Wafer double-sided electroplating self-locking hanger

Abstract

The present invention provides a self-locking hanger for double-sided electroplating of wafers, which belongs to the field of semiconductor electroplating, and includes a carrier sheet, a pressing sheet for pressing and fixing a wafer on the carrier sheet, and a locking mechanism arranged between the carrier sheet and the pressing sheet, wherein the carrier sheet is provided with a circular groove for accommodating the wafer, and the bottom of the circular groove is also provided with a conductive ring for connecting the wafer with an external circuit, the pressing sheet is provided with a pressing protrusion adapted to the circular groove, the bottom of the circular groove is provided with a first clearance hole penetrating the carrier sheet, and the pressing sheet is provided with a second clearance hole penetrating the pressing sheet and the pressing protrusion. The self-locking hanger for double-sided electroplating of wafers provided by the present invention can make both sides of the wafer contact with the electroplating solution by setting the first clearance hole and the second clearance hole, so that the wafer can be electroplated on both sides at the same time during the electroplating process, thereby improving the working efficiency of wafer electroplating.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor electroplating, and more specifically, relates to a self-locking hanger for double-sided electroplating of wafers. Background Art

[0002] In the production process of semiconductor integrated circuits, the surface of the wafer needs to be electroplated to form a metal layer. Wafer electroplating is one of the key links in the semiconductor wafer manufacturing process. The production efficiency and electroplating quality of this process are crucial. The process is to place the wafer in the electroplating solution, connect a negative voltage to the wafer as the cathode, and connect the positive voltage to the anode in the electroplating solution. The metal ions in the electroplating solution are deposited on the surface of the wafer through the action of the electric field. In the wafer electroplating process, a plating hanger is required to clamp the wafer. However, after the wafer is installed in the existing electroplating hanger, only one side of the wafer can contact the electroplating solution, which causes the wafer to be electroplated on only one side, which seriously affects the low production efficiency of wafer electroplating. Summary of the invention

[0003] The purpose of the present invention is to provide a self-locking rack for double-sided electroplating of wafers, aiming to solve the problem that the existing self-locking rack for double-sided electroplating of wafers can only perform single-sided electroplating and low production efficiency during the wafer electroplating process.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: to provide a double-sided electroplating self-locking hanger for wafers, which is used to clamp and fix wafers, including a carrier plate, a pressing plate for pressing and fixing the wafer on the carrier plate, and a locking mechanism arranged between the carrier plate and the pressing plate, the carrier plate is provided with a circular groove for accommodating the wafer, the bottom of the circular groove is also provided with a conductive ring for connecting the wafer with an external circuit, the pressing plate is provided with a pressing protrusion adapted to the circular groove, the bottom of the circular groove is provided with a first clearance hole penetrating the carrier plate, and the pressing plate is provided with a second clearance hole penetrating the pressing plate and the pressing protrusion.

[0005] As another embodiment of the present application, the locking mechanism includes a plurality of clamping caps disposed on the carrier sheet and a plurality of locking holes disposed on the clamping sheet, and the clamping caps penetrate through the locking holes to clamp and fix the carrier sheet and the clamping sheet.

[0006] As another embodiment of the present application, the locking holes are all arc-shaped elongated holes whose centers coincide with the centers of the circular grooves, and locking ramps are provided on both side walls of the arc-shaped elongated holes along the length direction of the arc-shaped elongated holes.

[0007] As another embodiment of the present application, the end of the arc-shaped oblong hole is also provided with a yield portion for the clamping cap to pass through, and the yield portion is connected to the arc-shaped oblong hole, and the yield portion is arranged on the end of the arc-shaped oblong hole where the locking ramp has the smallest thickness.

[0008] As another embodiment of the present application, the thickness of the locking ramp increases gradually in the counterclockwise direction, and the thickest part of the locking ramp is equal to the thickness of the clamping plate.

[0009] As another embodiment of the present application, the clamping cap includes a mounting post disposed on the carrier sheet, and a clamping portion disposed at an end of the mounting post.

[0010] As another embodiment of the present application, the mounting post is movably disposed on the supporting sheet, and the mounting post is threadedly connected to the supporting sheet.

[0011] As another embodiment of the present application, the conductive ring includes a metal ring body arranged at the bottom of the circular groove and located at the bottom of the wafer, and a conductive part arranged on the side of the metal ring body and used to connect the metal ring body to an external circuit.

[0012] As another embodiment of the present application, the conductive ring and the conductive part are an integrally formed structure, and both the conductive ring and the conductive part are made of copper material.

[0013] As another embodiment of the present application, both the supporting plate and the pressing plate are provided with hanging holes for hanging and fixing the supporting plate and the pressing plate.

[0014] The beneficial effect of the self-locking hanger for double-sided electroplating of wafers provided by the present invention is that: compared with the prior art, a circular groove for accommodating wafers is provided on the carrier sheet, a pressing protrusion matching the shape of the circular groove is provided on the pressing sheet, and the pressing sheet and the carrier sheet are respectively provided with a first clearance hole and a second clearance hole. The self-locking hanger for double-sided electroplating of wafers provided by the present invention prevents the conductive ring from being at the bottom of the circular groove when the wafer is fixed, and the wafer is placed in the circular groove, and then the pressing sheet and the carrier sheet are fixed to each other through a locking mechanism, so that the pressing protrusion on the pressing sheet presses and fixes the wafer, making the wafer installation more secure, and by providing the first clearance hole and the second clearance hole, both sides of the wafer can contact the electroplating solution, so that the wafer can be electroplated on both sides at the same time during the electroplating process, thereby improving the working efficiency of wafer electroplating. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A schematic diagram of the exploded structure of a self-locking hanger for double-sided electroplating of wafers provided by an embodiment of the present invention;

[0017] Figure 2 A schematic diagram of the structure of a compression sheet used in an embodiment of the present invention;

[0018] Figure 3 A schematic diagram of the locking state structure of a self-locking rack for double-sided electroplating of wafers provided in an embodiment of the present invention;

[0019] Figure 4 A schematic diagram of the structure of the wafer double-sided electroplating self-locking hanger in the open state provided by an embodiment of the present invention;

[0020] Figure 5 for Figure 4 Schematic diagram of the enlarged structure of part A in the middle.

[0021] In the figure: 1. carrier plate; 11. circular groove; 12. first clearance hole; 2. clamping plate; 21. clamping protrusion; 22. second clearance hole; 3. conductive ring; 4. locking mechanism; 41. clamping cap; 42. locking hole; 43. locking ramp; 44. clearance part; 5. hanging hole; 6. wafer. DETAILED DESCRIPTION

[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0023] Please also read Figure 1 and Figure 2, the self-locking hanger for double-sided electroplating of wafers provided by the present invention is now described. The self-locking hanger for double-sided electroplating of wafers comprises a carrier sheet 1, a pressing sheet 2 for pressing and fixing the wafer on the carrier sheet 1, and a locking mechanism 4 arranged between the carrier sheet 1 and the pressing sheet 2, the carrier sheet 1 is provided with a circular groove 11 for accommodating the wafer, the bottom of the circular groove 11 is also provided with a conductive ring 3 for connecting the wafer with an external circuit, the pressing sheet 2 is provided with a pressing protrusion 21 adapted to the circular groove 11, the bottom of the circular groove 11 is provided with a first clearance hole 12 penetrating the carrier sheet 1, and the pressing sheet 2 is provided with a second clearance hole 22 penetrating the pressing sheet 2 and the pressing protrusion 21.

[0024] Compared with the prior art, the self-locking rack for double-sided electroplating of wafers provided in this embodiment has a circular groove 11 for accommodating wafers on the carrier sheet 1, a pressing protrusion 21 matching the shape of the circular groove 11 on the pressing sheet 2, and the pressing sheet 2 and the carrier sheet 1 are respectively provided with a first clearance hole 12 and a second clearance hole 22. The self-locking rack for double-sided electroplating of wafers provided in the present invention prevents the conductive ring 3 from being at the bottom of the circular groove 11 when the wafer is fixed, and the wafer is placed in the circular groove 11, and then the pressing sheet 2 and the carrier sheet 1 are fixed to each other through the locking mechanism 4, so that the pressing protrusion 21 on the pressing sheet 2 presses and fixes the wafer, so that the wafer is installed more firmly, and the first clearance hole 12 and the second clearance hole 22 are provided so that both sides of the wafer can contact the electroplating solution, so that the wafer can be electroplated on both sides at the same time during the electroplating process.

[0025] As a specific embodiment of the wafer double-sided electroplating self-locking hanger provided by the present invention, please refer to Figures 3 to 5 The locking mechanism 4 includes a plurality of clamping caps 41 disposed on the carrier sheet 1 and a plurality of locking holes 42 disposed on the clamping sheet 2. The clamping caps 41 penetrate the locking holes 42 to clamp and fix the carrier sheet 1 and the clamping sheet 2. During the installation of the clamping sheet 2, it is only necessary to pass the clamping caps 41 through the locking holes 42 and fix the clamping caps 41 to the carrier sheet 1. The clamping caps 41 can be used to firmly fix the clamping sheet 2 and the carrier sheet 1 to each other, so that the carrier sheet 1 and the clamping sheet 2 are more firmly fixed.

[0026] As a specific embodiment of the wafer double-sided electroplating self-locking hanger provided by the present invention, please refer to Figures 1 to 5The locking holes 42 are arc-shaped oblong holes whose centers coincide with the centers of the circular grooves 11, and locking ramps 43 are arranged along the length direction of the arc-shaped oblong holes on both side walls. The locking holes 42 are arc-shaped oblong holes, and locking ramps 43 with gradually increasing thickness are arranged on the side walls of the arc-shaped oblong holes. When installing the pressing sheet 2, it is only necessary to pass the pressing cap 41 through the locking hole 42 and install it on the bearing sheet 1, and then it is only necessary to rotate the pressing sheet 2 in the corresponding direction, and the pressing cap 41 is pushed away from the bearing sheet 1 through the thickness change of the locking ramp 43, thereby realizing the pressing and fixing of the pressing sheet 2, making it more convenient to fix the bearing sheet 1 and the pressing sheet 2.

[0027] As a specific embodiment of the wafer double-sided electroplating self-locking hanger provided by the present invention, please refer to Figure 5 The end of the arc-shaped oblong hole is also provided with a clearance portion 44 for the clamping cap 41 to pass through, and the clearance portion 44 is connected to the arc-shaped oblong hole, and the clearance portion 44 is arranged at the end of the arc-shaped oblong hole where the thickness of the locking ramp 43 is the smallest. The setting of the clearance portion 44 allows the clamping cap 41 to be installed and fixed to the bearing sheet 1 in advance before the clamping sheet 2 is installed, and then when the clamping sheet 2 is installed, it is only necessary to pass the clamping cap 41 through the clearance portion 44 and then rotate the clamping sheet 2. The clamping cap 41 can be pushed away from the bearing sheet 1 by the change in the thickness of the locking ramp 43, thereby achieving the clamping and fixing of the clamping sheet 2.

[0028] As a specific embodiment of the wafer double-sided electroplating self-locking hanger provided by the present invention, please refer to Figure 4 and Figure 5 The thickness of the locking ramp 43 increases in the counterclockwise direction, and the thickest part of the locking ramp 43 is equal to the thickness of the pressing sheet 2. The thickness of the locking ramp 43 increases in the counterclockwise direction, and the pressing sheet 2 can be pressed and fixed by rotating the pressing sheet 2 clockwise during installation, which is more in line with the operating habits of operators in the production process, making the installation efficiency of the carrier sheet 1 and the pressing sheet 2 higher.

[0029] As a specific embodiment of the wafer double-sided electroplating self-locking hanger provided by the present invention, please refer to Figure 4 and Figure 5 The clamping cap 41 includes a mounting post arranged on the carrier sheet 1, and a clamping part arranged at the end of the mounting post. The diameter of the clamping part is larger than the size of the mounting post, and the side of the clamping part close to the clamping sheet 2 is pressed against the inclined surface of the upper part of the locking ramp 43. During the rotation of the clamping sheet 2, the height change of the locking ramp 43 pushes the clamping part away from the carrier sheet 1, but the overall length of the mounting post remains unchanged. The clamping sheet 2 is subjected to the reverse force of the clamping part, so that the clamping sheet 2 can be clamped and fixed, so that the installation efficiency of the carrier sheet 1 and the clamping sheet 2 is higher.

[0030] As a specific embodiment of the wafer double-sided electroplating self-locking hanger provided by the present invention, please refer to Figure 4 and Figure 5 The mounting post is movably arranged on the carrier sheet 1, and the mounting post is threadedly connected to the carrier sheet 1. The end of the mounting post is provided with a thread, and the carrier sheet 1 is provided with a threaded hole for installing the mounting post. The mounting post adopts this fixing method, so that the distance between the pressing part and the carrier sheet 1 can be adjusted based on the thickness of the base wafer, thereby adjusting the distance between the carrier sheet 1 and the pressing sheet 2 after being fixed.

[0031] As a specific embodiment of the wafer double-sided electroplating self-locking hanger provided by the present invention, please refer to Figure 1 The conductive ring 3 includes a metal ring body disposed at the bottom of the circular groove 11 and located at the bottom of the wafer, and a conductive part disposed on the side of the metal ring body and used to connect the metal ring body with an external circuit. The configuration of the conductive ring 3 makes the connection between the wafer and the external circuit simpler and more convenient.

[0032] As a specific embodiment of the wafer double-sided electroplating self-locking hanger provided by the present invention, please refer to Figure 1 The conductive ring 3 and the conductive part are integrally formed, and both the conductive ring 3 and the conductive part are made of copper. The copper material has better conductivity and is more corrosion-resistant, which increases the service life of the conductive ring 3.

[0033] As a specific embodiment of the wafer double-sided electroplating self-locking hanger provided by the present invention, please refer to Figures 1 to 4 The carrier sheet 1 and the pressing sheet 2 are both provided with hanging holes 5 for hanging and fixing the carrier sheet 1 and the pressing sheet 2. The setting of the hanging holes 5 makes it easier to hang and fix the electroplating rack.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A self-locking hanger for double-sided electroplating of wafers, characterized in that: The invention comprises a carrier sheet, a pressing sheet for pressing and fixing a wafer on the carrier sheet, and a locking mechanism arranged between the carrier sheet and the pressing sheet, wherein the carrier sheet is provided with a circular groove for accommodating the wafer, the bottom of the circular groove is also provided with a conductive ring for connecting the wafer with an external circuit, the pressing sheet is provided with a pressing protrusion adapted to the circular groove, the bottom of the circular groove is provided with a first clearance hole penetrating the carrier sheet, and the pressing sheet is provided with a second clearance hole penetrating the pressing sheet and the pressing protrusion; The locking mechanism comprises a plurality of clamping caps arranged on the carrier sheet, and a plurality of locking holes arranged on the clamping sheet, wherein the clamping caps penetrate through the locking holes to clamp and fix the carrier sheet and the clamping sheet; the locking holes are all arc-shaped oblong holes whose centers coincide with the centers of the circular grooves, and locking ramps arranged along the length direction of the arc-shaped oblong holes are arranged on both side walls of the arc-shaped oblong holes; The end of the arc-shaped oblong hole is also provided with a giving portion for the clamping cap to pass through, and the giving portion is connected to the arc-shaped oblong hole, and the giving portion is arranged on the end of the arc-shaped oblong hole where the locking ramp has the smallest thickness.

2. The self-locking rack for double-sided electroplating of wafers as claimed in claim 1, characterized in that: The thickness of the locking ramp increases in the counterclockwise direction, and the thickest part of the locking ramp is equal to the thickness of the pressing sheet.

3. The self-locking rack for double-sided electroplating of wafers as claimed in claim 1, characterized in that: The clamping cap comprises a mounting post arranged on the bearing sheet and a clamping portion arranged at an end of the mounting post.

4. The self-locking rack for double-sided electroplating of wafers as claimed in claim 3, characterized in that: The mounting post is movably arranged on the bearing sheet, and the mounting post is threadedly connected to the bearing sheet.

5. The self-locking rack for double-sided electroplating of wafers as claimed in claim 1, characterized in that: The conductive ring comprises a metal ring body arranged at the bottom of the circular groove and located at the bottom of the wafer, and a conductive part arranged on the side of the metal ring body and used for connecting the metal ring body with an external circuit.

6. The self-locking rack for double-sided electroplating of wafers as claimed in claim 5, characterized in that: The conductive ring and the conductive part are an integrally formed structure, and both the conductive ring and the conductive part are made of copper.

7. The self-locking rack for double-sided electroplating of wafers as claimed in claim 1, characterized in that: The bearing sheet and the pressing sheet are both provided with hanging holes for hanging and fixing the bearing sheet and the pressing sheet.

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