Thermosyphon cooling device

By setting up a vertical condensation unit and a special arrangement of steam and liquid pipes in the thermosiphon heat dissipation device, the temperature difference problem caused by limited space in electronic equipment is solved, and the temperature uniformity and heat dissipation efficiency are improved.

CN111174613BActive Publication Date: 2025-02-18SHENZHEN ZHIHAN THERMAL TRANSMISSION TECH CO LTD
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Patent Information

Application Number
CN202010120302.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-02-26
Publication Date
2025-02-18
Estimated Expiration
2040-02-26

AI Technical Summary

Technical Problem

When existing thermosiphon heat dissipation devices are used in electronic equipment, due to limited space, it is difficult to effectively reduce the temperature difference between the left and right sides of the evaporator, resulting in uneven temperatures.

Method used

By adopting a thermosiphon heat dissipation device, the first condensing unit and the second condensing unit have a current collecting chamber and a condenser tube perpendicular to the evaporator, and the left and right evaporator is reduced by a special steam pipe and a liquid pipe arrangement. The temperature difference between the two sides makes the temperature more even.

Benefits of technology

In a compact space, the temperature difference between the left and right sides of the evaporator is reduced, so that the temperature on the left and right sides of the bottom of the evaporator is relatively uniform, and the heat dissipation efficiency is improved.

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Abstract

The present invention provides a thermal siphon heat dissipation device, which provides a first condensing unit and a second condensing unit. The first right collecting chamber and the first left collecting chamber of the first condensing unit and the second left collecting chamber and the second right collecting chamber of the second condensing unit are all vertically and fixedly arranged close to the evaporator, thereby reducing the space occupied by the siphon heat dissipation device in the upper and lower directions; the first steam pipe connects the first right collecting chamber of the first condensing unit and the right steam pipe connecting hole arranged on the evaporator, and the second steam pipe connects the second left collecting chamber of the second condensing unit and the left steam pipe connecting hole arranged on the evaporator; thus, compared with only providing a collecting pipe for gathering steam on one side of the evaporator, the technical solution of the present invention can reduce the difference in the distance between the steam in the left area and the steam in the right area of ​​the evaporator sealed accommodating chamber reaching the collecting chamber, thereby reducing the temperature difference between the left and right sides of the evaporator, so that the temperature on the left and right sides of the bottom of the evaporator is relatively uniform.
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Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic or electric equipment, and in particular to a thermal siphon heat dissipation device. Background Art

[0002] The thermal siphon heat dissipation device is composed of a condenser, an evaporator, a steam pipe and a liquid pipe. The evaporator is filled with a working fluid. The condenser is usually composed of two collecting pipes on both sides and a plurality of condensing pipes connecting the two collecting pipes. The evaporator absorbs the heat from the heat source and the internal working fluid is heated up. The working fluid is heated up to generate steam. The steam enters the condenser through the steam pipe and is condensed into a liquid with a lower temperature and then flows back to the evaporator through the liquid pipe, thereby achieving the heat dissipation effect on the heat source.

[0003] In the relevant scheme, refer to Figure 1 , the condenser is placed above the evaporator, the manifolds are arranged horizontally, the steam pipe and the liquid pipe are connected to the evaporator from the middle of the top and the middle of the bottom of the evaporator respectively, the condenser and the evaporator are roughly located on the same plane, thus occupying a larger area. When the thermosiphon heat dissipation device is used in electronic equipment to dissipate heat from electronic components, due to the limited internal space of the electronic equipment, it is impossible to provide enough space in the vertical direction for setting the condenser. Figure 2 If the two headers of the condenser are set perpendicular to the surface of the evaporator, one header must be close to the left and the other to the right, that is, the header for collecting steam is close to the side of the evaporator. The steam pipe layout should be as short as possible to reduce the steam flow distance, thereby reducing the steam flow resistance. In this setting, the steam pipe can only be connected to the side of the evaporator close to the header for collecting steam. Then the steam on the side of the evaporator far from the header for collecting steam has to flow a long distance to reach the header, which causes a large difference in heat absorption capacity between the left and right sides of the evaporator. Summary of the invention

[0004] The object of the present invention is to provide a thermal siphon heat dissipation device which can avoid occupying a large space in the vertical direction, making the structure more compact, and can reduce the temperature difference between the left and right sides of the evaporator, so that the temperature on the left and right sides of the bottom of the evaporator is relatively uniform.

[0005] To solve the above technical problems, the technical solution adopted by the present invention is: a thermal siphon heat dissipation device, including an evaporator, a first condensing unit, a second condensing unit, a first steam pipe, a second steam pipe, a first liquid pipe and a second liquid pipe; the evaporator is provided with a sealed accommodating chamber for accommodating a working medium and a right steam pipe connecting hole, a left steam pipe connecting hole, a right liquid pipe connecting hole and a left liquid pipe connecting hole connected to the sealed accommodating chamber; the right steam pipe connecting hole is located on the right side of the left steam pipe connecting hole; the right liquid pipe connecting hole is located on the right side of the left liquid pipe connecting hole; the first condensing unit has a first right collecting chamber, a first left collecting chamber and a plurality of first condensing tubes arranged in parallel; the first condensing tube connects the first right collecting chamber and the first left collecting chamber; the first right collecting chamber is located on the right side of the evaporator near the top, and its axis is perpendicular to the surface of the evaporator; the first left collecting chamber is located on the evaporator on the left side near the top, with its axis perpendicular to the surface of the evaporator; the second condensing unit has a second left collecting chamber, a second right collecting chamber and a plurality of second condensing tubes arranged in parallel; the second condensing tube connects the second left collecting chamber and the second right collecting chamber; the second left collecting chamber is located on the left side near the top of the evaporator, with its axis perpendicular to the surface of the evaporator; the second right collecting chamber is located on the right side near the top of the evaporator, with its axis perpendicular to the surface of the evaporator; one end of the first steam pipe is connected to the first right collecting chamber, and the other end is connected to the right steam pipe connecting hole; one end of the second steam pipe is connected to the second left collecting chamber, and the other end is connected to the left steam pipe connecting hole; one end of the first liquid pipe is connected to the first left collecting chamber, and the other end is connected to the left liquid pipe connecting hole; one end of the second liquid pipe is connected to the second right collecting chamber, and the other end is connected to the right liquid pipe connecting hole.

[0006] Further, the axis of the first right manifold is in the same straight line as the axis of the second right manifold; the axis of the first left manifold is in the same straight line as the axis of the second left manifold.

[0007] Furthermore, the first condensing unit and the second condensing unit are integrated on the same condenser, and the condenser includes a left collecting pipe and a right collecting pipe spaced apart on the left and right sides; the left collecting pipe and the right collecting pipe are fixedly arranged close to the evaporator; a first partition plate is arranged in the right collecting pipe, and the internal cavity of the right collecting pipe is divided into a first right collecting cavity and a second right collecting cavity; a second partition plate is arranged in the left collecting pipe, and the internal cavity of the left collecting pipe is divided into a first left collecting cavity and a second left collecting cavity.

[0008] Further, the first condensing unit and the second condensing unit are arranged in parallel in the up and down directions; the first condensing unit is a condenser, including a first right collecting tube and a first left collecting tube, the first right collecting cavity is formed in the first right collecting tube, and the first left collecting cavity is formed in the first left collecting tube; the first right collecting tube and the first left collecting tube are fixedly arranged close to the evaporator; the second condensing unit is a condenser, including a second right collecting tube and a second left collecting tube, the second right collecting cavity is formed in the second right collecting tube, and the second left collecting cavity is formed in the second left collecting tube; the second right collecting tube and the second left collecting tube are fixedly arranged close to the evaporator.

[0009] Furthermore, the left liquid pipe connection hole is located directly below the left steam pipe connection hole; and the right liquid pipe connection hole is located directly below the right steam pipe connection hole.

[0010] Furthermore, the right steam pipe connection hole and the right liquid pipe connection hole are both arranged close to the right side of the evaporator; the left steam pipe connection hole and the left liquid pipe connection hole are both arranged close to the left side of the evaporator.

[0011] Furthermore, it also includes a right additional steam pipe and a left additional steam pipe; the first condensing unit is located above the second condensing unit; the evaporator is also provided with a right additional steam pipe connection hole and a left additional steam pipe connection hole; the right additional steam pipe connection hole and the left additional steam pipe connection hole are both connected to the sealed accommodating cavity, and the right additional steam pipe connection hole is located on the right side of the left additional steam pipe connection hole; one end of the right additional steam pipe is connected to the first right collecting cavity, the right additional steam pipe bypasses the second right collecting pipe and the other end is connected to the right additional steam pipe connection hole; one end of the left additional steam pipe is connected to the second left collecting cavity, and the other end of the left additional steam pipe is connected to the left additional steam pipe connection hole.

[0012] Furthermore, a groove matched with the outer side wall of the right additional steam pipe is formed on the second right collecting pipe, and the right additional steam pipe is embedded in the groove.

[0013] Furthermore, the first condensing unit and the second condensing unit are staggered left and right, so that the first right collecting pipe and the right side of the evaporator form a residual space and the first steam pipe is arranged in the residual space, and the second left collecting pipe and the left side of the evaporator form a residual space and the second steam pipe is arranged in the residual space.

[0014] Furthermore, a transfer tube is fixedly provided on the evaporator, which is connected to the right steam pipe connection hole, the left steam pipe connection hole, the right liquid pipe connection hole and the left liquid pipe connection hole in a one-to-one correspondence; the first steam pipe, the second steam pipe, the first liquid pipe and the second liquid pipe are respectively connected to the sealed accommodating cavity through the corresponding transfer tube.

[0015] It can be seen from the above technical solution that the present invention has at least the following advantages and positive effects:

[0016] The present invention provides a thermal siphon heat dissipation device, which is provided with a first condensing unit and a second condensing unit. The first right collecting chamber and the first left collecting chamber of the first condensing unit and the second left collecting chamber and the second right collecting chamber of the second condensing unit are all perpendicular to the evaporator, thereby reducing the space occupied by the siphon heat dissipation device in the upper and lower directions. Then, the first right collecting chamber of the first condensing unit and the right steam pipe connecting hole arranged on the evaporator are connected by a first steam pipe, and the second left collecting chamber of the second condensing unit and the left steam pipe connecting hole arranged on the evaporator are connected by a second steam pipe. Since the left steam pipe connecting hole is located on the left side of the right steam pipe connecting hole, the second left collecting chamber is located on the left side of the first right collecting chamber. Therefore, compared with only providing a collecting pipe for gathering steam on one side of the evaporator, the technical solution of the present invention can reduce the difference in the distance of steam in the left area and the right area of ​​the evaporator sealing accommodating chamber to reach the collecting chamber, thereby reducing the temperature difference between the left and right sides of the evaporator, so that the temperature on the left and right sides of the bottom of the evaporator is relatively uniform. Moreover, the steam pipe and the liquid pipe can be arranged on both sides of the evaporator respectively, reducing the pipe diameter of the steam pipe, which is convenient for pipeline arrangement. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 and Figure 2 It is a schematic diagram of the three-dimensional structure of the thermal siphon heat dissipation device in the relevant scheme.

[0018] Figure 3 , Figure 5 and Figure 6 It is a schematic diagram of the three-dimensional structure of a thermosiphon heat dissipation device in which the first condensing unit and the second condensing unit are specifically arranged at the same height in one embodiment of the present invention.

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of a heat source at the bottom of an evaporator in one embodiment of the present invention.

[0020] Figure 7 , Figure 8 and Fig. 9 It is a schematic diagram of the three-dimensional structure of a thermosiphon heat dissipation device in which a first condensing unit and a second condensing unit are arranged side by side in the vertical direction in one embodiment of the present invention.

[0021] Fig.10 It is a schematic diagram of the three-dimensional structure of a thermosiphon heat dissipation device after a right additional steam pipe and a left additional steam pipe are arranged in one embodiment of the present invention.

[0022] Fig.11 and Fig.12 It is a schematic diagram of the three-dimensional structure of the thermosiphon heat dissipation device after a groove is formed in the second right collecting pipe in one embodiment of the present invention.

[0023] The reference numerals in the accompanying drawings are explained as follows: 1. Evaporator; 2. First condensing unit; 21. First condensing tube; 22. First right collecting tube; 23. First left collecting tube; 3. Second condensing unit; 31. Second condensing tube; 32. Second right collecting tube; 321. Groove; 33. Second left collecting tube; 4. First steam pipe; 5. Second steam pipe; 6. First liquid pipe; 7. Second liquid pipe; 8. Adapter tube; 9. Adapter seat; 10. Heat source; 11. Left collecting tube; 12. Right collecting tube; 13. First partition; 14. Second partition; 15. Right additional steam pipe; 16. Left additional steam pipe. DETAILED DESCRIPTION

[0024] Typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and the descriptions and illustrations therein are essentially used for illustration purposes rather than for limiting the present invention.

[0025] In the description of the present invention, it should be understood that the terms "above" and "below" refer to the orientation relationship of the thermosiphon heat dissipation device in use. In addition, other terms indicating orientation or positional relationships, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Reference Figure 3The embodiment of the present invention provides a thermosiphon heat dissipation device, which can be used to dissipate heat from heating elements in electronic or electrical equipment. The thermosiphon heat dissipation device includes an evaporator 1, a first condensing unit, a second condensing unit, a first steam pipe 4, a second steam pipe 5, a first liquid pipe 6, and a second liquid pipe 7.

[0028] Reference Figure 4 The evaporator 1 has a sealed accommodating chamber inside, which is evacuated and filled with a proper amount of working fluid. In the use state, the evaporator 1 is vertically arranged, and the surface of the evaporator 1 is in close contact with a heat source 10 such as a heat-generating electronic component. The heat of the heat source 10 enters the evaporator 1 through heat conduction and is finally dissipated by the first condensing unit and the second condensing unit of the thermosiphon heat dissipation device.

[0029] A right steam pipe connection hole, a left steam pipe connection hole, a right liquid pipe connection hole and a left liquid pipe connection hole (not shown in the figure) connected to the sealed accommodating chamber are provided on one side of the evaporator 1 close to the condenser. The right steam pipe connection hole and the left steam pipe connection hole are close to the top of the evaporator 1 and are used to connect to the upper part of the sealed accommodating chamber. The left steam pipe connection hole is located on the left side of the right steam pipe connection hole. The right liquid pipe connection hole and the left liquid pipe connection hole are close to the bottom of the evaporator 1 and are used to connect to the lower part of the sealed accommodating chamber. The right liquid pipe connection hole is located on the right side of the left liquid pipe connection hole.

[0030] Reference Figure 5 The evaporator 1 is fixed with a transfer tube 8 that is connected to the right steam pipe connection hole, the left steam pipe connection hole, the right liquid pipe connection hole and the left liquid pipe connection hole in a one-to-one correspondence. The transfer tube 8 is fixed to the evaporator 1 in advance as a whole. The inner diameter of the transfer tube 8 is slightly larger than the outer diameters of the first steam pipe 4, the second steam pipe 5, the first liquid pipe 6 and the second liquid pipe 7, so that during subsequent assembly, one end of the first steam pipe 4, the second steam pipe 5, the first liquid pipe 6 and the second liquid pipe 7 can be inserted into the transfer tube 8, thereby facilitating gas welding.

[0031] The specific method of pre-fixing the transfer tube 8 and the evaporator 1 as one is to weld the transfer tube 8 and the components constituting the evaporator 1 together at one time by furnace welding.

[0032] The above solution can avoid surface deformation of the evaporator 1 due to local heating of the evaporator 1 when the steam pipes and liquid pipes are directly welded to the steam pipe connection holes and liquid pipe connection holes of the evaporator 1 during assembly. It can also avoid heating the evaporator 1 as a whole before welding the steam pipes and liquid pipes, which consumes a long heating time, thereby improving production efficiency and reducing the complexity of the manufacturing process.

[0033] In practical applications, the number and location of the transfer tubes 8 are determined according to the number and location of the actual steam pipe connection holes and liquid pipe connection holes, that is, the number of transfer tubes 8 should be equal to the sum of the number of steam pipes and liquid pipes.

[0034] The first condensing unit has a first right manifold, a first left manifold, and a plurality of first condensing tubes 21 arranged in parallel. The first condensing tube 21 connects the first right manifold and the first left manifold. The first right manifold is located on the right side of the evaporator 1 near the top, and its axis is perpendicular to the surface of the evaporator 1. The first left manifold is located on the left side of the evaporator 1 near the top, and its axis is perpendicular to the surface of the evaporator 1.

[0035] The second condensing unit has a second left manifold, a second right manifold, and a plurality of second condensing tubes 31 arranged in parallel. The second condensing tubes 31 connect the second left manifold and the second right manifold. The second left manifold is located on the left side of the evaporator 1 near the top, and its axis is perpendicular to the surface of the evaporator 1. The second right manifold is located on the right side of the evaporator 1 near the top, and its axis is perpendicular to the surface of the evaporator 1.

[0036] Among them, the first right manifold, the first left manifold, the second left manifold and the second right manifold are all internal cavities of the tubular object, and the axial direction is also the length direction of the tubular object.

[0037] Through the above arrangement, the thermosiphon heat dissipation device of this scheme can avoid the arrangement of the condenser and the evaporator 1 arranged in parallel up and down (such as Figure 1 The heat dissipation device is designed to avoid occupying a large layout area caused by the large vertical space. In addition, the length and occupied space of the steam pipe and the liquid pipe are shortened, making the heat dissipation device more compact as a whole.

[0038] Continue to refer to Figure 3 , Figure 5 and Figure 6 The specific arrangement of the first condensing unit and the second condensing unit can be at the same height, and the axis of the first right manifold and the axis of the second right manifold are on the same straight line. The axis of the first left manifold and the axis of the second left manifold are on the same straight line. In this way, the first condensing unit and the second condensing unit are located at the same height plane, and the first condensing unit and the second condensing unit will not interfere with each other.

[0039] Specifically, the first condensing unit and the second condensing unit can be formed by dividing the same condenser. The condenser includes a left manifold 11 and a right manifold 12 spaced apart from each other. The axes of the left manifold 11 and the right manifold 12 are perpendicular to the surface of the evaporator 1, and one end thereof is fixedly arranged close to the surface of the evaporator 1. Wherein, "close to" means that one end of the left manifold 11 and one end of the right manifold 12 are near the surface of the evaporator 1 or against the surface of the evaporator 1. A first partition plate 13 is arranged in the right manifold 12, thereby dividing the internal cavity of the right manifold 12 into a first right manifold cavity and a second right manifold cavity. A second partition plate 14 is arranged in the left manifold 11, thereby dividing the internal cavity of the left manifold 11 into a first left manifold cavity and a second left manifold cavity. The first condensing unit can be arranged on the side of the second condensing unit away from the evaporator 1, and the second condensing unit is directly close to the evaporator 1.

[0040] The first right manifold and the second left manifold are both used to gather steam, and the gathered steam is respectively introduced into the first condenser 21 and the second condenser 31 for cooling and liquefaction.

[0041] The first condenser tube 21 and the second condenser tube 31 can be in the form of a flat tube, a round tube, etc.

[0042] The first left manifold and the second right manifold are respectively connected to the outlet of the first condenser tube 21 and the outlet of the second condenser tube 31 , so as to respectively gather liquid condensed from the first condenser tube 21 and the second condenser tube 31 .

[0043] Figure 6 The arrows indicate the flow direction of the working medium in the first condenser tube 21 and the second condenser tube 31. During the flow, the vapor working medium is gradually condensed into liquid working medium.

[0044] The first condensing unit and the second condensing unit may also be two independent condensers. The two independent condensers are arranged at the same height, and the two independent condensers may also be spaced a certain distance apart.

[0045] Two adapters 9 are fixedly provided on the left manifold 11 and the right manifold 12, respectively, and the adapters 9 have internal passages. The two adapters 9 on the right manifold 12 are connected to the first right manifold cavity and the second right manifold cavity, respectively, and the two adapters 9 on the left manifold 11 are connected to the first left manifold cavity and the second left manifold cavity, respectively.

[0046] One end of the first steam pipe 4 is connected to the first right manifold through the corresponding adapter 9, and the other end is connected to the right steam pipe connection hole, so that the steam near the right side of the evaporator 1 can be transmitted to the first right manifold.

[0047] One end of the first liquid pipe 6 is connected to the first left manifold through the corresponding adapter 9 , and the other end is connected to the left liquid pipe connection hole, so that the condensed liquid in the first left manifold can flow back to the evaporator 1 .

[0048] Similarly, the adapter seat 9 corresponding to one end of the second steam pipe 5 is connected to the second left manifold, and the other end is connected to the left steam pipe connection hole, so that the steam near the left side of the evaporator 1 can be transmitted to the second left manifold.

[0049] One end of the second liquid pipe 7 is connected to the second right manifold through the corresponding adapter 9 , and the other end is connected to the right liquid pipe connection hole, so that the condensed liquid in the second left manifold can flow back to the evaporator 1 .

[0050] In some embodiments, the adapter 9 may not be provided on the left collecting pipe 11 and the right collecting pipe 12, and the first steam pipe 4, the second steam pipe 5, the first liquid pipe 6 and the second liquid pipe 7 are directly connected to the first right collecting chamber, the first left collecting chamber, the second left collecting chamber and the second right collecting chamber respectively.

[0051] The first steam pipe 4, the second steam pipe 5, the first liquid pipe 6 and the second liquid pipe 7 are respectively arranged on the left and right sides, and the diameter of the steam pipe is reduced, which can alleviate the problem of difficult pipeline layout.

[0052] Reference Figure 7 , Figure 8 and Fig. 9 The specific arrangement of the first condensing unit 2 and the second condensing unit 3 can also be arranged side by side in the up and down direction, so that the first condensing unit 2 and the second condensing unit 3 are independent condensers. The first condensing unit 2 can be located above the second condensing unit 3. The first condensing unit 2 and the second condensing unit 3 can be arranged close to each other up and down, or they can be separated by a certain distance.

[0053] The first condensing unit 2 includes a first right manifold 22, a first left manifold 23, and a first condensing tube 21 connected between the first right manifold 22 and the first left manifold 23. The first right manifold cavity is formed in the first right manifold 22. The first left manifold cavity is formed in the first left manifold 23. One end of the first right manifold 22 and one end of the first left manifold 23 are fixedly arranged close to the surface of the evaporator 1, and the axes are perpendicular to the surface of the evaporator 1.

[0054] The second condensing unit 3 is a condenser including a second right header 32, a second left header 33, and a second condensing tube 31 connected between the second right header 32 and the second left header 33. A second right header cavity is formed in the second right header 32, and a second left header cavity is formed in the second left header 33. One end of the second right header 32 and one end of the second left header 33 are fixedly arranged close to the surface of the evaporator 1, and the axes are both perpendicular to the surface of the evaporator 1.

[0055] Figure 7 The arrows indicate the flow direction of the working medium in the first condenser tube 21 and the second condenser tube 31. During the flow, the vapor working medium is gradually condensed into liquid working medium.

[0056] In the specific implementation, the first condensing unit 2 and the second condensing unit 3 are staggered in left and right positions, that is, the first condensing unit 2 and the second condensing unit 3 are not completely vertically opposite, so that the first right header 22 and the right side of the evaporator 1 form a remaining space and the first steam pipe 4 is arranged in the remaining space, and the second left header 33 and the left side of the evaporator 1 form a remaining space and the second steam pipe 5 is arranged in the remaining space. Thus, the arrangement of the steam pipe is more reasonable, the structure is more compact, and the travel of the steam in the steam pipe is shortened as much as possible to achieve a better heat dissipation effect.

[0057] The first condensing unit 2 and the second condensing unit 3 are of similar size, and the first left header 23 of the first condensing unit 2 is located on the upper left of the second left header 33 of the second condensing unit 3. Therefore, the first liquid pipe 6 can be arranged closer to the evaporator 1, so that the first liquid pipe 6 can cross the second steam pipe 5 from the side of the second steam pipe 5 away from the evaporator 1 and connect to the left steam pipe connection hole.

[0058] In actual use, a cooling fan is provided to be used in conjunction with the thermosiphon cooling device. If the wind generated by the cooling fan first flows through the second condensing unit 3 and then flows through the first condensing unit 2, a portion of the heat of the second condensing unit 3 is brought into the first condensing unit 2, so that the temperature of the first condensing unit 2 is higher than that of the second condensing unit 3. Then, the heat source control temperature of the first steam pipe 4 of the evaporator 1 close to the first condensing unit 2 will be higher than the heat source control temperature of the second steam pipe 5 of the evaporator 1 close to the second condensing unit 3, that is, the temperature on the right side of the evaporator 1 is higher than the temperature on the left side. This is because when the heat exchange area of ​​the condensing units is the same, the heat source control temperature rise is mainly based on the condenser temperature.

[0059] In view of this problem, the present embodiment is configured as follows: the left liquid pipe connection hole is set directly below the left steam pipe connection hole, and the right liquid pipe connection hole is set directly below the right steam pipe connection hole. Thus, the liquid working medium with a lower temperature flowing out of the second condensing unit 3 with a better condensing effect flows into the right side of the evaporator 1, thereby compensating for the problem of the higher temperature on the right side of the evaporator 1. Similarly, the liquid working medium with a higher temperature flowing out of the first condensing unit 2 flows into the left side of the evaporator 1, thereby compensating for the problem of the lower temperature on the left side of the evaporator 1. Thus, through this compensation design, the temperature on the left and right sides of the evaporator 1 is relatively balanced.

[0060] Among them, "directly below" is not absolute, and a certain manufacturing error is allowed. It can also achieve good results to set the left liquid pipe connection hole in the vicinity of the area directly below the left steam pipe connection hole and the right liquid pipe connection hole in the vicinity of the area directly below the right steam pipe connection hole.

[0061] Furthermore, the right steam pipe connection hole and the right liquid pipe connection hole are both arranged near the right side of the evaporator 1. The left steam pipe connection hole and the left liquid pipe connection hole are both arranged near the left side of the evaporator 1. That is, the left-right distance between the right steam pipe connection hole and the left steam pipe connection hole and the distance between the right liquid pipe connection hole and the left liquid pipe connection hole are extended as far as possible, so that the above-mentioned compensation mechanism works more obviously, and the heat source temperature on the left and right sides of the evaporator 1 is controlled more evenly.

[0062] Reference Fig.10 , under the limitation of the setting space, the diameter of the first steam pipe 4 and the diameter of the second steam pipe are difficult to continue to increase, and the oversized pipe diameter is difficult to turn in the limited space. When the heat source power is larger, the steam volume will be larger. In order to make the steam in the evaporator 1 flow into the first condensing unit 2 and the second condensing unit 3 more smoothly, the thermal siphon heat dissipation device is also provided with a right additional steam pipe 15 and a left additional steam pipe 16, and the evaporator 1 is provided with corresponding right additional steam pipe connection holes and left additional steam pipe connection holes. The right additional steam pipe connection hole and the left additional steam pipe connection hole are both connected to the sealed accommodating cavity, and the right additional steam pipe connection hole is located on the right side of the left additional steam pipe connection hole. One end of the right additional steam pipe 15 is connected to the first right manifold, and the right additional steam pipe 15 bypasses the second right manifold 32 and the other end is connected to the right additional steam pipe connection hole, so that a part of the steam on the right side of the evaporator 1 can enter the first right manifold 22 of the first condensing unit 2 through the right additional steam pipe 15. One end of the left additional steam pipe 16 is connected to the second left collecting chamber, and the other end of the left additional steam pipe 16 is connected to the left additional steam pipe connecting hole, so that a part of the steam on the left side of the evaporator 1 can enter the second left collecting pipe 33 of the second condensing unit 3 through the left additional steam pipe 16.

[0063] Through the above arrangement, the channel for steam to flow into the first condensing unit 2 and the second condensing unit 3 is increased, so that the steam in the evaporator 1 can flow into the first condensing unit 2 and the second condensing unit 3 more smoothly, and the flow resistance is reduced, thereby further improving the heat dissipation capacity.

[0064] Reference Fig.11 and Fig.12The second right manifold 32 is provided with a groove 321 adapted to the outer side wall of the right additional steam pipe 15, and the right additional steam pipe 15 is embedded in the groove 321. It can be understood that the groove 321 provided in the second right manifold 32 is only used to accommodate the right additional steam pipe 15, and to make way for the right additional steam pipe 15 to pass through, and the second right manifold cavity in the second right manifold 32 should be ensured to be still a sealed cavity. Therefore, when the second right manifold 32 is arranged close to the right side of the evaporator 1, it is avoided that the right additional steam pipe 15 protrudes from the right side of the evaporator 1 and fails to meet the setting space limitation of the thermosiphon heat dissipation device.

[0065] In the scheme in which the first condensing unit 2 and the second condensing unit 3 are arranged side by side in the up and down directions, the above implementation scheme in which the first condensing unit 2 and the second condensing unit 3 are arranged at the same height can be referred to, and corresponding adapter tubes 8 are respectively provided on the right steam pipe connection hole, the left steam pipe connection hole, the right liquid pipe connection hole and the left liquid pipe connection hole of the evaporator 1, and corresponding adapter seats 9 are provided on the first right collecting pipe 22, the first left collecting pipe 23, the second right collecting pipe 32 and the second left collecting pipe 33. Each liquid pipe and steam pipe is connected to the corresponding adapter tube 8 and adapter seat 9, thereby realizing the connection between the sealed accommodating cavity in the evaporator 1 and the collecting cavity in the corresponding collecting pipe, which will not be introduced in detail here.

[0066] In practical applications, the first condensing unit 2 and the second condensing unit 3 are arranged at the same height ( Figures 3 to 5 As shown) and the first condensing unit 2 and the second condensing unit 3 are arranged side by side in the vertical direction ( Figures 7 to 9 The two solutions shown in the figure can be mixed, for example, three condensers are set in a thermosyphon cooling device. One of the condensers is Figures 3 to 5 The scheme shown is to divide the condenser into two condensing units by setting partitions in the manifolds on both sides. Figures 7 to 9 The solution shown is arranged as two independent condensing units one above the other. Through this mixed arrangement, multiple condensers are arranged to meet the heat dissipation requirements of higher thermal power.

[0067] Figures 3 to 5The scheme of dividing the condenser into two condensation units shown can also be extended and implemented on multiple condensers placed up and down. Taking the setting of two condensers as an example, each is divided into two condensation units in advance, the left side of one condensation unit of the first condenser is connected to the left side of one condensation unit of the second condenser, the right side of one condensation unit of the first condenser is connected to the right side of one condensation unit of the second condenser, the left side of another condensation unit of the first condenser is connected to the left side of another condensation unit of the second condenser, and the right side of another condensation unit of the first condenser is connected to the right side of another condensation unit of the second condenser, so as to form a synthetic first condensation unit 2 and second condensation unit 3 as a whole.

[0068] Although the present invention has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in a variety of forms without departing from the spirit or essence of the present invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A thermosyphon heat dissipation device, characterized in that: include: The evaporator is provided with a sealed accommodating chamber for accommodating a working medium, and a right steam pipe connection hole, a left steam pipe connection hole, a right liquid pipe connection hole and a left liquid pipe connection hole which are connected to the sealed accommodating chamber; the right steam pipe connection hole is located on the right side of the left steam pipe connection hole; the right liquid pipe connection hole is located on the right side of the left liquid pipe connection hole; the positions of the right steam pipe connection hole and the left steam pipe connection hole are higher than the positions of the right liquid pipe connection hole and the left liquid pipe connection hole; A first condensing unit comprises a first right manifold, a first left manifold and a plurality of first condensing tubes arranged in parallel; The first condensing pipe is connected to the first right manifold and the first left manifold; The first right manifold is located on the right side of the evaporator near the top, and its axis is perpendicular to the surface of the evaporator; The first left manifold is located on the left side of the evaporator near the top, and its axis is perpendicular to the surface of the evaporator; A second condensing unit comprises a second left manifold, a second right manifold and a plurality of second condensing tubes arranged in parallel; the second condensing tubes are connected with the second left manifold and the second right manifold; The second left manifold is located on the left side of the evaporator near the top, and its axis is perpendicular to the surface of the evaporator; The second right manifold is located on the right side of the evaporator near the top, and its axis is perpendicular to the surface of the evaporator; A first steam pipe, one end of which is connected to the first right manifold, and the other end of which is connected to the right steam pipe connection hole; A second steam pipe, one end of which is connected to the second left manifold, and the other end of which is connected to the left steam pipe connection hole; A first liquid pipe, one end of which is connected to the first left manifold, and the other end of which is connected to the left liquid pipe connection hole; A second liquid pipe, one end of which is connected to the second right manifold, and the other end of which is connected to the right liquid pipe connection hole; The axis of the first right manifold and the axis of the second right manifold are on the same straight line; The axis of the first left manifold and the axis of the second left manifold are on the same straight line; The first condensing unit and the second condensing unit are arranged side by side in the up-down direction; The first condensing unit is a condenser, comprising a first right header and a first left header, the first right header forms the first right header cavity, and the first left header forms the first left header cavity; The first right header and the first left header are fixedly arranged close to the evaporator; The second condensing unit is a condenser, comprising a second right header and a second left header, the second right header forms the second right header cavity, and the second left header forms the second left header cavity; The second right header and the second left header are fixedly arranged close to the evaporator; The left liquid pipe connection hole is located directly below the left steam pipe connection hole; the right liquid pipe connection hole is located directly below the right steam pipe connection hole; The right steam pipe connection hole and the right liquid pipe connection hole are both arranged close to the right side of the evaporator; the left steam pipe connection hole and the left liquid pipe connection hole are both arranged close to the left side of the evaporator; It also includes a right additional steam pipe and a left additional steam pipe; the first condensing unit is located above the second condensing unit; the evaporator is also provided with a right additional steam pipe connection hole and a left additional steam pipe connection hole; the right additional steam pipe connection hole and the left additional steam pipe connection hole are both connected to the sealed accommodating cavity, and the right additional steam pipe connection hole is located on the right side of the left additional steam pipe connection hole; One end of the right additional steam pipe is connected to the first right manifold, the right additional steam pipe bypasses the second right manifold and the other end is connected to the right additional steam pipe connection hole; one end of the left additional steam pipe is connected to the second left manifold, the other end of the left additional steam pipe is connected to the left additional steam pipe connection hole; The first condensing unit and the second condensing unit are staggered left and right, so that the first right collecting pipe and the right side of the evaporator form a remaining space and the first steam pipe is arranged in the remaining space, and the second left collecting pipe and the left side of the evaporator form a remaining space and the second steam pipe is arranged in the remaining space.

2. The thermosyphon heat dissipation device according to claim 1, characterized in that: The first condensing unit and the second condensing unit are integrated on the same condenser, and the condenser includes a left header and a right header spaced apart from each other; the left header and the right header are fixedly arranged close to the evaporator; A first partition plate is arranged in the right manifold to divide the inner cavity of the right manifold into a first right manifold cavity and a second right manifold cavity; A second partition plate is arranged inside the left manifold to divide the inner cavity of the left manifold into a first left manifold cavity and a second left manifold cavity.

3. The thermosyphon heat dissipation device according to claim 1, characterized in that: The second right manifold is provided with a groove matched with the outer side wall of the right additional steam pipe, and the right additional steam pipe is embedded in the groove.

4. The thermosyphon heat dissipation device according to claim 1, characterized in that: The evaporator is fixedly provided with a transfer tube which is connected with the right steam pipe connection hole, the left steam pipe connection hole, the right liquid pipe connection hole and the left liquid pipe connection hole in a one-to-one correspondence; the first steam pipe, the second steam pipe, the first liquid pipe and the second liquid pipe are respectively connected with the sealed accommodating cavity through the corresponding transfer tube.

Citation Information

Patent Citations

  • Thermosyphon heat dissipation device

    CN211696009U