Curing parameter optimization method and device, thin film curing system and computer device

Abstract

The application relates to a curing parameter optimization method and device, a thin film curing system and computer equipment. The method comprises the following steps: acquiring thin film initial temperature information and a first curing parameter of a thin film curing system; inputting the initial temperature information and the first curing parameter into a temperature solving model to obtain a thin film temperature under the first curing parameter; and obtaining a second curing parameter according to the thin film temperature and a preset thin film curing temperature. The method can acquire the initial temperature information and the first curing parameter of the thin film curing system, input the initial temperature information and the first curing parameter into the temperature solving model to obtain the thin film temperature under the first curing parameter, and obtain the second curing parameter according to the thin film temperature and the preset thin film curing temperature. The thin film is controlled to cure according to the second curing parameter, the corresponding thermal curing process parameter can be acquired, the thermal curing process production can be standardized, and the efficiency and quality of the functional thin film thermal curing process are improved.

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