A building seismic isolation support monitoring device and method

Abstract

The present invention discloses a monitoring device and method for building seismic isolation bearings, the device comprises an X displacement detection module, a Y displacement detection module, a Z displacement detection module, a rotation angle detection module and a data processing module, the X displacement detection module comprises an X displacement sensor and an X direction reflector, the Y displacement detection module comprises a Y displacement sensor and a Y direction reflector, the Z displacement detection module comprises a Z displacement sensor and a Z direction reflector, the rotation angle detection module comprises a mounting rod, an annular scale plate and a horizontal bracket, as well as a laser transmitter and a camera; the method comprises the following steps: 1. Layout of seismic isolation bearings; 2. Selection of seismic isolation bearings; 3. Installation of monitoring device; 4. Connection between monitoring device and data processing module; 5. Data collection and transmission of monitoring device; 6. Processing of monitoring device and primary and secondary alarms. The present invention is reasonably designed to realize real-time monitoring, thereby timely making forecasts.

Description

Technical Field

[0001] The invention belongs to the technical field of building seismic isolation bearing monitoring, and in particular relates to a building seismic isolation bearing monitoring device and method. Background Art

[0002] Traditional buildings resist earthquakes by improving their structural strength, which can be achieved within a certain range by increasing the cross-sectional area of ​​components and the amount of steel used. Since traditional earthquake-resistant structures are designed to prevent structural collapse, their earthquake-resistant performance depends to a large extent on the plasticity of the structure (components). Good structural plasticity can protect the safety of people and property in buildings, but post-earthquake repair or demolition of damaged buildings will generate a large amount of construction waste, pollute the environment, and have many disadvantages.

[0003] With the development of technology, seismic isolation buildings have emerged. They use seismic isolation technology to set up seismic isolation bearings on the lower structure of the building to form a seismic isolation layer, which separates the upper structure of the building from the lower structure of the building, and makes the traditional rigid structures of the upper and lower parts "softly" connected through seismic isolation bearings. In this way, seismic energy is consumed, the transmission of seismic energy to the upper part is reduced, and the safety of the upper structure and internal personnel and equipment can be more effectively guaranteed.

[0004] However, the existing displacement detection device for the seismic isolation support is complicated to operate, inefficient, and has a single detection content. In addition, the current monitoring device requires personnel to check it regularly, which is not only a big task and high labor intensity, but also cannot meet the real-time requirements.

[0005] Therefore, there is a lack of a building seismic isolation bearing monitoring device and method with a simple structure and reasonable design, which saves time, labor, and costs little, and is convenient for obtaining the three-dimensional displacement and rotation angle of the seismic isolation bearing, realizing real-time monitoring, and thus making timely forecasts and facilitating the adoption of preventive measures. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a building seismic isolation bearing monitoring device in view of the deficiencies in the above-mentioned prior art. The device has a reasonable design and low cost, saves time and effort, and is inexpensive. It is convenient to obtain the three-dimensional displacement and rotation angle of the seismic isolation bearing, realize real-time monitoring, and thus make timely forecasts, making it convenient to take preventive measures.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is: a building seismic isolation bearing monitoring device, wherein a vibration isolation bearing is arranged between a lower structure of a building and an upper structure of the building, and the lower structure of the building includes a plurality of frame columns, characterized in that: it includes an X displacement detection module arranged on the frame column and detecting the X-direction displacement of the vibration isolation bearing, a Y displacement detection module arranged on the frame column and detecting the Y-direction displacement of the vibration isolation bearing, a Z displacement detection module arranged on the frame column and detecting the Z-direction displacement of the vibration isolation bearing, and a rotation angle detection module detecting the rotation angle of the vibration isolation bearing, and a data processing module connected to the X displacement detection module, the Y displacement detection module, the Z displacement detection module and the rotation angle detection module, the X displacement detection module includes a detection module arranged on the frame column The frame column of the present invention comprises an X-direction displacement sensor on one side thereof and an X-direction reflector arranged at the bottom of the upper structure of the building, the Y-direction displacement detection module comprises a Y-direction displacement sensor arranged on the other side of the frame column and a Y-direction reflector arranged at the bottom of the upper structure of the building, the Z-displacement detection module comprises a Z-direction displacement sensor installed on the top of the frame column and a Z-direction reflector arranged at the bottom of the upper structure of the building, the rotation angle detection module comprises a plurality of mounting rods arranged on the outer circumference of the upper connecting steel plate, an annular dial installed on the plurality of mounting rods and a horizontal bracket installed on an opposite side of the frame column, and a laser emitter and a camera installed on the horizontal bracket, the data processing module comprises a microcontroller, and the X-direction displacement sensor, the Y-direction displacement sensor, the Z-direction displacement sensor and the camera are all connected to the microcontroller.

[0008] The above-mentioned building seismic isolation bearing monitoring device is characterized in that: the laser emitted by the X-direction displacement sensor points to the maximum surface of the reflector in the X direction, and the laser emitted by the X-direction displacement sensor is parallel to the X-axis direction, the laser emitted by the Y-direction displacement sensor points to the maximum surface of the reflector in the Y direction, and the laser emitted by the Y-direction displacement sensor is parallel to the Y-axis direction, and the laser emitted by the Z-direction displacement sensor points to the maximum surface of the reflector in the Z direction, and the laser emitted by the Z-direction displacement sensor is parallel to the Z-axis direction.

[0009] The above-mentioned building seismic isolation bearing monitoring device is characterized in that: the bottom center of the lower connecting steel plate of the seismic isolation bearing is taken as the origin O, the X-axis passes through the origin O and points to the east, the Y-axis passes through the origin O and is perpendicular to the X-axis direction and points to the north, and the Z-axis passes through the origin O and is perpendicular to the XOY plane formed by the X-axis and the Y-axis and points to the upper structure of the building.

[0010] The above-mentioned building seismic isolation bearing monitoring device is characterized in that: the data processing module also includes a voice alarm module connected to the microcontroller, and the X-axis displacement sensor, Y-axis displacement sensor, and Z-axis displacement sensor are connected to the microcontroller via an RS485 communication module.

[0011] The above-mentioned building seismic isolation bearing monitoring device is characterized in that: the microcontroller performs data communication with the monitoring module through the first communication module and the second communication module, the monitoring module includes a computer and a router and a switch connected to the computer in sequence, and the second communication module is connected to the switch;

[0012] A temperature and humidity sensor is arranged on the upper structure of the building, and the temperature and humidity sensor is connected to the microcontroller.

[0013] At the same time, the present invention also discloses a seismic isolation bearing peeping monitoring method with simple steps, reasonable design, convenient implementation and good use effect, characterized in that the method comprises the following steps:

[0014] Step 1: Layout of seismic isolation bearings:

[0015] Step 101, mark each frame column in the lower structure of the building in order from south to north and from west to east to obtain the first frame column, the second frame column, ..., the i-th frame column, ..., the N-th frame column; wherein i and N are both positive integers, and 1≤i≤N, N=40;

[0016] Step 102, respectively install rubber seismic isolation bearings on the 1st frame column to the 11th frame column, the 15th frame column to the 17th frame column, the 19th frame column, the 20th frame column, the 27th frame column, the 28th frame column, the 31st frame column and the 32nd frame column, and respectively record the rubber seismic isolation bearings as the 1st rubber seismic isolation bearing, the 2nd rubber seismic isolation bearing, ..., the jth rubber seismic isolation bearing, ..., the Mth rubber seismic isolation bearing in order from small to large frame columns; wherein j and M are both positive integers, and 1≤j≤M, M=20, the top surface of each rubber seismic isolation bearing is fixedly connected to the upper structure of the building, and the bottom surface of each rubber seismic isolation bearing is fixedly connected to the frame column;

[0017] Step 103, respectively install lead rubber seismic isolation bearings on the 12th frame column to the 14th frame column, the 18th frame column, the 21st frame column to the 26th frame column, the 29th frame column, the 30th frame column, and the 33rd frame column to the 40th frame column, and respectively record the lead rubber seismic isolation bearings as the first lead rubber seismic isolation bearing, the second lead rubber seismic isolation bearing, ..., the j'th lead rubber seismic isolation bearing, ..., the M'th lead rubber seismic isolation bearing in order from small to large of the frame columns; wherein j' and M' are both positive integers, and 1≤j'≤M', M'=20, the top surface of each lead rubber seismic isolation bearing is fixedly connected to the upper structure of the building, and the bottom surface of each lead rubber seismic isolation bearing is fixedly connected to the frame column;

[0018] Step 2: Selection of seismic isolation bearings:

[0019] The 5th rubber isolation bearing, the 10th rubber isolation bearing, the 19th rubber isolation bearing and the 31st rubber isolation bearing are selected as monitoring isolation bearings, and the isolation bearings are sequentially recorded as the 1st monitoring isolation bearing, the 2nd monitoring isolation bearing, the 3rd monitoring isolation bearing and the 4th monitoring isolation bearing; any monitoring isolation bearing is recorded as the kth monitoring isolation bearing, k is a positive integer, and 1≤k≤4;

[0020] Step 3: Installation of monitoring device:

[0021] The method for installing the monitoring device at each monitoring isolation support is the same. The process of installing the monitoring device at the kth monitoring isolation support is as follows:

[0022] Step 301, the rubber seismic isolation bearing includes a seismic isolation rubber pad, an upper connecting steel plate arranged on the upper part of the seismic isolation rubber pad, and a lower connecting steel plate arranged on the bottom of the seismic isolation rubber pad; wherein the upper connecting steel plate of the kth monitoring seismic isolation bearing is fixedly connected to the upper structure of the building, and the lower connecting steel plate of the kth monitoring seismic isolation bearing is fixedly connected to the frame column;

[0023] Step 302, the center of the bottom surface of the following connected steel plate is the origin O, the X axis passes through the origin O and points to the east, the Y axis passes through the origin O and is perpendicular to the X axis and points to the north, and the Z axis passes through the origin O and is perpendicular to the XOY plane formed by the X axis and the Y axis and points to the upper structure of the building, and a rectangular coordinate system is established;

[0024] Step 303: Install an X-direction displacement sensor on one side of the frame column at the bottom of the kth monitoring isolation support, and install an X-direction reflector at the bottom of the building superstructure; wherein the laser emitted by the X-direction displacement sensor points to the largest surface of the X-direction reflector, and the laser emitted by the X-direction displacement sensor is parallel to the X-axis direction;

[0025] Step 304: Install a Y-direction displacement sensor on the other side of the frame column at the bottom of the kth monitoring isolation support, and install a Y-direction reflector at the bottom of the building superstructure; wherein the laser emitted by the Y-direction displacement sensor points to the largest surface of the Y-direction reflector, and the laser emitted by the Y-direction displacement sensor is parallel to the Y-axis direction;

[0026] Step 305: Install a Z-direction displacement sensor on the top of the frame column at the bottom of the kth monitoring isolation support, and install a Z-direction reflector at the bottom of the building superstructure; wherein the laser emitted by the Z-direction displacement sensor points to the largest surface of the Z-direction reflector, and the laser emitted by the Z-direction displacement sensor is parallel to the Z-axis direction;

[0027] Step 306, evenly distribute a plurality of mounting rods on the outer circumference of the upper connecting steel plate, and install an annular scale plate on the plurality of mounting rods; wherein the center of the annular scale plate coincides with the center point of the upper connecting steel plate;

[0028] Step 307, installing a horizontal bracket on an opposite side of the frame column at the bottom of the kth monitoring isolation support, and installing a laser transmitter and a camera on the horizontal bracket; wherein the lens of the camera faces the annular scale plate;

[0029] Step 4: Connection between monitoring device and data processing module:

[0030] Step 401, connecting the microcontroller to the RS485 communication module, and connecting the A terminal of the RS485 communication module to the A line of the RS485 bus, and connecting the B terminal of the RS485 communication module to the B line of the RS485 bus;

[0031] Step 402: record the X-direction displacement sensors in the first monitoring isolation support, ..., the kth monitoring isolation support, ..., and the fourth monitoring isolation support as the first group of X-direction displacement sensors, ..., the kth group of X-direction displacement sensors, ..., and the fourth group of X-direction displacement sensors, respectively; and connect the A output ends of the first group of X-direction displacement sensors, ..., the kth group of X-direction displacement sensors, ..., and the fourth group of X-direction displacement sensors to the A line of the RS485 bus, respectively, and connect the B output ends of the first group of X-direction displacement sensors, ..., the kth group of X-direction displacement sensors, ..., and the fourth group of X-direction displacement sensors to the B line of the RS485 bus, respectively;

[0032] Step 403, record the Y-direction displacement sensors in the 1st monitoring isolation bearing, ..., the kth monitoring isolation bearing, ..., and the 4th monitoring isolation bearing as the 1st group of Y-direction displacement sensors, ..., the kth group of Y-direction displacement sensors, ..., and the 4th group of Y-direction displacement sensors respectively; and connect the A output ends of the 1st group of Y-direction displacement sensors, ..., the kth group of Y-direction displacement sensors, ..., and the 4th group of Y-direction displacement sensors to the A line of the RS485 bus respectively, and connect the B output ends of the 1st group of Y-direction displacement sensors, ..., the kth group of Y-direction displacement sensors, ..., and the 4th group of Y-direction displacement sensors to the B line of the RS485 bus respectively;

[0033] Step 404, the Z-direction displacement sensors in the first monitoring isolation support, ..., the kth monitoring isolation support, ..., and the fourth monitoring isolation support are respectively recorded as the first group of Z-direction displacement sensors, ..., the kth group of Z-direction displacement sensors, ..., and the fourth group of Z-direction displacement sensors; and the A output ends of the first group of Z-direction displacement sensors, ..., the kth group of Z-direction displacement sensors, ..., and the fourth group of Z-direction displacement sensors are respectively connected to the A line of the RS485 bus, and the B output ends of the first group of Z-direction displacement sensors, ..., the kth group of Z-direction displacement sensors, ..., and the fourth group of Z-direction displacement sensors are respectively connected to the B line of the RS485 bus;

[0034] Step 405, record the cameras in the 1st monitoring seismic isolation support, ..., the kth monitoring seismic isolation support, ..., and the 4th monitoring seismic isolation support as the 1st camera, ..., the kth camera, ..., and the 4th camera, respectively, and connect the 1st camera, ..., the kth camera, ..., and the 4th camera to the microcontroller;

[0035] Step 5: Data collection and transmission of monitoring device:

[0036] Step 501: There are three X-direction displacement sensors in the k-th group of X-direction displacement sensors, and the three X-direction displacement sensors in the k-th group of X-direction displacement sensors are respectively recorded as a first X-direction displacement sensor in the k-th group, a second X-direction displacement sensor in the k-th group, and a third X-direction displacement sensor in the k-th group; wherein the first X-direction displacement sensor in the k-th group, the second X-direction displacement sensor in the k-th group, and the third X-direction displacement sensor in the k-th group are arranged along a side height direction of a frame column;

[0037] Step 502: Set the initial X-direction spacing between the first X-direction displacement sensor in the kth group, the second X-direction displacement sensor in the kth group, and the third X-direction displacement sensor in the kth group and the X-direction reflector to L. k,x (0); where the initial setting spacing in the X direction is L k,x The value range of (0) is 25cm~45cm;

[0038] Step 503: the number of the Y-direction displacement sensors in the k-th group of Y-direction displacement sensors is three, and the three Y-direction displacement sensors in the k-th group of Y-direction displacement sensors are respectively recorded as a first Y-direction displacement sensor in the k-th group, a second Y-direction displacement sensor in the k-th group, and a third Y-direction displacement sensor in the k-th group; wherein the first Y-direction displacement sensor in the k-th group, the second Y-direction displacement sensor in the k-th group, and the third Y-direction displacement sensor in the k-th group are arranged along the height direction of another side surface of the frame column;

[0039] The initial Y-direction spacing between the first Y-direction displacement sensor in the kth group, the second Y-direction displacement sensor in the kth group, and the third Y-direction displacement sensor in the kth group and the Y-direction reflector is set to L. k,y (0); where the initial setting spacing in the Y direction is L k,y The value range of (0) is 25cm~45cm;

[0040] Step 504: the number of the Z-direction displacement sensors in the k-th group of Z-direction displacement sensors is three, and the three Z-direction displacement sensors in the k-th group of Z-direction displacement sensors are respectively recorded as a first Z-direction displacement sensor in the k-th group, a second Z-direction displacement sensor in the k-th group, and a third Z-direction displacement sensor in the k-th group; wherein the first Z-direction displacement sensor in the k-th group, the second Z-direction displacement sensor in the k-th group, and the third Z-direction displacement sensor in the k-th group are arranged clockwise along the top of the frame column;

[0041] The initial Z-direction spacing between the first Z-direction displacement sensor in the kth group, the second Z-direction displacement sensor in the kth group, and the third Z-direction displacement sensor in the kth group and the Z-direction reflector is set to L. k,z (0); where the initial setting distance L in the Z direction k,z The value range of (0) is 23cm to 38cm;

[0042] Step 505: At the initial moment, the laser emitted by the laser transmitter irradiates the annular dial to form a positioning irradiation point. The k-th camera captures an image of the positioning irradiation point on the annular dial at the k-th monitoring isolation support, and sends the image of the positioning irradiation point on the k-th annular dial to the microcontroller. According to the image of the positioning irradiation point on the k-th annular dial, the angle scale value of the positioning irradiation point on the k-th annular dial is obtained, and recorded as the initial angle value θ of the k-th monitoring isolation support. k (0);

[0043] Step 506: During the detection process of the kth group of X-direction displacement sensors, the kth group of Y-direction displacement sensors, and the kth group of Z-direction displacement sensors, the X-direction displacement detected by the first X-direction displacement sensor in the kth group at the qth sampling moment is obtained. The X-direction displacement detected by the second X-direction displacement sensor in the k-th group at the q-th sampling moment and the X-direction displacement detected by the third X-direction displacement sensor in the k-th group at the q-th sampling moment The microcontroller uses the formula Get the X-direction displacement L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q); The microcontroller uses the formula L k,x (q,0)=|L k,x (q)-L k,x(0)|, and obtain the X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q,0); where q is a natural number;

[0044] At the same time, the Y-direction displacement detected by the first Y-direction displacement sensor in the k-th group at the q-th sampling moment is obtained. The Y-direction displacement detected by the second Y-direction displacement sensor in the k-th group at the q-th sampling moment and the Y-direction displacement detected by the third Y-direction displacement sensor in the k-th group at the q-th sampling moment The microcontroller uses the formula Get the Y-direction displacement L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q); The microcontroller uses the formula L k,y (q,0)=|L k,y (q)-L k,y (0)|, and obtain the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0);

[0045] At the same time, the Z-direction displacement detected by the first Z-direction displacement sensor in the k-th group at the q-th sampling moment is obtained. The Z-direction displacement detected by the second Z-direction displacement sensor in the k-th group at the q-th sampling moment and the Z-direction displacement detected by the third Z-direction displacement sensor in the k-th group at the q-th sampling moment The microcontroller uses the formula Get the Z-direction displacement L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q); The microcontroller uses the formula L k,z (q,0)=|L k,z (q)-L k,z (0)|, and obtain the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q,0);

[0046] Step 507: According to the method described in step 505, the image of the locating irradiation point on the kth annular scale plate at the qth sampling time is obtained, and the angle value θ of the locating irradiation point on the kth monitoring isolation support at the qth sampling time is obtained. k (q), the microcontroller uses the formula θ k (q,0)=|θ k (q)-θ k (0)|, and obtain the rotation angle θ of the kth monitoring isolation support at the qth sampling time k (q,0);

[0047] Step 6: Processing of monitoring device and primary and secondary alarms:

[0048] The X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q,0), the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0), the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q,0) and the rotation angle θ of the kth monitoring isolation bearing at the qth sampling time k (q,0) is used for judgment, and the microcontroller controls the voice alarm module to issue a first-level alarm reminder or a second-level alarm reminder.

[0049] The above method is characterized in that: a microcontroller is used to compensate the displacement between step 5 and step 6, and the specific process is as follows:

[0050] Step A: Using a microcontroller to calculate the X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x The process of compensation for (q,0) is as follows:

[0051] Step A1: the mean errors of the first X-direction displacement sensor in the k-th group, the second X-direction displacement sensor in the k-th group, the third X-direction displacement sensor in the k-th group, the first Y-direction displacement sensor in the k-th group, the second Y-direction displacement sensor in the k-th group, the third Y-direction displacement sensor in the k-th group, the first Z-direction displacement sensor in the k-th group, the second Z-direction displacement sensor in the k-th group, and the third Z-direction displacement sensor in the k-th group are all the same, and the mean errors of the displacement sensors are obtained as follows:

[0052] Step A11, projecting the laser beam of the X-axis displacement sensor onto the reference reflector, sending the detected distance between the X-axis displacement sensor and the reference reflector to the microcontroller, and recording the a-th distance measurement value measured by the X-axis displacement sensor as L(a);

[0053] Step A12, then manually measure the distance between the X-axis displacement sensor and the reference reflector to obtain the true value of the distance and record it as Z1;

[0054] Step A13: According to the formula Get the mean error m of the displacement sensor w ; Wherein, N′ represents the total number of measurements, a and N′ are both positive integers, and the value range of a is 1 to N′, and the value of N′ is 100 to 200;

[0055] Step A2: The microcontroller uses the formula Get the X-direction displacement compensation value L′ detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q); The microcontroller uses the formula L′ k,x (q,0)=|L′ k,x (q)-L k,x (0)|, and obtain the compensation value L′ of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q,0);

[0056] Step B: According to the method described in step A, a microcontroller is used to calculate the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment. k,y (q,0) is compensated, and the microcontroller uses the formula Get the Y-direction displacement compensation value L′ detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q); The microcontroller uses the formula L′ k,y (q,0)=|L′ k,y (q)-L k,y (0)|, and obtain the Y-direction displacement change compensation value L′ detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0);

[0057] Step C: According to the method described in step A, a microcontroller is used to calculate the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment. k,z (q,0) is compensated, and the microcontroller uses the formula Get the Z-direction displacement compensation value L′ detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q); The microcontroller uses the formula L′ k,z (q,0)=|L′ k,z (q)-L k,z (0)|, and obtain the Z-direction displacement change compensation value L′ detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q,0).

[0058] The above method is characterized in that: the processing of the monitoring device in step 6 and the first-level alarm and the second-level alarm are specifically performed as follows:

[0059] Step 601, the microcontroller uses the formula

[0060] The X-direction displacement change rate ΔL of the k-th monitoring isolation support at the q+1-th sampling time is obtained k,x (q+1); where the time T ranges from 8h to 12h; where L′ k,x(q+1,0) represents the compensation value of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q+1-th sampling moment, L′ k,x (q+2,0) represents the compensation value of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q+2-th sampling moment, L′ k,x (q+3,0) represents the compensation value of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q+3-th sampling moment;

[0061] The microcontroller uses the formula The Y-direction displacement change rate ΔL of the k-th monitoring isolation support at the q+1-th sampling time is obtained k,y (q+1); where L′ k,y (q+1,0) represents the compensation value of the Y-direction displacement change detected by the k-th group of Y-direction displacement sensors at the q+1-th sampling moment, L′ k,y (q+2,0) represents the compensation value of the Y-direction displacement change detected by the k-th group of Y-direction displacement sensors at the q+2-th sampling moment, L′ k,y (q+3,0) represents the compensation value of the Y-direction displacement change detected by the k-th group of Y-direction displacement sensors at the q+3-th sampling moment;

[0062] The microcontroller uses the formula The Z-direction displacement change rate ΔL of the k-th monitoring isolation support at the q+1-th sampling time is obtained k,z (q+1); where L′ k,z (q+1,0) represents the compensation value of the Z-direction displacement change detected by the k-th group of Z-direction displacement sensors at the q+1-th sampling moment, L′ k,z (q+2,0) represents the compensation value of the Z-direction displacement change detected by the k-th group of Z-direction displacement sensors at the q+2-th sampling moment, L′ k,z (q+3,0) represents the compensation value of the Z-direction displacement change detected by the k-th group of Z-direction displacement sensors at the q+3-th sampling moment;

[0063] The microcontroller uses the formula Get the rotation angle change rate Δθ of the kth monitoring isolation support at the q+1th sampling time k (q+1); where θ k (q+1,0) represents the rotation angle of the kth monitoring isolation support at the q+1th sampling time, θ k (q+2,0) represents the rotation angle of the kth monitoring isolation support at the q+2th sampling time, θ k (q+3,0) represents the rotation angle of the kth monitoring isolation bearing at the q+3th sampling time;

[0064] Step 602: The microcontroller arranges the X-direction displacement variation compensation value of the first group of X-direction displacement sensors at the qth sampling moment, the X-direction displacement variation compensation value of the second group of X-direction displacement sensors at the qth sampling moment, the X-direction displacement variation compensation value of the third group of X-direction displacement sensors at the qth sampling moment, and the X-direction displacement variation compensation value of the fourth group of X-direction displacement sensors at the qth sampling moment in ascending order to obtain the maximum value of the X-direction displacement variation at the qth sampling moment. The microcontroller arranges the Y-direction displacement change compensation value of the first group of Y-direction displacement sensors at the qth sampling moment, the Y-direction displacement change compensation value of the second group of Y-direction displacement sensors at the qth sampling moment, the Y-direction displacement change compensation value of the third group of Y-direction displacement sensors at the qth sampling moment, and the Y-direction displacement change compensation value of the fourth group of Y-direction displacement sensors at the qth sampling moment in order from small to large, and obtains the maximum value of the Y-direction displacement change at the qth sampling moment. The microcontroller arranges the Z-direction displacement change compensation value of the first group of Z-direction displacement sensors at the qth sampling moment, the Z-direction displacement change compensation value of the second group of Z-direction displacement sensors at the qth sampling moment, the Z-direction displacement change compensation value of the third group of Z-direction displacement sensors at the qth sampling moment, and the Z-direction displacement change compensation value of the fourth group of Z-direction displacement sensors at the qth sampling moment in order from small to large, and obtains the maximum value of the Z-direction displacement change at the qth sampling moment. The microcontroller arranges the rotation angle of the first monitoring isolation support at the qth sampling moment, the rotation angle of the second monitoring isolation support at the qth sampling moment, the rotation angle of the third monitoring isolation support at the qth sampling moment, and the rotation angle of the fourth monitoring isolation support at the qth sampling moment in order from small to large, and obtains the maximum rotation angle θ of the monitoring isolation support at the qth sampling moment max (q);

[0065] Step 603: The microcontroller converts the X-direction displacement variation compensation value L′ detected by the k-th group of X-direction displacement sensors at the q+1-th sampling moment into k,x (q+1,0) and the maximum value of the displacement change in the X direction at the qth sampling moment The maximum value of the second level warning in the X direction The Y-direction displacement change compensation value L′ detected by the k-th group of Y-direction displacement sensors at the q+1th sampling moment is compared. k,y (q+1,0) and the maximum value of the Y-direction displacement change at the qth sampling moment The maximum value of the second level warning in the Y direction Compare the Y-direction displacement change compensation value L′ detected by the k-th group of Z-direction displacement sensors at the q+1-th sampling moment k,z(q+1,0) and the maximum value of the Z-direction displacement change at the qth sampling moment The maximum value of the second level warning in the Z direction For comparison, the rotation angle θ of the kth monitoring isolation support at the qth sampling moment is k (q,0) and the maximum rotation angle θ of the isolation bearing monitored at the qth sampling moment max (q) and the maximum value of the second-level warning of the rotation angle θ 2 (max) for comparison:

[0066] when And ΔL k,x (q+1)>L x (s), the microcontroller controls the voice alarm module to issue a first-level alarm; where L x (s) represents the change rate threshold of displacement in the X direction;

[0067] when And ΔL k,y (q+1)>L y (s), the microcontroller controls the voice alarm module to issue a first-level alarm; where L y (s) represents the change rate threshold of the displacement in the Y direction;

[0068] when And ΔL k,z (q+1)>L z (s), the microcontroller controls the voice alarm module to issue a first-level alarm; where L z (s) represents the threshold value of the rate of change of displacement in the Z direction;

[0069] When θ 2 (max)>θ k (q+1,0)≥θ max (q) and Δθ k When (q+1)>Δθ(s), the microcontroller controls the voice alarm module to issue a first-level alarm; wherein Δθ(s) represents the change rate threshold of the rotation angle of the monitoring isolation support;

[0070] when And ΔL k,x (q+1)>L x (s), the microcontroller controls the voice alarm module to give a secondary alarm;

[0071] when And ΔL k,y (q+1)>L y (s), the microcontroller controls the voice alarm module to give a secondary alarm;

[0072] when And ΔLk,z (q+1)>L z (s), the microcontroller controls the voice alarm module to give a secondary alarm;

[0073] When θ k (q+1,0)>θ 2 (max) and Δθ k When (q+1)>Δθ(s), the microcontroller controls the voice alarm module to perform a secondary alarm.

[0074] The above method is characterized in that: the change rate threshold L of the X-direction displacement x The value range of (s) is 0.01 to 0.1, and the change rate threshold of the Y-direction displacement L y The value range of (s) is 0.01 to 0.1, and the change rate threshold of the Z-direction displacement L z The value range of (s) is 0.01 to 0.1, and the value range of the change rate threshold Δθ(s) of the rotation angle of the monitoring isolation support is 0.1 to 1;

[0075] Set the diameter of the seismic isolation rubber pad to R z , set the thickness of the seismic isolation rubber pad to H z , when 0.55R z More than 3H z When the maximum value of the second-level warning in the X direction is Maximum value of the second level warning in the Y direction Take 3H z ×80%;

[0076] When 0.55R z Less than 3 hours z When the maximum value of the second-level warning in the X direction is Maximum value of the second level warning in the Y direction Take 0.55R z ×80%;

[0077] When 0.55R z Equal to 3H z When the maximum value of the second-level warning in the X direction is Maximum value of the second level warning in the Y direction Take 0.55R z ×80% or 3H z ×80%;

[0078] Maximum value of the second-level warning in the Z direction The value range is: 4mm~4.5mm;

[0079] Maximum value of rotation angle secondary warning θ 2 The value range of (max) is 1°~2°.

[0080] Compared with the prior art, the present invention has the following advantages:

[0081] 1. Simple structure, reasonable design and easy installation.

[0082] 2. The monitoring isolation bearing used is provided with an X-direction displacement sensor and an X-direction reflector to detect the displacement change in the X direction, a Y-direction displacement sensor and a Y-direction reflector to detect the displacement change in the Y direction, and a Z-direction displacement sensor and a Z-direction reflector to detect the displacement change in the Z direction, thereby realizing real-time monitoring of the three-dimensional displacement of the isolation bearing and effectively adapting to long-term real-time detection.

[0083] 3. A laser transmitter, an annular dial and a camera are provided in the monitoring seismic isolation bearing. The laser emitted by the laser transmitter irradiates the annular dial to form a positioning irradiation point. The camera captures an image of the positioning irradiation point on the annular dial at the monitoring seismic isolation bearing. The rotation angle of the monitoring seismic isolation bearing is obtained by measuring the position change of the positioning irradiation point in the images of the positioning irradiation point on the annular dial twice.

[0084] 4. The seismic isolation bearing peek monitoring method of the present invention has simple steps, is easy to implement and simple to operate. First, the seismic isolation bearings are arranged, and then the seismic isolation bearings are selected to obtain monitoring seismic isolation bearings, and then X-axis displacement sensors, Y-axis displacement sensors, Z-axis displacement sensors and rotation angle measurement modules are installed at each monitoring seismic isolation bearing; secondly, the X-axis displacement sensor, Y-axis displacement sensor, Z-axis displacement sensor and rotation angle measurement module are connected to the data processing module; thereafter, the data detected by the X-axis displacement sensor, Y-axis displacement sensor, Z-axis displacement sensor and rotation angle measurement module are sent to the microcontroller, and finally, the microcontroller judges the displacement change in the X direction, the displacement change in the Y direction and the displacement change in the Z direction, and the microcontroller controls the voice alarm module to issue a first-level alarm reminder or a second-level alarm reminder, so as to facilitate the adoption of preventive measures.

[0085] 5. The present invention adopts X-direction displacement sensor, Y-direction displacement sensor and Z-direction displacement sensor to measure the displacement change in the X direction and the displacement change in the Y direction in a non-contact method, which is easy to install.

[0086] 6. When monitoring the vibration-damping support, the present invention not only considers the displacement change in the X direction and the displacement change in the Y direction, but also considers the displacement change in the Z direction and the rotation angle, thereby increasing the parameter measurement range.

[0087] In summary, the present invention is reasonably designed and low-cost, saves time, effort, and is inexpensive. It is easy to obtain the three-dimensional displacement and rotation angle of the seismic isolation bearing, realize real-time monitoring, and thus make timely forecasts, making it easy to take preventive measures.

[0088] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0089] Figure 1 It is a structural schematic diagram of the building seismic isolation bearing monitoring device of the present invention.

[0090] Figure 2 The present invention is a circuit principle block diagram of the building seismic isolation support monitoring device.

[0091] Figure 3 It is a schematic diagram of the position of the annular dial of the building seismic isolation bearing monitoring device of the present invention.

[0092] Figure 4 The present invention is a circuit diagram of the temperature and humidity sensor of the building seismic isolation support monitoring device.

[0093] Figure 5 The present invention is a circuit schematic diagram of the voice alarm module of the building seismic isolation support monitoring device.

[0094] Figure 6 This is a circuit schematic diagram of the RS485 communication module of the building seismic isolation support monitoring device of the present invention.

[0095] Figure 7 The schematic diagram of the circuit of the RJ45 communication module of the building seismic isolation support monitoring device of the present invention.

[0096] Figure 8 It is a schematic diagram of the layout of the seismic isolation bearings of the building seismic isolation bearing monitoring method of the present invention.

[0097] Fig. 9 It is a flowchart of the building seismic isolation bearing monitoring method of the present invention.

[0098] Description of reference numerals:

[0099] 1—Rubber seismic isolation bearing; 1-1—Upper connecting steel plate; 1-2—Lower connecting steel plate;

[0100] 1-3—seismic isolation rubber pad; 2—lead rubber seismic isolation bearing; 3—frame column;

[0101] 4—building superstructure; 5-1—X-direction reflector; 5-2—X-direction displacement sensor;

[0102] 6-1—Y direction reflector; 6-2—Y direction displacement sensor; 7—Z direction displacement sensor;

[0103] 7-1—Z direction reflector; 8—ring scale plate; 8-1—mounting rod;

[0104] 9—camera; 9-1—horizontal bracket; 9-2—laser transmitter;

[0105] 10—microcontroller; 11—RS485 communication module; 12—first communication module;

[0106] 13—second communication module; 14—switch; 15—router;

[0107] 16—computer; 17—temperature and humidity sensor; 18—voice alarm module;

[0108] 101—the first monitoring isolation bearing; 102—the second monitoring isolation bearing;

[0109] 103—the third monitoring isolation bearing; 104—the fourth monitoring isolation bearing. DETAILED DESCRIPTION

[0110] like Figures 1 to 3 The device for monitoring a seismic isolation support of a building shown in the figure comprises a vibration isolation support arranged between a lower structure of a building and an upper structure 4 of the building, wherein the lower structure of the building comprises a plurality of frame columns 3, and is characterized in that: the device comprises an X displacement detection module arranged on the frame column 3 and detecting the X-direction displacement of the vibration isolation support, a Y displacement detection module arranged on the frame column 3 and detecting the Y-direction displacement of the vibration isolation support, a Z displacement detection module arranged on the frame column 3 and detecting the Z-direction displacement of the vibration isolation support, and a rotation angle detection module detecting the rotation angle of the vibration isolation support, and a data processing module connected to the X displacement detection module, the Y displacement detection module, the Z displacement detection module and the rotation angle detection module, wherein the X displacement detection module comprises an X-direction displacement sensor 5-2 arranged on one side of the frame column 3 and an X-direction displacement sensor 5-2 arranged at the bottom of the upper structure 4 of the building The Y-direction displacement detection module comprises a Y-direction displacement sensor 6-2 arranged on the other side of the frame column 3 and a Y-direction reflector 6-1 arranged at the bottom of the building superstructure 4, the Z-direction displacement detection module comprises a Z-direction displacement sensor 7 installed on the top of the frame column 3 and a Z-direction reflector 7-1 arranged at the bottom of the building superstructure 4, the rotation angle detection module comprises a plurality of mounting rods 8-1 arranged on the outer circumference of the upper connecting steel plate 1-1, an annular dial 8 installed on the plurality of mounting rods 8-1 and a horizontal bracket 9-1 installed on an opposite side of the frame column 3, and a laser emitter 9-2 and a camera 9 installed on the horizontal bracket 9-1, the data processing module comprises a microcontroller 10, and the X-direction displacement sensor 5-2, the Y-direction displacement sensor 6-2, the Z-direction displacement sensor 7 and the camera 9 are all connected to the microcontroller 10.

[0111] In this embodiment, the laser emitted by the X-direction displacement sensor 5-2 points to the maximum surface of the X-direction reflector 5-1, and the laser emitted by the X-direction displacement sensor 5-2 is parallel to the X-axis direction, the laser emitted by the Y-direction displacement sensor 6-2 points to the maximum surface of the Y-direction reflector 6-1, and the laser emitted by the Y-direction displacement sensor 6-2 is parallel to the Y-axis direction, and the laser emitted by the Z-direction displacement sensor 7 points to the maximum surface of the Z-direction reflector 7-1, and the laser emitted by the Z-direction displacement sensor 7 is parallel to the Z-axis direction.

[0112] In this embodiment, the bottom center of the lower connecting steel plate of the seismic isolation bearing is taken as the origin O, the X-axis passes through the origin O and points to the east, the Y-axis passes through the origin O and is perpendicular to the X-axis and points to the north, and the Z-axis passes through the origin O and is perpendicular to the XOY plane formed by the X-axis and the Y-axis and points to the upper structure 4 of the building.

[0113] In this embodiment, the data processing module further includes a voice alarm module 18 connected to the microcontroller 10 , and the X-direction displacement sensor 5 - 2 , the Y-direction displacement sensor 6 - 2 , and the Z-direction displacement sensor 7 are connected to the microcontroller 10 via an RS485 communication module 11 .

[0114] In this embodiment, the microcontroller 10 performs data communication with the monitoring module through the first communication module 12 and the second communication module 13. The monitoring module includes a computer 16 and a router 15 and a switch 14 connected to the computer 16 in sequence. The second communication module 13 is connected to the switch 14.

[0115] The building superstructure 4 is provided with a temperature and humidity sensor 17 , and the temperature and humidity sensor 17 is connected to the microcontroller 10 .

[0116] In this embodiment, the microcontroller 10 may be a STM32F103ZET6 microcontroller.

[0117] like Figure 4 As shown, in this embodiment, the temperature and humidity sensor 17 is an AM2301 temperature and humidity sensor, the VDD pin of the AM2301 temperature and humidity sensor is connected to the 5V power supply output terminal, the SDA pin of the AM2301 temperature and humidity sensor is divided into two paths, one path is connected to the 5V power supply output terminal through the resistor R1, and the other path is connected to the PA14 pin of the microcontroller 10, the GND pin of the AM2301 temperature and humidity sensor is grounded, and the NC pin of the AM2301 temperature and humidity sensor is suspended.

[0118] In this embodiment, the temperature and humidity sensor 17 detects the temperature and humidity of the environment in which the rubber seismic isolation bearing 1 is located, and sends the detected temperature and humidity to the microcontroller 10. The microcontroller 10 compares the temperature and humidity values ​​with the required temperature and humidity values. When the temperature and humidity values ​​are greater than the required temperature and humidity values, the microcontroller 10 controls the voice alarm module 18 to sound an alarm.

[0119] like Figure 5 As shown, in this embodiment, the voice alarm module 18 includes a chip XFS4243CE, a chip TPA2005D1 and a speaker SPK1. The 1st, 3rd and 5th pins of the chip XFS4243CE are all grounded, the 2nd pin of the chip XFS4243CE is connected to the 3.3V power supply output terminal, the 10th pin of the chip XFS4243CE is connected to the PC11 pin of the microcontroller 10, the 8th pin of the chip XFS4243CE is connected to the PC10 pin of the microcontroller 10, the 4th pin of the chip XFS4243CE is connected to one end of the resistor R28, the 6th pin of the chip XFS4243CE is grounded, and the 1st and 6th pins of the chip TPA2005D1 are connected to the ground. The pin is connected to the 3.3V power supply output end, the 3rd pin of the chip TPA2005D1 is connected to the other end of the resistor R28 via the capacitor C22, the 4th pin of the chip TPA2005D1 is connected to one end of the resistor R29 via the capacitor C23, the other end of the resistor R29 is grounded, the 7th pin of the chip TPA2005D1 is grounded, the 5th pin of the chip TPA2005D1 is divided into two paths, one path is connected to one end of the capacitor C26, the other path is connected to one end of the resistor R30, and the third path is connected to one end of the speaker SPK1; the 8th pin of the chip TPA2005D1 is divided into two paths, one path is connected to the other end of the capacitor C26, the other path is connected to the other end of the resistor R30, and the third path is connected to the other end of the speaker SPK1.

[0120] like Figure 6As shown, in this embodiment, the RS485 communication module 11 includes a chip MAX1487, the first pin of the chip MAX1487 is connected to the PD1 pin of the microcontroller 10, the connecting end of the second pin and the third pin of the chip MAX1487 is connected to the PD2 pin of the microcontroller 10, the fourth pin of the chip MAX1487 is connected to the PD3 pin of the microcontroller 10, the fifth pin of the chip MAX1487 is grounded, and the sixth pin of the chip MAX1487 is grounded. Three paths, one path is connected to the 5V power supply output end through the resistor R5, another path is connected to one end of the resistor R3, and the third path is connected to the anode of the voltage regulator D1; the 7th pin of the chip MAX1487 is divided into three paths, one path is connected to the ground through the resistor R2, another path is connected to one end of the resistor R4, and the third path is connected to the anode of the voltage regulator D2; the cathode of the voltage regulator D1 and the cathode of the voltage regulator D2 are both grounded, the other end of the resistor R3 is connected to the A line of the RS485 bus, and the other end of the resistor R4 is connected to the B line of the RS485 bus.

[0121] In this embodiment, the RS485 communication module 11 is provided to facilitate the X-axis displacement sensor 5-2, the Y-axis displacement sensor 6-2, and the Z-axis displacement sensor 7 to communicate data with the microcontroller 10 via the RS485 bus, thereby realizing the parallel connection of multiple sensors, with a long transmission distance and low interference.

[0122] In this embodiment, the X-axis displacement sensor 5 - 2 , the Y-axis displacement sensor 6 - 2 and the Z-axis displacement sensor 7 may refer to the laser distance measuring sensor with RS485 output.

[0123] In this embodiment, during the actual connection process, the A terminals of the X-axis displacement sensor 5-2, the Y-axis displacement sensor 6-2 and the Z-axis displacement sensor 7 are connected to the A line of the RS485 bus, and the B terminals of the X-axis displacement sensor 5-2, the Y-axis displacement sensor 6-2 and the Z-axis displacement sensor 7 are connected to the B line of the RS485 bus.

[0124] In this embodiment, the camera 9 can refer to the OV7670 camera.

[0125] In this embodiment, the laser emitter 9 - 2 can refer to the cross-line laser emitter of the drilling laser.

[0126] In this embodiment, the first communication module 12 may refer to the TL-FC311A-3 optical fiber transceiver, and the second communication module 13 may refer to the TL-FC311B-3 optical fiber transceiver.

[0127] like Figure 7As shown, in this embodiment, during the actual connection process, the microcontroller 10 is connected to an RJ45 interface module for connecting the first communication module 12, and the RJ45 interface module includes a chip RTL8015AS, a chip 20F001N and an RJ45 interface. The SA0 pin to the SA4 pin of the RTL8015AS are respectively connected to the PA0-PA4 pins of the microcontroller 10, the SA5 pin to the SA7 pin of the RTL8015AS and the SA10 pin to the SA19 pin of the RTL8015AS are grounded, and the SA8 pin to the SA9 pin of the RTL8015AS are grounded. The A9 pin is connected to the 5V power supply output terminal, the SD0 pin-SD7 pin of the RTL8015AS is connected to the PC0-PC7 pin of the microcontroller 10 respectively, the RSTDRV pin, IOWB pin and IORB pin of the RTL8015AS are connected to the PC8, PC9 and PC12 pins of the microcontroller 10 respectively, the SMEMWB pin, SMEMRB pin and JP pin of the RTL8015AS are connected to the 5V power supply output terminal, the IOCS16B pin of the RTL8015AS is grounded via a resistor R35, and the The AEN pin is grounded, the TPOUT+ pin of the RTL8015AS is divided into two paths, one is grounded through the capacitor C37, and the other is connected to the TD+ pin of the chip 20F001N through the resistor R34; the TPOUT- pin of the RTL8015AS is divided into two paths, one is grounded through the capacitor C36, and the other is connected to the TD- pin of the chip 20F001N through the resistor R33; the TPIN+ pin of the RTL8015AS is divided into two paths, one is connected to one end of the resistor R32, and the other is connected to the RD+ pin of the chip 20F001N; the TPOUT- pin of the RTL8015AS is divided into two paths, one is connected to the ground through the capacitor C36, and the other is connected to the TD- pin of the chip 20F001N through the resistor R33; the TPIN+ pin of the RTL8015AS is divided into two paths, one is connected to one end of the resistor R32, and the other is connected to the RD+ pin of the chip 20F001N; The IN- pin is divided into two paths, one path is connected to one end of the resistor R31, and the other path is connected to the RD- pin of the chip 20F001N; the other end of the resistor R32 and the other end of the resistor R31 are grounded via the capacitor C35; the TX+ pin of the chip 20F001N is connected to the TX+ pin of the RJ45 interface, the TX- pin of the chip 20F001N is connected to the TX- pin of the RJ45 interface, the RX+ pin of the chip 20F001N is connected to the RX+ pin of the RJ45 interface, and the RX- pin of the chip 20F001N is connected to the RX- pin of the RJ45 interface.

[0128] In this embodiment, during the actual connection process, the RJ45 interface is connected to the Ethernet interface of the first communication module 12 via a network cable.

[0129] In this embodiment, during the actual connection process, the optical interface of the first communication module 12 is connected to the optical interface of the second communication module 13 via an optical fiber.

[0130] In this embodiment, during the actual connection process, the Ethernet interface of the second communication module 13 is connected to the Ethernet interface of the switch 14 via a network cable.

[0131] In this embodiment, the switch 14 may refer to a TP-LINK switch.

[0132] In this embodiment, the router 15 may refer to the TL-R473G router of TP-LINK.

[0133] In this embodiment, during the actual connection process, another Ethernet interface of the switch 14 is connected to a LAN network of the router 15 via a network cable.

[0134] In this embodiment, the computer 16 can refer to a Lenovo computer. In the actual connection process, the network interface of the computer 16 is connected to another LAN network interface of the router 35 through a network cable.

[0135] In this embodiment, the X-direction reflector 5 - 1 and the Y-direction reflector 6 - 1 are independent reflectors.

[0136] In this embodiment, the annular dial 8 is an angle dial.

[0137] In this embodiment, a horizontal support rod for installing the Z-direction displacement sensor 7 is provided on the top of the frame column 3 .

[0138] like Figure 8 and Fig. 9 A building seismic isolation bearing monitoring method is shown, comprising the following steps:

[0139] Step 1: Layout of seismic isolation bearings:

[0140] Step 101, mark each frame column 3 in the lower structure of the building in the order from south to north and from west to east to obtain the first frame column, the second frame column, ..., the i-th frame column, ..., the N-th frame column; wherein i and N are both positive integers, and 1≤i≤N, N=40;

[0141] Step 102, respectively install rubber seismic isolation bearings 1 on the 1st frame column to the 11th frame column, the 15th frame column to the 17th frame column, the 19th frame column, the 20th frame column, the 27th frame column, the 28th frame column, the 31st frame column and the 32nd frame column, and respectively record the rubber seismic isolation bearings 1 as the 1st rubber seismic isolation bearing, the 2nd rubber seismic isolation bearing, ..., the jth rubber seismic isolation bearing, ..., the Mth rubber seismic isolation bearing in the order of the frame columns from small to large; wherein j and M are both positive integers, and 1≤j≤M, M=20, the top surface of each rubber seismic isolation bearing 1 is fixedly connected to the upper structure 4 of the building, and the bottom surface of each rubber seismic isolation bearing 1 is fixedly connected to the frame column 3;

[0142] Step 103, respectively install lead rubber seismic isolation bearings 2 on the 12th frame column to the 14th frame column, the 18th frame column, the 21st frame column to the 26th frame column, the 29th frame column, the 30th frame column, and the 33rd frame column to the 40th frame column, and respectively record the lead rubber seismic isolation bearings 2 as the first lead rubber seismic isolation bearing, the second lead rubber seismic isolation bearing, ..., the j'th lead rubber seismic isolation bearing, ..., the M'th lead rubber seismic isolation bearing in the order of the frame columns from small to large; wherein j' and M' are both positive integers, and 1≤j'≤M', M'=20, the top surface of each lead rubber seismic isolation bearing is fixedly connected to the building superstructure 4, and the bottom surface of each lead rubber seismic isolation bearing is fixedly connected to the frame column;

[0143] Step 2: Selection of seismic isolation bearings:

[0144] The fifth rubber isolation bearing, the tenth rubber isolation bearing, the nineteenth rubber isolation bearing and the thirty-first rubber isolation bearing are selected as monitoring isolation bearings, and the isolation bearings are sequentially recorded as the first monitoring isolation bearing 101, the second monitoring isolation bearing 102, the third monitoring isolation bearing 103, and the fourth monitoring isolation bearing 104; wherein any monitoring isolation bearing is recorded as the kth monitoring isolation bearing, k is a positive integer, and 1≤k≤4;

[0145] In this embodiment, the selection of the seismic isolation bearing may refer to the ETABS seismic isolation analysis.

[0146] Step 3: Installation of monitoring device:

[0147] The method for installing the monitoring device at each monitoring isolation support is the same. The process of installing the monitoring device at the kth monitoring isolation support is as follows:

[0148] Step 301, the rubber seismic isolation bearing 1 includes a seismic isolation rubber pad 1-3, an upper connecting steel plate 1-1 arranged on the upper part of the seismic isolation rubber pad 1-3, and a lower connecting steel plate 1-2 arranged at the bottom of the seismic isolation rubber pad 1-3; wherein the upper connecting steel plate 1-1 of the kth monitoring seismic isolation bearing is fixedly connected to the upper structure 4 of the building, and the lower connecting steel plate 1-2 of the kth monitoring seismic isolation bearing is fixedly connected to the frame column 3;

[0149] Step 302, the center of the bottom surface of the following connecting steel plate 1-2 is the origin O, the X axis passes through the origin O and points to the east, the Y axis passes through the origin O and is perpendicular to the X axis and points to the north, and the Z axis passes through the origin O and is perpendicular to the XOY plane formed by the X axis and the Y axis and points to the building superstructure 4, and a rectangular coordinate system is established;

[0150] Step 303, installing an X-direction displacement sensor 5-2 on one side of the frame column 3 at the bottom of the kth monitoring isolation support, and installing an X-direction reflector 5-1 at the bottom of the building superstructure 4; wherein the laser emitted by the X-direction displacement sensor 5-2 points to the largest surface of the X-direction reflector 5-1, and the laser emitted by the X-direction displacement sensor 5-2 is parallel to the X-axis direction;

[0151] Step 304, install a Y-direction displacement sensor 6-2 on the other side of the frame column 3 at the bottom of the kth monitoring isolation support, and install a Y-direction reflector 6-1 at the bottom of the building superstructure 4; wherein the laser emitted by the Y-direction displacement sensor 6-2 points to the largest surface of the Y-direction reflector 6-1, and the laser emitted by the Y-direction displacement sensor 6-2 is parallel to the Y-axis direction;

[0152] Step 305: Install a Z-direction displacement sensor 7 on the top of the frame column 3 at the bottom of the kth monitoring isolation support, and install a Z-direction reflector 7-1 on the bottom of the building superstructure 4; wherein the laser emitted by the Z-direction displacement sensor 7 points to the largest surface of the Z-direction reflector 7-1, and the laser emitted by the Z-direction displacement sensor 7 is parallel to the Z-axis direction;

[0153] Step 306: evenly distribute a plurality of mounting rods 8-1 on the outer circumference of the upper connecting steel plate 1-1, and mount an annular scale plate 8 on the plurality of mounting rods 8-1; wherein the center of the annular scale plate 8 coincides with the center point of the upper connecting steel plate 1-1;

[0154] Step 307, installing a horizontal bracket 9-1 on an opposite side of the frame column 3 at the bottom of the kth monitoring isolation support, and installing a laser transmitter 9-2 and a camera 9 on the horizontal bracket 9-1; wherein the lens of the camera 9 faces the annular scale plate 8;

[0155] Step 4: Connection between monitoring device and data processing module:

[0156] Step 401, connecting the microcontroller 10 to the RS485 communication module 11, and connecting the A terminal of the RS485 communication module 11 to the A line of the RS485 bus, and connecting the B terminal of the RS485 communication module 11 to the B line of the RS485 bus;

[0157] Step 402: record the X-direction displacement sensors 5-2 in the first monitoring isolation bearing, ..., the kth monitoring isolation bearing, ..., and the fourth monitoring isolation bearing as the first group of X-direction displacement sensors, ..., the kth group of X-direction displacement sensors, ..., and the fourth group of X-direction displacement sensors, respectively; and connect the A output ends of the first group of X-direction displacement sensors, ..., the kth group of X-direction displacement sensors, ..., and the fourth group of X-direction displacement sensors to the A line of the RS485 bus, respectively, and connect the B output ends of the first group of X-direction displacement sensors, ..., the kth group of X-direction displacement sensors, ..., and the fourth group of X-direction displacement sensors to the B line of the RS485 bus, respectively;

[0158] Step 403, record the Y-direction displacement sensors 6-2 in the 1st monitoring isolation bearing, ..., the kth monitoring isolation bearing, ..., and the 4th monitoring isolation bearing as the 1st group of Y-direction displacement sensors, ..., the kth group of Y-direction displacement sensors, ..., and the 4th group of Y-direction displacement sensors respectively; and connect the A output ends of the 1st group of Y-direction displacement sensors, ..., the kth group of Y-direction displacement sensors, ..., and the 4th group of Y-direction displacement sensors to the A line of the RS485 bus respectively, and connect the B output ends of the 1st group of Y-direction displacement sensors, ..., the kth group of Y-direction displacement sensors, ..., and the 4th group of Y-direction displacement sensors to the B line of the RS485 bus respectively;

[0159] Step 404, the Z-direction displacement sensors 7 in the first monitoring isolation bearing, ..., the kth monitoring isolation bearing, ..., and the fourth monitoring isolation bearing are respectively recorded as the first group of Z-direction displacement sensors, ..., the kth group of Z-direction displacement sensors, ..., and the fourth group of Z-direction displacement sensors; and the A output ends of the first group of Z-direction displacement sensors, ..., the kth group of Z-direction displacement sensors, ..., and the fourth group of Z-direction displacement sensors are respectively connected to the A line of the RS485 bus, and the B output ends of the first group of Z-direction displacement sensors, ..., the kth group of Z-direction displacement sensors, ..., and the fourth group of Z-direction displacement sensors are respectively connected to the B line of the RS485 bus;

[0160] Step 405, record the cameras 9 in the first monitoring seismic isolation support, ..., the kth monitoring seismic isolation support, ..., and the fourth monitoring seismic isolation support as the first camera, ..., the kth camera, ..., and the fourth camera, respectively, and connect the first camera, ..., the kth camera, ..., and the fourth camera to the microcontroller 10;

[0161] Step 5: Data collection and transmission of monitoring device:

[0162] Step 501: the number of X-direction displacement sensors 5-2 in the k-th group of X-direction displacement sensors is three, and the three X-direction displacement sensors 5-2 in the k-th group of X-direction displacement sensors are respectively recorded as the first X-direction displacement sensor in the k-th group, the second X-direction displacement sensor in the k-th group, and the third X-direction displacement sensor in the k-th group; wherein the first X-direction displacement sensor in the k-th group, the second X-direction displacement sensor in the k-th group, and the third X-direction displacement sensor in the k-th group are arranged along a side surface height direction of the frame column 3;

[0163] Step 502: Set the initial X-direction spacing between the first X-direction displacement sensor in the kth group, the second X-direction displacement sensor in the kth group, and the third X-direction displacement sensor in the kth group and the X-direction reflector 5-1 to L. k,x (0); where the initial setting spacing in the X direction is L k,x The value range of (0) is 25cm~45cm;

[0164] Step 503: the number of the Y-direction displacement sensors 6-2 in the k-th group of Y-direction displacement sensors is three, and the three Y-direction displacement sensors 6-2 in the k-th group of Y-direction displacement sensors are respectively recorded as the first Y-direction displacement sensor in the k-th group, the second Y-direction displacement sensor in the k-th group, and the third Y-direction displacement sensor in the k-th group; wherein the first Y-direction displacement sensor in the k-th group, the second Y-direction displacement sensor in the k-th group, and the third Y-direction displacement sensor in the k-th group are arranged along the height direction of the other side surface of the frame column 3;

[0165] The initial Y-direction spacing between the first Y-direction displacement sensor in the kth group, the second Y-direction displacement sensor in the kth group, and the third Y-direction displacement sensor in the kth group and the Y-direction reflector 6-1 is set to L. k,y (0); where the initial setting spacing in the Y direction is L k,y The value range of (0) is 25cm~45cm;

[0166] Step 504: the number of the Z-direction displacement sensors 7 in the k-th group of Z-direction displacement sensors is three, and the three Z-direction displacement sensors 7 in the k-th group of Z-direction displacement sensors are respectively recorded as the first Z-direction displacement sensor in the k-th group, the second Z-direction displacement sensor in the k-th group, and the third Z-direction displacement sensor in the k-th group; wherein the first Z-direction displacement sensor in the k-th group, the second Z-direction displacement sensor in the k-th group, and the third Z-direction displacement sensor in the k-th group are arranged clockwise along the top of the frame column 3;

[0167] The initial Z-direction spacing between the first Z-direction displacement sensor in the kth group, the second Z-direction displacement sensor in the kth group, and the third Z-direction displacement sensor in the kth group and the Z-direction reflector 7-1 is set to L. k,z (0); where the initial setting distance L in the Z direction k,zThe value range of (0) is 23cm to 38cm;

[0168] Step 505: At the initial moment, the laser emitted by the laser transmitter 9-2 irradiates the annular scale plate 8 to form a positioning irradiation point. The k-th camera captures an image of the positioning irradiation point on the annular scale plate 8 at the k-th monitoring isolation support, and sends the image of the positioning irradiation point on the k-th annular scale plate to the microcontroller 10. According to the image of the positioning irradiation point on the k-th annular scale plate, the angle scale value of the positioning irradiation point on the k-th annular scale plate 8 is obtained, and recorded as the initial angle value θ of the k-th monitoring isolation support. k (0);

[0169] Step 506: During the detection process of the kth group of X-direction displacement sensors, the kth group of Y-direction displacement sensors, and the kth group of Z-direction displacement sensors, the X-direction displacement detected by the first X-direction displacement sensor in the kth group at the qth sampling moment is obtained. The X-direction displacement detected by the second X-direction displacement sensor in the k-th group at the q-th sampling moment and the X-direction displacement detected by the third X-direction displacement sensor in the k-th group at the q-th sampling moment The microcontroller 10 uses the formula Get the X-direction displacement L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q); The microcontroller 10 uses the formula L k,x (q,0)=|L k,x (q)-L k,x (0)|, and obtain the X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q,0); where q is a natural number;

[0170] At the same time, the Y-direction displacement detected by the first Y-direction displacement sensor in the k-th group at the q-th sampling moment is obtained. The Y-direction displacement detected by the second Y-direction displacement sensor in the k-th group at the q-th sampling moment and the Y-direction displacement detected by the third Y-direction displacement sensor in the k-th group at the q-th sampling moment The microcontroller 10 uses the formula Get the Y-direction displacement L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q); The microcontroller 10 is based on the formula L k,y (q,0)=|L k,y (q)-L k,y (0)|, and obtain the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0);

[0171] At the same time, the Z-direction displacement detected by the first Z-direction displacement sensor in the k-th group at the q-th sampling moment is obtained. The Z-direction displacement detected by the second Z-direction displacement sensor in the k-th group at the q-th sampling moment and the Z-direction displacement detected by the third Z-direction displacement sensor in the k-th group at the q-th sampling moment The microcontroller 10 uses the formula Get the Z-direction displacement L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q); The microcontroller 10 is based on the formula L k,z (q,0)=|L k,z (q)-L k,z (0)|, and obtain the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q,0);

[0172] Step 507: According to the method described in step 505, the image of the locating irradiation point on the kth annular scale plate at the qth sampling time is obtained, and the angle value θ of the locating irradiation point on the kth monitoring isolation support at the qth sampling time is obtained. k (q), the microcontroller 10 uses the formula θ k (q,0)=|θ k (q)-θ k (0)|, and obtain the rotation angle θ of the kth monitoring isolation support at the qth sampling time k (q,0);

[0173] Step 6: Processing of monitoring device and primary and secondary alarms:

[0174] The X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q,0), the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0), the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q,0) and the rotation angle θ of the kth monitoring isolation bearing at the qth sampling time k (q, 0) is judged, and the microcontroller 10 controls the voice alarm module 18 to issue a first-level alarm reminder or a second-level alarm reminder.

[0175] In this embodiment, the microcontroller 10 is used to compensate the displacement between step 5 and step 6, and the specific process is as follows:

[0176] Step A: Using the microcontroller 10 to calculate the X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,xThe process of compensation for (q,0) is as follows:

[0177] Step A1: the mean errors of the first X-direction displacement sensor in the k-th group, the second X-direction displacement sensor in the k-th group, the third X-direction displacement sensor in the k-th group, the first Y-direction displacement sensor in the k-th group, the second Y-direction displacement sensor in the k-th group, the third Y-direction displacement sensor in the k-th group, the first Z-direction displacement sensor in the k-th group, the second Z-direction displacement sensor in the k-th group, and the third Z-direction displacement sensor in the k-th group are all the same, and the mean errors of the displacement sensors are obtained as follows:

[0178] Step A11, projecting the laser beam of the X-axis displacement sensor 5-2 onto the reference reflector, sending the detected distance between the X-axis displacement sensor 5-2 and the reference reflector to the microcontroller 10, and recording the a-th distance measurement value measured by the X-axis displacement sensor 5-2 as L(a);

[0179] Step A12, then manually measure the distance between the X-axis displacement sensor 5-2 and the reference reflector to obtain the true value of the distance and record it as Z1;

[0180] Step A13: According to the formula Get the mean error m of the displacement sensor w ; Wherein, N′ represents the total number of measurements, a and N′ are both positive integers, and the value range of a is 1 to N′, and the value of N′ is 100 to 200;

[0181] Step A2: The microcontroller 10 uses the formula Get the X-direction displacement compensation value L′ detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q); The microcontroller 10 uses the formula L′ k,x (q,0)=|L′ k,x (q)-L k,x (0)|, and obtain the compensation value L′ of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q,0);

[0182] Step B: According to the method described in step A, the microcontroller 10 is used to calculate the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment. k,y (q,0) is compensated, and the microcontroller 10 is compensated according to the formula Get the Y-direction displacement compensation value L′ detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q); The microcontroller 10 uses the formula L′ k,y (q,0)=|L′ k,y (q)-L k,y(0)|, and obtain the Y-direction displacement change compensation value L′ detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0);

[0183] Step C: According to the method described in step A, the microcontroller 10 is used to calculate the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment. k,z (q,0) is compensated, and the microcontroller 10 is compensated according to the formula Get the Z-direction displacement compensation value L′ detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q); The microcontroller 10 uses the formula L′ k,z (q,0)=|L′ k,z (q)-L k,z (0)|, and obtain the Z-direction displacement change compensation value L′ detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q,0).

[0184] In this embodiment, the processing of the monitoring device in step 6 and the first-level alarm and the second-level alarm are specifically performed as follows:

[0185] Step 601, the microcontroller 10 uses the formula

[0186] The X-direction displacement change rate ΔL of the k-th monitoring isolation support at the q+1-th sampling time is obtained k,x (q+1); where the time T ranges from 8h to 12h; where L′ k,x (q+1,0) represents the compensation value of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q+1-th sampling moment, L′ k,x (q+2,0) represents the compensation value of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q+2-th sampling moment, L′ k,x (q+3,0) represents the compensation value of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q+3-th sampling moment;

[0187] The microcontroller 10 uses the formula The Y-direction displacement change rate ΔL of the k-th monitoring isolation support at the q+1-th sampling time is obtained k,y (q+1); where L′ k,y (q+1,0) represents the compensation value of the Y-direction displacement change detected by the k-th group of Y-direction displacement sensors at the q+1-th sampling moment, L′ k,y (q+2,0) represents the compensation value of the Y-direction displacement change detected by the k-th group of Y-direction displacement sensors at the q+2-th sampling moment, L′ k,y(q+3,0) represents the compensation value of the Y-direction displacement change detected by the k-th group of Y-direction displacement sensors at the q+3-th sampling moment;

[0188] The microcontroller 10 uses the formula Get the Z-direction displacement change rate ΔL of the k-th monitoring isolation support at the q+1-th sampling time k,z (q+1); where L′ k,z (q+1,0) represents the compensation value of the Z-direction displacement change detected by the k-th group of Z-direction displacement sensors at the q+1-th sampling moment, L′ k,z (q+2,0) represents the compensation value of the Z-direction displacement change detected by the k-th group of Z-direction displacement sensors at the q+2-th sampling moment, L′ k,z (q+3,0) represents the compensation value of the Z-direction displacement change detected by the k-th group of Z-direction displacement sensors at the q+3-th sampling moment;

[0189] The microcontroller 10 uses the formula Get the rotation angle change rate Δθ of the kth monitoring isolation support at the q+1th sampling time k (q+1); where θ k (q+1,0) represents the rotation angle of the kth monitoring isolation support at the q+1th sampling time, θ k (q+2,0) represents the rotation angle of the kth monitoring isolation support at the q+2th sampling time, θ k (q+3,0) represents the rotation angle of the kth monitoring isolation bearing at the q+3th sampling time;

[0190] Step 602: The microcontroller 10 arranges the X-direction displacement variation compensation value of the first group of X-direction displacement sensors at the qth sampling moment, the X-direction displacement variation compensation value of the second group of X-direction displacement sensors at the qth sampling moment, the X-direction displacement variation compensation value of the third group of X-direction displacement sensors at the qth sampling moment, and the X-direction displacement variation compensation value of the fourth group of X-direction displacement sensors at the qth sampling moment in ascending order to obtain the maximum value of the X-direction displacement variation at the qth sampling moment. The microcontroller 10 arranges the Y-direction displacement variation compensation value of the first group of Y-direction displacement sensors at the qth sampling moment, the Y-direction displacement variation compensation value of the second group of Y-direction displacement sensors at the qth sampling moment, the Y-direction displacement variation compensation value of the third group of Y-direction displacement sensors at the qth sampling moment, and the Y-direction displacement variation compensation value of the fourth group of Y-direction displacement sensors at the qth sampling moment in order from small to large, and obtains the maximum value of the Y-direction displacement variation at the qth sampling moment. The microcontroller 10 arranges the Z-direction displacement variation compensation value of the first group of Z-direction displacement sensors at the qth sampling moment, the Z-direction displacement variation compensation value of the second group of Z-direction displacement sensors at the qth sampling moment, the Z-direction displacement variation compensation value of the third group of Z-direction displacement sensors at the qth sampling moment, and the Z-direction displacement variation compensation value of the fourth group of Z-direction displacement sensors at the qth sampling moment in order from small to large, and obtains the maximum value of the Z-direction displacement variation at the qth sampling moment. The microcontroller 10 arranges the rotation angle of the first monitoring isolation support at the qth sampling moment, the rotation angle of the second monitoring isolation support at the qth sampling moment, the rotation angle of the third monitoring isolation support at the qth sampling moment, and the rotation angle of the fourth monitoring isolation support at the qth sampling moment in order from small to large, and obtains the maximum rotation angle θ of the monitoring isolation support at the qth sampling moment max (q);

[0191] Step 603: The microcontroller 10 calculates the compensation value L′ of the X-direction displacement variation detected by the k-th group of X-direction displacement sensors at the q+1-th sampling moment. k,x (q+1,0) and the maximum value of the displacement change in the X direction at the qth sampling moment The maximum value of the second level warning in the X direction The Y-direction displacement change compensation value L′ detected by the k-th group of Y-direction displacement sensors at the q+1th sampling moment is compared. k,y (q+1,0) and the maximum value of the Y-direction displacement change at the qth sampling moment The maximum value of the second level warning in the Y direction Compare the Y-direction displacement change compensation value L′ detected by the k-th group of Z-direction displacement sensors at the q+1-th sampling moment k,z (q+1,0) and the maximum value of the Z-direction displacement change at the qth sampling moment The maximum value of the second level warning in the Z direction For comparison, the rotation angle θ of the kth monitoring isolation support at the qth sampling moment is k (q,0) and the maximum rotation angle θ of the isolation bearing monitored at the qth sampling moment max (q) and the maximum value of the second-level warning of the rotation angle θ 2 (max) for comparison:

[0192] when And ΔL k,x (q+1)>L x (s), the microcontroller 10 controls the voice alarm module 18 to issue a first-level alarm; wherein, L x (s) represents the change rate threshold of displacement in the X direction;

[0193] when And ΔL k,y (q+1)>L y (s), the microcontroller 10 controls the voice alarm module 18 to issue a first-level alarm; wherein, L y (s) represents the change rate threshold of displacement in the Y direction;

[0194] when And ΔL k,z (q+1)>L z (s), the microcontroller 10 controls the voice alarm module 18 to issue a first-level alarm; wherein, L z (s) represents the threshold value of the rate of change of displacement in the Z direction;

[0195] When θ 2 (max)>θ k (q+1,0)≥θ max (q) and Δθ k When (q+1)>Δθ(s), the microcontroller 10 controls the voice alarm module 18 to issue a first-level alarm; wherein Δθ(s) represents the threshold value of the rate of change of the rotation angle of the monitoring isolation support;

[0196] when And ΔL k,x (q+1)>L x (s), the microcontroller 10 controls the voice alarm module 18 to perform a secondary alarm;

[0197] when And ΔL k,y (q+1)>L y (s), the microcontroller 10 controls the voice alarm module 18 to perform a secondary alarm;

[0198] when And ΔL k,z (q+1)>L z (s), the microcontroller 10 controls the voice alarm module 18 to perform a secondary alarm;

[0199] When θ k (q+1,0)>θ 2 (max) and Δθ k When (q+1)>Δθ(s), the microcontroller 10 controls the voice alarm module 18 to issue a secondary alarm.

[0200] In this embodiment, the change rate threshold L of the X-direction displacement x The value range of (s) is 0.01 to 0.1, and the change rate threshold of the Y-direction displacement L y The value range of (s) is 0.01 to 0.1, and the change rate threshold of the Z-direction displacement L zThe value range of (s) is 0.01 to 0.1, and the value range of the change rate threshold Δθ(s) of the rotation angle of the seismic isolation support is 0.1 to 1;

[0201] Set the diameter of the seismic isolation rubber pad 1-3 to R z , set the thickness of the seismic isolation rubber pad 1-3 to H z , when 0.55R z More than 3H z When the maximum value of the second-level warning in the X direction is Maximum value of the second level warning in the Y direction Take 3H z ×80%; when 0.55R z Less than 3 hours z When the maximum value of the second-level warning in the X direction is Maximum value of the second level warning in the Y direction Take 0.55R z ×80%; when 0.55R z Equal to 3H z When the maximum value of the second-level warning in the X direction is Maximum value of the second level warning in the Y direction Take 0.55R z ×80% or 3H z ×80%; Maximum value of the second-level warning in the Z direction The value range is: 4mm~4.5mm; the maximum value of the second-level warning of the rotation angle θ 2 The value range of (max) is 1°~2°.

[0202] In this embodiment, in step 506, the laser beam emitted by the first X-direction displacement sensor in the k-th group is projected onto the X-direction reflector 5-1 to form the first X-direction irradiation point of the k-th group. The first X-direction displacement sensor in the k-th group obtains the distance from the first X-direction displacement sensor in the k-th group to the first X-direction irradiation point of the k-th group and records it as the X-direction displacement detected by the first X-direction displacement sensor in the k-th group at the q-th sampling time. The laser beam emitted by the second X-direction displacement sensor in the kth group is projected onto the X-direction reflector 5-1 to form the second X-direction irradiation point of the kth group. The second X-direction displacement sensor in the kth group obtains the distance from the second X-direction displacement sensor in the kth group to the second X-direction irradiation point of the kth group and records it as the X-direction displacement detected by the second X-direction displacement sensor in the kth group at the qth sampling time. The laser beam emitted by the third X-direction displacement sensor in the kth group is projected onto the X-direction reflector 5-1 to form the third X-direction irradiation point of the kth group. The third X-direction displacement sensor in the kth group obtains the distance from the third X-direction displacement sensor in the kth group to the third X-direction irradiation point of the kth group and records it as the X-direction displacement detected by the third X-direction displacement sensor in the kth group at the qth sampling time. The laser beam emitted by the first Y-direction displacement sensor in the kth group is projected onto the Y-direction reflector 6-1 to form the first Y-direction irradiation point of the kth group. The first Y-direction displacement sensor in the kth group obtains the distance from the first Y-direction displacement sensor in the kth group to the first Y-direction irradiation point of the kth group and records it as the Y-direction displacement detected by the first Y-direction displacement sensor in the kth group at the qth sampling moment. The laser beam emitted by the second Y-direction displacement sensor in the kth group is projected onto the Y-direction reflector 6-1 to form the second Y-direction irradiation point of the kth group. The second Y-direction displacement sensor in the kth group obtains the distance from the second Y-direction displacement sensor in the kth group to the second Y-direction irradiation point of the kth group and records it as the Y-direction displacement detected by the second Y-direction displacement sensor in the kth group at the qth sampling moment. The laser beam emitted by the third Y-direction displacement sensor in the kth group is projected onto the Y-direction reflector 6-1 to form the third Y-direction irradiation point in the kth group. The third Y-direction displacement sensor in the kth group obtains the distance from the third Y-direction displacement sensor in the kth group to the third Y-direction irradiation point in the kth group and records it as the Y-direction displacement detected by the third Y-direction displacement sensor in the kth group at the qth sampling moment.

[0203] The laser beam emitted by the first Z-direction displacement sensor in the kth group is projected onto the Z-direction reflector 7-1 to form the first Z-direction irradiation point of the kth group. The first Z-direction displacement sensor in the kth group obtains the distance from the first Z-direction displacement sensor in the kth group to the first Z-direction irradiation point of the kth group and records it as the Z-direction displacement detected by the first Z-direction displacement sensor in the kth group at the qth sampling moment. The laser beam emitted by the second Z-direction displacement sensor in the kth group is projected onto the Z-direction reflector 7-1 to form the second Z-direction irradiation point of the kth group. The second Z-direction displacement sensor in the kth group obtains the distance from the second Z-direction displacement sensor in the kth group to the second Z-direction irradiation point of the kth group and records it as the Z-direction displacement detected by the second Z-direction displacement sensor in the kth group at the qth sampling moment. The laser beam emitted by the third Z-direction displacement sensor in the kth group is projected onto the Z-direction reflector 7-1 to form the third Z-direction irradiation point in the kth group. The third Z-direction displacement sensor in the kth group obtains the distance from the third Z-direction displacement sensor in the kth group to the third Z-direction irradiation point in the kth group and records it as the Z-direction displacement detected by the third Z-direction displacement sensor in the kth group at the qth sampling moment.

[0204] In this embodiment, during actual use, the microcontroller 10 can also obtain the X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment. k,x (q,0), the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y(q,0) and the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q, 0) is sent out through the first communication module 12, and the second communication module 13 receives the X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment. k,x (q,0), the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0) and the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q, 0) and sent to the computer 16 through the switch 14 and the router 15, so that the computer 16 can calculate the X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment. k,x (q,0), the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0) and the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q, 0) is compensated, and then a first-level alarm or a second-level alarm is issued according to steps 601 to 603.

[0205] In this embodiment, during actual use, the microcontroller 10 can also send the obtained image of the positioning irradiation point on the kth annular dial to the computer 16 through the first communication module 12, the second communication module 13, the switch 14 and the router 15. The computer 16 displays the image of the positioning irradiation point on the kth annular dial at the initial moment and the qth sampling moment, thereby facilitating the observation of the angle scale value of the positioning irradiation point on the kth annular dial 8 at the initial moment and the angle scale value of the positioning irradiation point on the kth annular dial 8 at the qth sampling moment.

[0206] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any way. Any simple modification, change and equivalent structural change made to the above embodiment based on the technical essence of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A building seismic isolation bearing monitoring device, wherein a seismic isolation bearing is arranged between a building lower structure and a building upper structure (4), wherein the building lower structure comprises a plurality of frame columns (3), characterized in that: The invention comprises an X-displacement detection module arranged on a frame column (3) and detecting an X-direction displacement of a vibration isolation support, a Y-displacement detection module arranged on the frame column (3) and detecting an Y-direction displacement of the vibration isolation support, a Z-displacement detection module arranged on the frame column (3) and detecting an Z-direction displacement of the vibration isolation support, and a rotation angle detection module detecting an angle of rotation of the vibration isolation support, and a data processing module connected to the X-displacement detection module, the Y-displacement detection module, the Z-displacement detection module and the rotation angle detection module, wherein the X-displacement detection module comprises an X-direction displacement sensor (5-2) arranged on one side of the frame column (3) and an X-direction reflector (5-1) arranged at the bottom of a building upper structure (4), and the Y-displacement detection module comprises a Y-direction displacement sensor (6-2) arranged on the other side of the frame column (3) and A Y-direction reflector (6-1) is arranged at the bottom of a building upper structure (4); the Z-direction displacement detection module comprises a Z-direction displacement sensor (7) installed at the top of a frame column (3) and a Z-direction reflector (7-1) arranged at the bottom of the building upper structure (4); the rotation angle detection module comprises a plurality of mounting rods (8-1) arranged on the outer circumference of an upper connecting steel plate (1-1), an annular scale plate (8) installed on the plurality of mounting rods (8-1) and a horizontal bracket (9-1) installed on an opposite side of the frame column (3), and a laser emitter (9-2) and a camera (9) installed on the horizontal bracket (9-1); the data processing module comprises a microcontroller (10); the X-direction displacement sensor (5-2), the Y-direction displacement sensor (6-2), the Z-direction displacement sensor (7) and the camera (9) are all connected to the microcontroller (10); The laser emitted by the X-direction displacement sensor (5-2) points to the maximum surface of the X-direction reflector (5-1), and the laser emitted by the X-direction displacement sensor (5-2) is parallel to the X-axis direction; the laser emitted by the Y-direction displacement sensor (6-2) points to the maximum surface of the Y-direction reflector (6-1), and the laser emitted by the Y-direction displacement sensor (6-2) is parallel to the Y-axis direction; the laser emitted by the Z-direction displacement sensor (7) points to the maximum surface of the Z-direction reflector (7-1), and the laser emitted by the Z-direction displacement sensor (7) is parallel to the Z-axis direction; The data processing module also includes a voice alarm module (18) connected to the microcontroller (10), and the X-direction displacement sensor (5-2), the Y-direction displacement sensor (6-2), and the Z-direction displacement sensor (7) are connected to the microcontroller (10) via an RS485 communication module (11).

2. A building seismic isolation bearing monitoring device according to claim 1, characterized in that: The center of the bottom surface of the lower connecting steel plate of the seismic isolation bearing is taken as the origin O, the X-axis passes through the origin O and points to the east, the Y-axis passes through the origin O and is perpendicular to the X-axis and points to the north, and the Z-axis passes through the origin O and is perpendicular to the XOY plane formed by the X-axis and the Y-axis and points to the upper structure of the building (4).

3. A building seismic isolation bearing monitoring device according to claim 1, characterized in that: The microcontroller (10) performs data communication with the monitoring module through a first communication module (12) and a second communication module (13); the monitoring module comprises a computer (16) and a router (15) and a switch (14) connected in sequence to the computer (16); and the second communication module (13) is connected to the switch (14); A temperature and humidity sensor (17) is provided on the building superstructure (4), and the temperature and humidity sensor (17) is connected to the microcontroller (10).

4. A method for monitoring a building seismic isolation support using the device according to claim 1, characterized in that: The method comprises the following steps: Step 1: Layout of seismic isolation bearings: Step 101, mark each frame column (3) in the lower structure of the building in the order from south to north and from west to east to obtain the first frame column, the second frame column, ..., the i-th frame column, ..., the N-th frame column; wherein i and N are both positive integers, and 1≤i≤N, N=40; Step 102, respectively installing rubber seismic isolation bearings (1) on the 1st frame column to the 11th frame column, the 15th frame column to the 17th frame column, the 19th frame column, the 20th frame column, the 27th frame column, the 28th frame column, the 31st frame column and the 32nd frame column, and respectively recording the rubber seismic isolation bearings (1) as the 1st rubber seismic isolation bearing, the 2nd rubber seismic isolation bearing, ..., the jth rubber seismic isolation bearing, ..., the Mth rubber seismic isolation bearing in the order of the frame columns from small to large; wherein j and M are both positive integers, and 1≤j≤M, M=20, the top surface of each rubber seismic isolation bearing (1) is fixedly connected to the upper structure (4) of the building, and the bottom surface of each rubber seismic isolation bearing (1) is fixedly connected to the frame column (3); Step 103, respectively install lead rubber seismic isolation bearings (2) on the 12th frame column to the 14th frame column, the 18th frame column, the 21st frame column to the 26th frame column, the 29th frame column, the 30th frame column, and the 33rd frame column to the 40th frame column, and respectively record the lead rubber seismic isolation bearings (2) as the first lead rubber seismic isolation bearing, the second lead rubber seismic isolation bearing, ..., the j'th lead rubber seismic isolation bearing, ..., the M'th lead rubber seismic isolation bearing in the order of the frame columns from small to large; wherein j' and M' are both positive integers, and 1≤j'≤M', M'=20, the top surface of each lead rubber seismic isolation bearing is fixedly connected to the upper structure (4) of the building, and the bottom surface of each lead rubber seismic isolation bearing is fixedly connected to the frame column; Step 2: Selection of seismic isolation bearings: The fifth rubber isolation bearing, the tenth rubber isolation bearing, the nineteenth rubber isolation bearing and the thirty-first rubber isolation bearing are selected as monitoring isolation bearings, and the isolation bearings are sequentially recorded as the first monitoring isolation bearing (101), the second monitoring isolation bearing (102), the third monitoring isolation bearing (103) and the fourth monitoring isolation bearing (104); wherein any monitoring isolation bearing is recorded as the kth monitoring isolation bearing, k is a positive integer, and 1≤k≤4; Step 3: Installation of monitoring device: The method for installing the monitoring device at each monitoring isolation support is the same. The process of installing the monitoring device at the kth monitoring isolation support is as follows: Step 301, the rubber seismic isolation bearing (1) comprises a seismic isolation rubber pad (1-3), an upper connecting steel plate (1-1) arranged on the upper part of the seismic isolation rubber pad (1-3), and a lower connecting steel plate (1-2) arranged on the bottom of the seismic isolation rubber pad (1-3); wherein the upper connecting steel plate (1-1) of the kth monitoring seismic isolation bearing is fixedly connected to the upper structure (4) of the building, and the lower connecting steel plate (1-2) of the kth monitoring seismic isolation bearing is fixedly connected to the frame column (3); Step 302, the center of the bottom surface of the following connecting steel plate (1-2) is the origin O, the X axis passes through the origin O and points to the east, the Y axis passes through the origin O and is perpendicular to the X axis and points to the north, and the Z axis passes through the origin O and is perpendicular to the XOY plane formed by the X axis and the Y axis and points to the upper structure of the building (4), and a rectangular coordinate system is established; Step 303, installing an X-direction displacement sensor (5-2) on one side of the frame column (3) at the bottom of the kth monitoring isolation support, and installing an X-direction reflector (5-1) at the bottom of the building superstructure (4); wherein the laser emitted by the X-direction displacement sensor (5-2) points to the largest surface of the X-direction reflector (5-1), and the laser emitted by the X-direction displacement sensor (5-2) is parallel to the X-axis direction; Step 304, installing a Y-direction displacement sensor (6-2) on the other side of the frame column (3) at the bottom of the kth monitoring isolation support, and installing a Y-direction reflector (6-1) at the bottom of the building superstructure (4); wherein the laser emitted by the Y-direction displacement sensor (6-2) points to the largest surface of the Y-direction reflector (6-1), and the laser emitted by the Y-direction displacement sensor (6-2) is parallel to the Y-axis direction; Step 305, installing a Z-direction displacement sensor (7) on the top of the frame column (3) at the bottom of the kth monitoring isolation support, and installing a Z-direction reflector (7-1) at the bottom of the building superstructure (4); wherein the laser emitted by the Z-direction displacement sensor (7) points to the largest surface of the Z-direction reflector (7-1), and the laser emitted by the Z-direction displacement sensor (7) is parallel to the Z-axis direction; Step 306: evenly distribute a plurality of mounting rods (8-1) on the outer circumference of the upper connecting steel plate (1-1), and mount an annular scale plate (8) on the plurality of mounting rods (8-1); wherein the center of the annular scale plate (8) coincides with the center point of the upper connecting steel plate (1-1); Step 307, installing a horizontal bracket (9-1) on an opposite side of the frame column (3) at the bottom of the kth monitoring isolation support, and installing a laser transmitter (9-2) and a camera (9) on the horizontal bracket (9-1); wherein the lens of the camera (9) faces the annular scale plate (8); Step 4: Connection between monitoring device and data processing module: Step 401, connecting the microcontroller (10) to the RS485 communication module (11), and connecting the A terminal of the RS485 communication module (11) to the A line of the RS485 bus, and connecting the B terminal of the RS485 communication module (11) to the B line of the RS485 bus; Step 402: record the X-direction displacement sensors (5-2) in the first monitoring isolation support, ..., the kth monitoring isolation support, ..., and the fourth monitoring isolation support as the first group of X-direction displacement sensors, ..., the kth group of X-direction displacement sensors, ..., and the fourth group of X-direction displacement sensors, respectively; and connect the A output ends of the first group of X-direction displacement sensors, ..., the kth group of X-direction displacement sensors, ..., and the fourth group of X-direction displacement sensors to the A line of the RS485 bus, and connect the B output ends of the first group of X-direction displacement sensors, ..., the kth group of X-direction displacement sensors, ..., and the fourth group of X-direction displacement sensors to the B line of the RS485 bus, respectively; Step 403, record the Y-direction displacement sensors (6-2) in the first monitoring isolation bearing, ..., the kth monitoring isolation bearing, ..., and the fourth monitoring isolation bearing as the first group of Y-direction displacement sensors, ..., the kth group of Y-direction displacement sensors, ..., and the fourth group of Y-direction displacement sensors, respectively; and connect the A output ends of the first group of Y-direction displacement sensors, ..., the kth group of Y-direction displacement sensors, ..., and the fourth group of Y-direction displacement sensors to the A line of the RS485 bus, and connect the B output ends of the first group of Y-direction displacement sensors, ..., the kth group of Y-direction displacement sensors, ..., and the fourth group of Y-direction displacement sensors to the B line of the RS485 bus, respectively; Step 404, the Z-direction displacement sensors (7) in the first monitoring isolation support, ..., the kth monitoring isolation support, ..., and the fourth monitoring isolation support are respectively recorded as the first group of Z-direction displacement sensors, ..., the kth group of Z-direction displacement sensors, ..., and the fourth group of Z-direction displacement sensors; and the A output ends of the first group of Z-direction displacement sensors, ..., the kth group of Z-direction displacement sensors, ..., and the fourth group of Z-direction displacement sensors are respectively connected to the A line of the RS485 bus, and the B output ends of the first group of Z-direction displacement sensors, ..., the kth group of Z-direction displacement sensors, ..., and the fourth group of Z-direction displacement sensors are respectively connected to the B line of the RS485 bus; Step 405, the cameras (9) in the first monitoring seismic isolation support, ..., the kth monitoring seismic isolation support, ..., and the fourth monitoring seismic isolation support are respectively recorded as the first camera, ..., the kth camera, ..., and the fourth camera, and the first camera, ..., the kth camera, ..., and the fourth camera are all connected to the microcontroller (10); Step 5: Data collection and transmission of monitoring device: Step 501: the number of X-direction displacement sensors (5-2) in the k-th group of X-direction displacement sensors is three, and the three X-direction displacement sensors (5-2) in the k-th group of X-direction displacement sensors are respectively recorded as a first X-direction displacement sensor in the k-th group, a second X-direction displacement sensor in the k-th group, and a third X-direction displacement sensor in the k-th group; wherein the first X-direction displacement sensor in the k-th group, the second X-direction displacement sensor in the k-th group, and the third X-direction displacement sensor in the k-th group are arranged along a side surface height direction of the frame column (3); Step 502: Set the initial X-direction spacing between the first X-direction displacement sensor in the kth group, the second X-direction displacement sensor in the kth group, and the third X-direction displacement sensor in the kth group and the X-direction reflector (5-1) to L. k,x (0); where the initial setting spacing in the X direction is L k,x The value range of (0) is 25cm~45cm; Step 503: the number of the Y-direction displacement sensors (6-2) in the k-th group of Y-direction displacement sensors is three, and the three Y-direction displacement sensors (6-2) in the k-th group of Y-direction displacement sensors are respectively recorded as the first Y-direction displacement sensor in the k-th group, the second Y-direction displacement sensor in the k-th group, and the third Y-direction displacement sensor in the k-th group; wherein the first Y-direction displacement sensor in the k-th group, the second Y-direction displacement sensor in the k-th group, and the third Y-direction displacement sensor in the k-th group are arranged along the height direction of another side surface of the frame column (3); The initial Y-direction spacing between the first Y-direction displacement sensor in the kth group, the second Y-direction displacement sensor in the kth group, and the third Y-direction displacement sensor in the kth group and the Y-direction reflector (6-1) is set to L. k,y (0); where the initial setting spacing in the Y direction is L k,y The value range of (0) is 25cm~45cm; Step 504: the number of the Z-direction displacement sensors (7) in the k-th group of Z-direction displacement sensors is three, and the three Z-direction displacement sensors (7) in the k-th group of Z-direction displacement sensors are respectively recorded as the first Z-direction displacement sensor in the k-th group, the second Z-direction displacement sensor in the k-th group, and the third Z-direction displacement sensor in the k-th group; wherein the first Z-direction displacement sensor in the k-th group, the second Z-direction displacement sensor in the k-th group, and the third Z-direction displacement sensor in the k-th group are arranged clockwise along the top of the frame column (3); The initial Z-direction spacing between the first Z-direction displacement sensor in the kth group, the second Z-direction displacement sensor in the kth group, and the third Z-direction displacement sensor in the kth group and the Z-direction reflector (7-1) is set to L. k,z (0); where the initial setting distance L in the Z direction k,z The value range of (0) is 23cm to 38cm; Step 505: At the initial moment, the laser emitted by the laser emitter (9-2) irradiates the annular scale plate (8) to form a positioning irradiation point, the kth camera captures an image of the positioning irradiation point on the annular scale plate (8) at the kth monitoring isolation support, and sends the image of the positioning irradiation point on the kth annular scale plate to the microcontroller (10), and obtains the angle scale value of the positioning irradiation point on the kth annular scale plate (8) based on the image of the positioning irradiation point on the kth annular scale plate, and records it as the initial angle value θ of the kth monitoring isolation support. k (0); Step 506: During the detection process of the kth group of X-direction displacement sensors, the kth group of Y-direction displacement sensors, and the kth group of Z-direction displacement sensors, the X-direction displacement detected by the first X-direction displacement sensor in the kth group at the qth sampling moment is obtained. The X-direction displacement detected by the second X-direction displacement sensor in the k-th group at the q-th sampling moment and the X-direction displacement detected by the third X-direction displacement sensor in the k-th group at the q-th sampling moment The microcontroller (10) is based on the formula Get the X-direction displacement L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q); microcontroller (10) according to formula L k,x (q,0)=|L k,x (q)-L k,x (0)|, and obtain the X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q,0); where q is a natural number; At the same time, the Y-direction displacement detected by the first Y-direction displacement sensor in the k-th group at the q-th sampling moment is obtained. The Y-direction displacement detected by the second Y-direction displacement sensor in the k-th group at the q-th sampling moment and the Y-direction displacement detected by the third Y-direction displacement sensor in the k-th group at the q-th sampling moment The microcontroller (10) is based on the formula Get the Y-direction displacement L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q); microcontroller (10) according to formula L k,y (q,0)=|L k,y (q)-L k,y (0)|, and obtain the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0); At the same time, the Z-direction displacement detected by the first Z-direction displacement sensor in the k-th group at the q-th sampling moment is obtained. The Z-direction displacement detected by the second Z-direction displacement sensor in the k-th group at the q-th sampling moment and the Z-direction displacement detected by the third Z-direction displacement sensor in the k-th group at the q-th sampling moment The microcontroller (10) is based on the formula Get the Z-direction displacement L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q); microcontroller (10) according to formula L k,z (q,0)=|L k,z (q)-L k,z (0)|, and obtain the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q,0); Step 507: According to the method described in step 505, the image of the locating irradiation point on the kth annular scale plate at the qth sampling time is obtained, and the angle value θ of the locating irradiation point on the kth monitoring isolation support at the qth sampling time is obtained. k (q), the microcontroller (10) according to the formula θ k (q,0)=|θ k (q)-θ k (0)|, and obtain the rotation angle θ of the kth monitoring isolation support at the qth sampling time k (q,0); Step 6: Processing of monitoring device and primary and secondary alarms: The X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q,0), the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0), the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q,0) and the rotation angle θ of the kth monitoring isolation bearing at the qth sampling time k (q, 0) is used for judgment, and the microcontroller (10) controls the voice alarm module (18) to issue a first-level alarm reminder or a second-level alarm reminder.

5. The method according to claim 4, characterized in that: Between step 5 and step 6, a microcontroller (10) is used to compensate the displacement. The specific process is as follows: Step A: using a microcontroller (10) to calculate the X-direction displacement change L detected by the k-th group of X-direction displacement sensors at the q-th sampling moment. k,x The process of compensation for (q,0) is as follows: Step A1: the mean errors of the first X-direction displacement sensor in the k-th group, the second X-direction displacement sensor in the k-th group, the third X-direction displacement sensor in the k-th group, the first Y-direction displacement sensor in the k-th group, the second Y-direction displacement sensor in the k-th group, the third Y-direction displacement sensor in the k-th group, the first Z-direction displacement sensor in the k-th group, the second Z-direction displacement sensor in the k-th group, and the third Z-direction displacement sensor in the k-th group are all the same, and the mean errors of the displacement sensors are obtained as follows: Step A11, projecting the laser beam of the X-axis displacement sensor (5-2) onto the reference reflector, sending the detected distance between the X-axis displacement sensor (5-2) and the reference reflector to the microcontroller (10), and recording the a-th distance measurement value measured by the X-axis displacement sensor (5-2) as L(a); Step A12, then manually measure the distance between the X-axis displacement sensor (5-2) and the reference reflector to obtain the true value of the distance and record it as Z1; Step A13: According to the formula Get the mean error m of the displacement sensor w ; Wherein, N′ represents the total number of measurements, a and N′ are both positive integers, and the value range of a is 1 to N′, and the value of N′ is 100 to 200; Step A2: The microcontroller (10) calculates the Get the X-direction displacement compensation value L′ detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q); The microcontroller (10) according to the formula L′ k,x (q,0)=|L′ k,x (q)-L k,x (0)|, and obtain the compensation value L′ of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q-th sampling moment k,x (q,0); Step B: According to the method described in step A, a microcontroller (10) is used to calculate the Y-direction displacement change L detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment. k,y (q,0) is compensated, and the microcontroller (10) is calculated according to the formula Get the Y-direction displacement compensation value L′ detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q); The microcontroller (10) is based on the formula L′ k,y (q,0)=|L′ k,y (q)-L k,y (0)|, and obtain the Y-direction displacement change compensation value L′ detected by the k-th group of Y-direction displacement sensors at the q-th sampling moment k,y (q,0); Step C: According to the method described in step A, a microcontroller (10) is used to calculate the Z-direction displacement change L detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment. k,z (q,0) is compensated, and the microcontroller (10) is calculated according to the formula Get the Z-direction displacement compensation value L′ detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q); The microcontroller (10) according to the formula L′ k,z (q,0)=|L′ k,z (q)-L k,z (0)|, and obtain the Z-direction displacement change compensation value L′ detected by the k-th group of Z-direction displacement sensors at the q-th sampling moment k,z (q,0).

6. The method according to claim 5, characterized in that: The specific process of the monitoring device processing and the first and second level alarms in step 6 is as follows: Step 601, the microcontroller (10) according to the formula The X-direction displacement change rate ΔL of the k-th monitoring isolation support at the q+1-th sampling time is obtained k,x (q+1); where the time T ranges from 8h to 12h; where L′ k,x (q+1,0) represents the compensation value of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q+1-th sampling moment, L′ k,x (q+2,0) represents the compensation value of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q+2-th sampling moment, L′ k,x (q+3,0) represents the compensation value of the X-direction displacement change detected by the k-th group of X-direction displacement sensors at the q+3-th sampling moment; The microcontroller (10) is based on the formula The Y-direction displacement change rate ΔL of the k-th monitoring isolation support at the q+1-th sampling time is obtained k,y (q+1); where L′ k,y (q+1,0) represents the compensation value of the Y-direction displacement change detected by the k-th group of Y-direction displacement sensors at the q+1-th sampling moment, L′ k,y (q+2,0) represents the compensation value of the Y-direction displacement change detected by the k-th group of Y-direction displacement sensors at the q+2-th sampling moment, L′ k,y (q+3,0) represents the compensation value of the Y-direction displacement change detected by the k-th group of Y-direction displacement sensors at the q+3-th sampling moment; The microcontroller (10) is based on the formula Get the Z-direction displacement change rate ΔL of the k-th monitoring isolation support at the q+1-th sampling time k,z (q+1); where L′ k,z (q+1,0) represents the compensation value of the Z-direction displacement change detected by the k-th group of Z-direction displacement sensors at the q+1-th sampling moment, L′ k,z (q+2,0) represents the compensation value of the Z-direction displacement change detected by the k-th group of Z-direction displacement sensors at the q+2-th sampling moment, L′ k,z (q+3,0) represents the compensation value of the Z-direction displacement change detected by the k-th group of Z-direction displacement sensors at the q+3-th sampling moment; The microcontroller (10) is based on the formula Get the rotation angle change rate Δθ of the kth monitoring isolation support at the q+1th sampling time k (q+1); where θ k (q+1,0) represents the rotation angle of the kth monitoring isolation support at the q+1th sampling time, θ k (q+2,0) represents the rotation angle of the kth monitoring isolation support at the q+2th sampling time, θ k (q+3,0) represents the rotation angle of the kth monitoring isolation bearing at the q+3th sampling time; Step 602: The microcontroller (10) arranges the X-direction displacement variation compensation value of the first group of X-direction displacement sensors at the qth sampling moment, the X-direction displacement variation compensation value of the second group of X-direction displacement sensors at the qth sampling moment, the X-direction displacement variation compensation value of the third group of X-direction displacement sensors at the qth sampling moment, and the X-direction displacement variation compensation value of the fourth group of X-direction displacement sensors at the qth sampling moment in ascending order to obtain the maximum value of the X-direction displacement variation at the qth sampling moment. The microcontroller (10) arranges the Y-direction displacement variation compensation value of the first group of Y-direction displacement sensors at the qth sampling moment, the Y-direction displacement variation compensation value of the second group of Y-direction displacement sensors at the qth sampling moment, the Y-direction displacement variation compensation value of the third group of Y-direction displacement sensors at the qth sampling moment, and the Y-direction displacement variation compensation value of the fourth group of Y-direction displacement sensors at the qth sampling moment in ascending order to obtain the maximum value of the Y-direction displacement variation at the qth sampling moment. The microcontroller (10) arranges the Z-direction displacement variation compensation value of the first group of Z-direction displacement sensors at the qth sampling moment, the Z-direction displacement variation compensation value of the second group of Z-direction displacement sensors at the qth sampling moment, the Z-direction displacement variation compensation value of the third group of Z-direction displacement sensors at the qth sampling moment, and the Z-direction displacement variation compensation value of the fourth group of Z-direction displacement sensors at the qth sampling moment in ascending order, and obtains the maximum value of the Z-direction displacement variation at the qth sampling moment. The microcontroller (10) arranges the rotation angle of the first monitoring isolation support at the qth sampling moment, the rotation angle of the second monitoring isolation support at the qth sampling moment, the rotation angle of the third monitoring isolation support at the qth sampling moment, and the rotation angle of the fourth monitoring isolation support at the qth sampling moment in order from small to large, and obtains the maximum rotation angle θ of the monitoring isolation support at the qth sampling moment max (q); Step 603: The microcontroller (10) converts the X-direction displacement variation compensation value L detected by the k-th group of X-direction displacement sensors at the q+1-th sampling moment into k ' ,x (q+1,0) and the maximum value of the displacement change in the X direction at the qth sampling moment The maximum value of the second level warning in the X direction The Y-direction displacement compensation value L detected by the k-th group of Y-direction displacement sensors at the q+1-th sampling moment is compared. k ' ,y (q+1,0) and the maximum value of the Y-direction displacement change at the qth sampling moment The maximum value of the second level warning in the Y direction The Y-direction displacement compensation value L detected by the k-th group of Z-direction displacement sensors at the q+1-th sampling moment is compared. k ' ,z (q+1,0) and the maximum value of the Z-direction displacement change at the qth sampling moment The maximum value of the second level warning in the Z direction For comparison, the rotation angle θ of the kth monitoring isolation support at the qth sampling moment is k (q,0) and the maximum rotation angle θ of the isolation bearing monitored at the qth sampling moment max (q) and the maximum value of the second-level warning of the rotation angle θ 2 (max) for comparison: when And ΔL k,x (q+1)>L x (s), the microcontroller (10) controls the voice alarm module (18) to issue a first-level alarm; wherein, L x (s) represents the change rate threshold of displacement in the X direction; when And ΔL k,y (q+1)>L y (s), the microcontroller (10) controls the voice alarm module (18) to issue a first-level alarm; wherein, L y (s) represents the change rate threshold of the displacement in the Y direction; when And ΔL k,z (q+1)>L z (s), the microcontroller (10) controls the voice alarm module (18) to issue a first-level alarm; wherein, L z (s) represents the threshold value of the rate of change of displacement in the Z direction; When θ 2 (max)>θ k (q+1,0)≥θ max (q) and Δθ k When (q+1)>Δθ(s), the microcontroller (10) controls the voice alarm module (18) to issue a first-level alarm; wherein Δθ(s) represents a threshold value for monitoring the rate of change of the rotation angle of the seismic isolation support; when And ΔL k,x (q+1)>L x (s), the microcontroller (10) controls the voice alarm module (18) to perform a secondary alarm; when And ΔL k,y (q+1)>L y (s), the microcontroller (10) controls the voice alarm module (18) to perform a secondary alarm; when And ΔL k,z (q+1)>L z (s), the microcontroller (10) controls the voice alarm module (18) to perform a secondary alarm; When θ k (q+1,0)>θ 2 (max) and Δθ k When (q+1)>Δθ(s), the microcontroller (10) controls the voice alarm module (18) to perform a secondary alarm.

7. The method according to claim 6, characterized in that: The change rate threshold L of the X-direction displacement x The value range of (s) is 0.01 to 0.1, and the change rate threshold of the Y-direction displacement L y The value range of (s) is 0.01 to 0.1, and the change rate threshold of the Z-direction displacement L z The value range of (s) is 0.01 to 0.1, and the value range of the change rate threshold Δθ(s) of the rotation angle of the seismic isolation support is 0.1 to 1; Set the diameter of the seismic isolation rubber pad (1-3) to R z , set the thickness of the seismic isolation rubber pad (1-3) to H z , when 0.55R z More than 3H z When the maximum value of the second-level warning in the X direction is Maximum value of the second level warning in the Y direction Take 3H z ×80%; When 0.55R z Less than 3 hours z When the maximum value of the second-level warning in the X direction is Maximum value of the second level warning in the Y direction Take 0.55R z ×80%; When 0.55R z Equal to 3H z When the maximum value of the second-level warning in the X direction is Maximum value of the second level warning in the Y direction Take 0.55R z ×80% or 3H z ×80%; Maximum value of the second-level warning in the Z direction The value range is: 4mm~4.5mm; Maximum value of rotation angle secondary warning θ 2 The value range of (max) is 1°~2°.

8. The method according to claim 4, characterized in that: In step 506, the laser beam emitted by the first X-direction displacement sensor in the k-th group is projected onto the X-direction reflector (5-1) to form the first X-direction irradiation point of the k-th group. The first X-direction displacement sensor in the k-th group obtains the distance from the first X-direction displacement sensor in the k-th group to the first X-direction irradiation point of the k-th group and records it as the X-direction displacement detected by the first X-direction displacement sensor in the k-th group at the q-th sampling time. The laser beam emitted by the second X-direction displacement sensor in the kth group is projected onto the X-direction reflector (5-1) to form the second X-direction irradiation point of the kth group. The second X-direction displacement sensor in the kth group obtains the distance from the second X-direction displacement sensor in the kth group to the second X-direction irradiation point of the kth group and records it as the X-direction displacement detected by the second X-direction displacement sensor in the kth group at the qth sampling moment. The laser beam emitted by the third X-direction displacement sensor in the kth group is projected onto the X-direction reflector (5-1) to form the third X-direction irradiation point in the kth group. The third X-direction displacement sensor in the kth group obtains the distance from the third X-direction displacement sensor in the kth group to the third X-direction irradiation point in the kth group and records it as the X-direction displacement detected by the third X-direction displacement sensor in the kth group at the qth sampling moment. The laser beam emitted by the first Y-direction displacement sensor in the k-th group is projected onto the Y-direction reflector (6-1) to form the first Y-direction irradiation point of the k-th group. The first Y-direction displacement sensor in the k-th group obtains the distance from the first Y-direction displacement sensor in the k-th group to the first Y-direction irradiation point of the k-th group and records it as the Y-direction displacement detected by the first Y-direction displacement sensor in the k-th group at the q-th sampling moment. The laser beam emitted by the second Y-direction displacement sensor in the kth group is projected onto the Y-direction reflector (6-1) to form the second Y-direction irradiation point of the kth group. The second Y-direction displacement sensor in the kth group obtains the distance from the second Y-direction displacement sensor in the kth group to the second Y-direction irradiation point of the kth group and records it as the Y-direction displacement detected by the second Y-direction displacement sensor in the kth group at the qth sampling moment. The laser beam emitted by the third Y-direction displacement sensor in the kth group is projected onto the Y-direction reflector (6-1) to form the third Y-direction irradiation point in the kth group. The third Y-direction displacement sensor in the kth group obtains the distance from the third Y-direction displacement sensor in the kth group to the third Y-direction irradiation point in the kth group and records it as the Y-direction displacement detected by the third Y-direction displacement sensor in the kth group at the qth sampling moment. The laser beam emitted by the first Z-direction displacement sensor in the kth group is projected onto the Z-direction reflector (7-1) to form the first Z-direction irradiation point of the kth group. The first Z-direction displacement sensor in the kth group obtains the distance from the first Z-direction displacement sensor in the kth group to the first Z-direction irradiation point of the kth group and records it as the Z-direction displacement detected by the first Z-direction displacement sensor in the kth group at the qth sampling moment. The laser beam emitted by the second Z-direction displacement sensor in the kth group is projected onto the Z-direction reflector (7-1) to form the second Z-direction irradiation point in the kth group. The second Z-direction displacement sensor in the kth group obtains the distance from the second Z-direction displacement sensor in the kth group to the second Z-direction irradiation point in the kth group and records it as the Z-direction displacement detected by the second Z-direction displacement sensor in the kth group at the qth sampling moment. The laser beam emitted by the third Z-direction displacement sensor in the kth group is projected onto the Z-direction reflector (7-1) to form the third Z-direction irradiation point in the kth group. The third Z-direction displacement sensor in the kth group obtains the distance from the third Z-direction displacement sensor in the kth group to the third Z-direction irradiation point in the kth group and records it as the Z-direction displacement detected by the third Z-direction displacement sensor in the kth group at the qth sampling moment.

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