Liquid Cooling Heat Dissipation Device, Liquid Cooling Electronic Equipment

Abstract

The present application discloses a liquid cooling heat dissipation device, a liquid-cooled electronic device, and a liquid-cooled virtual currency mining machine. The liquid cooling heat dissipation device includes a housing unit, which has a first side end and a second side end. Then, a first accommodation space in the housing unit is close to the first side end where the opening is located, and a flow rate adjustment unit is provided at the first side end. The flow rate adjustment unit is provided with a flow rate adjustment hole. The substrate unit of the operation module is placed in the above-mentioned first accommodation space. The flow rate adjustment unit is arranged corresponding to the first surface area of the substrate unit, and heat generating elements are provided on the first surface of the substrate unit. In this way, the flow rate adjustment unit can adjust the heat dissipation efficiency of the coolant for the first surface and the second surface of the substrate unit, thereby solving the technical problems of easy occurrence of local overheating and poor liquid cooling heat dissipation effect caused by the structure of the existing electronic device, achieving the technical effect of targeted liquid cooling heat dissipation for the operation module, and improving the liquid cooling heat dissipation efficiency and uniformity.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid cooling heat dissipation for electronic devices, and particularly to a liquid cooling heat dissipation device and a liquid-cooled electronic device. Background Art

[0002] With the continuous development of technology, electronic devices are constantly updated, and the amount of data they process is increasing, and the computing density is getting higher. In order to ensure stable operation, it is necessary to continuously improve their heat dissipation capacity.

[0003] Currently, air cooling heat dissipation technology is no longer applicable to high-power density electronic devices, and liquid cooling heat dissipation technology has gradually become the mainstream. There are two liquid cooling heat dissipation methods in existing liquid cooling heat dissipation technology. One is to install a liquid cooling plate on the electronic device, and the other is to directly immerse the electronic device in the coolant; among them, for immersion liquid cooling heat dissipation, existing technical solutions mostly directly remove the fan of the original air-cooled electronic device and then directly immerse it in the coolant flowing in a bottom-up cycle.

[0004] However, it is found that in the above solutions, after removing the fan, the structure of the electronic device is not suitable for immersion liquid cooling heat dissipation. For example, local overheating is likely to occur, affecting the heat dissipation efficiency and resulting in poor heat dissipation effect. Summary of the Invention

[0005] An embodiment of the present application provides a liquid cooling heat dissipation device and a liquid-cooled electronic device. The liquid cooling heat dissipation device includes a housing unit, the housing unit has a first side end and a second side end. Then, a first accommodation space in the housing unit is close to the first side end where the opening is provided, and a flow rate adjustment unit is further provided at the first side end, and a flow rate adjustment hole is provided on the flow rate adjustment unit; the substrate unit of the operation module is placed in the above first accommodation space, the flow rate adjustment unit is arranged corresponding to the first surface area of the substrate unit, and heat generating elements are provided on the first surface of the substrate unit; thus, when the housing unit is placed in the coolant flowing from bottom to top with the first side end facing down and the second side end facing up, the flow rate adjustment unit can adjust the flow rate of the coolant flowing through the first surface and the second surface of the substrate unit; that is, the flow rate adjustment unit can adjust the heat dissipation efficiency of the coolant for the first surface and the second surface of the substrate unit;

[0006] That is to say, according to the different heat transfer performances of the substrate units in the operation module, the liquid cooling heat dissipation device of the embodiment of the present application can adjust the size of the flow rate adjustment hole, and then adjust the flow rate of the coolant flowing through the first surface and the second surface of the substrate unit, so as to perform targeted liquid cooling heat dissipation on the operation module, solve the technical problems of local overheating and poor liquid cooling heat dissipation caused by the structure of the existing electronic device, and achieve the technical effects of targeted liquid cooling heat dissipation on the operation module, improving the liquid cooling heat dissipation efficiency and uniformity.

[0007] An embodiment of the present application provides a liquid cooling device, which includes:

[0008] A housing unit, which has a first side end and a second side end arranged oppositely, and the first side end is open;

[0009] A first accommodation space, which is arranged inside the housing unit and is used for arranging an operation module, and the first accommodation space is close to the first side end;

[0010] A flow rate adjustment unit, which is installed at the first side end;

[0011] Wherein, the operation module includes a substrate unit, the substrate unit has a first surface and a second surface that extend in the direction from the first side end to the second side end and are arranged oppositely, and a heating element is provided on the first surface;

[0012] At the first side end, the flow rate adjustment unit is arranged corresponding to the first surface area, and a flow rate adjustment hole is provided on the flow rate adjustment unit, so that when the coolant flows from the first side end to the second side end, the flow rate of the coolant flowing through the first surface and the second surface is adjusted.

[0013] In a disclosed embodiment, in the first accommodation space, a plurality of the operation modules are stacked; and for the first surface area of each operation module, a corresponding flow rate adjustment unit is provided at the first side end.

[0014] In a disclosed embodiment, a first radiator is provided on the first surface, a second radiator is provided on the second surface, the heat dissipation fins of the first radiator and the second radiator extend in the direction from the first side end to the second side end, and the flow rate adjustment unit covers the height of the heat dissipation fins of the first radiator.

[0015] In a disclosed embodiment, the operation module is installed in the first accommodation space through a fixed guide rail; the fixed guide rail is fixed to the housing unit through a fixing hole; wherein,

[0016] The fixed guide rail is provided with a guide post in a first direction, and the second radiator is provided with a guide groove in the first direction; or,

[0017] The fixed guide rail is provided with a guide groove in the first direction, and the second radiator is provided with a guide post in the first direction;

[0018] The guide groove is for the guide post to be inserted, and the first direction is the direction from the first side end to the second side end.

[0019] In an open embodiment, the first end of the second radiator close to the first side end and the second end far from the first side end are respectively fixedly connected inside the housing unit through a first mounting plate and a second mounting plate; wherein,

[0020] Both ends of the first mounting plate are fixedly connected to the housing unit through first mounting holes, and the first mounting plate is further provided with first connection holes connected to the first end of the second radiator;

[0021] Both ends of the second mounting plate are fixedly connected to the housing unit through second mounting holes, and the second mounting plate is further provided with second connection holes connected to the second end of the second radiator.

[0022] In an open embodiment, the flow rate adjustment unit includes a flow rate adjustment plate and the first mounting plate integrally arranged, wherein the flow rate adjustment plate is provided with the flow rate adjustment holes, the flow rate adjustment plate is parallel to the first side end, and the first mounting plate and the flow rate adjustment plate are vertically bent.

[0023] In an open embodiment, a second accommodation space is further provided inside the housing unit, the second accommodation space is communicated with the first accommodation space, the second accommodation space is close to the second side end, and the second accommodation space is used for arranging a power module and a control module; wherein, the power module is electrically connected to the operation module through a transfer copper bar, and the control module is electrically connected to the operation module through a control line.

[0024] In an open embodiment, a power supply connector electrically connected to the power module and a communication connector electrically connected to the control module are provided at the second side end, wherein the power supply connector and the communication connector are respectively located at both ends of the second side end.

[0025] The embodiment of the present application further provides a liquid-cooled electronic device, which includes a liquid-cooled heat dissipation device and an operation module placed inside the liquid-cooled heat dissipation device, wherein the liquid-cooled heat dissipation device is the above-mentioned liquid-cooled heat dissipation device.

[0026] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0027] In the embodiment of the present application, the liquid cooling heat dissipation device includes a housing unit. The housing unit has a first side end and a second side end. Then, a first accommodation space in the housing unit is close to the first side end where the opening is located. A flow rate adjustment unit is further provided at the first side end. The flow rate adjustment unit is provided with a flow rate adjustment hole for the coolant to flow through. The substrate unit of the operation module is placed in the above-mentioned first accommodation space. The flow rate adjustment unit is arranged corresponding to the first surface area of the substrate unit. Heat generating elements are provided on the first surface of the substrate unit. In this way, when the above-mentioned housing unit is placed in the coolant flowing from bottom to top with the first side end facing down and the second side end facing up, the flow rate adjustment unit can adjust the flow rate of the coolant flowing through the first surface and the second surface. That is, the flow rate adjustment unit can adjust the heat dissipation efficiency of the coolant for the first surface and the second surface.

[0028] That is to say, according to the difference in heat on the first surface and the second surface of the substrate unit, the liquid cooling heat dissipation device of the embodiment of the present application can adjust the size of the flow rate adjustment hole, and then adjust the flow rate of the coolant flowing through the first surface and the second surface, so as to perform targeted liquid cooling heat dissipation on the operation module, improving the efficiency and uniformity of liquid cooling heat dissipation. Description of the Drawings

[0029] Figure 1 It is a schematic structural diagram of the liquid cooling heat dissipation device described in the embodiment of the present application.

[0030] Figure 2 It is a schematic internal structural diagram of the liquid cooling heat dissipation device described in the embodiment of the present application.

[0031] Figure 3 It is a schematic structural diagram of the liquid cooling heat dissipation device described in the embodiment of the present application placed in the cooling device.

[0032] Figure 4 It is a schematic structural diagram of the fixed guide rail described in the embodiment of the present application.

[0033] Figure 5 It is a schematic installation structural diagram of the first radiator and the second radiator described in the embodiment of the present application.

[0034] Figure 6 It is a schematic structural diagram of the second mounting plate described in the embodiment of the present application.

[0035] Figure 7 It is a schematic structural diagram of the flow rate adjustment unit described in the embodiment of the present application.

[0036] Reference Signs

[0037] 10 - Housing unit, 11 - First side end, 12 - Second side end, 13 - Housing, 14 - Top cover, 15 - Fixed guide rail, 16 - First mounting plate, 17 - Second mounting plate, 18 - Adapter copper bar, 19 - Control line,

[0038] 111 - Power supply connector, 112 - Communication connector,

[0039] 151 - Guide post, 152 - Fixed hole,

[0040] 161 - First mounting hole, 162 - First connection hole,

[0041] 171 - Second mounting hole, 172 - Second connection hole, 173 - Cable tie hole,

[0042] 21 - First accommodation space, 22 - Second accommodation space,

[0043] 30 - Operation module, 31 - Substrate unit, 32 - Heating element, 33 - First radiator, 34 - Second radiator, 35 - Heat dissipation fin,

[0044] 341 - Guide groove,

[0045] 40 - Flow rate adjustment unit, 41 - Flow rate adjustment plate, 42 - Flow rate adjustment hole,

[0046] 50 - Power supply module, 60 - Control module,

[0047] 90 - Cooling device, 91 - Coolant inlet, 92 - Coolant outlet,

[0048] A - First direction, B - Second direction. Detailed implementation manner

[0049] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings of the specification and specific implementation manners.

[0050] The embodiment of the present application provides a liquid cooling and heat dissipation device, which includes a housing unit 10, a first accommodation space 21 and a flow rate adjustment unit 40 provided in the housing unit 10. The housing unit 10 has a first side end 11 and a second side end 12 arranged opposite to each other, and the first side end 11 is open; the first accommodation space 21 is arranged inside the housing unit 10, and the first accommodation space 21 is used to arrange the operation module 30, and the first accommodation space 21 is close to the first side end 11; the flow rate adjustment unit 40 is installed at the first side end 11; wherein, the operation module 30 includes a substrate unit 31, and the substrate unit 31 has a direction from the first side end to the second side end ( Figure 1A direction), and the first surface and the second surface are oppositely arranged, and a heating element 32 is provided on the first surface; at the first side end 11, the flow rate adjusting unit 40 is arranged corresponding to the first surface area, and a flow rate adjusting hole 42 is provided on the flow rate adjusting unit 40, so that when the coolant flows from the first side end 11 to the second side end 12, the flow rate of the coolant flowing through the first surface and the second surface is adjusted.

[0051] It should be noted that, referring to Figure 3 , the liquid cooling heat dissipation device in the embodiment of the present application is internally loaded with an operation module 30, and the operation module 30 is an electronic device that requires liquid cooling heat dissipation, such as a calculation example board, a chip board, etc. Then, the liquid cooling heat dissipation device as a whole is placed in the cooling device 90. The lower end of the cooling device 90 has a coolant inlet 91, and the upper end has a coolant outlet 92. The coolant circulates under the action of an external power pump, and the liquid level of the coolant in the cooling device 90 submerges the liquid cooling heat dissipation device; in this way, inside the cooling device, the coolant flows from bottom to top, that is, the coolant flows from the lower end of the liquid cooling heat dissipation device to the upper end, so that the circulating coolant continuously exchanges heat with electronic devices such as calculation example boards, realizing liquid cooling heat dissipation of the electronic devices; it can be understood that the coolant should be an electrically insulating coolant, such as insulating oil substances, fluorinated liquids, etc.

[0052] Referring to Figure 1 , 2 , 5, in this embodiment, the liquid cooling heat dissipation device includes a housing unit 10, and the housing unit 10 is, for example, in the shape of a cuboid. The housing unit 10 has opposite first side ends 11 and second side ends 12, and the first side end 11 is an open setting; then, a first accommodation space 21 close to the first side end 11 is provided inside the housing unit 10, and the first accommodation space 21 is used to place the operation module 30, such as a calculation example board, a chip board, etc.; among them, referring to Figure 5 , the operation module 30 includes a substrate unit 31, and the substrate unit 31 has opposite first and second surfaces. The first surface is the surface of the substrate unit that faces upward in Figure 1 and faces left in Figure 5 , and the second surface is the surface of the substrate unit that faces downward in Figure 1 and faces right in Figure 5 ; when the substrate unit 31 is placed in the first accommodation space 21, the first surface and the second surface are placed extending in the direction from the first side end to the second side end ( Figure 1 A direction in Figure 3 , the first side end 11 of the housing unit 10 is placed downward and the second side end 12 is placed upward in the above-mentioned cooling device 90, and the second side end 12 of the housing unit 10 is submerged by the coolant.

[0053] At this time, at the first side end 11 described above, it is easy to understand that the substrate unit 31 divides the coolant, that is, part of the coolant flows through the first surface area to conduct liquid cooling heat dissipation on the first surface, and part of the coolant flows through the second surface area to conduct liquid cooling heat dissipation on the second surface; meanwhile, in this embodiment, a heating element 32 is provided on the first surface. Then, in combination with Figure 2 , a flow rate adjustment unit 40 is provided at a position corresponding to the first surface area at the first side end 11, and a flow rate adjustment hole 42 is provided on the flow rate adjustment unit 40; in this way, the flow rate adjustment unit 40 has a blocking effect on the coolant flowing through the first surface, and the coolant can only pass through the flow rate adjustment hole 42; that is, in this embodiment, by providing the flow rate adjustment unit 40 at a position corresponding to the first surface of the first side end 11 of the housing unit 10, the flow rate adjustment hole 42 on the flow rate adjustment unit 40 can adjust the flow rate of the coolant flowing through the first surface of the substrate unit, and further adjust the heat dissipation efficiency of the coolant on the first surface and the second surface. That is, in this embodiment, according to the different heats of the first surface and the second surface of the substrate unit, targeted liquid cooling heat dissipation can be performed on the arithmetic module, improving the liquid cooling heat dissipation efficiency and uniformity.

[0054] For example, when the substrate unit of the arithmetic module is a common PCB board, the heats of the first surface and the second surface of the substrate unit are quite the same. At this time, the size of the flow rate adjustment hole 42 can be increased to reduce the resistance of the coolant flowing through the first surface, so that the flow rates of the coolant flowing through the first surface and the second surface are quite the same; when the substrate unit of the arithmetic module is made of aluminum, since the heat transfer performance of the aluminum material is relatively strong, therefore, the heat of the second surface of the substrate unit without the heating element is much greater than that of the first surface. At this time, the size of the flow rate adjustment hole 42 can be reduced to increase the resistance of the coolant flowing through the first surface, that is, to make the coolant tend to flow through the second surface, thereby increasing the heat dissipation efficiency of the second surface and preventing local overheating caused by untimely heat dissipation of the second surface.

[0055] In the embodiment of the present application, the liquid cooling heat dissipation device includes a housing unit, the housing unit has a first side end and a second side end. Then, the first accommodation space in the housing unit is close to the first side end where the opening is provided, and a flow rate adjustment unit is further provided at the first side end, and a flow rate adjustment hole for the coolant to flow through is provided on the flow rate adjustment unit; the substrate unit of the arithmetic module is placed in the above-mentioned first accommodation space, the flow rate adjustment unit is provided corresponding to the first surface area of the substrate unit, and a heating element is provided on the first surface of the substrate unit; in this way, when the above-mentioned housing unit is placed in the coolant flowing from bottom to top with the first side end facing down and the second side end facing up, the flow rate adjustment unit can adjust the flow rates of the coolant flowing through the first surface and the second surface; that is, the flow rate adjustment unit can adjust the heat dissipation efficiency of the coolant on the first surface and the second surface;

[0056] That is to say, according to the difference in heat of the first surface and the second surface of the substrate unit, the liquid cooling device according to the embodiment of the present application can adjust the size of the flow adjustment holes, and then adjust the flow rate of the coolant flowing through the first surface and the second surface, so as to perform targeted liquid cooling on the arithmetic module, improve the efficiency and uniformity of liquid cooling, and prevent local overheating.

[0057] In a possible implementation manner, in the first accommodation space 21, a plurality of arithmetic modules 30 are stacked; and, corresponding to the first surface area of each arithmetic module 30, a corresponding flow rate adjustment unit 40 is provided at the first side end 11.

[0058] That is, a plurality of arithmetic modules 30 can be stacked in a second direction ( Figure 2 direction B in the figure) perpendicular to the first direction. At this time, it can be understood that the first surface area of each arithmetic module 30 should be correspondingly provided with the flow rate adjustment unit 40; that is to say, a plurality of flow rate adjustment units 40 are provided at intervals at the first side end 11, and each flow rate adjustment unit 40 corresponds to the first surface area of an arithmetic module 30; it can also be understood that the plurality of flow rate adjustment units 40 can be separately provided, or the plurality of flow rate adjustment units 40 are integrally provided.

[0059] In this embodiment, according to actual needs, a plurality of arithmetic modules can be stacked in the first accommodation space of the housing unit. At this time, the plurality of flow rate adjustment units can respectively adjust the flow rate of the coolant flowing through the first surface and the second surface of each substrate unit, so as to perform targeted liquid cooling on the plurality of arithmetic modules at the same time.

[0060] In a possible implementation manner, a first radiator 33 is provided on the first surface, a second radiator 34 is provided on the second surface, and the heat dissipation fins 35 of the first radiator 33 and the second radiator 34 extend in the direction from the first side end to the second side end. And, the flow rate adjustment unit 40 covers the height of the heat dissipation fins 35 of the first radiator 33.

[0061] Combined with Figure 5 , in order to further improve the heat dissipation efficiency, a first radiator 33 and a second radiator 34 can be fixedly provided on the first surface and the second surface respectively. Among them, as Figure 1 、 2 、shown in 5, the heat dissipation fins 35 of the two radiators should be arranged to extend in the direction from the first side end to the second side end (direction A). In this way, it can be ensured that the coolant flows from the first side end to the second side end from bottom to top. And, at the first side end 11, the flow rate adjustment unit 40 should cover the height of the heat dissipation fins 35 of the first radiator 33.

[0062] In this embodiment, a first heat sink and a second heat sink are respectively arranged on the first surface and the second surface. The heat dissipation fins of the two heat sinks increase the contact area with the coolant, thereby improving the heat exchange efficiency with the coolant and further enhancing the liquid cooling efficiency.

[0063] In a possible implementation manner, the operation module 30 is installed in the first accommodation space 21 through a fixed guide rail 15.

[0064] As described above, the operation module 30 is installed in the first accommodation space 21. In this embodiment, for example, a fixed guide rail 15 can be arranged in the first accommodation space 21, and then the operation module 30 is inserted into the fixed guide rail 15 to achieve fixed installation.

[0065] Specifically, in combination with Figure 4 , the fixed guide rail 15 is provided with a guide post 151 along the first direction (the direction from the first side end to the second side end). Further in combination with Figure 5 , both side ends of the second heat sink 34 are provided with guide grooves 341 along the first direction. In this way, for example, the fixed guide rail 15 can be respectively arranged at both side ends of the second heat sink 34, and the guide grooves 341 are for the guide posts 151 to be inserted, thereby realizing the connection between the fixed guide rail and the second heat sink; then, the fixed guide rail 15 is fixed to the housing unit 10 through a fixing hole 152, and thus the operation module 30 can be installed in the first accommodation space 21.

[0066] It can be understood that the positions of the above-mentioned guide post and guide groove can be interchanged, that is, the fixed guide rail is provided with a guide groove along the first direction, and the second heat sink is provided with a guide post along the first direction.

[0067] Among them, the first heat sink 33 and the second heat sink 34 can be fixedly connected to the substrate unit 31 through fixing screws or the like. Then, in this embodiment, by providing a guide groove or a guide post on the second heat sink 34, the substrate unit 31 is indirectly fixedly connected to the housing unit 10 through the second heat sink 34, and the second heat sink 34 corresponds to the side of the substrate unit 31 where the heating element 32 is not provided, avoiding adverse stress effects on the heating element 32.

[0068] In a possible implementation manner, a first end portion of the second heat sink 34 close to the first side end 11 and a second end portion far from the first side end 11 are respectively fixedly connected to the inside of the housing unit 10 through a first mounting plate 16 and a second mounting plate 17.

[0069] In combination with Figure 2 、 6 、7, that is, in this embodiment, the operation module 30 is limited and fixed in the first direction through the first mounting plate 16 and the second mounting plate 17.

[0070] Specifically, in combination withFigure 2 , 7 , both ends of the first mounting plate 16 are fixedly connected to the housing unit 10 through first mounting holes 161, and the first mounting plate 16 is further provided with first connection holes 162 connected to the first end of the second radiator 34; that is, the first mounting plate 16 is, for example, a rectangular plate, both ends of the first mounting plate 16 are provided with first bends, the first bends are fixedly connected to the housing unit 10 through the first mounting holes 161 opened thereon, and then, a plurality of first connection holes 162 are provided on one side of the first mounting plate 16 facing the first end of the second radiator 34, and first connection screws pass through the first connection holes 162 and are tightened to the first end of the second radiator 34, so that the second radiator 34 is fixedly connected to the inside of the housing unit 10 through the first mounting plate 16.

[0071] Similarly, in combination with Figure 2 , 6 , both ends of the second mounting plate 17 are fixedly connected to the housing unit 10 through second mounting holes 171, and the second mounting plate 17 is further provided with second connection holes 172 connected to the second end of the second radiator 34; that is, the second mounting plate 17 is, for example, a rectangular plate, both ends of the second mounting plate 17 are provided with second bends, the second bends are fixedly connected to the housing unit 10 through the second mounting holes 171 opened thereon, and then, a plurality of second connection holes 172 are provided on one side of the second mounting plate 17 facing the second end of the second radiator 34, and second connection screws pass through the second connection holes 172 and are tightened to the second end of the second radiator 34, so that the second radiator 34 is fixedly connected to the inside of the housing unit 10 through the second mounting plate 17.

[0072] In a possible implementation manner, the flow rate adjustment unit 40 includes a flow rate adjustment plate 41 and a first mounting plate 16 that are integrally provided, wherein, the flow rate adjustment plate 41 is provided with flow rate adjustment holes 42, the flow rate adjustment plate is parallel to the first side end, and the first mounting plate 16 and the flow rate adjustment plate 41 are vertically bent.

[0073] That is, in the embodiment of the present application, the first mounting plate 16 and the flow rate adjustment plate 41 are vertically and integrally provided, which simplifies the number of components and facilitates installation.

[0074] In a possible implementation manner, a second accommodation space 22 is further provided inside the housing unit 10, the second accommodation space 22 is communicated with the first accommodation space 21, the second accommodation space 22 is close to the second side end 12, and the second accommodation space 22 is used for arranging the power module 50 and the control module 60; wherein, the power module 50 is electrically connected to the operation module 30, and the control module 60 is electrically connected to the operation module 30.

[0075] In combination with Figure 1 , 2, the liquid cooling device of this embodiment can also carry a power module 50 that supplies power to the operation module 30 and a control module 60 that controls the operation of the operation module 30, that is, the liquid cooling device can also perform liquid cooling for the above-mentioned power module 50 and control module 60; wherein, for the convenience of external cable connection and maintenance, a second accommodation space 22 is provided inside the housing unit 10 near the second side end 12, the power module 50 and the control module 60 are arranged in the second accommodation space 22, and the power module 50 and the control module 60 are electrically connected to the operation module 30 respectively.

[0076] In a possible implementation manner, in combination with Figure 2 , the power module 50 is electrically connected to the operation module 30 through an adapter copper bar 18, and the control module 60 is electrically connected to the operation module 30 through a control line 19.

[0077] In a possible implementation manner, in combination with Figure 1 , a power supply connector 111 electrically connected to the power module 50 and a communication connector 112 electrically connected to the control module 60 are provided at the second side end 12, wherein the power supply connector 111 and the communication connector 112 are respectively located at both ends of the second side end 12; that is, in this embodiment, the power supply connector 111 and the communication connector 112 are respectively arranged at both ends of the second side end 12 to prevent mutual interference.

[0078] In addition, in combination with the above embodiment and Figure 6 , a wire tying hole 173 can also be provided on the second mounting plate 17, and the wire tying hole 173 is used to fix the cable connected to the operation module 30, which is convenient for wiring and is neat and beautiful.

[0079] The embodiment of the present application also discloses a liquid-cooled electronic device, which includes a liquid cooling device and an operation module placed inside the liquid cooling device, wherein the liquid cooling device is the above-mentioned liquid cooling device.

[0080] The basic principle of the present application has been described above in combination with specific embodiments. However, it should be noted that the advantages, advantages, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, advantages, effects, etc. are essential for each embodiment of the present application. In addition, the above-disclosed specific details are only for the purpose of illustration and easy understanding, rather than limitations, and the above details do not limit the present application to necessarily adopt the above specific details to implement.

[0081] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any way. Words such as "including," "comprising," "having," etc. are open-ended terms, meaning "including but not limited to," and can be used interchangeably with each other. The word "or" and "and" used herein refer to the phrase "and / or" and can be used interchangeably with it, unless the context clearly indicates otherwise. The phrase "such as" used herein refers to the phrase "such as but not limited to" and can be used interchangeably with it.

[0082] It should also be noted that in the devices, equipment, and methods of this application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of this application.

[0083] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

[0084] The above description has been presented for purposes of illustration and description. In addition, this description is not intended to limit the embodiments of this application to the form disclosed herein. Although several example aspects and embodiments have been discussed above, those skilled in the art will recognize that certain variations, modifications, alterations, additions, and sub-combinations thereof should be included within the scope of protection of the present invention.

Claims

1. A liquid cooling and heat dissipation device, characterized in that, The liquid cooling and heat dissipation device includes: A housing unit (10), the housing unit (10) having a first side end (11) and a second side end (12) arranged oppositely, and the first side end (11) is open; A first accommodation space (21), the first accommodation space (21) being arranged inside the housing unit (10), an operation module (30) being arranged in the first accommodation space (21), and the first accommodation space (21) being close to the first side end (11); A flow rate adjustment unit (40), the flow rate adjustment unit (40) being installed at the first side end (11); Wherein, the operation module (30) includes a substrate unit (31), the substrate unit (31) having a first surface and a second surface extending in the direction from the first side end (11) to the second side end (12) and arranged oppositely, and a heating element (32) being provided on the first surface; At the first side end (11), the flow rate adjustment unit (40) is arranged corresponding to the first surface area, and a flow rate adjustment hole (42) is provided on the flow rate adjustment unit (40), so that when the liquid cooling and heat dissipation device is placed in a cooling device (90) and the coolant covering the operation module (30) flows from the first side end (11) to the second side end (12), the flow rate adjustment unit is used to adjust the flow rate of the coolant flowing through the first surface and the second surface.

2. The liquid cooling and heat dissipation device according to claim 1, wherein, In the first accommodation space (21), a plurality of the operation modules (30) are stacked; and corresponding to the first surface area of each operation module (30), a corresponding flow rate adjustment unit (40) is provided at the first side end (11).

3. The liquid cooling and heat dissipation device according to any one of claims 1 and 2, characterized in that The first surface is provided with a first radiator (33), the second surface is provided with a second radiator (34), the heat dissipation fins (35) of the first radiator (33) and the second radiator (34) extend in the direction from the first side end (11) to the second side end (12), and the flow rate adjustment unit (40) covers the height of the heat dissipation fins (35) of the first radiator (33).

4. The liquid cooling and heat dissipation device according to claim 3, wherein, The operation module (30) is installed in the first accommodation space (21) through a fixed guide rail (15); the fixed guide rail (15) is fixed to the housing unit (10) through a fixing hole (152); wherein, The fixed guide rail (15) is provided with a guide post (151) in a first direction, and the second radiator (34) is provided with a guide groove (341) in the first direction; or, The fixed guide rail (15) is provided with a guide groove (341) in the first direction, and the second radiator (34) is provided with a guide post (151) in the first direction; The guide groove (341) is for the guide post (151) to be inserted, and the first direction is the direction from the first side end (11) pointing to the second side end (12).

5. The liquid cooling and heat dissipation device according to claim 3, wherein, The first end of the second radiator (34) close to the first side end (11) and the second end away from the first side end (11) are respectively fixedly connected to the inside of the housing unit (10) through a first mounting plate (16) and a second mounting plate (17); wherein, Both ends of the first mounting plate (16) are fixedly connected to the housing unit (10) through first mounting holes (161), and a first connection hole (162) for connecting to the first end of the second radiator (34) is further provided on the first mounting plate (16); Both ends of the second mounting plate (17) are fixedly connected to the housing unit (10) through second mounting holes (171), and a second connection hole (172) for connecting to the second end of the second radiator (34) is further provided on the second mounting plate (17).

6. The liquid cooling and heat dissipation device according to claim 5, wherein, The flow rate adjustment unit (40) includes an integrally provided flow rate adjustment plate (41) and the first mounting plate (16), wherein a flow rate adjustment hole (42) is provided on the flow rate adjustment plate (41), the flow rate adjustment plate (41) is parallel to the first side end (11), and the first mounting plate (16) and the flow rate adjustment plate (41) are perpendicularly bent.

7. The liquid cooling heat dissipation device according to claim 1, characterized in that A second accommodation space (22) is further provided inside the housing unit (10), the second accommodation space (22) is communicated with the first accommodation space (21), the second accommodation space (22) is close to the second side end (12), and the second accommodation space (22) is used for arranging a power module (50) and a control module (60); wherein, the power module (50) is electrically connected to the operation module (30) through a transfer copper bar (18), and the control module (60) is electrically connected to the operation module (30) through a control line (19).

8. The liquid cooling and heat dissipation device according to claim 7, characterized in that, A power supply connector (111) electrically connected to the power module (50) and a communication connector (112) electrically connected to the control module (60) are provided on the second side end (12), wherein the power supply connector (111) and the communication connector (112) are respectively located at both ends of the second side end (12).

9. A liquid-cooled electronic device, characterized in that, The liquid-cooled electronic device includes a liquid-cooled heat dissipation device, and the liquid-cooled heat dissipation device is the liquid-cooled heat dissipation device according to any one of claims 1 to 8.

Images