A motherboard component with antenna and communication equipment capable of realizing sub-6G

Abstract

The present invention discloses a motherboard component with an antenna and a communication device that can achieve sub-6G. The motherboard component includes a motherboard and a patch antenna arranged on the motherboard. The motherboard includes a substrate and a motherboard ground extension structure connected to one end of the substrate; the substrate includes a clearance area arranged opposite to the motherboard ground extension structure, and the patch antenna is attached to the clearance area; the motherboard ground extension structure is coupled with the clearance area and the patch antenna to achieve the sub-6G frequency band. The motherboard component meets the N41, N77, N78 and N79 frequency band transmission by setting a motherboard ground extension structure connected to the substrate, and by coupling the motherboard ground extension structure, the clearance area and the patch antenna, so as to achieve the Sub-6G demand with high-speed signal transmission. In addition, under the motherboard structure, the Sub-6G frequency band can be achieved by adopting a patch antenna, and the antenna can be miniaturized. The patch antenna and the clearance area are connected by SMT technology, and the process is simple and the cost is low.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a mainboard assembly with an antenna capable of achieving sub-6G and a communication device. Background Art

[0002] With the development of society and communication technology, people have more and more demands for signal reception and transmission, and also higher and higher requirements for communication transmission rate and stability. The transmission function of 2G / 3G / 4G antennas has been increasingly unable to meet the needs of smart networks / Internet of Things. In order to adapt to the requirements of global use, communication equipment has higher and higher signal transmission rates. Therefore, high-frequency and high-speed transmission antennas are needed to meet the needs of communication transmission.

[0003] Sub-6G refers to the 5G frequency band and the sub-6G frequency band with an operating frequency of 450MHz-6000MHz. Sub-6G antennas will become a usage trend with their excellent transmission rate and transmission stability. Therefore, it is necessary to seek a sub-6G frequency band device with miniaturization, simple structure and process. Summary of the invention

[0004] In order to solve the problems of the prior art, the present invention provides a motherboard assembly with an antenna and a communication device that can achieve sub-6G, which can achieve the Sub-6G frequency band and occupies a small space.

[0005] In order to solve the above technical problems, the present invention proposes the following technical solutions:

[0006] On the one hand, a motherboard assembly with an antenna capable of implementing sub-6G is provided, comprising a motherboard and a patch antenna disposed on the motherboard.

[0007] The main board includes a base plate and a main board ground extension structure connected to one end of the base plate;

[0008] The substrate comprises a clearance area arranged opposite to the extended structure of the main board, and the patch antenna is attached to the clearance area;

[0009] The mainboard ground extension structure, clearance area and patch antenna are coupled to each other to achieve the sub-6G frequency band.

[0010] In some preferred embodiments, the extended structure of the main board is an L-shaped structure, including a first metal conductor with one end vertically connected to the substrate and a second metal conductor with one end vertically connected to the first metal conductor, and a gap is formed between the substrate and the extended structure of the main board.

[0011] In some preferred embodiments, the size of the first metal conductor is 1.8±0.3 mm*2.1±0.3 mm, and the size of the second metal conductor is 12.9±0.3 mm*2.1±0.3 mm.

[0012] In some preferred embodiments, the patch antenna is a ceramic patch antenna, and the ceramic patch antenna includes a first ground terminal and a second ground terminal disposed at two ends thereof, oppositely disposed feeding points, and a reserved feeding point.

[0013] In some preferred embodiments, the clearance area is located at the edge of the substrate and has a size of 9.3±0.3 mm*7.2±0.3 mm.

[0014] In some preferred embodiments, the mainboard also includes a third ground terminal, a fourth ground terminal and a fifth ground terminal arranged in the clearance area, and the third ground terminal, the fourth ground terminal and the fifth ground terminal all include connection points welded to the patch antenna.

[0015] In some preferred implementations, the patch antenna is connected to the clearance area by welding using SMT technology.

[0016] In some preferred embodiments, the substrate is an insulating board of FR-4 grade.

[0017] In some preferred embodiments, the sub-6G capable motherboard assembly with an antenna further includes a motherboard extension plate disposed on one side of the substrate and used to support an extension structure of the motherboard, and the motherboard extension plate and the substrate are located in the same plane.

[0018] On the other hand, a communication device is also provided, which includes the mainboard assembly with an antenna capable of achieving sub-6G.

[0019] The technical solution provided by the embodiment of the present invention has the following beneficial effects:

[0020] The present invention provides a mainboard component with an antenna and a communication device capable of realizing sub-6G. The mainboard component includes a mainboard and a patch antenna arranged on the mainboard. The mainboard includes a substrate and a mainboard ground extension structure connected to one end of the substrate. The substrate includes a clearance area arranged opposite to the mainboard ground extension structure, and the patch antenna is arranged in the clearance area. The mainboard ground extension structure is coupled with the clearance area and the patch antenna to realize the sub-6G frequency band. The mainboard component satisfies the N41, N77, N78 and N79 frequency band transmission by arranging the mainboard ground extension structure connected to the substrate, and by coupling the mainboard ground extension structure, the clearance area and the patch antenna, so as to realize the Sub-6G demand with high-speed signal transmission. In addition, under the mainboard structure, the Sub-6G frequency band can be realized by adopting the patch antenna, thereby realizing the miniaturization of the antenna.

[0021] Furthermore, the patch antenna is connected to the clearance area by welding using SMT technology, which simplifies the process and reduces labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the structure of a mainboard assembly with an antenna capable of implementing sub-6G in Example 1;

[0023] Figure 2 This is a schematic diagram of the structure of the mainboard in Example 1;

[0024] Figure 3 is a schematic diagram of the structure of the patch antenna in Example 1;

[0025] Figure 4 The standing wave ratio of the Sub-6G frequency band achieved by the mainboard assembly with an antenna capable of achieving sub-6G in Example 1.

[0026] Markings in the figure: 100-mainboard assembly, 10-mainboard, 20-patch antenna, 11-substrate, 12-mainboard ground extension structure, 13-clearance area, 121-first metal conductor, 122-second metal conductor, 123-gap, 21-first grounding terminal, 22-second grounding terminal, 23-feeding point, 24-reserved feeding point, 131-third grounding terminal, 132-fourth grounding terminal, 133-fifth grounding terminal. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0028] In the description of the present invention, it should be understood that the terms "vertical", "parallel", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] As described in the background technology, under the current situation where high requirements are placed on communication transmission rate and antenna miniaturization, there is an urgent need to develop a miniaturized device that can achieve sub-6G frequency band. The motherboard assembly with antenna and communication equipment that can achieve sub-6G provided in this embodiment can achieve sub-6G frequency band and have better transmission rate and transmission stability.

[0031] Please refer to the following Figures 1 to 4 A motherboard assembly with an antenna capable of achieving sub-6G protected by the present invention is described in detail.

[0032] Example 1.

[0033] like Figure 1 , 2 As shown, this embodiment provides a motherboard assembly 100 with an antenna that can achieve sub-6G, including a motherboard 10 and a patch antenna 20 disposed on the motherboard 10. The motherboard 10 includes a substrate 11 and a motherboard ground extension structure 12 connected to one end of the substrate 11. The substrate 11 includes a clearance area 13 arranged opposite to the motherboard ground extension structure 12, and the patch antenna 20 is attached to the clearance area 13. Under this structure, the motherboard ground extension structure 12, the patch antenna 20 and the clearance area 13 are coupled to each other to achieve the sub-6G frequency band.

[0034] Specifically, the mainboard ground extension structure 12 is an L-shaped structure, including a first metal conductor 121 with one end vertically connected to the substrate 11, and a second metal conductor 122 with one end vertically connected to the first metal conductor 121 and one end being a free end. In this structure, the second metal conductor 122 is parallel to the patch antenna 20, so that a gap 123 is formed between the substrate 11 and the mainboard ground extension structure 12.

[0035] As a preferred embodiment, the size of the first metal conductor 121 is 1.8±0.3 mm*2.1±0.3 mm, the size of the second metal conductor 122 is 12.9±0.3 mm*2.1±0.3 mm, and the size of the gap 123 is 1.8±0.3 mm*10.8±0.3 mm.

[0036] The patch antenna 20 used in this embodiment is preferably implemented as a ceramic patch antenna (chip antenna). A chip antenna refers to an antenna that is wound or serpentine on the surface or inside of a ceramic material and mounted in the clearance area of ​​a motherboard. The chip antenna occupies a small space, has high antenna efficiency and feasibility, and is mainly used for Bluetooth, GPS, WLAN, etc. Figure 3 As shown, the chip antenna in this embodiment includes a first ground terminal 21 and a second ground terminal 22 disposed at two ends thereof, and a feeding point 23 and a reserved feeding point 24 disposed at the other two ends thereof.

[0037] Further references Figure 2 As shown, the chip antenna size is 5.2±0.3mm*3.7±0.3mm*0.7±0.3mm. Among them, the width of the first ground terminal 21 and the second ground terminal 22 is 0.45±0.3mm, and the sizes of the feeding point 23 and the reserved feeding point 24 are 1.5±0.10mm*0.72±0.1mm and 1.4±0.10mm*0.72±0.1mm respectively. The distance between the feeding point 23 and the reserved feeding point 24 and the first ground terminal 21 is 0.5±0.10mm.

[0038] The patch antenna 20 is attached to the surface of the clearance area 13, and the clearance area 13 is located at the edge of the substrate, and the size is 9.3±0.3mm*7.2±0.3mm. The mainboard 10 also includes a third ground terminal 131, a fourth ground terminal 132 and a fifth ground terminal 133 arranged in the clearance area 13, and the third ground terminal 131, the fourth ground terminal 132 and the fifth ground terminal 133 all include a connection point (PAD point) welded to the patch antenna. And as a preferred embodiment, the patch antenna 20 is welded and connected to the clearance area 13 using SMT technology. The SMT technology patch is simple in process and can effectively reduce labor costs.

[0039] In this embodiment, the material of the substrate 11 is preferably an FR-4 grade insulating board. FR-4 grade material is a material specification that must be able to extinguish itself after burning, and is a common material for circuit boards. The mainboard assembly 100 with antenna that can achieve sub-6G also includes a mainboard extension board 14 disposed on one side of the substrate 11 and used to carry the mainboard extension structure 12. The mainboard extension board 14 and the substrate 11 are located in the same plane, and the mainboard extension structure 12 is attached to the mainboard extension board 14. The mainboard extension board 14 can be made of general hard plastic material.

[0040] After debugging and testing, it is known that the motherboard component with antenna that can achieve sub-6G can achieve the following Figure 4 The frequency band range shown includes N41, N77, N78 and N79, which can meet the Sub-6G requirements and can meet high-speed signal transmission. The motherboard component with antenna that can achieve sub-6G is further tested. The test results are shown in Table 1. It can be seen that the antenna efficiency in N41, N77, N78 and N79 can reach more than 40%, and the antenna efficiency is relatively high.

[0041]

[0042]

[0043] Table 1. Antenna efficiency in N41, N77, N78 and N79

[0044] Therefore, the motherboard assembly with an antenna that can achieve sub-6G in this embodiment meets the N41, N77, N78 and N79 frequency band transmission requirements with high-speed signal transmission by setting a motherboard ground extension structure connected to the substrate, and through the coupling of the motherboard ground extension structure, the clearance area and the patch antenna, in order to achieve the Sub-6G demand for high-speed signal transmission. In addition, under this motherboard structure, the Sub-6G frequency band can be achieved by using a patch antenna, thereby realizing the miniaturization of the antenna; further, the patch antenna and the clearance area are welded and connected using SMT technology, which simplifies the process and reduces labor costs.

[0045] Example 2.

[0046] The present embodiment provides a communication device, which includes the mainboard component with an antenna capable of realizing sub-6G as described in Embodiment 1. The communication device is a mobile phone, a router, a notebook, etc. By integrating the mainboard component, signal transmission of communication methods such as Bluetooth, GPS, and WLAN within the Sub-6G frequency band can be realized, and the transmission rate and stability are better.

[0047] All of the above optional technical solutions can be combined in any way to form optional embodiments of the present invention, that is, any multiple embodiments can be combined to meet the needs of different application scenarios. They are all within the protection scope of this application and will not be described one by one here.

[0048] It should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A motherboard assembly with an antenna capable of implementing sub-6G, comprising a motherboard and a patch antenna disposed on the motherboard, characterized in that: The main board includes a base plate and a main board ground extension structure connected to one end of the base plate; The substrate comprises a clearance area arranged opposite to the extended structure of the main board, and the patch antenna is attached to the clearance area; The mainboard ground extension structure, the clearance area and the patch antenna are coupled to each other to achieve the sub-6G frequency band; The extended structure of the main board is an L-shaped structure, including a first metal conductor with one end vertically connected to the substrate and a second metal conductor with one end vertically connected to the first metal conductor. The second metal conductor is parallel to the patch antenna. A gap is formed between the substrate and the extended structure of the main board. The patch antenna is a ceramic patch antenna. The clearance area is arranged at the edge of the substrate.

2. The motherboard assembly with antenna capable of implementing sub-6G according to claim 1, characterized in that: The size of the first metal conductor is 1.8±0.3mm*2.1±0.3mm, and the size of the second metal conductor is 12.9±0.3mm*2.1±0.3mm.

3. The motherboard assembly with antenna capable of implementing sub-6G according to claim 1, characterized in that: The ceramic patch antenna comprises a first ground terminal and a second ground terminal arranged at two ends thereof, feeding points arranged opposite to each other and a reserved feeding point.

4. The motherboard assembly with antenna capable of implementing sub-6G according to claim 1, characterized in that: The size of the clearance area is 9.3±0.3mm*7.2±0.3mm.

5. The motherboard assembly with antenna capable of implementing sub-6G according to claim 1, characterized in that: The mainboard further includes a third ground terminal, a fourth ground terminal and a fifth ground terminal which are arranged in the clearance area, and the third ground terminal, the fourth ground terminal and the fifth ground terminal all include connection points which are welded to the patch antenna.

6. The motherboard assembly with antenna capable of implementing sub-6G according to claim 5, characterized in that: The patch antenna is connected to the clearance area by welding using SMT technology.

7. The motherboard assembly with antenna capable of implementing sub-6G according to claim 1, characterized in that: The substrate adopts an insulating board of FR-4 grade.

8. The motherboard assembly with antenna capable of implementing sub-6G according to any one of claims 1 to 7, characterized in that: It also includes a mainboard extension plate which is arranged on one side of the base plate and is used to carry the extension structure of the main board. The mainboard extension plate and the base plate are located in the same plane.

9. A communication device, characterized in that: It includes a mainboard assembly with an antenna capable of implementing sub-6G as described in any one of claims 1 to 8.

Images