Spraying device and process chamber

Abstract

The present invention proposes a spray device and a process chamber, wherein the spray device comprises: a cover body, an injection channel is provided on the cover body; an electrode plate, a gas distribution space is formed between the electrode plate and the cover body, and the injection channel is connected to the gas distribution space; and a gas distribution device is arranged in the gas distribution space, and is located between the injection channel and the electrode plate. The spray device provided by the present invention forms a gas distribution space between the cover body and the electrode plate, and the vapor deposition process gas injected through the injection channel is buffered in the gas distribution space and then deposited on the substrate through the electrode plate. The formation of the gas distribution space makes the gas supply after flowing through the electrode plate more uniform, and further improves the uniformity of the coating. The spray device provided by the present invention arranges a gas distribution device in the gas distribution space, which plays a role in dispersing and uniformly distributing the vapor deposition process gas, so that the vapor deposition process gas is uniformly supplied to the electrode plate, which can improve the uniformity of the coating and improve the coating effect.

Description

Technical Field

[0001] The invention relates to the field of vapor deposition, and in particular to a spray device and a process chamber. Background Art

[0002] In the field of vapor deposition, a spray electrode device is used to deliver external process gas into the process chamber. Existing vapor deposition equipment has increasingly higher requirements for production capacity and coating uniformity. In the prior art, vapor deposition process gas is directly supplied to the electrode plate, resulting in uneven supply of vapor deposition process gas and poor coating uniformity. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0004] To this end, a first aspect of the present invention provides a spray device.

[0005] A second aspect of the present invention provides a process chamber.

[0006] In view of this, according to a first aspect of the present invention, a spray device is proposed, comprising: a cover body, on which an injection channel is provided; an electrode plate, an air distribution space is formed between the electrode plate and the cover body, and the injection channel is connected to the air distribution space; an air distribution device is arranged in the air distribution space, located between the injection channel and the electrode plate.

[0007] The spray device provided by the present invention places a substrate on a side of the electrode plate away from the cover body during operation, and the vapor deposition process gas is supplied to the electrode plate through the injection channel and the gas distribution device, and then transported to between the substrate and the electrode plate through the electrode plate. The electrode plate is energized to form an electric field between the electrode plate and the substrate, and the electric field can excite the vapor deposition process gas to deposit a coating on the substrate.

[0008] The spray device provided by the present invention forms an air distribution space between the cover body and the electrode plate. The vapor deposition process gas injected through the injection channel is buffered in the air distribution space and then deposited on the substrate through the electrode plate. The formation of the air distribution space makes the gas supply after flowing through the electrode plate more uniform, further improving the uniformity of the coating.

[0009] The spray device provided by the present invention disperses and evenly distributes the vapor deposition process gas by arranging the gas distribution device in the gas distribution space, so that the vapor deposition process gas is evenly supplied to the electrode plate, which can improve the uniformity of the coating and improve the coating effect.

[0010] In addition, the spray device in the above technical solution provided by the present invention may also have the following additional technical features:

[0011] In the above technical solution, further, the gas distribution device includes: a first gas equalizing member, connected to the cover body, and located between the injection channel and the electrode plate; at least one second gas equalizing member, connected to the electrode plate, and located between the electrode plate and the first gas equalizing member, dividing the gas distribution space into a first gas distribution space and a second gas distribution space; wherein the second gas equalizing member is provided with a gas equalizing hole, and the electrode plate is provided with a gas injection hole.

[0012] In this technical solution, the spray device further includes a first gas equalizing member and a second gas equalizing member. The first gas equalizing member is arranged between the injection channel and the electrode plate, and the second gas equalizing member is arranged between the electrode plate and the first gas equalizing member. Through the setting of the first gas equalizing member, it is possible to prevent the vapor deposition process gas injected through the injection channel from being directly supplied to the electrode plate, resulting in uneven gas supply; through the setting of the second gas equalizing member, the vapor deposition process gas after passing through the first gas equalizing member is supplied to the second gas equalizing member, and then supplied to the gas injection plate after passing through the second gas equalizing member, which plays the role of re-distributing the gas, so that the gas supply after flowing through the electrode plate is more uniform, further improving the uniformity of the coating.

[0013] Specifically, the first gas equalizing component is an gas distribution flange, and the second gas equalizing component is an gas equalizing plate.

[0014] Specifically, the first gas equalizing member has a plurality of gas distribution holes on the upper part and mounting holes arranged on the peripheral side. The first gas equalizing member is connected to the cover body through the mounting holes, and a gap is left between the first gas equalizing member and the cover body. The vapor deposition process gas injected through the injection channel can flow through the gap between the cover body and the first gas equalizing member to the first gas distribution space between the second gas equalizing member and the first gas equalizing member, and can also be transported to the first gas distribution space through the gas distribution holes of the second gas equalizing member to make the vapor deposition process gas supply more uniform.

[0015] Specifically, there are multiple gas-equalizing holes on the upper part of the second gas-equalizing member, and the aperture size of the gas-equalizing holes is between 0.1 and 2 mm. The multiple gas-equalizing holes are evenly distributed, and multiple second shrinkage holes can be set on the peripheral side of the second gas-equalizing member. The second gas-equalizing member is arranged between the first gas-equalizing member and the electrode plate. The setting of the second gas-equalizing member can redistribute the gas in the vapor deposition process, so that the gas supplied between the electrode plate and the substrate is more uniform. Furthermore, the setting of the second shrinkage hole can realize that when the second gas-equalizing member is heated and expanded, it can preferentially expand along the direction of the second shrinkage hole, thereby preventing the second gas-equalizing member from being deformed or damaged due to thermal stress.

[0016] Specifically, the second gas equalizing member may be a single-layer or multi-layer structure, and a multi-layer second gas equalizing member may have better gas distribution uniformity.

[0017] In any of the above technical solutions, further, an insulating tube is arranged in the cover body, and an injection channel is formed in the insulating tube; the cover body insulating plate is connected to the cover body, and is located between the electrode plate and the cover body; the electrode plate insulating plate is connected to the cover body insulating plate and the electrode plate, and is located on the peripheral side of the electrode plate; the electrode plate cover is connected to the cover body insulating plate and the electrode plate, and is located between the electrode plate and the cover body insulating plate; wherein the first gas equalizing member is connected to the cover body through the electrode plate cover and the cover body insulating plate, and the first gas equalizing member is located between the second gas equalizing member and the electrode plate cover.

[0018] In this technical solution, the spray device further includes an insulating tube, a cover insulating plate, an electrode plate insulating plate and an electrode plate cover plate; an injection channel for conveying vapor deposition process gas is formed in the insulating tube, which can play a role in safety protection and reducing non-working current loss, further improving the efficiency of deposition and reducing the energy consumption required for deposition; through the arrangement of the electrode plate cover plate, the electrode plate cover plate is connected to the power supply to transfer current to the electrode plate, so that an electric field can be formed between the electrode plate and the substrate, and the electric field can excite the vapor deposition process gas to deposit a film on the substrate, which is convenient for the electrode plate to be energized, making the spray device more convenient to use; through the arrangement of the cover insulating plate, the radio frequency current of the electrode plate cover plate is blocked from being transmitted to the cover body, making the spray device safer to use; through the arrangement of the electrode plate insulating plate, it is arranged on the peripheral side of the electrode plate, connected to the electrode plate and the cover insulating plate, and plays a role in insulating the peripheral side of the electrode plate. During use, the radio frequency current on the electrode plate or the electrode plate cover plate is prevented from being transmitted to the process chamber for carrying the substrate, making the spray device safer to use.

[0019] In this technical solution, the arrangement position of the first gas equalizing member is further clarified, so that the layout of the spray device is more compact and convenient for assembly and mounting.

[0020] Specifically, the cross section of the electrode plate insulating plate is L-shaped, the long side of the L-shape is connected to the cover insulating plate and the electrode plate, and the short side of the L-shape covers a portion of the electrode plate away from the cover.

[0021] Specifically, the insulating tube can be arranged in the cover body by gluing or bolting, and the thickness of the insulating tube is 5 to 20 mm.

[0022] Specifically, the insulating tube, the cover insulating plate and the electrode plate insulating plate are made of insulating materials, for example, the insulating material may be ceramic, polytetrafluoroethylene (PTFE), etc. The insulating material includes but is not limited to the above insulating materials.

[0023] In any of the above technical solutions, the spray device further includes: power supply components; a matcher, arranged on the cover; an electrode connector, arranged on the electrode plate cover; an electrode rod, one end of the electrode rod is connected to the output end of the matcher, and the other end is connected to the electrode plate cover through the electrode connector, and the current produced by the power supply components is transmitted to the electrode plate through the matcher via the electrode rod and the electrode plate cover; an electrode insulating tube, sleeved on the electrode rod; an electrode rod flow channel, opened in the electrode rod; the RF frequency range of the power supply components is 13.56MHz to 40MHz.

[0024] In this technical solution, the spray device further includes a matcher, an electrode rod and an electrode insulating tube sleeved on the electrode rod. The matcher is adapted to emit current, one end of the electrode rod is connected to the output end of the matcher, and the other end is connected to the electrode plate cover through an electrode connector. The output end of the matcher is connected to the electrode rod, so that the current generated by the matcher is conducted to the electrode plate cover through the electrode rod, and the current is further conducted to the electrode plate through the electrode plate cover, so that an electric field can be formed between the electrode plate and the substrate, and the gas phase deposition process gas is provided to deposit a coating on the substrate. The electrode insulating tube is sleeved on the electrode rod to play a role in safety protection and reducing the non-working loss of current. The electrode insulating tube is made of insulating materials, such as ceramics, PTFE, etc. The insulating material includes but is not limited to the above insulating materials; by opening an electrode rod flow channel in the electrode rod, cooling water can be passed to cool the electrode rod, which is beneficial to improving the performance of the electrode rod, and at the same time, the electrode rod flow channel is opened in the electrode rod to improve the sealing of the electrode rod.

[0025] In any of the above technical solutions, the spray device further includes: a hanging assembly, one end of which is connected to the cover body through the electrode plate cover plate and the cover body insulating plate, and the other end of which is connected to the electrode plate.

[0026] In this technical solution, the electrode plate is connected to the cover body through a lifting assembly. The setting of the lifting assembly makes the force on the electrode plate more uniform. The setting of the lifting assembly can better withstand the electrode plate's own gravity and prevent the electrode plate from being deformed due to its own gravity. The uniformity of the coating can be improved, while extending the service life of the spray device and reducing the frequency of repair and maintenance.

[0027] In any of the above technical solutions, further, the hanging assembly includes: a hanging block pad, which is arranged on the side of the electrode plate close to the cover body; a hanging block, one end of which is connected to the electrode plate cover plate, and the other end passes through the hanging block pad and is connected to the electrode plate.

[0028] In this technical solution, the structure of a hanging assembly is further provided. The hanging assembly includes a hanging block pad arranged on the electrode plate and a hanging block connected to the electrode plate at one end and to the electrode plate cover at the other end. When in use, one end of the hanging block is fixed to the cover body and the other end is fixed to the electrode plate by screws. At the same time, the fixing screws can pass through the fixing block pad and be screwed on the hanging block. The hanging block is fixed by multiple points, so that the fixing of the hanging block is more stable and reliable, which prevents the electrode plate from being separated from the hanging assembly and causing damage to the electrode plate, further prolonging the service life of the spray device and reducing the frequency of repair and maintenance.

[0029] In any of the above technical solutions, further, the electrode plate includes: a plate body, the plate body includes a first plane and a second plane arranged opposite to each other, the setting direction of the first plane of the plate body is toward the cover body, and the plate body is divided into an injection distribution area; an injection part, which is arranged on the plate body and located in the injection distribution area; a plurality of first shrinkage holes, and the plurality of first shrinkage holes are distributed on the peripheral side of the plate body; a reinforcement part, which is formed on the plate body.

[0030] In this technical solution, the structure of the electrode plate is further provided, and the electrode plate includes a plate body, an injection part, a first shrinkage hole and a reinforcement part arranged on the plate body. The injection part is arranged in the injection distribution area of ​​the plate body. After the vapor deposition process gas enters the gas distribution space, it passes through the electrode plate through the injection part and the first shrinkage hole; considering that vapor deposition usually needs to be carried out at a higher temperature, the electrode plate is usually in a high-temperature environment. In this technical solution, a plurality of first shrinkage holes are arranged on the peripheral side of the electrode plate. The thermal expansion of the electrode plate will first act on the first shrinkage hole. The deformation of the first shrinkage hole can avoid the deformation of the electrode plate, prevent the electrode plate from being deformed due to the high-temperature environment, improve the uniformity of the coating, and at the same time extend the service life of the spray device and reduce the frequency of repair and maintenance; through the arrangement of the reinforcement part, the deformation resistance of the electrode plate can be further improved. The reinforcement part can be one or more, and the reinforcement part is located in the injection distribution area and penetrates the injection distribution area. When there are multiple reinforcement parts, the multiple reinforcement parts are arranged crosswise.

[0031] Specifically, the first shrinkage hole is a waist-shaped hole or an elliptical hole, and the reinforcement portion is a groove or a protrusion formed on the plate body.

[0032] Specifically, there are two reinforcing parts, which are located in the injection distribution area and penetrate the injection distribution area, and the two reinforcing parts are vertically distributed; further, the electrode plate is square or rectangular, and the two reinforcing parts are respectively arranged on the diagonals of the electrode plate.

[0033] In any of the above technical solutions, further, the injection part includes: a plurality of circular holes, the plurality of circular holes are evenly distributed in the injection distribution area; and / or a plurality of air distribution grooves and a plurality of air injection grooves, one of the plurality of air distribution grooves and the plurality of air injection grooves is arranged on a first plane, and the other is arranged on a plurality of second planes, the plurality of air distribution grooves are arranged in parallel, the air distribution grooves pass through the injection distribution area, the cross-section of the air injection grooves is circular, connected to the air distribution grooves, and the groove width of the air distribution grooves is smaller than the diameter of the air injection grooves; and / or a plurality of injection holes, the plurality of injection holes are evenly distributed in the injection distribution area, each injection hole includes a straight hole portion, a diameter reducing portion and a bell-shaped groove, the straight hole portion is opened on the first plane, the bell-shaped groove is opened on the second plane, the straight hole portion is connected to the bell-shaped groove through the diameter reducing portion, the bell-shaped groove includes an opening end and a closing end, the closing end is arranged close to the straight hole portion, and the diameter of the diameter reducing portion is smaller than the diameter of the straight hole portion.

[0034] In this technical solution, the structure of the injection part is further provided. The injection part can be a plurality of circular holes. The vapor deposition process gas is transported to the space between the substrate and the electrode plate through the plurality of circular holes, which facilitates the uniform and stable transportation of the vapor deposition process gas, thereby improving the uniformity of the coating. The injection part can also include a gas distribution groove and a gas injection groove. The vapor deposition process gas is transported to the space between the substrate and the electrode plate through the gas injection groove and the gas distribution groove, which enables the vapor deposition process gas to be transported uniformly and stably, thereby improving the uniformity of the coating. The injection part can also include a plurality of injection holes. Each injection hole includes a straight hole portion, a reducing portion and a bell-shaped groove connected in sequence. The diameter of the reducing portion is smaller than that of the straight hole portion. Through the setting of the reducing portion, there is a large flow resistance for the vapor deposition process gas passing through the electrode plate, which hinders the passage of the gas and slows down the circulation speed of the vapor deposition process gas, thereby facilitating the uniform transportation of the vapor deposition process gas and thereby improving the uniformity of the coating.

[0035] Specifically, a plurality of circular holes are distributed in the injection distribution area at equal intervals, and the apertures of the plurality of circular holes are between 0.1 and 10 mm.

[0036] Specifically, the gas injection groove is located on the first plane, and the gas distribution groove is arranged on the second plane. The gas injection groove can be a straight hole groove. The hole diameter of the straight hole groove is between 0.1 and 50 mm, and the hole depth is 1 to 50 mm. The multiple gas injection grooves are equally spaced, and the path of the vapor deposition process gas in the gas distribution space to each straight hole groove is the same; the groove width of the gas distribution groove is between 0.1 and 50 mm. Since the groove width of the gas distribution groove is smaller than the diameter of the gas injection groove, each gas injection groove is connected to multiple gas distribution grooves. After the vapor deposition process gas passes through the gas injection groove, it is transported to between the electrode plate and the substrate via the multiple gas distribution grooves, which is beneficial to improving the gas outlet uniformity of the gas injection plate.

[0037] Specifically, the gas distribution groove is located on the first plane, and the gas injection groove is arranged on the second plane. The gas injection groove can be a straight hole groove with an aperture of 0.1 to 50 mm and a hole depth of 5 to 50 mm. Multiple gas injection grooves are arranged at equal intervals; the groove width of the gas distribution groove is between 0.1 and 50 mm. Since the groove width of the gas distribution groove is smaller than the diameter of the gas injection groove, each gas injection groove is connected to multiple gas distribution grooves. After the vapor deposition process gas passes through the gas distribution groove, it passes between the gas injection groove electrode plate and the substrate, which is beneficial to improve the gas intake uniformity of the gas injection plate, thereby making the gas supply after flowing through the electrode plate more uniform, further improving the uniformity of the coating.

[0038] Specifically, the diameter of the straight hole portion is 1 to 50 mm, the hole depth is 1 to 50 mm, the diameter of the variable diameter portion is 0.1 to 1 mm, the hole depth is 0.1 to 10 mm, the maximum opening diameter of the bell-shaped groove is 1 to 50 mm, the angle between the opening angle edge and the center line is 0 to 90 degrees, and the hole depth is 1 to 50 mm. At the same time, the diameter of the bell-shaped groove gradually decreases with the depth, and after it is reduced to a set value, it will no longer change until it is connected to the variable diameter portion.

[0039] In any of the above technical solutions, the spray device further includes: a plasma cleaning machine; a process gas outlet pipe, one end of which is connected to the output end of the plasma cleaning machine, and the other end is connected to the injection channel; a cooling device, which is mounted on the process gas outlet pipe.

[0040] In this technical solution, the spray device further includes a plasma cleaning machine, a process gas outlet pipe and a cooling device; the plasma cleaning machine is used to output the vapor deposition process gas, the vapor deposition process gas enters the injection channel through the process gas outlet pipe, and the cooling device installed on the process gas outlet pipe plays a cooling role.

[0041] According to a second aspect of the present invention, a process chamber is proposed, comprising: a process chamber body, a cavity with an opening formed in the process chamber body; a spray device of any of the above technical solutions, the cover of the spray device is connected to the process chamber body, and the electrode plate extends into the cavity; a transfer plate, arranged between the process chamber body and the spray device; a shielding cover, which is arranged on the process chamber body and the spray device.

[0042] In this technical solution, because the process chamber includes the spray device of the above technical solution, the process chamber has all the beneficial technical effects of the spray device.

[0043] In the process chamber provided by the present invention, during operation, a substrate is placed in the process chamber body, located on the side of the electrode plate facing away from the cover body, and a vapor deposition process gas enters the gas distribution space through an injection channel and is then transported to between the substrate and the electrode plate through the electrode plate. The electrode plate is energized to form an electric field between the electrode plate and the substrate, and the electric field can excite the vapor deposition process gas to deposit a coating on the substrate.

[0044] The process chamber provided by the present invention can reduce the difficulty of equipment manufacturing by setting the adapter plate, and can protect the spray device on the other hand to prevent the spray device from colliding with the process chamber body during installation and causing damage to the spray device; the setting of the shielding cover can shield the radio frequency radiation and reduce the content radiated to the outside of the process chamber body.

[0045] Specifically, the shielding cover is made of metal material stainless steel or aluminum, the thickness of the shielding cover is 1 to 5 mm, and it is well grounded, surrounding the process chamber body, the spray device and the adapter plate. The shielding cover is fixed to the adapter plate, the cover body and the process chamber body by screws.

[0046] Additional aspects and advantages of the present invention will become apparent from the following description or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0048] Figure 1 A schematic diagram showing the structure of a spray device according to an embodiment of the present invention is shown;

[0049] Figure 2 A schematic diagram showing the structure of a first gas equalizing member according to an embodiment of the present invention is shown;

[0050] Figure 3 A schematic diagram showing the structure of a second gas equalizing member according to an embodiment of the present invention is shown;

[0051] Figure 4 A schematic diagram showing the structure of an electrode plate according to an embodiment of the present invention is shown;

[0052] Figure 5 A schematic structural diagram of an electrode plate according to another embodiment of the present invention is shown;

[0053] Figure 6 for Figure 5 Cross-section view in the AA direction;

[0054] Figure 7 A schematic diagram showing the structure of an electrode plate according to another embodiment of the present invention is shown;

[0055] Figure 8 for Figure 7 Cross-section along the middle BB direction;

[0056] Fig. 9 A schematic diagram showing the structure of an electrode plate according to another embodiment of the present invention is shown;

[0057] Fig.10 for Fig. 9 Cross-sectional view in the mid-CC direction;

[0058] Fig.11 A schematic diagram of the installation structure of an electrode rod according to an embodiment of the present invention is shown;

[0059] Fig.12 for Fig.11 Cross-section in the middle DD direction;

[0060] Fig.13 A schematic diagram showing the installation position of a hoisting assembly according to an embodiment of the present invention is shown;

[0061] Fig.14 A schematic structural diagram of an adapter board according to an embodiment of the present invention is shown;

[0062] Fig.15 A schematic structural diagram of a process chamber according to an embodiment of the present invention is shown.

[0063] in, Figures 1 to 15 The corresponding relationship between the reference numerals and the component names is as follows:

[0064] 2 cover, 4 lifting assembly, 6 electrode plate, 8 first gas equalization part, 10 second gas equalization part, 12 insulation tube, 14 cover insulation plate, 16 electrode plate insulation plate, 18 electrode plate cover, 20 matching device, 22 electrode connector, 24 electrode rod, 26 electrode insulation tube, 28 plasma cleaning machine, 30 process gas outlet pipe, 32 cooling device, 34 process chamber body, 36 adapter plate, 38 shielding cover, 40 substrate, 42 carrier plate , 402 hanging block pad, 404 hanging block, 602 plate body, 604 first shrinkage hole, 606 reinforcement part, 608 round hole, 610 gas distribution groove, 612 gas injection groove, 614 injection hole, 6142 straight hole part, 6144 reducing part, 6146 bell-shaped groove, 802 gas distribution hole, 804 mounting hole, 1002 gas uniformity through hole, 1004 second shrinkage hole, 2402 electrode rod flow channel, 2002 matching device bottom plate. DETAILED DESCRIPTION

[0065] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0066] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0067] Refer to the following Figures 1 to 15The spraying device and the process chamber provided according to some embodiments of the present invention are described.

[0068] Embodiment 1

[0069] like Figure 1 As shown, an embodiment of the present invention provides a spray device, including: a cover body 2, an electrode plate 6 and an air distribution device.

[0070] An injection channel is provided on the cover body 2 ; an air distribution space is formed between the electrode plate 6 and the cover body 2 , and the injection channel is connected to the air distribution space; and an air distribution device is arranged in the air distribution space, between the injection channel and the electrode plate 6 .

[0071] The spray device provided by the present invention places the substrate 40 on the side of the electrode plate 6 facing away from the cover body 2 during operation, and the vapor deposition process gas is supplied to the electrode plate 6 through the injection channel and the gas distribution device, and then transported to between the substrate 40 and the electrode plate 6 through the electrode plate 6. The electrode plate 6 is energized to form an electric field between the electrode plate 6 and the substrate 40, and the electric field can excite the vapor deposition process gas to deposit a coating on the substrate 40.

[0072] The spray device provided by the present invention forms an air distribution space between the cover body 2 and the electrode plate 6. The vapor deposition process gas injected through the injection channel is buffered in the air distribution space and then deposited on the substrate 40 through the electrode plate. The formation of the air distribution space makes the gas supply after flowing through the electrode plate 6 more uniform, further improving the uniformity of the coating.

[0073] The spray device provided by the present invention disperses and evenly distributes the vapor deposition process gas by arranging the gas distribution device in the gas distribution space, so that the vapor deposition process gas is evenly supplied to the electrode plate 6, which can improve the uniformity of the coating and improve the coating effect.

[0074] Embodiment 2

[0075] like Figure 1 As shown, an embodiment of the present invention provides a spray device, including: a cover body 2, an electrode plate 6 and an air distribution device.

[0076] An injection channel is provided on the cover body 2 ; an air distribution space is formed between the electrode plate 6 and the cover body 2 , and the injection channel is connected to the air distribution space; and an air distribution device is arranged in the air distribution space, between the injection channel and the electrode plate 6 .

[0077] like Figure 1 , Figure 3 and Figure 4As shown, further, the gas distribution device includes: a first gas equalizing member 8, connected to the cover body 2, and located between the injection channel and the electrode plate 6; at least one second gas equalizing member 10, connected to the electrode plate 6, and located between the electrode plate 6 and the first gas equalizing member 8, dividing the gas distribution space into a first gas distribution space and a second gas distribution space; wherein, the second gas equalizing member 10 is provided with a gas equalizing hole, and the electrode plate 6 is provided with a gas injection hole, and the cross-sectional area of ​​the gas equalizing hole can be smaller than the cross-sectional area of ​​the gas injection hole, thereby improving the coating effect.

[0078] In this embodiment, the spray device further includes a first gas equalizing member 8 and a second gas equalizing member 10. The first gas equalizing member 8 is arranged between the injection channel and the electrode plate 6, and the second gas equalizing member 10 is arranged between the electrode plate 6 and the first gas equalizing member 8. Through the setting of the first gas equalizing member 8, it is possible to prevent the vapor deposition process gas injected through the injection channel from being directly supplied to the electrode plate 6, resulting in uneven gas supply; through the setting of the second gas equalizing member 10, the vapor deposition process gas after passing through the first gas equalizing member 8 is supplied to the second gas equalizing member 10, and then supplied to the gas injection plate after passing through the second gas equalizing member 10, which plays the role of re-distributing the gas, so that the gas supply after flowing through the electrode plate 6 is more uniform, further improving the uniformity of the coating.

[0079] Specifically, a plurality of gas distribution holes 802 are provided in the upper part of the first gas equalizing member 8, and mounting holes 804 are arranged on the peripheral side. The first gas equalizing member 8 is connected to the cover body 2 through the mounting holes 804, and a gap is left between the cover body 2. The vapor deposition process gas injected through the injection channel can flow through the gap between the cover body 2 and the first gas equalizing member 8 to the first gas distribution space between the second gas equalizing member 10 and the first gas equalizing member 8, and can also be transported to the first gas distribution space through the gas distribution holes 802 of the second gas equalizing member 10, so that the vapor deposition process gas supply is more uniform.

[0080] Specifically, the upper part of the second gas equalizing member 10 has a plurality of gas equalizing holes 1002, the aperture size of the gas equalizing holes 1002 is between 0.1 and 2 mm, and the plurality of gas equalizing holes 1002 are evenly distributed. A plurality of second shrinkage holes 1004 can be provided on the peripheral side of the second gas equalizing member 10. The second gas equalizing member 10 is provided between the first gas equalizing member 8 and the electrode plate 6. The provision of the second gas equalizing member 10 can redistribute the gas during the vapor deposition process, so that the gas supplied to the electrode plate 6 and the substrate 40 is more uniform. Furthermore, the provision of the second shrinkage holes 1004 can realize that when the second gas equalizing member 10 is heated and expanded, it can preferentially expand along the direction of the second shrinkage holes 1004, thereby preventing the second gas equalizing member 10 from being deformed or damaged due to thermal stress.

[0081] Specifically, the second gas equalizing member 10 may be a single-layer or multi-layer structure, and a multi-layer second gas equalizing member 10 may have better gas distribution uniformity.

[0082] Embodiment 3

[0083] like Figure 1 As shown, an embodiment of the present invention provides a spray device, including: a cover body 2, an electrode plate 6 and an air distribution device.

[0084] An injection channel is provided on the cover body 2 ; an air distribution space is formed between the electrode plate 6 and the cover body 2 , and the injection channel is connected to the air distribution space; and an air distribution device is arranged in the air distribution space, between the injection channel and the electrode plate 6 .

[0085] like Figure 1 , Figure 3 and Figure 4 As shown, further, the gas distribution device includes: a first gas distribution member 8, connected to the cover body 2, and located between the injection channel and the electrode plate 6; a second gas distribution member 10, connected to the electrode plate 6, and located between the electrode plate 6 and the first gas distribution member 8, dividing the gas distribution space into a first gas distribution space and a second gas distribution space.

[0086] like Figure 1 As shown, further, the spray device also includes: an insulating tube 12, which is arranged in the cover body 2, and an injection channel is formed in the insulating tube 12; a cover insulating plate 14, which is connected to the cover body 2 and is located between the electrode plate 6 and the cover body 2; an electrode plate insulating plate 16, which is connected to the cover insulating plate 14 and the electrode plate 6, and is located on the peripheral side of the electrode plate 6; an electrode plate cover 18, which is connected to the cover insulating plate 14 and the electrode plate 6, and is located between the electrode plate 6 and the cover insulating plate 14; wherein, the first gas equalizing member 8 is connected to the cover body 2 through the electrode plate cover 18 and the cover insulating plate 14, and the first gas equalizing member 8 is located between the second gas equalizing member 10 and the electrode plate cover 18.

[0087] In this embodiment, the spray device further includes an insulating tube 12, a cover insulating plate 14, an electrode plate insulating plate 16 and an electrode plate cover 18; an injection channel for conveying gas for vapor deposition process is formed in the insulating tube 12, which can play a role in safety protection and reducing non-working loss of current, further improving the efficiency of deposition coating and reducing the energy consumption required for deposition coating; through the setting of the electrode plate cover 18, the electrode plate cover 18 is connected to a power source to transfer current to the electrode plate 6, so that an electric field can be formed between the electrode plate 6 and the substrate 40, and the electric field can stimulate the vapor deposition process. The gas deposits a coating on the substrate 40, which facilitates the electrification of the electrode plate 6 and makes the spray device more convenient to use; the cover insulating plate 14 is set to block the radio frequency current of the electrode plate cover 18 from being transmitted to the cover 2, making the spray device safer to use; the electrode plate insulating plate 16 is set to be arranged on the peripheral side of the electrode plate 6, connected to the electrode plate 6 and the cover insulating plate 14, and plays the role of insulating the peripheral side of the electrode plate 6. During use, the radio frequency current on the electrode plate 6 or the electrode plate cover 18 is prevented from being transmitted to the process chamber used to support the substrate 40, making the spray device safer to use.

[0088] In this embodiment, the arrangement position of the first air equalizing member 8 is further clarified, so that the layout of the spraying device is more compact and convenient for assembly and mounting.

[0089] Specifically, the cross section of the electrode plate insulating plate 16 is L-shaped, the long side of the L-shape is connected to the cover insulating plate 14 and the electrode plate 6 , and the short side of the L-shape covers a portion of the electrode plate 6 away from the cover 2 .

[0090] Specifically, the insulating tube 12 can be set in the cover body 2 by gluing or bolting, and the thickness of the insulating tube 12 is 5 to 20 mm.

[0091] Specifically, the insulating tube 12, the cover insulating plate 14 and the electrode plate insulating plate 16 are made of insulating materials, for example, the insulating materials may be ceramics, PTFE, etc. The insulating materials include but are not limited to the above insulating materials.

[0092] like Figure 1 , Fig.11 and Fig.12 As shown, further, the spray device also includes: a matcher 20, which is arranged on the cover plate; an electrode connector 22, which is arranged on the electrode plate cover plate 18; an electrode rod 24, one end of the electrode rod 24 is connected to the output end of the matcher 20, and the other end is connected to the electrode plate cover plate 18 through the electrode connector 22, and the current generated by the matcher 20 is transmitted to the electrode plate 6 via the electrode rod 24 and the electrode plate cover plate 18; an electrode insulating tube 26, which is sleeved on the electrode rod 24; and an electrode rod flow channel 2402, which is opened in the electrode rod 24.

[0093] In this embodiment, the spray device further includes a matcher 20, an electrode rod 24, and an electrode insulating tube 26 sleeved on the electrode rod 24. The matcher 20 is adapted to emit current, one end of the electrode rod 24 is connected to the output end of the matcher 20, and the other end is connected to the electrode plate cover 18 through the electrode connector 22. The output end of the matcher 20 is connected to the electrode rod 24, so that the current generated by the matcher 20 is transmitted to the electrode plate cover 18 through the electrode rod 24, and the current is further transmitted to the electrode plate 6 through the electrode plate cover 18, so that an electric field can be formed between the electrode plate 6 and the substrate 40, and the gas phase deposition process gas is provided to deposit a coating on the substrate 40. The electrode insulating tube 26 is sleeved on the electrode rod 24 to play a role in safety protection and reducing non-working loss of current. The electrode insulating tube 26 is made of insulating material, for example, the insulating material can be ceramic, PTFE, etc. The insulating material includes but is not limited to the above-mentioned insulating materials. By opening an electrode rod flow channel 2402 in the electrode rod 24, cooling water can be passed to cool the electrode rod 24, which is beneficial to improving the performance of the electrode rod 24. At the same time, the electrode rod flow channel 2402 is opened in the electrode rod 24, which is beneficial to improving the sealing of the electrode rod 24.

[0094] Embodiment 4

[0095] like Figure 1 As shown, an embodiment of the present invention provides a spray device, including: a cover body 2, an electrode plate 6 and an air distribution device.

[0096] An injection channel is provided on the cover body 2 ; an air distribution space is formed between the electrode plate 6 and the cover body 2 , and the injection channel is connected to the air distribution space; and an air distribution device is arranged in the air distribution space, between the injection channel and the electrode plate 6 .

[0097] like Fig.13 As shown, the spray device further includes: a hanging assembly 4, one end of which is connected to the cover body 2 through the electrode plate cover 18 and the cover body insulating plate 14, and the other end is connected to the electrode plate 6.

[0098] In this embodiment, the electrode plate 6 is connected to the cover body 2 through the lifting component 4. The setting of the lifting component 4 makes the force on the electrode plate 6 more uniform. The setting of the lifting component 4 can better withstand the self-gravity of the electrode plate 6 and prevent the electrode plate 6 from being deformed due to its own gravity. The uniformity of the coating can be improved, and the service life of the spray device can be extended, while reducing the frequency of repair and maintenance.

[0099] like Fig.13 As shown, further, there are multiple hanging components 4, the electrode plate 6 is rectangular, and one end of the multiple hanging components 4 is distributed in a regular polygon with the center of the electrode plate 6.

[0100] In this embodiment, the number of hoisting components 4, the shape of the electrode plate 6, and the arrangement of the hoisting components 4 are further provided. The selection of the rectangular electrode plate 6 facilitates the production, processing and installation of the electrode plate 6 on the one hand; on the other hand, when the electrode plate 6 is hoisted by multiple hoisting components 4, the force between the multiple hoisting components 4 is uniform, which can further prevent the electrode plate 6 from being deformed; through the arrangement of multiple hoisting components 4, the self-weight of the electrode plate 6 is borne by multi-point hoisting, which can further prevent the electrode plate 6 from being deformed, improve the uniformity of the coating, and at the same time extend the service life of the spray device and reduce the frequency of repair and maintenance; through the layout of the multiple hoisting components 4 with one end of the electrode plate 6 being distributed in a regular polygonal shape with the center of the electrode plate 6, the multiple hoisting components 4 are more evenly stressed, which is beneficial to resist the self-weight of the electrode plate 6 and can further prevent the electrode plate 6 from being deformed.

[0101] Specifically, the electrode plate 6 may be in a square shape, and the plurality of hanging assemblies 4 may be divided into a plurality of groups, each group including four hanging assemblies 4 , and the hanging assemblies 4 of each group are distributed in a regular quadrilateral with the center of the electrode plate 6 .

[0102] like Figure 1As shown, further, the hanging assembly 4 includes: a hanging block pad 402, which is arranged on the side of the electrode plate 6 close to the cover body 2; a hanging block 404, one end of the hanging block 404 is connected to the electrode plate cover 18, and the other end passes through the hanging block pad 402 and is connected to the electrode plate 6.

[0103] In this embodiment, the structure of a hanging assembly 4 is further provided. The hanging assembly 4 includes a hanging block pad 402 arranged on the electrode plate 6 and a hanging block 404 connected to the electrode plate 6 at one end and to the cover body 2 at the other end. When in use, one end of the hanging block 404 is fixed to the electrode plate cover 18 and the other end is fixed to the electrode plate 6 by screws. At the same time, the fixing screws can pass through the fixing block pad and be screwed on the hanging block 404. The hanging block 404 is fixed at multiple points, so that the fixing of the hanging block 404 is more stable and reliable, which prevents the electrode plate 6 from detaching from the hanging assembly 4 and causing damage to the electrode plate 6, further prolonging the service life of the spray device and reducing the frequency of repair and maintenance.

[0104] Embodiment 5

[0105] like Figure 1 As shown, an embodiment of the present invention provides a spray device, including: a cover body 2, an electrode plate 6 and an air distribution device.

[0106] An injection channel is provided on the cover body 2 ; an air distribution space is formed between the electrode plate 6 and the cover body 2 , and the injection channel is connected to the air distribution space; and an air distribution device is arranged in the air distribution space, between the injection channel and the electrode plate 6 .

[0107] like Figures 4 to 10 As shown, further, the electrode plate 6 includes: a plate body 602, the plate body 602 includes a first plane and a second plane that are relatively arranged, the setting direction of the first plane of the plate body 602 is toward the cover body 2, and an injection distribution area is divided on the plate body 602; an injection part, which is arranged on the plate body 602 and is located in the injection distribution area; a plurality of first shrinkage holes 604, and the plurality of first shrinkage holes 604 are distributed on the peripheral side of the plate body 602; a reinforcement part 606, which is formed on the plate body 602.

[0108] In this embodiment, the structure of the electrode plate 6 is further provided. The electrode plate 6 includes a plate body 602 , an injection portion, a first shrinkage hole 604 and a reinforcement portion 606 arranged on the plate body. The injection part is arranged in the injection distribution area of ​​the plate body 602. After the vapor deposition process gas enters the gas distribution space, it passes through the electrode plate 6 through the injection part and the first shrinkage hole 604; considering that vapor deposition usually needs to be carried out at a higher temperature, the electrode plate 6 is usually in a high temperature environment. In this embodiment, multiple first shrinkage holes 604 are arranged on the surrounding side of the electrode plate 6. The thermal expansion of the electrode plate 6 will first act on the first shrinkage holes 604. The deformation of the first shrinkage holes 604 can avoid deformation of the electrode plate 6 and prevent the electrode plate 6 from being deformed due to the high temperature environment, which can improve the uniformity of the coating, extend the service life of the spray device, and reduce the frequency of repair and maintenance; through the arrangement of the reinforcement part 606, the deformation resistance of the electrode plate 6 can be further improved. The reinforcement part 606 can be one or more. The reinforcement part 606 is located in the injection distribution area and passes through the injection distribution area. When there are multiple reinforcement parts 606, multiple reinforcement parts 606 are cross-arranged.

[0109] Specifically, there are two reinforcing parts 606 located in the injection distribution area and penetrating the injection distribution area, and the two reinforcing parts 606 are vertically distributed; further, the electrode plate 6 is square or rectangular, and the two reinforcing parts 606 are respectively arranged on the diagonals of the electrode plate 6.

[0110] like Figures 4 to 10 As shown, further, the injection portion includes: a plurality of circular holes 608, the plurality of circular holes 608 are evenly distributed in the injection distribution area; and / or a plurality of gas distribution grooves 610 and a plurality of gas injection grooves 612, one of the plurality of gas distribution grooves 610 and the plurality of gas injection grooves 612 is arranged on a first plane, and the other is arranged on a plurality of second planes, the plurality of gas distribution grooves 610 are arranged in parallel, the gas distribution grooves 610 pass through the injection hole 614 distribution area, the gas injection grooves 612 have a circular cross-section, are connected to the gas distribution grooves 610, and the groove width of the gas distribution grooves 610 is smaller than the diameter of the gas injection grooves 612; And / or multiple injection holes 614, multiple injection holes 614 are evenly distributed in the injection distribution area, each injection hole 614 includes a straight hole portion 6142, a diameter-reducing portion 6144 and a bell-shaped groove 6146, the straight hole portion 6142 is opened on a first plane, the bell-shaped groove 6146 is opened on a second plane, the straight hole portion 6142 is connected to the bell-shaped groove 6146 through the diameter-reducing portion 6144, the bell-shaped groove 6146 includes an open end and a closed end, the closed end is arranged close to the straight hole portion 6142, and the diameter of the diameter-reducing portion 6144 is smaller than the diameter of the straight hole portion 6142.

[0111] In this embodiment, the structure of the injection part is further provided. The injection part can be a plurality of circular holes 608. The vapor deposition process gas is transported to the space between the substrate 40 and the electrode plate 6 through the plurality of circular holes 608, which facilitates the uniform and stable transportation of the vapor deposition process gas, thereby improving the uniformity of the coating. The injection part can also include a gas distribution groove 610 and a gas injection groove 612. The vapor deposition process gas is transported to the space between the substrate 40 and the electrode plate 6 through the gas injection groove 612 and the gas distribution groove 610, thereby making the vapor deposition process gas uniform and stable. The uniformity of the coating can be improved; the injection portion can also include a plurality of injection holes 614, each injection hole 614 includes a straight hole portion 6142, a diameter-reducing portion 6144 and a bell-shaped groove 6146 which are connected in sequence, the diameter of the diameter-reducing portion 6144 is smaller than the diameter of the straight hole portion 6142, and the arrangement of the diameter-reducing portion 6144 provides a greater flow resistance for the vapor deposition process gas passing through the electrode plate 6, thereby hindering the passage of the gas and slowing down the circulation speed of the vapor deposition process gas, making it easier for the vapor deposition process gas to be transported evenly, thereby improving the uniformity of the coating.

[0112] Specifically, the plurality of circular holes 608 are distributed in the injection distribution area at equal intervals, and the apertures of the plurality of circular holes 608 are between 0.1 and 10 mm.

[0113] Specifically, the gas injection groove 612 is located on the first plane, and the gas distribution groove 610 is arranged on the second plane. The gas injection groove 612 can be a straight hole groove. The aperture of the straight hole groove is between 0.1 and 50 mm, and the hole depth is 1 to 50 mm. Multiple gas injection grooves 612 are equally spaced, and the path of the vapor deposition process gas in the gas distribution space to each straight hole groove is the same; the groove width of the gas distribution groove 610 is between 0.1 and 50 mm. Since the groove width of the gas distribution groove 610 is smaller than the diameter of the gas injection groove 612, each gas injection groove 612 is connected to multiple gas distribution grooves 610. After the vapor deposition process gas passes through the gas injection groove 612, it is transported to between the electrode plate 6 and the substrate 40 via multiple gas distribution grooves 610, which is beneficial to improving the gas outlet uniformity of the gas injection plate.

[0114] Specifically, the gas distribution groove 610 is located on the first plane, and the gas injection groove 612 is arranged on the second plane. The gas injection groove 612 can be a straight hole groove with an aperture of 0.1 to 50 mm and a hole depth of 5 to 50 mm. Multiple gas injection grooves 612 are arranged at equal intervals; the groove width of the gas distribution groove 610 is between 0.1 and 50 mm. Since the groove width of the gas distribution groove 610 is smaller than the diameter of the gas injection groove 612, each gas injection groove 612 is connected to multiple gas distribution grooves 610. After the vapor deposition process gas passes through the gas distribution groove 610, it passes through the gas injection groove 612 between the electrode plate 6 and the substrate 40, which is beneficial to improve the uniformity of the gas intake of the gas injection plate, thereby making the gas supply after flowing through the electrode plate 6 more uniform, further improving the uniformity of the coating.

[0115] Specifically, the straight hole portion 6142 has a hole diameter of 1 to 50 mm and a hole depth of 1 to 50 mm, the diameter of the variable diameter portion 6144 has a hole diameter of 0.1 to 1 mm and a hole depth of 0.1 to 10 mm, the maximum hole diameter of the bell-shaped groove 6146 has a hole diameter of 1 to 50 mm, the angle between the opening angle edge and the center line is 0 to 90 degrees, and the hole depth is 1 to 50 mm. At the same time, the hole diameter of the bell-shaped groove 6146 gradually decreases with depth, and after being reduced to a set value, it no longer changes until it is connected to the variable diameter portion 6144.

[0116] Embodiment 6

[0117] like Figure 1 As shown, an embodiment of the present invention provides a spray device, including: a cover body 2, an electrode plate 6 and an air distribution device.

[0118] An injection channel is provided on the cover body 2 ; an air distribution space is formed between the electrode plate 6 and the cover body 2 , and the injection channel is connected to the air distribution space; and an air distribution device is arranged in the air distribution space, between the injection channel and the electrode plate 6 .

[0119] like Figure 1 As shown, further, the spray device also includes: a plasma cleaner 28; a process gas outlet pipe 30, one end of the process gas outlet pipe 30 is connected to the output end of the plasma cleaner 28, and the other end is connected to the injection channel; a cooling device 32, which is sleeved on the process gas outlet pipe 30.

[0120] In this embodiment, the spray device further includes a plasma cleaning machine 28, a process gas outlet pipe 30 and a cooling device 32; the plasma cleaning machine 28 is used to output the vapor deposition process gas, and the vapor deposition process gas enters the injection channel through the process gas outlet pipe 30, and the cooling device 32 mounted on the process gas outlet pipe 30 plays a cooling role.

[0121] Embodiment 7

[0122] like Fig.14 and Fig.15 As shown, an embodiment of the present invention provides a process chamber, including: a process chamber body 34, a cavity with an opening formed in the process chamber body 34; a spray device of any of the above embodiments, the cover body 2 of the spray device is connected to the process chamber body 34, and the electrode plate 6 extends into the cavity; a transfer plate 36, arranged between the process chamber body 34 and the spray device; a shielding cover 38, which is arranged on the process chamber body 34 and the spray device.

[0123] In this embodiment, because the process chamber includes the spray device of the above embodiment, the process chamber has all the beneficial technical effects of the spray device.

[0124] In the process chamber provided by the present invention, during operation, the substrate 40 is placed in the process chamber body 34, located on the side of the electrode plate 6 facing away from the cover body 2, and the vapor deposition process gas enters the gas distribution space through the injection channel, and is then transported to between the substrate 40 and the electrode plate 6 through the electrode plate 6. The electrode plate 6 is energized to form an electric field between the electrode plate 6 and the substrate 40, and the electric field can excite the vapor deposition process gas to deposit a coating on the substrate 40.

[0125] The process chamber provided by the present invention can reduce the difficulty of equipment manufacturing by setting the adapter plate 36, and can protect the spray device on the other hand to prevent the spray device from colliding with the process chamber body 34 during installation and causing damage to the spray device; the shielding cover 38 can be set to shield radio frequency radiation and reduce the content radiated to the outside of the process chamber body 34.

[0126] Specifically, the shielding cover 38 is made of stainless steel or aluminum, with a thickness of 1 to 5 mm, and is well grounded, and surrounds the above parts as a whole. The shielding cover is fixed to the adapter plate 36, the cover 2 and the process chamber body 34 by screws.

[0127] Embodiment 8

[0128] like Figures 1 to 15 As shown, an embodiment of the present invention provides a spray device, including: a cover body 2, a hanging assembly 4 and an electrode plate 6.

[0129] Among them, an injection channel is opened on the cover body 2; one end of the hanging component 4 is connected to the cover body 2; the other end of the hanging component 4 is connected to the electrode plate 6, and an air distribution space is formed between the electrode plate 6 and the cover body 2, and the injection channel is connected to the air distribution space.

[0130] like Figure 1 and Fig.15As shown, further, the spray device of this embodiment also includes a power matching device connected to the electrode plate 6, and the power matching device includes: a matcher 20 (Match), an electrode rod 24, an electrode connector 22 and an electrode insulating tube 26. The electrode rod 24 is located between the matcher 20 and the electrode connector 22, and plays a connecting and conductive role. The electrode connector 22 and the electrode plate cover 18 are locked by threaded connection. There is a matcher bottom plate 2002 below the matcher 20, and the matcher bottom plate 2002 connects the matcher 20 and the cover 2, and is fastened by screw connection. The electrode rod 24 passes through the cover 2 and the matching bottom plate 2002, wherein the electrode rod 24 and the matching device 20 are connected and fastened with screws, and the electrode rod 24 is directly inserted into the electrode connector 22, and the electrode rod 24 has a ring groove, and a conductive spring is installed in the ring groove. The electrode rod 24 is connected to the electrode connector 22 through the ring groove and the conductive spring, which can realize plug-in connection, and the connection is stable and has good conductivity. It can reduce the setting space of the joint and the connector, minimize the connection distance and reduce the resistance at the same time, and can more effectively realize the transmission of radio frequency current, reduce energy loss, and reduce the influence of other uncertain factors caused by the overly complex electrode feed structure. Figure 1 and Fig.15 As shown, the matcher 20 is located above the matcher bottom plate 2002, and the matcher 20 is fixed to the matcher bottom plate 2002 by screws. The matcher bottom plate 2002 is located above the cover 2, and the matcher bottom plate 2002 is fixed to the cover 2 by screws. The electrode insulation tube 26 is fixed in the cover 2 by means of thread or adhesive connection. The electrode insulation tube 26 is sleeved on the outside of the electrode rod 24 and is made of insulating materials, such as ceramics, PTFE and other insulating materials, including but not limited to the above insulating materials. The thickness of the electrode insulation tube 12 is 5 to 20 mm.

[0131] Furthermore, the spray device of the present embodiment also includes an air intake device, which includes: a plasma cleaning machine 28, a process gas outlet pipe 30 and a cooling device 32. The plasma cleaning machine 28 can be a remote plasma cleaning machine (RPS), and the plasma cleaning machine 28 is located above the process gas outlet pipe 30. The plasma cleaning machine 28 and the process gas outlet pipe 30 are locked by connecting parts. The cooling device 32 includes two semicircular cooling parts, each of which has a cooling water channel inside, and cooling water can flow. The two semicircular cooling parts are sleeved on the process gas outlet pipe 30, one of the semicircular cooling parts and the other semicircular cooling part have threaded holes, and the two semicircular cooling parts are locked by screws. At the same time, the two semicircular cooling parts tightly clamp the process gas outlet pipe 30 to ensure sufficient contact area, which is beneficial to cooling.

[0132] Furthermore, the spray device of this embodiment also includes an insulating structure, which includes: a seal, an insulating tube 12, an electrode plate insulating plate 16 and a cover insulating plate 14. Among them, the seal can be an O-ring, which is arranged between the adapter plate 36 and the cover 2, between the process gas outlet pipe 30 and the cover 2, between the insulating tube 12 and the cover, and between the insulating tube 12 and the electrode plate cover 18. The sealing method includes but is not limited to O-ring sealing. The seal is used to prevent the gas deposition process gas from escaping from the gap between the cover insulating plate 14 and the cover 2 and between the cover 2 and the electrode plate cover 18, causing waste of gas deposition process gas. The insulating tube 12 is arranged in the cover 2 and connected by means of threaded or adhesive connection. The insulating tube 12 can realize the function of air discharge. At the same time, the insulating tube 12 is made of insulating materials, such as ceramics, PTFE and other insulating materials, including but not limited to the above insulating materials, to block the RF current of the electrode plate cover 18 from being conducted to the cover body 2 and the process gas outlet pipe 30, and play a role in safety protection and reducing the non-working loss of current. The electrode plate insulating plate 16 is located on the side of the electrode plate 6 and around the lower surface of the electrode plate 6, wherein the electrode plate 6 is insulated with a convex dovetail structure, and the electrode plate 6 is provided with a concave dovetail groove. The electrode plate insulating plate 16 is installed and fixed with the concave cavity structure of the electrode plate 6 through the convex dovetail structure. The electrode plate insulating plate 16 is made of insulating materials, such as ceramics, PTFE and other insulating materials, including but not limited to the above insulating materials, to block the RF current in the electrode plate cover 18 and the electrode plate 6 from being conducted to the adapter plate 36. The cover insulating plate 14 is located between the cover body 2 and the electrode plate cover 18, and the cover insulating plate 14 is fixed above the electrode plate cover 18 by screws. The cover insulating plate 14 is made of insulating materials, such as ceramics, PTFE and other insulating materials, including but not limited to the above insulating materials, to prevent the radio frequency current in the electrode plate cover 18 from being transmitted to the rotating cover 2.

[0133] Furthermore, the spray device of this embodiment also includes a spray electrode coating process chamber: the spray electrode coating process chamber includes an adapter plate 36. The cover body 2 is connected to the adapter plate 36, the process air outlet pipe 30 and the matcher 20. The adapter plate 36 is located below the cover body 2, and an O-ring is installed between the adapter plate 36 and the cover body 2 for sealing, and they are fastened by screws. The process air outlet pipe 30 is located above the cover body 2, and the process air outlet pipe 30 is locked to the cover body 2 by connecting parts. An O-ring is installed between the process air outlet pipe 30 and the cover body 2 for sealing, and the sealing method includes but is not limited to O-ring sealing, and it is fastened by screws. Between the matcher 20 and the cover body, there is a matcher base plate 2002 below the matcher 20, which is installed to connect the matcher 20 and the cover body 2, and is fastened by screws.

[0134] Furthermore, the spray device of this embodiment also includes a second gas equalizing member 10, and the second gas equalizing member 10 is locked with the electrode plate 6 by screws, and the electrode plate cover 18 is locked with the electrode plate 6 by screws. The cover insulating plate 14 and the electrode plate cover 18 are fastened by screws or slots, and the electrode plate insulating plate 16 and the electrode plate 6 are fastened by screws or slots. The hanging block 404 passes through the second gas equalizing member 10 and the hanging block pad 402, and is fixed to the electrode plate 6 by screws.

[0135] Specifically, due to production capacity requirements and structure, the electrode plate 6 has a relatively large outer dimension, with a side length of 1000mm×1000mm to 3000mm×3000mm and a thickness of 10 to 50mm. The existing practice is to fix the electrode plate 6 to the cover body 2 on all sides, and the middle position of the electrode plate 6 is deformed downward due to gravity, and the deformation is relatively large. In the vapor deposition process, excessive deformation of the lower surface of the electrode plate 6 will affect the process. In order to resist the deformation of atmospheric pressure caused by gravity and vacuum in the chamber, the cover body 2 is manufactured to be thicker. The cover body 2 is used as the base, and the cover body 2 is fixed to the hanging block 404 by screws. The electrode plate 6 is pulled by the hanging block 404 to prevent the electrode plate 6 from being deformed beyond the tolerance, and at the same time, the screws and the cover body 2 are insulated.

[0136] Furthermore, if Figure 1 As shown, the vapor deposition process gas enters the gas distribution space through the process gas outlet pipe 30 through the insulating tube 12, wherein the first gas equalizing member 8 can prevent the gas from directly rushing into the first gas distribution space between the second gas equalizing member 10 and the electrode plate cover 18, wherein the second gas equalizing member 10 is covered with gas equalizing holes 1002, further equalizing the gas so that it enters the second gas distribution space between the second gas equalizing member 10 and the electrode plate 6 as if passing through a nozzle, and the second gas equalizing member 10 includes but is not limited to one layer, and multiple layers can be stacked according to actual needs. The vapor deposition process gas enters the process chamber chamber through the electrode plate 6 in the second gas distribution space, reacts with the substrate 40, and deposits a coating.

[0137] Furthermore, the spray device includes a power supply component. During operation, the current generated by the power supply component passes through the matcher 20, the electrode rod 24 and the electrode connector 22, and is conducted to the electrode plate cover 18. The radio frequency range of the power supply component is 13.56MHz to 40MHz, wherein the preferred radio frequency frequency is 13.56MHz, 27.12MHz or 40MHz. The electrode plate cover 18 transmits the current to the lower surface of the electrode plate 6 through the hanging block 404, the hanging block pad 402 and the periphery of the electrode plate 6, and the substrate 40 is grounded. An electric field is formed between the lower surface of the electrode plate 6 and the substrate 40, and the electric field excites the vapor deposition process gas to generate plasma, which reacts with the substrate 40 to deposit a coating.

[0138] Furthermore, if Figure 2 As shown, the first gas equalizing member 8 can block most of the gas and make it go away from the periphery, wherein the first gas equalizing member 8 is provided with a plurality of gas distribution holes 802 to transmit an appropriate amount of gas phase deposition process gas, and ensure the uniformity of the gas phase deposition process gas entering the first gas distribution space. Furthermore, the first gas equalizing member 8 is provided with mounting holes 804 on the peripheral side, through which the electrode plate cover 18 is connected and fastened.

[0139] Furthermore, if Figure 3 As shown, the second gas equalizing member 10 is covered with gas equalizing holes 1002, the aperture size of the gas equalizing holes 1002 is between 0.1 and 2 mm, and the gas equalizing holes 1002 are evenly distributed. Second shrinkage holes 1004 are arranged on the peripheral side of the second gas equalizing member 10, which can realize the expansion of the second gas equalizing member 10 along the direction of the second shrinkage holes 1004 when the second gas equalizing member 10 is heated and expanded, thereby preventing the second gas equalizing member 10 from being deformed or damaged due to thermal stress.

[0140] Furthermore, if Figure 4 As shown, the electrode plate 6 is covered with circular holes 608, and the aperture size of the circular holes 608 is between 0.1 and 10 mm. The circular holes 608. The first shrinkage holes 604 are arranged on the peripheral side of the electrode plate 6, which can realize the expansion along the direction of the first shrinkage holes 604 when the electrode plate 6 expands due to heat, so as to prevent the electrode plate 6 from being deformed or damaged due to thermal stress. Because the electrode plate 6 is closer to the heat source carrier plate 42 of the process chamber, the carrier plate 42 for carrying the substrate 40 is directly located above the heater, and at the same time, it is also closer to the plasma area, and will further heat up. Therefore, a reinforcement part 606 is further provided, and there are two reinforcement parts 606, which are distributed in a cross shape. When the electrode plate 6 expands due to heat, it can further prevent the electrode plate 6 from being deformed or damaged due to thermal stress.

[0141] Furthermore, if Figure 1 and Fig.15 As shown, an adapter plate 36 is further provided. In the existing manufacturing method, the spray device sinks the spray electrode device into the process chamber body 34, which will increase the height of the chamber and increase the difficulty of processing and manufacturing. At the same time, when the spray device is installed, it is easy to hit the side wall of the process chamber body 34, causing damage to the equipment. The adapter plate 36 can protect the spray device and prevent it from being damaged by bumps during installation. The adapter plate 36 can be manufactured by processing a whole piece of material or by splicing and welding multiple root plates. The internal opening of the adapter plate 36 is larger than the size of the electrode plate insulating plate 16, and the spacing between the adapter plate 36 and the electrode plate insulating plate 16 is 0 to 10 mm.

[0142] Furthermore, if Figure 5 and Figure 6As shown, the first surface of the electrode plate 6 facing the cover body 2 is provided with a gas injection groove 612, the aperture of the gas injection groove 612 is between 0.1 and 50 mm, the hole depth is 1 to 50 mm, the gas injection groove 612 is evenly distributed, and the distance between each gas injection groove 612 and other adjacent gas injection grooves 612 is the same. Such a structure can ensure that the gas deposition process gas in the second gas distribution space has the same path to each gas injection groove 612. The second plane on the back of the electrode plate 6 is provided with a gas distribution groove 610, the groove width of the gas distribution groove 610 is between 0.1 and 50 mm, and multiple gas distribution grooves 610 are distributed at equal intervals. In the figure, the horizontal length is along the Y direction, so that the gas can be more evenly distributed. Each gas injection groove 612 can correspond to a plurality of gas injection grooves 612 in the horizontal X direction, and each gas injection groove 612 corresponds to a plurality of gas distribution grooves 610 in the horizontal Y direction. This injection part structure is beneficial to improving the uniformity of gas outlet on the back of the injection part.

[0143] Furthermore, if Figure 7 and Figure 8 As shown, the electrode plate 6 is provided with a gas injection groove 612 on the second surface facing away from the cover body 2. The aperture of the gas injection groove 612 is between 0.1 and 50 mm, and the hole depth is 5 to 50 mm. The gas injection groove 612 is evenly distributed, and each gas injection groove 612 is at the same distance from other adjacent gas injection grooves 612. The electrode plate 6 is provided with a gas distribution groove 610 on the first surface facing the cover body 2. The width of the gas distribution groove 610 is between 0.1 and 50 mm. A plurality of gas distribution grooves 610 are evenly spaced. In the figure, the gas distribution groove 610 is horizontally arranged along the Y direction, so that the gas can be more evenly distributed. Each hole can correspond to a plurality of gas distribution grooves 610 in the horizontal X direction, and each gas distribution groove 610 corresponds to a plurality of holes in the horizontal Y direction. The hole-groove structure and the injection part structure are beneficial to improving the uniformity of the gas outlet on the reverse side of the injection part.

[0144] Furthermore, if Fig. 9 and Fig.10As shown, the electrode plate 6 includes a plurality of injection holes 614, and the plurality of injection holes 614 are evenly distributed, and the plurality of injection holes 614 are equally spaced. Such a structure can ensure that the path of the vapor deposition process gas in the second gas distribution space to each straight hole portion 6142 is the same. As shown in the CC cross-section, the injection hole 614 includes a straight hole portion 6142, a diameter-reducing portion 6144, and a bell-shaped groove 6146. The aperture of the straight hole portion 6142 is 1 to 50 mm, and the hole depth is 1 to 50 mm. The aperture of the diameter-reducing portion 6144 is 0.1 to 1 mm, and the hole depth is 0.1 to 10 mm. The maximum aperture of the bell-shaped groove 6146 is 1 to 50 mm, and the angle between the opening angle edge line and the center line is 0 to 90 degrees, and the hole depth is 1 to 50 mm. At the same time, the aperture gradually decreases with the depth, and after it is reduced to the set value, it will no longer change until it is connected to the diameter-reducing portion 6144. The structure of the electrode plate 6 has a large flow resistance to the gas because the diameter-reducing portion 6144 is a slender hole, which hinders the passage of the gas in the vapor deposition process. This will make the gas distribution space of the electrode plate 6 facing the cover plate side tend to be uniform, and similarly, the gas outlet of the electrode plate 6 away from the cover plate side will be uniform.

[0145] Furthermore, if Fig.11 As shown, the matcher 20 is located above the matcher bottom plate 2002, and the matcher 20 is fixed to the matcher bottom plate 2002 by screws. The matcher bottom plate 2002 is located above the cover body 2, and the matcher bottom plate 2002 is fixed to the cover body 2 by screws. The electrode rod 24 insulating tube 12 is fixed in the cover body 2 by means of threaded or adhesive connection. The electrode rod 24 insulating tube 12 is made of insulating material, such as ceramic, PTFE and other insulating materials, including but not limited to the above insulating materials, and the thickness of the electrode rod 24 insulating tube 12 is 5 to 20 mm. The electrode rod 24 is located between the matcher 20 and the electrode connector 22, and plays a connecting and conductive role. The electrode connector 22 and the electrode plate cover 18 are locked by threaded connection. Such a setting reduces the number of connectors and minimizes the spatial connection distance, which is beneficial to the loss of electrical energy of the conductivity of the radio frequency current. Furthermore, the electrode rod 24 has a built-in water-cooling channel. See the cross-sectional view DD. An electrode rod channel 2402 is opened in the electrode rod 24. Cooling water can pass through the electrode rod channel 2402 to cool the electrode rod 24. The water-cooling structure is beneficial to improving the performance of the electrode rod 24. The electrode rod channel 2402 is opened in the electrode rod 24 to improve the sealing of the electrode rod 24.

[0146] Furthermore, if Fig.13As shown, the hanging block 404 is located above the second gas equalizing member 10, distributed on the horizontal plane, and based on the center, it can be distributed in a square as shown in the figure along the XY direction, and the side length of the square is 10% to 60% of the length and width of the electrode plate 6. The number of hanging blocks 404 can also be set according to actual needs, and can be single or multiple, and the position is distributed in the area of ​​10% to 60% of the length and width of the electrode plate 6 according to actual needs. Confirming the number and position of the hanging blocks 404 is beneficial to resist the deformation of the electrode plate 6 by its own weight and improve the electric field uniformity of the radio frequency current on the electrode plate 6. Through model analysis, the specific number and position distribution of electrode plates 6 of different sizes and different characteristics can be calculated.

[0147] Furthermore, if Fig.15 As shown, due to the characteristics of the power supply components themselves, when powered on, radio frequency radiation will be generated, which will cause harm to the human body and interference to the equipment. The radio frequency radiation in this system is mainly generated in the matcher 20 and the electrode rod 24, electrode connector 22, electrode plate cover 18, electrode plate 6 and the parts and spaces where radio frequency current flows. The space refers to the process chamber body 34, which generates plasma due to radio frequency discharge excitation of gas deposition process gas. Radio frequency radiation can pass through the gaps where the parts in the equipment are combined and radiate to the space. Based on the above problems, a shielding cover 38 is further provided. The shielding cover 38 is made of metal material, which can be stainless steel or aluminum. The thickness of the shielding cover 38 is 1 to 5 mm. At the same time, a good grounding treatment is performed. The shielding cover 38 can play a role in shielding radio frequency radiation and reduce the content of radiation to the space. The shielding cover 38 is located outside the matcher 20, electrode rod 24, adapter plate 36, cover 2, and process chamber body 34, and surrounds the above parts as a whole. The shielding cover 38 is fixed to the adapter plate 36 by screws, the shielding cover 38 is fixed to the cover body 2 by screws, and the shielding cover 38 is fixed to the process chamber body 34 by screws.

[0148] This embodiment has the following beneficial effects:

[0149] (1) The first gas equalizing member 8, the second gas equalizing member 10 and the electrode plate 6 are arranged to ensure uniformity of the gas entering the process chamber.

[0150] (2) By improving the structure and installation method of the electrode plate 6, it is possible to avoid the electrode plate 6 being greatly deformed due to its own weight, which would affect the process.

[0151] (3) The connection structure of the electrode rod 24 is optimized, which reduces the number of connectors and minimizes the spatial connection distance, which is beneficial to the loss of electrical energy in the conductivity of the radio frequency current. The electrode rod 24 has a built-in cooling channel, which can take away the heat generated by the radio frequency current passing through the electrode rod 24, thereby increasing the service life of the electrode rod 24.

[0152] (4) By setting up the insulating tube 12, the cover insulating plate 14 and the electrode plate insulating plate 16, on the one hand, the waste of vapor deposition process gas is avoided and the effect of non-working current loss is reduced; on the other hand, the high-frequency current on the electrode plate 6 is prevented from being transmitted to the cover 2.

[0153] (5) By providing the adapter plate 36, the difficulty of manufacturing the equipment can be reduced, and at the same time, the spray device can be protected to prevent damage caused by collision during installation of the spray device.

[0154] (6) By setting up the shielding cover 38 and adopting an integral shield structure, the radio frequency radiation is effectively isolated to prevent it from radiating into space.

[0155] In the description of the present invention, the term "plurality" refers to two or more than two. Unless otherwise clearly defined, the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention. The terms "connection", "installation", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0156] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0157] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A spray device, characterized in that: include: A cover body, wherein an injection channel is provided on the cover body; An electrode plate, wherein an air distribution space is formed between the electrode plate and the cover body, and the injection channel is connected to the air distribution space; An air distribution device, arranged in the air distribution space and located between the injection channel and the electrode plate; The air distribution device comprises: A first gas equalizing member, connected to the cover body and located between the injection channel and the electrode plate; At least one second gas distribution member, connected to the electrode plate, located between the electrode plate and the first gas distribution member, dividing the gas distribution space into a first gas distribution space and a second gas distribution space; Wherein, the second gas equalizing member is provided with a gas equalizing through hole, a plurality of second shrinkage holes are provided on the peripheral side of the second gas equalizing member, and the electrode plate is provided with a gas injection through hole; The electrode plate comprises a plate body, an injection portion, a plurality of first shrinkage holes and a reinforcement portion, the plate body comprises a first plane and a second plane arranged opposite to each other, the first plane of the plate body is arranged in a direction facing the cover body, and an injection distribution area is divided on the plate body; the injection portion is arranged on the plate body and located in the injection distribution area; the plurality of first shrinkage holes are distributed on the peripheral side of the plate body; the reinforcement portion is formed on the plate body; The first shrinkage hole is a waist-shaped hole or an elliptical hole, and the reinforcement portion is a groove or a protrusion formed on the plate body; The injection part comprises: A plurality of circular holes, wherein the plurality of circular holes are evenly distributed in the injection distribution area; and / or A plurality of gas distribution grooves and a plurality of gas injection grooves, one of the plurality of gas distribution grooves and the plurality of gas injection grooves is arranged on the first plane, and the other is arranged on a plurality of the second planes, the plurality of gas distribution grooves are arranged in parallel, the gas distribution grooves pass through the injection distribution area, the gas injection grooves are circular in cross-section and connected to the gas distribution grooves, and the groove width of the gas distribution grooves is smaller than the diameter of the gas injection grooves; and / or A plurality of injection holes are uniformly distributed in the injection distribution area, each of the injection holes comprises a straight hole portion, a diameter-reducing portion and a bell-shaped groove, the straight hole portion is arranged on the first plane, the bell-shaped groove is arranged on the second plane, the straight hole portion is connected to the bell-shaped groove through the diameter-reducing portion, the bell-shaped groove comprises an open end and a closed end, the closed end is arranged close to the straight hole portion, and the diameter of the diameter-reducing portion is smaller than the diameter of the straight hole portion.

2. The spray device according to claim 1, characterized in that: Also includes: An insulating tube is disposed in the cover body, and the injection channel is formed in the insulating tube; A cover insulating plate, connected to the cover and located between the electrode plate and the cover; An electrode plate insulating plate, connected to the cover insulating plate and the electrode plate, and located on the peripheral side of the electrode plate; An electrode plate cover plate, connected to the cover insulating plate and the electrode plate, and located between the electrode plate and the cover insulating plate; The first gas equalizing member is connected to the cover body through the electrode plate cover and the cover body insulating plate, and the first gas equalizing member is located between the second gas equalizing member and the electrode plate cover.

3. The spray device according to claim 2, characterized in that: Also includes: Power supply components; A matcher, arranged on the cover plate; An electrode connector is arranged on the electrode plate cover; An electrode rod, one end of which is connected to the output end of the matching device, and the other end of which is connected to the electrode plate cover through the electrode connector, and the current generated by the power supply component is transmitted to the electrode plate through the matching device, the electrode rod and the electrode plate cover; An electrode insulating tube is sleeved on the electrode rod; An electrode rod flow channel is provided in the electrode rod; The radio frequency range of the power supply components is 13.56 MHz to 40 MHz.

4. The spray device according to claim 2, characterized in that: Also includes: A hanging assembly, one end of which is connected to the cover body through the electrode plate cover plate and the cover body insulating plate, and the other end of which is connected to the electrode plate.

5. The spray device according to claim 4, characterized in that: The hoisting assembly comprises: A hanging block pad is arranged on a side of the electrode plate close to the cover body; A hanging block, one end of which is connected to the electrode plate cover plate, and the other end of which passes through the hanging block pad and is connected to the electrode plate.

6. The spray device according to any one of claims 1 to 5, characterized in that: Also includes: Plasma cleaning machines; A process gas outlet pipe, one end of which is connected to the output end of the plasma cleaning machine, and the other end of which is connected to the injection channel; A cooling device is sleeved on the process air outlet pipe.

7. A process chamber, characterized in that: include: A process chamber body, wherein a cavity having an opening is formed in the process chamber body; The spray device according to any one of claims 1 to 6, wherein the cover of the spray device is connected to the process chamber body, and the electrode plate extends into the chamber; An adapter plate, arranged between the process chamber body and the spray device; A shielding cover is arranged on the process chamber body and the spraying device.

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