Camera package, method for manufacturing camera package, and electronic device

Abstract

The present disclosure relates to a camera package, a method for manufacturing a camera package, and an electronic device capable of reducing the manufacturing cost for forming a lens. The method for manufacturing a camera package according to the present disclosure includes: forming a high contact angle around a lens forming area at the upper side of a transparent substrate for protecting a solid-state imaging element; dripping a lens material into the lens forming area at the upper side of the transparent substrate; and molding the dripped lens material through a mold to form a lens. The present disclosure is applicable, for example, to a camera package in which a lens is arranged above a solid-state imaging element, etc.

Description

Technical Field

[0001] The present disclosure relates to a camera package, a method for manufacturing the camera package, and an electronic device, and in particular, to a camera package, a method for manufacturing the camera package, and an electronic device capable of reducing a manufacturing cost for forming a lens. Background Art

[0002] As a method of forming a lens on a substrate, an imprinting technique is known in which a mold is pressed onto a resin dripped onto a substrate to transfer the shape of the mold. In order to form a defect-free lens with an extremely high yield, a forming method is generally used in which excess resin that exceeds the volume of the lens and protrudes from the mold is dripped during formation. The reason for dripping the excess resin is that when the resin drips onto the substrate, the resin spreads due to its own weight, thereby forming a large lens with a complex shape.

[0003] For example, Patent Document 1 discloses a technique in which an overflow portion for blocking excess resin is provided on a mold so that the excess resin does not flow to an unnecessary area.

[0004] Reference List

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2012-93765 Summary of the invention

[0007] Problem to be solved

[0008] The amount of resin dripped in excess of the required amount leads to an increase in manufacturing costs. In addition, if the mold is provided with an overflow portion, since the size of the mold itself becomes larger, when a plurality of lenses are molded simultaneously on a substrate, the interval between adjacent lenses cannot be reduced, resulting in substrate loss and increased manufacturing costs.

[0009] The present disclosure has been made in view of the above-described circumstances, and an object of the present disclosure is to reduce the manufacturing cost for forming a lens.

[0010] Technical solutions to the problem

[0011] According to the first aspect of the present disclosure, a method for manufacturing a camera package includes: forming a high contact angle film around a lens forming area at the upper side of a transparent substrate for protecting a solid-state imaging element; dripping a lens material into the lens forming area at the upper side of the transparent substrate; and molding the dripped lens material through a mold to form a lens.

[0012] According to the first aspect of the present disclosure, a high contact angle film is formed around a lens forming area at the upper side of a transparent substrate for protecting a solid-state imaging element, a lens material is dropped into the lens forming area at the upper side of the transparent substrate, and the dropped lens material is molded by a mold to form a lens.

[0013] A camera package according to a second aspect of the present disclosure includes: a solid-state imaging element; a lens formed on an upper side of a transparent substrate for protecting the solid-state imaging element; and a high contact angle film formed around the lens on the upper side of the transparent substrate.

[0014] According to a second aspect of the present disclosure, there are provided: a solid-state imaging element; a lens formed at an upper side of a transparent substrate for protecting the solid-state imaging element; and a high contact cornea formed around the lens at the upper side of the transparent substrate.

[0015] The electronic device according to the third aspect of the present disclosure includes a camera package and a lens module. The camera package includes: a solid-state imaging element; a lens formed on the upper side of a transparent substrate for protecting the solid-state imaging element; and a high contact angle film formed around the lens on the upper side of the transparent substrate. The lens module includes: at least one substrate with a lens arranged above the camera package.

[0016] According to a third aspect of the present disclosure, there are provided: a camera package provided with a solid-state imaging element, a lens formed on the upper side of a transparent substrate for protecting the solid-state imaging element, and a high contact cornea formed around the lens on the upper side of the transparent substrate; and a lens module including one or more substrates with lenses arranged above the camera package.

[0017] The camera package and electronics may be separate devices, or may be modules included in other devices.

[0018] Advantageous Effects of the Present Disclosure

[0019] According to the first to third aspects of the present disclosure, the manufacturing cost for forming a lens can be reduced.

[0020] Note that the effects are not necessarily limited to those described herein, but may be any effects described in the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic structural diagram of a camera package as a semiconductor device to which the present disclosure is applied.

[0022] Figure 2 It is shown Figure 1A block diagram of an example of a system configuration of a camera package in FIG.

[0023] Figure 3 It is a diagram for explaining a method of forming a lens resin portion.

[0024] Figure 4 is a plan view of the upper surface of the protective substrate.

[0025] Figure 5 It is a diagram for explaining another example of the mold.

[0026] Figure 6 It is a diagram for explaining the sequence for forming the lens resin portion.

[0027] Figure 7 It is a diagram for explaining a wafer level lens process for forming a lens resin portion.

[0028] Figure 8 It is a diagram for explaining a wafer level lens process for forming a lens resin portion.

[0029] Fig. 9 It is shown Figure 1 FIG. 1 is a diagram of a modified example of a camera package.

[0030] Fig.10 It is a diagram for explaining another example of the shape of the lens resin portion.

[0031] Fig.11 It is a diagram for explaining application in a mold forming step.

[0032] Fig.12 is a schematic structural diagram of a camera package as a semiconductor device to which the present disclosure is applied.

[0033] Fig.13 It is a diagram for explaining a lens forming method for forming a lens resin portion.

[0034] Fig.14 It is a cross-sectional view and a plan view of the mold.

[0035] Fig.15 This is a plan view of the lens resin portion.

[0036] Fig.16 It is used to explain the use of Fig.14 Diagram of the role and effect of the mold case.

[0037] Fig.17 It is used to explain the use of Fig.14 Diagram of the role and effect of the mold case.

[0038] Fig.18 It is used to illustrate Fig.14 FIG. 4 is a diagram of a modified example of the mold.

[0039] Fig.19 It is a figure for demonstrating another example of a mold|die.

[0040] Fig. 20 yes Fig.19 Cross-sectional and plan views of the mold in .

[0041] Fig.21 is a diagram showing a detailed cross-sectional structure of a solid-state imaging element.

[0042] Fig. 22 It is a figure for demonstrating the manufacturing method of a camera package.

[0043] Fig.23 It is a figure for demonstrating the manufacturing method of a camera package.

[0044] Fig.24 It is a figure for demonstrating the manufacturing method of a camera package.

[0045] Fig.25 It is a figure for demonstrating the manufacturing method of a camera package.

[0046] Fig.26 It is a figure for demonstrating the manufacturing method of a camera package.

[0047] Fig. 27 It is a figure for demonstrating the manufacturing method of a camera package.

[0048] Fig.28 It is a figure for demonstrating the manufacturing method of a camera package.

[0049] Fig.29 It is a figure for demonstrating the manufacturing method of a camera package.

[0050] Fig.30 It is a figure for demonstrating the manufacturing method of a camera package.

[0051] Fig.31 It is a figure for demonstrating the manufacturing method of a camera package.

[0052] Fig.32 It is a figure for demonstrating the manufacturing method of a camera package.

[0053] Fig.33 It is a figure for demonstrating the manufacturing method of a camera package.

[0054] Fig.34 It is a figure for demonstrating the manufacturing method of a camera package.

[0055] Fig.35 It is a figure for demonstrating the manufacturing method of a camera package.

[0056] Fig.36 It is a figure for demonstrating the manufacturing method of a camera package.

[0057] Fig.37 is a cross-sectional view of a first configuration example of a camera module.

[0058] Fig.38 is a cross-sectional view of a second configuration example of the camera module.

[0059] Fig.39 is a cross-sectional view of a third configuration example of the camera module.

[0060] Fig.40 It is a diagram for explaining a method of manufacturing a stacked lens structure.

[0061] Fig.41 It is a diagram for explaining bonding of two substrates with lenses in a substrate state.

[0062] Fig.42 It is a diagram for explaining a method of manufacturing a substrate with a lens in a substrate state.

[0063] Fig.43 : is a block diagram showing a configuration example of an imaging device as an electronic device to which the present disclosure is applied.

[0064] Fig.44 This is a diagram for explaining an example of using an image sensor.

[0065] Fig.45 is a block diagram showing an example of a schematic configuration of an in-vivo information acquisition system.

[0066] Fig.46 is a diagram showing an example of a schematic configuration of an endoscopic surgery system.

[0067] Fig.47 : is a block diagram showing an example of the functional configuration of a camera head and a CCU (Camera Control Unit).

[0068] Fig.48 is a block diagram showing an example of a schematic configuration of a vehicle control system.

[0069] Fig.49 It is an explanatory diagram showing an example of the installation positions of the vehicle exterior information detection unit and the imaging unit. DETAILED DESCRIPTION

[0070] Hereinafter, a mode for implementing the present disclosure (hereinafter referred to as an embodiment) is described. Note that the description is given in the following order.

[0071] 1. Schematic structure of camera package

[0072] 2. Camera package system structure

[0073] 3. Method for forming the lens resin portion

[0074] 4. Formation sequence of lens resin part

[0075] 5. Modifications

[0076] 6. Formation of mold

[0077] 7. Schematic structure of camera package without using high contact cornea

[0078] 8. Function and effect of mold

[0079] 9. Modification of mold

[0080] 10. Another embodiment of the mold

[0081] 11. Detailed structure of solid-state imaging element

[0082] 12. Method for manufacturing camera package

[0083] 13. Camera module construction example

[0084] 14. Direct bonding between substrates with lenses

[0085] 15. Method for manufacturing substrate with lens

[0086] 16. Application examples of electronic equipment

[0087] 17. Application examples of in vivo information acquisition systems

[0088] 18. Application examples of endoscopic surgery systems

[0089] 19. Application examples of mobile objects

[0090] <1. Schematic Structure of Camera Package>

[0091] Figure 1 A schematic structure of a camera package as a semiconductor device to which the present disclosure is applied is shown.

[0092] Figure 1 The camera package 1 shown converts light or electromagnetic waves incident on the device in the direction of the arrow in the figure into electrical signals. Hereinafter, in the present disclosure, for convenience, a device that converts light as an object to be converted into an electrical signal is described as an example.

[0093] The camera package 1 is provided with at least: a solid-state imaging element 13 having a stacked structure of a first structure 11 and a second structure 12; an external terminal 14; a protective substrate 18 formed above the first structure 11; a lens resin portion 19 formed on the protective substrate 18; and a high contact angle film 20 formed around the lens resin portion 19. Note that in the following, for convenience, it is assumed that the incident surface side on which light is incident on the device is Figure 1 The upper side of the device, and the other surface side of the device opposite to the incident surface is Figure 1 On the lower side, the first structure 11 is called the upper structure 11, and the second structure 12 is called the lower structure 12.

[0094] The camera package 1 is formed by bonding a semiconductor substrate (wafer) for forming a part of the upper structure 11, a semiconductor substrate (wafer) for forming a part of the lower structure 12, and a protective substrate 18 at the wafer level, and then singulating the bonded substrates into individual camera packages 1.

[0095] The upper structure 11 before singulation is obtained by forming a plurality of pixels on a semiconductor substrate (wafer) that convert incident light into electrical signals respectively. For example, the pixel is provided with: a photodiode (PD) for performing photoelectric conversion; and a plurality of pixel transistors that control the photoelectric conversion operation and the reading operation of the electrical signal obtained by the photoelectric conversion. For example, preferably, the pixel transistor is a MOS transistor. The upper structure 11 included in the camera package 1 after singulation is sometimes referred to as an upper chip, an image sensor substrate, or an image sensor chip.

[0096] On the upper surface of the upper structure 11, for example, a red (R), green (G), or blue (B) filter 15 and an on-chip lens 16 are formed. Above the on-chip lens 16, a protective substrate 18 for protecting the structure of the camera package 1 (particularly, the on-chip lens 16 and the color filter 15) is arranged. For example, the protective substrate 18 is a transparent substrate such as a glass substrate. When the hardness of the protective substrate 18 is higher than the hardness of the on-chip lens 16, the protective effect of the on-chip lens 16 is enhanced.

[0097] On the upper surface of the protective substrate 18, a lens resin portion 19 is arranged, which is formed by molding a resin material as a lens material into a predetermined shape by embossing. The lens resin portion 19 plays the role of a lens that refracts incident light in a predetermined direction so that the incident light can be incident on a predetermined pixel of the upper structure 11. In addition, a high contact angle film 20 is formed around the lens resin portion 19 on the upper surface of the protective substrate 18. The high contact angle film 20 is a film in which, when a resin material as a lens material is dropped in the formation step of the lens resin portion 19, the contact angle of the resin material is greater than the contact angle of the protective substrate 18.

[0098] The lower structure 12 before singulation is obtained by forming a semiconductor circuit including transistors and wiring on a semiconductor substrate (wafer). The lower structure 12 included in the camera package 1 after singulation is sometimes referred to as a lower chip, a signal processing substrate, or a signal processing chip. On the lower structure 12, a plurality of external terminals 14 are formed, which are electrically connected to wiring (not shown) outside the device. The external terminals 14 are, for example, solder balls.

[0099] The camera package 1 has a cavity-free structure in which a protective substrate 18 is fixed above the upper structural body 11 or above the on-chip lens 16 via a sealing resin 17 arranged on the on-chip lens 16. Since the hardness of the sealing resin 17 is lower than that of the protective substrate 18, this can be used to mitigate the transfer of stress applied to the protective substrate 18 from the outside of the camera package 1 to the inside of the device, compared with a case where there is no sealing resin.

[0100] Note that the camera package 1 can form a cavity structure which is a structure different from the cavity-free structure: in the cavity structure, a columnar or wall-like structure is formed on the upper surface of the upper structure 11, and the protective substrate 18 is fixed on the above-mentioned columnar or wall-like structure, so that the protective substrate 18 is carried above the on-chip lens 16 in a state where there is a gap between the protective substrate 18 and the on-chip lens 16.

[0101] <2. Camera Package System Structure>

[0102] Figure 2 is a block diagram showing a system configuration example of the camera package 1 .

[0103] Figure 2 The camera package 1 in FIG. 1 is provided with a pixel array unit 24 in which a plurality of pixels 31 each including a photoelectric conversion unit (PD) are arranged in the row direction and the column direction.

[0104] The pixel array unit 24 is provided with: a row drive signal line 32 for driving the pixels 31 row by row; and a vertical signal line (column reading line) 33 for reading signals generated as a result of photoelectric conversion from the plurality of pixels 31 driven row by row. Figure 2 As shown, a plurality of pixels 31 arranged in the row direction are connected to one row drive signal line 32. A plurality of pixels 31 arranged in the column direction are connected to one vertical signal line 33.

[0105] The camera package 1 is also provided with a row driving unit 22 and a column signal processing unit 25 .

[0106] For example, the row driving unit 22 is provided with: a row address control unit that determines the position of a row to be pixel driven, in other words, called a row decoder unit; and a row driving circuit unit that generates a signal for driving the pixel 31 .

[0107] For example, the column signal processing unit 25 is provided with a load circuit unit connected to the vertical signal line 33, thereby forming a source follower circuit with the pixel 31. In addition, the column signal processing unit 25 may also be provided with an amplifier circuit unit that amplifies the signal read from the pixel 31 via the vertical signal line 33. In addition, the column signal processing unit 25 may also be provided with a noise processing unit for removing the noise level of the system from the signal read from the pixel 31 as a result of the photoelectric conversion.

[0108] The column signal processing unit 25 is provided with an analog-to-digital converter (ADC) for converting the signal read from the pixel 31 or the analog signal subjected to the above-mentioned noise processing into a digital signal. The ADC is provided with: a comparator unit for comparing the analog signal as the conversion object with the reference scanning signal as the comparison object to be compared with the analog signal; and a counter unit for measuring the time before the comparison result in the above-mentioned comparator unit is inverted. The column signal processing unit 25 may also be provided with a horizontal scanning circuit unit for controlling the scanning of the column being read.

[0109] The camera package 1 is also provided with a timing control unit 23. The timing control unit 23 provides a signal for controlling the timing to the row drive unit 22 and the column signal processing unit 25 based on the reference clock signal and the timing control signal input to the device. Hereinafter, in the present disclosure, all or part of the row drive unit 22, the column signal processing unit 25, and the timing control unit 23 are sometimes referred to as a pixel peripheral circuit unit, a peripheral circuit unit, or a control circuit unit.

[0110] The camera package 1 is also provided with an image signal processing unit 26. The image signal processing unit 26 is a circuit that performs various signal processing on data obtained as a result of photoelectric conversion (in other words, data obtained due to the camera operation in the camera package 1). For example, the image signal processing unit 26 includes an image signal processing circuit unit and a data holding unit. The image signal processing unit 26 may also be provided with a processor unit.

[0111] An example of the signal processing performed by the image signal processing unit 26 is a tone curve correction process of increasing the gray scale when the image data after the AD conversion is data obtained by imaging a dark object, and reducing the gray scale when the image data after the AD conversion is data obtained by imaging a bright object. In this case, it is preferable that characteristic data of the tone curve be stored in advance in the data holding unit of the image signal processing unit 26 in order to correct the gray scale of the image data based on the tone curve.

[0112] The camera package 1 is also provided with an input unit 21A. For example, the input unit 21A inputs the above-mentioned reference clock signal, timing control signals such as a vertical synchronization signal and a horizontal synchronization signal, and feature data to be stored in a data holding unit of the image signal processing unit 26 from outside the device to the camera package 1. The input unit 21A is provided with: an input terminal 41, which is an external terminal 14 for inputting data to the camera package 1; and an input circuit unit 42, which extracts a signal input to the input terminal 41 into the camera package 1.

[0113] The input unit 21A is also provided with an input amplitude changing unit 43 that changes the amplitude of the signal extracted by the input circuit unit 42 to an amplitude that can be easily used inside the camera package 1 .

[0114] The input unit 21A is also provided with an input data conversion circuit unit 44 for changing the arrangement of the data sequence of the input data. For example, the input data conversion circuit unit 44 is a serial / parallel conversion circuit that receives a serial signal as input data and converts the serial signal into a parallel signal.

[0115] Note that the input amplitude changing unit 43 and the input data conversion circuit unit 44 may be omitted in some cases.

[0116] In the case where the camera package 1 is connected to an external storage device such as a flash memory, SRAM, or DRAM, the input unit 21A may also be provided with a storage interface circuit that receives data from these external storage devices.

[0117] The camera package 1 is also provided with an output unit 21B. The output unit 21B outputs the image data captured by the camera package 1 and the image data subjected to signal processing by the image signal processing unit 26 from the camera package 1 to the outside of the device. The output unit 21B is provided with: an output terminal 48, which is an external terminal 14 for outputting data from the camera package 1 to the outside of the device; and an output circuit unit 47, which is a circuit for outputting data from the inside of the camera package 1 to the outside of the device, and is a circuit for driving an external wiring connected to the output terminal 48 and located outside the camera package 1.

[0118] The output unit 21B is also provided with an output amplitude changing unit 46 that changes the amplitude of a signal used inside the camera package 1 to an amplitude that can be easily used by an external device connected to the outside of the camera package 1 .

[0119] The output unit 21B is also provided with an output data conversion circuit unit 45 that changes the arrangement of the data sequence of the output data. For example, the output data conversion circuit unit 45 is a parallel / serial conversion circuit that converts a parallel signal used inside the camera package 1 into a serial signal.

[0120] In some cases, the output data conversion circuit unit 45 and the output amplitude changing unit 46 may be omitted.

[0121] In the case where the camera package 1 is connected to an external storage device such as a flash memory, SRAM, or DRAM, the output unit 21B may also be provided with a storage interface circuit that outputs data to these external storage devices.

[0122] Note that in the present disclosure, for convenience, a circuit block including both or at least one of the input unit 21A and the output unit 21B is sometimes referred to as an input / output unit 21. In addition, a circuit unit including both or at least one of the input circuit unit 42 and the output circuit unit 47 is sometimes referred to as an input / output circuit unit 49.

[0123] <3. Method for Forming Lens Resin Portion>

[0124] Next, we will refer to Figure 3 A method of forming the lens resin portion 19 on the protective substrate 18 will be described.

[0125] First, the UV ozone cleaning process using ultraviolet (UV) and ozone (O3) and the cleaning process using chemical solutions are used to remove Figure 3The contaminants on the surface of the protective substrate 18 shown in A. The cleaning process using a chemical solution can be implemented by the following cleaning methods: a cleaning method such as two-fluid cleaning or brush cleaning using, for example, isopropyl alcohol (IPA), ethanol, acetone, etc. as a chemical solution.

[0126] After cleaning, Figure 3 As shown in A of FIG. 1 , a pattern of a high contact angle film 20 is formed on the upper surface of the protective substrate 18. The patterning of the high contact angle film 20 can be performed by photolithography, screen printing, or inkjet printing. The area where the high contact angle film 20 is formed is an area where it is not desired to arrange the lens material 501 to be dropped in the next step. In other words, it is Figure 1 The area other than the lens resin portion 19 on the protective substrate 18 in the lens is covered. For example, as the material of the high contact angle film 20, a fluorine-based resin or a silicone (Si-CH3)-based resin or the like can be used. In addition, as the material of the high contact angle film 20, a material having a light shielding (light absorbing or reflecting) function can be added or adopted. In this case, the high contact angle film 20 makes it possible to take measures to deal with flare and ghosting at the same time.

[0127] Note that after cleaning the surface of the protective substrate 18, before forming the pattern of the high contact angle film 20, an adhesion promoter for improving the adhesion between the lens material 501 to be dropped in the next step and the protective substrate 18 may be formed on the entire upper surface of the protective substrate 18. The contact angle of the adhesion promoter is smaller than that of the high contact angle film, and the high contact angle film is a film having a larger contact angle with respect to the adhesion promoter.

[0128] Next, if Figure 3 As shown in FIG. 1B , the lens material 501 is dripped into a predetermined area on the protective substrate 18 for forming the lens resin portion 19, specifically, the lens material 501 is dripped inside the area where the high contact cornea 20 is formed. The amount of the lens material 501 dripped is substantially equal to the amount equivalent to the volume of the lens resin portion 19 in the completed state. The dripping position of the lens material 501 can be controlled with high precision based on the alignment mark formed at a predetermined position on the protective substrate 18. For example, the lens material 501 is formed using a resin material that is hardened by ultraviolet rays.

[0129] Figure 4 is Figure 3 B is a plan view of the upper surface of the protective substrate 18 after the step of dropping the lens material 501.

[0130] The planar shape of the lens resin portion 19 may be Figure 4 The circle shown in A can be Figure 4The high contact angle film 20 is formed into a circular or rectangular shape corresponding to the plane shape of the lens resin portion 19 to be formed. Since the high contact angle film 20 is formed on the upper surface of the protective substrate 18, the dropped lens material 501 spreads only in the area where the high contact angle film 20 is not formed. Since the spread of the lens material 501 in the plane direction does not exceed the required amount, the lens material 501 equivalent to the volume of the lens resin portion 19 has a large block shape, so that a thick lens can be formed.

[0131] return Figure 3 ,like Figure 3 As shown in C, in a state where the protective substrate 18 is placed on the chuck 502 of the imprinting device and fixedly adsorbed thereon, a mold 503 mounted on the mounting unit 504 of the imprinting device and having a concave-convex shape of the lens resin portion 19 is pressed against the lens material 501 at a predetermined speed and a predetermined load. Therefore, the concave-convex shape of the mold 503 is transferred to the lens material 501 dropped on the protective substrate 18. The height when the mold 503 is pressed against the lens material 501 is controlled according to the thickness of the lens resin portion 19. Similar to the case of the dropping position of the lens material 501, the position of the mold 503 in the plane direction can be controlled with high precision based on the alignment mark formed at a predetermined position on the protective substrate 18. The surface of the mold 503 in contact with the lens material 501 can be subjected to a mold release process in advance so that the surface can be easily peeled off from the hardened lens material 501.

[0132] Next, if Figure 3 As shown in D, in a state where the mold 503 is pressed against the lens material 501, ultraviolet rays are irradiated to the lens material 501 from above the mounting unit 504 to harden the lens material. The mounting unit 504 and the mold 503 are formed using an ultraviolet transparent material. Note that the chuck 502 may be formed using an ultraviolet transparent material, and the lens material 501 may be irradiated with ultraviolet rays from below the chuck 502 to harden the lens material. In addition, instead of using an ultraviolet hardening resin material, a thermosetting resin material may be used as the lens material 501, and the lens material 501 may be hardened by heat treatment.

[0133] like Figure 3 As shown in FIG. 1E, when the mold 503 is separated from the lens material 501 after the lens material 501 is hardened, a protective substrate 18 is formed. Figure 1 The amount of lens material 501 dropped is substantially equal to the volume of the lens resin portion 19 in the finished state, and therefore, the lens resin portion 19 controlled with high precision can be formed without causing the lens material 501 to protrude onto the high contact cornea 20.

[0134] Note that, when the amount of the lens material 501 to be dropped is slightly larger than the amount corresponding to the volume of the lens resin portion 19 in the completed state, Figure 5 As shown, a light-shielding film (mask) 505 that does not allow ultraviolet rays to pass can be formed at the side portion of the outer periphery of the mold 503. Therefore, when the mold 503 is pressed against the lens material 501, the lens material 501 protruding outward is not irradiated with ultraviolet rays and can be removed without being hardened.

[0135] exist Figure 3 After demolding shown in E, an antireflection film may be formed on the upper surface of the lens resin portion 19 as the outermost surface and the upper surface of the high contact angle film 20. Examples of the material of the antireflection film include silicon oxide film, silicon nitride film, silicon oxynitride film, and the like.

[0136] As described above, the lens resin portion 19 is formed by forming the high contact angle film 20 around the lens resin portion 19 on the upper surface of the protective substrate 18, dripping the lens material 501 inside the high contact angle film, and molding and hardening the dripped lens material 501 through the mold 503. By forming the high contact angle film 20 around the lens resin portion 19, a thick lens having a bulk shape can be formed with the dripping amount of the lens material 501 equivalent to the volume of the lens resin portion 19 in the finished state. Since there is no need to drip excess lens material 501 above the volume of the lens shape, and there is no need to provide an overflow portion on the mold 503, the mold 503 can be designed to have a small size. Therefore, the manufacturing cost for forming the lens can be reduced.

[0137] <4. Formation sequence of lens resin portion>

[0138] Figure 6 It is used to illustrate the execution reference Figure 3 A diagram illustrating the sequence of steps for forming the lens resin portion 19.

[0139] Figure 6 A shows the case where the protective substrate 18 is disposed above the solid-state imaging element 13 by referring to Figure 3 The method described is a method of forming the lens resin portion 19 on the upper surface of the protective substrate 18 .

[0140] In contrast, Figure 6 B shows the first reference Figure 3 The method described is a method of forming the lens resin portion 19 on the upper surface of the protective substrate 18 and then arranging the protective substrate 18 on which the lens resin portion 19 is formed over the on-chip lens 16 and the color filter 15 of the solid-state imaging element 13 at an arbitrary timing.

[0141] In this way, the lens resin portion 19 can be formed on the protective substrate 18 that has been combined with the solid-state imaging element 13, or the lens resin portion 19 can be formed on the protective substrate 18 in a single state and then combined with the solid-state imaging element 13.

[0142] In addition, despite the Figure 3 The lens forming method for forming the lens resin portion 19 is described by focusing on one lens resin portion 19, but referring to Figure 3 The described method can also be applied to a wafer-level lens process for simultaneously forming a plurality of lens resin portions 19 in the planar direction of the protective substrate 18 .

[0143] That is, Figure 7 As shown, a large number of lens resin portions 19 can be formed in batches on a device substrate 552 by an imprint process using a wafer replica substrate 551, on which a plurality of lens resin portions 19 are arranged in a planar direction. Figure 3 Mold 503 in.

[0144] Alternatively, if Figure 8 As shown, the following method can also be adopted: by using a mold 503 to change the position of the mold on the device substrate 552, the lens resin parts 19 are formed on the device substrate 552 one by one, thereby forming a large number of lens resin parts 19 on the device substrate 552.

[0145] Figure 7 and Figure 8 The device substrate 552 is Figure 6 The wafer substrate shown in the upper part of A is in a state where a protective substrate 18 is formed above the solid-state imaging element 13 before the lens resin portion 19 is formed. Figure 6 FIG. 1B is a wafer state of the protective substrate 18 before the lens resin portion 19 is formed.

[0146] <5. Modifications>

[0147] Fig. 9 and Fig.10 Shows Figure 1 A modified example of the camera package 1 in FIG.

[0148] In reference Figure 3 In the description of FIG. 1 , it is described that an adhesion promoter can be formed on the entire upper surface of the protective substrate 18 , and the adhesion promoter is used to improve the adhesion between the lens material 501 and the protective substrate 18 .

[0149] Fig. 9is a cross-sectional view of the camera package 1 in the case where an adhesion promoter is formed on the upper surface of the protective substrate 18 .

[0150] like Fig. 9 As shown, an adhesion promoter 571 is formed on the entire upper surface of the protective substrate 18 , and then the lens resin portion 19 and the high contact angle film 20 are formed on the adhesion promoter 571 .

[0151] The high contact angle film 20 has a property of having a contact angle greater than the contact angle of the adhesion promoter 571. Therefore, even in the case where the adhesion promoter 571 is formed on the entire upper surface of the protective substrate 18, as shown in FIG. Figure 3 As described above, the lens resin portion 19 may be formed in a bulk shape by an amount corresponding to the volume of the lens resin portion 19 .

[0152] Note that, instead of the adhesion promoter 571, another film such as an IR cut filter for shielding infrared (IR) light may be formed on the camera package 1. Furthermore, the IR cut filter and the adhesion promoter 571 may be stacked.

[0153] Fig.10 1 is a diagram showing an example of another shape of the lens resin portion 19 .

[0154] The shape of the lens resin portion 19 may be any shape as long as it can function as a lens; for example, Fig.10 The shape of the mold 503 may be changed in accordance with the shape of the lens resin portion 19 .

[0155] In addition, Fig.10 In the camera package 1, an anti-reflection film 572 is formed on the upper surface of the lens resin portion 19 and the upper surface of the high contact angle film 20. As described above, as a material of the high contact angle film 20, a material capable of absorbing or reflecting light may be added, or Fig.10 As shown, an antireflection film 572 may be formed on the upper surface of the lens resin portion 19 and the upper surface of the high contact angle film 20. Therefore, flare and ghosting can be suppressed.

[0156] <6. Formation of mold>

[0157] In the above example, the high contact angle film 20 is used in the step of transferring the concavo-convex shape of the mold 503 to the lens material 501 and molding the lens resin portion 19 , but the high contact angle film can also be used in the step of forming the mold 503 .

[0158] Fig.11 An example of a forming step of the mold 503 is shown.

[0159] like Fig.11 As shown in FIG. 1A, a light shielding film 582, an adhesion promoter 583, and a high contact angle film 584 are sequentially formed on a substrate 581. The light shielding film 582 is formed on a substrate to be described later. Fig.11 In step D, the mold 503 is formed in a region other than the region where the mold material 591 is formed. The adhesion promoter 583 and the high contact angle film 584 are formed on the entire surface.

[0160] Next, if Fig.11 As shown in B and C of FIG. 5 , the high contact angle film 584 is exposed and etched using a mask 585 having a pattern corresponding to the area where the high contact angle film 584 is to be formed, so that the high contact angle film 584 is patterned in the desired area. Figure 3 As in step A, the area where the high contact angle film 584 is to be formed is an area outside the formation area of ​​the mold 503.

[0161] Then, if Fig.11 As shown in D, the material (mold material) 591 for the mold 503 is dropped on the upper surface of the adhesion promoter 583 formed on the substrate 581, and the mold 592 to which the concave and convex shape of the mold 503 has been transferred is pressed and hardened, thereby manufacturing the mold 503.

[0162] In the above-mentioned manufacturing step of the mold 503, by forming a high contact angle film 584 in an area other than the formation area of ​​the mold 503, the mold material 591 to be dropped is only an amount equivalent to the volume of the mold 503, so that the mold 503 can be manufactured efficiently.

[0163] <7. Schematic structure of camera package without using high contact cornea>

[0164] Next, a method of forming the lens resin portion 19 without using the high contact cornea 20 will be described.

[0165] Fig.12 A schematic structure of a camera package 1 in which the high contact angle film 20 is not formed is shown.

[0166] Fig.12 The structure of the camera package 1 in FIG. 1 is similar to that of the camera package 1 in FIG. 1 except that the high contact angle film 20 is not formed around the lens resin portion 19. Figure 1 The configuration of the camera package 1 shown is similar, and thus similar descriptions are omitted.

[0167] refer to Fig.13 , a lens forming method of forming a lens resin portion 19 on a protective substrate 18 without using a high contact angle film 20 is described.

[0168] Note that although Fig.13 Although the lens forming method is shown when one lens resin portion 19 is formed, the method is also applicable to a wafer-level lens process in which a plurality of lens resin portions 19 are simultaneously formed in the planar direction of the protective substrate 18 .

[0169] First, if Fig.13 As shown in A, in a state where the protective substrate 18 is placed on the chuck 601 and fixedly adsorbed thereon, the contaminants on the surface of the protective substrate 18 are removed by a UV ozone cleaning process using ultraviolet (UV) and ozone (O3), a cleaning process using a chemical solution, etc. The cleaning process using a chemical solution can be implemented by the following cleaning methods: a cleaning method such as two-fluid cleaning or brush cleaning using, for example, isopropyl alcohol (IPA), ethanol, acetone, etc. as a chemical solution. After cleaning the surface of the protective substrate 18, an adhesion promoter (not shown) is formed, which is used to improve the adhesion between the lens material 602 to be dropped in the next step and the protective substrate 18.

[0170] Next, if Fig.13 As shown in FIG. 1B , the lens material 602 is dripped at a predetermined position on the protective substrate 18 where the lens resin portion 19 is to be formed. The dripping position of the lens material 602 can be controlled with high precision based on an alignment mark formed at a predetermined position on the protective substrate 18. For example, the lens material 602 is formed using a resin material that is hardened by ultraviolet rays.

[0171] Next, if Fig.13 As shown in C, a mold 603 having a concavo-convex shape of a lens resin portion 19 mounted on a mounting unit 604 of an imprinting device is pressed against a protective substrate 18 at a predetermined speed and a predetermined load. Therefore, the concavo-convex shape of the mold 603 is transferred to the lens material 602 dripped on the protective substrate 18. At this time, an abutting portion 611 of the mold 603, which is a convex portion closest to the protective substrate 18, abuts against the protective substrate 18, thereby controlling the distance between the mounting unit 604 and the protective substrate 18 with high precision (controlling the height from the mounting unit 604 to the protective substrate 18). As in the case of the dropping position of the lens material 602, the position of the mold 603 in the plane direction can be controlled with high precision based on an alignment mark formed at a predetermined position on the protective substrate 18. The surface of the mold 603 in contact with the lens material 602 can be demolded in advance so that it can be easily peeled off from the hardened lens material 602.

[0172] Finally, if Fig.13As shown in D, while the mold 603 is pressed against the lens material 602, ultraviolet rays are irradiated to the lens material 602 from above the mounting unit 604 to harden the lens material, thereby forming the lens resin portion 19. The mold 603 and the mounting unit 604 are formed using a light-transmitting material. A light-shielding film (mask) 612 that does not allow ultraviolet rays to pass through is formed at the peripheral portion in the plane direction of the mold 603, so that the lens material 602 protruding outside the abutment portion 611 is not irradiated with ultraviolet rays. Therefore, the lens material 602 outside the abutment portion 611 can be removed in an unhardened state.

[0173] Note that instead of using an ultraviolet curing resin material as the lens material 602 , a thermosetting resin material may be used as the lens material 602 .

[0174] Fig.14 It is a cross-sectional view on a plane passing through the abutment portion 611 of the mold 603 , and a plan view (bottom view) of the lower surface thereof is a surface pressed against the lens material 602 .

[0175] The mold 603 includes four abutment portions 611, and each of the four abutment portions 611 is arranged at a position on the inner side of the outer periphery in a plan view. Each abutment portion 611 is a columnar body having a cylindrical shape. In the present specification, a columnar body is a columnar body or a cone body having a face substantially parallel to the abutment direction as a side face, and the side face is not necessarily perpendicular to the protective substrate 18 as the abutment face; it can be inclined at a predetermined angle. The abutment portion 611 can also be a columnar body having a prism shape such as a triangular prism or a quadrangular prism. In addition, the abutment portion 611 can also be a columnar body having a polygonal pyramid shape such as a triangular pyramid or a quadrangular pyramid or a conical shape.

[0176] The shape of the top end of the columnar body that contacts the protective substrate 18 is arbitrary. Fig.14 In the example in FIG. 1 , when the mold 603 is pressed against the protective substrate 18, the contact surface of the protective substrate 18 in contact with the abutment portion 611 is a gray circle in the bottom view; however, as will be referred to later Fig.18 As described in A and B, the shape of the top end of the abutting portion 611 may be configured to make point contact with the protective substrate 18 .

[0177] Furthermore, in this embodiment, the four abutment portions 611 are arranged symmetrically about the center of the plane area of ​​the mold 603, but they do not necessarily have to be arranged symmetrically. However, considering the flow of the lens material 602 described later, it is preferable to arrange them symmetrically.

[0178] The number of the abutment portions 611 formed on the mold 603 is not limited to four, but may be three or more, because only plane control is required to control the height of the lens resin portion 19 after curing.

[0179] As indicated by oblique lines in the bottom view, a light shielding film 612 is formed at the outer peripheral portion outside the four contact portions 611 .

[0180] Fig.15 It is a plan view of the lens resin portion 19 after the excess lens material 602 is removed after the hardening process.

[0181] exist Fig.14 In the region of the light shielding film 612 shown in FIG. 1 , the lens material 602 is removed in an uncured state, so that the planar shape of the lens resin portion 19 becomes as follows: Fig.15 The lens material 602 does not exist in the four regions 621 corresponding to the four abutment portions 611 of the mold 603 .

[0182] Note that if the shading film 612 formed on the mold 603 is formed on the inner side of the four abutting portions 611, the planar shape of the lens resin portion 19 is a rectangular shape represented by the dotted line 19', and the four regions 621 corresponding to the abutting portions 611 respectively no longer have any traces.

[0183] exist Fig.14 and Fig.15 In the plan view of , the central lens portion 19L is a region in the cured lens resin portion 19 that performs a lens function of refracting incident light and causing the incident light to be incident on the pixel of the upper structure 11 .

[0184] <8. Functions and effects of molds>

[0185] exist Fig.13 In the mold 603 used in the lens forming method, a space is formed that allows the lens material 602 to flow out of the lens material 602 when the contact portion 611 contacts the protective substrate 18.

[0186] Furthermore, the space created between the mold 603 and the protective substrate 18 when the contact portion 611 contacts the protective substrate 18 is also a space that allows the lens material 602 to flow in from the outside when the lens material 602 hardens and shrinks.

[0187] The energy-hardening resin material hardened by energy such as ultraviolet rays or heat shrinks when hardening. According to the structure of the above-mentioned mold 603, when the lens material 602 shrinks, as shown in FIG. Fig.16As shown in A and B, the lens material 602 protruding outward is provided in the gap between the mold 603 and the protective substrate 18 other than the abutment portion 611, so that no wrinkles or voids are generated in the lens portion 19L that performs the lens function.

[0188] In contrast, consider, for example, the following situation: Fig.17 As shown in A and B of FIG. 1 , a mold 640 including an abutment portion 641 is used to stamp the lens shape, and the abutment portion 641 has a rectangular shape around the entire circumference. Fig.17 As shown in gray in B, the abutment portion 641 of the mold 640 is in contact with the protective substrate 18 over the entire circumference. When the lens material 602 is hardened using such a mold 640 and the lens material 602 shrinks, the lens material 602 is not supplied from the outside of the abutment portion 641, and the inner lens material 602 enclosed by the abutment portion 641 shrinks, thereby generating gaps and wrinkles due to peeling.

[0189] Therefore, by performing imprinting using the mold 603 of the present disclosure, a space is formed for the resin material to flow in and out from the outside, so that wrinkles and voids can be prevented from being generated.

[0190] Furthermore, by performing high-precision plane control on the distance between the abutment portion 611 of the mold 603 and the protective substrate 18 in the height direction, the lens thickness and shape of the lens resin portion 19 can be controlled with high precision simply by pressing the mold 603 against the protective substrate 18 .

[0191] Therefore, by performing imprinting using the mold 603 provided with the abutment portion 611 , the lens resin portion 19 can be formed at low cost while the lens shape is controlled with high precision using a simple device configuration.

[0192] <9. Modification of the mold>

[0193] Fig.18 FIG. 603 shows a modified example of the mold 603. Note that Fig.18 In A to C of FIG. 1 , the light shielding film 612 is omitted from illustration.

[0194] The top end of the abutment portion 611 of the aforementioned mold 603 is cylindrical in shape, and is configured such that when the mold 603 is pressed against the protective substrate 18 , the abutment portion 611 is in circular (surface) contact with the protective substrate 18 .

[0195] In contrast, Fig.18 In the first modification of the mold 603 shown in A, the top of the abutment portion 611 has a substantially spherical (hemispherical) shape. When the mold 603 of the first modification is pressed against the protective substrate 18, the area where the protective substrate 18 contacts the abutment portion 611 is a point.

[0196] In addition, Fig.18 In the second modification of the mold 603 shown in B, the top of the abutment portion 611 has a polygonal pyramid shape such as a triangular pyramid. When the mold 603 of the second modification is pressed against the protective substrate 18, the area where the protective substrate 18 contacts the abutment portion 611 is a point. Note that in addition to the polygonal pyramid shape, the shape may also be a cone.

[0197] In this way, the tip of the contact portion 611 may be shaped so as to make point contact with the protective substrate 18 .

[0198] In addition, if Fig.18 As shown in FIG. 6C , the three or more abutment portions 611 of the mold 603 may be arranged in two or more lens units instead of in one lens unit.

[0199] <10. Another embodiment of the mold>

[0200] Next, another embodiment of the mold 603 will be described.

[0201] Fig.19 The mold 603 shown is provided with an abutment portion 661 instead of Fig.14 The abutment portion 611 of the mold 603 shown in the figure is provided with a light shielding film 662 instead of Fig.14 The light shielding film 612 of the mold 603 is shown.

[0202] The abutting portion 661 is configured to abut against a surface of the substrate 651 different from the surface on which the lens resin portion 19 is formed.

[0203] exist Fig.19 In the present invention, the substrate 651 on which the lens resin portion 19 is formed has a cavity shape and includes a surface different in height from the surface on which the lens resin portion 19 is formed. The abutment portion 661 of the mold 603 is arranged at the outer periphery of the mold 603 and is configured to abut against a surface higher than the surface on which the lens resin portion 19 is formed. The abutment portion 661 controls the height of the lens resin portion 19 by abutting against a surface higher than the surface on which the lens resin portion 19 is formed.

[0204] When the abutment portion 661 abuts against the upper surface at the higher side of the substrate 651, a space allowing the lens material 602 to flow therein is formed between the lower surface at the lower side of the substrate 651 having a cavity shape and the mold 603, so that: excess lens material 602 can flow out to the outside, or the lens material 602 can return to the inside when hardening and shrinking.

[0205] Fig. 20 yes Fig.19A cross-sectional view of the mold 603 is shown, as well as a plan view (bottom view) of its lower surface, which is the surface pressed against the lens material 602.

[0206] On the substrate 651 ( Fig.19 ) in the case where there is a step between the surface on which the lens resin portion 19 is formed and the surface at a different height, the mold 603 and the substrate 651 can be aligned in the planar direction by utilizing the inclined surface connecting the two surfaces.

[0207] like Fig. 20 As shown in the cross-sectional and plan views, Fig.19 The mold 603 shown is provided with a guide portion 671 formed in a frustum shape so as to contact the inclined surfaces at the four corners of the substrate 651, and the guide portion 671 is guided by the inclined surface of the cavity shape of the substrate 651, so that the position of the mold 603 in the plane direction is controlled. Except for the four corners of the guide portion 671 of the mold 603, the mold 603 is recessed on the inside (in the direction of the lens portion 19L) relative to the inclined surface of the cavity shape of the substrate 651, thereby forming a gap as a flow path of the lens material 602.

[0208] <11. Detailed Structure of Solid-State Image Sensor>

[0209] Next, the detailed structure and manufacturing method of the solid-state imaging element 13 of the camera package 1 will be described.

[0210] Fig.21 is a diagram showing a detailed cross-sectional structure of the solid-state imaging element 13. Fig.21 In FIG. 1 , the lens resin portion 19 of the camera package 1 is omitted from illustration.

[0211] In the portion including the upper structure 11 provided in the camera package 1 and the portion above the upper structure 11, a pixel array unit 24 is arranged, in which a plurality of pixels 31 ( Figure 2 ), each pixel 31 includes an on-chip lens 16, a color filter 15, a pixel transistor, and a photodiode 51. A pixel transistor region 301 is also arranged in the region (pixel array region) of the pixel array unit 24. The pixel transistor region 301 is a region in which at least one pixel transistor among a transfer transistor, an amplification transistor, and a reset transistor is formed.

[0212] In a region located on the lower surface of the semiconductor substrate 81 provided in the lower structure body 12 and below the pixel array unit 24 provided in the upper structure body 11 , a plurality of external terminals 14 are arranged.

[0213] Note that Fig.21In the description, “the area located on the lower surface of the semiconductor substrate 81 disposed in the lower structure 12 and below the pixel array unit 24 disposed in the upper structure 11” is referred to as the first specific area, and “the area located on the upper surface of the semiconductor substrate 81 disposed in the lower structure 12 and below the pixel array unit 24 disposed in the upper structure 11” is referred to as the second specific area.

[0214] At least a portion of the plurality of external terminals 14 arranged in the first specific area is a signal input terminal 14A for inputting a signal from the outside to the camera package 1, or a signal output terminal 14B for outputting a signal from the camera package 1 to the outside. In other words, the signal input terminal 14A and the signal output terminal 14B are external terminals 14 other than the power terminal and the ground terminal among the external terminals 14. In the present disclosure, the signal input terminal 14A or the signal output terminal 14B is also referred to as a signal input / output terminal 14C.

[0215] A through via 88 penetrating the semiconductor substrate 81 is arranged near the signal input / output terminal 14C in the first specific region. Note that in this disclosure, a through via hole penetrating the semiconductor substrate 81 and a via wiring formed in the through via hole are simply referred to as a through via 88 in some cases.

[0216] Preferably, the through via hole has a structure formed by digging from the lower surface of the semiconductor substrate 81 until reaching a conductive pad 322 (hereinafter sometimes referred to as a via pad 322), wherein the conductive pad 322 is a portion of a multilayer wiring layer 82 arranged above the upper surface of the semiconductor substrate 81 and serves as a terminal (bottom) of the via hole.

[0217] The signal input / output terminal 14C arranged in the first specific region is electrically connected to the through via 88 (more specifically, via wiring formed in a through via hole) also arranged in the first specific region.

[0218] An input / output circuit unit 49 provided with the input circuit unit 42 or the output circuit unit 47 is arranged in the area near the signal input / output terminal 14C and the above-mentioned through via in the second specific area.

[0219] The signal input / output terminal 14C arranged in the first specific region is electrically connected to the input / output circuit unit 49 via the penetration via 88 and the via pad 322 or a part of the multilayer wiring layer 82 .

[0220] The region where the input / output circuit unit 49 is arranged is referred to as an input / output circuit region 311. On the upper surface of the semiconductor substrate 81 provided in the lower structure 12, a signal processing circuit region 312 is formed adjacent to the input / output circuit region 311. The signal processing circuit region 312 is a region where a reference circuit is formed. Figure 2 The region of the image signal processing unit 26 is illustrated.

[0221] The area where the pixel peripheral circuit unit is arranged is called the pixel peripheral circuit area 313. Figure 2 The pixel peripheral circuit area 313 is arranged in an area outside the pixel array unit 24 on the lower surface of the semiconductor substrate 101 provided in the upper structure body 11 and on the upper surface of the semiconductor substrate 81 provided in the lower structure body 12.

[0222] The signal input / output terminal 14C may be arranged in a region below the input / output circuit region 311 provided in the lower structural body 12, or may be arranged in a region below the signal processing circuit region 312. Alternatively, the signal input / output terminal 14C may be arranged below a pixel peripheral circuit unit such as a row driving unit 22 or a column signal processing unit 25 provided in the lower structural body 12.

[0223] In the present disclosure, a wiring connection structure for connecting wiring included in the multilayer wiring layer 102 of the upper structure 11 and wiring included in the multilayer wiring layer 82 of the lower structure 12 is sometimes referred to as an upper / lower wiring connection structure, and an area where this structure is arranged is sometimes referred to as an upper / lower wiring connection area 314.

[0224] The upper / lower wiring connection structure includes: a first through electrode (Through Silicon Via) 109, which penetrates the semiconductor substrate 101 from the upper surface of the upper structure 11 and reaches the multi-layer wiring layer 102; a second through electrode (chip through electrode) 105, which penetrates the semiconductor substrate 101 and the multi-layer wiring layer 102 from the upper surface of the upper structure 11 and reaches the multi-layer wiring layer 82 of the lower structure 12; and a connecting wiring 106, which is used to connect the above two through electrodes (Through Silicon Via, TSV). In the present disclosure, this upper / lower wiring connection structure is sometimes referred to as a twin contact structure.

[0225] The upper / lower wiring connection region 314 is arranged outside the pixel peripheral circuit region 313 .

[0226] In this embodiment, the pixel peripheral circuit region 313 is formed in both the upper structure body 11 and the lower structure body 12 , but may be formed in only one of them.

[0227] In addition, in this embodiment, the upper / lower wiring connection area 314 is arranged outside the pixel array unit 24 and outside the pixel peripheral circuit area 313, but it can also be arranged outside the pixel array unit 24 and inside the pixel peripheral circuit area 313.

[0228] In this embodiment, a double contact structure using two through-electrodes, the through-silicon via 109 and the through-chip via 105, is adopted as a structure for electrically connecting the multilayer wiring layer 102 of the upper structure 11 and the multilayer wiring layer 82 of the lower structure 12.

[0229] As a structure for electrically connecting the multilayer wiring layer 102 of the upper structure 11 and the multilayer wiring layer 82 of the lower structure 12, for example, a shared contact structure can be adopted in which the wiring layer 103 of the upper structure 11 and the wiring layer 83 of the lower structure 12 are each connected to a through electrode.

[0230] <12. Method for manufacturing camera package>

[0231] Next, refer to Figures 22 to 36 , a method for manufacturing the camera package 1 is described.

[0232] First, the lower structure 12 and the upper structure 11 are manufactured in a wafer state.

[0233] As the lower structural body 12, an input / output circuit unit 49 and a multilayer wiring layer 82 as a part of the row driving unit 22 or the column signal processing unit 25 are formed in a region to be each chip unit of a semiconductor substrate 81. The semiconductor substrate 81 at this time is in a state before thinning, and its thickness is, for example, about 600 μm.

[0234] On the other hand, as the upper structure 11, the photodiode 51 of each pixel 31 and the source / drain region of the pixel transistor are formed in the region to be each chip unit of the semiconductor substrate 101. In addition, on one surface of the semiconductor substrate 101, a multilayer wiring layer 102 for constituting the row drive signal line 32 and the vertical signal line 33, etc. is formed. At this time, the semiconductor substrate 101 is also in a state before thinning, and its thickness is, for example, about 600 μm.

[0235] Then, if Fig. 22As shown in FIG. 1 , after the multilayer wiring layer 82 side of the lower structure 12 and the multilayer wiring layer 102 side of the upper structure 11 in the manufactured wafer state are faced to each other and bonded, as shown in FIG. Fig.23 As shown, the semiconductor substrate 101 of the upper structure 11 is thinned. For example, the above bonding may include plasma bonding and bonding using an adhesive; in this embodiment, bonding is performed by plasma bonding. In the case of plasma bonding, a film such as a plasma TEOS film, a plasma SiN film, a SiON film (barrier film) or a SiC film is formed on the bonding surface of the upper structure 11 and the lower structure 12, and the two bonding surfaces are plasma treated and overlapped, and then annealing is performed, and finally the upper structure 11 and the lower structure 12 are bonded.

[0236] After the semiconductor substrate 101 of the upper structure 11 is thinned, Fig.24 As shown, in a region to be an upper / lower wiring connection region 314, a silicon through electrode 109, a chip through electrode 105, and a connection wiring 106 for connecting these two through electrodes are formed using a damascene method or the like.

[0237] Next, if Fig.25 As shown, a planarization film 108 is first formed above the photodiode 51 of each pixel 31 , and then a color filter 15 and an on-chip lens 16 are formed on the planarization film 108 .

[0238] Then, if Fig.26 As shown in FIG. 1 , a planarization film 110 is first formed on the entire surface of the solid-state imaging element 13 obtained by bonding the upper structure 11 and the lower structure 12, on which the on-chip lens 16 is formed, and then a sealing resin 17 is applied on the planarization film 110, and as shown in FIG. Fig. 27 As shown, the protective substrate 18 is bonded to the above-mentioned sealing resin, thereby having a cavity-free structure.

[0239] At this time, as reference Figure 6 As described in B, when a method of bonding the protective substrate 18 in a single state to the solid-state imaging element 13 to form the lens resin portion 19 is adopted, the lens resin portion 19 is first formed on the protective substrate 18 .

[0240] On the other hand, as referenced Figure 6 As described in A, in the case of adopting a method in which the protective substrate 18 is disposed above the solid-state imaging element 13 and then the lens resin portion 19 is formed on the protective substrate 18, Fig. 27 After the state shown, the lens resin portion 19 is formed on the protective substrate 18 in a predetermined step.

[0241] Next, if Fig.28 As shown, after the entire solid-state imaging element 13 is turned upside down, the semiconductor substrate 81 of the lower structure 12 is thinned to a thickness that does not affect the device characteristics, for example, to a thickness of about 30 μm to 100 μm.

[0242] Next, if Fig.29 As shown, after a pattern of a photoresist 221 is formed on the thinned semiconductor substrate 81 so that the photoresist has an opening at a position where a through via 88 (not shown) is to be arranged, the semiconductor substrate 81 and a portion of the interlayer insulating film 84 under the semiconductor substrate 81 are removed by dry etching to form an opening portion 222.

[0243] Next, if Fig.30 As shown, for example, an insulating film (isolation film) 86 is formed by a plasma CVD method on the entire upper surface of the semiconductor substrate 81 including the opening portion 222. For example, the insulating film 86 may be a SiO2 film, a SiN film, or the like.

[0244] Next, if Fig.31 As shown, the insulating film 86 on the bottom surface of the opening 222 is removed by an etch-back method, thereby exposing the wiring layer 83c closest to the semiconductor substrate 81.

[0245] Next, if Fig.32 As shown, a barrier metal film (not shown) and a Cu seed layer 231 are formed by sputtering. The barrier metal film is used to prevent Fig.33 The Cu seed layer 231 is a film diffused with the connection conductor 87 (Cu) shown in the figure, and when the connection conductor 87 is buried by electrolytic plating, the Cu seed layer 231 serves as an electrode. Tantalum (Ta), titanium (Ti), tungsten (W), zirconium (Zr) and its nitride film can be used as the material of the barrier metal film. In this embodiment, titanium is used as the barrier metal film.

[0246] Next, if Fig.33 As shown, after forming a resist pattern 241 in a desired region on the Cu seed layer 231, copper (Cu) is plated as the connection conductor 87 by electrolytic plating. Thus, the through via 88 is formed, and the rewiring 90 is also formed on the upper side of the semiconductor substrate 81.

[0247] Next, if Fig.34 As shown, after the resist pattern 241 is removed, the barrier metal film (not shown) and the Cu seed layer 231 under the resist pattern 241 are removed by wet etching.

[0248] Next, if Fig.35As shown, after the solder resist layer 91 is formed so as to protect the rewiring 90 , the solder resist layer 91 is removed only in the region for mounting the external terminal 14 , thereby forming the solder resist opening portion 242 .

[0249] Then, if Fig.36 As shown, the external terminal 14 is formed in the solder resist opening 242 by a solder ball mounting method or the like.

[0250] As described above, according to the manufacturing method of the solid-state imaging element 13, first, the upper structure 11 (first semiconductor substrate) and the lower structure 12 (second semiconductor substrate) are bonded to each other in a manner that the wiring layers face each other, wherein in the upper structure 11, a photodiode 51 and a pixel transistor circuit for photoelectric conversion are formed, and in the lower structure 12, an input / output circuit unit 49 for outputting a pixel signal output from the pixel 31 to the outside of the camera package 1 is formed below the pixel array unit 24. Then, a through passage 88 is formed that passes through the lower structure 12, and an external terminal 14 is formed, which is electrically connected to the outside of the camera package 1 via the input / output circuit unit 49 and the through passage 88. Therefore, it is possible to manufacture Figure 1 The camera package 1 is shown.

[0251] <13. Configuration example of camera module>

[0252] The mold to which the present disclosure is applied may be used to form a mold in a wafer-level lens process that simultaneously forms a plurality of lenses in a planar direction of a wafer substrate by an imprint method.

[0253] Hereinafter, the configuration of a camera module formed by using a wafer-level lens process for simultaneously forming a plurality of lenses in a planar direction of a wafer substrate is first described, and then steps in which the mold of the present disclosure can be used among steps of forming the camera module are described.

[0254] Fig.37 is a cross-sectional view of the camera module 700 .

[0255] The camera module 700 includes a stacked lens structure (lens module) 702 in which a plurality of substrates 701a to 701e with lenses are stacked. The stacked lens structure 702 forms an optical unit 703. A dashed line 704 indicates an optical axis of the optical unit 703.

[0256] Figure 1 The camera package 1 in the embodiment is arranged below the stacked lens structure 702. The camera package 1 is fixed on the stacked lens structure 702 by using a structural material 740 formed by using, for example, epoxy resin.

[0257] In the camera module 700, light incident on the camera module 700 from above passes through the stacked lens structure 702 and is incident on the on-chip lens 16, the color filter 15 and the photoelectric conversion elements such as the photodiode (not shown) formed in the upper structure 11 of the camera package 1.

[0258] The stacked lens structure 702 is provided with five stacked lens substrates 701a to 701e. When there is no need to distinguish these five lens substrates 701a to 701e, they are simply referred to as the lens substrate 701.

[0259] Note that Fig.37 In the example of FIG. 7 , the stacked lens structure 702 has a configuration in which five substrates with lenses 701 a to 701 e are stacked, but the number of stacked substrates with lenses 701 may be a plurality other than five or one.

[0260] Each lens-carrying substrate 701 for forming the stacked lens structure 702 has a configuration in which a lens resin portion 722 is added to a carrier substrate 721. The carrier substrate 721 includes a through hole 723, and the lens resin portion 722 is formed inside the through hole 723. The lens resin portion 722 is a portion integrally formed of a material for forming a lens portion, and includes a portion extending to the carrier substrate 721 to carry the lens portion.

[0261] Note that in the case where the carrier substrate 721, the lens resin portion 722, or the through hole 723 of the substrates with lenses 701a to 701e are distinguished from each other, as shown in FIG. Fig.37 As shown, they are described as carrier substrates 721a to 721e, lens resin portions 722a to 722e, or through holes 723a to 723e corresponding to the substrates with lenses 701a to 701e.

[0262] The cross-sectional shape of the through hole 723 of each lens-equipped substrate 701 for forming the stacked lens structure 702 has a so-called downward frustum shape in which the opening width decreases in the direction toward the lower side.

[0263] A diaphragm plate 731 is disposed on the stacked lens structure 702 . For example, the diaphragm plate 731 is provided with a layer formed by using a material having light absorption or light shielding properties. The diaphragm plate 731 is provided with an opening 732 .

[0264] The stacked lens structure 702 , the camera package 1 , the aperture plate 731 , and the like are housed in a lens barrel 751 .

[0265] As mentioned above, Figure 1The camera package 1 in FIG. 7 may be combined with a stacked lens structure 702 in which a plurality of substrates 701 with lenses are stacked to form a camera module 700 .

[0266] In addition, if Fig.38 As shown, the camera module 700 may also have a stacked lens structure 702 and Fig.10 The camera package 1 shown in the figure is combined with the structure, or has a structure in which the stacked lens structure 702 and Fig.12 The camera package 1 shown is assembled.

[0267] In addition, if Fig.39 As shown, the camera module 700 may have a configuration of a compound-eye camera module in which a stacked lens structure 702 is provided with a plurality of optical units 703 , and a camera package 1 is provided with a plurality of light receiving areas corresponding to the plurality of optical units 703 .

[0268] Note that Fig.39 In the camera package 1 of the illustrated camera module 700 , a configuration is adopted in which the sealing resin 17 buried between the on-chip lens 16 and the protective substrate 18 , and the lens resin portion 19 and the high contact angle film 20 formed on the upper surface of the protective substrate 18 are omitted.

[0269] exist Fig.39 In the example of , the multiple optical units 703 formed in the stacked lens structure 702 have the same structure, but sometimes they may have different structures. That is, due to the different shapes and numbers of the lens resin parts 722, the structures of the multiple optical units 703 may have different optical parameters. For example, the multiple optical units 703 may be an optical unit 703 with a short focal length for imaging a near scene and an optical unit 703 with a long focal length for imaging a distant scene.

[0270] Fig.40 It is used to illustrate the reference of the substrate state in manufacturing Figure 37 to Figure 39 A diagram illustrating a method of manufacturing a stacked lens structure 702.

[0271] First, if Fig.40 As shown in A, a substrate 701W-e with a lens in a substrate state located at the bottom layer of the stacked lens structure 702 is prepared. Note that the substrate 701W-e with a lens represents the substrate state (wafer state) before the substrate 701e with a lens is singulated. For the substrates 701W-a to 701W-d with a lens in a substrate state described later, they similarly represent the substrate state (wafer state) before the substrates 701a to 701e with a lens are singulated.

[0272] Next, if Fig.40 As shown in B, the substrate 701W-d with a lens in a substrate state located at the second-to-last bottom layer of the stacked lens structure 702 is bonded to the substrate 701W-e with a lens in a substrate state.

[0273] Next, if Fig.40 As shown in C, the substrate 701W-c with a lens in a substrate state, which is located at the third-to-last bottom layer of the stacked lens structure 702, is bonded to the substrate 701W-d with a lens in a substrate state.

[0274] Next, if Fig.40 As shown in D, the substrate 701W-b with a lens in a substrate state, which is located in the fourth-to-last bottom layer of the stacked lens structure 702, is bonded to the substrate 701W-c with a lens in a substrate state.

[0275] Next, if Fig.40 As shown in E, the substrate 701W-a with a lens in a substrate state, which is located in the fifth to last bottom layer of the stacked lens structure 702, is bonded to the substrate 701W-b with a lens in a substrate state.

[0276] Finally, if Fig.40 As shown in FIG. 5 , the aperture plate 731W on the substrate 701a with lens in the stacked lens structure 702 is bonded to the substrate 701W-a with lens in the substrate state. The aperture plate 731W represents the substrate state (wafer state) before the aperture plate 731 is singulated.

[0277] As described above, in the stacked lens structure 702, five substrates 701W-a to 701W-e with lenses in a substrate state are stacked one by one from the lower substrate 701W with lenses to the upper substrate 701W with lenses, thereby obtaining a stacked lens structure 702W in a substrate state.

[0278] Note that the stacked lens structure 702W in a substrate state may also be formed by sequentially stacking from an upper substrate 701W with lenses to a lower substrate 701W with lenses.

[0279] <14. Direct bonding between substrates with lenses>

[0280] As an example of bonding two substrates 701W with lenses in a substrate state, Fig.41 It is a diagram for explaining the bonding between the substrate with lens 701W-a in the substrate state and the substrate with lens 701W-b in the substrate state.

[0281] Note that Fig.41, portions of the substrate with lens 701W-b that correspond to portions of the substrate with lens 701W-a are given the same reference numerals as those of the substrate with lens 701W-a to be described.

[0282] An upper surface layer 801 is formed on the upper surface of the substrate 701W-a with a lens and the upper surface of the substrate 701W-b with a lens. A lower surface layer 802 is formed on the lower surface of the substrate 701W-a with a lens and the lower surface of the substrate 701W-b with a lens. Then, as Fig.41 As shown in A, the entire lower surface of the substrate 701W-a with lens including the inner flat portion 812 and the entire upper surface of the substrate 701W-b with lens including the surface side flat portion 811 are subjected to plasma activation treatment, and the above-mentioned entire lower surface and the above-mentioned entire upper surface are the bonding surfaces of the substrates 701W-a with lenses and 701W-a. The gas used for plasma activation treatment can be any gas such as O2, N2, He, Ar and H2, as long as the gas can be used for plasma treatment. However, when a gas having the same constituent elements as the upper surface layer 801 and the lower surface layer 802 is used as the gas for plasma activation treatment, changes in the films of the upper surface layer 801 and the lower surface layer 802 can be preferably suppressed.

[0283] Then, if Fig.41 As shown in B, the inner flat portion 812 of the substrate with lens 701W-a in an activated surface state and the front flat portion 811 of the substrate with lens 701W-b in an activated surface state are bonded to each other.

[0284] By bonding the substrates with lenses, hydrogen bonds are generated between hydrogen of the OH groups on the surface of the lower surface layer 802 of the substrate 701W-a with lenses and hydrogen of the OH groups on the surface of the upper surface layer 801 of the substrate 701W-b with lenses. Therefore, the substrate 701W-a with lenses and the substrate 701W-b with lenses are fixed. This bonding process between the substrates with lenses can be performed under atmospheric pressure.

[0285] The substrate 701W-a with lens and the substrate 701W-b with lens that have undergone the above-mentioned bonding treatment are annealed. In addition, dehydration condensation occurs in a state where the OH group is hydrogen-bonded, so a covalent bond is formed between the lower surface layer 802 of the substrate 701W-a with lens and the upper surface layer 801 of the substrate 701W-b with lens through oxygen. Alternatively, the elements contained in the lower surface layer 802 of the substrate 701W-a with lens and the elements contained in the upper surface layer 801 of the substrate 701W-b with lens are covalently bonded. By bonding, the two substrates with lenses are firmly fixed. In this way, when a covalent bond is formed between the lower surface layer 802 of the substrate 701W with lens arranged on the upper side and the upper surface layer 801 of the substrate 701W with lens arranged on the lower side, and the two substrates 701W with lenses are fixed, this is referred to as direct bonding in this specification. Since direct bonding according to the present disclosure does not use resin when fixing the plurality of substrates with lenses 701W, this produces the following action and effect: the plurality of substrates with lenses 701W can be fixed without causing hardening shrinkage or thermal expansion.

[0286] The above-mentioned annealing treatment can also be performed under atmospheric pressure. Since the annealing treatment performs dehydration condensation, it can be performed at 100° C. or higher, 150° C. or higher, or 200° C. or higher. In contrast, from the viewpoint of protecting the energy-curable resin used to form the lens resin portion 722 from heat and from the viewpoint of suppressing degassing of the energy-curable resin, the annealing treatment can be performed at 400° C. or lower, 350° C. or lower, or 300° C. or lower.

[0287] In the case where the bonding process of the substrate with lens 701W or the direct bonding process of the substrate with lens 701W is performed under non-atmospheric pressure conditions, when the bonded substrate with lens 701W-a and substrate with lens 701W-b are returned to the atmospheric environment, a pressure difference is generated between the bonded lens resin portion 722 and the space outside the lens resin portion 722. Due to the pressure difference, pressure is applied to the lens resin portion 722, so that there is a concern that the lens resin portion 722 may be deformed.

[0288] The bonding process of the substrate with lens 701W or the direct bonding process of the substrate with lens 701W under atmospheric pressure conditions produces the following effects: deformation of the lens resin portion 722 that may occur when bonding is performed under non-atmospheric pressure conditions is avoided.

[0289] By directly bonding substrates that have been subjected to plasma activation treatment, in other words, by directly bonding the substrates by plasma bonding, for example, as in the case of using a resin as an adhesive, fluidity and thermal expansion can be suppressed, thereby improving the positional accuracy when bonding the substrate 701W-a with a lens and the substrate 701W-b with a lens.

[0290] As described above, the upper surface layer 801 or the lower surface layer 802 is formed on the inner flat portion 812 of the substrate 701W-a with a lens and on the surface flat portion 811 of the substrate 701W-b with a lens. By the plasma activation treatment performed earlier, dangling bonds are easily formed on the upper surface layer 801 and the lower surface layer 802. That is, the lower surface layer 802 formed on the inner flat portion 812 of the substrate 701W-a with a lens and the upper surface layer 801 formed on the surface flat portion 811 of the substrate 701W-b with a lens are also used to improve the bonding strength.

[0291] In addition, when an oxide film is used to form the upper surface layer 801 or the lower surface layer 802, it is not affected by the change in film quality caused by plasma (O2), so this also has the effect of suppressing the corrosion of the lens resin part 722 by plasma.

[0292] As described above, a substrate 701W-a with lenses in a substrate state in which a plurality of substrates 701a with lenses are formed and a substrate 701W-b with lenses in a substrate state in which a plurality of substrates 701b with lenses are formed are directly bonded after surface activation treatment by plasma, in other words, bonded by plasma bonding.

[0293] The same applies to the case of bonding two other substrates 701W with lenses in the substrate state.

[0294] <15. Method for manufacturing substrate with lens>

[0295] Next, refer to Fig.42 , describing a method for manufacturing a substrate 701W with a lens in a substrate state.

[0296] First, if Fig.42 As shown in FIG. 1A , a carrier substrate 721W is prepared, in which a plurality of through holes 723 are formed. A light shielding film 911 is formed on the side walls of the through holes 723 to prevent light reflection. Fig.42 In the figure, due to space limitation, only two through holes 723 are shown, but actually a large number of through holes 723 are formed in the plane direction of the carrier substrate 721W. In addition, an alignment mark (not shown) for alignment is formed in a region near the periphery of the carrier substrate 721W.

[0297] The surface side flat portion 811 on the upper side of the carrier substrate 721W and the back side flat portion 812 on the lower side are flat surfaces formed to be sufficiently flat for the above-mentioned plasma bonding. The thickness of the carrier substrate 721W also serves as a spacer for determining the distance between lenses when it is finally singulated into a substrate 701 with a lens and stacked with another substrate 701 with a lens.

[0298] For the carrier substrate 721W, it is preferable to use a base material having a low thermal expansion coefficient of 10 ppm / °C or less.

[0299] Next, if Fig.42 As shown in FIG. 1B , a carrier substrate 721W is arranged on a mold substrate 921, and a plurality of concave molds 922 are arranged on the mold substrate 921 at equal intervals. More specifically, the inner flat portion 812 of the carrier substrate 721W and the flat surface 923 of the mold substrate 921 are overlapped, so that the concave mold 922 is located inside the through hole 723 of the carrier substrate 721W. The molds 922 of the mold substrate 921 are formed in a one-to-one correspondence with the through holes 723 of the carrier substrate 721W, and the positions of the carrier substrate 721W and the mold substrate 921 in the plane direction are adjusted so that the center of the corresponding mold 922 and the center of the through hole 723 coincide in the optical axis direction. The mold substrate 921 is formed using a hard molding member, so the mold substrate 921 is formed using, for example, metal, silicon, quartz, or glass.

[0300] Next, if Fig.42 As shown in C, the energy-hardening resin 931 is filled (dropped) into the space between the mold substrate 921 and the through hole 723 of the stacked carrier substrate 721W. The lens resin portion 722 is formed using the energy-hardening resin 931. Therefore, it is preferred that the energy-hardening resin 931 be defoamed in advance so that it does not contain bubbles. The defoaming treatment is preferably a vacuum defoaming treatment or a defoaming treatment performed by centrifugal force. In addition, the vacuum defoaming treatment is preferably performed after filling. By performing the defoaming treatment, the lens resin portion 722 can be molded without containing bubbles.

[0301] Next, if Fig.42 As shown in FIG. 1 , a mold substrate 941 is arranged on the stacked mold substrate 921 and the carrier substrate 721W. A plurality of concave molds 942 are arranged at equal intervals on the mold substrate 941, and the mold substrate 941 is arranged after being aligned with high precision so that the center of the through hole 723 and the center of the mold 942 coincide in the optical axis direction as in the case where the mold substrate 921 is arranged. The mold substrate 941 is formed using a hard molding member, and thus is formed using, for example, metal, silicon, quartz, or glass.

[0302] As for the height direction, which is the longitudinal direction on the paper, the position of the mold substrate 941 is fixed so that the interval between the mold substrate 941 and the mold substrate 921 becomes a distance predetermined by a control device that controls the interval between the mold substrate 941 and the mold substrate 921. At this time, the space between the mold 942 of the mold substrate 941 and the mold 922 of the mold substrate 921 is equal to the thickness of the lens resin portion 722 calculated by the optical design.

[0303] Alternatively, if Fig.42 As shown in FIG. 8E, as in the case where the mold substrate 921 is arranged, the flat surface 943 of the mold substrate 941 and the surface side flat portion 811 of the carrier substrate 721W can overlap. In this case, the distance between the mold substrate 941 and the mold substrate 921 is the same as the thickness of the carrier substrate 721W, so high-precision alignment can be performed in the plane direction and the height direction.

[0304] When the interval between the mold substrate 941 and the mold substrate 921 is controlled to be a preset distance, Fig.42 In step C, the filling amount of the energy-hardening resin 931 dropped into the through hole 723 of the carrier substrate 721W is an amount that does not overflow from the space surrounded by the through hole 723 of the carrier substrate 721W and the upper mold substrate 941 and the lower mold substrate 921. Therefore, the manufacturing cost can be reduced without wasting the material of the energy-hardening resin 931.

[0305] Later, in Fig.42 In the state shown in E of FIG. 1 , the energy hardening resin 931 is hardened. For example, when heat or ultraviolet rays are supplied as energy to the energy hardening resin 931, the energy hardening resin 931 is hardened. During the hardening process, the deformation due to the contraction of the energy hardening resin 931 can be minimized by pushing down the mold substrate 941 or performing alignment.

[0306] A thermoplastic resin may be used instead of the energy-hardening resin 931. In this case, Fig.42 In the state shown in E, the energy-hardening resin 931 is molded into a lens shape by increasing the temperature of the mold substrate 941 and the mold substrate 921, and is hardened by cooling.

[0307] Next, if Fig.42 As shown in FIG. 5 , the control device for controlling the positions of the mold substrate 941 and the mold substrate 921 moves the mold substrate 941 upward and moves the mold substrate 921 downward, so that the mold substrate 941 and the mold substrate 921 are separated from the carrier substrate 721W. When the mold substrate 941 and the mold substrate 921 are separated from the carrier substrate 721W, the lens resin portion 722 is formed inside the through hole 723 of the carrier substrate 721W.

[0308] Note that, for example, the surfaces of the mold substrate 941 and the mold substrate 921 that are in contact with the carrier substrate 721W may be coated with a fluorine-based or silicon-based release agent. In this way, the carrier substrate 721W can be easily separated from the mold substrate 941 and the mold substrate 921. In addition, as a method of easily separating from the contact surface with the carrier substrate 721W, various coatings such as fluorine-containing diamond-like carbon (DLC) may be applied.

[0309] Next, if Fig.42 As shown in FIG. 1 , an upper surface layer 801 is formed on the surface of the carrier substrate 721W and the surface of the lens resin portion 722, and a lower surface layer 802 is formed on the rear surface of the carrier substrate 721W and the lens resin portion 722. Before and after the formation of the upper surface layer 801 and the lower surface layer 802, the surface side flat portion 811 and the back side flat portion 812 of the carrier substrate 721W can be flattened by performing chemical mechanical polishing (CMP) or the like as needed.

[0310] As described above, by imprinting (press molding) the energy curing resin 931 into the through hole 723 formed in the carrier substrate 721W using the mold substrate 941 and the mold substrate 921, the lens resin portion 722 can be formed and the substrate-state substrate 701W with lens can be manufactured.

[0311] The shapes of the mold 922 and the mold 942 are not limited to the above-mentioned concave shapes, but are appropriately determined according to the shape of the lens resin portion 722. Figures 37 to 39 As shown, the lens shapes of the lens-bearing substrates 701a to 701e can adopt various shapes obtained through optical system design; for example, a biconvex shape, a biconcave shape, a plano-convex shape, a plano-concave shape, a convex meniscus shape, a concave meniscus shape, and higher-order aspheric shapes can be adopted.

[0312] Furthermore, the shapes of the mold 922 and the mold 942 may be such that the lens shape formed has a moth-eye structure.

[0313] According to the above-mentioned manufacturing method, the fluctuation of the distance in the plane direction between the lens resin parts 722 due to the hardening shrinkage of the energy-hardening resin 931 can be eliminated by the intervention of the carrier substrate 721W, so that the lens distance accuracy can be controlled with high precision. In addition, there is an effect that the energy-hardening resin 931 with low strength is strengthened by the carrier substrate 721W with high strength. Therefore, a lens array substrate in which a plurality of lenses with excellent operability are arranged can be provided, and there is an effect of suppressing the warping of the lens array substrate.

[0314] When forming the mold 922 and the mold 942 used in the method for manufacturing the substrate 701W with a lens in the above-mentioned substrate state, the reference Fig.11 The forming method of the mold 503.

[0315] <16. Application examples of electronic equipment>

[0316] The above-mentioned camera package 1 and camera module 700 can be used in combination with electronic devices, wherein the camera package is used in an imaging unit (photoelectric conversion unit), for example: an imaging device, such as a digital camera and a video camera; a portable terminal device with an imaging function; and a copier using a camera package in an image reading unit.

[0317] Fig.43 : is a block diagram showing a configuration example of an imaging device as an electronic device to which the present disclosure is applied.

[0318] Fig.43 The image pickup device 2000 in the embodiment is provided with a camera module 2002 and a digital signal processor (DSP) circuit 2003 as a camera signal processing circuit. In addition, the image pickup device 2000 is provided with a frame memory 2004, a display unit 2005, a recording unit 2006, an operation unit 2007, and a power supply unit 2008. The DSP circuit 2003, the frame memory 2004, the display unit 2005, the recording unit 2006, the operation unit 2007, and the power supply unit 2008 are connected to each other via a bus 2009.

[0319] The image sensor 2001 in the camera module 2002 acquires incident light (image light) from an object, and converts the light amount of the incident light of the image formed on the imaging surface into an electrical signal in the pixel unit, and outputs the electrical signal as a pixel signal. The above-mentioned camera module 700 is adopted as the camera module 2002, and the image sensor 2001 corresponds to the above-mentioned solid-state imaging element 13. In the case of adopting the configuration of the camera package 1 as the imaging unit of the imaging device 2000, the camera module 2002 is replaced by the camera package 1.

[0320] For example, the display unit 2005 formed by using a panel display device such as a liquid crystal panel and an organic electroluminescent (EL) panel displays a moving image or a still image captured by the image sensor 2001. The recording unit 2006 records the moving image or the still image captured by the image sensor 2001 in a recording medium such as a hard disk and a semiconductor memory.

[0321] The operation unit 2007 issues operation commands regarding various functions of the imaging device 2000 under the operation of the user. The power supply unit 2008 appropriately supplies various power sources used as operation power sources for the DSP circuit 2003, frame memory 2004, display unit 2005, recording unit 2006, and operation unit 2007 to power supply targets.

[0322] As described above, high image quality and miniaturization can be achieved by using the camera module 700 equipped with the stacked lens structure 702 that is aligned and bonded (stacked) with high precision as the camera module 2002. Therefore, in the imaging device 2000 such as a video camera, a digital camera, and a camera module for a mobile device (e.g., a portable phone), it is also possible to make the semiconductor package compact and improve the image quality of the captured image.

[0323] <Use examples of image sensors>

[0324] Fig.44 1 is a diagram showing a usage example of an image sensor using the camera package 1 or the camera module 700 .

[0325] For example, as described below, an image sensor using the camera package 1 or the camera module 700 may be used in various cases of sensing light such as visible light, infrared light, ultraviolet light, and X-rays.

[0326] - Devices that capture images for viewing, such as digital cameras and portable devices with camera functions

[0327] - Devices for traffic purposes, such as on-board sensors for capturing images of the front, rear, surroundings, and interior of a car for safe driving such as automatic stopping and driver status recognition; surveillance cameras for monitoring moving vehicles and roads; and distance sensors for measuring the distance between vehicles, etc.

[0328] - Devices for home appliances such as televisions, refrigerators, and air conditioners that record user gestures and operate the device based on the gestures

[0329] - Devices for medical care, such as endoscopes and devices for angiography by receiving infrared light

[0330] -Security devices, such as security cameras and personal authentication cameras

[0331] - Devices for beauty care, such as skin condition measurement devices for imaging the skin and microscopes for imaging the scalp

[0332] - Equipment for sports, such as action cameras and wearable cameras for sports

[0333] - Agricultural devices, such as cameras used to monitor the condition of fields and crops

[0334] <17. Application examples of in vivo information acquisition systems>

[0335] As described above, the technology according to the present disclosure (the present technology) is applicable to various products. For example, the technology according to the present disclosure can be applied to a system for acquiring in vivo information of a patient using a capsule endoscope.

[0336] Fig.45 : is a block diagram showing an example of a schematic configuration of an in-vivo information acquisition system of a patient using a capsule endoscope, to which the technology according to the present disclosure (the present technology) can be applied.

[0337] The in vivo information acquisition system 10001 includes a capsule endoscope 10100 and an external control device 10200 .

[0338] During the examination, the patient swallows the capsule endoscope 10100. The capsule endoscope 10100 has an imaging function and a wireless communication function, and while the capsule endoscope 10100 moves in organs such as the stomach and intestines by peristaltic motion or the like until the patient naturally excretes the capsule endoscope 10100, it sequentially captures images in the organs (hereinafter also referred to as in-vivo images) at predetermined intervals, and sequentially wirelessly transmits information on the in-vivo images to an external control device 10200 outside the body.

[0339] The external control device 10200 controls the operation of the in-vivo information acquisition system 10001 as a whole. In addition, the external control device 10200 receives information about in-vivo images sent from the capsule endoscope 10100, and generates image data for displaying in-vivo images on a display device (not shown) based on the received information about in-vivo images.

[0340] In the in-vivo information acquisition system 10001, in-vivo images obtained by imaging the state inside the body of a patient during the period from swallowing the capsule endoscope 10100 to its excretion in this manner can be obtained as needed.

[0341] The configuration and function of the capsule endoscope 10100 and the external control device 10200 will be described in more detail.

[0342] The capsule endoscope 10100 includes a capsule-shaped shell 10101 , and a light source unit 10111 , a camera unit 10112 , an image processing unit 10113 , a wireless communication unit 10114 , a power transmission unit 10115 , a power supply unit 10116 , and a control unit 10117 are all accommodated in the shell 10101 .

[0343] For example, the light source unit 10111 includes a light source such as a light emitting diode (LED), and the light source unit 10111 illuminates an imaging area of ​​the imaging unit 10112 with light.

[0344] The imaging unit 10112 includes an optical system including an imaging element and a plurality of lenses disposed in front of the imaging element. Reflected light (hereinafter referred to as observation light) of light irradiated on the body tissue to be observed is converged by the optical system and incident on the imaging element. In the imaging unit 10112, in the imaging element, the observation light incident thereon is photoelectrically converted, thereby generating an image signal corresponding to the observation light. The image signal generated by the imaging unit 10112 is provided to the image processing unit 10113.

[0345] The image processing unit 10113 includes a processor such as a central processing unit (CPU) and a graphics processing unit (GPU), and performs various types of signal processing on the image signal generated by the camera unit 10112. The image processing unit 10113 provides the image signal after the signal processing to the wireless communication unit 10114 as raw data.

[0346] The wireless communication unit 10114 performs predetermined processing (e.g., modulation processing) on ​​the image signal subjected to signal processing by the image processing unit 10113, and transmits the image signal to the external control device 10200 via the antenna 10114A. In addition, the wireless communication unit 10114 receives a control signal related to the drive control of the capsule endoscope 10100 from the external control device 10200 via the antenna 10114A. The wireless communication unit 10114 provides the control signal received from the external control device 10200 to the control unit 10117.

[0347] The power feeding unit 10115 includes an antenna coil for receiving power, a power regeneration circuit for regenerating power from current generated in the antenna coil, a booster circuit, etc. In the power transmitting unit 10115, power is generated using the so-called non-contact charging principle.

[0348] The power supply unit 10116 includes a secondary battery and stores the power generated by the power transmission unit 10115. Fig.45 In order to simplify the drawings, arrows and the like for indicating the power receiving side of the power supply unit 10116 are not shown. However, the power stored in the power supply unit 10116 is supplied to the light source unit 10111, the camera unit 10112, the image processing unit 10113, the wireless communication unit 10114, and the control unit 10117, and can be used to drive these units.

[0349] The control unit 10117 includes a processor such as a CPU, and appropriately controls driving of the light source unit 10111 , the imaging unit 10112 , the image processing unit 10113 , the wireless communication unit 10114 , and the power transmission unit 10115 according to a control signal transmitted from the external control device 10200 .

[0350] The external control device 10200 includes a processor such as a CPU and a GPU, or a microcomputer, or a control substrate on which a processor and a storage element (e.g., a memory) are mounted in a mixed manner, etc. The external control device 10200 controls the operation of the capsule endoscope 10100 by sending a control signal to the control unit 10117 of the capsule endoscope 10100 via the antenna 10200A. In the capsule endoscope 10100, for example, the illumination condition of the observation target in the light source unit 10111 can be changed according to the control signal from the external control device 10200. In addition, the imaging condition (e.g., the frame rate and the exposure value in the imaging unit 10112) can be changed according to the control signal from the external control device 10200. In addition, according to the control signal from the external control device 10200, the processing content in the image processing unit 10113 and the condition for the wireless communication unit 10114 to send the image signal (e.g., the transmission interval and the number of images to be sent, etc.) can be changed.

[0351] In addition, the external control device 10200 performs various types of image processing on the image signal sent from the capsule endoscope 10100, thereby generating image data for displaying the captured in-vivo image on the display device. For example, examples of image processing include various types of signal processing, such as development processing (demosaic processing), high image quality processing (e.g., band enhancement processing, super-resolution processing, noise reduction (NR) processing and / or camera shake correction processing), and / or scaling processing (electronic zoom processing). The external control device 10200 controls the driving of the display device, and causes the display device to display the captured in-vivo image based on the generated image data. Alternatively, the external control device 10200 may cause a recording device (not shown) to record the generated image data, or cause a printing device (not shown) to print out the generated image data.

[0352] An example of an in vivo information acquisition system to which the technology according to the present disclosure can be applied is described above. The technology according to the present disclosure can be applied to the camera unit 10112 in the above-mentioned structure. In particular, the camera package 1 or the camera module 700 can be applied as the camera unit 10112. By applying the technology according to the present disclosure to the camera unit 10112, the capsule endoscope 10100 can be made more compact, thereby further reducing the burden on the patient. In addition, while making the capsule endoscope 10100 compact, a clearer image of the surgical site can be obtained, thereby improving the accuracy of the inspection.

[0353] <18. Application examples of endoscopic surgery systems>

[0354] For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

[0355] Fig.46 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to the present disclosure can be applied.

[0356] Fig.46 The figure shows a state where an operator (surgeon) 11113 performs surgery on a patient 11132 on a bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 includes an endoscope 11100, other surgical instruments 11110 such as a pneumoperitoneum tube 11111 and an energy treatment tool 11112, a support arm device 11120 for supporting the endoscope 11100, and a cart 11200 on which various devices for endoscopic surgery are installed.

[0357] The endoscope 11100 includes: a barrel 11101, a region having a predetermined length from the distal end of the barrel 11101 is inserted into a body cavity of a patient 11132; and a camera 11102 connected to the proximal end of the barrel 11101. In the example shown, the endoscope 11100 constructed as a so-called rigid scope having a rigid barrel 11101 is shown, but the endoscope 11100 may also be constructed as a so-called flexible scope having a flexible barrel.

[0358] An opening in which an objective lens is installed is provided at the distal end of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the distal end of the lens barrel through a light guide extending in the lens barrel 11101, and the light is irradiated onto an observation object in the body cavity of the patient 11132 via the objective lens. Note that the endoscope 11100 may be a forward-viewing endoscope, an oblique-viewing endoscope, or a side-viewing endoscope.

[0359] An optical system and an imaging element are provided in the camera head 11102, and reflected light (observation light) from an observation target is converged onto the imaging element through the optical system. The observation light is photoelectrically converted by the imaging element, and an electrical signal corresponding to the observation light, that is, an image signal corresponding to the observation image, is generated. The image signal is sent to the camera control unit (CCU) 11201 as raw data.

[0360] The CCU 11201 is formed using a central processing unit (CPU), a graphics processing unit (GPU), and the like, and the CCU 11201 integrally controls the operations of the endoscope 11100 and the display device 11202. In addition, the CCU 11201 receives an image signal from the camera 11102, and performs various image processing such as development processing (demosaic processing) on ​​the image signal for displaying an image based on the image signal.

[0361] Under the control of the CCU 11201, the display device 11202 displays an image based on the image signal (image-processed by the CCU 11201).

[0362] The light source device 11203 includes a light source such as a light emitting diode (LED), for example, and supplies irradiation light to the endoscope 11100 for imaging a surgical site or the like.

[0363] The input device 11204 is an input interface of the endoscopic surgery system 11000. The user can input various information and instructions to the endoscopic surgery system 11000 through the input device 11204. For example, the user inputs instructions for changing the imaging conditions of the endoscope 11100 (type of irradiation light, magnification, focal length, etc.).

[0364] The treatment tool control device 11205 controls the driving of the energy treatment tool 11112 for tissue cauterization, cutting, and blood vessel sealing. The pneumoperitoneum device 11206 injects gas into the body cavity through the pneumoperitoneum tube 11111, thereby expanding the body cavity of the patient 11132, so as to ensure the field of view through the endoscope 11100 and the operator's working space. The recorder 11207 is a device capable of recording various information related to the operation. The printer 11208 is a device capable of printing various information related to the operation in various forms such as text, images, or charts.

[0365] Note that, for example, the light source device 11203 that provides irradiation light to the endoscope 11100 for imaging the surgical site may include an LED, a laser light source, or a white light source obtained by combining an LED and a laser light source. Since the output intensity and output timing of each color (each wavelength) can be controlled with high precision when the white light source is composed of a combination of RGB laser light sources, the light source device 11203 can adjust the white balance of the captured image. In addition, in this case, by irradiating the observation object with each laser from the RGB laser light source in a time division manner and controlling the drive of the imaging element of the camera 11102 in synchronization with the irradiation timing, images corresponding to RGB can be captured in a time division manner. According to this method, a color image can also be obtained without a color filter being provided in the imaging element.

[0366] In addition, the drive of the light source device 11203 can be controlled so as to change the light intensity to be output every predetermined time. By controlling the drive of the imaging element of the camera 11102 in synchronization with the time when the light intensity changes and acquiring images in a time division manner, and combining these images, a high dynamic range image without so-called black defect and halo can be generated.

[0367] In addition, the light source device 11203 can be configured to provide light of a predetermined wavelength band corresponding to special light observation. In special light observation, for example, by irradiating light of a narrower band than the irradiation light (in other words, white light) in ordinary observation, so-called narrow-band imaging is performed, wherein predetermined tissues such as blood vessels in the surface layer of the mucosa are imaged with high contrast, using the wavelength dependence of light absorption in human tissue. Alternatively, in special light observation, fluorescence observation can be performed to obtain an image by irradiating fluorescence generated by excitation light. In fluorescence observation, for example, human tissue can be irradiated with excitation light to observe fluorescence from the human tissue (autofluorescence observation), or reagents such as indocyanine green (ICG) can be locally injected into human tissue, and the human tissue is irradiated with excitation light corresponding to the fluorescence wavelength of the reagent to obtain a fluorescent image. The light source device 11203 can be configured to provide narrow-band light and / or excitation light corresponding to such special light observation.

[0368] Fig.47 It is shown Fig.46 A block diagram of an example of the functional configuration of the camera 11102 and the CCU 11201 shown.

[0369] The camera 11102 includes a lens unit 11401, an imaging unit 11402, a driving unit 11403, a communication unit 11404, and a camera control unit 11405. The CCU 11201 includes a communication unit 11411, an image processor 11412, and a control unit 11413. The camera 11102 and the CCU 11201 are communicably connected to each other via a transmission cable 11400.

[0370] The lens unit 11401 is an optical system provided at a connection with the lens barrel 11101. Observation light acquired through the distal end of the lens barrel 11101 is guided to the camera 11102 and is incident on the lens unit 11401. The lens unit 11401 is configured by combining a plurality of lenses including a zoom lens and a focus lens.

[0371] The imaging unit 11402 includes an imaging element. The imaging element forming the imaging unit 11402 may be one (so-called single-board type) or multiple (so-called multi-board type). For example, in the case where the imaging unit 11402 is a multi-board type, image signals corresponding to R, G, and B, respectively, may be generated by the respective imaging elements, and a color image may be obtained by combining these image signals. Alternatively, the imaging unit 11402 may include a pair of imaging elements for respectively acquiring a right-eye image signal and a left-eye image signal corresponding to a three-dimensional (3D) display. With the 3D display, the operator 11131 can more accurately grasp the depth of living tissue in the surgical site. Note that in the case where the imaging unit 11402 is a multi-board type, a system of multiple lens units 11401 may be provided corresponding to the respective imaging elements.

[0372] In addition, the camera unit 11402 does not have to be arranged on the camera head 11102. For example, the camera unit 11402 can be arranged in the lens barrel 11101 and immediately behind the objective lens.

[0373] The driving unit 11403 includes an actuator, and moves the zoom lens and the focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera control unit 11405. Therefore, the magnification and focus of the image captured by the camera unit 11402 can be appropriately adjusted.

[0374] The communication unit 11404 includes a communication device for transmitting and receiving various information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 to the CCU 11201 through the transmission cable 11400 as raw data.

[0375] In addition, the communication unit 11404 receives a control signal for controlling the driving of the camera 11102 from the CCU 11201, and provides the control signal to the camera control unit 11405. For example, the control signal includes information related to imaging conditions, such as information specifying a frame rate of a captured image, information specifying an exposure value during imaging, and / or information specifying a magnification and a focus of a captured image.

[0376] Note that imaging conditions such as the above-mentioned frame rate, exposure value, magnification, and focus may be appropriately specified by the user, or may be automatically set based on the acquired image signal by the control unit 11413 of the CCU 11201. In the latter case, the endoscope 11100 is equipped with a so-called automatic exposure (AE: auto exposure) function, an automatic focus (AF: autofocus) function, and an automatic white balance (AWB: auto white balance) function.

[0377] The camera control unit 11405 controls the driving of the camera 11102 based on the control signal from the CCU 11201 received through the communication unit 11404 .

[0378] The communication unit 11411 includes a communication device for transmitting and receiving various information to and from the camera 11102. The communication unit 11411 receives an image signal transmitted from the camera 11102 through the transmission cable 11400.

[0379] In addition, the communication unit 11411 transmits a control signal for controlling the driving of the camera 11102 to the camera 11102. The above-mentioned image signal and the above-mentioned control signal can be transmitted through electrical communication, optical communication, and the like.

[0380] The image processor 11412 performs various image processing on the image signal sent from the camera 11102 as raw data.

[0381] The control unit 11413 performs various controls related to imaging the surgical site, etc. through the endoscope 11100 and displaying the captured image obtained by imaging the surgical site, etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera head 11102 .

[0382] In addition, based on the image signal that has been image-processed by the image processor 11412, the control unit 11413 enables the display device 11202 to display the captured image of the surgical site, etc. At this time, the control unit 11413 can use various image recognition technologies to recognize various objects in the captured image. For example, the control unit 11413 can detect the shape and color of the edge of the object included in the captured image, thereby recognizing surgical tools such as forceps, specific living parts, bleeding, mist when using the energy treatment tool 11112, etc. When enabling the display device 11202 to display the captured image, the control unit 11413 can use the recognition result to superimpose and display various surgical auxiliary information on the image of the surgical site. The surgical auxiliary information is superimposed and displayed, and presented to the operator 11131, so that the burden of the operator 11131 can be reduced, and the operator 11131 can reliably perform surgery.

[0383] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 together is an electrical signal cable corresponding to electrical signal communication, an optical fiber compatible with optical communication, or a composite cable thereof.

[0384] Here, in the example shown, communication is performed in a wired manner using the transmission cable 11400, but communication between the camera 11102 and the CCU 11201 may also be performed in a wireless manner.

[0385] An example of an endoscopic surgical system to which the technology according to the present disclosure can be applied is described above. In the above configuration, the technology according to the present disclosure can be applied to the imaging unit 11402 of the camera head 11102. Specifically, the camera package 1 or the camera module 700 can be used as the imaging unit 11402. By applying the technology according to the present disclosure to the imaging unit 11402, a clearer surgical site image can be obtained while making the camera head 11102 compact.

[0386] Note that, although the description is given here using an endoscopic surgery system as an example, in addition to this, for example, the technology according to the present disclosure can also be applied to a microsurgery system or the like.

[0387] <19. Application examples of mobile objects>

[0388] In addition, for example, the technology according to the present disclosure can also be implemented as a device installed on any type of mobile body, such as: automobiles, electric vehicles, hybrid vehicles, motorcycles, bicycles, personal mobile devices, airplanes, drones, ships, and robots, etc.

[0389] Fig.48: is a block diagram showing a schematic configuration example of a vehicle control system as an example of a moving body control system to which the technology according to the present disclosure can be applied.

[0390] The vehicle control system 12000 is provided with a plurality of electronic control units connected to each other via a communication network 12001. Fig.48 In the example shown, the vehicle control system 12000 is provided with a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. In addition, as a functional configuration of the integrated control unit 12050, a microcomputer 12051, a sound and image output unit 12052, and an in-vehicle network interface (I / F) 12053 are shown.

[0391] The drive system control unit 12010 controls the operation of the devices related to the drive system of the vehicle according to various programs. For example, the drive system control unit 12010 serves as a control device for the following devices: a drive force generating device such as an internal combustion engine and a drive motor for generating the drive force of the vehicle; a drive force transmitting mechanism for transmitting the drive force to the wheels; a steering mechanism for adjusting the steering angle of the vehicle; and a braking device for generating the braking force of the vehicle.

[0392] The body system control unit 12020 controls the operation of various devices installed on the vehicle body according to various programs. For example, the body system control unit 12020 serves as a control device for each of the following devices: a keyless entry system; a smart key system; a power window device; or various lights such as a headlight, a taillight, a brake light, a signal light, or a fog light. In this case, a radio wave transmitted from a portable device that replaces a key or a signal of various switches may be input to the body system control unit 12020. The body system control unit 12020 receives input of these radio waves or signals, and controls the door lock device, the power window device, and lights, etc. of the vehicle.

[0393] The vehicle exterior information detection unit 12030 detects information outside the vehicle in which the vehicle control system 12000 is installed. For example, the camera unit 12031 is connected to the vehicle exterior information detection unit 12030. The vehicle exterior information detection unit 12030 enables the camera unit 12031 to capture an image of the vehicle exterior and receive the captured image. Based on the received image, the vehicle exterior information detection unit 12030 can perform detection processing or distance detection processing on objects such as pedestrians, vehicles, obstacles, signs, or letters on the road surface.

[0394] The imaging unit 12031 is an optical sensor for receiving light and outputting an electrical signal corresponding to the amount of light received. The imaging unit 12031 may output the electrical signal as an image, or may output the electrical signal as ranging information. In addition, the light received by the imaging unit 12031 may be visible light or non-visible light such as infrared rays.

[0395] The in-vehicle information detection unit 12040 detects information in the vehicle. For example, the in-vehicle information detection unit 12040 is connected to a driver state detection unit 12041 for detecting a driver state. For example, the driver state detection unit 12041 includes a camera for photographing the driver, and the in-vehicle information detection unit 12040 can calculate the driver's fatigue level or concentration level based on the detection information input from the driver state detection unit 12041, or can determine whether the driver is dozing off.

[0396] Based on the information outside and inside the vehicle acquired by the outside information detection unit 12030 or the inside information detection unit 12040, the microcomputer 12051 can calculate the control target value of the driving force generating device, the steering mechanism, or the braking device, and can output a control command to the driving system control unit 12010. For example, the microcomputer 12051 can perform cooperative control for realizing the functions of the advanced driver assistance system (ADAS), which includes: collision avoidance or impact buffering of the vehicle, following driving based on the distance between vehicles, speed maintenance driving, vehicle collision warning, or lane departure warning of the vehicle.

[0397] In addition, the microcomputer 12051 can control the driving force generating device, steering mechanism, or braking device, etc. based on the information around the vehicle obtained by the external information detection unit 12030 or the internal information detection unit 12040, thereby performing collaborative control for achieving autonomous driving that does not rely on the driver's operation.

[0398] In addition, based on the information outside the vehicle acquired by the vehicle exterior information detection unit 12030, the microcomputer 12051 may output a control command to the body system control unit 12020. For example, the microcomputer 12051 may perform cooperative control for implementing glare protection, such as controlling the headlights according to the position of the preceding vehicle or the oncoming vehicle detected by the vehicle exterior information detection unit 12030, and switching the high beam to the low beam.

[0399] The sound and image output unit 12052 sends at least one of a sound output signal or an image output signal to an output device, which can visually or auditorily notify passengers on the vehicle or the outside of the vehicle of information. Fig.48 In the example of , as output devices, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are shown. For example, the display unit 12062 may include at least one of an on-board display or a head-up display.

[0400] Fig.49 12031 is a diagram showing an example of the installation position of the imaging unit 12031.

[0401] exist Fig.49 In the figure, as the camera unit 12031, the vehicle 12100 includes camera units 12101, 12102, 12103, 12104 and 12105.

[0402] For example, the camera units 12101, 12102, 12103, 12104, and 12105 are disposed at locations such as the front nose, rearview mirror, rear bumper, rear door, and upper portion of the front windshield in the vehicle 12100. The camera unit 12101 disposed at the front nose and the camera unit 12105 disposed at the upper portion of the front windshield in the vehicle mainly acquire the front image of the vehicle 12100. The camera units 12102 and 12103 disposed at the rearview mirror mainly acquire images of both sides of the vehicle 12100. The camera unit 12104 disposed at the rear bumper or rear door mainly acquires the rear image of the vehicle 12100. The front images acquired by the camera units 12101 and 12105 are mainly used to detect the preceding vehicle, pedestrians, obstacles, traffic lights, traffic signs, or lanes, etc.

[0403] Note that Fig.49 , an example of the imaging ranges of the imaging units 12101 to 12104 is shown. The imaging range 12111 indicates the imaging range of the imaging unit 12101 provided at the front nose, the imaging ranges 12112 and 12113 respectively indicate the imaging ranges of the imaging units 12102 and 12103 provided at the rearview mirror, and the imaging range 12114 indicates the imaging range of the imaging unit 12104 provided at the rear bumper or the rear door. For example, by superimposing the image data acquired by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 seen from above is obtained.

[0404] At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera including a plurality of imaging elements, or may be an imaging element including pixels for phase difference detection.

[0405] For example, the microcomputer 12051 can obtain the distance to each solid within the imaging range 12111 to 12114 and the change of the distance over time (relative speed relative to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104, thereby extracting the following solid as the leading vehicle: In particular, the solid is closest to the vehicle 12100 on the driving road and is traveling at a predetermined speed (for example, greater than or equal to 0 km / h) in almost the same direction as the vehicle 12100. In addition, the microcomputer 12051 can pre-set the inter-vehicle distance to be maintained with the leading vehicle, and can perform automatic braking control (including follow-up stop control) and automatic acceleration control (including follow-up start control) and the like. In this way, cooperative control for realizing automatic driving and the like that travels autonomously without relying on the driver's operation can be performed.

[0406] For example, based on the distance information obtained from the camera units 12101 to 12104, the microcomputer 12051 can extract solid data related to the solid in a manner that classifies the solid into motorcycles, standard vehicles, large vehicles, pedestrians, and other solids such as electric poles, and use it to automatically avoid obstacles. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that can be seen by the driver of the vehicle 12100 and obstacles that are difficult to see. Then, the microcomputer 12051 determines a collision risk that indicates the degree of danger of colliding with each obstacle, and when the collision risk is greater than or equal to a set value and there is a possibility of collision, the microcomputer 12051 can output a warning to the driver through the audio speaker 12061 and the display unit 12062, or perform forced deceleration or evasive steering through the drive system control unit 12010, thereby performing driving assistance for avoiding collision.

[0407] At least one of the camera units 12101 to 12104 may be an infrared camera for detecting infrared rays. For example, the microcomputer 12051 may identify a pedestrian by determining whether there is a pedestrian in the image captured by the camera units 12101 to 12104. For example, such pedestrian recognition is performed by the following process: extracting feature points in the image captured by the camera units 12101 to 12104 as infrared cameras; and performing pattern matching processing on a series of feature points representing the outline of an object and discerning whether the object is a pedestrian. When the microcomputer 12051 determines that there is a pedestrian in the image captured by the camera units 12101 to 12104 and identifies the pedestrian, the sound image output unit 12052 controls the display unit 12062 to superimpose and display a rectangular outline for emphasizing the identified pedestrian. In addition, the sound image output unit 12052 may control the display unit 12062 to display an icon or the like for representing a pedestrian at a desired position.

[0408] An example of a vehicle control system to which the technology according to the present disclosure can be applied is described above. The technology according to the present disclosure can be applied to the camera unit 12031 in the above-mentioned structure. Specifically, the camera package 1 or the camera module 700 can be used as the camera unit 12031. By applying the technology according to the present disclosure to the camera unit 12031, a captured image that is easier to view and distance information can be obtained while reducing the size. In addition, by using the captured image and distance information obtained, the driver's fatigue can be reduced and the safety of the driver and the vehicle can be improved.

[0409] Furthermore, the present disclosure is applicable not only to molding of a lens (lens resin portion) included in a camera package but also to general imprinting of a molding resin using a mold.

[0410] The embodiments of the present disclosure are not limited to the above-described embodiments, and various changes may be made without departing from the gist of the present disclosure.

[0411] For example, a combination of all or part of the above-described embodiments may be adopted.

[0412] Note that the effects described in this specification are merely exemplary and not limiting; effects other than those described in this specification may also be included.

[0413] Note that the present disclosure may also have the following configurations.

[0414] (1) A method for manufacturing a camera package, comprising:

[0415] forming a high contact cornea around a lens forming region on the upper side of a transparent substrate protecting a solid-state imaging element;

[0416] dropping a lens material into the lens forming region on the upper side of the transparent substrate; and

[0417] The dropped lens material is molded by a mold to form a lens.

[0418] (2) The method for manufacturing a camera package according to (1) above,

[0419] The high contact angle film is a film having a contact angle greater than a contact angle of the transparent substrate.

[0420] (3) The method for manufacturing a camera package according to (1) or (2) above, comprising:

[0421] forming an adhesion promoter on an upper surface of the transparent substrate; and

[0422] The high contact cornea is formed around the lens forming area on the adhesion promoter.

[0423] (4) The method for manufacturing a camera package according to (3) above,

[0424] The high contact angle film is a film having a contact angle greater than the contact angle of the adhesion promoter.

[0425] (5) The method for manufacturing a camera package according to any one of (1) to (4) above, further comprising:

[0426] An anti-reflection film is formed on the upper surface of the formed lens and the upper surface of the high contact cornea around the lens.

[0427] (6) A camera package comprising:

[0428] Solid-state imaging element;

[0429] a lens formed on an upper side of a transparent substrate protecting the solid-state imaging element; and

[0430] A high contact cornea is formed around the lens on the upper side of the transparent substrate.

[0431] (7) The camera package according to (6) above,

[0432] The high contact angle film is a film having a contact angle greater than a contact angle of the transparent substrate.

[0433] (8) The camera package according to (6) or (7),

[0434] Wherein, the high contact cornea is formed on the transparent substrate.

[0435] (9) The camera package according to (6) or (7) above, further comprising:

[0436] The adhesion promoter on the transparent substrate,

[0437] Wherein, the high contact cornea and the lens are formed on the adhesion promoter.

[0438] (10) The camera package according to (6) or (7) above, further comprising:

[0439] The IR cut-off filter on the transparent substrate,

[0440] Wherein, the high contact cornea and the lens are formed on the IR cutoff filter.

[0441] (11) The camera package according to any one of (6) to (10) above, further comprising:

[0442] An anti-reflection film is located on the upper surface of the high contact cornea and the upper surface of the lens.

[0443] (12) An electronic device comprising:

[0444] A camera package, the camera package comprising:

[0445] Solid-state imaging element,

[0446] a lens formed on the upper side of a transparent substrate protecting the solid-state imaging element, and

[0447] a high contact cornea formed around the lens on the upper side of the transparent substrate; and

[0448] A lens module includes one or more substrates with lenses arranged above the camera package.

[0449] Furthermore, the present disclosure may also have the following configurations.

[0450] (B1) A mold comprising:

[0451] abutting portion, which abuts against the substrate when the resin material on the substrate is molded into a predetermined shape,

[0452] Here, when the abutting portion is in abutment with the substrate, a space is formed for allowing the resin material to flow in / out from the outside.

[0453] (B2) The mold according to (B1) above, comprising:

[0454] Three or more columnar bodies serve as the contact portion.

[0455] (B3) The mold according to (B1) or (B2) above,

[0456] Wherein, in a plan view, the abutment portion is arranged on the inner side of the outer peripheral portion.

[0457] (B4) The mold according to any one of (B1) to (B3) above,

[0458] Wherein, the columnar body has a cylindrical shape or a polygonal column shape.

[0459] (B5) The mold according to any one of (B1) to (B3) above,

[0460] Wherein, the columnar body has a conical shape or a polygonal pyramid shape.

[0461] (B6) The mold according to any one of (B1) to (B5) above,

[0462] The top end of the contact portion that contacts the substrate is substantially spherical in shape.

[0463] (B7) The mold according to any one of (B1) to (B5) above,

[0464] The top end of the contact portion in contact with the substrate has a shape of a polygonal pyramid or a cone.

[0465] (B8) The mold according to any one of (B1) to (B4) above,

[0466] Wherein, the abutting portion is configured to contact the substrate surface.

[0467] (B9) The mold according to any one of (B1) to (B7) above,

[0468] Wherein, the abutting portion is configured to be in point contact with the substrate.

[0469] (B10) The mold according to any one of (B1) to (B9) above,

[0470] Here, a light shielding film is formed in a partial region.

[0471] (B11) A method for manufacturing a semiconductor device, comprising:

[0472] a step of pressing a mold against a resin material on a substrate and transferring a shape of the mold to the resin material, thereby forming a lens resin portion;

[0473] The mold includes a contact portion, and when the resin material on the substrate is molded into a predetermined shape, the contact portion contacts the substrate, and

[0474] In a state where the contact portion contacts the substrate, a space is formed for allowing the resin material to flow in and out from the outside.

[0475] (B12) The method for manufacturing a semiconductor device according to (B11) above, comprising:

[0476] The substrate on which the lens resin portion is formed is bonded to a semiconductor substrate on which pixels are formed, the pixels converting incident light into electrical signals.

[0477] (B13) The method for manufacturing a semiconductor device according to (B11) above, comprising:

[0478] A resin material is dropped onto the substrate, which is bonded to a semiconductor substrate on which pixels are formed, and the pixels convert incident light into electrical signals; and the mold is pressed to transfer the shape of the mold to the resin material, thereby forming the lens resin portion.

[0479] Reference numerals list

[0480] 1 Camera package

[0481] 11. First structure (upper structure)

[0482] 12 Second structure (lower structure)

[0483] 13 Solid-state imaging element

[0484] 14 external terminals

[0485] 18 Protective substrate

[0486] 19 Lens resin part

[0487] 20 High Contact Cornea

[0488] 501 Lens Material

[0489] 503 Mould

[0490] 571 Adhesion Promoter

[0491] 572 Anti-reflective film

[0492] 602 Lens Material

[0493] 603 Mould

[0494] 611 Contact Department

[0495] 612 shading film

[0496] 661 Contact part

[0497] 662 shading film

[0498] 671 Guidance Department

[0499] 700 Camera Module

[0500] 701 Substrate with lens

[0501] 702 stacked lens structure

[0502] 703 Optical Unit

[0503] 722 Lens resin part

[0504] 723 Through hole

[0505] 921 mold substrate

[0506] 922 Mould

[0507] 941 mold substrate

[0508] 942 Mould

[0509] 2000 Camera Device

[0510] 2001 Image Sensor

[0511] 2002 Camera Module

Claims

1. A method for manufacturing a camera package; include: forming a high contact angle film around a lens forming region at an upper side of a transparent substrate for protecting a solid-state imaging element; dropping a lens material in the lens forming region at the upper side of the transparent substrate; as well as The lens material dripped in is molded through a mold to form a lens, wherein an adhesion promoter is formed on the transparent substrate, the adhesion promoter can improve the adhesion between the lens and the transparent substrate, and the lens and the high contact cornea are formed on the adhesion promoter, and the lower surface of the lens and the lower surface of the high contact cornea are on the same plane, The mold includes an abutment portion, and when the abutment portion abuts against the transparent substrate, a space is formed between the mold and the transparent substrate to allow the lens material to flow from the outside into the lens forming area when the lens material hardens and shrinks.

2. The method for manufacturing a camera package according to claim 1, in, The high contact angle film is a film having a contact angle greater than a contact angle of the transparent substrate.

3. The method for manufacturing a camera package according to claim 1, in, The high contact angle film is a film having a contact angle greater than the contact angle of the adhesion promoter.

4. The method for manufacturing a camera package according to any one of claims 1 to 3, further comprising: include: An anti-reflection film is formed on the upper surface of the formed lens and the upper surface of the high contact cornea around the lens.

5. Camera package, include: Solid-state imaging element; a lens formed at an upper side of a transparent substrate for protecting the solid-state imaging element; and a high contact cornea formed around the lens at the upper side of the transparent substrate, wherein an adhesion promoter is formed on the transparent substrate, the adhesion promoter can improve the adhesion between the lens and the transparent substrate, and the lens and the high contact cornea are formed on the adhesion promoter, and the lower surface of the lens and the lower surface of the high contact cornea are on the same plane, The camera package is manufactured by the method for manufacturing a camera package according to any one of claims 1 to 4.

6. The camera package according to claim 5, in, The high contact angle film is a film having a contact angle greater than a contact angle of the transparent substrate.

7. The camera package according to claim 5, in, The high contact corner film is formed on the transparent substrate.

8. The camera package according to claim 5, in, The high contact angle film is a film having a contact angle greater than the contact angle of the adhesion promoter.

9. The camera package according to claim 5, further comprising: include: The infrared cut-off filter on the transparent substrate, Wherein, the high contact cornea and the lens are formed on a stacked structure of the infrared cutoff filter and the adhesion promoter.

10. The camera package according to any one of claims 5 to 9, further comprising: include: An anti-reflection film is located on the upper surface of the high contact cornea and the upper surface of the lens.

11. Electronic equipment, include: A camera package according to any one of claims 5 to 10.

Images