Substrate processing method and substrate processing apparatus

By employing a two-step cleaning method and functional water rinsing in substrate processing, the problem of poor cleaning effect caused by low cleanliness of recycled liquid was solved, achieving efficient removal of substrate particles and reducing costs.

CN112002654BActive Publication Date: 2026-04-21TOKYO ELECTRON LTD
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Patent Information

Application Number
CN202010418111.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-05-27
Filing Date
2020-05-18
Publication Date
2026-04-21
Estimated Expiration
2040-05-18

AI Technical Summary

Technical Problem

In existing technologies, the cleaning efficiency of recycled cleaning solutions is low, making it difficult to effectively remove particles from the substrate, resulting in poor cleaning performance.

Method used

A two-step cleaning method is adopted. First, the substrate is cleaned with a fresh solution with high cleanliness, and then further cleaned with a recycled solution with lower cleanliness, combined with rinsing with functional water to remove residual particles.

Benefits of technology

Using a low-cleanliness recovery solution can effectively remove particles from the substrate, reduce cleaning costs, and improve cleaning efficiency.

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Abstract

A substrate processing method and a substrate processing apparatus are provided. A substrate processing method of one embodiment of the present application includes a first cleaning step and a second cleaning step. The first cleaning step cleans a substrate with a first cleaning liquid. The second cleaning step, which is performed after the first cleaning step, cleans the substrate with a second cleaning liquid that is less clean than the first cleaning liquid. The present application can sufficiently remove particles from a substrate even when a less clean cleaning liquid is used.
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