A PCB board, its manufacturing method, an electronic module, and its assembly method

Abstract

The present invention discloses a PCB board and a manufacturing method thereof, and an electronic module and an assembly method thereof, wherein a PCB board comprises: a PCB board, provided with a positioning groove for installing a shielding cover, the groove width of the positioning groove is greater than the wall thickness of the shielding cover to form a gap, and the gap can at least partially accommodate solder. The present invention provides a positioning groove for installing the shielding cover on the PCB board, so that the shielding cover is more stable during installation, avoids the problem of position misalignment and wrong direction during the welding process of the PCB board and the shielding cover, greatly increases the success rate of welding of the PCB board and the shielding cover, greatly improves the production efficiency of the PCB board, and reduces the cost caused by rework, and the groove width of the positioning groove is greater than the wall thickness of the shielding cover to form a gap that can accommodate solder, which solves the problem of empty solder joints and cold solder joints in the welding of the shielding cover and the PCB board.

Description

Technical Field

[0001] The present invention relates to the technical field of the production, processing and installation of PCB boards, and particularly to a PCB board, a manufacturing method thereof, an electronic module and an assembly method thereof. Background Art

[0002] A shielding cover is a metal cover that can prevent electromagnetic interference and shield the components on the PCB. The shielding cover isolates two spatial regions to control the induction and radiation of electromagnetic waves from one region to another.

[0003] Shielding covers have been widely used in electronic products. With the miniaturization of the volume and the diversification of functions of electronic products, the shapes and sizes of shielding covers are becoming more and more diverse and complex. Due to the uncertainty of the shape of the shielding cover product and the PCB layout, most shielding covers are customized parts.

[0004] In the SMT process of the entire manufacturing process of the PCB bare board through surface mount technology and then through double-in wire mount plug-in, in the first step, the components are first placed at the designated positions on the PCB, and then the direction and position are checked for accuracy. After confirmation, in the second step, the shielding cover is placed at the designated position on the PCB. At this time, the direction and position of the shielding cover need to be checked and confirmed again before entering the reflow oven. After cooling out of the oven, the welding quality of the entire board of SMT devices needs to be checked for the third time.

[0005] In addition, the existing installation method of the shielding cover is as follows: solder paste is brushed on the pads of the PCB board, and then the shielding cover is placed in the area where the solder paste is provided. The PCB board and the shielding cover are welded together through the reflow soldering process. This installation method has the problem of void soldering and false soldering when the shielding cover is welded to the PCB, which affects the welding strength between the shielding cover and the PCB board. Summary of the Invention

[0006] The present invention discloses a PCB board, a manufacturing method thereof, an electronic module and an assembly method thereof. By opening a positioning groove matching with the shielding cover in the area of the PCB board for installing the shielding cover, and the groove width of the positioning groove is greater than the wall thickness of the shielding cover to form a gap that can accommodate the soldering agent, the problem of void soldering and false soldering in the welding of the shielding cover and the PCB board is solved. At the same time, the accuracy of the welding position between the PCB board and the shielding cover is ensured.

[0007] The technical solution provided by the present invention is as follows:

[0008] A PCB board, comprising:

[0009] A PCB board, provided with a positioning groove for installing a shielding cover, the groove width of the positioning groove is greater than the wall thickness of the shielding cover to form a gap, and the gap can at least partially accommodate the soldering agent.

[0010] In this technical solution, by providing positioning grooves on the PCB board for installing the shielding cover, the shielding cover is more stable during installation, avoiding problems such as misalignment and incorrect orientation during the welding process of the PCB board and the shielding cover, greatly increasing the success rate of welding the PCB board and the shielding cover, significantly improving the production efficiency of the PCB board, reducing the cost brought by rework, and the groove width of the positioning groove is greater than the wall thickness of the shielding cover to form a gap for accommodating the welding agent, solving the problem of void soldering and false soldering in the welding of the shielding cover and the PCB board.

[0011] Preferably, the groove width of the positioning groove is 1.5 - 2.5 times the wall thickness of the shielding cover.

[0012] In this technical solution, setting the groove width of the positioning groove within this range not only meets the placement of the shielding cover but also is conducive to better accommodating the welding agent in the gap.

[0013] Preferably, the positioning groove can be a closed groove or an intermittent groove.

[0014] In this technical solution, the specific form of the positioning groove can be set according to actual needs, increasing the diversity of the forms of the positioning groove.

[0015] A PCB board pre-coated with a welding agent, including any of the above-mentioned PCB boards, wherein;

[0016] Pre-coat the welding agent on the PCB board, so that the welding agent is cooled and fixed on the PCB board, and the welding agent is arranged on both sides of the positioning groove close to the positioning groove.

[0017] In this technical solution, by pre-coating the welding agent on the PCB board, the efficiency of subsequent assembly of the shielding cover is greatly accelerated, and the production efficiency is significantly improved.

[0018] An electronic module, including: any of the above-mentioned PCB boards;

[0019] The shielding cover is installed in the positioning groove;

[0020] The welding agent is arranged in the positioning groove and fixes the shielding cover and the PCB board.

[0021] In this technical solution, using a PCB board with positioning grooves to install the shielding cover solves the problem of void soldering and false soldering in the welding of the shielding cover and the PCB board. At the same time, it ensures the accuracy of the welding position of the PCB board and the shielding cover, greatly improving the performance of the electronic module.

[0022] A manufacturing method of a PCB board, including:

[0023] A PCB board, with a positioning groove provided on the PCB board. The positioning groove can be used to install a shielding cover, and the groove width of the positioning groove is greater than the wall thickness of the shielding cover to form a gap.

[0024] In this technical solution, by providing a positioning groove for installing a shielding cover on the PCB board, the accuracy of the welding position between the PCB board and the shielding cover is ensured.

[0025] Preferably, the positioning groove is processed by an etching method.

[0026] In this technical solution, when etching the metal circuit on the PCB board, the positioning groove is etched out at the same time. Without affecting the manufacturing process of the PCB board, the positioning groove is added, thus greatly shortening the manufacturing process of the PCB board and further increasing the production efficiency.

[0027] An assembly method for an electronic module, using the PCB board; wherein,

[0028] Step S20: Pre-apply a welding agent at a position close to the positioning groove;

[0029] Step S21: Place the shielding cover in the positioning groove;

[0030] Step S22: Put the shielding cover and the PCB board into a furnace for heating. The welding agent melts and flows into the positioning groove to contact the shielding cover, and then take out the shielding cover and the PCB board to cool.

[0031] In this technical solution, during SMT component placement, the installation of the shielding cover on the PCB board is realized, the manufacturing process is shortened, and the production efficiency is further increased. More preferably, through this installation method, the problems of void soldering and false soldering in the welding between the shielding cover and the PCB board are solved. At the same time, the accuracy of the welding position between the PCB board and the shielding cover is ensured.

[0032] Preferably, the welding agent is applied to both side edges of the groove width of the positioning groove and close to the positioning groove.

[0033] In this technical solution, the welding agent is brushed on both side edges of the groove width of the positioning groove and close to the positioning groove, which is convenient for the welding agent to flow into the positioning groove after melting, greatly improving the reliability of the assembly.

[0034] Preferably, the welding agent is flush with the PCB board.

[0035] In this technical solution, the reliability of the welding agent flowing into the positioning groove after melting is further increased.

[0036] Compared with the prior art, a PCB board, a manufacturing method thereof, a shielding cover, and an installation method for the PCB board and the shielding cover disclosed by the present invention have the following beneficial effects:

[0037] 1. By setting positioning grooves for installing shielding covers on the PCB board, the shielding covers are more stable during installation, avoiding problems such as misalignment and incorrect orientation during the welding process of the PCB board and the shielding cover, greatly increasing the success rate of welding the PCB board and the shielding cover, significantly improving the production efficiency of the PCB board, and reducing the costs brought by rework.

[0038] 2. During SMT component placement, the installation of the shielding cover on the PCB board is realized, shortening the manufacturing process and further increasing the production efficiency. More preferably, through this installation method, the problems of void soldering and false soldering in the welding of the shielding cover and the PCB board are solved. At the same time, the accuracy of the welding position between the PCB board and the shielding cover is ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The following will further illustrate the above characteristics, technical features, advantages and their implementation manners of a PCB board, its manufacturing method, an electronic module and its assembly method in a clear and understandable manner in combination with the drawings.

[0040] Figure 1 is a schematic structural diagram of the assembled PCB board and shielding cover of the present invention;

[0041] Figure 2 is a schematic structural diagram of the PCB board of the present invention;

[0042] Figure 3 is a schematic structural diagram of the shielding cover of the present invention;

[0043] Figure 4 is a schematic structural diagram of the shielding cover placed in the positioning groove coated with welding agent;

[0044] Figure 5 is a process flow chart of the PCB board manufacturing process of the present invention.

[0045] EXPLANATION OF THE REFERENCE NUMBERS IN THE DRAWINGS:

[0046] PCB board 100, positioning groove 101, substrate 111, conductive metal sheet 112, dry film 113, circuit negative film 114, shielding cover 200, welding agent 300. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the specific embodiments of the present invention will be described below with reference to the drawings. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings and other embodiments can be obtained.

[0048] For the sake of simplicity of the drawings, only the parts related to the present invention are schematically shown in each drawing, and they do not represent the actual structure of the product as a whole. In addition, for the sake of simplicity and easy understanding of the drawings, in some drawings, for components with the same structure or function, only one of them is schematically shown, or only one of them is labeled. In this text, "one" not only means "only this one", but also can mean "more than one" situation.

[0049] An embodiment disclosed by the present invention, referring to Figure 1 and 2 As shown, a PCB board includes a PCB board 100. Among them, the PCB board 100 is provided with a positioning groove 101 in the installation area of the shielding cover 200. It should be noted that the groove width of the positioning groove 101 is greater than the wall thickness of the shielding cover 200 to form a gap, and at least part of the soldering agent 300 can be accommodated in the gap. The commonly used soldering agent 300 is solder paste. By providing the positioning groove 101 for installing the shielding cover 200 on the PCB board 100, the shielding cover 200 is more stable during installation, avoiding the problems of misalignment and incorrect direction during the welding process of the PCB board 100 and the shielding cover 200, greatly increasing the welding success rate of the PCB board 100 and the shielding cover 200, greatly improving the production efficiency of the PCB board 100, and reducing the cost brought by rework.

[0050] More preferably, referring to Figure 2 As shown, the positioning groove 101 is a closed annular groove. In actual production, the positioning groove 101 can be a closed groove or an intermittent groove. By setting the positioning groove 101 as an annular groove, it is convenient to set all the welding positions of the shielding cover 200 within the positioning groove 101, further increasing the stability of the shielding cover 200 placed in the positioning groove 101, and greatly improving the accuracy of the welding position of the PCB board 100 and the shielding cover 200. Of course, in actual production, the specific shape of the positioning groove 101 is determined according to the size of the electronic components that need to be shielded and protected on the actual PCB board 100.

[0051] More preferably, the groove width of the positioning groove 101 is 1.5 - 2.5 times the wall thickness of the shielding cover 200. Setting the groove width of the positioning groove 101 within this range can not only meet the placement of the shielding cover 200, but also is beneficial for the gap to better accommodate the soldering agent 300.

[0052] It should be noted that there are no mandatory requirements for the specific design dimensions of the groove width and groove depth of the positioning groove 101. In principle, on the premise of meeting the installation of the shielding cover 200 and ensuring the structural strength of the PCB board 100, the specific features of the positioning groove 101 can be set according to actual production needs.

[0053] In another embodiment disclosed by the present invention, referring to Figure 2As shown in the figure, a PCB board pre-coated with a soldering agent uses the PCB board in the above embodiment. Specifically, the soldering agent 300 is pre-coated on the PCB board 100 and fixed on the PCB board 100 after cooling. Moreover, the soldering agent 300 is located on both sides of the positioning groove 101 and close to the positioning groove 101. By pre-coating the soldering agent 300 on the PCB board 100, the efficiency of subsequent assembly of the shielding cover 200 is greatly improved, and the production efficiency is extremely enhanced.

[0054] In another embodiment disclosed by the present invention, referring to Figure 1 As shown in the figure, an electronic module includes the PCB board 100 in any of the above embodiments, the positioning groove 101 on the PCB board 100 for installing and securing the shielding cover 200, and the soldering agent 300 is disposed in the positioning groove 101 to fix the shielding cover 200 and the PCB board 100. By using the PCB board 100 provided with the positioning groove 101 to install the shielding cover 200, the problems of dry soldering and false soldering in the welding of the shielding cover 200 and the PCB board 100 are solved. Meanwhile, the accuracy of the welding position between the PCB board 100 and the shielding cover 200 is ensured, and the performance of the electronic module is greatly improved.

[0055] In another embodiment disclosed by the present invention, a manufacturing method of a PCB board includes: setting a positioning groove 101 on the PCB board 100, and the groove width of the positioning groove 101 is greater than the wall thickness of the shielding cover 200, so that a certain gap can be formed when the shielding cover 200 is installed in the positioning groove 101. The positioning groove is processed by etching, and the steps of the manufacturing method of the PCB board 100 will be specifically given below.

[0056] Referring to Figure 5As shown in the figure, the steps of the manufacturing method include: Step S10: First, a conductive metal sheet 112 is connected to the surface of the substrate 111, and the conductive metal sheet 112 is attached to the surface of the substrate 111. Generally, the surface size of the substrate 111 is the same as that of the conductive metal sheet 112. Step S11: A dry film 113 is attached to the surface of the conductive metal sheet 112, and a stamping process is performed. It should be noted that the conductive metal sheet 112 is located between the dry film 113 and the substrate 111. Step S12: A circuit negative film 114 is attached to the surface of the dry film 113. Among them, the circuit negative film 114 is provided with a pattern layer having the same specification size as the positioning groove 101 at the position corresponding to the installation of the shielding cover 200, and an exposure process is performed by irradiating UV light; the pattern layer is printed on the dry film 113; it should be noted that the pattern layer also includes a circuit pattern. Step S13: The pattern layer on the dry film 113 is developed with a developer, and the dry film 113 without the printed pattern layer on the dry film 113 is removed, exposing a part of the conductive metal sheet 112. The developer is sodium carbonate. Step S14: The conductive metal sheet 112 is etched into a pattern layer with an etching solution. It should be noted that the etched part is the exposed conductive metal sheet 112. Step S15: The remaining dry film 113 is removed. That is, the manufacturing process of the PCB board 100 is completed. When etching, the circuit diagram and the positioning groove 101 are processed.

[0057] More preferably, the above-mentioned conductive metal sheet 112 is made of copper foil metal. The copper foil metal has the advantages of being easily adhered to the substrate 111 and having good conduction performance, which greatly improves the performance of the PCB board 100. Further preferably, the manufacturing material of the substrate 111 is PP polyester fiberglass. The substrate 111 is made of PP polyester fiberglass material, which greatly enhances the tensile strength and bending strength of the substrate 111, and is more heat-resistant, increasing the service life of the PCB board 100.

[0058] In another embodiment disclosed in the present invention, refer to Figures 1-4 As shown in the figure, an assembly method of an electronic module includes, when performing SMT component placement: Step S20: Pre-brush a soldering agent 300 on the PCB board 100, where the soldering agent 300 is brushed on both sides of the positioning groove 101; Step S21: Install the shielding cover 200 in the positioning groove 101; Step S22: Put the shielding cover 200 and the PCB board 100 into a furnace for heating. After the soldering agent 300 melts and flows into the positioning groove 101, take out the shielding cover 200 and the PCB board 100 to cool, and the soldering agent 300 welds the shielding cover 200 and the PCB board 100.

[0059] By realizing the installation of the shielding cover 200 on the PCB board 100 during SMT component placement, the manufacturing process is greatly shortened, and the production efficiency is further increased. More preferably, by this installation method, the problems of dry soldering and false soldering in the welding of the shielding cover 200 and the PCB board 100 are solved. At the same time, the accuracy of the welding position between the PCB board 100 and the shielding cover 200 is ensured.

[0060] More preferably, the welding agent 300 is flush with the PCB board 100, further increasing the reliability of the welding agent 300 flowing into the positioning groove 101 after melting.

[0061] It should be noted that the above embodiments can be freely combined as needed. The above are only the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for assembling an electronic module, characterized in that: A PCB board manufactured by a method for manufacturing a PCB board; a positioning groove is provided on the PCB board, the positioning groove is used for installing a shielding cover, and the groove width of the positioning groove is greater than the wall thickness of the shielding cover to form a gap; The manufacturing steps of the PCB board specifically include: Step S10: First, connect a conductive metal sheet to the surface of the substrate, and the conductive metal sheet is attached to the surface of the substrate; Step S11: Attach a dry film to the surface of the conductive metal sheet and perform a pressing mold treatment; Step S12: Attach the circuit negative film to the surface of the dry film. Among them, a pattern layer with the same specifications as the positioning groove is provided at the position of the circuit negative film corresponding to the installation of the shielding cover. The pattern layer also includes a circuit pattern, and the pattern layer is printed on the dry film; Step S13: Develop the pattern layer on the dry film with a developer, remove the dry film on the dry film where the pattern layer is not printed, and expose part of the conductive metal sheet; Step S14: Etch the conductive metal sheet into a pattern layer with an etching solution to process a circuit diagram and a positioning groove; Step S15: Remove the remaining dry film; Among them, it also includes: Step S20: Brush a welding agent in advance at a position close to the positioning groove; Step S21: Place the shielding cover in the positioning groove; Step S22: Place the shielding cover and the PCB board in a furnace for heating, and the welding agent melts and flows into the positioning groove to contact the shielding cover, and take out the shielding cover and the PCB board to cool.

2. The method for assembling an electronic module according to claim 1, characterized in that, The welding agent is applied to both sides of the groove width of the positioning groove and is close to the positioning groove.

3. The method for assembling an electronic module according to claim 2, characterized in that, The edge of the welding agent is flush with the edge of the positioning groove of the PCB board.

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