Heat sink

Abstract

A heat sink is provided. The heat sink comprises: a film layer; a heat dissipation layer arranged on the film layer and comprising a plurality of through holes; and a first adhesive layer arranged on the heat dissipation layer, the heat dissipation layer comprising a first region, a second region and a third region, the through holes comprising a plurality of first holes arranged in the first region, a plurality of second holes arranged in the second region and a plurality of third holes arranged in the third region, and the average interval between adjacent first holes is smaller than the average interval between adjacent third holes.

Description

Technical Field

[0001] The present disclosure relates to heat sinks. Background Art

[0002] Electronic devices may generate heat from their internal wiring, terminals, chips and other electronic components. The heat generated by electronic components may shorten the life of the electronic device, cause malfunction and performance degradation. In particular, in the case of a display device with a light source that generates a large amount of heat, the accumulated heat also becomes a major cause of reducing the display quality of the display device.

[0003] On the other hand, the reality is that as electronic devices such as display devices and portable terminals become more high-performance and miniaturized, the electronic components inside them are also becoming highly integrated, requiring technology that can more effectively remove the heat generated by the increase in thermal energy density as the integration of electronic components becomes higher.

[0004] As a method of removing the heat, there can be exemplified a method of disposing a heat sink including a heat dissipation layer adjacent to an electronic component or the like that generates heat. Summary of the invention

[0005] The problem to be solved by the present disclosure is to provide a heat sink having an improved heat dissipation function while being excellent in durability.

[0006] The problems of the present disclosure are not limited to the problems mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

[0007] A heat sink according to one embodiment for solving the above-mentioned problem includes: a film layer; a heat dissipation layer, arranged on the film layer and including a plurality of through holes; and a first adhesive layer, arranged on the heat dissipation layer, the heat dissipation layer including a first region, a second region and a third region, the through holes including a plurality of first holes arranged in the first region, a plurality of second holes arranged in the second region and a plurality of third holes arranged in the third region, and the average spacing between adjacent first holes is smaller than the average spacing between adjacent third holes.

[0008] Alternatively, the film layer may be at least partially in contact with an inner side wall of the heat dissipation layer and / or the first adhesive layer exposed by the through hole in the through hole.

[0009] It can be that the heat sink also includes a protective layer, which is arranged below the film layer and includes a removed tongue, and the shortest distance from the removed tongue to the center of the first area is smaller than the shortest distance from the removed tongue to the center of the third area.

[0010] It may be that the film layer includes a protruding area, the heat dissipation layer and the protruding area do not overlap, and the film layer is in contact with the first adhesive layer in the protruding area.

[0011] Alternatively, the through hole further includes: a first space surrounded by one side of the film layer and one side of the protective layer; and a second space surrounded by the other side of the film layer and one side of the first adhesive layer.

[0012] It may be that the number of the first holes arranged in the same area is greater than the number of the third holes.

[0013] It may be that the average area of ​​the first holes on a plane is larger than the average area of ​​the second holes on a plane.

[0014] The center of the second region may overlap with a high-temperature component that releases heat, and an average area of ​​the second holes on a plane may be smaller than an average area of ​​the third holes on a plane.

[0015] It may be that an average interval between adjacent second holes is larger than an average interval between adjacent first holes.

[0016] It may be that the film layer comprises polyethylene terephthalate, and the heat dissipation layer comprises a carbon material.

[0017] Details of other embodiments are included in the detailed description and drawings.

[0018] (Effect of Publicity)

[0019] According to the embodiments of the present disclosure, the interlayer bonding force of the heat sink can be improved to give the heat sink excellent physical and mechanical properties, and wrinkles and foam defects can be improved to improve the reliability of the heat sink.

[0020] The effects according to the present disclosure are not limited to the above-exemplified contents, and more effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a perspective view of a display device including a heat sink according to an embodiment.

[0022] Figure 2 is an exploded perspective view of a display device including a heat sink according to an embodiment.

[0023] Figure 3 is a top view of a heat sink according to an embodiment.

[0024] Figure 4 Yes Figure 3 A cross-sectional view taken along line IV-IV'.

[0025] Figure 5is a cross-sectional view of a heat sink according to another embodiment.

[0026] Figure 6 is a cross-sectional view of a heat sink according to yet another embodiment.

[0027] Figure 7 is a cross-sectional view of a heat sink according to yet another embodiment.

[0028] Figure 8 is a top view of a heat sink according to yet another embodiment.

[0029] Fig. 9 is a cross-sectional view of a heat sink according to yet another embodiment.

[0030] Figures 10 to 13 It is a cross-sectional view according to process steps of a method for manufacturing a heat sink according to an embodiment.

[0031] Description of Reference Numerals

[0032] 10: Display device

[0033] 100: Cover window

[0034] 200: Display panel

[0035] 300: Parts below the panel

[0036] 400: Heat sink

[0037] 411: First adhesive layer

[0038] 420: Heat dissipation layer

[0039] 430: Film layer

[0040] 440: Protective layer

[0041] 450: Filling layer

[0042] 500: Middle frame

[0043] 600: Main circuit board

[0044] 700: Bottom cover DETAILED DESCRIPTION

[0045] The advantages and features of the present disclosure and the methods for achieving these advantages and features are shown in the attached Figure 1 The detailed embodiments described below will make it clear. However, the present disclosure is not limited to the embodiments disclosed below, and can also be implemented in other forms. That is, the present disclosure is defined only by the scope of the claimed rights.

[0046] When describing an element or layer as being "on" or "over" another element or layer, it includes not only the case where it is directly on the other element or layer but also the case where other layers or other elements are interposed. On the contrary, when describing an element as being "directly on" or "directly over" it means that no other element or layer is interposed.

[0047] Throughout the specification, the same reference numerals are used for the same or similar parts.

[0048] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0049] Figure 1 is a perspective view of a display device including a heat sink according to an embodiment. Figure 2 is an exploded perspective view of a display device including a heat sink according to an embodiment.

[0050] Reference Figure 1 and Figure 2 The display device 10 can be used not only as a portable electronic device such as a mobile phone, a smart phone, a tablet personal computer (PC, Personal Computer), a smart watch, a watch phone, etc., but also as a display screen for a variety of products such as a laptop computer, a monitor, and the Internet of Things (IOT).

[0051] The display device 10 may be any one of an organic light-emitting display device, a liquid crystal display device, a plasma display device, a field emission display device, an electrophoretic display device, an electrowetting display device, a quantum dot light-emitting display device, and a micro-LED display device. The following description will focus on the case where the display device 10 is an organic light-emitting display device, but the present disclosure is not limited thereto.

[0052] Reference Figure 1 and Figure 2 , a display device 10 according to an embodiment includes a cover window 100 , a display panel 200 , a lower panel member 300 , a heat sink 400 , a middle frame 500 , a main circuit board 600 , and a lower cover 700 .

[0053] In the present specification, “above”, “top”, and “above” refer to the direction in which the cover window 100 is arranged based on the display panel 200, that is, the third direction Z, and “below”, “bottom”, and “below” refer to the direction in which the intermediate frame 500 is arranged based on the display panel 200, that is, the opposite direction of the third direction Z. In addition, “left”, “right”, “up”, and “down” refer to directions when the display panel 200 is viewed on a plane. For example, “left” refers to the opposite direction of the first direction X, “right” refers to the first direction X, “up” refers to the third direction Z, and “down” refers to the opposite direction of the third direction Z.

[0054] The cover window 100 may be arranged above the display panel 200 to cover the upper surface of the display panel 200. Thus, the cover window 100 can perform the function of protecting the upper surface of the display panel 200. The cover window 100 may include a transmissive portion DA100 corresponding to the display panel 200 and a light shielding portion NDA100 corresponding to an area outside the display panel 200. The light shielding portion NDA100 may be formed to be opaque. Alternatively, the light shielding portion NDA100 may be formed by a decorative layer having a pattern formed therein that can be viewed by a user without displaying an image. For example, a company logo or a variety of texts may be patterned in the light shielding portion NDA100. In addition, a hole for exposing a front camera, an iris recognition sensor, an illumination sensor, etc. may be formed in the light shielding portion NDA100.

[0055] The cover window 100 may be made of glass, sapphire and / or plastic. The cover window 100 may be rigidly or flexibly formed.

[0056] The display panel 200 may be disposed under the cover window 100. The display panel 200 may be disposed overlapping the transmission portion DA100 of the cover window 100.

[0057] The display panel 200 may be a light-emitting display panel including a light-emitting element. For example, the display panel 200 may be an organic light-emitting display panel using an organic light-emitting diode (OLED), an ultra-small light-emitting diode display panel using an ultra-small light-emitting diode (Micro LED), and a quantum dot light-emitting display panel including a quantum dot light-emitting element (Quantumdot Light Emitting Diode).

[0058] The display panel 200 may include a substrate, a thin film transistor layer, a light emitting element layer, and a thin film encapsulation layer disposed on the substrate.

[0059] Since the display panel 200 is implemented to be flexible, it can be formed of plastic. In this case, the substrate may include a flexible substrate and a supporting substrate. The supporting substrate is used to support the flexible substrate, so the flexibility can be smaller than that of the flexible substrate. The flexible substrate and the supporting substrate can each contain a polymer substance with flexibility. For example, the flexible substrate and the supporting substrate can each be polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene napthalate (PEN), polyethylene terepthalate (PET), polyphenylene sulfide (PPS), arylate (polyallylate), polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP) or a combination of these.

[0060] A thin film transistor layer is arranged on the substrate. The thin film transistor layer may include a scan line, a data line and a thin film transistor. Each thin film transistor includes a gate electrode, a semiconductor layer, a source electrode and a drain electrode. In the case where the scan drive unit is directly formed on the substrate, the scan drive unit may be formed together with the thin film transistor layer.

[0061] A light emitting element layer is arranged on the thin film transistor layer. The light emitting element layer may include an anode electrode, a light emitting layer, a cathode electrode and a dike. The light emitting layer may include an organic light emitting layer containing an organic substance. For example, the light emitting layer may include a hole injection layer, a hole transporting layer, an organic light emitting layer, an electron transporting layer and an electron injection layer. The hole injection layer and the electron injection layer may be omitted. If a voltage is applied to the anode electrode and the cathode electrode, the holes and electrons move to the organic light emitting layer through the hole transporting layer and the electron transporting layer, respectively, and emit light by combining with each other in the organic light emitting layer. The light emitting element layer may be a pixel array layer forming pixels, and the area where the light emitting element layer is formed may be defined as a display area for displaying an image. The peripheral area of ​​the display area may be defined as a non-display area.

[0062] A thin film encapsulation layer is arranged on the light emitting element layer. The thin film encapsulation layer plays a role in preventing oxygen or moisture from penetrating into the light emitting element layer. The thin film encapsulation layer may include at least one inorganic film and at least one organic film.

[0063] The lower panel member 300 may be disposed below the display panel 200. The lower panel member 300 may be attached to the lower side of the display panel 200 through an adhesive layer. The adhesive layer may be a transparent adhesive film (OCA) or a transparent adhesive resin (OCR).

[0064] The under-panel member 300 may include at least one of a light absorbing member for absorbing light incident from the outside, a buffer member for absorbing an impact from the outside, and an electromagnetic wave blocking member.

[0065] The light absorbing member blocks the transmission of light, thereby preventing the structure disposed below the light absorbing member from being visually recognized from above the display panel 200. The light absorbing member may include a light absorbing substance such as a black pigment or dye.

[0066] The buffer component absorbs external impact to prevent the display panel 200 from being damaged. The buffer component may be formed as a single layer or multiple layers. For example, the buffer component may be formed of a polymer resin such as polyurethane, polycarbonate, polypropylene, polyethylene, etc., or may include a sponge having elasticity such as a foamed rubber, polyurethane or acrylic material. The buffer component may be a cushion layer.

[0067] The electromagnetic wave blocking member may be made of a material having an electromagnetic wave shielding function and may be made of a common metal foil used in the art, such as copper foil, aluminum foil or metal sheet.

[0068] A heat sink 400 may be arranged below the panel lower component 300. The heat sink 400 absorbs and diffuses heat from the heat generating location, thereby greatly reducing the heat generating temperature. The heat sink 400 may include a first adhesive layer 411, a heat dissipation layer 420 arranged below the first adhesive layer 411, and a film layer 430 arranged below the heat dissipation layer 420. A detailed description of the heat sink 400 will be described later.

[0069] The middle frame 500 may be disposed below the heat sink 400. The middle frame 500 may include synthetic resin, metal, or both.

[0070] A hole for inserting a camera device, a sound generating device, or a battery, etc. may be formed in the middle frame 500. A main circuit board 600 may be disposed below the middle frame 500. The main circuit board 600 may be a printed circuit board (PCB) or a flexible printed circuit board.

[0071] The main circuit board 600 may include a main processor, an audio driver, a microphone, a mobile communication module, and the like.

[0072] The lower cover 700 may be disposed below the middle frame 500 and the main circuit board 600. The lower cover 700 may be fastened and fixed to the middle frame 500. The lower cover 700 may form a lower appearance of the display device 10. The lower cover 700 may include plastic and / or metal.

[0073] Hereinafter, the heat sink 400 will be described in more detail.

[0074] Figure 3 is a top view of a heat sink according to an embodiment. Figure 4 Yes Figure 3 A cross-sectional view taken along line IV-IV'.

[0075] Reference Figure 3 and Figure 4 According to an embodiment, the heat sink 400 may include a protective layer 440, a film layer 430 disposed on the protective layer 440, a heat dissipation layer 420 disposed on the film layer 430, and a first adhesive layer 411 disposed on the heat dissipation layer 420. It should be noted that Figure 4 is when Figure 1 and Figure 2For comparison, the heat sink 400 is shown upside down, that is, the first adhesive layer 411 may be disposed on the display panel 200 side, and the protective layer 440 may be disposed on the middle frame 500 side.

[0076] Figure 3 The planar shape of the heat sink 400 that can be used in the display device 10 is illustrated, but is not limited thereto. According to an embodiment, the heat sink 400 can have various sizes and shapes, for example, a rectangular, square, a rectangular with rounded corners, a square with rounded corners, an elliptical or circular shape.

[0077] The protective layer 440 may be a protective member for supporting the heat dissipation layer 420 to minimize damage caused by external impact and to suppress penetration of impurities such as moisture that may flow into the heat dissipation fin 400 from the outside.

[0078] The protective layer 440 may include a protruding area PA. The protruding area PA of the protective layer 440 may be an area where the side of the protective layer 440 protrudes from the side of the heat dissipation layer 420. The width of the protruding area PA in the cross section may be 0.3 mm to 0.5 mm, but is not limited thereto. A detailed description of the protruding area PA will be described later.

[0079] In addition, the protective layer 440 may include a removal tongue RT extending outwardly on one side and protruding. The side of the removal tongue RT of the protective layer 440 may be arranged to protrude more than the side of the film layer 430.

[0080] The protective layer 440 may be a layer that is suitable for being removed from the heat sink 400 by the display device 10. In this case, the user may grasp the removal tongue RT of the protective layer 440 by hand and remove the protective layer 440 from the layer arranged thereunder (e.g., the film layer 430). To this end, the adhesive force between the protective layer 440 and the layer arranged thereunder (e.g., the film layer 430) may be such that the adhesiveness can be separated by grasping by hand.

[0081] Generally, in the process of peeling the protective layer 440 from the film layer 430, wrinkles and bubbles may be generated on the film layer 430. The weaker the bonding force between the film layer 430 arranged under the protective layer 440 and the heat dissipation layer 420, the more serious this phenomenon may appear. A detailed description of this will be given later.

[0082] The figure shows a structure in which the side of the protective layer 440 except for the tongue RT is aligned with the side of the film layer 430 and the first adhesive layer 411, but it is not limited thereto. That is, the area of ​​the protective layer 440 on the plane may be formed to be larger than the area of ​​the film layer 430, etc., and the protective layer 440 may be arranged to cover the film layer 430. In this case, the side of the protective layer 440 except for the tongue RT may be arranged to protrude outward from the side of the film layer 430.

[0083] The film layer 430 may be disposed on the protective layer 440. One side of the film layer 430 may be at least partially in contact with one side of the protective layer 440. An adhesive layer is also disposed between the film layer 430 and the protective layer 440, through which one side of the film layer 430 and one side of the protective layer 440 can be bonded to each other.

[0084] The film layer 430 may include a protruding area PA. The protruding area PA of the film layer 430 may be an area where the side of the film layer 430 protrudes more than the side of the heat dissipation layer 420. That is, the film layer 430 may be formed to be wider than the heat dissipation layer 420, and the film layer 430 may be formed to cover one side of the heat dissipation layer 420 disposed below. Thus, dust can be prevented from being generated from the heat dissipation layer 420, and a detailed description of this will be described later.

[0085] One side of the film layer 430 may include a first side W1 , a second side W2 , and a third side W3 .

[0086] The first surface W1 of the film layer 430 may be defined as a region where one surface of the film layer 430 and one surface of the heat dissipation layer 420 are connected.

[0087] The second surface W2 and the third surface W3 of the film layer 430 may be defined as surfaces disposed inside the through hole H of the heat dissipation layer 420 described later.

[0088] The second surface W2 of the film layer 430 may be defined as a region in contact with the first adhesive layer 411 exposed through the through hole H of the heat dissipation layer 420 .

[0089] The third surface W3 of the film layer 430 may be defined as a region between the first surface W1 and the second surface W2, and the third surface W3 of the film layer 430 may at least partially contact the inner sidewall of the heat dissipation layer 420. A detailed description of this will be given later.

[0090] The thickness T430 of the film layer 430 may be smaller than the maximum thickness T440 of the protective layer 440. The thickness T430 of the film layer 430 may be 0.0055 mm to 0.01 mm, but is not limited thereto. When the thickness T430 of the film layer 430 is less than 0.0055 mm, wrinkles of the heat sink 400 may be produced, and when the thickness T430 of the film layer 430 exceeds 0.01 mm, it may also be disadvantageous in terms of flexibility.

[0091] The film layer 430 is not particularly limited as long as it is made of a rigid material, but may be, for example, a polymer film such as polyimide (PI) or polyethylene terephthalate (PET). In addition, the film layer 430 may further include a black pigment or dye.

[0092] The heat dissipation layer 420 may be disposed on the film layer 430. One side of the heat dissipation layer 420 may be at least partially in contact with one side of the film layer 430. An adhesive layer is also disposed between the heat dissipation layer 420 and the film layer 430, through which one side of the heat dissipation layer 420 and the other side of the film layer 430 can be bonded to each other.

[0093] In one embodiment, the side of the heat dissipation layer 420 may be arranged on the inner side than the side of the film layer 430. In addition, the side of the heat dissipation layer 420 is arranged on the inner side than the protruding area PA of the film layer 430, and the heat dissipation layer 420 may not overlap with the protruding area PA of the film layer 430. That is, the heat dissipation layer 420 may be formed to be smaller than the film layer 430 on the plane, and one side of the heat dissipation layer 420 may be covered by the film layer 430. Specifically, the film layer 430 may be arranged to cover not only the top of the heat dissipation layer 420 but also the side. Thus, the side of the heat dissipation layer 420 can be not exposed to the outside, and dust generated from the heat dissipation layer 420 can be prevented from causing a defect in the display device 10.

[0094] The heat dissipation layer 420 may be a heat transfer component made of a material with relatively high thermal conductivity. In an exemplary embodiment, the thermal conductivity of the heat dissipation layer 420 in the thickness direction (third direction Z) and the thermal conductivity in the horizontal direction (first direction X and second direction Y) may be different. For example, the thermal conductivity of the heat dissipation layer 420 in the horizontal direction may be greater than the thermal conductivity in the thickness direction. By this, the absorbed heat can be effectively transferred to the horizontal direction (surface direction).

[0095] In addition, the heat dissipation layer 420 may have a greater thermal conductivity than the protective layer 440 and the film layer 430. For example, the heat dissipation layer 420 may have a greater horizontal thermal conductivity than the protective layer 440 and the film layer 430.

[0096] The heat dissipation layer 420 may be composed of carbon materials such as graphite, graphene, and carbon nanotubes. In an exemplary embodiment, the heat dissipation layer 420 may be a graphite film obtained by carbonizing and desertifying a polymer film such as polyimide. Graphite has excellent thermal conductivity, so when used as the heat dissipation layer 420, the heat dissipation characteristics of the heat sink 400 can be further improved. In addition, artificial graphite manufactured by carbonizing and desertifying a polymer film can be formed into a micro-sized thickness, so that the heat sink 400 can be thinned.

[0097] The thickness T420 of the heat dissipation layer 420 may be greater than the maximum thickness T440 of the protection layer 440 and the maximum thickness T430 of the film layer 430. For example, the thickness T420 of the heat dissipation layer 420 may be about 0.025 mm to 0.035 mm, but is not limited thereto. In another embodiment, the heat dissipation layer 420 may also be natural graphite.

[0098] The heat dissipation layer 420 may include one or more through holes H. The through holes H vertically penetrate the heat dissipation layer 420 along the thickness direction, so as to expose a portion of the first adhesive layer 411 disposed on the heat dissipation layer 420 .

[0099] The film layer 430 may be extended inside the through hole H. Thus, the film layer 430 may at least partially contact the first adhesive layer 411 exposed by the through hole H. In addition, the film layer 430 may at least partially contact the inner side wall of the heat dissipation layer 420 through the through hole H.

[0100] Specifically, the second surface W2 of the film layer 430 may be in contact with one side of the first adhesive layer 411 exposed by the through hole H. In addition, the third surface W3 of the film layer 430 may be in contact with the inner side wall of the heat dissipation layer 420 exposed by the through hole H. Thus, when the heat dissipation layer 420 is composed of a material that is fragile to damage in the third direction Z and is easily peeled off, the inner side wall of the heat dissipation layer 420 can also be in contact with one side of the film layer 430 through the through hole H, thereby improving the internal bonding force of the heat dissipation layer 420 and providing the heat sink 400 with excellent physical and mechanical properties.

[0101] In one embodiment, the through holes H of the heat dissipation layer 420 may be arranged in a plurality of spaces in a first direction X and a second direction Y orthogonal to each other on a plane, and arranged in a substantially matrix shape.

[0102] The planar shape of the through hole H is not particularly limited, and may be, for example, a substantially circular shape. However, the through hole H is not limited thereto, and may also be an elliptical or polygonal shape in plan.

[0103] In one embodiment, the inner wall of the through hole H may be substantially perpendicular to the upper surface or the lower surface of the heat dissipation layer 420 , but is not limited thereto. The inner wall of the through hole H may also have a predetermined inclination.

[0104] The through hole H may include a first space S1 and a second space S2 .

[0105] The first space S1 of the through hole H may be defined as a space surrounded by one side of the film layer 430 and one side of the protection layer 440 .

[0106] The second space S2 of the through hole H may be defined as a space surrounded by one side of the first adhesive layer 411 exposed by the through hole H, the inner sidewall of the heat dissipation layer 420, and the third surface W3 of the other side of the film layer 430. The first space S1 of the through hole H may be larger than the second space S2.

[0107] The through holes H may include a first hole H1, a second hole H2, and a third hole H3. The first hole H1 may be disposed in the first area A1 of the heat dissipation layer 420, the second hole H2 may be disposed in the second area A2 of the heat dissipation layer 420, and the third hole H3 may be disposed in the third area A3 of the heat dissipation layer 420.

[0108] The first area A1 is an area adjacent to the removal tongue RT of the protective layer 440, and the shortest distance from the removal tongue RT of the protective layer 440 to the center of the first area A1 may be smaller than the shortest distance to the center of the second area A2 and / or the center of the third area A3.

[0109] The first area A1 may be an area that is initially removed when the protective layer 440 is removed from the film layer 430. That is, the protective layer 440 disposed in the first area A1 may be removed from the film layer 430 earlier than the protective layer 440 disposed in the second area A2 and the third area A3.

[0110] Generally, during the process of removing the protective layer 440 from the film layer 430, the film layer 430 may separate from the heat dissipation layer 420 and expand and contract. In this process, wrinkles may be generated in the film layer 430. If the contraction process is not sufficient, additional defects such as foaming may occur.

[0111] Meanwhile, in the case of the first area A1 , the initial force (Initial Force) of peeling off the protective layer 440 may appear relatively high, and wrinkles and poor foaming may also appear most seriously in the first area A1 .

[0112] Therefore, the heat sink 400 according to an embodiment can prevent wrinkles or bubbles from being formed in the heat sink 400 by densely arranging the first holes H1 arranged in the first area A1.

[0113] Specifically, the interval D_H1 between the first holes H1 may be different from the interval D_H2 between the second holes H2 and / or the interval D_H3 between the third holes H3. Here, the interval between each hole may be defined as the average interval between holes adjacent to each other.

[0114] In one embodiment, the interval D_H1 between the first holes H1 may be smaller than the interval D_H3 between the third holes H3. In addition, the interval D_H1 between the first holes H1 may also be smaller than the interval D_H2 between the second holes H2.

[0115] In addition, the number of the first holes H1 arranged in the same area may be different from the number of the third holes H3 and / or the second holes H2 arranged in the same area.

[0116] In one embodiment, the number of first holes H1 arranged in the same area may be greater than the number of third holes H3 arranged in the same area. In addition, the number of first holes H1 arranged in the same area may be greater than the number of second holes H2 arranged in the same area.

[0117] In addition, the on-plane area S_H1 of the first hole H1 may be substantially the same as the on-plane area S_H3 of the third hole H3 .

[0118] Here, as described above, when the first holes H1 are densely arranged in the first area A1, the bonding force between the heat dissipation layer 420 and the film layer 430 can be further improved. Therefore, even if a relatively large initial force (Initial Force) is applied in the first area A1, the film layer 430 can be prevented from being separated from the heat dissipation layer 420, thereby preventing wrinkles or bubbles from being formed in the film layer 430.

[0119] The second area A2 is an area overlapping with a high-temperature component that releases heat in the display device 10. For example, the center of the second area A2 may be an area where integrated circuits, driver chips, light sources, sensors, batteries, etc. of the display device 10 are arranged. The second area A2 may have a greater heat energy density than the third area A3 and / or the first area A1, and the accumulated heat energy may cause a decrease in the display quality of the display device 10.

[0120] Therefore, the heat sink 400 according to an embodiment reduces the area of ​​the second holes H2 arranged in the second area A2 and shortens the heat transfer path in the horizontal direction, thereby improving the heat dissipation characteristics of the heat sink 400 .

[0121] Specifically, the planar area S_H2 of the second hole H2 may be different from the planar area S_H3 of the third hole H3 and / or the planar area S_H1 of the first hole H1 .

[0122] In one embodiment, the planar area S_H2 of the second hole H2 may be smaller than the planar area S_H3 of the third hole H3. In addition, the planar area S_H2 of the second hole H2 may also be smaller than the planar area S_H1 of the first hole H1.

[0123] In addition, the interval D_H2 between the second holes H2 may be different from the interval D_H3 between the third holes H3 and the interval D_H1 between the first holes H1 .

[0124] In one embodiment, the interval D_H2 between the second holes H2 may be greater than the interval D_H3 between the third holes H3. In addition, the interval D_H2 between the second holes H2 may be greater than the interval D_H1 between the first holes H1.

[0125] In addition, the number of the second holes H2 arranged in the same area may be substantially the same as the number of the third holes H3 arranged in the same area.

[0126] As described above, when the second hole H2 arranged in the second region A2 is formed to have a small area, the horizontal heat transfer path in the heat dissipation layer 420 can be shortened. Therefore, the horizontal heat diffusion performance of the heat dissipation sheet 400 is improved, thereby further improving the heat dissipation characteristics.

[0127] On the other hand, the first area A1, the second area A2 and the third area A3 are not limited to Figure 3 and Figure 4 The relative positions of the first area A1, the second area A2 and the third area A3 can be variously deformed.

[0128] As described above, the heat dissipation characteristics and durability required for the heat sink 400 may be different according to the first area A1, the second area A2 and the third area A3. According to one embodiment, the heat sink 400 designs the through hole H differently according to the first area A1, the second area A2 and the third area A3, so as to improve the heat dissipation characteristics of the heat sink 400 and prevent wrinkles or poor foaming, thereby improving the reliability of the heat sink 400.

[0129] A first adhesive layer 411 may be disposed below the heat dissipation layer 420 . One surface of the first adhesive layer 411 may be in contact with the heat dissipation layer 420 and the film layer 430 , and the other surface of the first adhesive layer 411 may be in contact with one surface of the lower panel component 300 .

[0130] The first adhesive layer 411 may bond one side of the heat dissipation layer 420 to the lower panel member 300 . In addition, the first adhesive layer 411 may bond one side of the film layer 430 to the lower panel member 300 .

[0131] The first adhesive layer 411 may include a protruding area PA. The protruding area PA of the first adhesive layer 411 may be an area where the side surface of the first adhesive layer 411 protrudes more than the side surface of the heat dissipation layer 420. That is, the first adhesive layer 411 may be formed to be wider than the heat dissipation layer 420 on a plane. In the protruding area PA, the first adhesive layer 411 may be in contact with the film layer 430.

[0132] The first adhesive layer 411 may include a substance having adhesive force or cohesive force, for example, the first adhesive layer 411 may include a thermosetting resin.

[0133] The thickness T411 of the first adhesive layer 411 may be greater than the thickness T430 of the film layer 430. In addition, the thickness T411 of the first adhesive layer 411 may be less than the thickness T420 of the heat dissipation layer 420. In one embodiment, the thickness T411 of the first adhesive layer 411 may be 0.02 mm to 0.03 mm, but is not limited thereto.

[0134] The thermal conductivity of the first adhesive layer 411 may be lower than the thermal conductivity of the heat dissipation layer 420 .

[0135] exist Figure 4 In the embodiment, one side of the first adhesive layer 411 is flat, and there is a second space S2 between the first adhesive layer 411 and the film layer 430, but it is not limited thereto, and the first adhesive layer 411 may fill a part or all of the second space S2. When the first adhesive layer 411 is filled in the second space S2, i.e., inside the through hole H of the heat dissipation layer 420, the first adhesive layer 411 and the inner side wall of the heat dissipation layer 420 may be in contact with each other. Thus, the peel strength of the heat dissipation layer 420 can be improved.

[0136] In addition, as the first adhesive layer 411 fills the second space S2, the contact area between the film layer 430 and the first adhesive layer 411 is further increased. As a result, the bonding force between the film layer 430 and the first adhesive layer 411 is further improved, and a heat sink 400 with excellent durability can be provided. At the same time, in the process of peeling the protective layer 440 from the film layer 430, the film layer 430 can be prevented from being separated from the first adhesive layer 411, so that wrinkles or bubbles can be prevented from being formed on the film layer 430.

[0137] Hereinafter, another embodiment of the present disclosure will be described. In the following embodiments, the same structures as those already described are denoted by the same reference numerals, and repeated descriptions are omitted or simplified.

[0138] Figure 5 is a cross-sectional view of a heat sink according to another embodiment. Figure 5 The heat sink 400_1 according to this embodiment is different from the heat sink 400_1 in that a filling layer 450 is arranged between the film layer 430 and the first adhesive layer 411. Figure 4 One side of the filling layer 450 may be in contact with one side of the film layer 430 , and the other side of the filling layer 450 may be in contact with one side of the first adhesive layer 411 .

[0139] The filling layer 450 may include an organic material. The filling layer 450 may include a transparent light-curing resin (e.g., UV-curing resin) or a thermosetting resin. Examples of the light-curing resin include epoxy acrylic resin, polyurethane acrylate resin, and silicon acrylate resin. Examples of the thermosetting resin include acrylic resin, polyurethane resin, and polyester resin.

[0140] The maximum thickness T450 of the filling layer 450 may be greater than the maximum thickness T440 of the protection layer 440 and the maximum thickness T430 of the film layer 430. The maximum thickness T450 of the filling layer 450 may be less than or substantially the same as the thickness T420 of the heat dissipation layer 420. In one embodiment, the maximum thickness T450 of the filling layer 450 may be about 0.025 mm to 0.035 mm, but is not limited thereto.

[0141] The filling layer 450 may be in a shape that fills the through hole H formed in the heat dissipation layer 420. The filling layer 450 may be in contact with the inner side wall of the heat dissipation layer 420 through the through hole H. Thus, the durability of the heat sink 400_1 can be further improved. Specifically, when the heat dissipation layer 420 is composed of a material that is fragile to damage in the third direction Z and is easily peeled off, the side surface of the filling layer 450 can also be in contact with the inner side wall of the heat dissipation layer 420 through the through hole H, thereby improving the internal bonding force of the heat dissipation layer 420 and providing excellent physical and mechanical properties to the heat sink 400_1.

[0142] The top of the filling layer 450 may be as follows Figure 5 The film layer 430 may be arranged to cover the filling layer 450. In this case, the film layer 430 may be in contact with the top of the flat filling layer 450, thereby further increasing the contact area between the filling layer 450 and the film layer 430. As a result, the film layer 430 and the filling layer 450 can be further firmly combined, so as described above, in the process of peeling the protective layer 440 from the film layer 430, the film layer 430 can be prevented from being separated from the layers arranged below (for example, the heat dissipation layer 420 and the filling layer 450), thereby preventing wrinkles or poor foaming.

[0143] On the other hand, according to the present embodiment, the heat dissipation layer 420 of the heat sink 400_1 includes a first area A1, a second area A2 and a third area A3. According to the first area A1, the second area A2 and the third area A3, the through hole H is designed differently to improve the heat dissipation characteristics of the heat sink 400_1 and prevent wrinkles or poor foaming, which is the same as described above.

[0144] Figure 6 is a cross-sectional view of a heat sink according to yet another embodiment.

[0145] Reference Figure 6 The heat sink 400_2 according to this embodiment is different from the heat sink 400_2 in that the top of the filling layer 450_A includes a recessed portion 450_d recessed in the depth direction (third direction Z). Figure 5 The embodiments are different.

[0146] The thickness of the recessed portion 450_d of the filling layer 450_A may be relatively large at both ends in the width direction (first direction X) in the cross section and the thickness may decrease from both ends toward the center. The thickness of the recessed portion 450_d may be smallest at the center in the width direction in the cross section.

[0147] The recessed portion 450_d of the filling layer 450_A has a first thickness T450_1 at the end with the largest thickness, and has a second thickness T450_2 at the center portion with the lowest height. Here, the first thickness T450_1 and the second thickness T450_2 are defined as the vertical distance (the distance in the third direction Z) from the top of the filling layer 450_A to the bottom surface (or the extension surface of the bottom surface). When the bottom surface of the filling layer 450_A is flat, it is clear that the first thickness T450_1 is greater than the second thickness T450_2. In the case where the bottom surface of the filling layer 450_A has a concave shape or other different shapes, the first thickness T450_1 may also be greater than the second thickness T450_2.

[0148] The first thickness T450_1 of the recessed portion 450_d of the filling layer 450_A may be smaller than or equal to the thickness T420 of the heat dissipation layer 420. The first thickness T450_1 of the recessed portion 450_d being equal to the thickness T420 of the heat dissipation layer 420 means that the upper surface of the filling layer 450_A is connected to one end of the heat dissipation layer 420. When the first thickness T450_1 of the recessed portion 450_d is smaller than the thickness T420 of the heat dissipation layer 420, the upper surface of the filling layer 450_A may be separated from one end of the heat dissipation layer 420.

[0149] The through hole H may include a first space S1 in an area where the film layer 430 overlaps with the recessed portion 450_d of the filling layer 450_A. The first space S1 may be surrounded by one side of the protective layer 440 and one side of the film layer 430. As the film layer 430 and the protective layer 440 separate the first space S1 by placing it between each other, the contact area between the film layer 430 and the heat dissipation layer 420 and the filling layer 450_A may be larger than the contact area between the film layer 430 and the protective layer 440. That is, the bonding force between the film layer 430 and the heat dissipation layer 420 and the filling layer 450_A may be greater than the bonding force between the film layer 430 and the protective layer 440. Thus, the protective layer 440 can be more easily peeled off from the film layer 430, preventing the film layer 430 from being separated from the heat dissipation layer 420 and the filling layer 450_A, thereby preventing wrinkles or poor foaming.

[0150] The film layer 430 may be arranged to cover the heat dissipation layer 420 and the filling layer 450_A. The film layer 430 may be connected along the upper surface of the recessed portion 450_d of the filling layer 450_A. In addition, the film layer 430 may not be connected to the protective layer 440 in the area overlapping with the recessed portion 450_d of the filling layer 450_A.

[0151] On the other hand, according to the present embodiment, the heat dissipation layer 420 of the heat sink 400_2 includes a first area A1, a second area A2 and a third area A3. According to the first area A1, the second area A2 and the third area A3, the through hole H is designed differently to improve the heat dissipation characteristics of the heat sink 400_2 and prevent wrinkles or poor foaming, which is the same as described above.

[0152] Figure 7 is a cross-sectional view of a heat sink according to yet another embodiment.

[0153] Reference Figure 7 The heat sink 400_3 according to this embodiment is different from the heat sink 400_3 in that a filling layer 450_B is arranged between the film layer 430 and the heat dissipation layer 420. Figure 4 The embodiments are different.

[0154] The maximum thickness T450B of the filling layer 450_B may be greater than the thickness T420 of the heat dissipation layer 420. Thus, the filling layer 450_B may be arranged to cover one side of the heat dissipation layer 420. That is, the filling layer 450_B may be in contact with the upper surface of the heat dissipation layer 420 and the inner side wall of the heat dissipation layer 420 exposed by the through hole H. In this case, when the heat dissipation layer 420 is composed of a material that is fragile to damage in the third direction Z and is easily peeled off, the filling layer 450_B may also be directly in contact with the upper surface and the inner side wall of the heat dissipation layer 420. Thus, the internal bonding force of the heat dissipation layer 420 can be improved, and better physical and mechanical properties can be imparted to the heat sink 400_3.

[0155] The top of the filling layer 450_B may constitute a flat surface. The film layer 430 may be arranged to cover the filling layer 450_B. In this case, the film layer 430 can be connected along the top of the flat filling layer 450_B, so that the contact area between the filling layer 450_B and the film layer 430 can be further increased. As a result, the film layer 430 and the filling layer 450_B can be more firmly combined, so as described above, in the process of peeling the protective layer 440 from the film layer 430, the film layer 430 can be prevented from being separated from the filling layer 450_B, so wrinkles or poor foaming can be prevented.

[0156] In one embodiment, the film layer 430 may not be in contact with the upper surface of the heat dissipation layer 420. In addition, the film layer 430 may be in contact with the side surface of the heat dissipation layer 420 at least partially.

[0157] On the other hand, according to the present embodiment, the heat dissipation layer 420 of the heat sink 400_3 includes a first area A1, a second area A2 and a third area A3. According to the first area A1, the second area A2 and the third area A3, the through hole H is designed differently to improve the heat dissipation characteristics of the heat sink 400_3 and prevent wrinkles or poor foaming, which is the same as described above.

[0158] Figure 8 is a top view of a heat sink according to yet another embodiment. Fig. 9 is a cross-sectional view of a heat sink according to yet another embodiment.

[0159] Reference Figure 8 and Fig. 9 The heat sink 400_4 according to this embodiment is different from the heat sink 420_1 in that the through holes H of the heat sink layer 420_1 are regularly arranged on the plane. Figure 5 The embodiments are different.

[0160] Specifically, the through holes H of the heat dissipation layer 420_1 may be arranged in a spaced relationship in the first direction X and the second direction Y, and may be arranged in a substantially matrix shape. The spacing distance of the through holes H in the first direction X and / or the spacing distance in the second direction Y may be respectively constant, and the spacing distance of the through holes H in the first direction X may be substantially the same as the spacing distance in the second direction Y. By regularly arranging the through holes H on a plane, the thermal conductivity in the horizontal direction inside the heat dissipation layer 420_1 may be kept uniform. In addition, the spacing distance of the through holes H in the first direction X and / or the spacing distance in the second direction Y may be constant, and the spacing distance in the first direction X is different from the spacing distance in the second direction Y.

[0161] The through hole H of the heat dissipation layer 420_1 may have a constant shape and / or area in a plane.

[0162] A filling layer 450 may be arranged inside the through hole H. The filling layer 450 may be connected to the inner side wall of the heat dissipation layer 420_1 through the through hole H. Thus, in the case where the heat dissipation layer 420_1 is composed of a material that is fragile to damage in the third direction Z and is easily peeled off, the internal bonding force of the heat dissipation layer 420_1 can be improved, and excellent physical and mechanical properties can be imparted to the heat sink 400_4, which is the same as described above. Next, a method for manufacturing a heat sink according to an embodiment as described above is described. In the heat sink according to various embodiments, the manufacturing Figures 1 to 4 The heat sink method is described as an example. Figures 1 to 4 Substantially the same components are denoted by the same reference numerals, and detailed reference numerals are omitted.

[0163] Figures 10 to 13 is a cross-sectional view of a method for manufacturing a heat sink according to an embodiment of the present invention according to the process steps. Figure 3 The diagram is shown by cutting out the line corresponding to IV-IV' shown in FIG.

[0164] Reference Fig.10 First, a heat dissipation layer 420' is prepared, and one or more through holes H are formed in the heat dissipation layer 420'. The step of forming the through holes H may be a step of punching the heat dissipation layer 420' using a mold 910 having a shape corresponding to the through holes H.

[0165] Specifically, the plane area of ​​the through holes H and the intervals between the through holes H can be designed differently according to the first area A1, the second area A2, and the third area A3. Thus, the heat dissipation characteristics of the heat sink 400 are improved, wrinkles or poor foaming are prevented, and the reliability of the heat sink 400 can be improved, which is the same as described above.

[0166] The heat dissipation layer 420' is similar to the heat dissipation layer 420 in that no through hole H is formed. Figure 4 The heat dissipation layer 420 is the same as that described in the above description, and the detailed description is omitted.

[0167] Next, refer to Fig.11 , a film layer 430' is formed on one side of the heat dissipation layer 420, and a first adhesive layer 411 is formed on the other side of the heat dissipation layer 420. The film layer 430' may be a polymer film such as polyethylene terephthalate. An adhesive layer is also formed on one side of the film layer 430', and the film layer 430' can be bonded to the top of the heat dissipation layer 420 through the adhesive layer. The first adhesive layer 411 may be made of a thermosetting resin. The film layer 430' is not arranged inside the through hole H of the heat dissipation layer 420, and is not arranged inside the through hole H of the heat dissipation layer 420. Figure 4 The film layer 430 is the same as that described in the above description, and the detailed description is omitted.

[0168] Next, refer to Fig.12 , insert the needle tip 930 into the through hole H of the heat dissipation layer 420 on one side of the film layer 430. The step of inserting the needle tip 930 into the through hole H may be a step of applying pressure to the film layer 430 by using the needle tip 930 arranged at a position corresponding to the through hole H. Thus, the film layer 430 can be closely attached to the inner wall of the through hole H of the heat dissipation layer 420, and the film layer 430 can be connected to the inner side wall of the heat dissipation layer 420 and / or the first adhesive layer 411. Fig.10 The method of applying pressure using a needle tip 930 is exemplified, but it is not limited thereto. The film layer 430 may be pressed against the inner side wall of the heat dissipation layer 420 and / or one surface of the first adhesive layer 411 by air pressure. Figure 4 It has been explained in etc., so the detailed description is omitted.

[0169] Next, refer to Fig.13 , a protective layer 440 is formed on one side of the film layer 430 and cut off, thereby completing the heat sink. In one embodiment, the step of forming the protective layer 440 can be performed using a roll-to-roll process. An adhesive layer is also formed on one side of the protective layer 440, and the protective layer 440 can be bonded to one side of the film layer 430 through the adhesive layer. Figure 4 It has been explained in etc., so the detailed description is omitted.

[0170] Although the above description is centered on the embodiments of the present disclosure, this is merely illustrative and does not limit the present disclosure. People with common knowledge in the field to which the present disclosure belongs should know that various modifications and applications not illustrated above can be performed within the scope of the essential features of the embodiments of the present disclosure. For example, each component specifically shown in the embodiments of the present disclosure can be implemented in a modified manner. Moreover, the differences related to such modifications and applications should be interpreted as being included in the scope of the present disclosure specified in the scope of the claimed rights.

Claims

1. A heat sink, wherein: include: Membrane layer; A heat dissipation layer, arranged on the film layer and comprising a plurality of through holes; as well as A first adhesive layer is arranged on the heat dissipation layer, The heat dissipation layer includes a first region, a second region and a third region. The through holes include a plurality of first holes arranged in the first region, a plurality of second holes arranged in the second region, and a plurality of third holes arranged in the third region. The average interval between adjacent first holes is smaller than the average interval between adjacent third holes. The heat sink further comprises a protective layer, which is arranged below the film layer and comprises a tongue removal. The shortest distance from the removal tongue to the center of the first region is smaller than the shortest distance from the removal tongue to the center of the third region.

2. The heat sink according to claim 1, wherein: The film layer is at least partially connected to the inner side wall of the heat dissipation layer and / or the first adhesive layer exposed by the through hole in the through hole.

3. The heat sink according to claim 1, wherein: The film layer includes a protruding area, and the heat dissipation layer does not overlap with the protruding area. The film layer is in contact with the first adhesive layer in the protruding area.

4. The heat sink according to claim 1, wherein: The through hole further includes: a first space surrounded by one side of the film layer and one side of the protective layer; and a second space surrounded by the other side of the film layer and one side of the first adhesive layer.

5. The heat sink according to claim 1, wherein: The number of the first holes arranged in the same area is greater than the number of the third holes.

6. The heat sink according to claim 5, wherein: The average area of ​​the first holes on a plane is larger than the average area of ​​the second holes on a plane.

7. The heat sink according to claim 1, wherein: The center of the second region overlaps with the high-temperature component that releases heat, The average area of ​​the second holes on a plane is smaller than the average area of ​​the third holes on a plane.

8. The heat sink according to claim 7, wherein: An average interval between adjacent second holes is larger than an average interval between adjacent first holes.

9. The heat sink according to claim 8, wherein: The film layer comprises polyethylene terephthalate, The heat dissipation layer includes a carbon material.

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