A visual inspection device for semiconductor module packaging

Abstract

The present invention discloses a visual inspection device for semiconductor module packaging, comprising a base, a cylinder body fixed on the base, a first annular plate fixed on the piston rod of the cylinder body, an annular groove provided on the first annular plate, a slider slidably provided in the annular groove, a second annular plate fixed on the slider, a support rod fixed on the second annular plate, a support plate fixed on the support rod, a lamp bead fixedly embedded on the support plate, a camera fixed on the support plate, the camera is connected to a computer host through a data cable, and the camera can be operated and the shooting situation can be viewed while the computer is being used. By moving the camera up and down and rotating it, the semiconductor can be shot while being processed on the operating table, and the camera can be adjusted in position to meet the shooting requirements.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and in particular relates to a visual inspection device for semiconductor module packaging. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements.

[0003] Visual inspection is to use machines instead of human eyes to make measurements and judgments. Visual inspection refers to the use of machine vision products (i.e. image capture devices, which are divided into CMOS and CCD) to convert the captured target into image signals, which are transmitted to a dedicated image processing system. According to pixel distribution, brightness, color and other information, they are converted into digital signals. The image system performs various operations on these signals to extract the characteristics of the target, and then controls the operation of the equipment on site according to the results of the judgment. It is a valuable mechanism for production, assembly or packaging, and it has immeasurable value in detecting defects and preventing defective products from being delivered to consumers.

[0004] After semiconductor packaging, visual inspection is required to identify the quality of the product. However, the cameras on the visual equipment currently used for semiconductor packaging inspection are not convenient to adjust during shooting, which greatly affects the shooting effect and quality, and affects the inspection results. Summary of the invention

[0005] The object of the present invention is to provide a visual inspection device for semiconductor module packaging to solve the problem of inconvenient adjustment of the camera.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a visual inspection device for semiconductor module packaging, comprising a base, a cylinder body is fixed on the base, a first annular plate is fixed on the piston rod of the cylinder body, an annular groove is arranged on the first annular plate, a slider is slidably arranged in the annular groove, a second annular plate is fixed on the slider, a support rod is fixed on the second annular plate, a support plate is fixed on the support rod, a lamp bead is fixedly embedded on the support plate, the lamp bead is an LED lamp, and is powered by a wire plug connected to an indoor 220V power socket strip, a camera is also fixed on the support plate, the camera is connected to a computer host via a data cable, and the camera can be operated and the shooting situation can be viewed while the computer is being used.

[0007] Preferably, a ball groove is provided on the sliding block, and a ball is rolled in the ball groove. The ball rolls and contacts the inner wall of the annular groove, and can rotate on the second annular plate, thereby reducing friction.

[0008] Preferably, a motor is fixed on the first annular plate, a driving bevel gear is fixed on the rotating shaft of the motor, the model of the motor is 4RK25GN-C, a forward and reverse switch is fixed on the motor housing through a wire, the model of the forward and reverse switch is HY2-8, and the motor is powered by being connected to the indoor 220V power socket through a wire plug.

[0009] Preferably, a linkage bevel gear is fixed on the second annular plate, and the linkage bevel gear is meshed with the driving bevel gear, so that the second annular plate can rotate forward and reversely by a quarter of a circle.

[0010] Preferably, an alignment groove is provided on the support rod, and an alignment block is fixed on the support plate. The alignment block and the alignment groove are slidably inserted into each other, so as to facilitate the disassembly of the support plate to inspect the positions of the lamp beads and the camera.

[0011] Preferably, the alignment block is provided with a groove, a latch is slidably provided in the groove, and the latch is connected to the groove via a spring to ensure that the extension and resetting of the latch is stable.

[0012] Preferably, a through hole is connected in the alignment groove, and the bayonet is spring-fitted into the through hole to facilitate disassembly of the support plate and the support rod.

[0013] Preferably, a bracket and an operating table are fixed on the base, and the operating table is a disc structure, so that the semiconductor can be packaged and processed on the operating table.

[0014] Compared with the prior art, the beneficial effects of the present invention are: by moving the camera up and down and rotating it, it is possible to take pictures while the semiconductor is being processed on the operating table 5, and the position of the camera can be adjusted to meet the shooting requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 It is a partial enlarged schematic diagram of the support plate and the support rod of the present invention;

[0017] Figure 3 It is a partial enlarged schematic diagram of the slider and the annular groove of the present invention;

[0018] Figure 4 This is a top view distribution diagram of the second annular plate and the linked bevel gear of the present invention.

[0019] In the figure: 1. base; 11. cylinder body; 12. first annular plate; 13. annular groove; 14. slider; 15. second annular plate; 16. support rod; 17. support plate; 18. lamp bead; 19. camera; 2. ball groove; 21. ball bearing; 3. motor; 31. driving bevel gear; 32. linkage bevel gear; 4. alignment groove; 41. alignment block; 42. groove; 43. latch; 44. spring; 45. through hole; 5. operating table. DETAILED DESCRIPTION

[0020] See also Figure 1 and Figure 2 A visual inspection device for semiconductor module packaging includes a base 1, a cylinder body 11 is fixed on the base 1, a first annular plate 12 is fixed on the piston rod of the cylinder body 11, an annular groove 13 is provided on the first annular plate 12, a slider 14 is slidably provided in the annular groove 13, a second annular plate 15 is fixed on the slider 14, a support rod 16 is fixed on the second annular plate 15, a support plate 17 is fixed on the support rod 16, a lamp bead 18 is fixedly embedded on the support plate 17, the lamp bead 18 is an LED lamp, and is powered by a wire plug connected to an indoor 220V power socket strip, a camera 19 is also fixed on the support plate 17, and the camera 19 is connected to a computer host through a data cable, and the camera 19 can be operated and the shooting situation can be viewed while the computer is being used.

[0021] See also Figure 1 and Figure 3 The slider 14 is provided with a ball groove 2, in which a ball 21 is rolled. The ball 21 rolls and contacts the inner wall of the annular groove 13, and can rotate on the second annular plate 15, thereby reducing friction.

[0022] See also Figure 1 A motor 3 is fixed on the first annular plate 12, a driving bevel gear 31 is fixed on the rotating shaft of the motor 3, the model of the motor 3 is 4RK25GN-C, a forward and reverse switch is fixed on the housing of the motor 3 through a wire, the model of the forward and reverse switch is HY2-8, and the motor 3 is powered by a wire plug connected to an indoor 220V power socket.

[0023] See also Figure 1 and Figure 4 A linkage bevel gear 32 is fixed on the second annular plate 15 , and the linkage bevel gear 32 is meshed with the driving bevel gear 31 , so that the second annular plate 15 can rotate forward and backward by a quarter of a circle.

[0024] See also Figure 2 The support rod 16 is provided with an alignment groove 4, and the support plate 17 is fixed with an alignment block 41. The alignment block 41 is slidably inserted into the alignment groove 4, which facilitates the removal of the support plate 17 to inspect the lamp beads 18 and the camera 19.

[0025] See also Figure 2 A groove 42 is provided on the alignment block 41, and a latch 43 is slidably provided in the groove 42. The latch 43 is connected to the groove 42 by a spring 44 to ensure that the retraction and resetting of the latch 43 is stable.

[0026] See also Figure 2 A through hole 45 is connected in the alignment groove 4, and the bayonet 43 is spring-fitted into the through hole 45 to facilitate the disassembly of the support plate 17 and the support rod 16.

[0027] See also Figure 1 A bracket and an operating table 5 are fixed on the base 1 . The operating table 5 is a disc structure, so that semiconductors can be packaged and processed on the operating table 5 .

[0028] The working principle of this solution is: when detection is required, the camera 19 is first connected to the computer host through a data cable, and then the semiconductor module is packaged and processed on the operating table 5, and a single or two cameras 19 and lamp beads 18 are started according to any needs, and the lamp beads 18 provide light sources.

[0029] When the height of the camera 19 needs to be adjusted, the piston rod of the cylinder 11 is pushed forward so that the height of the camera 19 can be moved up and down.

[0030] When the camera 19 needs to rotate in a circle with the operating table 5 as the center, the power of the motor 3 is turned on, and the motor 3 is started by the forward switch or the reverse switch of the forward and reverse switch. The motor 3 drives the driving bevel gear 31 to engage the linkage bevel gear 32 to rotate, so that the second annular plate 15 rotates forward one quarter of a circle or reverse one quarter of a circle, thereby ensuring all-round shooting.

[0031] The sliding block 14 slides in the annular groove 13 , and the balls 21 are in rolling contact with the annular groove 13 , so that the stability of the rotation of the second annular plate 15 is ensured.

[0032] When the lamp bead 18 or the camera 19 needs to be disassembled for maintenance, the latch 43 is pressed so that the latch 43 compresses the spring 44 and enters the groove 42 to complete the separation from the through hole 45, thereby completing the disassembly of the support plate 17 and the support rod 16.

Claims

1. A visual inspection device for semiconductor module packaging, comprising a base (1), characterized in that: A cylinder body (11) is fixed on the base (1), a first annular plate (12) is fixed on the piston rod of the cylinder body (11), an annular groove (13) is provided on the first annular plate (12), a slider (14) is slidably provided in the annular groove (13), a second annular plate (15) is fixed on the slider (14), a support rod (16) is fixed on the second annular plate (15), a support plate (17) is fixed on the support rod (16), a lamp bead (18) is fixedly embedded in the support plate (17), and a camera (19) is also fixed on the support plate (17); a single or two cameras (19) and the lamp bead (18) are activated according to any need, and the lamp bead (18) provides a light source; A motor (3) is fixed on the first annular plate (12), and a driving bevel gear (31) is fixed on the rotating shaft of the motor (3); A linkage bevel gear (32) is fixed on the second annular plate (15), and the linkage bevel gear (32) is meshed with the driving bevel gear (31); The support rod (16) is provided with an alignment groove (4), and the support plate (17) is fixed with an alignment block (41), and the alignment block (41) is slidably inserted into the alignment groove (4).

2. A visual inspection device for semiconductor module packaging according to claim 1, characterized in that: The slider (14) is provided with a ball groove (2), in which a ball (21) is rolled, and the ball (21) rolls and contacts the inner wall of the annular groove (13).

3. The visual inspection device for semiconductor module packaging according to claim 1, characterized in that: The alignment block (41) is provided with a groove (42), a latch (43) is slidably provided in the groove (42), and the latch (43) is connected to the groove (42) via a spring (44).

4. A visual inspection device for semiconductor module packaging according to claim 3, characterized in that: The alignment groove (4) is connected to a through hole (45), and the latch (43) is spring-loaded into the through hole (45).

5. The visual inspection device for semiconductor module packaging according to claim 1, characterized in that: A bracket is fixed on the base (1), and an operating table (5) is fixed on the bracket. The operating table (5) is a disc structure.

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