Side key fingerprint module, terminal and manufacturing method of side key fingerprint module

Abstract

A side key fingerprint module includes a fingerprint chip, the fingerprint chip includes a chamfer and a blanking groove for improving the hand feel, the chamfer and the blanking groove are arranged opposite to each other, the chamfer is located at the edge of one side surface of the fingerprint chip, and the blanking groove is located at the edge of the other side surface of the fingerprint chip. The side key fingerprint module of the present invention can ensure that the size of the chamfer of the fingerprint chip remains unchanged and meets the production requirements; during production, the size of the chamfer is stable and the defect rate is low. The present invention also relates to a terminal and a method for manufacturing the side key fingerprint module.

Description

Technical Field

[0001] The present invention relates to the field of terminal technology, and in particular to a side key fingerprint module, a terminal, and a method for manufacturing the side key fingerprint module. Background Art

[0002] At present, the demand for full screens in the mobile phone and tablet industries has become the mainstream, and the side key fingerprint can be made into a whole by combining the power button and the fingerprint, which does not take up extra space in the whole machine, and is increasingly favored by users and solution providers. The traditional side key fingerprint has a cutting feeling because the edge of the fingerprint chip is a 90-degree right angle. In order to improve this cutting feeling, the edge of the fingerprint chip needs to be chamfered, but the existing production method has the problem of large and small chamfers (that is, one side has a chamfer and the other side has no chamfer), which cannot meet the customer's requirement of "obvious corners on both sides", resulting in the current defective rate of about 8%-20%, which is relatively high and has great resistance to mass production. Summary of the invention

[0003] In view of this, the present invention provides a side key fingerprint module, a terminal and a method for manufacturing a side key fingerprint module, which can ensure that the size of the chamfer of the fingerprint chip remains unchanged and meets the production requirements; during production, the size of the chamfer is stable and the defective rate is low.

[0004] The present invention provides a side key fingerprint module, comprising a fingerprint chip, wherein the fingerprint chip comprises a chamfer and a blanking groove for improving the hand feel, the chamfer and the blanking groove are arranged opposite to each other, the chamfer is located at the edge of one side surface of the fingerprint chip, and the blanking groove is located at the edge of the other side surface of the fingerprint chip.

[0005] Furthermore, the fingerprint chip is formed with a side wall, and the chamfer connects the edge of one side surface of the fingerprint chip with the side wall in an inclined transition, and along the thickness direction of the fingerprint chip, the blanking groove and the chamfer are arranged at intervals.

[0006] Furthermore, the blanking groove is formed by the edge of the other side surface of the fingerprint chip being recessed toward one side surface and penetrating through the side wall.

[0007] Furthermore, the chamfer is in a continuous ring shape along a circle of the fingerprint chip and / or the blanking groove is in a continuous ring shape along a circle of the fingerprint chip.

[0008] Furthermore, the fingerprint chip includes a protective layer, which is arranged on a side of the fingerprint chip away from the blanking groove, and the protective layer covers the chamfer.

[0009] Furthermore, the side key fingerprint module also includes a first circuit substrate, a reinforcement plate, a button assembly and a second circuit substrate, the fingerprint chip is arranged on the first circuit substrate, the first circuit substrate is arranged on the reinforcement plate, and the button assembly is arranged between the reinforcement plate and the second circuit substrate.

[0010] Furthermore, the key assembly includes a touch element and a key body, one side of the touch element contacts the reinforcing plate, the other side of the touch element abuts against the key body, and the key body is arranged on the second circuit substrate and electrically connected to the second circuit substrate.

[0011] The present invention also provides a terminal, comprising the above-mentioned side key fingerprint module and a housing, wherein the side key fingerprint module is arranged in the housing.

[0012] The present invention also provides a method for manufacturing a side key fingerprint module, including the above-mentioned side key fingerprint module, and the steps of the method for manufacturing the side key fingerprint module include:

[0013] Step S1, providing a plate for making fingerprint chips, cutting one side surface of the plate for the fingerprint chips to form a plurality of fingerprint chips, and connecting the partial positions of the plurality of fingerprint chips in one piece;

[0014] Step S2: cutting the other side surface of the plate of the fingerprint chip to form the blanking groove, and separating the multiple fingerprint chips.

[0015] Furthermore, between step S1 and step S2, a protective layer is formed on one side of the fingerprint chip, and the protective layer covers the chamfer.

[0016] The fingerprint chip of the side key fingerprint module of the present invention includes a chamfer and a blanking groove for improving the hand feel. The chamfer and the blanking groove are arranged opposite to each other. The chamfer is located at the edge of one side surface of the fingerprint chip, and the blanking groove is located at the edge of the other side surface of the fingerprint chip. The blanking groove is used to separate the fingerprint chip from the raw material. The size of the chamfer is not damaged, which can ensure that the size of the chamfer of the fingerprint chip remains unchanged and meets the production requirements. During production, the size of the chamfer is stable, thereby reducing the defective rate and facilitating mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. 1 is a schematic diagram of the structure of a terminal according to the first embodiment of the present invention.

[0018] Figure 2 FIG. 4 is a schematic diagram of the structure of the terminal according to the first embodiment of the present invention from another viewing angle.

[0019] Figure 3 FIG. 1 is a schematic diagram of the structure of a fingerprint chip according to the first embodiment of the present invention.

[0020] Figure 4 This is a schematic diagram of the structure of an enlarged edge of a fingerprint chip according to the first embodiment of the present invention.

[0021] Figure 5FIG. 1 is a schematic structural diagram of a reinforcing plate according to a first embodiment of the present invention.

[0022] Figure 6 FIG. 4 is a schematic structural diagram of a reinforcing plate according to a second embodiment of the present invention.

[0023] Figure 7 FIG. 4 is a schematic structural diagram of a reinforcing plate according to a third embodiment of the present invention.

[0024] Figure 8 FIG. 4 is a flow chart of a method for manufacturing a side key fingerprint module according to a fourth embodiment of the present invention.

[0025] Fig. 9 The figure is a processing diagram of the manufacturing method of the side key fingerprint module of the present invention when making chamfers.

[0026] Fig.10 The figure is a processing diagram of the manufacturing method of the side key fingerprint module of the present invention when making the blanking groove.

[0027] Fig.11 It is a schematic diagram of the structure of the fingerprint chip and the plate being separated according to the present invention. DETAILED DESCRIPTION

[0028] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0029] Figure 1 FIG. 1 is a schematic diagram of the structure of a terminal according to the first embodiment of the present invention. Figure 1 As shown, the terminal 10 includes a side key fingerprint module 12 and a housing 13 . The side key fingerprint module 12 is disposed in the housing 13 , and a portion of the side key fingerprint module 12 is exposed from the housing 13 .

[0030] Figure 2 FIG. 2 is a schematic diagram of the structure of the terminal from another perspective of the first embodiment of the present invention. Figure 1 and Figure 2As shown, specifically, the side key fingerprint module 12 includes a fingerprint chip 121, a first circuit substrate 122, a reinforcing plate 123a, a key assembly 124 and a second circuit substrate 125 in sequence. The fingerprint chip 121 is arranged on the first circuit substrate 122, the first circuit substrate 122 is arranged on the reinforcing plate 123a, and the key assembly 124 is arranged between the reinforcing plate 123a and the second circuit substrate 125. The housing 13 includes a bearing boss 131, which is used to bear the second circuit substrate 125, and the second circuit substrate 125 is arranged on the bearing boss 131. The fingerprint chip 121 and the reinforcing plate 123a can be movably arranged in the housing 13, and a part of the fingerprint chip 121 is exposed from the housing 13. The fingerprint chip 121 is used to collect fingerprint information, and the key assembly 124 is used to realize the key function.

[0031] The button assembly 124 includes a touch element 1241 and a button body 1242. One side of the touch element 1241 contacts the reinforcing plate 123a, and the other side of the touch element 1241 rests on the button body 1242. The touch element 1241 can be specifically a plate, but is not limited to this. The button body 1242 is set on the second circuit substrate 125 and is electrically connected to the second circuit substrate 125.

[0032] Figure 3 FIG. 1 is a schematic diagram of the structure of a fingerprint chip according to the first embodiment of the present invention. Figure 4 This is a schematic diagram of the structure of an enlarged edge of a fingerprint chip according to the first embodiment of the present invention. Figure 3 and Figure 4As shown, the fingerprint chip 121 includes a chamfer 1211 for improving the hand feel, a blanking groove 1212 and a protective layer (not shown). The chamfer 1211 and the blanking groove 1212 are arranged opposite to each other. The chamfer 1211 is located at the edge of one side surface of the fingerprint chip 121, and the blanking groove 1212 is located at the edge of the other side surface of the fingerprint chip 121. Specifically, the chamfer 1211 is in a continuous ring shape along the fingerprint chip 121 and / or the blanking groove 1212 is in a continuous ring shape along the fingerprint chip 121. The blanking groove 1212 is used to separate the fingerprint chip 121 from the raw material when the fingerprint chip 121 is produced. The fingerprint chip 121 is formed with a side wall. The chamfer 1211 connects the edge of one side surface of the fingerprint chip 121 with the side wall in an inclined transition. Along the thickness direction of the fingerprint chip 121, the blanking groove 1212 is arranged at intervals from the chamfer 1211. The blanking groove 1212 is formed by the edge of the other side surface of the fingerprint chip 121 being recessed toward one side surface and penetrating the side wall. The protective layer is disposed on the side of the fingerprint chip 121 away from the blanking groove 1212, and the protective layer covers the chamfer 1211. The protective layer and the chamfer 1211 are both located outside the housing 13. Specifically, the protective layer can be a paint layer, but is not limited thereto. In this embodiment, preferably, the inclination angle of the chamfer 1211 is 45°, but is not limited thereto, and the inclination angle of the chamfer 1211 can be freely selected according to actual conditions.

[0033] Figure 5 FIG. 1 is a schematic diagram of the structure of the reinforcing plate of the first embodiment of the present invention. Figure 1 , Figure 2 , Figure 5 As shown, the reinforcing plate 123a includes a plate body 1231 and a limiting portion 1232a, the plate body 1231 is in a flat and long strip shape, the limiting portion 1232a is connected to the plate body 1231, and is located on both sides of the plate body 1231. Specifically, the plate body 1231 includes a first surface 101, a second surface 102, a side wall 103, and a receiving groove 104, the first surface 101 and the second surface 102 are arranged opposite to each other, the first surface 101 is located above the second surface 102, the side wall 103 is located between the first surface 101 and the second surface 102, the receiving groove 104 is located in the second surface 102, and the two sides of the receiving groove 104 are connected to the side wall 103, and the cross section of the receiving groove 104 is square, but it is not limited thereto.

[0034] like Figure 2 and Figure 5As shown, the limiting portion 1232a is connected to the side wall 103, the limiting portion 1232a is a limiting block, the limiting block is connected to the side wall 103, the limiting blocks are located on both sides of the first surface 101, there are multiple limiting blocks, the first circuit substrate 122 is arranged on the first surface 101, and the trigger element 1241 is arranged in the receiving groove 104. In this embodiment, the limiting block is used to abut against the housing 13, so that the reinforcing plate 123a cannot be removed from the housing 13, and plays a role in limiting the movement of the reinforcing plate 123a.

[0035] The fingerprint chip 121 of the side key fingerprint module 12 of the present invention includes a chamfer 1211 and a blanking groove 1212 for improving the hand feel. The chamfer 1211 and the blanking groove 1212 are arranged opposite to each other. The chamfer 1211 is located at the edge of one side surface of the fingerprint chip 121, and the blanking groove 1212 is located at the edge of the other side surface of the fingerprint chip 121. The blanking groove 1212 is used to separate the fingerprint chip 121 from the raw material. The size of the chamfer 1211 is not damaged, which can ensure that the size of the chamfer 1211 of the fingerprint chip 121 remains unchanged and meets the production requirements. During production, the size of the chamfer 1211 is stable, thereby reducing the defective rate and facilitating mass production.

[0036] Second embodiment

[0037] The structure of the side key fingerprint module of this embodiment is substantially the same as that of the side key fingerprint module of the first embodiment, except that the structure of the reinforcing plate 123b of this embodiment is different from that of the reinforcing plate 123a of the first embodiment.

[0038] Figure 6 FIG. 2 is a schematic diagram of the structure of the reinforcing plate of the second embodiment of the present invention. Figure 6 As shown, the limiting portion 1232b is a limiting piece, and the limiting piece includes a first limiting piece 12321b and a second limiting piece 12322b, the first limiting piece 12321b is located at one end of the plate body 1231, and the second limiting piece 12322b is located at the other end of the plate body 1231, a part of the first limiting piece 12321b is connected to the second surface 102, and the other part is located on one side of the second surface 102, and a part of the second limiting piece 12322b is connected to the second surface 102, and the other part is located on the other side of the second surface 102. In this embodiment, the parts of the first limiting piece 12321b and the second limiting piece 12322b that are not connected to the second surface 102 are used to abut against the shell 13, so that the reinforcing plate 123a cannot be removed from the shell 13, which plays a role in limiting the movement of the reinforcing plate 123a.

[0039] Third embodiment

[0040] The structure of the side key fingerprint module of this embodiment is substantially the same as that of the side key fingerprint module of the second embodiment, except that the structure of the reinforcing plate 123c of this embodiment is different from that of the reinforcing plate 123b of the second embodiment.

[0041] Figure 7 FIG. 1 is a schematic diagram of the structure of a reinforcing plate according to a third embodiment of the present invention. Figure 7 As shown, the limiting portion 1232c includes a first limiting piece 12321c and a second limiting piece 12322c, the first limiting piece 12321c is located at one end of the plate body 1231, and the second limiting piece 12322c is located at the other end of the plate body 1231, the first limiting piece 12321c includes a first portion 201, a second portion 202 and a first middle portion (not shown), the first middle portion is located between the first portion 201 and the second portion 202, the first middle portion is connected to the second surface 102, and the first portion The first part 201 is located on one side of the second surface 102, and the second part 202 is located on the other side of the second surface 102; the second limiting piece 12322c includes a third part 203, a fourth part 204 and a second middle part 205, the second middle part 205 is located between the third part 203 and the fourth part 204, the second middle part 205 is connected to the second surface 102, the third part 203 is located on one side of the second surface 102, and the fourth part 204 is located on the other side of the second surface 102. In this embodiment, the first part 201, the second part 202, the third part 203 and the fourth part 204 are all used to abut against the shell 13, so that the reinforcing plate 123a cannot be removed from the shell 13, and play a role in limiting the movement of the reinforcing plate 123a.

[0042] Fourth embodiment

[0043] Figure 8 FIG. 4 is a flow chart of a method for manufacturing a side key fingerprint module according to a fourth embodiment of the present invention. Fig. 9 The figure is a processing diagram of the manufacturing method of the side key fingerprint module of the present invention when making chamfers. Fig.10 The figure is a processing diagram of the manufacturing method of the side key fingerprint module of the present invention when making the blanking groove. Fig.11 It is a schematic diagram of the structure of the fingerprint chip and the plate being separated according to the present invention.

[0044] The manufacturing method of the side key fingerprint module of the present invention includes the side key fingerprint module 12 as described above. Figure 8 As shown, the steps of the manufacturing method of the side key fingerprint module 12 include:

[0045] Step S1, such as Fig. 9As shown, a plate 40 for making a fingerprint chip 121 is provided, and a surface of one side of the plate 40 of the fingerprint chip 121 is cut to form a plurality of fingerprint chips 121, and the partial positions of the plurality of fingerprint chips 121 are integrally connected;

[0046] Step S2, such as Fig.10 and Fig.11 As shown, the other side surface of the plate 40 of the fingerprint chip 121 is cut to form a blanking groove 1212, and the multiple fingerprint chips 121 are separated.

[0047] Specifically, between step S1 and step S2, a protective layer is formed on one side of the fingerprint chip 121, and the protective layer covers the chamfer 1211. In this embodiment, the protective layer can be formed on the plate 40 by spraying, but the present invention is not limited thereto.

[0048] The manufacturing method of the side key fingerprint module 12 of the present invention makes a chamfer 1211 on the edge of one side surface of the fingerprint chip 121, and makes a blanking groove 1212 from the edge of the other side surface of the fingerprint chip 121 to separate the fingerprint chip 121 from the raw material. The size of the chamfer 1211 is not damaged, so the size of the chamfer 1211 can be guaranteed to remain unchanged to meet the production requirements; during production, the size of the chamfer 1211 is stable, thereby reducing the defective rate and facilitating mass production; a protective layer is made on one side of the plate 40 to avoid the complex process defects of single-grain spraying.

[0049] The fingerprint chip 121 of the side key fingerprint module 12 of the present invention includes a chamfer 1211 and a blanking groove 1212 for improving the hand feel. The chamfer 1211 and the blanking groove 1212 are arranged opposite to each other. The chamfer 1211 is located at the edge of one side surface of the fingerprint chip 121, and the blanking groove 1212 is located at the edge of the other side surface of the fingerprint chip 121. The blanking groove 1212 is used to separate the fingerprint chip 121 from the raw material. The size of the chamfer 1211 is not damaged, which can ensure that the size of the chamfer 1211 of the fingerprint chip 121 remains unchanged and meets the production requirements. During production, the size of the chamfer 1211 is stable, thereby reducing the defective rate and facilitating mass production.

[0050] In this document, unless otherwise specified or limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0051] In this document, the terms "comprises," "comprising," or any other variations thereof, are intended to cover a non-exclusive inclusion of elements other than those listed and may also include additional elements not expressly listed.

[0052] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, and these simple modifications all belong to the protection scope of the present invention. The various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

Claims

1. A method for manufacturing a side key fingerprint module, characterized in that: The side key fingerprint module includes a fingerprint chip, and the fingerprint chip includes a chamfer and a blanking groove for improving the hand feel, the chamfer is arranged opposite to the blanking groove, the chamfer is located at the edge of one side surface of the fingerprint chip, and the blanking groove is located at the edge of the other side surface of the fingerprint chip; The steps of the manufacturing method of the side key fingerprint module include: Step S1, providing a plate for making the fingerprint chip, cutting one side surface of the plate of the fingerprint chip to form a plurality of fingerprint chips, and partially connecting the plurality of fingerprint chips in one piece; Step S2, cutting is performed on the other side surface of the plate of the fingerprint chip to form the blanking groove; the blanking groove is used to separate the fingerprint chip from the raw material so that the chamfer size is not damaged.

2. The method for manufacturing a side key fingerprint module according to claim 1, characterized in that: The method further includes forming a protective layer on one side of the fingerprint chip between step S1 and step S2, wherein the protective layer covers the chamfer.

3. The method for manufacturing a side key fingerprint module according to claim 1, characterized in that: The fingerprint chip is formed with a side wall, and the chamfer connects the edge of one side surface of the fingerprint chip with the side wall in an inclined transition. Along the thickness direction of the fingerprint chip, the blanking groove and the chamfer are arranged at intervals.

4. The method for manufacturing a side key fingerprint module according to claim 1, characterized in that: The chamfer is in a continuous ring shape along a circle of the fingerprint chip and / or the blanking groove is in a continuous ring shape along a circle of the fingerprint chip.

5. The method for manufacturing a side key fingerprint module according to claim 1, characterized in that: The side key fingerprint module also includes a first circuit substrate, a reinforcement plate, a button assembly and a second circuit substrate. The fingerprint chip is arranged on the first circuit substrate, the first circuit substrate is arranged on the reinforcement plate, and the button assembly is arranged between the reinforcement plate and the second circuit substrate.

6. The method for manufacturing a side key fingerprint module according to claim 5, characterized in that: The key assembly includes a touch element and a key body, one side of the touch element contacts the reinforcing plate, the other side of the touch element abuts against the key body, and the key body is arranged on the second circuit substrate and electrically connected to the second circuit substrate.

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