Alignment device, wafer bonding equipment and wafer bonding test equipment

Abstract

The utility model provides an alignment device, wafer bonding equipment and wafer bonding test equipment, and relates to the technical field of semiconductors. The alignment device comprises a carrying table with a placing area, and at least two first alignment assemblies and a second alignment assembly which are arranged on the carrying table, the number of the first alignment assemblies is at least two, each first alignment assembly specifically comprises a first elastic alignment piece upwards extending out of the placing area, and the first elastic alignment pieces can move downwards when being pressed; the second alignment assembly comprises a rotating arm capable of rotating relative to the carrying table and an elastic reset piece connected to the rotating arm, and the elastic reset piece is used for driving the rotating arm to rotate towards the placing area; a second elastic alignment piece is arranged at the tail end of the rotating arm; the second elastic alignment piece upwards extends out of the placing area and can downwards move when being pressed; the first elastic alignment piece and the second elastic alignment piece are arranged in the containing area in a spaced and surrounding mode. According to the alignment device, alignment operation on the wafer is convenient, stable alignment on the wafer can be kept in the bonding process, and the bonding yield is high.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to an alignment device, a wafer bonding device and a wafer bonding test device. Background Art

[0002] Wafer bonding technology refers to the process of tightly bonding two mirror-polished homogeneous or heterogeneous wafers by chemical and physical action. After the wafers are bonded, the atoms in the cross section react to form covalent bonds under the action of external forces, and the bonding interface reaches a specific bonding strength. Before wafer bonding, the two wafers need to be aligned using an alignment device. In the prior art, multiple rigid pusher motors and other rigid push components are generally used to push and align the wafers. The operation is cumbersome and requires high precision in the push stroke of the rigid push component. After the wafer alignment operation is completed, the rigid push component needs to be withdrawn to the initial position to avoid interference caused by the subsequent pressing of the upper and lower bonding plates, which causes the wafer to slip easily during the vacuuming process in the bonding chamber and the pressing process of the upper bonding plate, resulting in invalid alignment, waste bonding, and low bonding yield. Utility Model Content

[0003] The purpose of the utility model is to provide an alignment device, a wafer bonding device and a wafer bonding test device to solve the technical problems that the existing alignment device has complicated wafer alignment operation and cannot maintain stable alignment of the wafer during the bonding process, resulting in easy wafer slippage and low bonding yield.

[0004] In order to solve the above problems, the utility model provides an alignment device, including a carrier with a placement area and:

[0005] At least two first alignment assemblies include first elastic alignment members extending upward from the placement area and capable of moving downward when compressed; and

[0006] A second alignment assembly includes a rotating arm and an elastic reset member connected to the rotating arm, wherein the elastic reset member is used to drive the rotating arm to rotate toward the placement area; a second elastic alignment member is provided at the end of the rotating arm, and the second elastic alignment member extends upward from the placement area and can move downward when pressed;

[0007] Wherein, the first elastic alignment member and the second elastic alignment member are arranged around the placement area at intervals, and are used for abutting and aligning the wafer placed in the placement area.

[0008] Optionally, the second alignment assembly includes a connecting seat, which is detachably fixed to the carrier, the head end of the rotating arm is rotatably connected to the connecting seat, and the elastic reset member is connected between the connecting seat and the rotating arm.

[0009] Optionally, a receiving groove is provided on the top of the carrier, the connecting seat is connected to the top of the carrier, the rotating arm includes a first arm segment and a second arm segment from the head end to the tail end, and the second arm segment is completely received in the receiving groove.

[0010] Optionally, the second alignment assembly is accommodated in the accommodation groove, and the second arm segment is connected to the bottom of the first arm segment.

[0011] Optionally, a limiting groove is provided at the bottom of the accommodating groove, and the distance between the limiting groove and the center of the placement area is a preset distance smaller than the radius of the wafer; a downwardly protruding mounting boss is provided at the end of the second arm segment, and the mounting boss extends into the limiting groove, and the second elastic alignment member is arranged on the mounting boss.

[0012] Optionally, the connecting seat includes a fixed connecting part detachably fixed to the carrier and a rotating connecting part connected to one side of the fixed connecting part, and an accommodating space is enclosed between the bottom wall of the rotating connecting part and the side wall of the fixed connecting part; the rotating arm is rotatably connected to the top of the rotating connecting part, and a limiting boss is provided at the bottom of the rotating arm, and the elastic reset member is accommodated in the accommodating space and connected between the fixed connecting part and the limiting boss.

[0013] Optionally, the first alignment assembly includes a base shell, a limit column and an elastic member, the base shell is provided with a plug-in slot, the limit column is slidably plugged into the plug-in slot, the elastic member is accommodated in the plug-in slot and connected between the base shell and the limit column; the top surface of the carrier is provided with a mounting groove, the base shell is embedded in the mounting groove, and an avoidance gap is left between the top end surface of the base shell and the notch of the mounting groove.

[0014] Optionally, the carrier is detachably plugged with a positioning pin, the positioning pin is used to match the notch of the wafer, and the area surrounded by the positioning pin and the first elastic alignment member in the placement area is smaller than a half-circumference area.

[0015] The utility model also provides a wafer bonding device, including a bonding chamber and the above-mentioned alignment device, wherein the alignment device is arranged in the bonding chamber, a pressure plate is provided in the bonding chamber, the pressure plate is located above the placement area in the alignment device, and the pressure plate and the carrier can be raised and lowered relative to each other.

[0016] The utility model also provides a wafer bonding test equipment, including a bonding chamber, a conveying component and the above-mentioned alignment device, wherein the conveying component is connected to the alignment device and is used to send the alignment device into the bonding position of the bonding chamber or send the bonding chamber out of the bonding chamber to the placement position; a pressure plate is provided in the bonding chamber, the pressure plate is located above the placement area in the alignment device, and the pressure plate and the carrier can be raised and lowered relative to each other.

[0017] When the alignment device provided by the utility model is applied to wafer bonding equipment and wafer bonding testing equipment, firstly, during the alignment operation of the alignment device on the wafer, it is only necessary to adjust the rotating arm to rotate away from the placement area to a position avoiding the placement area, and stop adjusting the rotation of the rotating arm after the rough position accuracy is placed in the placement area. The rotating arm can automatically push the wafer to complete the alignment operation under the restoring action of the elastic reset part, and the operation is convenient and the alignment efficiency is high. In addition, in the process of adjusting the rotation avoidance of the rotating arm, the rotating arm and the second elastic alignment part can be rotated to a certain range outside the placement area, and the corresponding accuracy limit of the avoidance rotation stroke is relatively low, thereby further improving the convenience of use and operation, and effectively reducing the use of rigid pushing parts to promote wafer alignment, and the pushing stroke is too small to complete precise alignment, and if it is too large, its rigid pushing force will cause wafer fragments.

[0018] Secondly, during the subsequent vacuum pumping operation and bonding process, the first elastic alignment part and the second elastic alignment part of the alignment device do not need to be withdrawn, and the wafer can always be kept clamped and aligned, thereby ensuring the position accuracy of the wafer during the vacuum pumping operation and bonding process, and correspondingly improving the bonding accuracy and yield of the wafer bonding equipment to the wafer, reducing the airflow disturbance during the vacuum pumping process and the vibration generated during the bonding process, which may cause the wafer to slip and affect its position accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A top view of the alignment device provided by an embodiment of the utility model when clamping and aligning a wafer;

[0021] Figure 2 A front view of the alignment device provided by the embodiment of the utility model when clamping and aligning a wafer;

[0022] Figure 3 A top view of an alignment device provided by an embodiment of the utility model;

[0023] Figure 4 This is an axonometric view of the second alignment component in the alignment device provided in an embodiment of the utility model.

[0024] Description of reference numerals:

[0025] 10-wafer; 11-slot; 100-carrier; 110-placing area; 120-accommodating groove; 130-limiting groove; 140-installing groove; 150-avoidance gap; 200-first alignment component; 210-base shell; 211-plug-in groove; 220-limiting column; 230-elastic member; 300-second alignment component; 310-rotating arm; 311-first arm section; 312-second arm section; 313-reinforcing rib; 314-installing boss; 315-limiting boss; 316-handle; 320-elastic reset member; 330-second elastic alignment member; 340-connecting seat; 341-fixed connection part; 342-rotating connection part; 343-accommodating space; 400-positioning pin. DETAILED DESCRIPTION

[0026] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] This embodiment provides an alignment device, such as Figure 3As shown, it includes a carrier 100 with a placement area 110 and a first alignment component 200 and a second alignment component 300 arranged on the carrier 100, wherein the first alignment component 200 is at least two, specifically including a first elastic alignment member extending upward from the placement area 110, and the first elastic alignment member can move downward when pressed; the second alignment component 300 includes a rotating arm 310 that can rotate relative to the carrier 100 and an elastic reset member 320 connected to the rotating arm 310, and the elastic reset member 320 is used to drive the rotating arm 310 to rotate toward the placement area 110; a second elastic alignment member 330 is provided at the end of the rotating arm 310, and the second elastic alignment member 330 extends upward from the placement area 110 and can move downward when pressed; wherein the first elastic alignment member and the second elastic alignment member 330 are spaced apart and surrounded in the placement area 110, and are used to abut and align the wafer 10 placed in the placement area 110.

[0030] The alignment device provided in this embodiment is used to push and align the wafer 10 placed in the placement area 110 so that the wafer 10 and the placement area 110 are coaxial. When in use, a rotational force is applied to the rotating arm 310 to adjust the rotating arm 310 to rotate in a direction away from the placement area 110, so that the second elastic alignment member 330 rotates to an area outside the placement area 110 to reduce interference with the placement of the wafer 10. During this process, the elastic reset member 320 is elastically deformed as the rotating arm 310 rotates. Then, the wafer 10 is roughly aligned. The wafer 10 is placed accurately in the placement area 110; then, the rotation force applied to the rotating arm 310 is stopped, and the elastic reset member 320 has an elastic recovery tendency due to elastic deformation, and an elastic recovery force capable of driving the rotating arm 310 to rotate toward the placement area 110 is applied to the rotating arm 310 accordingly. Under the recovery action of the elastic recovery force, the rotating arm 310 drives the second elastic alignment member 330 to rotate toward the wafer 10, and the second elastic alignment member 330 abuts against the wafer 10 and continues to push the wafer 10 to move toward the two first elastic alignment members, such as Figure 1 As shown, the wafer 10 is not moved until it abuts against all the first elastic alignment members and the second elastic alignment members 330 at the same time, thereby achieving alignment of the wafer 10 .

[0031] The alignment device can be used as a lower bonding plate in a wafer bonding device and a wafer bonding test device:

[0032] Among them, when the alignment device is applied to the wafer bonding equipment, the wafer bonding equipment specifically includes a bonding chamber and the above-mentioned alignment device. The alignment device is arranged in the bonding chamber. A pressure plate is provided in the bonding chamber. The pressure plate is located above the placement area 110 in the alignment device, and the pressure plate and the carrier 100 can be relatively raised and lowered to bond the wafer 10 placed in the placement area 110. Initially, the pressure plate is located above the carrier 100 with a placement gap between the two to ensure the placement of the wafer 10; then the above-mentioned wafer 10 alignment operation is performed, the first elastic alignment member and the second elastic alignment member 330 clamp the wafer 10 to limit it in the alignment position, and the top of the first elastic alignment member and the second elastic alignment member 330 are higher than the wafer 10 to ensure the limiting stability of the wafer 10; then the bonding chamber is closed and a vacuum operation is performed; continuously, the pressure plate and the carrier 100 are adjusted to move toward each other, the pressure plate first contacts the top of the first elastic alignment member and the second elastic alignment member 330 downward, and the first elastic alignment member and the second elastic alignment member 330 move downward and retract under the downward pressure of the pressure plate until the first elastic alignment member and the second elastic alignment member 330 are at the same height as the wafer 10, the pressure plate presses down on the wafer 10 placed in the placement area 110 to perform a bonding process on the wafer 10.

[0033] Among them, when the alignment device is applied to a wafer bonding test equipment, the wafer bonding test equipment specifically includes a bonding chamber, a conveying component and the above-mentioned alignment device, the conveying component is connected to the alignment device, and is used to send the alignment device into the bonding position of the bonding chamber or send it out of the bonding chamber to the placement position; a pressure plate is provided in the bonding chamber, and the pressure plate is located above the placement area 110 in the alignment device, and the pressure plate and the carrier 100 can be relatively raised and lowered to bond the wafer 10 placed in the placement area 110. The wafer bonding test equipment is used to test the bonding performance of the wafer 10 when the alignment device cooperates with the bonding chamber, pressure plate, etc. When in use, the operation difference from the above-mentioned alignment device applied to the wafer bonding equipment is only that when the wafer 10 alignment operation is performed, the alignment device is located at the placement position outside the bonding chamber. After completion, the transmission component will send the alignment device holding the wafer 10 into the bonding position in the bonding chamber, and then perform vacuum operation and bonding processing; then the transmission component will send the alignment device out of the bonding chamber to the placement position, remove the bonded wafer 10 to test its performance, and complete the bonding test of the wafer 10.

[0034] It can be seen that when the alignment device provided in this embodiment is applied to wafer bonding equipment and wafer bonding testing equipment, first, in the alignment operation of the alignment device on the wafer 10, it is only necessary to adjust the rotating arm 310 to rotate away from the placement area 110 to a position avoiding the placement area 110, and stop adjusting the rotation of the rotating arm 310 after the rough position accuracy is placed in the placement area 110. The rotating arm 310 can automatically push the wafer 10 to complete the alignment operation under the recovery action of the elastic reset member 320, which is convenient to operate and has high alignment efficiency. In the process of adjusting the rotation avoidance of the rotating arm 310, the rotating arm 310 and the second elastic alignment member 330 can be rotated to a certain range outside the placement area 110, and the corresponding accuracy limit of the avoidance rotation stroke is relatively low, thereby further improving its convenience in use and operation, and effectively reducing the use of rigid pushing members to push the wafer 10 for alignment. If the pushing stroke is too small, it cannot complete precise alignment, and if it is too large, its rigid pushing force will cause the wafer 10 to be broken.

[0035] Secondly, during the subsequent vacuum operation and bonding process, the first elastic alignment member and the second elastic alignment member 330 of the alignment device do not need to be withdrawn, and the clamping alignment of the wafer 10 can always be maintained, thereby ensuring the position accuracy of the wafer 10 during the vacuum operation and bonding process, and correspondingly improving the bonding accuracy and yield of the wafer bonding equipment to the wafer 10, reducing the airflow disturbance during the vacuum process and the vibration generated during the bonding process, which may cause the wafer 10 to slip and affect its position accuracy.

[0036] Among them, when the alignment device is applied to a wafer bonding device, a rotating driving member connected to the rotating arm 310 can be set to realize the driving of the rotating arm 310 to avoid rotation; when the alignment device is applied to a wafer bonding device or a wafer bonding testing device, the above-mentioned rotating driving member can be set, or the rotation of the rotating arm 310 can be directly adjusted manually to further improve the convenience and efficiency of the alignment operation.

[0037] Specifically, Figure 3 As shown, two first alignment components 200 may be used, and one second alignment component 300 may be used, and two first elastic alignment components and one second elastic alignment component 330 are evenly spaced and arranged along the circumference of the placement area 110 .

[0038] Optionally, in this embodiment, if Figure 1 and Figure 4As shown, the second alignment assembly 300 includes a connection seat 340, which is detachably fixed to the carrier 100, the head end of the rotating arm 310 is rotatably connected to the connection seat 340, and the elastic reset member 320 is connected between the connection seat 340 and the rotating arm 310. The second alignment assembly 300 is detachably mounted on the carrier 100 via the connection seat 340. When the second alignment assembly 300 fails or is damaged, the second alignment assembly 300 can be removed for repair or replacement without removing the overall alignment device, thereby improving the convenience of maintenance of the alignment device.

[0039] In this embodiment, Figure 1 and Figure 3 As shown, a receiving groove 120 is provided at the top of the carrier 100, a connecting seat 340 is connected to the top of the carrier 100, and a rotating arm 310 includes a first arm section 311 and a second arm section 312 from the head end to the tail end, and the second arm section 312 is completely received in the receiving groove 120. The end of the first arm section 311 away from the second arm section 312 is rotatably connected to the connecting seat 340, and the end of the second arm section 312 away from the first arm section 311 is provided with a second elastic alignment member 330, wherein the second alignment assembly 300 is installed at the top of the carrier 100, which is more convenient for disassembly and assembly, and is more convenient when the rotating arm 310 needs to be manually rotated and adjusted; and the second arm section 312 is completely received in the receiving groove 120 and does not protrude upward, so the second arm section 312 is lower than the placement area 110 as a whole, and is protruding toward the placement area. During the process of placing the wafer 10 in the placement area 110, the area where the second arm segment 312 is located will not interfere with the placement of the wafer 10, thereby increasing the rough positioning accuracy of the wafer 10 placed in the placement area 110, and correspondingly reducing the position restriction on the placement of the wafer 10; similarly, during the process of pressing the pressure plate down for bonding, the area where the second arm segment 312 is located will not interfere with the pressure plate, thereby reducing the restriction on the size of the pressure plate, and further improving the ease of use of the alignment device, wafer bonding equipment and wafer bonding testing equipment.

[0040] Specifically, in this embodiment, Figure 1 and Figure 3As shown, the second alignment assembly 300 is accommodated in the receiving groove 120, and the second arm section 312 is connected to the bottom of the first arm section 311. The entire second alignment assembly 300 is installed in the receiving groove 120 as a whole, and the rotating arm 310 and the second elastic alignment member 330 are used as movable parts of the second alignment assembly 300. The first arm section 311 is arranged to be located above the second arm section 312 as a whole. When the groove depth of the receiving groove 120 can accommodate the second elastic alignment member 330 extending downward from the second arm section 312 and submerging the second arm section 312, it can be ensured that the second arm section 312 does not protrude upward, and at the same time, it will not interfere with the first arm section 311 in the height direction, thereby ensuring the rotation of the rotating arm 310 and the second elastic alignment member 330, and reducing the limitation of the depth of the receiving groove 120 caused by the first arm section 311.

[0041] A reinforcing rib 313 may be provided between the top surface of the second arm segment 312 extending out of the first arm segment 311 and the side wall of the first arm segment 311 to improve the connection firmness and stability between the two.

[0042] In this embodiment, Figure 1 and Figure 3 As shown, a limiting groove 130 is provided at the bottom of the accommodating groove 120, and the distance between the limiting groove 130 and the center of the placement area 110 is a preset distance smaller than the radius of the wafer 10; a downwardly protruding mounting boss 314 is provided at the end of the second arm section 312, and the mounting boss 314 extends into the limiting groove 130, and the second elastic alignment member 330 is provided on the mounting boss 314. On the one hand, the second elastic alignment member 330 is installed on the mounting boss 314 with a larger volume, and its connection to the second arm section 312 is more stable, which correspondingly improves the stability of the second elastic alignment member 330 in pushing, clamping and aligning the wafer 10; in addition, the mounting boss 314 is inserted downward into the limiting groove 130, and the limiting groove 130 extends radially into the placement area 110 by a preset distance, so that the rotation stroke of the second elastic alignment member 330 toward the placement area 110 inward exceeds the edge area of ​​the wafer 10, thereby ensuring the clamping and alignment firmness and stability of the second elastic alignment member 330 on the wafer 10 during the alignment operation.

[0043] On the other hand, when the wafer 10 is not placed, during the process of the second arm section 312 driving the mounting boss 314 and the second elastic alignment member 330 to rotate toward or away from the placement area 110, when the mounting boss 314 abuts against the groove wall of the limiting groove 130, it cannot continue to rotate, that is, the limiting groove 130 can limit the rotation stroke of the rotating arm 310 by abutting against the mounting boss 314, thereby reducing the occurrence of interference when the rotating arm 310 rotates away from the placement area 110, resulting in excessive deformation of the elastic return member 320 and inability to elastically recover, or a small rotation stroke resulting in the second elastic alignment member 330 still being located in the placement area 110; at the same time, it can also reduce the occurrence of interference when the elastic return member 320 drives the rotating arm 310 to rotate and recover toward the placement area 110, resulting in a long rotation stroke of the rotating arm 310 to avoid the placement area 110, which consumes more time and affects the alignment efficiency, thereby ensuring the normal use of the second alignment assembly 300 and the alignment device, and further improving its convenience of use and alignment efficiency.

[0044] Specifically, the preset distance may be 1-2 mm.

[0045] Specifically, in this embodiment, Figure 4 As shown, the connecting seat 340 includes a fixed connecting part 341 detachably fixed to the carrier 100 and a rotating connecting part 342 connected to one side of the fixed connecting part 341, and an accommodating space 343 is enclosed between the bottom wall of the rotating connecting part 342 and the side wall of the fixed connecting part 341; the rotating arm 310 is rotatably connected to the top of the rotating connecting part 342, and a limiting boss 315 is provided at the bottom of the rotating arm 310, and the elastic reset member 320 is accommodated in the accommodating space 343 and connected between the fixed connecting part 341 and the limiting boss 315. This is one of the specific connection forms between the rotating arm 310 and the connecting seat 340. When the rotating arm 310 is not subjected to external force, the elastic reset member 320 drives the rotating arm 310 to rotate relative to the connecting seat 340 through the limiting boss 315 until the mounting boss 314 abuts against the groove side wall of the limiting groove 130 facing the placement area 110; when it is necessary to adjust the rotating arm 310 to rotate to avoid the placement area 110, the rotating arm 310 is rotated away from the placement area 110, and the limiting boss 315 rotates synchronously with the rotating arm 310 and squeezes the elastic reset member 320 to cause it to undergo elastic deformation until the mounting boss 314 abuts against the groove side wall of the limiting groove 130 away from the placement area 110; the above arrangement ensures the normal operation of the second alignment assembly 300, and has a compact structure and strong stability.

[0046] Specifically, the elastic reset member 320 can be a torsion spring; the rotating connection part 342 can be provided with a threaded countersunk hole, and the head end of the rotating arm 310 is provided with a rotating hole. A screw is passed through the rotating hole and screwed into the threaded countersunk hole, and the height of the screw extending upward from the threaded countersunk hole is 0.4-0.6mm greater than the depth of the rotating hole, preferably 0.5mm, thereby realizing the rotating connection between the rotating arm 310 and the rotating connection part 342.

[0047] In this embodiment, Figure 2 As shown, the first alignment assembly 200 includes a base shell 210, a limiting column 220 and an elastic member 230. The base shell 210 is provided with a plug-in slot 211, the limiting column 220 is slidably plugged into the plug-in slot 211, and the elastic member 230 is accommodated in the plug-in slot 211 and connected between the base shell 210 and the limiting column 220; the top surface of the carrier 100 is provided with a mounting groove 140, the base shell 210 is embedded in the mounting groove 140, and an avoidance gap 150 is left between the top end surface of the base shell 210 and the notch 11 of the mounting groove 140. The limiting member serves as the first elastic alignment member; first, in the first alignment component 200, the elastic member 230 is completely accommodated in the plug-in slot 211 of the base shell 210, and the limiting column 220 is slidably plugged into the plug-in slot 211, then the plug-in slot 211 can guide the lifting and lowering movement of the limiting column 220 to improve the lifting and lowering stability of the limiting column 220, and at the same time, the elastic member 230 is connected between the base shell 210 and the limiting column 220 with higher stability to ensure the elastic driving effect of the elastic member 230 on the limiting column 220; secondly, the first alignment component 200 is installed on the top of the carrier 100 through the cooperation of the base shell 210 and the mounting slot 140, the first alignment component 200 is more convenient to disassemble and assemble, and an avoidance gap 150 is left between the base shell 210 and the top surface of the carrier 100 to ensure that the base shell 210 and the elastic member 230 are lower than the placement area 110 without interfering with the placement of the wafer 10.

[0048] Specifically, the height of the avoidance gap 150 may be 0.4-0.6 mm, preferably 0.5 mm.

[0049] A structure such as the first alignment assembly 200 may be provided at the end of the rotating arm 310 , with the limiting column 220 serving as the second elastic alignment member 330 .

[0050] For a wafer 10 having a notch 11, in the alignment device provided in this embodiment, as Figure 1 and Figure 3As shown, the carrier 100 is detachably plugged with a positioning pin 400, which matches the notch 11 of the wafer 10, and the positioning pin 400 and the first elastic alignment member are arranged in the placement area 110 in an area smaller than the semicircular area. During the alignment operation, one hand can rotate the rotating arm 310 to a position avoiding the placement area 110, and then the other hand can manually suck the wafer 10 through a vacuum suction pen, and move the wafer 10 from one side of the placement area 110 so that the side opening of the notch 11 is roughly aligned with the positioning pin 400, and then release the rotating arm 310. Under the restoring action of the elastic reset member 320, the rotating arm 310 rotates toward the wafer 10, and the second elastic alignment member 330 thereon pushes the wafer 10 to abut against the first elastic alignment member, and the notch 11 is inserted into the positioning pin 400, thereby achieving alignment and circumferential limitation of the wafer 10.

[0051] Among them, when this form of alignment device is applied to wafer bonding test equipment, manual placement of wafer 10 only requires ensuring that the side opening of the slot 11 is aligned or partially engaged with the positioning pin 400, and the wafer 10 can be aligned under the push of the second elastic alignment member 330. The placement position accuracy requirements of the wafer 10 are low and the operation is convenient. The alignment operation can be completed quickly and manually throughout the process, without the need to use a robot in the bonding chamber, pressure plate and other complete equipment to place the wafer 10 with high precision. Accordingly, the alignment device does not need to be integrated into the bonding chamber, pressure plate and other complete equipment, nor does it need to determine the time required for the entire alignment process based on the scheduling process of the complete equipment, thereby improving the ease of use and testing efficiency of the alignment device and wafer bonding test equipment.

[0052] Preferably, if Figure 1 and Figure 3 As shown, the positioning pin 400 is located in the middle position between the two first elastic alignment members, and the second elastic alignment member 330 is symmetrical with the positioning pin 400 about the axis of the placement area 110; wherein, when the alignment device is provided with a positioning pin 400, the positioning pin 400 needs to be removed before being sent into the bonding chamber to avoid interference with the pressure plate.

[0053] In this embodiment, Figure 4 As shown, a handle 316 is provided at the top of the first arm section 311. When the rotating arm 310 is rotated manually, force can be applied to the rotating arm 310 through the handle 316, thereby improving the convenience of operation of the alignment device.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. An alignment device, characterized in that: It comprises a carrier (100) having a placement area (110) and: A first alignment assembly (200), at least two in number, comprising a first elastic alignment member extending upward from the placement area (110), and the first elastic alignment member being able to move downward when pressed; as well as, A second alignment component (300) comprises a rotating arm (310) and an elastic reset member (320) connected to the rotating arm (310), wherein the elastic reset member (320) is used to drive the rotating arm (310) to rotate toward the placement area (110); a second elastic alignment member (330) is provided at the end of the rotating arm (310), wherein the second elastic alignment member (330) extends upward from the placement area (110) and can move downward when pressed; The first elastic alignment member and the second elastic alignment member (330) are arranged at intervals around the placement area (110) and are used for abutting and aligning the wafer (10) placed in the placement area (110).

2. The alignment device according to claim 1, characterized in that The second alignment assembly (300) includes a connecting seat (340), the connecting seat (340) is detachably fixed to the carrier (100), the head end of the rotating arm (310) is rotatably connected to the connecting seat (340), and the elastic reset member (320) is connected between the connecting seat (340) and the rotating arm (310).

3. The alignment device according to claim 2, characterized in that: The top of the carrier (100) is provided with a receiving groove (120), the connecting seat (340) is connected to the top of the carrier (100), and the rotating arm (310) includes a first arm section (311) and a second arm section (312) from the head end to the tail end, and the second arm section (312) is completely received in the receiving groove (120).

4. The alignment device according to claim 3, characterized in that: The second alignment assembly (300) is accommodated in the accommodation groove (120), and the second arm section (312) is connected to the bottom of the first arm section (311).

5. The alignment device according to claim 3, characterized in that: A limiting groove (130) is provided at the bottom of the accommodating groove (120), and the distance between the limiting groove (130) and the center of the placement area (110) is smaller than the radius of the wafer (10) by a preset distance; a downwardly protruding mounting boss (314) is provided at the end of the second arm section (312), and the mounting boss (314) extends into the limiting groove (130), and the second elastic alignment member (330) is arranged on the mounting boss (314).

6. The alignment device according to any one of claims 2 to 5, characterized in that: The connecting seat (340) includes a fixed connecting portion (341) detachably fixed to the carrier (100) and a rotating connecting portion (342) connected to one side of the fixed connecting portion (341), and a receiving space (343) is enclosed between the bottom wall of the rotating connecting portion (342) and the side wall of the fixed connecting portion (341); the rotating arm (310) is rotatably connected to the top of the rotating connecting portion (342), and a limiting boss (315) is provided at the bottom of the rotating arm (310); the elastic reset member (320) is received in the receiving space (343) and connected between the fixed connecting portion (341) and the limiting boss (315).

7. The alignment device according to any one of claims 1 to 5, characterized in that: The first alignment component (200) comprises a base shell (210), a limiting column (220) and an elastic member (230); the base shell (210) is provided with a plug-in slot (211), the limiting column (220) is slidably plugged into the plug-in slot (211), and the elastic member (230) is accommodated in the plug-in slot (211) and connected between the base shell (210) and the limiting column (220); the top surface of the carrier (100) is provided with a mounting slot (140), the base shell (210) is embedded in the mounting slot (140), and an avoidance gap (150) is reserved between the top surface of the base shell (210) and the notch (11) of the mounting slot (140).

8. The alignment device according to any one of claims 1 to 5, characterized in that: The carrier (100) is detachably plugged with a positioning pin (400), the positioning pin (400) is used to match the notch (11) of the wafer (10), and the area surrounded by the positioning pin (400) and the first elastic alignment member in the placement area (110) is smaller than a half-circumferential area.

9. A wafer bonding device, characterized in that: It comprises a bonding chamber and an alignment device as claimed in any one of claims 1 to 8, wherein the alignment device is arranged in the bonding chamber, a pressure plate is arranged in the bonding chamber, the pressure plate is located above a placement area (110) in the alignment device, and the pressure plate and the carrier (100) can be raised and lowered relative to each other.

10. A wafer bonding test device, characterized in that: It comprises a bonding chamber, a conveying component and an alignment device as claimed in any one of claims 1 to 8, wherein the conveying component is connected to the alignment device and is used to send the alignment device into the bonding position of the bonding chamber or send the alignment device out of the bonding chamber to the placement position; a pressure plate is provided in the bonding chamber, the pressure plate is located above the placement area (110) in the alignment device, and the pressure plate and the carrier (100) can be raised and lowered relative to each other.

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