is also filled with heat transfer oil, the heating pipe is supported at the center axis of the center hole, and the heating pipe is fixedly connected to the sealing cover; A second sealing ring is provided between the two end surfaces of the hot pressing roller body and the adjacent sealing cover; a second positioning groove for positioning the second sealing ring is respectively provided on the two end surfaces of the hot pressing roller body, or a second positioning groove for positioning the second sealing ring is provided on the sealing cover.

2. The circuit board roll laminating device according to claim 1, characterized in that: The pressure sensor is installed between the cylinder and the support, and the piston of the cylinder is connected to the pressure sensor.

3. The circuit board roll laminating device according to claim 2, characterized in that: A support platform is installed on the support, the pressure sensor is placed on the support platform, and the vibration source is installed on the support platform.

4. The circuit board roll laminating device according to claim 3, characterized in that: The circuit board roller laminating device further comprises a guide sleeve for guiding the pressure sensor to rise and fall, the pressure sensor is installed in the guide sleeve, and the guide sleeve is installed on the support platform.

5. The circuit board roll laminating device according to any one of claims 1 to 4, characterized in that: The frame is provided with a slide rail for guiding the support to be lifted and lowered. The support is provided with a slide block, and the slide block is slidably installed on the slide rail.

6. The circuit board roll laminating device according to any one of claims 1 to 4, characterized in that: A support tube is installed in the central hole, and two ends of the support tube are respectively sealed and connected to the two sealing covers. The central hole is filled with the heat transfer oil in the area outside the support tube.

7. The circuit board roll laminating device according to claim 6, characterized in that: Support plates are respectively arranged at both ends of the support tube. The support plates are placed in the central hole and are annular in shape. Each of the support plates is sealed and connected to the adjacent sealing cover.

8. The circuit board roll laminating device according to any one of claims 1 to 4, characterized in that: The film supply mechanism includes a rotating shaft for supporting the dry film roll, a separation shaft for separating the dry film on the dry film roll from the protective film, a recovery shaft for recovering the protective film and a recovery motor for driving the recovery shaft to rotate, one end of the rotating shaft is pivotally connected to the frame, both ends of the separation shaft are pivotally connected to the frame, and one end of the recovery shaft is pivotally connected to the frame.

9. The circuit board roll laminating device according to any one of claims 1 to 4, characterized in that: There are two sets of film supply mechanisms, which are respectively placed at the upper and lower ends of the frame.

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