Display device

Abstract

An embodiment of the present disclosure provides a display device, comprising: a substrate; a thin film transistor located on the substrate; a first electrode electrically connected to the thin film transistor; a light-emitting layer and a second electrode overlapping the first electrode; a first partition wall located between the first electrode and the second electrode; and a second partition wall overlapping the first partition wall, wherein the first partition wall comprises at least one of a black pigment and a black dye, wherein the second partition wall comprises an organic insulating material, and wherein a portion of the second partition wall overlaps the first electrode.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0042015 filed on April 10, 2019, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to a display device. Background Art

[0003] The light emitting display device includes two electrodes and a light emitting layer positioned therebetween. Electrons injected from a cathode as one electrode and holes injected from an anode as the other electrode combine with each other in the light emitting layer to generate excitons, which emit energy to emit light.

[0004] The light emitting display device includes a plurality of pixels including a light emitting diode, the light emitting diode including a cathode, an anode and a light emitting layer, and each pixel includes a plurality of transistors and capacitors for driving the light emitting diode.

[0005] The above information disclosed in this Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute the prior art. Summary of the invention

[0006] The present disclosure describes a display device which is excellent in stability with respect to external light exposure and in which defects such as dark spots are controlled.

[0007] An embodiment of the present disclosure provides a display device, comprising: a substrate; a thin film transistor located on the substrate; a first electrode electrically connected to the thin film transistor; a light-emitting layer and a second electrode overlapping the first electrode; a first partition wall located between the first electrode and the second electrode; and a second partition wall overlapping the first partition wall, wherein the first partition wall comprises at least one of a black pigment and a black dye, wherein the second partition wall comprises an organic insulating material, and wherein a portion of the second partition wall overlaps the first electrode.

[0008] An end portion of the second partition wall may contact the first electrode, wherein a width of a region where the second partition wall and the first electrode contact each other is about 2 micrometers or more.

[0009] The second partition wall may include a first region and a second region having different thicknesses.

[0010] The display device may further include an encapsulation layer on the second electrode, wherein the second region supports the encapsulation layer.

[0011] The first electrode may include a first layer, a second layer, and a third layer, wherein each of the first layer and the third layer includes ITO, IZO, ZnO, In2 O 3 , IGO or AZO, wherein the second layer comprises Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a mixture thereof.

[0012] A surface of the first electrode may define a groove exposing the second layer.

[0013] The display device may further include a third partition wall located on the second partition wall.

[0014] The second partition wall may be located on the first electrode, wherein the first partition wall is located on the second partition wall.

[0015] The second partition wall may include a first region and a second region having different thicknesses.

[0016] The first partition wall may be located on an upper surface of the second partition wall.

[0017] The first partition wall may overlap an upper surface and both side surfaces of the second partition wall.

[0018] The display device may further include a third partition wall located on the first partition wall.

[0019] The third partition walls and the second partition walls may include the same material.

[0020] The third partition wall may contact an upper surface of the second partition wall.

[0021] The display device may further include an insulating layer between the thin film transistor and the first electrode, wherein the first partition wall and the second partition wall contact the insulating layer.

[0022] The first partition wall may be spaced apart from the first electrode.

[0023] Another embodiment of the present disclosure provides a display device, which includes: a substrate; a thin film transistor located on the substrate; a first electrode connected to the thin film transistor; an insulating layer located between the first electrode and the thin film transistor; a first partition wall and a second partition wall stacked with the insulating layer; and a light-emitting layer and a second electrode stacked with the first electrode, wherein an end of the second partition wall contacts an upper surface of the first electrode.

[0024] The amount of sulfur (S) in the first partition walls may be smaller than the amount of sulfur (S) in the second partition walls.

[0025] An amount of at least one of the black pigment and the black dye in the first partition walls may be greater than an amount of at least one of the black pigment and the black dye included in the second partition walls.

[0026] The second partition wall may include a first region and a second region having different thicknesses.

[0027] The display device may further include an encapsulation layer, wherein a thickness of the second region is greater than a thickness of the first region, and wherein the second region supports the encapsulation layer.

[0028] The light emitting layer may include quantum dots.

[0029] The second partition wall may contact a side surface of the first partition wall and an upper surface of the first electrode.

[0030] According to the described embodiments, a display device having high reliability with respect to external light and a low dark spot defect rate can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A cross-sectional view of a display device according to an embodiment is shown.

[0032] Figure 2 An enlarged view of a portion of a display device according to an embodiment is shown.

[0033] Figure 3 A cross-sectional view of a display device according to an embodiment is shown.

[0034] Figure 4 A cross-sectional view of a display device according to an embodiment is shown.

[0035] Figure 5 A cross-sectional view of a display device according to an embodiment is shown.

[0036] Figure 6 A cross-sectional view of a display device according to an embodiment is shown.

[0037] Figure 7 A cross-sectional view of a display device according to an embodiment is shown.

[0038] Figure 8 A cross-sectional view of a display device according to an embodiment is shown.

[0039] Fig. 9 A cross-sectional view of a display device according to an embodiment is shown.

[0040] Fig.10 A cross-sectional view of a display device according to an embodiment is shown.

[0041] Fig.11 A cross-sectional view of a display device according to an embodiment is shown.

[0042] Fig. 12A A graph showing the content of "S" according to the examples, Fig. 12B An EDS analysis image of the first partition wall and the second partition wall is shown.

[0043] Fig.13 TEM images of the first partition walls and the second partition walls are shown.

[0044] Fig.14 A graph showing the dark spot ratio relative to the width at which the first electrode overlaps the second barrier rib is shown. DETAILED DESCRIPTION

[0045] By referring to the detailed description of the embodiments and the accompanying drawings, the features of the inventive concept and the method for realizing the features can be more easily understood. Hereinafter, the embodiments will be described in more detail with reference to the accompanying drawings. However, the described embodiments can be implemented in various different forms and should not be interpreted as being limited to the embodiments shown here. On the contrary, these embodiments are provided as examples so that the present disclosure will be thorough and complete, and the aspects and features of the inventive concept will be fully conveyed to those skilled in the art. Therefore, the processes, elements and techniques that are unnecessary for a person of ordinary skill in the art to fully understand the aspects and features of the inventive concept may not be described.

[0046] Unless otherwise specified, the same reference numerals denote the same elements throughout the drawings and written description, and therefore, their description will not be repeated. In addition, parts not related to the description of the embodiments may not be shown to make the description clear. In the drawings, the relative sizes of elements, layers, and regions may be exaggerated for clarity.

[0047] Various embodiments are described herein with reference to cross-sectional views as schematic diagrams of embodiments and / or intermediate structures. In this way, changes in the shapes of the diagrams, such as those caused by manufacturing techniques and / or tolerances, will be expected. In addition, for the purpose of describing embodiments according to the concepts of the present disclosure, the descriptions of the specific structures or functions disclosed herein are merely illustrative. Therefore, the embodiments disclosed herein should not be interpreted as being limited to the shapes of the specifically shown areas, but rather include deviations in shapes caused by, for example, manufacturing. In addition, as will be appreciated by those skilled in the art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present disclosure.

[0048] In the detailed description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of the various embodiments. However, it is apparent that the various embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form to avoid making the various embodiments unnecessarily obscure.

[0049] It will be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the spirit and scope of the present disclosure, the first element, first component, first region, first layer or first part described below may be referred to as the second element, second component, second region, second layer or second part.

[0050] For ease of explanation, spatial relative terms such as "below", "below", "below", "below", "above", "on", etc. may be used here to describe the relationship between one element or feature and another (other) element or feature as shown in the drawings. It will be understood that, in addition to the orientation depicted in the drawings, the spatial relative terms are intended to include different orientations of the device in use or in operation. For example, if the device in the drawings is turned over, the element described as "below", "below" or "below" other elements or features will then be positioned as "above" the other elements or features. Therefore, the example terms "below" and "below" can include both the above and below orientations. The device can be positioned in addition (for example, rotated 90 degrees or at other orientations), and the spatial relative descriptors used here should be interpreted accordingly. Similarly, when a first part is described as being arranged "on" a second part, this means that the first part is arranged at the upper or lower side of the second part, and is not limited to the upper side of the second part based on the direction of gravity.

[0051] It will be understood that when an element, layer, region or component is referred to as "on" another element, layer, region or component, "connected to" another element, layer, region or component or "coupled to" another element, layer, region or component, the element, layer, region or component may be directly on, directly connected to or directly coupled to the other element, layer, region or component, or one or more intermediate elements, intermediate layers, intermediate regions or intermediate components may be present. However, "directly connected to / directly coupled to" means that a component is directly connected or directly coupled to another component without intermediate components. Meanwhile, other expressions describing the relationship between components such as "between...", "directly between..." or "adjacent to..." and "directly adjacent to..." may be similarly interpreted. In addition, it will also be understood that when an element or layer is referred to as "between" two elements or layers, it may be the only element or only layer between the two elements or layers, or one or more intermediate elements or intermediate layers may also be present.

[0052] For the purposes of this disclosure, when a statement such as "at least one of..." is located after a list of elements, it modifies the entire list of elements rather than the individual elements in the list. For example, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. The same reference numerals always represent the same element. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0053] The terms used herein are only for the purpose of describing specific embodiments, and are not intended to limit the present disclosure. As used herein, the singular forms "one", "one (person / kind)" are also intended to include plural forms, unless the context clearly indicates otherwise. It will also be understood that when the terms "include", "have" and "comprise" and their variations are used in this specification, the descriptions indicate the presence of the features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their groups. As used herein, the term "and / or" includes any and all combinations of one or more related listed items.

[0054] As used herein, the terms "substantially", "approximately", "approximately" and similar terms are used as approximate terms rather than as terms of degree, and are intended to explain the inherent deviations of measured or calculated values ​​that will be recognized by those of ordinary skill in the art. Taking into account the errors associated with the measurements mentioned and the measurements of specific quantities (i.e., the limitations of the measurement system), "approximately" or "approximately" as used herein include the values ​​and mean within the range of acceptable deviations of the specific values ​​as determined by those of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the value. In addition, when describing embodiments of the present disclosure, the use of "can" means "one or more embodiments of the present disclosure".

[0055] In addition, any numerical range disclosed and / or stated herein is intended to include all sub-ranges of the same numerical precision included in the stated range. For example, the range "1.0 to 10.0" is intended to include all sub-ranges between the stated minimum value 1.0 and the stated maximum value 10.0 (and including the stated minimum value 1.0 and the stated maximum value 10.0), that is, having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as 2.4 to 7.6 as an example. Any maximum numerical limit stated here is intended to include all lower numerical limits included therein, and any minimum numerical limit stated in this specification is intended to include all higher numerical limits included therein. Therefore, the applicant reserves the right to modify this specification (including claims) to explicitly state any sub-ranges included in the scope explicitly stated here. All such ranges are intended to be inherently described in this specification so that the modification of any such sub-ranges explicitly stated will meet the requirements.

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the inventive concept belongs. It will also be understood that terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or in this specification, and should not be interpreted as an idealized or overly formal meaning, unless explicitly defined as such herein.

[0057] Furthermore, throughout the specification, the phrase "on a plane" means viewing a target portion from the top, and the phrase "on a cross section" means viewing a cross section formed by vertically cutting the target portion from the side.

[0058] In the following, reference will be made to Figure 1 and Figure 2 A display device according to an embodiment will be described. Figure 1 shows a cross-sectional view of a display device according to an embodiment, Figure 2 An enlarged view of a portion of a display device according to an embodiment is shown.

[0059] First, refer to Figure 1 The substrate 110 may include a transparent glass substrate, or may include a substrate in which plastic layers and barrier layers are alternately stacked. The substrate 110 according to the present embodiment may be a flat substrate or may be a flexible substrate that is bendable, foldable, or rollable.

[0060] The buffer layer 111 is positioned on the substrate 110. The buffer layer 111 may reduce or prevent diffusion of impurities, etc. from the substrate 110 toward the inside of the display device. In addition, when the surface of the substrate 110 is uneven, the buffer layer 111 may improve the flatness of the surface of the substrate 110.

[0061] The buffer layer 111 may include an inorganic insulating material or an organic insulating material such as silicon oxide, silicon nitride, etc. The buffer layer 111 may be a single layer or a multilayer. For example, when the buffer layer 111 is a double layer, its lower layer may include silicon nitride and its upper layer may include silicon oxide, but the present disclosure is not limited thereto.

[0062] The semiconductor layer 130 is positioned on the buffer layer 111. The semiconductor layer 130 may include amorphous silicon, polycrystalline silicon, an oxide semiconductor, etc., but is not limited thereto.

[0063] The semiconductor layer 130 may include a source region 132 connected to the source electrode 153, a drain region 133 connected to the drain electrode 155, and a channel region 131 positioned between the source region 132 and the drain region 133, which will be described later. The source region 132 and the drain region 133 may be doped with impurities, respectively.

[0064] The first insulating layer 141 is positioned on the semiconductor layer 130 and the buffer layer 111. The first insulating layer 141 may include an inorganic insulating material such as silicon nitride, silicon oxide, metal oxide, etc., or may include an organic insulating material. The first insulating layer 141 may be a single film or a plurality of films.

[0065] The gate electrode 124 is positioned on the first insulating layer 141. The gate electrode 124 overlaps the channel region 131 of the semiconductor layer 130.

[0066] The gate electrode 124 may include at least one of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu). The gate electrode 124 may include a single film or a plurality of films.

[0067] The second insulating layer 142 may be positioned on the gate electrode 124 and the first insulating layer 141. The second insulating layer 142 may include an inorganic insulating material such as silicon nitride, silicon oxide, or metal oxide, or may include an organic insulating material.

[0068] The source electrode 153 and the drain electrode 155 may be positioned on the second insulating layer 142 .

[0069] The source electrode 153 and the drain electrode 155 may include at least one of aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu). The source electrode 153 and the drain electrode 155 may include a single film or a plurality of films.

[0070] Each of the source electrode 153 and the drain electrode 155 may be connected to the source region 132 and the drain region 133 of the semiconductor layer 130 , respectively, through the contact holes of the first insulating layer 141 and the second insulating layer 142 .

[0071] The third insulating layer 160 is positioned on the source electrode 153 and the drain electrode 155. The third insulating layer 160 may cover the source electrode 153 and the drain electrode 155 to planarize them or provide a flat layer thereon. The third insulating layer 160 may include an organic insulating material or an inorganic insulating material. The third insulating layer 160 may be a single film or a plurality of films.

[0072] The first electrode 191 is positioned on the third insulating layer 160. The first electrode 191 may be connected to the drain electrode 155 through a contact hole of the third insulating layer 160.

[0073] The first electrode 191 may be a transparent electrode, a transflective electrode, or a reflective electrode. When the first electrode 191 is a transparent electrode or a transflective electrode, as an example, the first electrode 191 may be made of ITO, IZO, ZnO, In 2 O 3 When the first electrode 191 is a reflective electrode, the first electrode 191 may include a reflective film including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a mixture thereof and a reflective film including ITO, IZO, ZnO, In 2 O 3 , IGO or AZO. However, the first electrode 191 is not limited thereto, and the first electrode 191 may include various materials and may have a differently modified structure such as a single-layer structure or a multi-layer structure. The first electrode 191 according to the present embodiment may have a three-layer structure, and may have a multi-layer structure in which ITO, Ag, and ITO are sequentially stacked.

[0074] The partition wall 360 may be positioned on the first electrode 191 and on the third insulating layer 160. The partition wall 360 includes an opening portion 365 exposing a portion of the first electrode 191. The light emitting layer 370 may be positioned in the opening portion 365. The exposed region not covered by the partition wall 360 may be a light emitting region, and the region where the partition wall 360 is positioned may be a non-light emitting region.

[0075] The partition wall 360 may include a first partition wall 361 and a second partition wall 362. The size of the first opening portion 365a of the first partition wall 361 and the size of the second opening portion 365b of the second partition wall 362 may be different. The plane size of the first opening portion 365a of the first partition wall 361 may be larger than the plane size of the second opening portion 365b of the second partition wall 362. The side surface of the first opening portion 365a may contact the second partition wall 362. The end of the second partition wall 362 may contact the upper surface 191p of the first electrode 191 while covering the end of the first partition wall 361.

[0076] The first partition wall 361 may overlap a portion of the first electrode 191. According to an embodiment, the first partition wall 361 may overlap an end portion of the first electrode 191, and the first partition wall 361 may be positioned on the third insulating layer 160. The first partition wall 361 may be positioned between the third insulating layer 160 and the second partition wall 362. For example, the first partition wall 361 may contact the third insulating layer 160.

[0077] The first partition wall 361 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide, but is not limited thereto. In addition, the first partition wall 361 may further include a photoinitiator, etc. The first partition wall 361 may be formed by using a negative photosensitive resin composition.

[0078] The first partition wall 361 according to the present embodiment may include at least one of a black pigment and a black dye. The black pigment according to the present embodiment may include black pigment particles for absorbing external light, and may include a dispersant bonded to the black pigment particles, but is not limited thereto, and may include only black pigment particles in which the dispersant is omitted. In addition, the black dye according to the present embodiment may include black dye particles for absorbing external light and a dispersant bonded to the black dye particles, but is not limited thereto, and may include only black dye particles in which the dispersant is omitted.

[0079] The first partition wall 361 may absorb external light and / or may reduce or prevent light leakage. For example, the first partition wall 361 including at least one of a black pigment and a black dye reduces or prevents external light from penetrating into the third insulating layer 160, thereby reducing or preventing out-gassing in the third insulating layer 160, etc. Otherwise, when out-gassing occurs, oxidation of the first electrode 191, etc. may occur, thereby deteriorating the reliability of the display device.

[0080] In addition, the first partition wall 361 can reduce a phenomenon in which external light is reflected by a metal wiring such as a gate line or a data line and is regarded as light leakage. Therefore, the first partition wall 361 thereby improves the display quality of the display device.

[0081] The second partition wall 362 may be positioned on the first partition wall 361. The second partition wall 362 may overlap a portion of the first electrode 191.

[0082] The second partition wall 362 may include an organic insulating material such as an acrylic organic compound, polyimide, and / or polyamide. The second partition wall 362 may be made transparent by using, for example, a positive photosensitive resin composition, but is not limited thereto.

[0083] Unlike the first partition wall 361 , the second partition wall 362 may omit the black pigment and the black dye. Therefore, the amount of at least one of the black pigment and the black dye included in the first partition wall 361 may be greater than that of at least one of the black pigment and the black dye included in the second partition wall 362 .

[0084] The second partition wall 362 may include a compound represented by Chemical Formula 1. The compound represented by Chemical Formula 1 may include an SO bond. Therefore, the amount of sulfur (S) included in the second partition wall 362 may be greater than that included in the first partition wall 361.

[0085]

[0086] The second partition wall 362 may include a first region 362a and a second region 362b. The maximum thickness of the first region 362a (hereinafter, also referred to as the first thickness) is t a and the maximum thickness of the second region 362b (hereinafter, also referred to as the second thickness) t b In some embodiments, the maximum thickness t of the second region 362b is b The maximum thickness t of the first region 362a may be a at least twice as much.

[0087] The second region 362b of the second partition wall 362 may have a relatively thick thickness. The second region 362b may function as a spacer. The second partition wall 362 may have elasticity (eg, predetermined elasticity) and may support the encapsulation layer 400 described later.

[0088] The first region 362a and the second region 362b may be manufactured by the same process. For example, the region overlapping the second opening portion 365b may be manufactured by being exposed by the mask opening portion, the region overlapping the first region 362a may be manufactured by overlapping with the halftone mask, and the region overlapping the second region 362b may be manufactured by overlapping with the mask light blocking portion. The portion exposed by the mask opening portion may be eliminated to form the second opening portion 365b, and the region overlapping with the mask light blocking portion may be formed to have a second thickness tb The second region 362b of the half-tone mask may be formed with a first thickness t a In this case, the first thickness t of the region overlapping the halftone mask is a It can be changed according to the exposure amount. When the exposure amount increases, the first thickness t a However, even if the exposure amount increases, the second thickness t b It can also be constant.

[0089] According to the present embodiment, the thickness t of the first partition wall 361 is 1 The first thickness t of the second partition wall 362 may be about 0.5 micrometers to about 3 micrometers. a and the second thickness t b It may be about 0.3 micrometer to about 1 micrometer, and they may satisfy the above-mentioned conditions.

[0090] The second partition wall 362 may contact the upper surface 191p of the first electrode 191. The width of the region where the second partition wall 362 and the upper surface 191p of the first electrode 191 contact each other is referred to as a first width w1. The first width w1 may be about 2 micrometers or more. When the first width w1 is less than about 2 micrometers, the defect rate of the dark spot may be about 10% or more. In order to reduce the defect rate of the dark spot of the display device, the first width w1 may satisfy the above-mentioned value.

[0091] In the following, reference will be made to Figure 2 The embodiments are described more specifically.

[0092] Reference Figure 2 According to the present embodiment, the first electrode 191 may have a three-layer structure. The first electrode 191 may include a first layer 191a, a second layer 191b, and a third layer 191c. In this case, the first layer 191a and the third layer 191c may include ITO, IZO, ZnO, In 2 O 3 , at least one of IGO and AZO, and the second layer 191 b may include at least one of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and a mixture thereof.

[0093] The upper surface 191 p of the first electrode 191 formed of three layers may include a partially recessed groove A. The groove A may be a surface shape naturally formed in a process of forming the first electrode 191 .

[0094] The metal included in the second layer 191b grows through the groove A, for example, the metal grows in the first partition wall 361. Therefore, the metal included in the second layer 191b generates a Figure 2The metal defect B in the expanded state is shown in FIG. In addition, in other examples, the second layer 191 b exposed at the end of the first electrode 191 may also grow along the first partition wall 361 .

[0095] The display device according to the present embodiment includes a second partition wall 362 covering the first partition wall 361. The second partition wall 362 can reduce or prevent the growth of the above-mentioned metal defect B. Pixel defects can be reduced by controlling the metal defect B. The second partition wall 362 may include a compound represented by Chemical Formula 1, and the SO bond included in the compound may limit the growth of the metal defect B.

[0096] In the absence of the second partition wall 362, the metal defect B continues to grow, in which case a short circuit occurs when the metal defect B contacts the common electrode 270, or field concentration occurs in the corresponding region at the same time. The pixel including the metal defect B becomes a dark spot to cause a pixel defect.

[0097] Refer again Figure 1 , the light emitting layer 370 is positioned on the first electrode 191 exposed by the opening portion 365. The common electrode 270 as a second electrode overlapping the front surface of the substrate 110 is positioned on the light emitting layer 370 and the partition wall 360. The first electrode 191, the light emitting layer 370, and the common electrode 270 may form a light emitting diode.

[0098] The common electrode 270 may be a transparent electrode, a transflective electrode, or a reflective electrode. When the common electrode 270 is a transparent electrode or a transflective electrode, the common electrode 270 may include a layer containing a metal having a small work function (e.g., Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and / or a mixture thereof), and may include a layer such as ITO, IZO, ZnO, and / or In 2 O 3 A transparent layer or a transflective conductive layer. When the common electrode 270 is a reflective electrode, it may include, for example, a layer containing Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and / or a mixture thereof. The material and stacking structure of the common electrode 270 are not limited thereto, and various modifications thereof are possible.

[0099] Here, the first electrode 191 is an anode as a hole injection electrode, and the common electrode 270 is a cathode as an electron injection electrode. However, the present embodiment is not limited thereto, and the first electrode 191 may be a cathode, and the common electrode 270 may be an anode according to a driving method of the display device. Holes and electrons are injected from the first electrode 191 and the common electrode 270 into the light emitting layer 370, respectively, and excitons generated by the combination of the injected holes and electrons fall back from an excited state to a ground state to emit light.

[0100] Meanwhile, the light emitting layer 370 may include a low molecular weight organic material or a polymer organic material such as poly (3,4-ethylenedioxythiophene) (PEDOT). The light emitting layer 370 may include a multilayer including a light emitting layer and at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. When all of these layers are included, the hole injection layer is positioned on the first electrode 191 as an anode, and the hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer may be sequentially stacked thereon.

[0101] However, the present disclosure is not limited thereto, and the light emitting layer 370 may include a quantum dot material. The core of the quantum dot may be selected from II-VI compounds, III-V compounds, IV-VI compounds, IV elements, IV compounds, and / or combinations thereof.

[0102] The II-VI group compounds can be selected from: binary compounds selected from CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS and / or mixtures thereof; ternary compounds selected from CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZn Te, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS and / or mixtures thereof; and four-element compounds selected from HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe and / or mixtures thereof.

[0103] The III-V compounds can be selected from: binary compounds selected from GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb and / or mixtures thereof; ternary compounds selected from GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InPSb and / or mixtures thereof; and quaternary compounds selected from GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb and / or mixtures thereof.

[0104] The IV-VI group compounds can be selected from: two-element compounds selected from SnS, SnSe, SnTe, PbS, PbSe, PbTe and / or mixtures thereof; three-element compounds selected from SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe and / or mixtures thereof; and four-element compounds selected from SnPbSSe, SnPbSeTe, SnPbSTe and / or mixtures thereof.

[0105] The Group IV element may be selected from Si, Ge and / or mixtures thereof.

[0106] The Group IV compound may be a binary compound selected from SiC, SiGe and / or mixtures thereof.

[0107] In this case, the two-element compound, the three-element compound or the four-element compound may be present in the particle at a uniform concentration, or they may be divided into states with partially different concentrations and respectively present in the same particle. In addition, a core / shell structure in which some quantum dots surround other quantum dots may be possible. The interface between the core and the shell may have a concentration gradient in which the concentration of the element of the shell decreases toward its center.

[0108] In some embodiments, the quantum dot may have a core-shell structure including a core and a shell surrounding the core. The shell of the quantum dot may be used as a passivation layer for maintaining semiconductor properties and / or may be used as a charging layer for applying electrophoretic properties to the quantum dot by reducing or preventing chemical denaturation of the core. The shell may be a single layer or multiple layers. The interface between the core and the shell may have a concentration gradient in which the concentration of the element of the shell decreases near its center. Examples of shells of quantum dots include metal oxides or non-metal oxides, semiconductor compounds, or combinations thereof.

[0109] For example, the metal oxide or non-metal oxide may be SiO 2 、Al 2 O 3 、TiO 2 、ZnO、MnO、Mn 2 O 3 , Mn 3 O 4 , CuO, FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 , NiO, or binary compounds such as MgAl 2 O 4 、CoFe 2 O 4 、NiFe 2 O 4 、CoMn 2 O 4 The present invention may be a three-element compound of the type described above, but the present disclosure is not limited thereto.

[0110] In addition, the semiconductor compound may be CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, etc., but the present disclosure is not limited thereto.

[0111] The quantum dots may have a full width at half maximum (FWHM) of a light emission wavelength spectrum equal to or less than about 45 nm, equal to or less than about 40 nm, or equal to or less than about 30 nm, within which range the color purity or color reproducibility may be improved. In addition, since the light emitted by the quantum dots is emitted in all directions, the viewing angle of the light may be improved.

[0112] Furthermore, the shape of the quantum dots is not particularly limited to the shapes generally used in the art, but may be spherical, pyramidal, multi-armed or cubic nanoparticles, nanotubes, nanowires, nanofibers, nanosheet particle shapes, and the like.

[0113] Quantum dots can control the color of emitted light according to their particle size, so quantum dots can have various luminescent colors, such as blue, red, and green.

[0114] An encapsulation layer 400 for protecting the light emitting diode may be positioned on the common electrode 270. The encapsulation layer 400 may be bonded to the substrate 110 through a sealant. The encapsulation layer 400 may be formed of various materials such as glass, quartz, ceramic, plastic, and / or metal.

[0115] Although a flat encapsulation layer 400 is shown in this specification, the present disclosure is not limited thereto, and an embodiment may include an encapsulation layer 400 positioned on the common electrode 270 without using a sealant. In this case, the encapsulation layer 400 may include a single layer of an inorganic film or a single layer of an organic film, or may include a layer in which an inorganic film and an organic film are alternately stacked. For example, the encapsulation layer 400 may include two layers of inorganic films and an organic film positioned between the two layers of inorganic films. Unlike the structure shown in the drawings, the encapsulation layer 400 according to the present embodiment may be positioned on the common electrode 270, and may be formed so as not to be spaced apart from the common electrode 270.

[0116] In this specification, it has been described that one thin film transistor is positioned at each pixel in the display area, and it has been described that a light emitting diode is connected to the thin film transistor. However, one pixel may include at least two thin film transistors and one capacitor, but it is not limited thereto, and one pixel may include three or more thin film transistors and / or two or more capacitors. Here, a pixel is the smallest unit for displaying an image.

[0117] When only the first partition wall 361 is included, the dark spot defect rate may be in the range of about 10% to about 50%, and when only the second partition wall 362 is included, the dark spot defect rate may be less than about 1%. However, when only the second partition wall 362 is included, light leakage may occur, or reliability against external light may be low. The display device according to the present embodiment may include the first partition wall 361 to reduce or prevent light leakage and exhaust, and may include the second partition wall 362 to provide a display device with excellent display quality by reducing the dark spot defect rate.

[0118] In the following, reference will be made to Figures 3 to 11 A display device according to an embodiment will be described. Figures 3 to 11 sectional views of display devices according to the embodiments are shown respectively. Figure 1 and Figure 2The description of the same constituent elements is repeated.

[0119] First refer to Figure 3 , the partition wall 360 may be positioned on the first electrode 191 and the third insulating layer 160. The partition wall 360 includes a first partition wall 361, a second partition wall 362, and a third partition wall 363.

[0120] The first partition wall 361 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide, but is not limited thereto. In addition, the first partition wall 361 may further include a photoinitiator, etc. The first partition wall 361 may be formed by using a negative photosensitive resin composition.

[0121] The first partition wall 361 may include at least one of a black pigment and a black dye. The black pigment according to the present embodiment may include black pigment particles for absorbing external light, and may include a dispersant bonded to the black pigment particles, but the present embodiment is not limited thereto, and the present embodiment may include only black pigment particles in which the dispersant is omitted. In addition, the black dye according to the present embodiment may include black dye particles for absorbing external light, and also include a dispersant bonded to the black dye particles, but the present embodiment is not limited thereto, and the present embodiment may include only black dye particles in which the dispersant is omitted.

[0122] The second partition wall 362 may be positioned on the first partition wall 361. The second partition wall 362 may overlap a portion of the first electrode 191. The second partition wall 362 may have the same thickness throughout.

[0123] According to the present embodiment, the maximum thickness t of the first partition wall 361 is 1 The maximum thickness t of the second partition wall 362 may be about 0.5 micrometers to about 3 micrometers. 2 It may be from about 0.3 microns to about 1 micron.

[0124] The second partition wall 362 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide. The second partition wall 362 may be formed by using a positive photosensitive resin composition, but the present embodiment is not limited thereto. Unlike the first partition wall 361, the second partition wall 362 may omit a black pigment or a black dye, and optionally, the second partition wall 362 may be transparent. The second partition wall 362 may include a compound represented by Chemical Formula 1.

[0125] The third partition walls 363 may be positioned on the second partition walls 362. The third partition walls 363 may be positioned only on the upper surface 362p of the second partition walls 362. The third partition walls 363 may be formed through a separate process after the second partition walls 362 are formed.

[0126] The third partition walls 363 may include the same material as that of the second partition walls 362. Although the second partition walls 362 and the third partition walls 363 are illustrated as separate constituent elements in this example, the second partition walls 362 and the third partition walls 363 including the same material may be regarded as substantially a single layer.

[0127] The third partition wall 363 may overlap a portion of the second partition wall 362. The third partition wall 363 may serve as a spacer, and may support the encapsulation layer 400 as described above.

[0128] Reference Figure 4 , the partition wall 360 may be positioned on the first electrode 191 and the third insulating layer 160. The partition wall 360 may include a first partition wall 361 and a second partition wall 362.

[0129] The second partition wall 362 may be positioned on the third insulating layer 160, and the first partition wall 361 may be positioned on the second partition wall 362. The second partition wall 362 may be positioned between the first partition wall 361 and the third insulating layer 160. According to the present embodiment, the second partition wall 362 may directly contact the third insulating layer 160.

[0130] The second partition wall 362 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide. The second partition wall 362 may be formed by using a positive photosensitive resin composition, but is not limited thereto. Unlike the first partition wall 361, the second partition wall 362 may omit black pigment and black dye and may be transparent. The second partition wall 362 may include a compound represented by Chemical Formula 1.

[0131] The second partition wall 362 may include a first region 362a and a second region 362b. The maximum thickness t of the first region 362a is a and the maximum thickness t of the second region 362b b The maximum thickness t of the second region 362b may be different. b The maximum thickness t of the first region 362a may be a at least twice as much.

[0132] The first region 362a and the second region 362b may be manufactured in the same process. For example, the region overlapping the second opening portion 365b may be manufactured by being exposed by the mask opening portion, the region overlapping the first region 362a may be manufactured by overlapping with the halftone mask, and the region overlapping the second region 362b may be manufactured by overlapping with the mask light blocking portion. The portion exposed by the mask opening portion may be eliminated to form the second opening portion 365b, and the region overlapping with the mask light blocking portion may be formed to have a second thickness t bThe second region 362b of the half-tone mask may be formed with a first thickness t a In this case, the region overlapping the half-tone mask may have a first thickness t that varies according to the exposure amount. a When the exposure increases, the first thickness t a However, even if the exposure amount increases, the second thickness t b It can also remain constant.

[0133] The first partition wall 361 may be positioned on the second partition wall 362. The first partition wall 361 may overlap a portion of the first electrode 191. In this case, an end portion of the first partition wall 361 may contact an upper surface 191p of the first electrode 191.

[0134] The size of the first opening portion 365a of the first partition wall 361 and the size of the second opening portion 365b of the second partition wall 362 may be different. The plane size of the first opening portion 365a of the first partition wall 361 may be smaller than the plane size of the second opening portion 365b of the second partition wall 362. The side surface defining the second opening portion 365b may contact the first partition wall 361. The first partition wall 361 may surround the side surface of the second opening portion 365b (for example, may surround the side surface of the second partition wall 362). The end of the first partition wall 361 may contact the upper surface 191p of the first electrode 191 while being positioned inside the second opening portion 365b.

[0135] The first partition wall 361 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide, but is not limited thereto. In addition, the first partition wall 361 may further include a photoinitiator, etc. The first partition wall 361 may be formed by using a negative photosensitive resin composition.

[0136] The first partition wall 361 according to the present embodiment may include at least one of a black pigment and a black dye. The black pigment according to the present embodiment may include black pigment particles for absorbing external light, and may include a dispersant bonded to the black pigment particles, but the black pigment is not limited thereto. For example, the black pigment may only include black pigment particles in which a dispersant is omitted. The black dye according to the present embodiment may include black dye particles for absorbing external light, and may include a dispersant bonded to the black dye particles, but is not limited thereto. For example, the black dye may only include black dye particles in which a dispersant is omitted.

[0137] Next, refer to Figure 5 , the second spacer 362 and the first spacer 361 may be sequentially positioned on the first electrode 191 and the third insulating layer 160 .

[0138] The second partition wall 362 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide. The second partition wall 362 may be formed by using a positive photosensitive resin composition, but is not limited thereto. Unlike the first partition wall 361, the second partition wall 362 may not include a black pigment and a black dye, and may be transparent. The second partition wall 362 may include a compound represented by Chemical Formula 1.

[0139] The second partition wall 362 may include a first region 362a and a second region 362b. The maximum thickness t of the first region 362a is a and the maximum thickness t of the second region 362b b The maximum thickness t of the second region 362b may be different. b The maximum thickness t of the first region 362a may be a at least twice as much.

[0140] The first partition wall 361 may be positioned above the second partition wall 362 and may not contact the first electrode 191. Although an embodiment in which the first partition wall 361 is positioned only on the upper surface 362p of the second partition wall 362 is shown here, the present disclosure is not limited thereto. For example, in the present embodiment, the first partition wall 361 may have any structure that does not contact the upper surface 191p of the first electrode 191 while overlapping the side surface of the second partition wall 362.

[0141] The first partition wall 361 according to the present embodiment may include at least one of a black pigment and a black dye. The black pigment according to the present embodiment may include black pigment particles for absorbing external light, and may include a dispersant bonded to the black pigment particles, but is not limited thereto, and may include only black pigment particles while omitting the dispersant. The black dye according to the present embodiment may include black dye particles for absorbing external light and a dispersant bonded to the black dye particles, but is not limited thereto, and may include only black dye particles in which the dispersant is omitted.

[0142] The size of the first opening portion 365a of the first partition wall 361 may be different from the size of the second opening portion 365b of the second partition wall 362. The planar size of the first opening portion 365a of the first partition wall 361 may be larger than the planar size of the second opening portion 365b of the second partition wall 362.

[0143] Reference Figure 6 , the second spacer 362 , the first spacer 361 , and the third spacer 363 may be sequentially positioned on the first electrode 191 and the third insulating layer 160 .

[0144] The second partition wall 362 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide. As an example, the second partition wall 362 may be formed by using a positive photosensitive resin composition, but is not limited thereto. Unlike the first partition wall 361, the second partition wall 362 may omit a black pigment and a black dye, and may be transparent. The second partition wall 362 may include a compound represented by Chemical Formula 1.

[0145] The first partition wall 361 may be positioned on the second partition wall 362. The first partition wall 361 may overlap a portion of the first electrode 191. In this case, an end portion of the first partition wall 361 may contact an upper surface 191p of the first electrode 191.

[0146] The first partition wall 361 according to the present embodiment may include at least one of a black pigment and a black dye. The black pigment according to the present embodiment may include black pigment particles for absorbing external light and a dispersant bonded to the black pigment particles, but is not limited thereto and may include only black pigment particles from which the dispersant is omitted. The black dye according to the present embodiment may include black dye particles for absorbing external light and a dispersant bonded to the black dye particles, but is not limited thereto and may include only black dye particles from which the dispersant is omitted.

[0147] The third partition wall 363 may be positioned on the first partition wall 361. The third partition wall 363 may overlap the upper surface 361p of the first partition wall 361. In addition, the third partition wall 363 may include the same material as that of the second partition wall 362.

[0148] The third partition wall 363 may overlap a portion of the first partition wall 361. The second partition wall 362, the first partition wall 361, and the third partition wall 363 may overlap each other in a region where the third partition wall 363 is located, and the region may support the above-mentioned encapsulation layer 400, etc., similarly to a spacer.

[0149] Reference Figure 7 , the second spacer 362 , the first spacer 361 , and the third spacer 363 may be sequentially positioned on the first electrode 191 and the third insulating layer 160 .

[0150] The second partition wall 362 may be positioned on the third insulating layer 160 while overlapping a portion of the first electrode 191 .

[0151] The second partition wall 362 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide. The second partition wall 362 may be formed by using a positive photosensitive resin composition, but is not limited thereto. Unlike the first partition wall 361, the second partition wall 362 may omit black pigment and black dye and may be transparent. The second partition wall 362 may include a compound represented by Chemical Formula 1.

[0152] The first partition wall 361 may be positioned on the second partition wall 362. Although an embodiment in which the first partition wall 361 is positioned only on the upper surface 362p of the second partition wall 362 is shown here, the present disclosure is not limited thereto, and the first partition wall 361 may overlap the side surface of the second partition wall 362. However, the first partition wall 361 may be positioned so as not to contact the upper surface 191p of the first electrode 191.

[0153] The first partition wall 361 according to the present embodiment may include at least one of a black pigment and a black dye. The black pigment according to the present embodiment may include black pigment particles for absorbing external light and a dispersant bonded to the black pigment particles, but is not limited thereto, and may include only black pigment particles in which the dispersant is omitted. In addition, the black dye according to the present embodiment may include black dye particles for absorbing external light and a dispersant bonded to the black dye particles, but is not limited thereto, and may include only black dye particles in which the dispersant is omitted.

[0154] The third partition wall 363 may be positioned on the first partition wall 361. The third partition wall 363 may overlap the upper surface 361p of the first partition wall 361. The second partition wall 362, the first partition wall 361, and the third partition wall 363 overlap each other in a region where the third partition wall 363 is positioned, and the region may function as a spacer.

[0155] The third partition walls 363 may include the same material as that of the second partition walls 362 .

[0156] Reference Figure 8 , the second spacer 362 , the first spacer 361 , and the third spacer 363 may be positioned on the third insulating layer 160 and the first electrode 191 .

[0157] The second partition wall 362 may overlap an end portion of the first electrode 191. The end portion of the first electrode 191 may be covered by the second partition wall 362. Due to the second partition wall 362, the metal included in the first electrode 191 may be controlled not to grow into a metal defect.

[0158] The second partition wall 362 may be made of a transparent material. The second partition wall 362 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide. As an example, the second partition wall 362 may be formed by using a positive photosensitive resin composition, but is not limited thereto. Unlike the first partition wall 361, the second partition wall 362 may omit black pigment and black dye. The second partition wall 362 may include a compound represented by Chemical Formula 1.

[0159] The first partition wall 361 may be positioned on the third insulating layer 160, the second partition wall 362, and the first electrode 191. In a cross-sectional view, the first partition wall 361 may have a shape surrounding or contacting an upper surface 362p and a side surface 362s of the second partition wall 362. The first partition wall 361 may contact an upper surface 191p of the first electrode 191 while surrounding or contacting a side surface 362s of the second partition wall 362.

[0160] The first partition wall 361 according to the present embodiment may include at least one of a black pigment and a black dye. The black pigment according to the present embodiment may include black pigment particles for absorbing external light and a dispersant bonded to the black pigment particles, but is not limited thereto, and may include only black pigment particles in which the dispersant is omitted. In addition, the black dye according to the present embodiment may include black dye particles for absorbing external light and a dispersant bonded to the black dye particles, but is not limited thereto, and may include only black dye particles in which the dispersant is omitted.

[0161] The third partition wall 363 may be positioned on the first partition wall 361. The third partition wall 363 may include the same material as that of the second partition wall 362. The third partition wall 363 may overlap a portion of the second partition wall 362.

[0162] The third partition wall 363 may overlap a portion of the first partition wall 361. A region in which the third partition wall 363 is located overlaps a portion of the second partition wall 362 and / or a portion of the first partition wall 361, and the region may function as a spacer.

[0163] Reference Fig. 9 , the first partition wall 361 may be positioned on the third insulating layer 160. In this case, the first partition wall 361 may be positioned not to overlap the first electrode 191. The first electrode 191 and the first partition wall 361 may be spaced apart from each other in a plan view.

[0164] The second partition wall 362 may be positioned on the third insulating layer 160, the first electrode 191, and the first partition wall 361. The second partition wall 362 may be positioned in a space between the first electrode 191 and the first partition wall 361. The second partition wall 362 may contact the upper surface 160s of the third insulating layer 160 through the space.

[0165] The second partition wall 362 may include a first region 362a and a second region 362b. The maximum thickness t of the first region 362a is a and the maximum thickness t of the second region 362b b The maximum thickness t of the second region 362b may be different. b The maximum thickness t of the first region 362a may be a at least twice as much.

[0166] The second region 362b of the second partition wall 362 may have a relatively thick thickness. The second region 362b may function as a spacer. The second partition wall 362 may have elasticity (eg, predetermined elasticity), and may support the encapsulation layer 400 described above.

[0167] The second partition wall 362 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide. As an example, the second partition wall 362 may be formed by using a positive photosensitive resin composition, but is not limited thereto. Unlike the first partition wall 361, the second partition wall 362 may omit a black pigment and a black dye, and may be transparent. The second partition wall 362 may include a compound represented by Chemical Formula 1.

[0168] Reference Fig.10 , the second spacer 362 , the first spacer 361 , and the third spacer 363 may be sequentially positioned on the first electrode 191 and the third insulating layer 160 .

[0169] The second partition wall 362 may overlap a portion of the first electrode 191. The second partition wall 362 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide. As an example, the second partition wall 362 may be formed by using a positive photosensitive resin composition, but is not limited thereto. Unlike the first partition wall 361, the second partition wall 362 may omit a black pigment and a black dye, and may be transparent. The second partition wall 362 may include a compound represented by Chemical Formula 1.

[0170] The first partition wall 361 may be positioned on the second partition wall 362. The first partition wall 361 according to the present embodiment may overlap an upper surface 362p of the second partition wall 362.

[0171] The third partition wall 363 may be positioned on the second partition wall 362 and the first partition wall 361. The third partition wall 363 may overlap the side surface 361s of the first partition wall 361 while covering the upper surface 361p of the first partition wall 361. The third partition wall 363 may overlap the upper surface 362p of the second partition wall 362. Although an embodiment in which the edge of the third partition wall 363 and the edge of the second partition wall 362 are aligned is shown here, the present disclosure is not limited thereto, and the end of the third partition wall 363 may overlap the side surface of the second partition wall 362.

[0172] The third partition wall 363 may include a first region 363a and a second region 363b. The maximum thickness t of the first region 363a is a and the maximum thickness t of the second region 363b b For example, the maximum thickness t of the second region 363b is b The maximum thickness t of the first region 363a may be a at least twice as much.

[0173] The second partition walls 362, the first partition walls 361, and the second regions 363b of the third partition walls 363 may overlap each other in a region where the second regions 363b are located, and the region may function as a spacer. The second regions 363b may support the encapsulation layer 400 described above.

[0174] Reference Fig.11 , the partition wall 360 may be positioned on the first electrode 191 and the third insulating layer 160. The partition wall 360 includes a first partition wall 361, a second partition wall 362, and a third partition wall 363.

[0175] The first partition wall 361 may overlap a portion of the first electrode 191 and may be positioned on an upper surface of the third insulating layer 160 .

[0176] The first partition wall 361 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide, but is not limited thereto. In addition, the first partition wall 361 may further include a photoinitiator, etc. In addition, the first partition wall 361 may be formed by using a negative photosensitive resin composition.

[0177] The first partition wall 361 according to the present embodiment may include at least one of a black pigment and a black dye. The black pigment according to the present embodiment may include black pigment particles for absorbing external light and a dispersant bonded to the black pigment particles, but is not limited thereto, and may include only black pigment particles in which the dispersant is omitted. In addition, the black dye according to the present embodiment may include black dye particles for absorbing external light and a dispersant bonded to the black dye particles, but is not limited thereto, and may include only black dye particles in which the dispersant is omitted.

[0178] The second partition wall 362 may be positioned on the upper surface 191p of the first electrode 191. The second partition wall 362 overlaps the first electrode 191 while overlapping the side surface 361s of the first partition wall 361. The second partition wall 362 may have a shape surrounding the side surface of the opening portion of the first partition wall 361. The metal defect described above may easily occur at the boundary between the first partition wall 361 and the first electrode 191, and the growth of the metal defect may be reduced or prevented by surrounding the boundary with the second partition wall 362.

[0179] The second partition wall 362 may include an organic insulating material such as an acrylic organic compound, polyimide and / or polyamide. As an example, the second partition wall 362 may be formed by using a positive photosensitive resin composition, but is not limited thereto. Unlike the first partition wall 361, the second partition wall 362 may omit black pigment and black dye, and may be transparent optionally. The second partition wall 362 may include a compound represented by Chemical Formula 1.

[0180] The third partition wall 363 may be positioned on the upper surface 361p of the first partition wall 361. The third partition wall 363 may include the same material as that of the second partition wall 362. The third partition wall 363 may serve as a spacer, and may support the encapsulation layer 400 as described above.

[0181] In the following, reference will be made to FIG. 12A to FIG. 14 A display device according to the present embodiment is described. Fig. 12A is a graph showing the content of "S" according to this example, Fig. 12B This is the EDS analysis image of the first partition wall and the second partition wall. Fig.13 This is a TEM image of the first partition wall and the second partition wall. Fig.14 is a graph showing the dark spot ratio relative to the width at which the first electrode and the second partition wall overlap.

[0182] The second partition wall according to the present embodiment may be formed of a transparent material, and may include a compound represented by Chemical Formula 1. In addition, the first partition wall may include a black pigment.

[0183] Reference Fig. 12A , as the sputtering time passes, the S element contents of the cap layer, cathode, electron auxiliary layer, light emitting layer, hole auxiliary layer and partition wall included in the display device can be sequentially compared. When the sputtering time is in the range of about 0 seconds to about 500 seconds, the S element content shows similar results (regions corresponding to the cap layer, cathode, electron auxiliary layer, light emitting layer and hole auxiliary layer). Fig. 12A , the partition wall according to the present embodiment corresponds to the case of about 500 seconds to about 600 seconds. Because the second partition wall A includes the compound represented by Chemical Formula 1, it can be seen that as the TOF-SIMS analysis is performed, the intensity of the S element increases relative to the first partition wall B. That is, by Fig. 12A By analyzing the content of S element as shown in FIG. , the first partition wall B and the second partition wall A can be distinguished.

[0184] Referring to the EDS analysis image of the first partition wall and the second partition wall Fig. 12B , it is difficult to distinguish the first partition wall from the second partition wall by the elements C, F and Cl, but the first partition wall and the second partition wall can be distinguished by the difference between their S element contents. Fig.13 As shown in FIG. 1 , it can be seen that the first partition wall (BPDL) and the second partition wall (PS / PI) are also divided into separate layers through the TEM image.

[0185] Reference Fig.14 , showing the dark spot rate with respect to the increase in the width (overlapping amount) at which the second partition wall overlaps the first electrode. Fig.14 The figure shows the Figure 1 The dark spot rate of the first width corresponding to w1 is about 84%. When the first width corresponding to w1 is 0 (i.e., when the overlap width of the second partition wall and the first electrode is zero), the dark spot rate may be about 84%. As the overlap width increases, the dark spot rate decreases, and when the overlap width is about 2.2 microns or more, the dark spot rate may be substantially 0%, and for the width at which the second partition wall overlaps the first electrode is at least 2.0 microns, the dark spot rate may be appropriate.

[0186] While the embodiments of the present disclosure have been described in conjunction with what are presently considered to be working embodiments, it will be understood that the invention is not limited to the disclosed embodiments, but on the contrary is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims, and functional equivalents thereof are to be included therein.

[0187] Description of the label

[0188] 110: Base

[0189] 191: First electrode

[0190] 370: Luminous layer

[0191] 270: Second electrode

[0192] 361: The first adjacent wall

[0193] 362: Second wall

Claims

1. A display device, comprising: substrate; A thin film transistor, located on the substrate; A first electrode electrically connected to the thin film transistor; A light-emitting layer and a second electrode, stacked with the first electrode; A first partition wall is located between the first electrode and the second electrode; as well as a second partition wall, overlapping the first partition wall, Wherein, the first partition wall comprises at least one of a black pigment and a black dye, Wherein, the second partition wall comprises an organic insulating material, wherein a portion of the second partition wall overlaps the first electrode, wherein an end portion of the second partition wall contacts the first electrode, and The width of a region where the second partition wall and the first electrode are in contact with each other is 2 micrometers or greater.

2. The display device according to claim 1, wherein: The second partition wall includes a first region and a second region having different thicknesses, Wherein, the display device further includes an encapsulation layer located on the second electrode, and Wherein, the second region supports the encapsulation layer.

3. The display device according to claim 1, wherein the first electrode comprises a first layer, a second layer and a third layer, in, Each of the first layer and the third layer includes ITO, IZO, ZnO, In2O3, IGO or AZO, wherein the second layer comprises Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr or a mixture thereof, and The surface of the first electrode defines a groove for exposing the second layer. 4 . The display device according to claim 1 , further comprising a third partition wall located on the second partition wall.

5. The display device according to claim 1, wherein: The second partition wall is located on the first electrode, and Wherein, the first partition wall is located on the second partition wall.

6. The display device according to claim 5, wherein: The second partition wall includes a first region and a second region having different thicknesses.

7. The display device according to claim 5, wherein: The first partition wall is located on an upper surface of the second partition wall, and Wherein, the first partition wall overlaps the upper surface and two side surfaces of the second partition wall.

8. The display device according to claim 5, further comprising a third partition wall located on the first partition wall, wherein: The third partition wall contacts an upper surface of the second partition wall.

9. The display device according to claim 1, further comprising an insulating layer located between the thin film transistor and the first electrode, in, The first partition wall and the second partition wall contact the insulating layer.

Images