An improved bearing plate and bearing device
By designing a right-angle vent structure on the silicon wafer bearing disk, the pollution and position inaccurate problems caused by improper exhaust during the processing of the silicon wafer are solved, and higher processing quality and position accuracy are achieved.
Patent Information
- Application Number
- CN202010491857.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-06-02
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2040-06-02
AI Technical Summary
The existing silicon wafer carrier disks cause the bottom of the silicon wafer to be exposed during the exhaust process, which is susceptible to dust or other impurities, affecting the processing quality.
An improved load-bearing disk is designed, adopting a right-angle vent structure, and air is discharged under the load-bearing frame through the horizontal and vertical sections, preventing external air and impurities from entering the storage tank, ensuring the position accuracy and processing quality of the silicon wafer.
It effectively solves the problems of contamination and inaccurate position during the processing of silicon wafers, and improves the processing quality and position accuracy of silicon wafers.
Smart Images
Figure CN111477576B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to battery slice processing and transportation equipment, and in particular to an improved carrying plate and a carrying device. Background Art
[0002] The production process of solar silicon wafers generally includes silicon wafer inspection, surface texturing and pickling, diffusion bonding, dephosphorized silicon glass, plasma etching and pickling, anti-reflection film coating, screen printing and rapid sintering. During the production and processing process, multiple silicon wafers to be processed are generally placed on a silicon wafer carrier frame, and then the entire silicon wafer carrier frame is connected and installed on the transport track. The movement of the silicon wafer carrier frame drives the transfer of silicon wafers between various processing stations, thereby realizing batch processing of silicon wafers. The general silicon wafer carrier frame on the market is equipped with multiple upper and lower interconnected bearing slots. When placing the silicon wafers to be processed, the general practice is to first set a hook on the bearing slot, and then place the silicon wafers to be processed on the hook; for example, the utility model patent "graphite cabinet hook for solar silicon wafer coating machine" with authorization announcement number CN205473976U and the utility model patent "a double-sided coated graphite frame suitable for PERC cells" with authorization announcement number CN205792426U. In addition, for specific silicon wafer processing techniques, such as when the coating layer of the silicon wafer is thin, a carrier plate is also used to support the silicon wafer to ensure that the coating of the silicon wafer is protected during the processing and that the silicon wafer can be evenly heated, etc., such as the utility model patent "A silicon wafer carrier plate and a silicon wafer carrier device" with the authorization announcement number CN209963035U; however, when the carrier plate is used as a loading tool, since the bottom surface of the carrier plate is sealed, when the silicon wafer to be processed is placed on the storage slot of the carrier plate, it is necessary to perform a venting process, that is, to discharge the air between the silicon wafer and the storage slot, so as to ensure that the silicon wafer is placed in the storage slot in a close fit, thereby ensuring the position accuracy of the silicon wafer and improving the processing quality; to solve the exhaust problem, the conventional practice is to directly set an air vent on the storage slot of the carrier plate, and the air vent runs through the storage slot and the space below the carrier plate to achieve an exhaust effect; however, such an exhaust method causes the bottom of the silicon wafer corresponding to the air vent to be exposed, which is easily contaminated by dust or other impurities during the processing, affecting the processing effect. Summary of the invention
[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide an improved carrier plate, which can ensure that the air between the storage tank and the silicon wafer is discharged smoothly and can ensure the processing quality of the silicon wafer.
[0004] Another object of the present invention is to provide an improved carrying device.
[0005] The purpose of the present invention is achieved through the following technical solutions:
[0006] An improved carrier plate, characterized in that it includes a main body plate and a limit member for matching and installing with a carrier frame; wherein the limit member is arranged on the bottom surface of the main body plate, and the outer contour of the limit member is arranged corresponding to the inner contour of the carrier groove on the carrier frame; the storage groove is provided with a right-angle air vent, which includes a horizontal section and a vertical section, the outlet of the horizontal section is arranged on the inner wall of the storage groove, and the outlet of the vertical section is arranged at the bottom of the main body plate.
[0007] The working principle of the above improved carrier plate is:
[0008] First, a bearing frame is placed in each bearing slot on the bearing frame, and the limiting piece on the bottom surface of the main body plate is matched and placed in the bearing slot to limit and fix the bearing plate and prevent the bearing plate from moving; then, multiple silicon wafers to be processed are placed one by one in multiple storage slots on the top surface of the main body plate, thereby completing the installation of the bearing plate and the placement of the silicon wafers to be processed. When placing the silicon wafers, the air in the storage slot passes through the horizontal section and the vertical section of the right-angle vent in turn, and is finally discharged to the bottom of the bearing frame, avoiding residual air between the storage slot and the silicon wafer, so as to ensure that the silicon wafer is placed in the storage slot in a fit, thereby ensuring the position accuracy of the silicon wafer. In addition, since the right-angle vent adopts two perpendicular paths (horizontal section and vertical section), external air and impurities cannot directly enter the storage slot through the outlet of the vertical section to contact the silicon wafer, thereby avoiding the bottom surface of the silicon wafer from being contaminated and damaged, which is conducive to improving the processing quality of the silicon wafer.
[0009] According to a preferred embodiment of the present invention, the corners of the storage slots are all chamfered.
[0010] Preferably, the outlet of the horizontal section is arranged at a middle position of the chamfer.
[0011] Preferably, the chamfered corners at the corners of the storage groove and the inner wall of the storage groove are rounded.
[0012] In a preferred embodiment of the present invention, the depth of the storage groove is smaller than the thickness of the silicon wafer.
[0013] According to a preferred embodiment of the present invention, a pick-up and release groove is further provided on the top surface of the main body plate, the area of the pick-up and release groove is larger than that of the storage groove, and the depth of the pick-up and release groove is shallower than that of the storage groove.
[0014] Preferably, four corners of the pick-and-place slot are each provided with an outwardly disposed circular slot, and the circular slot is communicated with the pick-and-place slot.
[0015] In a preferred embodiment of the present invention, the limiting member comprises four groups of limiting columns, and the connecting line of two limiting columns of each group of limiting columns is respectively arranged parallel to the four edges of the main plate; the connecting line of the four groups of limiting columns constitutes the outer contour of the limiting member.
[0016] In a preferred embodiment of the present invention, the width of the main plate is set corresponding to the lateral dimension of the supporting frame, and a plurality of the storage slots and the picking and placing slots are provided on the main plate. The plurality of storage slots and the picking and placing slots are arranged along the lateral direction, and the plurality of storage slots are provided with the right-angle vents.
[0017] An improved carrying device, characterized in that it comprises a carrying frame and the improved carrying plate, wherein the carrying frame comprises a plurality of supporting rods, a frame and a connecting assembly, wherein the plurality of supporting rods are crisscrossedly arranged in the frame and both ends of the supporting rods are connected to the frame, the plurality of crisscrossed supporting rods form a plurality of carrying grooves, and the carrying plate is arranged in the carrying grooves.
[0018] Compared with the prior art, the present invention has the following beneficial effects:
[0019] 1. In the present invention, by setting the right-angle vent hole, when placing the silicon wafer, the air in the storage slot passes through the horizontal section and the vertical section of the right-angle vent hole in sequence and then is discharged to the bottom of the carrying frame, avoiding residual air between the storage slot and the silicon wafer, so as to ensure that the silicon wafer is placed in the storage slot in a close fit, thereby ensuring the position accuracy of the silicon wafer.
[0020] 2. In the present invention, since the right-angle vent hole adopts two perpendicular paths (horizontal section and vertical section), external air and impurities cannot directly enter the storage tank through the outlet of the vertical section and contact the silicon wafer, thereby avoiding the bottom surface of the silicon wafer from being contaminated and damaged, which is beneficial to improving the processing quality of the silicon wafer; at the same time, it can ensure that the air in the storage tank is discharged smoothly to achieve the degassing effect. The structure is simple but the effect is obvious, which can effectively solve the problems of degassing and silicon wafer pollution in actual production, and the design is very clever. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1-Figure 5 It is a structural schematic diagram of the first specific embodiment of the improved carrier plate of the present invention, wherein: Figure 1 is a top view, Figure 2 for Figure 1 The cross-sectional view in the A direction, Figure 3 For bottom view, Figure 4 For a stereogram, Figure 5 for Figure 4 Enlarged view of B.
[0022] Figure 6-Figure 9 It is a structural schematic diagram of a second specific embodiment of the improved carrying device of the present invention, wherein: Figure 6 To omit part of the three-dimensional diagram of the carrier plate, Figure 7 for Figure 6 A three-dimensional view of the center carrier plate. Figure 8 for Figure 7 The enlarged image of C in the middle. Fig. 9 This is a bottom view of the carrier plate.
[0023] Figure 10-Figure 15 FIG. 1 is a schematic diagram of the structure of the carrying frame in the second specific embodiment of the improved carrying device of the present invention, wherein: Fig.10 For a stereogram, Fig.11 for Fig.10 The enlarged image of D in the middle, Fig.12 This is a partial stereogram of the guide rail assembly. Fig.13 is the front view of the cross support rod. Fig.14 A three-dimensional diagram of the support rod. Fig.15 This is the front view of the longitudinal reinforcement rod. DETAILED DESCRIPTION
[0024] The present invention is further described below in conjunction with examples and drawings, but the embodiments of the present invention are not limited thereto.
[0025] Example 1
[0026] See also Figure 1-Figure 5 The improved carrier plate of this embodiment comprises a main body plate 1a and a stopper for matching and mounting with a carrier frame; wherein the stopper is arranged on the bottom surface of the main body plate 1a, and the outer contour of the stopper corresponds to the inner contour of a carrier groove 15 on the carrier frame; a right-angle vent hole 10a is arranged on the storage groove 2a, and the right-angle vent hole 10a comprises a horizontal section 8a and a vertical section 9a, the outlet of the horizontal section 8a is arranged on the inner wall of the storage groove 2a, and the outlet of the vertical section 9a is arranged at the bottom of the main body plate 1a. In this embodiment, the horizontal section 8a is rectangular, and the vertical section 9a is oblong.
[0027] See also Figure 4 and Figure 5 The corners of the storage slot 2a are all provided with chamfers 5a. The chamfers 5a can match the silicon wafers provided with chamfers 5a, and when workers take out the silicon wafers, they can also start to take them out from the chamfers 5a of the silicon wafers, which makes the operation more convenient and can avoid being pricked by the corners of the silicon wafers.
[0028] See also Figure 2 , Figure 4 and Figure 5 , the outlet of the horizontal section 8a is arranged at the middle position of the chamfer 5a.
[0029] See also Figure 2 , Figure 4 and Figure 5The chamfer 5a at the corner of the storage slot 2a and the inner wall of the storage slot 2a are all rounded. This prevents the sharp corners of the silicon wafer from directly contacting the inner wall of the storage slot 2a, and avoids the collision between the side of the silicon wafer and the inner wall of the storage slot 2a, which is beneficial to protecting the silicon wafer; at the same time, only the middle part of the chamfer 5a of the inner wall of the entire storage slot 2a is a plane, which serves as the positioning and fixing of the silicon wafer, has a simple structure, effectively reduces the area of direct contact between the silicon wafer and the inner wall of the storage slot 2a, and is cleverly designed.
[0030] In this embodiment, the depth of the storage slot 2a is smaller than the thickness of the silicon wafer, so that it is convenient for workers to take out the silicon wafer from the limited storage slot 2a through the raised edge of the silicon wafer, and the structure is simple and practical.
[0031] See also Figure 1 , Figure 2 , Figure 4 and Figure 5 The top surface of the main body plate 1a is also provided with a pick-up and placement groove 3a, the area of which is larger than that of the storage groove 2a, and the depth of which is shallower than that of the storage groove 2a. Thus, on the one hand, by providing the pick-up and placement groove 3a, when it is necessary to take out the processed silicon wafer, the worker can pick it up from the edge of the silicon wafer through the gap between the pick-up and placement groove 3a and the storage groove 2a, thereby completing the removal of the silicon wafer, which is convenient for operation; on the other hand, by providing the pick-up and placement groove 3a, it is possible to avoid the edge of the silicon wafer from being completely exposed, and under the protection of the pick-up and placement groove 3a, it is beneficial to improve the processing accuracy of the silicon wafer; in addition, the pick-up and placement groove 3a with a larger area can also hold silicon wafers of larger size, thereby being able to accommodate two silicon wafers of different sizes, which is a clever design.
[0032] See also Figure 1 , Figure 4 and Figure 5 , the four corners of the pick-and-place groove 3a are all provided with outwardly arranged circular grooves 4a, which are connected to the pick-and-place groove 3a. When it is necessary to store silicon wafers on the pick-and-place groove 3a, the provision of the circular grooves 4a can prevent the corners of the silicon wafers from directly touching the corners of the pick-and-place groove 3a, and can effectively protect the corners of the silicon wafers. In this embodiment, the top edge of the pick-and-place groove 3a is provided with a chamfer, which can prevent the upper edge of the silicon wafer placed in the pick-and-place groove 3a from being damaged, which is beneficial to protecting the silicon wafers.
[0033] In addition, when the silicon wafer matching the placing and picking groove 3a is processed, exhaust can be directly performed through the right-angle vent 10a in the storage groove 2a; of course, the right-angle vent 10a can also be provided on the placing and picking groove 3a of this embodiment to facilitate air exhaust.
[0034] See also Figure 3, the limiting member includes four groups of limiting columns 7a, and the connecting lines of the two limiting columns 7a of each group of limiting columns 7a are respectively arranged parallel to the four edges of the main plate 1a; the connecting lines of the four groups of limiting columns 7a constitute the outer contour of the limiting member. Through the setting of the limiting columns 7a, the coordination with the bearing groove 15 is achieved, and the position of the main plate 1a is limited; the use of the limiting columns 7a has a simple structure and can reduce the weight of the bearing plate, thereby reducing the pressure on the silicon wafer bearing frame and avoiding deformation of the silicon wafer bearing frame. A plurality of reinforcing ribs 6a are also provided at the bottom of the main plate 1a, and the plurality of reinforcing ribs 6a are crisscrossed. The setting of the reinforcing ribs 6a is conducive to improving the bearing capacity and anti-deformation ability of the main plate 1a, ensuring that the main plate 1a maintains a horizontal posture and avoids deformation.
[0035] In this embodiment, the main body plate 1a is made of graphite material. The main body plate 1a made of graphite stores silicon wafers. On the one hand, the graphite main body plate 1a has good thermal conductivity and is in contact with the entire bottom surface of the silicon wafer, so the silicon wafer can be evenly heated, which is conducive to better coating processing of the silicon wafer under specific conditions; on the other hand, the density of the graphite main body plate 1a is better than that of the CC composite plate, and the surface after processing is smoother, avoiding damage to the coating layer on the silicon wafer, and the main body plate 1a with good density and high surface finish can avoid adsorbing dust during the coating process, which is conducive to improving the coating processing accuracy of the silicon wafer.
[0036] See also Figure 1-Figure 5 The working principle of the improved carrier plate of this embodiment is:
[0037] First, a corresponding bearing frame is placed in each bearing slot 15 on the bearing frame, and the limiting member on the bottom surface of the main plate 1a is matched and placed in the bearing slot 15 to achieve the limiting and fixing of the bearing plate and prevent the bearing plate from moving; then, multiple silicon wafers to be processed are placed one by one in multiple storage slots 2a on the top surface of the main plate 1a, thereby completing the installation of the bearing plate and the placement of the silicon wafers to be processed. When placing the silicon wafers, the air in the storage slot 2a passes through the horizontal section 8a and the vertical section 9a of the right-angle vent 10a in sequence, and finally discharged to the bottom of the bearing frame, avoiding residual air between the storage slot 2a and the silicon wafer, so as to ensure that the silicon wafer is placed in the storage slot 2a in a close relationship, thereby ensuring the position accuracy of the silicon wafer. In addition, since the right-angle vent 10a adopts two mutually perpendicular paths (horizontal section 8a and vertical section 9a), external air and impurities cannot directly enter the storage slot 2a through the outlet of the vertical section 9a to contact the silicon wafer, thereby avoiding the bottom surface of the silicon wafer from being contaminated and damaged, which is conducive to improving the processing quality of the silicon wafer.
[0038] The improved bearing device of this embodiment comprises a bearing frame and the improved bearing plate, wherein the bearing frame comprises a plurality of supporting rods, a frame and a connecting assembly, wherein the plurality of supporting rods are arranged in a crisscross pattern in the frame and both ends of the supporting rods are connected to the frame, and the plurality of crisscross supporting rods form a plurality of bearing grooves 15, wherein the bearing plate is arranged in the bearing grooves 15. The bearing frame of the improved bearing device of this embodiment, for its specific structure, can refer to the graphite bearing frame in the prior art.
[0039] Example 2
[0040] See also Figure 6-Figure 9 The difference between the improved carrier plate of this embodiment and the embodiment 1 is that the width of the main plate 1a is set corresponding to the lateral dimension of the carrier frame, and the main plate 1a is provided with a plurality of storage slots 2a and the pick-up and release slots 3a, which are arranged in a lateral direction, and the plurality of storage slots 2a are provided with the right-angle vents 10a. By providing a plurality of storage slots 2a on the main plate 1a, a plurality of silicon wafers can be loaded, simplifying the installation process of the carrier plate and facilitating operation; at the same time, the width of the main plate 1a matches the lateral width of the carrier frame to form a rectangular or long strip carrier plate, which is convenient for the selection of the plate during processing, and there is no need to cut the plate into a single independent carrier plate, and the storage slots 2a can be directly processed on the rectangular or long strip plate, which effectively reduces the processing difficulty and processing cost.
[0041] The two ends of the top surface of the main body plate 1a are left hollow so that the solid part of the main body plate 1a can be supported on the guide rail rods on both sides of the supporting frame to facilitate the installation of the main body plate 1a and the supporting frame, while also avoiding placing the silicon wafer near the edge of the top surface of the main body plate 1a.
[0042] See also Figure 6 , Figure 10-Figure 15 The difference between the improved bearing device of this embodiment and the embodiment 1 is that the plurality of supporting rods include a plurality of transverse supporting rods 1 extending transversely and a plurality of supporting fixing rods 3, and the frame includes two sets of guide rail rods 5; the two sets of guide rail rods 5 extend in the longitudinal direction and are arranged opposite to each other, the plurality of transverse supporting rods 1 are arranged at equal intervals, and the two ends of each transverse supporting rod 1 are detachably mounted on the two sets of guide rail rods 5, and the space surrounded by every two transverse supporting rods 1 and the two sets of guide rail rods 5 constitutes a bearing slot 15; a plurality of supporting fixing rods 3 are arranged between every two transverse supporting rods 1. And the supporting fixing rods 3 and the transverse supporting rods 1 are arranged perpendicular to each other.
[0043] See also Fig.12 and Fig.13The inner side of the guide rail rod 5 is provided with a plurality of limit installation grooves 9 arranged in the longitudinal direction, the plurality of limit installation grooves 9 are arranged at equal intervals, and the limit installation grooves 9 are in the shape of a "7"; both ends of the transverse support rod 1 are provided with installation hooks 11 arranged at right angles to match the limit installation grooves 9; the installation hooks 11 at both ends of the transverse support rod 1 are correspondingly arranged on the limit installation grooves 9 on the two groups of guide rail rods 5. The arrangement of the limit installation grooves 9 and the installation hooks 11 facilitates the installation and disassembly of the transverse support rod 1 and the guide rail rod 5, and the limit effect is good, and the transverse and longitudinal directions of the transverse support rod 1 are limited at the same time, the design is ingenious, and the structure is simple.
[0044] See also Figure 6 , Fig.10 , Fig.11 , corner connectors 7 are provided at the corners between the two ends of the transverse support rod 1 and the guide rail rod 5, and connecting holes 10 are provided at the corresponding positions of the guide rail rod 5 and the transverse support rod 1, and the corner connectors 7 are connected to the transverse support rod 1 and the guide rail rod 5 by bolts. The provision of the corner connectors 7 further enhances the stability between the transverse support rod 1 and the guide rail rod 5, making the connection between the two more secure.
[0045] See also Figure 6 , Fig.10 , Fig.11 and Fig.14 , a plurality of mounting holes 6 are provided on the transverse support rod 1, and the mounting holes 6 on each transverse support rod 1 are arranged one by one; the support fixing rod 3 is composed of a round rod, and the two ends of the support fixing rod 3 are arranged in cooperation with the mounting holes 6. In this way, the installation connection between the support fixing rod 3 and the transverse support rod 1 is realized, which is convenient for assembly and disassembly, and easy for processing. In this embodiment, the mounting hole 6 is a through hole, and the two ends of the support fixing rod 3 are provided with mounting columns 13, and the mounting columns 13 match the mounting hole 6, and the diameter of the main part of the support fixing rod 3 is larger than the mounting hole 6; in this way, the mounting hole 6 is set as a through hole, which is convenient for the installation connection of the support fixing rod 3 on the front and rear sides of the transverse support rod 1, so that the support fixing rod 3 can be installed at the corresponding position according to actual needs.
[0046] See also Fig.10 , the support fixing rods 3 between two adjacent groups of transverse supporting rods 1 are staggered. In this embodiment, the support fixing rods 3 between two adjacent groups of transverse supporting rods 1 are randomly arranged, either staggered or corresponding to each other.
[0047] See also Fig.10, a transverse reinforcing rod 2 is provided in front of the front transverse supporting rod 1 and in the rear of the rear transverse supporting rod 1, both ends of the transverse reinforcing rod 2 are connected to the two guide rail rods 5, and a plurality of supporting fixing rods 3 are provided between the transverse reinforcing rod 2 and the transverse supporting rod 1. In this embodiment, the corners of the transverse reinforcing rod 2 and the guide rail rod 5 are further fixedly connected by corner connectors 7 and bolts. The provision of the transverse reinforcing rod 2 is conducive to improving the stability of the entire bearing frame. In this embodiment, the two ends of the transverse reinforcing rod 2 are also provided with mounting hooks 11, and the corresponding positions of the guide rail rods 5 are also provided with limiting mounting grooves 9 to achieve position limitation and fixation of the transverse reinforcing rod 2.
[0048] See also Fig.10 and Fig.11 , the inner sides of the two sets of guide rail rods 5 are provided with longitudinal reinforcing rods 4, the transverse support rods 1 and the transverse reinforcing rods 2 are provided with limiting grooves 12 at the corresponding positions of the longitudinal reinforcing rods 4, and the longitudinal reinforcing rods 4 are provided with connecting grooves 14 matching the limiting grooves 12; the longitudinal reinforcing rods 4 are provided with the corner connectors 7 between the transverse support rods 1 and the transverse reinforcing rods 2. Through the arrangement of the longitudinal reinforcing rods 4, the transverse support rods 1 and the transverse reinforcing rods 2 are matched, so that the surroundings of the entire bearing frame are more solid and have better stability, and all the transverse support rods 1 can be further limited and connected and installed, thereby improving the stability of the entire bearing frame. In this embodiment, the limiting grooves 12 on the transverse support rods 1 face downward, the limiting grooves 12 on the transverse reinforcing rods 2 face downward, and the connecting grooves 14 on the longitudinal reinforcing rods 4 are arranged to match and correspond. In this way, the limiting grooves 12 with different directions are arranged, which is conducive to improving the fastening and stability between the longitudinal reinforcing rods 4, the transverse reinforcing rods 2 and the transverse support rods 1 after installation.
[0049] See also Fig.12 The guide rail assembly 5 includes a plurality of guide rail plates 8, which are arranged in a lateral direction, and the vertical height of each guide rail plate 8 is greater than the lateral width. In this embodiment, the plurality of guide rail plates 8 are connected together by bolts. By providing such a guide rail assembly 5, the bending resistance of the guide rail plates 8 in the vertical direction is significantly increased, thereby improving the deformation resistance of the entire bearing frame, ensuring that the top surface of the silicon wafer remains horizontal during processing and transportation, thereby improving the processing quality of the silicon wafer.
[0050] The transverse supporting rods, supporting fixing rods, transverse reinforcing rods, longitudinal reinforcing rods and guide rail assembly rods of the load-bearing frame in this embodiment are all made of graphite or CC composite materials.
[0051] The above is a preferred embodiment of the present invention, but the embodiment of the present invention is not limited to the above content. Any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principles of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.
Claims
1. An improved carrier plate, characterized in that: The invention comprises a main body plate and a stopper for matching and installing with a bearing frame; wherein the stopper is arranged on the bottom surface of the main body plate, and the outer contour of the stopper is arranged corresponding to the inner contour of a bearing groove on the bearing frame; the main body plate is provided with a storage groove, and the storage groove is provided with a right-angle vent hole, and the right-angle vent hole comprises a horizontal section and a vertical section, and the outlet of the horizontal section is arranged on the inner wall of the storage groove, and the outlet of the vertical section is arranged at the bottom of the main body plate; The corners of the storage tank are all provided with chamfers; the outlet of the horizontal section is arranged at the middle position of the chamfers; The depth of the storage groove is smaller than the thickness of the silicon wafer; The top surface of the main body plate is also provided with a taking and placing groove, the area of which is larger than that of the storage groove, and the depth of which is shallower than that of the storage groove.
2. The improved carrier plate according to claim 1, characterized in that: The chamfered corners at the corners of the storage groove and the inner wall of the storage groove are all rounded.
3. The improved carrier plate according to claim 1, characterized in that: The four corners of the pick-and-place slot are all provided with outwardly arranged circular slots, which are communicated with the pick-and-place slot.
4. The improved carrier plate according to claim 1, characterized in that: The limiting member comprises four groups of limiting columns, and the connecting line of the two limiting columns in each group of limiting columns is respectively arranged parallel to the four edges of the main plate; the connecting line of the four groups of limiting columns constitutes the outer contour of the limiting member.
5. The improved carrier plate according to claim 1, characterized in that: The width of the main body plate is set corresponding to the transverse dimension of the carrying frame. The main body plate is provided with a plurality of storage slots, which are arranged in a transverse direction, and each of the plurality of storage slots is provided with the right-angle vents.
6. An improved bearing device, characterized in that: It comprises a carrying frame and the improved carrying plate as described in any one of claims 1 to 5, wherein the carrying frame comprises a plurality of supporting rods, a frame and a connecting assembly, wherein the plurality of supporting rods are crisscrossedly arranged in the frame and both ends of the supporting rods are connected to the frame, the plurality of crisscrossed supporting rods form a plurality of carrying grooves, and the carrying plate is arranged in the carrying grooves.