Device for detecting mould

Abstract

A mold sensor includes a housing defining an enclosed cavity in which a substrate treated with a nutrient is positioned. The mold sensor includes a substrate advancing mechanism configured to selectively move the substrate to expose a surface of the substrate within the cavity. The mold sensor includes a sensor configured to detect mold growth on the substrate within the cavity.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of U.S. Provisional Application Serial No. 62 / 787145, filed December 31, 2018, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This application generally relates to integrated sensors for detecting mold in the environment. Background Technology

[0004] In many environments, mold can become a serious problem. Prolonged exposure to mold can lead to health problems. Excessive mold growth can soil or degrade structural surfaces. Furthermore, the presence of mold can indicate moisture problems within a structure. Often, mold problems can persist for a period without being detected. In some cases, mold growth is easily visible and can be detected through visual inspection. In many cases, mold is present but not easily seen by the observer. Ideally, it is desirable to detect mold before it can cause health or structural problems.

[0005] Mold spreads by releasing spores into the air. Mold spores can grow when they land on a suitable growth medium. Suitable growth conditions include appropriate levels of nutrients, water, and pH balance. Mold spores that do not land on such a medium remain inactive and are able to be carried by the air. A certain concentration of mold spores has been found in most air. Problem areas may have a higher concentration of mold spores.

[0006] A typical method for detecting mold involves collecting surface or air samples from the affected location. Particulate matter can be accumulated or placed on a microscope slide. Experts can then examine the slide under a microscope to identify the mold and determine its concentration and type. These methods typically require sample collection and delivery to a laboratory with expertise in mold detection. This process is often labor-intensive and quite expensive. Furthermore, receiving the results can take time. Current methods do not allow for continuous sampling of the area. Summary of the Invention

[0007] A mold sensor is disclosed, providing the ability to periodically sample an area for mold spores. The mold sensor can sample the air and provide an indication of the presence of mold. In some configurations, the mold sensor can provide additional information about the type and concentration of mold present. The mold sensor can operate unattended for a period of time and can provide test results to a remote device. The mold sensor may include various sensing technologies.

[0008] A mold sensor includes a housing defining a cavity and a portal for allowing air to enter into the cavity, and a substrate treated to promote mold growth. The mold sensor includes a substrate advancement mechanism configured to selectively move the substrate to expose a surface of the substrate within the cavity. The mold sensor includes a sensor configured to detect mold growth on the substrate within the cavity.

[0009] The mold sensor can further include a source configured to selectively kill mold within the cavity. The source can be an ultraviolet (UV) light source. The mold sensor can further include a controllable door disposed on the portal to selectively allow or prohibit air from entering based on a position of the controllable door. The substrate advancement mechanism can include a roll of film treated with nutrients, and an electric motor coupled to a spool configured to pull the film into the cavity. The substrate advancement mechanism can include a drum coupled to the electric motor and having an outer surface treated with nutrients, the outer surface configured such that when the drum is rotated, a portion of the outer surface is positioned in the cavity. The substrate advancement mechanism can include a disk having a surface treated with nutrients and coupled to the electric motor, and configured such that when the disk is rotated, a portion of the surface is positioned in the cavity. The mold sensor can further include a heating element configured to heat the cavity. The mold sensor can further include a temperature sensor disposed within the cavity. The mold sensor can further include a humidity sensor disposed within the cavity. The mold sensor can further include a pressure sensor disposed within the cavity. The portal can be defined by a top surface of the housing, and the top surface can be substantially parallel to the substrate. The portal can be defined on a side surface of the housing, and the side surface can be substantially perpendicular to the substrate.

[0010] A mold sensor includes a housing defining a first cavity and a second cavity, and further defining an opening to allow air to enter into the first cavity. The mold sensor includes a substrate treated to promote mold growth and a substrate advancement mechanism configured to selectively move the substrate such that a first surface of the substrate within the first cavity is moved into the second cavity and a second surface of the substrate is moved into the first cavity. The mold sensor includes a sensor positioned in the first cavity configured to sense mold growth on the substrate exposed in the first cavity. The mold sensor includes a source in the second cavity configured to kill mold on the substrate exposed within the second cavity.

[0011] The mold sensor can further include a second sensor positioned in the second cavity and configured to sense mold growth on the substrate exposed in the second cavity. The mold sensor can further include a heating element within the first cavity.

[0012] The mold sensor includes a housing defining a cavity. The mold sensor includes: a substrate treated to promote mold growth; and a substrate propulsion mechanism configured to selectively move the substrate such that a first surface of the substrate is exposed outside the cavity and a second surface of the substrate is exposed inside the cavity. The mold sensor includes a sensor positioned within the cavity and configured to detect mold growth on the second surface. The mold sensor includes a light source positioned within the cavity and configured to kill mold on the second surface when activated.

[0013] The substrate propulsion mechanism may further include a second housing defining a second cavity to enclose the substrate before it is exposed to the outside of the cavity, and defining a third cavity to enclose the substrate after mold growth. The substrate propulsion mechanism may be configured such that the first surface is substantially perpendicular to the second surface. The substrate propulsion mechanism may be configured such that the first surface and the second surface are in the same plane. Attached Figure Description

[0014] Figure 1 A single-chamber mold sensor configuration with an integrated sensor module is described.

[0015] Figure 2 A single-chamber mold sensor configuration with multiple sensors is described.

[0016] Figure 3 Alternative configurations for single-chamber mold sensors with integrated sensors are described.

[0017] Figure 4 Alternative configurations for single-chamber mold sensors with multi-piece sensors are described.

[0018] Figure 5 An example of a multi-chamber mold sensor configuration is depicted.

[0019] Figure 6 An example of a single-cavity mold sensor is depicted, configured to expose the surface to airflow outside the single cavity.

[0020] Figure 7 A second example of a single-cavity mold sensor is depicted, configured to expose the surface to airflow outside the single cavity.

[0021] Figure 8 The growth surfaces of strips, including those treated with different nutrients, are depicted.

[0022] Figure 9 A growth surface with alternating surface type segments is depicted.

[0023] Figure 10 The growth surface of the zone, which includes different nutrient treatments, is depicted.

[0024] Figure 11 An example of a belt-based surface replacement mechanism is depicted.

[0025] Figure 12A and Figure 12B Different views of a roller-based surface replacement mechanism are depicted.

[0026] Figure 13A An example of a disk-based surface replacement mechanism is depicted.

[0027] Figure 13B An example of a disk configuration for a disk-based surface replacement mechanism is depicted.

[0028] Figure 14 Possible configurations for a capacitive sensor used to detect mold on a growing surface are described.

[0029] Figure 15 Possible configurations of the grown surface with integrated electrical contacts are depicted.

[0030] Figure 16 An example of a growth surface with conductive strips is depicted.

[0031] Figure 17 An example of a rolling element-based electrical contact for interacting with a conductive strip on a growth surface is depicted.

[0032] Figure 18A and Figure 18B Different views of electrode-based electrical contacts for interacting with conductive strips on the growth surface are depicted.

[0033] Figure 19 An example of a growth surface configured to measure and control the pH level of the growth surface is depicted.

[0034] Figure 20 A mold sensor system, including a mold sensor and a communication network, is described.

[0035] Figure 21 A flowchart depicts the possible operating sequence for operating the mold sensor. Detailed Implementation

[0036] This document describes embodiments of the present disclosure. However, it should be understood that the disclosed embodiments are merely examples, and other embodiments can take various and alternative forms. The drawings are not necessarily to scale; some features may be exaggerated or minimized to show detail of particular components. Therefore, the specific structural and functional details disclosed herein should not be construed as limiting, but merely as a representative basis for teaching those skilled in the art to employ the embodiments in various ways. As will be understood by those skilled in the art, the various features shown and described with reference to any of the drawings can be combined with features shown in one or more other drawings to produce embodiments not explicitly shown or described. The combinations of features shown provide representative embodiments for typical applications. However, for a particular application or implementation, various combinations and modifications of features consistent with the teachings of this disclosure are expected.

[0037] An improved method for mold detection could be an integrated sensor device capable of detecting the presence of mold without sending samples to a laboratory. Another advantage of integrated sensors is that the mold sensor can be placed in one location for continuous monitoring. It can generate an alarm when mold becomes a problem. A mold sensor is disclosed herein configured to sample the air and detect the concentration of mold in the air. The mold sensor can be configured to create a small, enclosed environment conducive to mold growth. Mold growth can be detected in a variety of ways.

[0038] This application first discloses a general configuration and structural elements for a mold sensing device. Then, specific mold sensing techniques and strategies applicable to the general configuration are disclosed. Various operating modes and strategies are then disclosed. The mold sensing system may include multiple mold sensors. The mold sensors may be of a common design with communication capabilities. The mold sensing system may include a reference mold sensor and a target area mold sensor. The reference mold sensor can provide information on the expected mold concentration in the environment (e.g., outdoors). The target mold sensor can provide information on the mold concentration in an area of ​​interest (e.g., a basement, living room). The mold sensing system may include results from multiple sensors to accurately determine the mold concentration in the target area.

[0039] Figure 1A diagram depicting the configuration of a first mold sensor configuration 100 is provided. The first mold sensor configuration 100 may include a housing 102 defining a cavity 103. The housing 102 may define a bottom opening to allow surface exposure within the cavity 103 (e.g., the housing 102 may have no bottom). The housing 102 may be constructed of plastic, metal, and / or other suitable materials that do not degas or otherwise inhibit mold / bacterial growth. The surface of the housing 102 within the cavity 103 may be coated with a layer to prevent or inhibit mold growth (e.g., an alkaline coating with pH > 7). Although shown as a cube, the shape of the housing 102 may be other shapes. The specific shape of the housing 102 may depend on other mechanisms coupled to the housing 102.

[0040] The first mold sensor configuration 100 may include an air inlet port 104. The air inlet port 104 may be configured to define an airflow path 106 within the inlet cavity 103. In some configurations, the housing 102 may define an opening to serve as the air inlet port 104. In some configurations, the air inlet port 104 may be configured to selectively open and close. For example, a movable grille or door may be positioned above the opening defined by the housing 102. The movable grille or door may be electrically actuated to an open or closed position via a solenoid. A spring mechanism may hold the movable grille in a normally closed position. The solenoid may be actuated by a control device 116. The movable grille or door may be electrically, magnetically, or mechanically operated. Some configurations may include an airflow sensor 119 for determining airflow into the inlet cavity 103. The airflow sensor 119 may be electrically coupled to the control device 116. Although not shown in all configurations, the airflow sensor 119 may be included in other configurations described herein.

[0041] Control device 116 may be a controller including a processing unit and non-volatile and volatile memory. The controller may be programmed to perform various operations related to operating the mold sensor. Control device 116 may further include any electrical interface for interacting with actuators and sensors that are part of the mold sensor. Additionally, control device 116 may include a network interface for accessing a network. The network interface may be wired and / or wireless. The network interface can provide a communication path to access the Internet / World Wide Web. Control device 116 may be mounted on housing 102.

[0042] The first mold sensor configuration 100 may further include a growth surface 112. The growth surface 112 may be a surface exposed within the cavity 103 and suitable for mold growth. In some configurations, the growth surface 112 may be exposed to air outside the cavity 103. For example, the growth surface 112 may be exposed to the environment outside the cavity 103 for air sampling, and then moved into the cavity 103 for mold growth. An air inlet port 104 may be configured to define an airflow path 106 such that air is directed toward the growth surface 112. The growth surface 112 may be configured to facilitate the collection of mold spores from the air. The growth surface 112 may be configured to be suitable for a medium that promotes mold growth. The growth surface 112 may be treated with nutrients that promote mold growth. For example, nutrients may include organic matter, salt, agar, and / or sugar. The growth surface 112 may be further configured to supply sufficient moisture content to encourage mold growth, or may be packaged in a manner that maintains moisture content until it is used. The growth surface 112 may include antimicrobial chemicals or treatments to prevent bacterial growth. The growth surface 112 may be a tape, membrane, or filter. The tape, membrane, or filter may be treated with various substances to promote mold growth. The tape, membrane, or filter may be breathable or impermeable. One or more temperature and humidity / moisture sensors may be integrated with the growth surface 112 to allow monitoring of the mold growth environment.

[0043] The specific conditions that promote mold growth can depend on the type of mold to be grown. Different molds may prefer different nutrient environments. The growth surface 112 may further include zones (e.g., strips) configured to grow different types of mold. For example, each zone of the growth surface 112 can be treated with a mixture of different nutrients that promote the growth of different types of mold. The advantage of this configuration is that the type of mold present can be determined by monitoring the mold growth in each zone.

[0044] The first mold sensor configuration 100 may include a sensing device 110 configured to sense mold growing on a growth surface. The placement of the sensing device 110 may depend on the type of sensing performed. Furthermore, the orientation of the sensing device 110 relative to the housing 102 may depend on the type of sensing device 110. For example, Figure 1A sensing device 110 is depicted mounted at an angle relative to housing 102. Some sensing device configurations may perform better when oriented toward or through growth surface 112. Sensing device 110 may use a variety of technologies. Sensing device 110 may be electrically connected to control device 116. Sensing device 110 may be contained within a single module coupled to housing 102. Some sensor configurations (e.g., optical or audio) may utilize source and receiver modules. Sensing device 110 may integrate source and receiver modules into a single unit. In some configurations, sensing device 110 may include multiple sensing devices of the same or different technologies, placed in different locations within housing 102. Various configurations of sensing device 110 are disclosed herein.

[0045] The first mold sensor configuration 100 may include a mold suppressor 108 configured to eliminate mold. The mold suppressor 108 may be mounted on one side of the housing 102. For example, the mold suppressor 108 may be one or more ultraviolet (UV) light sources. For example, the mold suppressor 108 may be a single UV light source or an array of UV light sources. The UV light source may be a source irradiating a diverging beam that can irradiate the entire growth surface 112 exposed in the cavity 103. The UV light source may be a UV source with a beam diverging component to amplify the UV beam to irradiate the entire growth surface 112 exposed in the cavity 103. The mold suppressor 108 may be a UV light source with a driver to sweep the UV light source across the growth surface 112 exposed within the cavity. Additionally, the mold suppressor 108 may be configured to eliminate mold on other surfaces of the cavity 103 (e.g., the inner sidewalls) and on the air inlet port 104. The mold suppressor 108 may be electrically actuated by a control device 116. The mold suppressor 108 may be actuated for a predetermined time period to eliminate already grown mold. The control device 116 can activate the mold inhibitor 108 after the measurement cycle is completed to eliminate mold that has grown during the measurement cycle. The mold inhibitor 108 can be operated to eliminate mold within the cavity 103 to define baseline conditions before the start of the measurement cycle.

[0046] The first mold sensor configuration 100 may further include a surface replacement mechanism 114 configured to support and facilitate the replacement of the growth surface 112. In some configurations, the growth surface 112 may be attached to the surface replacement mechanism 114. The surface replacement mechanism 114 may be configured to be selectively coupled to the housing 102. After a measurement cycle is completed, the growth surface 112 can be replaced to enable another measurement cycle. When desired, the surface replacement mechanism 114 may be attached to or detached from the housing 102 to replace the growth surface 112. The housing 102 may define an opening on its bottom surface to expose the growth surface 112 to the cavity 103 when the surface replacement mechanism 114 is coupled to the housing 102. In some configurations, the housing 102 may be configured without a bottom surface.

[0047] In some configurations, the growth surface 112 may be movable, and the surface replacement mechanism 114 may be configured to move the growth surface 112 to another location. The surface replacement mechanism 114 may be configured to store portions of the growth surface 112 that are not currently exposed within the housing 102. The stored portions may include unused and used portions. The surface replacement mechanism 114 may be configured to be electromechanically actuated and may be electrically coupled to a control device 116. Various configurations of the surface replacement mechanism 114 are discussed in more detail later in this document. In some configurations, the surface replacement mechanism 114 may include the ability to electrostatically charge the growth surface 112 to improve its ability to attract mold spores.

[0048] The first mold sensor configuration 100 may include one or more thermal control elements 120 configured to alter the temperature within the cavity 103 to promote mold growth. Additional thermal control elements may be embedded above, within, or below the growth surface 112. The thermal control elements 120 may be electrically connected to a control device 116. The thermal control elements 120 may include thermoelectric cooling elements. For example, the thermal control element 120 may be a thermoelectric heat pump (e.g., a Peltier device or heat pump). The thermal control element 120 may include heating elements, such as resistive elements. The thermal control element 120 may include an infrared (IR) source. The thermal control element 120 may be a single element or may include multiple thermal control elements positioned at different locations within the cavity 103 to independently control the temperature in different regions of the cavity 103. In some configurations, the mold sensor may include mechanisms for regulating humidity within the cavity 103. Different environmental conditions (e.g., temperature) within the same nutrient zone can be used to distinguish different types of mold. For example, exposure to different environmental conditions in a given nutrient zone can create multiple zones favorable for the growth of different types of mold. The thermal control element 120 can be configured to create different temperature conditions in different zones of the growth surface 112. For example, by placing the thermal control element 120 on one side of the cavity 103, the temperature can increase or decrease with increasing distance from the thermal control element 120. This can provide different environmental conditions for different portions of the growth surface 112.

[0049] The first mold sensor configuration 100 may include a cavity environment sensor 118 configured to measure environmental conditions within the cavity 103. The cavity environment sensor 118 may be electrically connected to a control device 116. The cavity environment sensor 118 may include one or more temperature sensors, humidity sensors, pressure sensors, and / or gas sensors. The temperature sensor may be positioned in the path of the airflow entering the cavity 103. The cavity environment sensor 118 may be monitored at periodic intervals to determine the condition state within the cavity 103.

[0050] An external environment sensing module 122 may be present to provide information about the environment outside the cavity 103. The environment sensing module 122 may include a temperature sensor, a humidity sensor, a pressure sensor, and / or a gas sensor. The environment sensing module 122 may be electrically connected to the control device 116. The external environment sensing module 122 may be integrated with the housing 102 or may be a separate module communicating with the control device 116. Communication between the control device 116 and the external environment sensing module 122 may be conducted via a wireless communication protocol (e.g., Bluetooth, Bluetooth LE, WiFi, optical). The environment sensing module 122 may provide information about conditions around or near the first mold sensor configuration 100 that may affect mold growth. The control device 116 may be further configured to receive information from an external network (e.g., the Internet) to provide additional background for mold detection. The presence and / or concentration of mold spores may vary depending on the time of day, season, and environmental parameters. The control device 116 may collect this additional information and utilize it during the mold detection process. The control device 116 can use this information to determine the conditions for initiating a measurement cycle. For example, the control device 116 can initiate measurement cycles more frequently during the year when mold spores are present at higher concentrations.

[0051] Figure 2 A second mold sensor configuration 200 is depicted. The second mold sensor configuration 200 can be configured for sensors that do not integrate a source module and a receiver module therein. The second mold sensor configuration 200 may include a sensor source module 210 and a sensor receiver module 212. For example, in an optical sensing system, the sensor source module 210 may be a light source, and the sensor receiver module 212 may be a light sensor. The transmitting and receiving modules can operate cooperatively to detect mold within cavity 103. The sensor source module 210 and the sensor receiver module 212 can be electrically connected to a control device 116. In operation, the control device 116 can activate the sensor source module 210 and receive signals from the sensor receiver module 212.

[0052] In the depicted configuration, sensor source module 210 is coupled to the side wall of housing 102. Sensor receiver module 212 is coupled below growth surface 112. Sensor receiver module 212 can be mounted on a frame or platform below growth surface 112. Sensor source module 210 and sensor receiver module 212 can be aligned to ensure that sensor receiver module 212 can receive signals from sensor source module 210. In other configurations, the positions of sensor receiver module 212 and sensor source module 210 can be reversed.

[0053] The first mold sensor configuration 100 can be described as having an integrated mold sensing device. That is, the sensing device 110 is a single module coupled to the housing 102. The second mold sensor configuration 200 can be described as having a two-part sensing device. The second mold sensor configuration 200 can be useful for sensing configurations that measure characteristics transmitted through the growth surface 112.

[0054] Air inlet port 104, mold inhibitor 108, (one or more) sensing devices, thermal control element 120, and cavity environment sensor 118 can be installed in various configurations. The specific location selected may depend on the packaging constraints of the housing and / or performance considerations for mold detection. The location of (one or more) sensing devices may be selected depending on the type of sensing device used. For example, a sensing device using an optical sensor may be located differently from a sensing device configured to measure electrical properties.

[0055] Figure 3 A third mold sensor configuration 300 is depicted. The third mold sensor configuration 300 may include a housing 302 defining a cavity 303. The third mold sensor configuration 300 may include a side air inlet port 304. The side air inlet port 304 may be configured to create an airflow path 306 into the cavity 303. In some configurations, the side air inlet port 304 may redirect airflow to direct it toward the growth surface 112. For example, the side air inlet port 304 may include angled slats or strips to redirect airflow. In some configurations, the housing 302 may define an opening to serve as the side air inlet port 304. In some configurations, the side air inlet port 304 may be configured to selectively open and close. For example, a movable grille or door may be positioned over the opening defined by the housing 302. The movable grille or door may be electrically actuated to an open or closed position via a solenoid. A spring mechanism may hold the movable grille in a normally closed position. The solenoid may be actuated via a control device 116. The movable grille or door may be electrically, magnetically, or mechanically operated.

[0056] The third mold sensor configuration 300 may include a top-mounted mold suppressor 308. The top-mounted mold suppressor 308 may be as previously referenced. Figure 1 The mold suppressor 108 functions as described. The third mold sensor configuration 300 may include a top-mounted sensing device 310. The top-mounted sensing device 310 may be as previously referenced. Figure 1 The sensing device 110 functions as described. The top-mounted mold suppressor 308 and sensing device 310 can be integrated into a single unit (e.g., a sensor / suppressor module). This integrated device facilitates the assembly of the mold sensor.

[0057] The third mold sensor configuration 300 describes a configuration with different air inlet ports and sensor locations. The components typically function as previously described.

[0058] Figure 4 A fourth mold sensor configuration 400 is depicted. The fourth mold sensor configuration 400 can be configured for sensors that do not integrate source and receiver modules. The fourth mold sensor configuration 400 may include a top-mounted sensor source module 410 and a sensor receiver module 412. For example, in an optical sensing system, the top-mounted sensor source module 410 may be a light source, and the sensor receiver module 412 may be a light sensor. The transmitting and receiving modules can operate cooperatively to detect mold. The top-mounted sensor source module 410 and sensor receiver module 412 can be electrically connected to a control device 116. In operation, the control device 116 can activate the top-mounted sensor source module 410 and receive signals from the sensor receiver module 412.

[0059] In the depicted configuration, the top-mounted sensor source module 410 is coupled to the top wall or top plate of the housing 302. The sensor receiving module 412 is coupled below the growth surface 112. The top-mounted sensor source module 410 and sensor receiving module 412 can be aligned to ensure that the sensor receiving module 412 can receive signals from the top-mounted sensor source module 410. The top-mounted mold suppressor 308 and the top-mounted sensor source 410 can be integrated into a single unit (e.g., a sensor source / suppressor module). This integrated device facilitates the assembly of the mold sensor. In other configurations, the positions of the sensor source module 410 and sensor receiving module 412 can be reversed.

[0060] Figure 5 A dual-chamber mold sensor configuration 500 is depicted. The dual-chamber mold sensor configuration 500 may include a dual-chamber housing 502, which includes a partition wall 507 defining a first chamber 503 and a second chamber 505. The first chamber 503 can be used to grow mold on a portion of the growth surface 512 exposed within the first chamber 503.

[0061] The dual-chamber mold sensor configuration 500 may include an air inlet port 504. The air inlet port 504 may be configured to define an airflow path 506 into the first chamber 503. In some configurations, the dual-chamber housing 502 may define an opening to serve as the air inlet port 504. In some configurations, the air inlet port 504 may be configured to selectively open and close. For example, a movable grille or door may be positioned over the opening defined by the dual-chamber housing 502. The movable grille or door may be electrically actuated to an open or closed position via a solenoid. A spring mechanism may hold the movable grille in a normally closed position. The solenoid may be actuated via a control device 116. The movable grille or door may be electrically, magnetically, or mechanically operated.

[0062] The dual-chamber mold sensor configuration 500 may include one or more mold sensing devices 510 configured to sense mold growing on a growth surface 512. The placement of the sensing devices 510 may depend on the type of sensing performed. The sensing devices 510 may use a variety of technologies. The sensing devices 510 may be electrically connected to a control device 116. The sensing devices 510 may be contained within a single module coupled to a housing 502. Various configurations of the sensing devices 510 are disclosed herein.

[0063] The dual-chamber mold sensor configuration 500 may include one or more sensor receiving modules 511. The sensor receiving module 511 may be configured such that the sensing device 510 acts as a source. The dual-chamber mold sensor configuration 500 may be configured to have a single mold sensing device 510A configured to detect mold growth in a first chamber 503. The dual-chamber mold sensor configuration 500 may be configured to have a single mold sensing device 510A configured to detect mold growth in the first chamber 503 and a single sensor receiving module 511A. The dual-chamber mold sensor configuration 500 may be configured to have a single mold sensing device 510B configured to detect mold growth in a second chamber 505. The dual-chamber mold sensor configuration 500 may be configured to have a single mold sensing device 510B configured to detect mold growth in the second chamber 505 and a single sensor receiving module 511B. The dual-cavity mold sensor configuration 500 can also be configured to have mold sensing devices 510A / 511A, 510B / 511B in both the first cavity 503 and the second cavity 505.

[0064] The dual-chamber mold sensor configuration 500 may include a mold suppressor 508 configured to eliminate mold. The mold suppressor 508 may be mounted on the side or top of the housing 502. The mold suppressor 508 may be configured to eliminate mold in the second chamber 505. The mold suppressor 508 may function as previously described herein. Furthermore, the mold suppressor 508 may be integrated with a mold sensing device 510 as previously described herein.

[0065] The dual-chamber mold sensor configuration 500 may further include a surface replacement mechanism 514 configured to move the growth surface 512 to another location. For example, the surface replacement mechanism 514 may include one or more rollers configured to move the growth surface 512. The growth surface 512 exposed within the first chamber 503 may be referred to as the active growth surface. The active growth surface can be a surface on which mold is to grow or is growing. The portion of the growth surface 512 exposed within the second chamber 505 may be referred to as the used surface. The used surface can be a surface on which mold has already grown. The surface replacement mechanism 514 may be configured to advance the growth surface 512 to provide a new active growth surface within the first chamber 503. The surface replacement mechanism 514 will be described in more detail herein. Another configuration may be in which the growth surface 512 is exposed to air in the first chamber 503 and then moved to the second chamber 505 for growth, measurement, and elimination (e.g., similar to a single-chamber configuration).

[0066] The dual-chamber mold sensor configuration 500 may include a thermal control element 520 configured to alter the temperature in the first chamber 503 to promote mold growth. Additional thermal control elements may be embedded above, in, or below the growth surface 512. The thermal control element 520 may be a thermoelectric element electrically driven by a control device 116. The dual-chamber mold sensor configuration 500 may also include a similar thermal control element in the second chamber 505. The thermal control element 520 may function as previously described for similar elements in other configurations.

[0067] The dual-chamber mold sensor configuration 500 may include a cavity environment sensor 518 configured to measure environmental conditions within a first cavity 503. The cavity environment sensor 518 may be electrically connected to a control device 116. The cavity environment sensor 518 may include a temperature sensor, a humidity sensor, a pressure sensor, and / or a gas sensor. The cavity environment sensor 518 may be monitored at periodic intervals to determine the condition status within the first cavity 503. The dual-chamber mold sensor configuration 500 may also include a similar environment sensor in a second cavity 505.

[0068] The dual-chamber mold sensor configuration 500 provides separate chambers for mold growth and elimination. The advantage of the dual-chamber mold sensor configuration 500 is that the sensor can be used continuously for mold sensing. A single-chamber configuration grows and eliminates mold in the same chamber, preventing the initiation of new samples during the mold elimination phase. In some configurations, the mold sensor can utilize more than two chambers. Multi-chamber mold sensor configurations can also be used. For example, different chambers can be configured to operate for different environmental parameters to create growth environments for different types of mold.

[0069] A typical operation of the dual-chamber mold sensor configuration 500 involves exposing a portion of the growth surface 512 to the first chamber 503. An air inlet port 504 can be opened for a predetermined amount of time at a predetermined time and then closed. A control device 116 can operate a thermal control element 520 and monitor the chamber environment sensor 518 to create an environment conducive to mold growth. The control device 116 can monitor signals from sensing devices 510 / 511 to determine the presence of mold. Upon completion of a measurement cycle, the control device 116 can activate a surface replacement mechanism 514 to move the growth surface 512, causing the exposed portion in the first chamber 503 to move to the second chamber 505. A new active growth surface can then be moved into the first chamber 503 to initiate a new measurement cycle.

[0070] The control device 116 can then operate the mold inhibitor 508 to eliminate mold on the growth surface 512. In a configuration where a mold sensing device (e.g., 510B / 511B) is provided in the second chamber 505, the control device 116 can monitor the corresponding signal to look for signs of mold elimination.

[0071] Figure 6 A first single cavity with an externally exposed configuration 600 is depicted. The single cavity / external exposure configuration 600 may include a single cavity configured to grow and eliminate mold. The single cavity / external exposure configuration 600 may include a housing 602 defining a cavity 603. The single cavity / external exposure configuration 600 also includes a growth surface 612. The growth surface 612 may be configured to expose an airflow 606 to the outside of the cavity 603.

[0072] The single-cavity / external exposure configuration 600 also includes a surface replacement mechanism 614 configured to move the growth surface 612 to different locations. An exposed portion 630 of the growth surface 612 can be exposed to an airflow 606 outside the cavity 603. The exposed portion 630 can be subjected to the airflow 606 for a predetermined amount of time to collect mold spores present in the airflow 606. The surface replacement mechanism 614 can be actuated to move the exposed portion 630 into the cavity 603. Thus, an additional, previously unexposed portion of the growth surface 612 can be positioned as the exposed portion 630. The surface replacement mechanism 614 is described in further detail herein.

[0073] The single-cavity / external-exposed configuration 600 may include a mold sensing device 610 configured to sense mold growing on a growth surface 612. The placement of the sensing device 610 may depend on the type of sensing performed. The sensing device 610 may use various technologies. The sensing device 610 may be electrically connected to a control device 116. The sensing device 610 may be contained within a single module coupled to a housing 602. Various configurations of the sensing device 610 are disclosed herein. The single-cavity / external-exposed configuration 600 may include a sensor receiving module 611. The sensor receiving module 611 may exist in a configuration in which the sensing device 610 is configured as a source. The sensor receiving module 611 may be positioned below the portion of the growth surface 612 within a cavity 603.

[0074] The single-chamber / externally exposed configuration 600 may include a mold suppressor 608 configured to eliminate mold in the chamber 603. The mold suppressor 608 may be mounted on the side or top of the housing 602 (depicted as being on the top). The mold suppressor 608 may function as previously described herein. Furthermore, as previously described herein, the mold suppressor 608 may be integrated with at least a portion of the mold sensing device 610.

[0075] The first single-cavity / external-exposed configuration 600 may include a thermal control element 620 configured to alter the temperature within the cavity 603 to promote mold growth. Additional thermal control elements may also be embedded above, within, or below the growth surface 612. The thermal control element 620 may be a thermoelectric element electrically driven by a control device 116. The single-cavity / external-exposed configuration 600 may include a cavity environment sensor 618 configured to measure environmental conditions within the cavity. The thermal control element 620 may operate as described herein.

[0076] The first single cavity with external exposure configuration 600 is partially characterized by the trajectory of the growth surface 612. As depicted, the growth surface 612 in cavity 603 is oriented at a ninety-degree angle relative to the exposed growth surface 630. The angle is not limited to ninety degrees. The first single cavity with external exposure configuration 600 allows for mold measurement while another air sample is exposed to airflow 606.

[0077] Figure 7 A second single-chamber configuration with an external exposure configuration 700 is depicted. The single-chamber / external exposure configuration 700 may include a single chamber configured to grow and eliminate mold. The single-chamber / external exposure configuration 700 may include a housing 702 defining a chamber 703. The single-chamber / external exposure configuration 700 also includes a movable growth surface 712. The movable growth surface 712 may be configured to expose an airflow 706 to the outside of the chamber 703.

[0078] The single-cavity / external exposure configuration 700 also includes a surface replacement mechanism 714 configured to move the growth surface 712 to different locations. An exposed portion 730 of the growth surface 712 can be exposed to an airflow 706. The exposed portion 730 can be subjected to the airflow 706 for a predetermined amount of time to collect mold spores present in the airflow 706. The surface replacement mechanism 714 can be actuated to move the exposed portion 730 into a cavity 703. Thus, another portion of the growth surface 712 can be positioned as the exposed portion 730. The surface replacement mechanism 714 is described in further detail herein.

[0079] The single-cavity / external-exposed configuration 700 may include a mold sensing device 710 configured to sense mold growing on a growth surface 712. The placement of the sensing device 710 may depend on the type of sensing performed. The sensing device 710 may use various technologies. The sensing device 710 may be electrically connected to a control device 116. The sensing device 710 may be contained within a single module coupled to a housing 702. Various configurations of the sensing device 710 are disclosed herein. The single-cavity / external-exposed configuration 700 may include a sensor receiving module 711. The sensor receiving module 711 may be present in a configuration where the sensing device 710 acts as a source. The sensor receiving module 711 may be positioned within a cavity 703 below the growth surface 712.

[0080] The single-chamber / externally exposed configuration 700 may include a mold suppressor 708 configured to eliminate mold. The mold suppressor 708 may be mounted on the side or top of the housing 702 (depicted as being on the top). The mold suppressor 708 may be configured to eliminate mold in the chamber 703. The mold suppressor 708 may function as previously described herein. Furthermore, as previously described herein, the mold suppressor 708 may be integrated with at least a portion of the mold sensing device 710.

[0081] The first single-cavity / external-exposed configuration 700 may include a thermal control element 720 configured to alter the temperature within the cavity 703 to promote mold growth. Additional thermal control elements may be embedded above, within, or below the growth surface 712. The thermal control element 720 may be a thermoelectric element electrically driven by a control device 117. The single-cavity / external-exposed configuration 700 may include a cavity environment sensor 718 configured to measure environmental conditions within the cavity.

[0082] The second single cavity with external exposure configuration 700 may be characterized in part by the trajectory of the growth surface 712. As depicted, the growth surface 712 within the cavity 703 is oriented to be coplanar with respect to the exposed growth surface 730. The second single cavity with external exposure configuration 700 can be mounted at any angle relative to the airflow 706. The sensor can be mounted such that air impinges on the exposed growth surface 730 at a predetermined angle.

[0083] The mold sensor configuration disclosed herein can utilize a surface replacement mechanism configured to replace a portion of the growth surface within a detection chamber. Additionally, the surface replacement mechanism can be configured to move an exposed growth surface into the detection chamber. The growth surface or medium can be configured in various ways. The growth medium can be a membrane or strip coated to create a sticky or viscous surface. A sticky surface helps attract particles such as mold spores. Furthermore, the surface of the membrane or strip can be coated with nutrients for mold growth. The surface of the membrane or strip can be coated with an antimicrobial coating to prevent bacterial growth.

[0084] Different types of mold may prefer different nutrients for growth. Growth media can be configured to encourage the growth of different types of mold. Figure 8 Possible configurations of the growth medium 800 are depicted. The growth medium 800 may include a matrix material 812. For example, the matrix material 812 may be a sheet, membrane, or strip. The matrix material 812 may be made of plastic, fabric, or other materials. In various configurations, the matrix material 812 may be formed as a strip, roller, or disc. Multiple test sections 802 may be defined on the matrix material 812. The test sections 802 may be defined as areas or surfaces of the growth medium 800 that can be exposed within the cavity of the mold sensor. The test sections 802 may be characterized by a width 816 and a length 814. The width 816 and length 814 may correspond to the size of the cavity or the size of the opening for exposing the test sections 802 within the cavity. The test sections 802 may be continuously repeated on the matrix material 812. During operation of the mold sensor, the test sections 802 may be exposed to air and processed through measurement cycles. The remaining test sections defined on the matrix material 812 may be enclosed by a surface replacement mechanism.

[0085] Test section 802 can be divided into multiple strips. For example, a first strip 804, a second strip 806, a third strip 808, and a fourth strip 810 can be defined on test section 802. Each strip can have a coating that favors the growth of different types of mold. For example, the first strip 804 may include a first nutrient coating that favors the growth of a first type of mold. The second strip 806 may include a second nutrient coating that favors the growth of a second type of mold. The third strip 808 may include a third nutrient coating that favors the growth of a third type of mold. The fourth strip 810 may include a fourth nutrient coating that favors the growth of a fourth type of mold. Within each strip, different environmental conditions (e.g., temperature) can be applied during the measurement cycle by operating a thermal control element. Within each strip, different environmental sensors (e.g., temperature, humidity, pH) can be embedded above, in, or below the strip to monitor conditions that promote mold growth. Sensor information can be used to calculate the concentration of mold spores in the air.

[0086] The segmentation of test section 802 allows the mold sensor to effectively detect the presence of different types of mold. Furthermore, different combinations of strips can be generated depending on the types of mold expected to be present in the environment at the time of testing. Test sections with a single nutrient coating may not be effective in detecting all types of mold. Another advantage of the strips is that the mold sensor can provide a more detailed report on the types of mold present. By sensing the presence and / or concentration of mold in each strip, a more detailed report can be provided.

[0087] Figure 9 Another possible configuration of the growth medium 900 is depicted. The growth medium 900 may include alternating growth regions defined on a substrate. The growth medium 900 may include a first growth region 902. Adjacent to the first growth region 902 may be a non-growth region 904. Adjacent to the non-growth region 904 may be a second growth region 906. The pattern of growth regions and non-growth regions may be repeated along the entire length of the growth medium 900. The non-growth region 904 may be a region configured to prevent mold growth (e.g., uncoated or having a coating with a high pH value). The non-growth region 904 may be a region that is not sticky or tacky. The non-growth region 904 may be configured to provide a buffer between the first growth region 902 and the second growth region 906. Each region may be characterized by a width 910 and a length 908. The width 910 and length 908 may correspond to the size of a cavity or the size of an opening for exposing the growth region 902 within the cavity. The size of each alternating region may be similarly defined.

[0088] Alternating growth medium configuration 900 in which the air-exposed area is located outside the cavity can be useful. In such a configuration, continuous mold detection may not be required. The non-growth area 904 can be positioned in the air-exposed zone without concern about mold spores adhering to the surface. When ready to perform a measurement cycle, the growth medium 900 can be advanced via a surface-changing mechanism to expose the second growth area 906 to air before it is advanced into the cavity. While the second growth area 906 is exposed to air, the non-growth area 904 can be inside the cavity. Note that the first growth area 902 and the second growth area 906 may include, as referenced... Figure 8 The described item.

[0089] Figure 10 Alternative configurations of the growth medium 1000 are depicted. The growth medium 1000 may include a matrix material 1004. For example, the matrix material 1004 may be a sheet, membrane, or strip. The matrix material 1004 may be made of plastic, fabric, or other materials. In various configurations, the matrix material 1004 may be formed as a strip, roller, or disc. A plurality of test sections 1002 may be defined on the matrix material 1004. The test sections 1002 may be defined as areas or surfaces of the growth medium 1000 that can be exposed within the cavity of the mold sensor. The test sections 1002 may be characterized by a width 1018 and a length 1016. The width 1018 and the length 1016 may correspond to the size of the cavity or the size of the opening for exposing the test sections 1002 within the cavity. The test sections 1002 may be continuously repeated on the matrix material 1004. During operation of the mold sensor, the test sections 1002 may be exposed to air and processed through measurement cycles. The remaining test section, confined to the matrix material 1004, can be enclosed by the surface replacement mechanism.

[0090] Test section 1002 may define one or more growth zones. For example, it may define a first growth zone 1006, a second growth zone 1008, a third growth zone 1010, and a fourth growth zone 1012. Each growth zone may have a coating or treatment that promotes the growth of different types of mold. For example, the first growth zone 1006 may be treated with a first nutrient coating that promotes the growth of a first type of mold. The second growth zone 1008 may be treated with a second nutrient coating that promotes the growth of a second type of mold. The third growth zone 1010 may be treated with a third nutrient coating that promotes the growth of a third type of mold. The fourth growth zone 1012 may be treated with a fourth nutrient coating that promotes the growth of a fourth type of mold. Test section 1002 may further include a non-growth region 1014. The non-growth region 1014 may be defined as the area between the growth zones within test section 1002. The non-growth region 1014 may be an area of ​​the matrix material 1004 that has not been treated to promote mold growth. The growth zones are depicted as square, but may have different shapes. For example, the growth zone can be circular or rectangular. Furthermore, although the pattern is shown as generally symmetrical, it can also be asymmetrical. Test sections 1002 can be continuously repeated on the substrate material 1004. During operation of the mold sensor, test sections 1002 can be exposed to air and processed through measurement cycles. Remaining test sections defined on the substrate material 1004 can be enclosed by a surface replacement mechanism.

[0091] Test zone 1002 can be defined as a repeating pattern on matrix material 1004. The pattern can be repeated at a distance approximately equal to the length 1016 of test zone 1002. Each growth zone can favor the growth of a specific type of mold. The division of test zone 1002 allows the sensor to effectively detect the presence of different types of mold. Furthermore, different combinations of growth zones can be generated depending on the type of mold expected to be present in the environment at the time of testing. Another advantage of different growth zones is that the mold sensor can provide a more detailed report on the types of mold present. By sensing the presence and / or concentration of mold in each growth zone, a more detailed report can be provided. Non-growth area 1014 can be useful for sensor calibration. Since mold is not expected to grow in non-growth area 1014, the mold sensor can utilize this area to calibrate the sensing device.

[0092] Features of each growth surface configuration can be combined to define additional growth surfaces. For example, Figure 8 and Figure 10 The configuration may include alternating zones that allow and prevent mold growth. The specific features selected for the growth surface may depend on the mold sensor configuration. Although the growth surface configuration is depicted as stripes, it can be formed on the surface of the roller or disc in a corresponding manner.

[0093] Mold sensor configurations may include a surface replacement mechanism. In some configurations, the surface replacement mechanism may be configured as a disposable cartridge capable of being mounted on or removed from the mold sensor. The disposable surface replacement mechanism may include a fixed growth surface that is exposed within the cavity when the mechanism is attached to the mold sensor housing.

[0094] The surface replacement mechanism can also be configured to advance the growth surface relative to the cavity. The surface replacement mechanism can be electrically controlled by the control device 116. The surface replacement mechanism can be configured to store a predetermined amount of growth surface that can be fed into the cavity for use in a measurement cycle. The surface replacement mechanism can also be configured to store used growth surfaces that have already been processed through a measurement cycle.

[0095] Figure 11 A side view depicts a possible configuration of a belt-based surface replacement mechanism 1100 configured to advance a belt, membrane, or diaphragm. The belt-based surface replacement mechanism 1100 may include a belt housing 1104. The belt housing 1104 may define a used belt cavity 1114 and an unused belt cavity 1116. The housing 1104 may include a partition wall 1118 between the used belt cavity 1114 and the unused belt cavity 1116. The belt housing 1104 may be configured to connect to a growth chamber housing 1102 defining a growth chamber 1103.

[0096] The belt-based surface changing mechanism 1100 may include a drum or spool 1108 that rotates about a shaft. The belt-based surface changing mechanism 1100 may include a driven drum or spool 1106 driven by an electrically driven unit. The electrically driven unit may be an electric motor with a shaft connected to the shaft of the driven spool 1106. In some configurations, the electrically driven unit may include an electric motor coupled to the driven spool 1106 via one or more gears. In some configurations, a manual crank assembly may be attached to the driven spool 1106 to allow manual belt advance. The belt-based surface may be packaged to maintain the belt's initial parameters (e.g., moisture level) until use. For example, the changing mechanism 1100 may include a liner or encapsulation that prevents moisture from evaporating from the belt-based surface before use. The encapsulation also prevents contamination of the belt-based surface before use.

[0097] An unused strip 1110 or membrane of a certain length can be wound around the reel 1108. The unused strip / membrane 1110 can be configured as a growth surface as previously described herein. The unused strip 1110 can be defined as the portion of the strip that has not yet been advanced into the growth chamber 1103. One end of the unused strip 1110 can be attached to the reel 1108. The strip may further include an activity testing surface 1122, which is defined as the portion of the strip positioned within the growth chamber 1103. The strip may further include a used strip 1112 or membrane of a certain length, which can be defined as the portion of the strip that has been processed in the growth chamber 1103 through a measurement cycle. One end of the used strip 1112 can be attached to the driven reel 1106.

[0098] The housing 1104 may define a separation surface 1120 configured to separate unused tape 1110 and used tape 1112 from the growth chamber 1103. The separation surface 1120 may define a groove or opening through which the tape can pass. The tape-based surface replacement mechanism 1100 may further include a first guide roller 1124 configured to guide unused tape 1110 into an unused tape cavity 1116 into the growth chamber 1103. The tape-based surface replacement mechanism 1100 may further include a second guide roller 1126 configured to guide tape (activity test surface 1122) into a used tape cavity 1114. The first guide roller 1124 and the second guide roller 1126 may be coupled to the separation surface 1120 via a bracket. In some configurations, the support may include a flexible component configured to apply a certain amount of pressure to press the rollers against the bottom surface of the mold sensor housing 1102 to help seal the cavity 1103 relative to external air and / or improve electrical contact between the belt and the control device 116. The lengths of the first guide roller 1124 and the second guide roller 1126 may be defined by the width of the belt.

[0099] Unused tapes (such as...) can be used Figure 8 to Figure 10The tape (as described) is wound or coiled onto a reel 1108. The tape can be guided along a path via a first guide roller 1124 and a second guide roller 1126 so that the ends can be attached to the driven reel 1106. A mold measurement cycle can be performed using the active test surface 1122 exposed within the growth chamber 1103. After a measurement cycle is completed, the driven reel 1108 can be rotated via an electrically driven mechanism. The driven reel 1108 can be driven to advance a portion of the tape serving as the active test surface 1122 into the used tape cavity 1114. By rotating the driven reel 1108, the tape is advanced and wound around the driven reel 1106. Rotation causes the unused tape 1110 to unwind from the reel 1108 and advance into the growth chamber 1103 as a new active test surface 1122. The total length of the tape can be configured to perform a predetermined number of measurements.

[0100] In some configurations, the used band cavity 1114 may contain encapsulation and / or chemicals to inhibit mold growth. This prevents mold growth in the unused band cavity 1116 and ensures that any mold growing during measurement is further eliminated. In some configurations, the unused band cavity 1116 may contain encapsulation and / or chemicals to preserve the unused band 1110 for later use. For example, the encapsulation and / or chemicals may be configured to prevent the unused band 1110 from drying out or becoming non-sticky, which could negatively impact measurement validity.

[0101] The belt-based surface replacement mechanism 1100 can be implemented as a cartridge containing a belt or diaphragm of a predetermined length. The cartridge can be user-replaceable. The cartridge can be discarded after use. In some configurations, the belt or diaphragm can be replaced within the cartridge.

[0102] In some configurations, the strip or growth surface may include notches along one or both sides of the strip. For example, notches may be positioned to identify each test segment of the strip. An optical sensor may be positioned to provide a signal when a notch appears between the source and receiver. The control device 116 may use this signal to properly position the strip so that the test segment is properly exposed in the cavity. The sensor may also be used to measure the amount of strip used. For example, an optical sensor may be used to count the notches. Knowing the distance between the notches and / or the total number of notches on the strip, the control device 116 may calculate the amount of strip used and / or the amount of strip remaining and communicate these values ​​to the user. The control device 116 may calculate the number of remaining measurement cycles based on the amount of strip remaining.

[0103] Figure 12A and Figure 12BDifferent views of a roller-based surface replacement mechanism 1200 are depicted. The roller-based surface replacement mechanism 1200 may include a roller 1204. The roller 1204 may be cylindrical. In some configurations, the roller 1204 may be solid. In some configurations, the roller 1204 may be hollow, having structural elements at each end for support and to facilitate rotation of the roller 1204. The roller 1204 may be rotated by an electric motor 1206 having a shaft coupled to a central axis of the roller 1204. The roller 1204 may include a growth surface 1208, which may be defined as an area exposed within the growth chamber of the mold sensor housing 1202. The roller 1204 may include an unexposed surface 1203, which may be defined as the surface of the roller 1204 not exposed within the growth chamber of the mold sensor housing 1202. The roller-based surface replacement mechanism 1200 may include a housing (not shown) configured to attach to the mold sensor housing 1202 and support the electric motor 1206. The housing may further prevent the roller surface from being exposed to outside air.

[0104] The roller 1204 can be divided into multiple surface segments 1210. The surface segments 1210 can be configured to fit within the growth chamber of the mold sensor housing 1202. The multiple surface segments 1210 can define the number of measurement cycles that can be performed. As previously described with respect to the band configuration, the surface segments 1210 can be divided into strips or subdivisions.

[0105] Roller 1204 can be a replaceable component, allowing a new roller 1204 to be installed when all surface segments 1210 have been used. Old rollers can be discarded or recycled. In some configurations, the roller surface can be a replaceable sheet or substrate. Used roller surface sheets can be replaced with new roller surface sheets.

[0106] The roller-based surface replacement mechanism 1200 can be rotated by the operation of an electric motor 1206. Measurements can be performed using the growth surface 1208 exposed in the cavity of the mold sensor housing 1202. After a measurement cycle is completed, the electric motor 1206 can be actuated to advance the roller 1204 to place the next surface segment 1210 into the growth cavity defined by the sensor housing 1202. For example, in Figure 12BIn this configuration, the currently exposed segment within the mold sensor housing 1202 is the growth surface 1208. Assuming clockwise rotation, the surface segment 1210A can be advanced into the mold sensor housing 1202. The control device 116 can be configured to actuate the electric motor 1206 for a predetermined duration calibrated to rotate the roller 1204 by an amount corresponding to one of the surface segments 1210. In other configurations, sensors such as potentiometers or encoders can be used as feedback signals to measure the amount of rotation and drive the electric motor 1206 accordingly. In some configurations, a manual crank assembly can be attached to the shaft of the roller 1204 to allow manual advancement of the roller 1204.

[0107] Figure 13A A disk-based surface replacement mechanism 1300 is depicted for advancing a disk 1308 to position a growth surface 1304 within a cavity formed by a sensor housing 1302. The disk-based surface replacement mechanism 1300 may include a disk housing 1306 configured to enclose the disk 1308. The disk 1308 may be configured to rotate about a central axis. An electric motor 1310 may be coupled to the disk housing 1306. The shaft of the electric motor 1310 may be coupled to the disk 1308 to rotate the disk 1308.

[0108] In some configurations, the entire surface of disk 1308 can be treated to promote mold growth. Disk 1308 can also be configured as follows: Figure 13B As depicted herein, disk 1308 may define a growth region 1312, which, as previously described herein, is treated to promote mold growth. Disk 1308 may include a non-growth region 1314 that separates the growth region 1312. The non-growth region 1314 may prevent mold growth from spreading to the exterior of sensor housing 1302. The growth region 1312 may be divided into zones treated differently to promote the growth of different types of mold, as previously described herein.

[0109] The disk-based surface changing mechanism 1300 can position the disk 1308 by operating an electric motor 1310. Measurements can be performed using the growth surface 1304 exposed in the growth housing 1302. After a measurement cycle is completed, the electric motor 1310 can be actuated to rotate the disk 1308 to the next growth region 1312. The control device 116 can be configured to actuate the electric motor 1310 for a predetermined duration calibrated to rotate the disk 1308 by an amount corresponding to one of the growth regions 1312. In other configurations, sensors such as potentiometers or encoders can be used as feedback signals to measure the amount of rotation and drive the electric motor 1310 accordingly.

[0110] The mold sensor configuration includes a sensing device configured to detect mold. The sensor can be electrically connected to a control device 116. Various sensor technologies are suitable for detecting mold growth within the housing. Types of sensors that can be used include optical sensors, chemical sensors, biosensors, mechanical sensors, audio sensors, and electrical sensors. The sensor can be configured to measure visual, mechanical, electrical, biological, and / or chemical properties associated with mold growth. The mold sensor configuration may include different types of sensors to detect the presence of mold. Some sensor technologies are better suited for detecting mold concentration, while others are suitable for detecting the presence of mold growth.

[0111] refer to Figure 1 As an example, the sensing device 110 can be implemented in a variety of ways. Various configurations can rely on different sensor technologies. The type of sensing device can be a chemical / gas sensor, an electrical sensor, a biosensor, an optical sensor, a mechanical sensor, or an audio sensor. The type of sensing device can depend on the type of property associated with the presence and / or concentration of the mold to be detected. The sensing device 110 can be configured to detect mold by measuring optical, electrical, biological, mechanical, and / or chemical properties. Different properties can be detected by different types of sensors. For example, some chemical properties, such as pH, can be detected by optical and / or electrical sensors. Mechanical properties can be detected by electrical and / or optical sensors. The characteristics of the sensing device may lie in the physical property it attempts to measure and how it measures that physical property.

[0112] During their metabolism, mold spores release volatile organic compounds (mVOCs) as byproducts of microbial activity. Mold spores can also further release mycotoxins as final products during secondary metabolism. Mold growth can be detected by sensing these chemicals throughout the mold's life cycle. Sensing device 110 can be a chemical sensor configured to sense changes in mVOCs or other chemicals associated with mold growth.

[0113] Molds can release alcohols, aldehydes, hydrocarbons, acids, ethers, esters, ketones, terpenes, sulfur, nitrogen, and other compounds. The type of chemical substance released can depend on the type of mold that is growing. Sensing device 110 can be any type of chemical sensor capable of detecting these compounds. For example, sensing device 110 can be an electrochemical gas sensor or a metal oxide gas sensor configured to detect these compounds. In some configurations, sensing device 110 may include multiple chemical sensors, each configured to measure a specific chemical compound.

[0114] For example, sensing device 110 may be a solid-state chemical resistive sensor that changes its resistance in response to exposure to certain chemical compounds. Control device 116 may be programmed to estimate gas concentration by measuring the resistance of the chemical resistive sensor. Control device 116 may include a voltage divider network and an analog-to-digital (A2D) converter to measure the voltage across the chemical resistive sensor. Control device 116 may store one or more tables mapping voltage and / or resistance values ​​to gas concentrations. Control device 116 may be configured to generate a warning or alarm in response to a gas sensor signal indicating that the mold concentration exceeds a threshold. For example, a warning may be generated when the mold concentration exceeds a reference concentration by a predetermined amount.

[0115] The control device 116 can store data that correlates the measurement results of the chemical sensor with mold growth. This data can be obtained experimentally from tests. The stored data can indicate the type and level of gases during different stages of mold growth. Additionally, the stored data can include gas profiles for different types of mold. The control device 116 can sample the chemical / gas sensor over time and compare the results with the stored data to further identify the type of mold, its concentration, or its growth stage. Furthermore, the initial concentration of mold before growth can be determined by back-calculating and estimating the growth rate based on data that can be obtained experimentally from tests.

[0116] Mold growth can also alter the properties of the growth medium. Common mold types, such as those in the genera *Aspergillus* and *Penicillium*, cause the pH of the growth surface 112 to shift towards acidity. Sensing device 110 can be configured to sense pH changes caused by mold growth. A first technique for detecting the pH of the growth surface 112 includes adding a universal pH indicator solution to the growth surface 112. The universal pH indicator can change color with changes in the pH of the growth surface 112. Nutrient treatment of the growth surface 112 may include the universal pH indicator solution. Sensing device 110 can be configured to detect color changes of the growth surface 112 associated with pH changes. In some configurations, sensing device 110 may be a camera providing a color image of the growth surface 112. For example, the camera may be a charge-coupled device (CCD) configured to provide a digital image of the growth surface 112. Control device 116 can be configured to implement image processing algorithms to determine the color changes of the growth surface 112. The sensing device 110 may be an optical sensing device configured to output electromagnetic waves (e.g., light) and receive reflected waves from the growth surface 112.

[0117] Color changes caused by pH variations can be detected by changes in optical properties such as absorption, reflection, scattering, color, and / or fluorescence. These properties can be detected using optical sensing systems, imaging systems, or camera systems. For example, an optical sensing system can be configured to provide data on the color of mold growing on a surface. Control device 116 can be programmed to process optical data including color information to identify the color of mold growth or the substrate. The color information can indicate mold growth on the substrate. For example, a change in the pH of the substrate can be identified by a change from a baseline color to a predetermined color. The predetermined color indicating mold growth can be determined experimentally.

[0118] For example, Figure 2 As shown, the sensing system may include a sensor source module 210 and a sensor receiver module 212. Although Figure 2 The sensor receiving module 212 is depicted on the opposite side of the growth surface 112 relative to the sensor source module 210, but the sensor receiving module 212 may be placed on the same side of the growth surface 112 as the sensor source module 210.

[0119] Sensor source module 210 can be a light source (or an electromagnetic wave source), and sensor receiving module 212 can be a photodetector. For example, a photodetector can be placed below growth surface 112. The light source can be activated to generate electromagnetic waves in cavity 103 to illuminate / shine growth surface 112. The electromagnetic waves passing through growth surface 112 can vary in wavelength based on the color of growth surface 112. The photodetector (sensor receiving module 212) can receive the electromagnetic waves and generate an electrical signal. The photodetector can be configured to detect different wavelengths of electromagnetic waves so that different colors can be detected. In some configurations, multiple photodetectors (e.g., a photodetector array) can be implemented, where each photodetector is tuned for a given wavelength range.

[0120] An optical sensing system, imaging system, or camera system may include both a sensor source module 210 (e.g., an optical source, LED, laser) and a sensor receiving module 212 (e.g., an optical sensor, photodiode, photodetector, imager, camera). In some configurations, the optical source may be a source configured to illuminate a large area or the entire area of ​​the growth surface 112 within the cavity 103, illuminating a diverging beam. The optical source may be a light source combined with a beam diverging component that diverges the beam to illuminate a large area or the entire area of ​​the growth surface 112 within the cavity 103. The optical sensor may be an array of photodiodes or a camera configured to receive electromagnetic waves reflected or scattered from and / or transmitted through the growth surface 112. In this configuration, changes in the optical properties of the entire growth surface 112 can be collected simultaneously. The sensor source module 210 may be driven by one or more input signals generated by the control device 116. The sensor receiving module 212 may provide optical data indicative of one or more optical properties to the control device 116. The optical data may be provided as one or more electrical signals. In some examples, optical data may include digital data such as image or pixel data / patterns. The specific optical data provided by sensor receiving module 212 may depend on the type of sensor used.

[0121] In another configuration, the optical source can be a laser beam with high directionality and a small divergence angle, and the optical sensor can be a single photodiode or an array of photodiodes or optical sensors. The optical source can be driven by a driver or electric motor to sweep around the entire portion or most of the growth surface 112, and the single photodiode can also be driven by the same or separate drivers or electric motors to move accordingly with the source. This configuration can be useful for configurations in which different mold growth zones are defined. The presence of mold can be scanned for each zone. The zones in which mold is detected can be stored, and the type of mold present can be indicated. The array of photodiodes or optical sensors may or may not need to be moved.

[0122] The optical source can be a single-wavelength source or a source that outputs multiple wavelengths (e.g., a wide-bandwidth source), and the optical sensor can be a narrow-bandwidth sensor or a wide-bandwidth sensor accordingly. Depending on the specific growth surface 112 in cavity 103 and the growing mycelium, changes in the optical properties of the growth surface 112 can be detected in the ultraviolet (UV), visible, or infrared (IR) wavelength range. If the optical source is a multi-wavelength or wide-bandwidth source, an optical spectrometer can also be used as an optical sensor to detect changes in optical properties within the spectral range. The spectral information can also include mVOC or other information, and both changes in the optical properties of the growth surface 112 and changes in mVOC or other information can be detected in this way.

[0123] The optical source can also be an array of individual monochromatic optical lasers. For example, ultraviolet lasers can induce fluorescence when irradiated with mold spores. By configuring two or more ultraviolet lasers as optical sources and an optical spectrometer as an optical sensor, the fluorescence of mold spores can be detected. Mold spores can be detected by the characteristics of their fluorescence spectra.

[0124] Changes in absorption, reflection, and / or scattering induced by mold growth can be detected directly by the light intensity received by a photodetector. A filter with photodiodes (or arrays) and RGB pixels (or an array of RGB pixels) can be used to determine color changes induced by mold growth. Control device 116 may include algorithms to detect changes in intensity and / or color.

[0125] In addition to growing within the plane of the growth surface 112, the mold can also grow outside the plane. The vertical depth of the mold can increase with increasing growth time. An optical sensor can be configured as a laser rangefinder (e.g., based on time-of-flight, frequency-modulated continuous wave, or structured light technology) to detect the out-of-plane depth of the growing mold. The control device 116 can be configured to periodically measure the rangefinder to monitor the vertical growth of the mold. The control device 116 can calculate the rate of change of vertical growth.

[0126] The optical properties of the growth surface can be calibrated with a reference and saved before exposure to mold or mold growth, for comparison with optical properties observed after exposure and growth. Mold growth affects the optical properties within the cavity. By comparing the measurements with baseline results, control device 116 can determine the presence and initial concentration of mold.

[0127] Another technique for detecting the pH of the growth medium can be the use of a pH meter, such as a potentiometric pH meter. The growth medium may include pre-printed electrodes for the potentiometric sensor. Nutrients may be coated on the surface above the electrodes to promote mold growth. As the pH changes, the resistance measured between the electrodes can change. The pH level can be determined by measuring the resistance between the electrodes. The control device 116 can be configured to receive electrical signals and estimate the resistance. Inductive sensing is described in more detail herein.

[0128] Another technique for detecting pH can be a system that controls the pH of a small area in the growth medium. Figure 19A configuration for controlling the pH of a surface is depicted. The active region of the growth surface 1902 may be covered with a hydrogel or similar coating that allows diffusion and promotes mold growth. A pH sensor may include a sensing electrode 1908 integrated with the growth surface 1902. The sensing electrode 1908 may have a pH-proportional potential response relative to a reference electrode 1912. A current source may supply current to one or more working electrodes (e.g., a first working electrode 1904 and a second working electrode 1906), which then flows through one or more counter electrodes 1910. A control device 116 may control the current to maintain the sensing electrode 1908 at a reference pH level 1916, which may be a constant pH value. This can be used to create a predetermined pH environment to promote the growth of certain types of mold. This also provides a feedback signal to provide a measurement of the amount of feedback that must be applied to maintain the pH at a constant level. An amplifier 1914 may receive input from the sensing electrode 1908 and the reference electrode 1912. The output of the amplifier 1914 may be electrically connected to the control device 116. When the pH level of the growth surface 1902 changes due to mold growth, the amount of current supplied to the working electrodes 1904 and 1906 can vary. As a result, the voltage measured at the sensing electrode 1908 changes.

[0129] Applicable Figure 19 The configuration creates a specific pH environment to promote the growth of certain types of mold. The feedback signal from the sensing electrode 1908 is proportional to the amount of current that must be applied to maintain a constant pH. For example, if no mold is growing, the pH level should remain constant without current changes. As mold grows on the surface, pH level changes cause the control device 116 to apply more current to rebalance the pH level. Mold growth can be detected by monitoring changes in the feedback signal. If the feedback signal exceeds a predetermined threshold, mold may be present. The growth surface can be configured as shown in... Figure 19 Multiple zones are configured as shown. Each zone can be used to create a different pH environment for mold growth. Additionally, different zones can be configured to be in different temperature zones (e.g., by operating a thermal control element associated with each zone). In this way, the environment can be configured to effectively grow different types of mold.

[0130] The growth of mold on the growth surface 112 can alter the electrical properties of the surface. For example, the impedance, capacitance, frequency response, and / or other electrical properties of the growth surface 112 can be changed due to mold growth. As the mold feeds on nutrients in the growth surface 112 and its roots (mycelium) spread to obtain more nutrients, the properties of the growth surface 112 can change due to mold growth. Both changes in the growth surface 112 and the invasion of the mycelium cause changes in impedance, capacitance, frequency response, and other electrical properties.

[0131] Figure 14 A sensing device configured to measure electrical properties is depicted. The electrical sensing configuration 1400 may include a first electrical contact 1404 and a second electrical contact 1406 coupled to a growth surface 1408. The first electrical contact 1404 and the second electrical contact 1406 may be adhered to or deposited on the growth surface 1408. In some configurations, the substrate of the growth surface 1408 may be a film, and the contacts may be deposited or etched onto the substrate.

[0132] A voltage can be applied between the first electrical contact 1404 and the second electrical contact 1406. This voltage can create an electric field 1412 within the housing 1402 and the growth surface 1408. The first electrical contact 1404 and the second electrical contact 1406 can operate as capacitive sensors. The dielectric between the first electrical contact 1404 and the second electrical contact 1406 can be defined by air, mold 1410, and the growth surface 1408 along with the housing 1402. As the mold 1410 grows on the growth surface 1408 and enters the cavity defined by the housing 1402, the dielectric properties can change. By measuring the dielectric change over time, the system can detect mold growth, mold concentration, and / or mold type. The first electrical contact 1404 and the second electrical contact 1406 can be electrically connected to a control device 116. The control device 116 can be configured to supply voltage to the first electrical contact 1404 and the second electrical contact 1406. The sensing device may include a current sensor to measure the current flowing between the first electrical contact 1404 and the second electrical contact 1406. The control device 116 may be configured to generate an alternating current (AC) voltage waveform having a frequency and amplitude range. By applying a known voltage waveform and measuring the resulting current, the control device 116 can determine the capacitance using basic electrical relationships. The capacitance value can change as the mold 1410 grows and causes changes in the dielectric. The control device 116 may be configured to sweep the frequency to obtain a frequency response of dielectric properties.

[0133] Figure 15A capacitance sensor 1500 is depicted, comprising a plurality of electrical contacts 1504 coupled to or integrated with a growth surface 1502. The electrical contacts 1504 may be arranged in a grid or other pattern. Each electrical contact 1504 may be electrically coupled to a control device 116 (e.g., via a mating electrode grid). As previously described herein, the control device 116 may be configured to measure capacitance across any pair of electrical contacts 1504. The arrangement of the capacitance sensor 1500 allows for the detection of mold growth in different areas of the growth surface 1502. By dividing the growth surface 1502 into smaller zones, mold growth can be determined in less time. The capacitance sensor 1500 is also capable of identifying specific zones on the growth surface 1502 where mold is growing. When different nutrient treatments are configured in different zones of the growth surface 1502 (e.g., Figure 8 and Figure 10 This can be particularly useful. The control device 116 can be configured to apply a voltage between any pair of contacts 1504 and measure the corresponding current. When the capacitance changes by a predetermined amount, the control device 116 can detect mold growth between the pair of contacts.

[0134] Figure 16 Possible configurations of an electrosensitive growth medium 1600 for detecting the electrical properties of a growth surface 1602 are depicted. The growth surface 1602 may include conductive strips capable of being electrically excited to measure electrical properties. A first conductive strip 1604 and a second conductive strip 1606 may be attached to the growth surface 1602. Between the first conductive strip 1604 and the second conductive strip 1606 may be a mold growth region 1608. The mold growth region 1608 may be treated with nutrients to encourage mold growth. Mold growing in the growth region 1608 can cause changes in the electrical properties between the conductive strips. The conductive strips may also be configured perpendicular to... Figure 16 The description is as shown in the figure. Other configurations of the conductive strips are possible (e.g., circular, arc-shaped). The first conductive strip 1604 and the second conductive strip 1606 may include periodic gaps 1605 or openings, such that the measurement results are only affected by the growth surface 1602 within the growth chamber.

[0135] Figure 17A first inductive configuration is depicted, wherein electrical contact with a conductive strip is achieved via a rolling element of a surface-changing mechanism. This inductive configuration can utilize a sensing device mounted on the underside of a growth surface 1602. The surface-changing mechanism may include a first rolling element 1702 and a second rolling element 1704, which contact the inductively sensing growth medium 1600 when the growth surface 1602 is within the cavity 103. One or more of the first rolling element 1702 and the second rolling element 1704 may include conductive contacts surrounding the periphery of the respective rolling element. The conductive contacts may extend around the rolling element such that they can contact the inductively sensing growth medium 1600 at any rotational position of the rolling element. For example, the first rolling element 1702 may include a high-side contact 1706A electrically connected to a control device 116. The first rolling element 1702 may also include a low-side contact 1708A electrically connected to the control device 116. The second rolling element 1704 may include a high-side contact 1706B electrically connected to the control device 116. The second rolling element 1704 may include a low-side contact 1708B electrically connected to the control device 116. A high-side contact 1706 on the rolling element may be configured to align with a first conductive strip 1604 of the inductive growth medium 1600. A low-side contact 1708 on the rolling element may be configured to align with a second conductive strip 1606 of the inductive growth medium 1600. The electrical connection of contacts 1706 and 1708 to the control device 116 may be achieved using a slip ring or similar device.

[0136] As the growth surface 1602 of the inductive growth medium 1600 is advanced, the conductive strip can maintain contact with the contacts of the rolling element. The gap 1605 confines the measurement to the surface within the cavity. In this way, any strip outside the cavity does not affect the measurement. The control device 116 can measure the electrical properties of the inductive growth medium 1600 by energizing the conductive strip. For example, the control device 116 can be programmed to apply a voltage or potential to the high-side contact 1706 and the low-side contact 1708. The voltage can induce a current flow that is proportional to the impedance of the mold growth region 1608. The control device 116 can measure the flowing current and determine the resistance by applying Ohm's law. The control device 116 can supply an AC voltage and sweep a frequency through a predetermined range to further characterize the impedance and / or frequency response of the growth region 1608.

[0137] For a configuration having conductive strips perpendicular to the depicted conductive strips, the rolling elements may be constructed of a conductive material and electrically connected to the control device 116. The conductive strips of the inductively grown medium may be spaced apart at a distance corresponding to the distance between the rolling elements. In this configuration, one rolling element may contact the higher-side conductive strip, and another rolling element may contact the lower-side conductive strip. The conductive strips may further include gaps, and the conductive surfaces of the rolling elements may include corresponding gaps.

[0138] Figure 18A A second inductive configuration 1800 is depicted, which relies on electrodes to interface with conductive strips in the inductive growth medium 1600. The second inductive configuration 1800 may include a first electrode 1806 and a second electrode 1808. The first electrode 1806 and the second electrode 1808 may be constructed of a conductive material and may be electrically connected to a control device 116. The first electrode 1806 may be aligned with a second conductive strip 1606 of the inductive growth medium 1600. The second electrode 1808 may be aligned with a first conductive strip 1604 of the inductive growth medium 1600. The inductive growth medium 1600 may contact a first rolling element 1802 and a second rolling element 1804 associated with a surface replacement mechanism.

[0139] Figure 18B A side view of the second inductive configuration 1800 is depicted, providing further details regarding the second electrode 1808. The second electrode 1808 may be fitted within an electrode housing 1809. The electrode housing 1809 may be sized to partially contain the second electrode 1808 and allow movement of the second electrode 1808 toward and away from the inductive growth medium 1600. A spring mechanism 1810 (or other flexible element) may be positioned within the electrode housing 1809 and below the second electrode 1808. The spring mechanism 1810 provides force to the second electrode 1808 to maintain contact with the surface of the inductive growth medium 1600. The electrode housing 1809 may be coupled to a mounting surface 1812, which may be part of a surface replacement mechanism structure. Other electrodes may be similarly configured. A first rolling element 1802 and a second rolling element 1804 may contact the inductive growth medium 1600 for movement. The first rolling element 1802 and the second rolling element 1804 can also apply sufficient pressure to the inductive strip 1600 to ensure that the cavity is sealed. The first rolling element 1802 and the second rolling element 1804 can be coupled to the mounting surface 1812 via a bracket.

[0140] Control device 116 can be configured to measure baseline impedance characteristics before mold grows on the growth surface. Control device 116 can then monitor changes in impedance characteristics indicative of mold growth. Control device 116 can store data related to the impedance characteristics of different types and concentrations of mold. Control device 116 can compare the measured impedance characteristics with the stored characteristics to identify the type and / or concentration of mold within the cavity.

[0141] The inductive configuration may further include features for enhancing electrical contact between the conductive strip on the growth surface and the sensing element. For example, the inductive configuration may include one or more magnets or electromagnets arranged to magnetically attract the growth surface. The conductive strip may, for example, comprise nickel. The electromagnet may be positioned below the conductive strip near an electrode or rolling element (e.g., near where electrical contact occurs) and is energized when electrical contact is desired. The electromagnet can attract the conductive strip and ensure contact with the electrode or rolling element. This feature is useful when the growth surface is movable, as electrical contact may be lost during movement. Mechanisms for re-establishing the electrical connection between the growth surface and the sensing device ensure reliable performance.

[0142] In some configurations, biological or chemical elements can be used as binders or reactants for sensing purposes to detect molds. These elements can be configured to bind to or react with mold spores. For example, certain antibodies or enzymes bind to certain types of molds, and binding events can be detected using various sensing methods, such as changes in electrical properties. Furthermore, reactions between mold spores and biological or chemical elements can cause the release of chemical compounds. These released compounds can be detected using sensors such as chemical, optical, and electrical sensors. Binding or reaction events can be used to determine the presence of different mold types. Binding or reactants can also be used to collect mold spores prior to the growth stage. Different biological or chemical elements can also be used to promote or inhibit mold growth.

[0143] In some configurations, an audio-based sensing device can be used to detect mold. Growing mold can affect how sound propagates within a cavity. Due to the mechanical properties of its molecular structure, growing mold will absorb and reflect sound waves of certain frequencies. In some configurations, the sensing device may include a source configured to emit sound waves and a receiver configured to convert the sound signal into an electrical signal. The configuration may depend on the type of sound to be measured. In a configuration for measuring sound wave reflection, the source module 210 and the receiver module 212 may be mounted within the cavity (e.g., on the same side of the growth surface). The receiver module 212 receives the sound waves reflected from the growth surface 112. In some configurations, the sensing device may be an ultrasonic transceiver including a source module and a receiver module. In a configuration for measuring sound wave transmission through the growth surface 112, the source module 210 and the receiver module 212 may be mounted on opposite sides of the growth surface 112 (e.g., Figure 2 (As depicted in the illustration). For example, sensor source module 210 may be an ultrasonic loudspeaker, and sensor receiving module 212 may be a microphone configured to convert acoustic signals into electrical signals. Sensor source module 210 may be driven by control device 116. Control device 116 may operate sensor source module 210 to output a frequency sweep within a predetermined frequency range. Control device 116 may receive electrical signals from sensor receiving module 212 and may measure the amplitude of the received acoustic signals. Control device 116 may be configured to estimate the molecular resonance frequencies of mold to determine the specific type of mold that is growing.

[0144] Control device 116 can store previously generated acoustic signature data representing different mold types and concentration levels. Control device 116 can be configured to compare measured acoustic signature data with stored acoustic signature data to identify the type and / or concentration level of mold growing in cavity 103. In some configurations, control device 116 can identify mold growth by changes in acoustic signature data compared to baseline acoustic signature data. Additional sensors (e.g., to measure volume or weight) may be included to provide improved estimates.

[0145] Ultrasonic sensors can also be used to sense out-of-plane mold growth by outputting acoustic pulses and measuring the response time (e.g., the time it takes for sound to travel to a receiver). Greater vertical growth can result in shorter pulse return times. The sensing device may include an ultrasonic transmitter and an ultrasonic receiver to measure the response time. Control device 116 may include circuitry for generating ultrasonic signals and receiving reflected ultrasonic signals. Control device 116 may include circuitry and / or control logic to sense the delay between transmitting the ultrasonic signal and receiving the reflected signal. Control device 116 may be programmed to measure the height of out-of-plane mold growth. The height may be monitored and stored over time. Control device 116 may store data on mold growth patterns for different types of mold. For example, mold growth patterns may be experimentally derived through testing. The mold type may be determined by comparing the measured growth pattern with historical patterns.

[0146] In configurations utilizing audio-based sensing devices, the enclosed volume or cavity can be acoustically / audio-isolated from the outside. For example, the cavity can be coated with a material to minimize acoustic echoes. Additionally, this prevents external noise / acoustic interference with the measurement process within cavity 103. Housing 102 can also be configured to optimize the audio / acoustic properties within cavity 103 to minimize unwanted echoes or reflections. An additional microphone can be attached to the outside of cavity 103 and used to subtract external noise from the measurement signal to improve measurement accuracy (e.g., differential measurements).

[0147] The growth surface can also possess certain mechanical properties (e.g., inertia, mass). When excited by sound waves, the surface can vibrate or oscillate. Vibration can be characterized by the amount of damping. Damping can be characterized as how quickly the amplitude of the vibration or oscillation dissipates after the excitation stops. A thicker mold growth layer can result in greater damping of the growth surface. That is, the vibration of the growth surface will dissipate in less time. An audio sensor source can be used to excite the growth surface with sound waves, thereby causing vibration, which can lead to a change in the response time from transmitter to receiver. A first baseline can be established before exposing the growth surface to outside air, and a second baseline can be established before mold growth. For example, an audio signal can cause a measurable vibration or deflection of the growth surface. After exposure and mold growth, measurements can be repeated and compared to the second baseline. An increase in damping can indicate mold growth on the surface. The magnitude of the increase in damping can indicate the amount of mold growth that has occurred. Multiple ultrasonic loudspeakers can be used to create a stereo effect for measurement.

[0148] Experimental tests can be performed to determine the damping properties of mold growth in the cavity. Under controlled conditions, mold can grow, and the damping properties can be measured at different growth stages. Data for different types of mold can be stored. The control device 116 can store data for later comparison. By comparing the damping response with historical damping responses, the control device 116 can determine the growth stage, concentration, and / or type of the growing mold.

[0149] Mold can be detected by measuring the mechanical properties of a growth surface that change as mold grows. The mechanical properties can be measured by applying an actuation pulse and measuring the resulting frequency and / or amplitude response. In some configurations, the mold sensor may include a mechanism for stimulating the growth surface. For example, a piezoelectric matrix may be included to facilitate the stimulation of the growth surface. The growth surface and the electrical contact system can be... Figure 16 to Figure 1 8. A similar configuration may be used. For example, the growth surface may include a pair of conductive strips with a piezoelectric material between them. The piezoelectric matrix may be electrically coupled to the control device 116. Electrical contact may be achieved using electrodes or contacts on a rolling element, as discussed previously herein. The control device 116 may actuate the piezoelectric matrix (e.g., by applying a voltage or current at a predetermined level or trend) to cause movement or deformation of the growth surface at a given frequency or amplitude defined by the excitation. The control device 116 may stop actuating the piezoelectric matrix and measure the oscillation and / or damping. Measurements may be performed via optical or electrical sensing devices. In some configurations, measurements may be performed using signals from the piezoelectric matrix. For example, vibration may induce a voltage on the piezoelectric matrix.

[0150] The piezoelectric matrix can be used as a sensor in other configurations, such as audio-based sensing configurations. When pressure from sound waves interacts with the piezoelectric matrix, it can generate an electrical signal. The piezoelectric matrix can act as a microphone and can be used to measure the deflection or movement of the growth surface caused by sound waves. The piezoelectric material can be disposed on the matrix / growth surface between at least two conductive zones. The piezoelectric material can be configured to generate an electrical signal at the conductive zones based on the deflection of the matrix / growth surface. The piezoelectric material can be configured to cause deflection of the matrix / growth surface in response to a voltage applied to the conductive zones.

[0151] The substrate can be constructed as cantilever, cantilever array, bridge, bridge array, septum or septum array, and plate. In some configurations, individual mechanical structures can be configured to promote the growth of different molds. Measuring the mechanical properties of each individual structure allows for the identification of the type of mold growing.

[0152] The growth surface can also be excited by an electromagnet interacting with it. For example, a conductive strip of nickel or ferromagnetic material can be attracted to the electromagnet. Control device 116 can be configured to cause the electromagnet to generate pulses to induce vibrations on the growth surface. An optical sensor can then be used to measure the oscillations and / or damping of the growth surface. Mold growth can be determined by comparing the response with first and second baseline responses obtained during the initial phase of the measurement cycle. Electrostatic actuation can also be applied to excite the growth surface. For example, a comb actuator or electrostatic motor can be used to excite the growth surface.

[0153] Mold sensors can be configured for extended use to continuously sense mold in the environment. Such configurations can utilize a surface-changing mechanism to continuously advance the growth surface, allowing for multiple measurement cycles to be performed. In some configurations, the surface-changing mechanism can be an interchangeable housing, allowing for the installation of new growth media to continue testing. Some sensor configurations are well-suited for interchangeable configurations. For example, configurations where the sensing element is included within a housing can be very suitable for these applications. Configurations that include part of the sensing element beneath the growth surface may require additional cost per replacement housing.

[0154] The surface propulsion mechanism can be configured to identify a lack of available new growth surfaces. For example, when no more unused strips are available, Figure 11 The belt-based surface-changing mechanism may be unable to advance the growth surface. This can be detected by increasing torque or by the inability to change the speed of the driven reel 1106. The control device 116 can be configured to detect this and notify the user that additional measurements are not possible. In other configurations, the final growth surface that can be moved into the cavity can be endowed with different properties. For example, different characteristics that can be recognized by sensing devices can be assigned to the final growth surface. For example, the final growth surface can be transparent or mirrored to change the intensity of light detected by an optical sensor. The control device 116 can be configured to detect changes and mark conditions during baseline measurements.

[0155] Mold sensors can also be configured as single-use devices for a single mold detection. Mold sensors can be configured with interchangeable cartridges that prevent the growth surface from advancing. Single-use applications are better suited to some sensor configurations, such as those measuring variations in mechanical properties. For example, the mold sensor can define a slot that allows manual insertion into the growth surface (e.g., a slide or strip). After a measurement cycle is complete, the growth surface can be manually removed and discarded. In some configurations, the growth surface can be cleaned, reprocessed with nutrients, and reused.

[0156] In some configurations, the continuous measurement setup can be configured to clean and re-treat the growth surface. For example, a belt-based configuration may include an electromechanical wiper / scraper mechanism that scrubs the growth surface after the mold eradication phase. The surface replacement mechanism may be configured with a removable waste bin for collecting waste. The surface replacement mechanism can be configured to reapply nutrients to the growth surface. For example, the growth surface may move through a nutrient container, or a nutrient solution may be sprayed or dripped onto the growth surface.

[0157] The sensing device configurations described herein can be combined in a given application. Mold sensors can utilize more than one of the described sensing techniques to better measure mold growth or indicate different properties of mold growth.

[0158] Mold growth and its rate can be affected by temperature. Different types of mold can respond differently to a given temperature. (See also...) Figure 1 The thermal control element 120 can be controlled by the control device 116. The thermal control element 120 can be operated to influence mold growth within the cavity 103. The control device 116 can implement closed-loop temperature control within the cavity 103 by controlling the thermal control element 120 using temperature feedback from the cavity environment sensor 118. The control device 116 can be configured to select a temperature setpoint for a given type of mold to optimize mold growth within the cavity 103. The control device 116 can be configured to adjust the temperature setpoint to detect the presence of different types of mold. An open-loop strategy can also be implemented, wherein the control device 116 is programmed to activate the thermal control element 120 in a predetermined manner.

[0159] Control device 116 can be configured to operate mold inhibitor 108 to influence mold growth. Control device 116 can operate mold inhibitor 108 to determine the intensity of mold. Control device 116 can operate mold inhibitor 108 with short pulses configured to kill weaker mold spores. Control device 116 can operate mold inhibitor 108 to regulate the mold growth rate. Control device 116 can further operate mold inhibitor 108 to prevent cavity 103 from saturating by eliminating some mold. Control device 116 can be configured to perform sensor measurements before and after application of mold inhibitor 108 to identify any differences in mold concentration that may have occurred. Control device 116 can be configured to identify the rate of mold elimination during activation of mold inhibitor 108. The rate of mold elimination can be used to identify the type of mold that is growing.

[0160] The mold suppressor 108 can be configured to output different UV wavelengths to measure the effect of different UV wavelengths on mold elimination. The mold suppressor 108 can be configured to allow for variation in light intensity. The control device 116 can control or select the light intensity and UV wavelength during the mold elimination phase. The control device 116 can operate different light sources providing different wavelengths of light or filter elements having one or more broadband light sources. When the control device 116 has determined the presence of a specific type of mold, the control device 116 can be configured to select a UV wavelength effective for eliminating the specific type of mold present. The control device 116 can store data regarding preferred parameters of the mold suppressor 108 for eliminating different types of mold.

[0161] The described mold sensor can operate automatically. For example, control device 116 can be configured to schedule measurement cycles at predetermined time intervals. Control device 116 can be configured to determine triggering conditions for initiating measurement cycles. For example, control device 116 can monitor weather information from external sensors or networks to determine if conditions conducive to mold growth exist. For example, control device 116 can initiate measurement cycles after detecting an increase in humidity or a decrease in temperature. Control device 116 can also be configured to learn local conditions that increase the risk of mold growth. Control device 116 can store measurement results and associated conditions during measurement cycles. Over time, control device 116 can learn that certain conditions are associated with mold growth. When these conditions are detected, control device 116 can reduce the time between measurement cycles.

[0162] Figure 20Possible configurations of a mold sensing system are depicted. The mold sensor 2000 may include a control unit 116. The control unit 116 may include a processing unit 2002 and volatile and non-volatile memory 2004. The mold sensor 2000 may include a human-machine interface (HMI) 2008 for user interaction. The HMI 2008 may be a combination of hardware and software components. The mold sensor 2000 can be operated by a user as needed. The control unit 116 may implement the HMI 2008 (e.g., a button / light) that allows the user to initiate a measurement cycle. The user can initiate a measurement cycle by pressing a button, and a light can indicate that a measurement cycle is in progress. The mold sensor 2000 may further include an alarm 2014 that provides feedback if a mold growth threshold is sensed. The alarm 2014 may be a visual alarm, such as a light-emitting diode (LED) or a display panel. In some configurations, the alarm 2014 may be an audible alarm. The control device 116 can be programmed to activate the alarm 2014 via the HMI 2008 in response to detecting a mold concentration exceeding a threshold during a measurement cycle. When the estimated mold concentration exceeds a predetermined concentration, the control device 116 can detect mold growth exceeding normal mold growth levels. The alarm can be an audible alarm and / or a virtual alarm communicated to the user.

[0163] Control device 116 may include a communication interface 2006 that allows a user to communicate with control device 116 via a cloud or network 2010 (e.g., Ethernet, Bluetooth). Control device 116 can be programmed using a network interface that allows access to mold sensor parameters via a web browser on user device 2018 (e.g., a computer or other device). HMI 2008 may include an application running on user device 2018, which may be a mobile phone or tablet. HMI 2008 may be configured to allow a user to initiate and / or schedule measurement cycles. HMI 2008 may be configured to communicate measurement results to the user. HMI 2008 may be configured to notify the user of the current status of the mold sensor. For example, HMI 2008 may communicate remaining battery life, remaining growth surface or measurement cycles, and warnings related to mold detection. Mold sensor 2000 may include a display module driven by HMI 2008.

[0164] The mold sensor 2000 may include a power interface 2016 for providing power to the mold sensor components. The power interface 2016 may include a battery. The battery may be rechargeable. In some configurations, the power interface 2016 may provide connectivity to an external source. For example, power may be provided by connecting to a household power outlet.

[0165] The system may include multiple mold sensors 2000 that work together to determine mold growth and concentration. In some configurations, the mold sensing system may include a first mold sensor (e.g., 2000A) and a second mold sensor (e.g., 2000B). The first mold sensor 2000A may be located in an area for which excessive mold growth is to be monitored. The second mold sensor 2000B may be located in a reference area. For example, the reference area may be outdoors. The reference area may be an area where excessive mold growth is not suspected. The second mold sensor 2000B can provide information about the concentration of mold typically present in the environment. For example, the second mold sensor 2000B can provide information about mold growth of a normal amount of mold spores naturally present in the environment. The first mold sensor 2000A, being located in an area of ​​active mold growth, may provide information about mold concentration that may differ from that in the reference area. For example, the first sensor 2000A may be located in a damp basement where mold has been growing for some time. The presence of mold in the enclosed area may lead to an increased concentration of airborne mold spores compared to the reference area. By using multiple mold sensors, the system can determine whether the mold concentration is abnormal relative to a reference area.

[0166] Using multiple mold sensors can prevent inaccurate assessments. For example, mold spore concentrations can typically vary throughout the year. By including a reference mold sensor, normal variations can be subtracted from the assessment of the mold of interest. This provides more accurate concentration data for the area of ​​interest and prevents false alarms due to seasonal variations in mold spore concentration. For instance, the mold sensing system can suppress alarms when the ratio of the measured mold concentration to the reference mold concentration is less than a threshold. An alarm could indicate the presence of more of a certain type of mold spores in an internal area compared to an external area.

[0167] In some configurations, the system can evaluate mold growth against different types of mold. For example, growth surfaces with differently treated zones and / or zones exposed to different environmental conditions can grow different types of mold. Sensors can be configured to measure mold concentration for each zone or type of mold. The concentration of each type of mold can be compared with a corresponding reference value from a mold sensor placed in a reference area.

[0168] The mold sensors 2000 can communicate with each other via communication interface 2006. One of the mold sensors 2000 can be configured as a master device. The master device can be configured to manage and coordinate the operation of other mold sensors. The master device can receive mold growth and concentration data from other mold sensors. The master device can synchronize the measurement cycles of the mold sensors 2000. For example, the master device can send a start measurement cycle signal to the mold sensor to initiate the measurement cycle. The master device can be further configured to determine a mold growth concentration threshold based on data from a reference mold sensor.

[0169] Control device 116 can be configured to perform data analysis. Control device 116 can be further configured to collect measurement data and send it to server 2012 or a cloud computer for processing. Control device 116 can be configured to send measurement data to user device 2018. One advantage of external processing is that the algorithm can be changed in a central location without reprogramming each individual mold sensor. The algorithm can be improved over time. Additionally, it is possible to analyze data from many mold sensors to develop improved mold sensing strategies and better characterize mold growth.

[0170] User device 2018 can be programmed to coordinate the operation of multiple mold sensors 2000. For example, a program can be executed on user device 2018 that allows the user to establish communication with the mold sensors 2000. The program can allow the user to identify the mold sensors 2000. For example, the program can allow one of the mold sensors to be identified as a reference mold sensor. The program can determine a mold alert threshold based on data received from the reference mold sensor. Control device 116 can transmit the results to user device 2018 via the Internet. This allows for the placement of mold sensors 2000 with remote monitoring capabilities. Additionally, the program can allow any number of mold sensors to be added to the mold sensing system.

[0171] The mold sensor 2000 may include self-test capabilities. The control device 116 may be programmed to operate and provide confirmation of proper operation. For example, the control device 116 may be configured to detect that the air inlet port 104 is operating properly. Some configurations may include an electrical switch or contact that closes when the air inlet port 104 is in a predetermined position. The control device 116 may actuate the air inlet port 104 and monitor the switch or contact to verify proper operation.

[0172] The control device 116 can be configured to operate the mold suppressor 108 to confirm appropriate operation. For example, in a configuration with an optical sensing device, the control device 116 can activate the mold suppressor 108 and confirm operation by sampling the optical sensing device.

[0173] The control device 116 can be further configured to calibrate the sensing system. The control device 116 can be configured to check the sensor status under conditions where no mold growth is observed, in order to establish a baseline status. The control device 116 can check the sensing device before and / or immediately after exposing the growth surface to air. The obtained signal should indicate the absence of mold growth. If the sensing device provides a signal indicating mold growth, the mold sensor may require servicing or cleaning.

[0174] Mold sensors can be used to estimate mold spore concentration. When a mold sensor is configured with predetermined fixed parameters (e.g., temperature, humidity, pressure, measurement time period), the concentration of mold spores detected in a volume can be correlated with the concentration of mold spores from a reference area. For example, mold growth data can be determined to correlate the measured parameters with the mold concentration. This feature can be useful in the design of multi-chamber mold sensors for detecting certain types of mold.

[0175] By implementing mold growth curve fitting and / or pattern recognition algorithms, measurement time can be reduced and detection accuracy improved. Molds grow differently in different environments. Curve fitting or pattern recognition can be achieved by changing one of the parameters (e.g., temperature, humidity, pressure) during measurement. The sensing device can be monitored to determine how the measured property changes in response to parameter variations. For example, if the sensor output changes more rapidly at higher humidity than at lower humidity, mold spores may be present. This allows for mold detection without waiting for mold spores to grow to a large concentration.

[0176] Figure 21 A flowchart 2100 depicts a possible sequence of operations for operating a mold sensor configuration. At operation 2102, a check can be performed to determine if a measurement trigger condition exists. For example, the measurement can be manually triggered by a button or switch, via network command, and / or scheduled. In some configurations, control device 116 can determine the trigger condition based on environmental conditions. The trigger condition may include a check to determine if there is sufficient growth surface available for performing the measurement (e.g., with excess material exceeding the amount required for the measurement). If no trigger condition exists, operation 2102 can be repeated.

[0177] If the measurement triggering conditions are met, operation 2104 can be performed to position the growth surface. The measurement cycle can begin by first positioning the unused portion of the growth surface to a location where it can receive airflow. In a configuration with a movable growth surface, control device 116 can actuate a surface changing mechanism to advance the growth surface to a predetermined position. For example, the unused portion of the growth surface can be advanced into the growth chamber. In some configurations (e.g., Figure 6 and Figure 7The growth surface can be positioned in the exposed area outside the growth chamber.

[0178] At operation 2106, the growth surface may be exposed to air. For example, control device 116 may open an air inlet port to allow airflow into the growth chamber. The air inlet port may be open for a predetermined period of time and then closed. The predetermined period of time may be determined based on environmental conditions detected from environmental sensors. In some configurations, an airflow sensor or pressure sensor may be monitored to determine when to close the air inlet port.

[0179] At operation 2108, baseline measurements of particles attached to the growth surface can be performed. The air inlet port can be closed before baseline measurements are performed. Baseline measurements can vary depending on the type of sensing technology used. For example, in a gas / chemical sensor configuration, mVOC in a closed cavity can be sensed and recorded. For optical sensors, the properties of light / electromagnetic waves reflected from or transmitted through the growth surface can be measured.

[0180] If mold spores are present and attached to a nutrient-rich growth surface, mold will begin to grow. At operation 2110, the cavity environment can be controlled to predetermined parameters. Control device 116 can be configured to enhance the growth environment by operating one or more thermal control elements 120. Control device 116 can operate thermal control elements 120 to increase the rate of mold growth. Additionally, any additional systems (e.g., humidity control) used to promote mold growth can be activated.

[0181] At operation 2112, sensor measurements can be performed. Control device 116 can use one or more sensing devices to perform measurements during the growth period and compare the results with baseline measurements. For example, control device 116 can monitor changes in mVOC during the growth period. For optical sensors, the properties of reflected or transmitted light can be monitored.

[0182] At operation 2114, a check can be performed to determine whether the measurement cycle has been completed. For example, the measurement cycle may be completed after a predetermined duration. In some configurations, sensor data can be monitored, and the measurement cycle can be terminated if mold growth is detected. If the measurement cycle has not been completed, operations 2112 and 2114 can be repeated.

[0183] If the measurement cycle is complete, operation 2116 can be performed to process the sensor data. The presence of mold can be determined by comparing the sensor data with stored data indicating mold growth. The amount of mold growth can be inversely calculated using algorithms such as quantitative polymerase chain reaction (QPCR) to determine the concentration of mold spores. The processed measurement results may include mold detection data from other mold sensors connected within the same communication network. The mold concentration from a reference sensor can be compared with other measured mold concentrations. The control device 116 can be programmed to change the signal indicating mold growth based on changes detected in the sensor measurements. For example, the control device 116 can perform periodic measurements and compare the results with baseline measurements.

[0184] At operation 2118, a check can be performed to determine whether mold is detected, as previously described herein. For example, if the ratio of the measured mold concentration to a reference mold concentration exceeds a threshold, the system can indicate the presence of mold. If mold is detected, operation 2120 can be performed to generate an alarm or warning signal. A signal indicating mold growth can be generated and output. The alarm or warning can be sent to and displayed on user device 2018. After generating the warning or indication, operation 2122 can be performed. If no mold is detected, operation 2122 can be performed. The signal indicating mold growth can be an indicator of mold growth already detected in the sample. In some configurations, the signal indicating mold growth can be an indicator that the amount or ratio of mold in the air exceeds a predetermined threshold. In some configurations, the signal indicating mold growth can be an indication of a measurement of the amount of mold present in the sample or air.

[0185] At operation 2122, control device 116 can operate the mold inhibitor to eliminate any mold that may have grown. During the elimination phase, control device 116 can sample the sensing device to detect any changes to ensure that the mold has been eliminated. The entire process can then be repeated.

[0186] The mold sensor configuration provides the ability to monitor mold growth in the environment over time. The enclosed volume provides a controlled environment for mold growth, allowing for more rapid mold detection. Furthermore, the enclosed volume allows mold growth but prevents its spread to other areas. Additionally, a mold inhibitor can be activated after a measurement cycle to eliminate the growing mold. A surface replacement mechanism allows for changing the growing surface to enable additional measurement cycles. The mold sensor allows for continuous monitoring of an area for a period of time.

[0187] Certain configurations of the growth surface can allow for the identification of the type of mold growing. A sensing device can be configured to measure mold growth in specific areas of the growth surface. In this way, the mold sensor can determine the type of mold growing. A mold detection device is configured to grow mold from mold spores present in the air at the time of sampling. This device is configured to perform inference or calculation to determine the concentration of mold spores in the sampled air.

[0188] Mold detection devices can be used in various ways. In some applications, they can be used to determine an absolute measurement of mold concentration. In other applications, they can be used to indicate whether the mold concentration exceeds a threshold indicating a mold problem (e.g., a threshold mold sensor). In some applications, they can be configured to provide a yes / no indication of mold presence. The rate of mold growth on a growth surface depends on the amount of mold spores inoculated onto the surface. Inoculation is related to the concentration of airborne mold spores. The mold detection device can be placed in the environment for a predetermined duration. It can be configured such that at the end of the duration, the detection of mold growth indicates that the concentration of mold spores in the sampled air is above a threshold. A threshold can be selected to indicate a mold problem in the environment in which the device is placed. If no mold growth is detected at the end of the duration, the concentration of mold spores in the sampled air is below the threshold, indicating no mold problem.

[0189] Threshold mold sensors can be configured to target a predetermined type of mold. For example, a nutrient platform can be configured to allow the growth of a predetermined type of mold. Nutrients can be added to a growth surface that favors the growth of the predetermined type of mold.

[0190] In other examples, the mold sensor can be configured to target multiple mold types. In these configurations, growth relationships among the various mold types can be investigated and understood. For example, the growth or presence of one type of mold may inhibit the growth of a second type. Understanding this relationship allows the mold sensor to be constructed to minimize such conditions. Additionally, environmental parameters such as temperature and humidity can be controlled to encourage mold growth.

[0191] The processes, methods, or algorithms disclosed herein can be transferred to, or implemented by, a processing device, controller, or computer that can include any existing programmable electronic control unit or dedicated electronic control unit. Similarly, processes, methods, or algorithms can be stored in many forms as data and instructions executable by a controller or computer, including but not limited to information permanently stored on non-writable storage media such as ROM devices and information reproducibly stored on writable storage media such as floppy disks, magnetic tapes, CDs, RAM devices, and other magnetic and optical media. The process, method, or algorithm can also be implemented in a software executable object. Alternatively, the process, method, or algorithm can be implemented, in whole or in part, using appropriate hardware components such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), state machines, controllers, or other hardware components or devices, or a combination of hardware, software, and firmware components.

[0192] Although exemplary embodiments have been described above, it is not intended that these embodiments describe all possible forms covered by the claims. The terms used in this specification are descriptive and not restrictive, and it should be understood that various changes can be made without departing from the spirit and scope of this disclosure. As previously described, features of various embodiments can be combined to form other embodiments of the invention, which may not be explicitly described or shown. While various embodiments may have been described as providing an advantage or preference over other embodiments or prior art implementations with respect to one or more desired characteristics, it will be recognized by those skilled in the art that one or more features or characteristics can be compromised to achieve the desired overall system properties, depending on the specific application and implementation. These properties may include, but are not limited to, cost, strength, durability, lifecycle cost, marketability, appearance, packaging, size, maintainability, weight, manufacturability, ease of assembly, etc. Therefore, any embodiment described as less desirable in one or more characteristics compared to other embodiments or prior art implementations does not exceed the scope of this disclosure and may be ideal for a particular application.

Claims

1. A mold sensor, the mold sensor comprising: A housing that defines a cavity and a port for allowing air to enter the cavity, the port including a movable grille or door and a spring mechanism configured to selectively open and close, the spring mechanism holding the movable grille or door in a normally closed position; A substrate, which is treated to promote mold growth; A matrix propulsion mechanism, the matrix propulsion mechanism including a rolling element configured to selectively move the matrix to expose the growth surface of the matrix within the cavity; as well as The sensor includes a first conductive strip and a second conductive strip attached to the growth surface, the mold growth area being located between the first conductive strip and the second conductive strip, and the growth of mold in the growth area causing a change in the electrical properties between the first conductive strip and the second conductive strip. The first conductive contact and the second conductive contact extend around the periphery of the rolling element and maintain contact with the first conductive strip and the second conductive strip, respectively. The controller is electrically connected to the first conductive contact and the second conductive contact to detect mold growth on the growth surface by stimulating the first conductive strip and the second conductive strip.

2. The mold sensor of claim 1, wherein the mold sensor further comprises a source configured to selectively kill mold within the cavity.

3. The mold sensor according to claim 2, wherein, The source is an ultraviolet (UV) light source.

4. The mold sensor according to claim 1, wherein the mold sensor further comprises a controllable door disposed on the port to selectively allow or prevent air from entering based on the position of the controllable door.

5. The mold sensor of claim 1, further comprising a heating element configured to heat the cavity.

6. The mold sensor according to claim 1, wherein the mold sensor further comprises a temperature sensor disposed within the cavity.

7. The mold sensor according to claim 1, wherein the mold sensor further comprises a humidity sensor disposed within the cavity.

8. The mold sensor according to claim 1, wherein the mold sensor further comprises a pressure sensor disposed within the cavity.

9. The mold sensor according to claim 1, wherein, The port is defined by the top surface of the housing, which is generally parallel to the matrix.

10. The mold sensor according to claim 1, wherein, The port is defined on a side surface of the housing, which is substantially perpendicular to the matrix.

11. A mold sensor, the mold sensor comprising: A housing that defines a first cavity and a second cavity, and further defines an opening to allow air to enter the first cavity, the opening including a movable grille or door and a spring mechanism configured to selectively open and close, the spring mechanism holding the movable grille or door in a normally closed position; A substrate, which is treated to promote mold growth; A matrix propulsion mechanism, the matrix propulsion mechanism including a rolling element configured to selectively move the matrix such that a first surface of the matrix in the first cavity is moved into a second cavity, and a second surface of the matrix is ​​moved into the first cavity; A sensor includes a first conductive strip and a second conductive strip attached to a second surface, a mold growth area located between the first conductive strip and the second conductive strip, and mold growth in the growth area causing a change in the electrical properties between the first conductive strip and the second conductive strip, wherein a first conductive contact and a second conductive contact extend around the periphery of the rolling element and maintain contact with the first conductive strip and the second conductive strip respectively, and a controller is electrically connected to the first conductive contact and the second conductive contact to detect mold growth on the second surface by stimulating the first conductive strip and the second conductive strip; as well as A source in the second cavity, the source being configured to kill mold on the substrate exposed within the second cavity.

12. The mold sensor of claim 11, further comprising a second sensor positioned in the second cavity and configured to sense mold growth on the substrate exposed in the second cavity.

13. The mold sensor of claim 11, wherein the mold sensor further includes a heating element within the first cavity.

14. A mold sensor, the mold sensor comprising: A housing that defines a cavity and a port for allowing air to enter the cavity, the port including a movable grille or door and a spring mechanism configured to selectively open and close, the spring mechanism holding the movable grille or door in a normally closed position; A substrate, which is treated to promote mold growth; A matrix propulsion mechanism, the matrix propulsion mechanism including a rolling element configured to selectively move the matrix such that a first surface of the matrix is ​​exposed outside the cavity and a second surface of the matrix is ​​exposed inside the cavity; A sensor includes a first conductive strip and a second conductive strip attached to a second surface, a mold growth area located between the first conductive strip and the second conductive strip, and mold growth in the growth area causing a change in the electrical properties between the first conductive strip and the second conductive strip, wherein a first conductive contact and a second conductive contact extend around the periphery of the rolling element and maintain contact with the first conductive strip and the second conductive strip respectively, and a controller is electrically connected to the first conductive contact and the second conductive contact to detect mold growth on the second surface by stimulating the first conductive strip and the second conductive strip; as well as A light source is positioned in the cavity and configured to kill mold on the second surface when activated.

15. The mold sensor according to claim 14, wherein, The matrix propulsion mechanism further includes a second housing that defines a second cavity to enclose the matrix before it is exposed to the outside of the cavity, and defines a third cavity to enclose the matrix after mold growth.

16. The mold sensor according to claim 14, wherein, The matrix propulsion mechanism is configured such that the first surface is substantially perpendicular to the second surface.

17. The mold sensor according to claim 14, wherein, The matrix propulsion mechanism is configured such that the first surface and the second surface are in the same plane.

Images