speaker
By designing a speaker including piezoelectric plate, power supply circuit, mounting plate, damping structure and housing, the existing piezoelectric speakers are solved, and higher structural performance and sound quality optimization are achieved , suitable for the demands of electronic products under the trend of lightweight and high-performance development.
Patent Information
- Application Number
- CN202010275114.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-04-09
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2040-04-09
AI Technical Summary
The existing piezoelectric speakers have thin structures, poor performance, and lack effective vibration conduction and noise isolation measures, making it difficult to meet the needs of electronic products under the trend of lightweight and high-performance development.
A speaker including at least one piezoelectric sheet, a power supply circuit, a mounting plate, a damping structure and a housing is designed. The piezoelectric sheet, power supply circuit and mounting plate are wrapped by the housing, and the packaging and structural modularization of the piezoelectric sheet is realized. Meanwhile, by providing a damping structure between the piezoelectric sheet and the vibrating surface, and providing a protective structure between the casing and the vibrating surface, vibration conduction and noise isolation are improved.
It improves the overall structural performance and reliability of the speaker, optimizes the sound quality and sound radiation performance, enhances the integration with electronic devices, and reduces assembly difficulty.
Smart Images

Figure CN111405439B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of electronic equipment, and in particular to a loudspeaker. Background Art
[0002] The loudspeaker is a common electroacoustic transducer device, which is widely used in electronic communication terminal equipment such as mobile phones.
[0003] According to the different driving methods, there are mainly two types of speakers: electromagnetically driven dynamic speakers and piezoelectric speakers. Compared with traditional dynamic speakers, piezoelectric speakers have the advantages of no magnetic field interference, low power consumption, and thinness. With the development trend of thinner and higher performance electronic products, piezoelectric speakers have broad development prospects and future. However, existing piezoelectric speakers are mostly composed of a single piezoelectric element, with a thin structure and poor performance, and there is still a lot of room for improvement. Summary of the invention
[0004] In view of this, an object of the present invention is to provide a speaker to improve the overall structural performance and usage performance of the speaker.
[0005] In a first aspect, an embodiment of the present invention provides a speaker, the speaker comprising:
[0006] at least one piezoelectric patch;
[0007] A power supply circuit, connected to the piezoelectric sheet and an external circuit, for providing voltage excitation to the piezoelectric sheet;
[0008] A mounting plate, fixedly connected to the piezoelectric sheet;
[0009] at least one damping structure, fixedly connected to the piezoelectric sheet and the vibrated surface, for transmitting vibration to the vibrated surface; and
[0010] A shell, fixedly connected to the mounting plate, used to enclose the piezoelectric sheet, the power supply circuit and the mounting plate, wherein the shell has a through hole for the damping structure to pass through;
[0011] Wherein, the vibrated surface is a screen or a casing of an electronic device.
[0012] Furthermore, the speaker further comprises:
[0013] The protective structure is arranged between the shell and the vibrated surface to avoid noise generated by collision between the shell and the vibrated surface.
[0014] Furthermore, the at least one piezoelectric sheet comprises:
[0015] A first piezoelectric sheet, fixedly connected to one side of the mounting plate; and
[0016] A second piezoelectric sheet, arranged on the other side of the mounting plate opposite to the first piezoelectric sheet;
[0017] Wherein, the first piezoelectric sheet is fixedly connected to the second piezoelectric sheet.
[0018] Furthermore, the speaker further comprises:
[0019] The steel plate is arranged in the area surrounded by the protection structure and connected between the damping structure and the vibrated surface.
[0020] Furthermore, the speaker further comprises:
[0021] At least one weight component is fixedly connected to the first piezoelectric sheet, and projections of the weight component and the damping structure along the deformation direction of the piezoelectric sheet do not overlap.
[0022] Furthermore, the weight component is located at an outer corner or a center position of the piezoelectric sheet.
[0023] Furthermore, the damping structure is located at an outer corner or a center position of the piezoelectric sheet.
[0024] Further, the power supply circuit includes a flexible circuit board;
[0025] The housing is provided with a mounting groove;
[0026] Wherein, the flexible circuit board is provided with a connecting part and a conductive part, the connecting part is fixedly connected to the piezoelectric sheet, and the conductive part extends from the inside of the shell through the mounting groove to the outside of the shell and is connected to the external circuit.
[0027] Furthermore, the vibrated surface is connected to a plate-shaped middle frame structure, a fixing groove is provided on the middle frame structure, and the outer wall of the shell is fixedly connected to the inner wall of the fixing groove.
[0028] In a second aspect, an embodiment of the present invention provides an electronic device, comprising the speaker as described above.
[0029] The technical solution of the embodiment of the present invention is to encapsulate the piezoelectric sheet, the power supply circuit and the mounting plate through the shell, thereby realizing the packaging of the piezoelectric sheet and protecting the piezoelectric sheet. At the same time, the structure of the speaker is modularized, the integrity of the speaker structure is enhanced, and the overall structural performance and reliability of the speaker are improved. Furthermore, by providing a damping structure between the piezoelectric sheet and the vibrated surface, the sound quality of the speaker is improved, and the performance of the speaker is further optimized. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
[0031] Figure 1 is an overall structural diagram of a loudspeaker according to Embodiment 1 of the present invention;
[0032] Figure 2 is an exploded view of the overall structure of the loudspeaker according to the first embodiment of the present invention;
[0033] Figure 3 is a schematic diagram of installing a first flexible circuit board according to the first embodiment of the present invention;
[0034] Figure 4 is a structural diagram of a first flexible circuit board according to a first embodiment of the present invention;
[0035] Figure 5 is an overall structural diagram of a loudspeaker according to a second embodiment of the present invention;
[0036] Figure 6 is an exploded view of the overall structure of the loudspeaker according to the second embodiment of the present invention;
[0037] Figure 7 is a structural diagram of a second flexible circuit board according to a second embodiment of the present invention;
[0038] Figure 8 is an overall structural diagram of a loudspeaker according to Embodiment 3 of the present invention;
[0039] Fig. 9 is an exploded view of the overall structure of the loudspeaker according to the third embodiment of the present invention;
[0040] Fig.10 is an exploded view of the overall structure of the loudspeaker according to the fourth embodiment of the present invention;
[0041] Fig.11 is an exploded view of the overall structure of the loudspeaker according to the fifth embodiment of the present invention;
[0042] Fig.12 It is an exploded view of the overall structure of the electronic device according to the sixth embodiment of the present invention.
[0043] In the figure: 1. upper shell; 101. mounting groove; 2. power supply circuit; 21. connecting part; 211. first connecting part; 212. second connecting part; 22. conductive part; 23. main body; 3. piezoelectric sheet; 31. first piezoelectric sheet; 32. second piezoelectric sheet; 4. mounting plate; 5. lower shell; 51. through hole; 6. damping structure; 7. protective structure; 8. vibrated surface; 9. steel plate; 10. counterweight component; 11. double-sided tape; 12. middle frame structure; 121. fixing groove; 13. screen; 14. outer shell; 15. frame; 16. speaker. DETAILED DESCRIPTION
[0044] The present invention is described below based on examples, but the present invention is not limited to these examples. In the detailed description of the present invention below, some specific details are described in detail. It is possible for those skilled in the art to fully understand the present invention without the description of these details. In order to avoid confusing the essence of the present invention, known methods, processes, flows and elements are not described in detail.
[0045] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.
[0046] Unless the context clearly requires otherwise, words such as “include”, “including” and the like in the specification should be interpreted as including rather than being exclusive or exhaustive; that is, as meaning “including but not limited to”.
[0047] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.
[0048] Embodiment 1
[0049] Figure 1 It is an overall structural diagram of the loudspeaker according to the first embodiment of the present invention. Figure 2 FIG. 1 is an exploded view of the overall structure of the loudspeaker according to the first embodiment of the present invention. Figure 1 and Figure 2 As shown, the speaker of this embodiment includes: a shell, a mounting plate 4, a power supply circuit 2, a piezoelectric sheet 3, a damping structure 6 and a protective structure 7. Among them, the piezoelectric sheet 3 is arranged as one, and is fixedly connected to one side of the mounting plate 4. The power supply circuit 2 is fixedly connected to the piezoelectric sheet 3 and connected to the external circuit, and is used to provide voltage excitation for the piezoelectric sheet 3. The damping structure 6 is arranged between the piezoelectric sheet 3 and the vibrated surface 8, and is fixedly connected to the piezoelectric sheet 3 and the vibrated surface 8. The vibrated surface 8 can be a screen or a shell of an electronic device. Figure 2In the figure, the vibrated surface 8 is the screen of the electronic device. The damping structure 6 is fixedly connected to the vibrated surface 8 by bonding, welding or glue curing. When in use, the piezoelectric sheet 3 is provided with voltage excitation by the external circuit and the power supply circuit 2, so that the piezoelectric sheet 3 is deformed under the action of the voltage, driving the damping structure 6 to vibrate and the vibration is transmitted to the vibrated surface 8 by the damping structure 6, so that the vibrated surface 8 produces sound, and the sound of the speaker is realized. At the same time, by setting the damping structure 6, the vibration mode of the speaker is adjusted, the sound radiation is optimized, and the sound quality of the speaker is improved, so that the performance of the speaker is more reliable, and the assembly difficulty is small, which further improves the reliability of the speaker during application. In an optional implementation method, the material of the piezoelectric sheet 3 can be any one of a single crystal, a double crystal, a piezoelectric ceramic sheet with or without a steel plate of any size and shape, thereby, it can be selected and changed according to different application occasions to expand the scope of application of the speaker.
[0050] Preferably, the mounting plate 4 is configured as a steel plate with a hollow rectangular structure. The housing includes an upper shell 1 and a lower shell 5. The upper shell 1 is fixedly connected to the outer edge of one side of the mounting plate 4. The lower shell 5 is arranged at the outer edge of the other side of the mounting plate 4 relative to the upper shell 1 and is fixedly connected to the mounting plate 4. The bottom of the lower shell 5 is also provided with a through hole 51 for the damping structure 6 to pass through. Among them, the piezoelectric sheet 3 is arranged between the upper shell 1 and the mounting plate 4, and the size of the piezoelectric sheet is less than or equal to the size of the mounting plate. The damping structure 6 passes through the through hole 51 and is fixedly connected to the bottom of the piezoelectric sheet 3. The piezoelectric sheet 3, the power supply circuit 2 and the mounting plate 4 are wrapped by the upper shell 1 and the lower shell 5, and the speaker is made into a modular structure. While realizing the packaging of the piezoelectric sheet and protecting the piezoelectric sheet, the overall structure is simple and compact, which is conducive to enhancing the integrity of the speaker structure, improving the overall structural performance and reliability of the speaker, and the assembly difficulty is low. At the same time, the resonant frequency of the speaker is adjusted by adjusting the shape of the mounting plate to further optimize the performance of the speaker.
[0051] In an optional implementation, the power supply circuit 2 is configured as a first flexible circuit board. Figure 3 It is a schematic diagram of installing the first flexible circuit board according to the first embodiment of the present invention. Figure 4 1 is a structural diagram of a first flexible circuit board according to an embodiment of the present invention. Figure 3 and Figure 4The first flexible circuit board includes a main body 23, a connecting part 21 and a conductive part 22, and the connecting part 21 and the conductive part 22 are respectively arranged at the two ends of the main body 23. The connecting part 21 is fixedly connected to the top of the piezoelectric sheet 3, and the conductive part 22 is connected to the external circuit. Therefore, the conductive part 22 extends from the inside of the shell to the outside of the shell through the mounting groove 101 and is connected to the external circuit to provide voltage excitation for the piezoelectric sheet 3. Since the flexible circuit board has the advantages of arbitrary bending, small size, light weight, good heat dissipation, easy installation and low comprehensive cost, it can facilitate the installation of the speaker, reduce the size and weight of the speaker, and improve the heat dissipation performance of the speaker.
[0052] In an optional implementation, the damping structure 6 is located at the outer corner or center of the bottom of the piezoelectric sheet 3, and an elastic mechanical element (such as a spring) or elastic material (such as foam, spring steel, rubber, etc.) of any block / ring structure is used, so that the damping structure 6 is more flexible in setting and meets the performance requirements of different speakers. Specifically, the damping structure 6 in this embodiment is set as a circular foam, which is located at the center of the piezoelectric sheet 3 to make the assembly of the speaker more convenient.
[0053] The protective structure 7 is configured as an annular foam and is fixedly connected to the bottom of the housing and the vibrated surface 8. Thus, during the use of the speaker, the annular foam enhances the sealing property of the connection between the speaker and the vibrated surface 8, reduces or avoids the noise generated by the collision between the housing and the vibrated surface 8, and further improves the performance of the speaker.
[0054] The technical solution of the first embodiment of the present invention is to wrap the piezoelectric sheet, power supply circuit and mounting plate through the shell, thereby realizing the packaging of the piezoelectric sheet and protecting the piezoelectric sheet. At the same time, the structure of the speaker is modularized, the integrity of the speaker structure is enhanced, and the overall structural performance and reliability of the speaker are improved. Furthermore, by setting a damping structure between the piezoelectric sheet and the vibrated surface, the sound quality of the speaker is improved, and the performance of the speaker is further optimized.
[0055] Embodiment 2
[0056] Figure 5 is an overall structural diagram of a loudspeaker according to a second embodiment of the present invention, Figure 6 FIG. 1 is an exploded view of the overall structure of the speaker of the second embodiment of the present invention. Figure 5 and Figure 6 The speaker of this embodiment includes: a housing, a mounting plate 4, a power supply circuit 2, a first piezoelectric sheet 31, a second piezoelectric sheet 32, a damping structure 6 and a protective structure 7. The housing, the mounting plate 4, the damping structure 6 and the protective structure 7 are basically the same as those of the first embodiment, and are not described in detail here.
[0057] Preferably, the first piezoelectric sheet 31 is fixedly connected to one side of the mounting plate 4, the second piezoelectric sheet 32 is arranged on the other side of the mounting plate 4 opposite to the first piezoelectric sheet 31, and the first piezoelectric sheet 31 and the second piezoelectric sheet 32 are fixedly connected to the hollow part of the mounting plate 4. Preferably, the first piezoelectric sheet 31 and the second piezoelectric sheet 32 in this embodiment have the same structure, which is convenient for assembly and production of the speaker.
[0058] Figure 7 is a structural diagram of a second flexible circuit board according to the second embodiment of the present invention. Figure 7 , the power supply circuit 2 of this embodiment is a second flexible circuit board. The second flexible circuit board includes a main body 23 and a conductive part 22 and a connecting part 21 arranged at both ends of the main body 23, and the connecting part 21 includes a first connecting part 211 and a second connecting part 212 arranged at one end of the main body 23 opposite to the conductive part 22. Specifically, the first connecting part 211 is fixedly connected to the top of the first piezoelectric sheet 31. One end of the second connecting part 212 is connected to the bottom of the first connecting part 211 close to one end of the conductive part 22, and the other end is arranged below the first connecting part 211 and extends in a direction parallel to the first connecting part 211 and is fixedly connected to the bottom of the second piezoelectric sheet 32. As a result, the conductive part 22 extends from the inside of the shell through the mounting groove 101 to the outside of the shell and is connected to the external circuit, and provides voltage excitation to the first piezoelectric sheet 31 and the second piezoelectric sheet 32 at the same time through the first connecting part 211 and the second connecting part 212. Since flexible circuit boards have the advantages of being able to be bent arbitrarily, small in size, light in weight, good in heat dissipation, easy to install and low in overall cost, they can facilitate the installation of speakers, reduce the size and weight of speakers, and improve the heat dissipation performance of speakers.
[0059] Embodiment 3
[0060] Figure 8 4 is an overall structural diagram of a loudspeaker according to Embodiment 3 of the present invention. Fig. 9 FIG. 1 is an exploded view of the overall structure of the speaker of Embodiment 3 of the present invention. Figure 8 and Fig. 9 The speaker of this embodiment includes: a housing, a mounting plate 4, a power supply circuit 2, a first piezoelectric sheet 31, a second piezoelectric sheet 32, a damping structure 6, a protective structure 7 and a steel plate 9. The housing, the mounting plate 4, the power supply circuit 2, the first piezoelectric sheet 31, the second piezoelectric sheet 32, the damping structure 6 and the protective structure 7 are arranged in a manner substantially the same as that of the second embodiment, and are not described in detail herein.
[0061] It should be noted that the steel plate 9 is arranged in the area surrounded by the protective structure 7, connected between the damping structure 6 and the vibrated surface 8, and the size of the steel plate 9 is larger than the size of the damping structure 6 and smaller than the size of the connecting portion between the second piezoelectric sheet 32 and the mounting plate 4. Specifically, the steel plate 9 can be a closed structure of regular size, or it can be hollow. Therefore, during the operation of the speaker, the conduction of vibration is enhanced by the steel plate 9, the vibration amplitude of the speaker is improved, and the loudness of the speaker is adjusted. Furthermore, the resonant frequency of the speaker is adjusted by adjusting the structure of the steel plate 9, thereby optimizing the low-frequency response and improving the quality of the speaker.
[0062] Embodiment 4
[0063] Fig.10 FIG. 4 is an exploded view of the overall structure of the speaker of the fourth embodiment of the present invention. Fig.10 The speaker of this embodiment includes: a housing, a mounting plate 4, a power supply circuit 2, a weight component 10, a first piezoelectric sheet 31, a second piezoelectric sheet 32, a damping structure 6, a protective structure 7 and a steel plate 9. The housing, the mounting plate 4, the power supply circuit 2, the first piezoelectric sheet 31, the second piezoelectric sheet 32, the damping structure 6, the protective structure 7 and the steel plate 9 are arranged in a manner substantially the same as that of the second embodiment, and are not described in detail herein.
[0064] It should be noted that there is at least one counterweight component 10, which is fixedly connected to the outer corner or center position of the first piezoelectric sheet 31, and does not overlap with the projection of the damping structure 6 along the deformation direction of the first piezoelectric sheet 31 and the second piezoelectric sheet 32. In an optional implementation, the counterweight component 10 can be a rectangular block, a cylindrical block, a circular tube block, a circular ring, a polygonal ring or a polygonal block structure. The material of the counterweight component 10 can be a metal material such as iron and copper, or an inorganic non-metallic material such as glass and silicon, or an organic polymer material such as polyvinyl chloride and epoxy resin. In addition, the counterweight component 10 is fixedly connected to the first piezoelectric sheet 31 by bonding or welding.
[0065] Specifically, four weight components 10 are provided in this embodiment, which are respectively located at the four outer corners of the first piezoelectric sheet 31. Therefore, by adding the weight components 10, the mass and stiffness distribution of the speaker are adjusted, the vibration mode of the speaker is optimized, and then the sound radiation of the speaker is optimized. Furthermore, by adjusting the relative position of the weight component 10 and the damping structure 6, the flatness of the sound pressure level frequency response curve of the speaker is optimized, the distortion of the speaker is reduced, and the sound quality of the speaker is improved.
[0066] Embodiment 5
[0067] Fig.11 FIG. 5 is an exploded view of the overall structure of the speaker of Embodiment 5 of the present invention. Fig.10The speaker of this embodiment includes: a housing, a mounting plate 4, a power supply circuit 2, a first piezoelectric sheet 31, a second piezoelectric sheet 32, a damping structure 6 and a protection structure 7. The housing, the mounting plate 4, the power supply circuit 2, the first piezoelectric sheet 31, the second piezoelectric sheet 32 and the damping structure 6 are arranged in a manner substantially the same as that of the second embodiment, and are not described in detail herein.
[0068] It should be noted that the protective structure 7 is configured as a double-sided adhesive tape 11 of a hollow rectangular structure. The vibrated surface is connected with a middle frame structure 12, which is configured as a plate. A fixing groove 121 is provided on the plate-like structure, and the edge of the bottom of the shell is fixedly connected to the inner wall of the fixing groove 121 through the double-sided adhesive tape 11. Therefore, when the first piezoelectric sheet 31 and the second piezoelectric sheet 32 are deformed, the damping structure 6 is driven to vibrate and transmit the vibration to the middle frame structure 12 and the vibrated surface 8, thereby realizing the sound of the speaker. By introducing the middle frame structure 12, the fixing method between the speaker and the vibrated surface 8 is made more flexible, thereby meeting the needs of different installation occasions and expanding the usability of the speaker.
[0069] It is easy to understand that the above structure of the speaker includes but is not limited to the description in the embodiment of the present invention, wherein the first piezoelectric sheet, the second piezoelectric sheet, the steel plate, the counterweight component, the annular foam, the double-sided tape and the middle frame structure can be freely combined according to actual needs.
[0070] Embodiment 6
[0071] Fig.12 FIG. 1 is an exploded view of the overall structure of the electronic device according to the sixth embodiment of the present invention. Fig.12 The electronic device of this embodiment includes a speaker, a screen 13, a housing 14 and a frame 15. Among them, the screen 13 or the housing 14 can be used as a vibrated surface, and the speaker is fixedly connected to the vibrated surface. The speaker of this embodiment can adopt the speaker structure of any one of the first to fifth embodiments, and the vibrated surface is the screen 13. Therefore, when the piezoelectric sheet in the speaker vibrates, the vibration is transmitted to the screen surface through the damping structure, so that the electronic device can make sounds, meeting the use needs of the electronic device in different occasions.
[0072] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A loudspeaker, characterized in that: The speaker comprises: At least one piezoelectric sheet (3), comprising a first piezoelectric sheet (31) and a second piezoelectric sheet (32); A power supply circuit (2), connected to the piezoelectric sheet (3) and an external circuit, and used to provide voltage excitation for the piezoelectric sheet (3); The mounting plate (4) is configured as a hollow rectangular structure, the first piezoelectric sheet (31) is fixedly connected to one side of the mounting plate (4), the second piezoelectric sheet (32) is arranged on the other side of the mounting plate (4) opposite to the first piezoelectric sheet (31), and the first piezoelectric sheet (31) and the second piezoelectric sheet (32) are fixedly connected corresponding to the hollow portion of the mounting plate (4); at least one damping structure (6) fixedly connected to the piezoelectric sheet (3) and the vibrated surface (8) for transmitting vibration to the vibrated surface (8); and a shell, fixedly connected to the mounting plate (4), and used to enclose the piezoelectric sheet (3), the power supply circuit (2) and the mounting plate (4), the shell having a through hole (51) for the damping structure (6) to pass through; Wherein, the vibrated surface (8) is a screen or a housing of an electronic device.
2. The loudspeaker according to claim 1, characterized in that The speaker also includes: A protective structure (7) is arranged between the shell and the vibrated surface (8) and is used to avoid noise generated by collision between the shell and the vibrated surface (8).
3. The loudspeaker according to claim 2, characterized in that The speaker also includes: A steel plate (9) is arranged in the area surrounded by the protection structure (7) and connected between the damping structure (6) and the vibrated surface (8).
4. The loudspeaker according to claim 1, characterized in that The speaker also includes: At least one weight component (10) is fixedly connected to the first piezoelectric sheet (31), and projections of the weight component (10) and the damping structure (6) along the deformation direction of the piezoelectric sheet (3) do not overlap.
5. The loudspeaker according to claim 4, characterized in that The weight component (10) is located at an outer corner or a central position of the piezoelectric sheet (3).
6. The loudspeaker according to claim 1, characterized in that The damping structure (6) is located at an outer corner or a central position of the piezoelectric sheet (3).
7. The loudspeaker according to claim 1, characterized in that The power supply circuit (2) comprises a flexible circuit board; The housing is provided with a mounting groove (101); The flexible circuit board is provided with a connecting portion (21) and a conductive portion (22), the connecting portion (21) is fixedly connected to the piezoelectric sheet (3), and the conductive portion (22) extends from the inside of the shell through the mounting groove (101) to the outside of the shell and is connected to an external circuit.
8. The loudspeaker according to claim 1, characterized in that The vibrated surface (8) is connected to a plate-shaped middle frame structure (12), a fixing groove (121) is provided on the middle frame structure (12), and the outer wall of the shell is fixedly connected to the inner wall of the fixing groove (121).
9. An electronic device, characterized in that: The electronic device comprises a speaker as claimed in any one of claims 1-8.
Citation Information
Patent Citations
Electronic equipment
CN108334165A
Matrix form piezoelectricity panel speaker with a weighting structure and a damping structure
CN201623850U
Loudspeaker and electronic equipment
CN211909160U