A dielectric filter and a multi-order dielectric filter
By designing a specific through-hole structure on the dielectric body of the ceramic dielectric filter and adjusting its size, the complex structure and large volume problems of traditional ceramic dielectric filters in multi-mode and multi-order filtering are solved, and efficient frequency selection and space utilization are achieved.
Patent Information
- Application Number
- CN202010878252.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-08-27
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2040-08-27
AI Technical Summary
Traditional ceramic dielectric filters have complex structure and large volume in realizing multi-mode multi-order filtering, resulting in poor frequency selection performance.
A specific through-hole structure is formed on the dielectric body, including two first through-holes and two second through-holes, and frequency adjustment of the two resonant modes of TM110 and TE111 is achieved by adjusting the diameter and height of the dielectric body, thereby forming a four-mode dual-channel dielectric filter.
The implementation of dual-channel second-order filtering on a single dielectric resonator is achieved, which improves frequency selectivity, reduces the overall size of the resonator, improves space utilization, and simplifies the structure without the need for additional mounting parts.
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Figure CN111969287B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of microwave filtering, and in particular to a dielectric filter and a multi-order dielectric filter. Background Art
[0002] In wireless communication systems, filters are indispensable frequency selection devices. With the rapid development of communication technology, the requirements for the size and weight of RF front-end filters are getting higher and higher. Among them, ceramic dielectric filters based on high dielectric constant and low loss angle ceramics have broad application prospects due to their compact size and excellent performance. However, traditional ceramic dielectric filters have complex structures and large volumes in achieving multi-mode and multi-order filtering, resulting in poor frequency selection performance of ceramic dielectric filters. Summary of the invention
[0003] The present application provides a dielectric filter and a multi-order dielectric filter to solve the problem that the traditional ceramic dielectric filter has a complex structure and a large volume in realizing multi-mode and multi-order filtering, resulting in poor frequency selection performance of the ceramic dielectric filter.
[0004] According to a first aspect of the present application, there is provided a dielectric filter, comprising a dielectric body, wherein the dielectric body has two surfaces disposed opposite to each other in a thickness direction and a side surface located between the two surfaces;
[0005] Two first through holes and two second through holes are formed on the dielectric body, wherein one of the first through hole and the second through hole penetrates from one of the two surfaces to the side surface, and the other of the first through hole and the second through hole penetrates from the other of the two surfaces to the side surface;
[0006] A line connecting the two first through holes and a line connecting the two second through holes intersect with the axis of the dielectric body respectively; one of the first through hole and the second through hole is used to couple with a pair of frequency mode generating sources respectively.
[0007] In a possible design, two chamfered inclined surfaces are further formed on the medium body, and the two chamfered inclined surfaces extend from two opposite surfaces of the medium body to the side surfaces respectively.
[0008] In a possible design, the two chamfered inclined surfaces surround the medium body.
[0009] In a possible design, the first through hole and the second through hole respectively penetrate to the chamfered inclined surface.
[0010] In a possible design, the medium body is cylindrical, and the ratio of the diameter to the height of the medium body is 1.8 to 2.6.
[0011] In a possible design, the two surfaces, the side surface, the first through hole, and the second through hole are all covered with a conductive metal plating layer.
[0012] In a possible design, the dielectric filter further includes an isolating member, which is located on the two surfaces and is disposed around the first through hole and the second through hole respectively; the isolating member is used to isolate the first through hole and the second through hole from the shielding zone.
[0013] In a possible design, the first through hole and the second through hole are respectively in an “L” shape, a “T” shape or a “X” shape.
[0014] In a possible design, both the first through hole and the second through hole have a vertical hole section and a horizontal hole section, and the hole diameters of the vertical hole section and the horizontal hole section are different.
[0015] According to a second aspect of the present application, a multi-order dielectric filter is provided, comprising at least two dielectric filters provided in any possible design of the first aspect of the present application, wherein the first through holes and the second through holes of the two dielectric filters are aligned respectively; and the first through holes and the second through holes on the sides of the two dielectric filters that are in contact with each other are electrically connected respectively.
[0016] The present application provides a dielectric filter and a multi-order dielectric filter, wherein the dielectric filter is formed by forming two first through holes and two second through holes on a dielectric body, and one of the first through holes and the second through hole penetrates from one of the two oppositely disposed surfaces of the dielectric body to the side surface of the dielectric body, and the other first through hole and the second through hole penetrate from the other surface of the dielectric body to the side surface; in this way, a resonance channel is formed between the two first through holes, and another resonance channel is formed between the two second through holes; and one of the first through holes and the second through hole are respectively used to couple with a pair of frequency mode generation sources; the frequencies of the two resonance modes TM110 and TE111 can be simultaneously adjusted to the required filter operating frequency by adjusting the diameter and height of the dielectric body; at the same time, the two resonance modes TM110 and TE111 both have polarization degenerate modes TM110d and TE111d; therefore, two pairs of resonance modes with similar frequencies exist in the dielectric body at the same time; thereby forming a four-mode dual-channel dielectric filter. Compared with traditional dielectric filters, the dielectric filter provided in the present application reduces the overall size of the resonator, realizes dual-channel second-order filtering on a single dielectric resonator, effectively improves the frequency selectivity of the dielectric filter, greatly improves the space utilization, and has a simple structure and does not require other installation parts. While saving production and processing costs, it is also easy to integrate with circuit board surface assembly technology (Surface Mount Technology, SMT).
[0017] The structure of the present application as well as its other objectives and beneficial effects will be described in detail in conjunction with the accompanying drawings to ensure that the description of the preferred embodiments is more obvious and understandable. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0019] Figure 1 It is a schematic diagram of the overall perspective structure of the dielectric filter provided in an embodiment of the present application;
[0020] Figure 2 yes Figure 1 The main view;
[0021] Figure 3 yes Figure 1 A top view of
[0022] Figure 4 A four-mode dual-channel topological structure diagram of a dielectric filter provided in an embodiment of the present application;
[0023] Figure 5 is a graph showing the relationship between the height of the first through hole and the second through hole penetrating to the side wall of the dielectric body and the frequency of each mode and Qe in the dielectric filter provided by the embodiment of the present application;
[0024] Figure 6 is a graph showing the relationship between the opening distances between the first through hole and the second through hole on the two surfaces of the dielectric body and the center distance of the dielectric body and the frequency of each mode and Qe in the dielectric filter provided by the embodiment of the present application;
[0025] Figure 7 is a frequency response curve diagram of a specific example of a dielectric filter provided in an embodiment of the present application;
[0026] Figure 8 is a schematic diagram of the overall perspective structure of a multi-order dielectric filter provided by another embodiment of the present application;
[0027] Fig. 9 yes Figure 8 The main view;
[0028] Fig.10 is a schematic diagram of the topological structure of a multi-order dielectric filter provided in another embodiment of the present application;
[0029] Fig.11 It is a frequency response curve diagram of a specific example of a multi-order dielectric filter provided in another embodiment of the present application.
[0030] Description of reference numerals:
[0031] 10- dielectric filter;
[0032] 100-medium body;
[0033] 101- surface; 102- side surface; 103- first through hole; 104- second through hole;
[0034] 1021- chamfered bevel;
[0035] 200-Isolators. Specific embodiments
[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0037] In the description of the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "plurality" means at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.
[0038] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0039] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0040] In the description of this application, it should be understood that the terms "inside", "outside", "upper", "bottom", "front", "back" and the like indicate directions or positional relationships (if any) based on the attached Figure 1 The orientation or positional relationship shown is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0041] Figure 1 is a schematic diagram of the overall perspective structure of the dielectric filter provided in the embodiment of the present application, Figure 2 yes Figure 1 The main view, Figure 3 yes Figure 1 Top view of the .
[0042] Reference Figure 1-Figure 3 As shown, an embodiment of the present application provides a dielectric filter 10 , including a dielectric body 100 , wherein the dielectric body 100 has two surfaces 101 disposed opposite to each other along a thickness direction and a side surface 102 located between the two surfaces 101 .
[0043] Specifically, refer to Figure 1-Figure 3 As shown, in the embodiment of the present application, the thickness direction of the medium body 100 may specifically refer to the vertical direction. It should be noted that in some possible examples, the placement direction of the medium body 100 may be in Figure 2 The thickness direction of the medium body 100 may refer to the horizontal direction.
[0044] Two first through holes 103 and two second through holes 104 are formed on the dielectric body 100 , wherein one of the first through hole 103 and the second through hole 104 penetrates from one of the two surfaces 101 to the side surface 102 , and the other first through hole 103 and the second through hole 104 penetrates from the other of the two surfaces 101 to the side surface 102 .
[0045] Specifically, in the embodiment of the present application, one of the first through hole 103 and the second through hole 104 may extend from the upper surface of the dielectric body 100 to the inside of the dielectric body 100 and pass through the side 102 of the dielectric body 100. Another first through hole 103 and the second through hole 104 may extend from the lower surface of the dielectric body 100 to the inside of the dielectric body 100 and pass through the side 102 of the dielectric body 100. In specific production and processing, the dielectric body 100 of the embodiment of the present application and the first through hole 103 and the second through hole 104 formed on the dielectric body 100 may be directly integrally formed; in other possible ways, the dielectric body 100 may be formed first, and then a blind hole section may be dug from the upper surface of the dielectric body 100 to the inside of the dielectric body 100, and a blind hole section may be dug from the side 102 of the dielectric body 100 to the inside of the dielectric body 100, so that the two blind hole sections are connected to each other to form the first through hole 103 or the second through hole 104. It should be noted that the first through hole 103 and the second through hole 104 formed from the lower surface of the dielectric body 100 can also be formed by digging blind hole segments, so as to facilitate the processing and forming of the first through hole 103 and the second through hole 104 and improve the production efficiency of the dielectric filter.
[0046] Optionally, during the production process of the first through hole 103 and the second through hole 104, after the blind holes dug from the two surfaces 101 of the medium body 100 to the inside are dug, another blind hole can be dug from the side 102 adjacent to the blind hole to the inside of the medium body 100, or another blind hole can be dug from the side 102 away from the blind hole to the inside of the medium body 100, so as to connect with the already dug blind holes to form the first through hole 103 and the second through hole 104.
[0047] In order to ensure the overall strength of the medium body 100 and improve the production efficiency, in the embodiment of the present application, optionally, another blind hole is dug from the side surface 102 of the blind hole that has been dug to the inside of the medium body 100, so that the two blind holes are connected to form the first through hole 103 or the second through hole 104. In this way, the digging depth of the other blind hole is reduced, the overall strength of the medium body 100 is effectively ensured, and the operation efficiency is improved.
[0048] The connecting line of the two first through holes 103 and the connecting line of the two second through holes 104 are respectively aligned with the axis of the dielectric body 100 (eg Figure 1 or Figure 2 One of the first through hole 102 and the second through hole 103 is respectively used to couple with a pair of frequency mode generating sources.
[0049] Specifically, refer to Figure 1 and Figure 2 As shown, one of the first through holes 103 is located on one side of the axis II from the surface 101 (eg Figure 2 The top surface shown in FIG) penetrates to the side surface 102 of the dielectric body 100; another first through hole 103 may be on the other side of the axis II from the surface 101 of the dielectric body 100 (eg Figure 2 The bottom surface shown in FIG. 1 is a bottom surface shown in FIG. 1 ) penetrates to the side surface 102 of the dielectric body 100; and, the two first through holes 103 and the axis II are located in the same plane; thus, after one of the first through holes 103 is coupled with a pair of frequency mode generating sources, the two first through holes 103 serve as port excitations of the dielectric filter, thereby forming one channel of the dual-channel dielectric filter. Figure 4 The four-mode dual-channel topological structure diagram of the dielectric filter provided in the embodiment of the present application. Figure 4 As shown, the first through hole 103 is coupled to the source of the frequency mode TM110 mode and the TE111 mode. Since both the TM110 mode and the TE111 mode have polarization degenerate modes, there are two pairs of resonant modes with similar frequencies in the dielectric body 100. For example Figure 4 The TM110 mode and TE111 mode and the corresponding degenerate modes TM110d mode and TE111d mode are shown in FIG.
[0050] The strength of the source coupling can be adjusted by adjusting the height of the first through hole 103 extending through the side surface 102 of the dielectric body 100 (for example, Figure 2 H) or adjusting the eccentric distance of the first through hole 103 from the top surface or bottom surface of the dielectric body 100 to the axis II (for example Figure 2 D) shown in Figure 2 is used to adjust. Figure 5: is a graph showing the relationship between the height of the first through hole and the second through hole penetrating to the side wall of the dielectric body and the frequency of each mode and Qe in the dielectric filter provided by the embodiment of the present application. Figure 5 As shown in FIG. 1 , as the height H increases, the external coupling Qe of the TM110 mode decreases, that is, the coupling strength increases; while the external coupling Qe of the TE111 mode increases, that is, the coupling strength decreases. Figure 6 : is a graph showing the relationship between the opening distances between the first through hole and the second through hole on the two surfaces of the dielectric body and the center distance of the dielectric body and the frequency of each mode and Qe in the dielectric filter provided by the embodiment of the present application. Figure 6 As shown in FIG. 1 , as the eccentric distance D increases, the external coupling Qe of the TM110 mode increases, that is, the coupling strength decreases; while the external coupling Qe of the TE111 mode decreases, that is, the coupling strength increases.
[0051] Through the above description and Figure 5 as well as Figure 6 It can be seen that when producing a dielectric filter, the coupling strength between the TM110 mode and TE111 mode generating sources and the dielectric filter can be adjusted by adjusting the height H of the first through hole 103 and / or the second through hole 104 penetrating to the side surface 102 of the dielectric body 100; or, the coupling strength between the TM110 mode and TE111 mode generating sources and the dielectric filter can be adjusted by adjusting the eccentric distance D of the first through hole 103 and / or the second through hole 104 on the two surfaces 101 of the dielectric body 100, so as to achieve a good coupling strength between the TM110 mode and the TE111 mode generating sources and the dielectric filter.
[0052] It should be noted that, since the degenerate modes of the TM110 mode and the TE111 mode, the TM110d mode and the TE111d mode, are orthogonal polarization degenerate modes of the TM110 mode and the TE111 mode; therefore, referring to Figure 1 or Figure 3 As shown, in the embodiment of the present application, the second through hole 104 and the first through hole 103 are arranged orthogonally. Figure 1 As shown, after the first through hole 103 is formed from the top surface of the dielectric body 100 to the inside, the dielectric body 100 is rotated 90° around its axis II to form a second through hole 104; accordingly, after another first through hole 103 is formed on the bottom surface of the dielectric body 100, the dielectric body 100 is rotated 90° around its axis II to form another second through hole 104. In this way, each first through hole 103 and the second through hole 104 are distributed at an angle of 90°. The two second through holes 104 together constitute another channel of the dielectric filter (such as Figure 4As shown), that is, one of the second through holes 104 is excited as an input port of the degenerate mode of the TM110 mode and the TE111 mode, and the other second through hole 104 is excited as an output port of the degenerate mode.
[0053] Therefore, the entire dielectric filter can select the TM110 mode and the TE111 mode and the corresponding degenerate mode TM110d mode and TE111 mode. In this way, a four-mode dual-channel second-order filter is constructed on the dielectric body 100 with limited space, which effectively improves the selectivity of the dielectric filter to the frequency and the out-of-band suppression effect, reduces the overall size of the resonator, and greatly improves the space utilization rate; and the structure is simple, does not need to install other parts, and is easy to integrate with SMT while saving production and processing costs.
[0054] In order to further improve the out-of-band suppression effect of the dielectric filter and the suppression of adjacent high-order modes, in one possible way, referring to Figure 1 As shown, in the embodiment of the present application, two chamfered inclined surfaces 1021 are further formed on the dielectric body 100 , and the two chamfered inclined surfaces 1021 extend from two opposite surfaces 101 of the dielectric body 100 to the side surface 102 , respectively.
[0055] Specifically, during specific manufacturing, the chamfer length to be chamfered can be determined from the edge of the dielectric body 100 to the axis II, and then the chamfer angle can be determined, and the edge of the dielectric body 100 can be cut to form a chamfered slope 1021; in some possible ways, the chamfered slope 1021 can also be formed together with the dielectric body 100. Optionally, the angles of the two chamfered slopes are 30° to 60°. In a specific example, the angle of the chamfered slope is 45°.
[0056] It is understandable that the formation of the chamfered slope 1021 can also be determined by determining the chamfer length from the edge of the medium body 100 to the axis II, and determining the chamfer height upward or downward from the edge of the medium body 100. In the embodiment of the present application, the specific determination method of the chamfered slope 1021 is not limited.
[0057] Optionally, the two chamfered slopes 1021 surround the medium body 100 .
[0058] Specifically, refer to Figure 1-Figure 3 As shown, in the embodiment of the present application, the overall structure of the medium body 100 can be cylindrical, and two chamfered inclined surfaces 1021 are respectively arranged at both ends of the cylindrical medium body 100 and around the medium body 100. It should be noted that the cylindrical medium body is only used as a specific example for illustration, and in some possible examples, the medium body may also be a cubic structure or a prism structure with equal length and width.
[0059] Further, see Figure 1-Figure 3 As shown, in the embodiment of the present application, the first through hole 103 and the second through hole 104 respectively penetrate to the chamfered inclined surface 1021 .
[0060] Specifically, refer to Figure 1 and Figure 2 As shown, after two chamfered inclined surfaces 1021 are formed on the dielectric body 100, the entire dielectric body 100 is a whole formed of mutually symmetrical truncated cone blocks.
[0061] In the embodiment of the present application, a chamfered bevel 1021 is formed on the dielectric body 100, and the first through hole 103 and the second through hole 104 serving as the port excitation of the dielectric filter respectively penetrate the chamfered bevel 1021. In this way, the chamfered bevel 1021 can increase the frequency of the adjacent high-order mode (such as the TM011 mode), while having little effect on the TM110 mode and the TE111 mode that require frequency selection; therefore, by forming the chamfered bevel 1021 on the dielectric body 100, the interference of the adjacent high-order mode on the frequency response near the operating frequency is reduced, that is, the out-of-band suppression effect of the dielectric filter is improved, and the frequency selectivity of the dielectric filter is improved.
[0062] It should be noted that due to the field distribution characteristics of the TM110 and TE111 modes, the frequencies of the two modes can be adjusted respectively by adjusting the diameter and height of the dielectric body 100, so that the dielectric filter meets the working frequency selection requirements. Among them, adjusting the diameter has a greater impact on the frequency of the TM110 mode, but has no obvious effect on the frequency of the TE111 mode. Increasing the diameter of the dielectric body 100 can reduce the frequency of the TM110 mode, and reducing the diameter of the dielectric body 100 can increase the frequency of the TM110 mode. Adjusting the height of the dielectric body 100 has a greater impact on the frequency of the TE111 mode, but has no obvious impact on the frequency of the TM110 mode. Increasing the height of the dielectric body 100 can reduce the frequency of the TE111 mode, and reducing the height of the dielectric body 100 can increase the frequency of the TE111 mode.
[0063] Therefore, in order to ensure that the dielectric filter can select the TM110 mode and the TE111 mode at the same time, in the embodiment of the present application, the ratio of the diameter to the height of the dielectric body 100 is 1.8 to 2.6. Optionally, the ratio of the diameter to the height of the dielectric body is 2.2. In this way, it is ensured that the dielectric filter can select the TM110 mode and the TE111 mode at the same time, effectively ensuring the realization of the multi-mode dielectric filter.
[0064] Optionally, to further reduce the insertion loss of the dielectric filter, in the embodiment of the present application, both surfaces 101 , the side surface 102 , the first through hole 103 and the second through hole 104 of the dielectric body 100 are covered with a conductive metal plating layer.
[0065] Specifically, all exposed surfaces of the dielectric body 100 are covered with a conductive metal coating. In a specific design, the conductive metal coating can be covered by surface electroplating. The conductive metal coating can be a metal with high electrical conductivity such as silver plating or copper plating.
[0066] Reference Figure 1-Figure 3 As shown, in the embodiment of the present application, the dielectric filter 10 further includes an isolating member 200, which is located on the two surfaces 101 and is respectively arranged around the first through hole 103 and the second through hole 104; the isolating member 200 is used to isolate the first through hole 103 and the second through hole 104 from the shielding zone.
[0067] Specifically, after the dielectric body 100 is covered with a conductive metal plating layer, the conductive metal plating layer forms an isolation zone on the outer surface of the dielectric body 100. Since the first through hole 103 and the second through hole 104 are coupled with the mode source as the port excitation of the dielectric filter 10, a non-electroplating isolation member 200 is provided at the periphery of the first through hole 103 and the second through hole 104 located on the surface 101, thereby effectively ensuring that the first through hole 103 and the second through hole 104 can be effectively coupled with the mode source. Optionally, the isolation member 200 can be an isolation ring surrounding the first through hole 103 or the second through hole 104. It can be understood that the isolation ring can be an isolation ring made of the same material as the dielectric body 100, such as a ceramic material with a higher dielectric constant. Of course, the material of the isolation ring and the dielectric body 100 can also be different, and the isolation ring only needs to be a non-electroplating isolation ring to isolate the first through hole 103 and the second through hole 104 as the port excitation of the dielectric filter 10 from the shielding zone.
[0068] Optionally, the first through hole 103 and the second through hole 104 are respectively in an "L" shape, a "T" shape or a "X" shape. In this application, the "L" shape is used as a specific example of the first through hole 103 and the second through hole 104 in the drawings of the specification. The processing and forming method of the first through hole 103 and the second through hole 104 can refer to the above description, which will not be repeated here.
[0069] In order to improve the flexibility of the overall design of the dielectric filter, in some possible ways, the coupling strength between the dielectric filter and the mode source can be adjusted by appropriately adjusting the apertures of the two hole sections of the first through hole 103 and the second through hole 104. Figure 1 and Figure 2As shown, both the first through hole 103 and the second through hole 104 have a vertical hole section and a horizontal hole section, and the aperture d1 of the vertical hole section is different from the aperture d2 of the horizontal hole section. That is, in some possible examples, the aperture d1 of the vertical hole section is larger than the aperture d2 of the horizontal hole section; in other possible examples, the aperture d1 of the vertical hole section is smaller than the aperture d2 of the horizontal hole section. Of course, in some possible cases, the aperture d1 of the vertical hole section may also be equal to the aperture d2 of the horizontal hole section.
[0070] As a specific example, refer to Figure 7 As shown, Figure 7 is a frequency response curve diagram of a specific example of a dielectric filter provided in an embodiment of the present application. Specifically, Figure 7 The figure shows the frequency response curve of a four-mode dual-channel dielectric filter with a center frequency of 3.5GHz and a passband width of about 80MHz. The four-mode dual-channel dielectric filter uses a ceramic dielectric material with a dielectric constant of 20, a dielectric body 100 with a diameter of 27.3mm, a height of 11.8mm, a chamfer length of 5.0mm, and an angle of 45°. The surface of the four-mode dual-channel dielectric filter is covered with a conductive metal coating. At this time, the Q value of the TM110 mode and the TE111 mode is about 2500. Figure 7 It can be seen that the S21 curve has a transmission zero on each side of the passband to enhance the frequency selection characteristics. In addition, from the S31 and S41 curves, it can be seen that the interval between the dual-channel components of the filter is about 20dB, achieving good isolation between the dual channels.
[0071] It should be noted that the above is only a specific example to verify the isolation between the two channels and the frequency selectivity of the dielectric filter provided in the embodiment of the present application. In some possible examples, in order to further reduce the size of the dielectric filter, other ceramic materials with higher dielectric constants can also be used as the material of the dielectric body 100.
[0072] Figure 8 is a schematic diagram of the overall perspective structure of a multi-order dielectric filter provided by another embodiment of the present application, Fig. 9 It is a schematic diagram of the topological structure of a multi-order dielectric filter provided in another embodiment of the present application.
[0073] Reference Figure 8 and Fig. 9 As shown, as another optional embodiment of the present application, in order to obtain a wider passband bandwidth and a steeper out-of-band filtering characteristic, a multi-order dielectric filter is provided, comprising at least two dielectric filters 10 provided by the aforementioned embodiments, wherein the first through holes 103 and the second through holes 104 of the two dielectric filters 10 are respectively aligned; and the first through holes 103 and the second through holes 104 on the sides of the two dielectric filters 10 that contact each other are respectively electrically connected.
[0074] Specifically, refer to Figure 8 and Fig. 9 As shown, the first through hole 103 on one dielectric filter 10 is aligned with the first through hole 103 on another dielectric filter 10; correspondingly, the second through hole 104 on one dielectric filter 10 is aligned with the second through hole 104 on another dielectric filter. Fig.10 FIG. 1 is a schematic diagram of the topological structure of a multi-order dielectric filter provided in another embodiment of the present application. Fig.10 As shown, a multi-order filter channel is formed between the first through holes 103 on the two dielectric filters 10, and a multi-order filter channel is formed between the second through holes 104 on the two dielectric filters 10. Thus, the frequency is selected by multi-order filtering, further improving the frequency selectivity and out-of-band filtering characteristics.
[0075] Optionally, the two first through holes 103 on the mutually contacting side of the two dielectric filters 10 can be fixed by welding or other methods to achieve electrical connection; correspondingly, the two second through holes 104 on the mutually contacting side of the two dielectric filters 10 can also be fixed by welding or other methods to achieve electrical connection.
[0076] It should be noted that, similar to the design method of a single dielectric filter, the multi-order dielectric filter provided in the embodiment of the present application can also adjust the coupling strength of each section by adjusting the height H of the first through hole 103 or the first through hole 104 from penetrating to the chamfered inclined surface 1021, the eccentric distance D on the dielectric body 100, and the diameter d of the two sections of the through hole, and adjust the resonant frequencies of the two modes by adjusting the diameter and height of the dielectric body. For details, please refer to the detailed description of the above dielectric filter embodiment, which will not be repeated in this embodiment.
[0077] As a specific example, refer to Fig.11 As shown, Fig.11 is a frequency response curve diagram of a specific example of a multi-order dielectric filter provided by another embodiment of the present application. Figure 7 Similar, through Figure 7 The specific single dielectric filters shown in the figure are cascaded, from Fig.11 and Figure 7 From the comparison, it can be seen that after upgrading a single dielectric filter to a fourth-order filter by cascading, the out-of-band suppression is greatly improved, and it is also easier to achieve a wider passband bandwidth.
[0078] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A dielectric filter, characterized in that: The medium body comprises a medium main body, wherein the medium main body has two surfaces arranged opposite to each other in a thickness direction and a side surface located between the two surfaces; Two first through holes and two second through holes are formed on the dielectric body, wherein one of the first through hole and the second through hole penetrates from one of the two surfaces to the side surface, and the other of the first through hole and the second through hole penetrates from the other of the two surfaces to the side surface; A line connecting the two first through holes and a line connecting the two second through holes intersect with the axis of the dielectric body respectively; one of the first through holes and the second through hole are respectively used to couple with a pair of frequency mode generating sources; the second through hole is orthogonally arranged with the first through hole; Two chamfered inclined surfaces are also formed on the medium body, and the two chamfered inclined surfaces extend from two opposite surfaces of the medium body to the side surfaces respectively.
2. The dielectric filter according to claim 1, characterized in that: The two chamfered slopes surround the medium body.
3. The dielectric filter according to claim 1 or 2, characterized in that: The first through hole and the second through hole penetrate to the chamfered inclined surface respectively.
4. The dielectric filter according to claim 1, characterized in that: The medium body is cylindrical, and the ratio of the diameter to the height of the medium body is 1.8-2.
6.
5. The dielectric filter according to claim 1, characterized in that: The two surfaces, the side surface, the first through hole and the second through hole are all covered with a conductive metal plating layer.
6. The dielectric filter according to claim 5, characterized in that The dielectric filter further comprises an isolating member, which is located on the two surfaces and is respectively arranged around the first through hole and the second through hole; the isolating member is used to isolate the first through hole and the second through hole from the shielding zone.
7. The dielectric filter according to claim 1, characterized in that: The first through hole and the second through hole are respectively in an "L" shape, a "T" shape or a "X" shape.
8. The dielectric filter according to claim 7, characterized in that: The first through hole and the second through hole both have a vertical hole section and a horizontal hole section, and the hole diameters of the vertical hole section and the horizontal hole section are different.
9. A multi-order dielectric filter, characterized in that: The invention comprises at least two dielectric filters according to any one of claims 1 to 8, wherein the first through holes and the second through holes of the two dielectric filters are aligned respectively; and the first through holes and the second through holes on the mutually contacting sides of the two dielectric filters are electrically connected respectively.
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