A debonding jig for thin sheet-like micro-electrocasting parts

Abstract

The present invention belongs to the field of micro electroforming, and specifically relates to a debonding jig for thin-sheet micro electroforming parts, comprising a substrate, a film attached to the surface of the substrate, and a thin-sheet micro electroforming part placed in the film, and also comprising a cover plate, an upper strong magnetic ring, and a lower strong magnetic ring; the periphery of the lower surface of the cover plate is provided with positioning columns arranged at equal intervals; the side of the cover plate is provided with a clamping handle with a through hole; the top of the positioning column is provided with a positioning platform with a retaining edge; the substrate is placed on the positioning platform and the micro electroforming part on the substrate faces the cover plate; the upper strong magnetic ring and the lower strong magnetic ring are placed on the cover plate and the substrate respectively. The present invention can effectively ensure that the thin-sheet micro electroforming part can be laid flat on the cover plate without turning over or stacking after the film is removed, which greatly improves the light transmission observation efficiency of the film removal and the morphology observation efficiency of the thin-sheet micro electroforming part. The structure is simple, the installation and disassembly are convenient, the components are few, and it is easy to implement.

Description

Technical Field

[0001] The invention belongs to the field of micro electroforming, and in particular relates to a debonding jig for thin sheet-shaped micro electroforming parts. Background Art

[0002] Masked micro-electroforming technology is the mainstream technology for batch manufacturing of micro-scale metal structures and parts. During masked micro-electroforming, in many cases, each micro-electroforming part is formed independently of each other in the concave cavity of the film pattern structure. In this way, when the film is removed, the micro-electroforming parts that fall off become messy because there is no connection between them. Especially when the micro-electroforming parts are in the form of thin sheets, there may be micro-electroforming parts stacking and flipping, which makes the subsequent product inspection operations very cumbersome, time-consuming and labor-intensive. During subsequent inspections, the inspectors have to use equipment with magnification and observation functions to separate, lay, divide and align the thin-sheet micro-electroforming parts (so that the inspection surfaces of all thin-sheet micro-electroforming parts to be inspected are consistent), which greatly reduces production efficiency and significantly increases production costs. Therefore, it is urgent to design and develop a jig in the process of removing the film of thin-sheet micro-electroplated parts, which can prevent the thin-sheet micro-electroplated parts from flipping over and stacking after falling off the substrate, and facilitate subsequent observation. Summary of the invention

[0003] The technical solution adopted by the present invention is: a debonding jig for thin-sheet micro-electroforming parts, comprising a substrate, a glue film attached to the surface of the substrate and a thin-sheet micro-electroforming part placed in the glue film, and also comprising a cover plate, an upper strong magnetic ring and a lower strong magnetic ring.

[0004] The side of the cover plate is provided with a clamping handle with a through hole. The clamping handle is used for clamping a fixture of an external device.

[0005] The periphery of the lower surface of the cover plate is provided with positioning columns arranged at equal intervals; the top of the positioning columns is provided with a positioning platform with a stop edge. The positioning columns and the positioning platform are used for positioning between the substrate and the cover plate.

[0006] The substrate is placed on the positioning table and the thin sheet-like fine electrocasting part on the substrate faces the cover plate; the height h of the retaining edge 挡沿 Greater than the film thickness h 胶膜 But it is smaller than the thickness of the substrate.

[0007] The height of the cavity formed between the cover plate and the substrate is greater than the thickness of the thin sheet-like fine electrocasting part but less than twice the thickness of the thin sheet-like fine electrocasting part. In this way, it can be ensured that the thin sheet-like fine electrocasting part will not turn over or overlap after the debonding is completed.

[0008] The upper strong magnetic ring and the lower strong magnetic ring are respectively placed on the cover plate and the substrate.

[0009] The cover plate is made of quartz glass with good transparency, which is convenient for light transmission observation after the adhesive film is removed.

[0010] The spacing between the positioning posts is smaller than the minimum value of the outer dimensions of the thin-sheet micro-electroforming parts, in order to prevent the thin-sheet micro-electroforming parts that fall off the substrate from scattering from the spacing between the positioning posts to the outside of the cavity formed between the cover plate and the substrate.

[0011] The outer surfaces of the upper and lower strong magnetic rings are coated with acid and alkali corrosion resistant polytetrafluoroethylene coatings to prevent the upper and lower strong magnetic rings from being corroded and damaged by the contacting medium during the process of removing the film of the thin sheet-like fine electrocasting.

[0012] The thickness of the cover plate is 1 mm to 2 mm; the width or arc length of the positioning column is 1 mm to 2 mm.

[0013] The upper surface of the cover plate is a plane, and the middle area of ​​the lower surface of the cover plate is a plane. In this way, the detached thin sheet-like micro-electroforming parts can be laid flat and placed on the same plane.

[0014] Compared with the prior art, the invention has the following beneficial effects.

[0015] (1) It can avoid the phenomenon of thin-sheet micro-electroforming parts turning over and stacking after the film is removed, which greatly facilitates the subsequent product inspection and analysis operations. The direct fixture can be placed on the inspection system to inspect the product, saving time and eliminating additional manual inspection and alignment of electroforming parts. The production efficiency is high and the labor cost is greatly reduced. The solution proposed by the present invention solves the industry problem.

[0016] (2) Easy to implement. The fixture of the present invention uses fewer components, has a simple structure, does not require special processing, and is easy to install and disassemble and easy to implement. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The present invention is a schematic diagram of a debonding jig for thin-sheet micro-electroforming parts.

[0018] Figure 2 is a schematic diagram of the cover.

[0019] In the figure: 1, substrate; 1-1, adhesive film; 1-2, thin sheet-like fine electroplating part; 2, upper strong magnetic ring; 3, cover plate; 3-1, positioning column; 3-2, positioning table; 3-2-1, stop edge; 3-3, clamping handle; 3-3-1, through hole; 4, lower strong magnetic ring. DETAILED DESCRIPTION

[0020] The present invention will be further described below in conjunction with the accompanying drawings.

[0021] like Figure 1~2As shown, a debonding jig for thin-sheet micro-electrocasting parts comprises a substrate 1, an adhesive film 1-1 attached to the surface of the substrate 1 and a thin-sheet micro-electrocasting part 1-2 placed in the adhesive film 1-1, and also comprises a cover plate 3, an upper strong magnetic ring 2 and a lower strong magnetic ring 4; the periphery of the lower surface of the cover plate 3 is provided with positioning posts 3-1 arranged at equal intervals; the side of the cover plate 3 is provided with a clamping handle 3-3 with a through hole 3-3-1; the top of the positioning post 3-1 is provided with a positioning platform 3-2 with a stop edge 3-2-1; the substrate 1 is placed on the positioning platform 3-2 and the thin-sheet micro-electrocasting part 1-2 on the substrate 1 faces the cover plate 3; the upper strong magnetic ring 2 and the lower strong magnetic ring 4 are respectively placed on the cover plate 3 and the substrate 1; the outer surfaces of the upper strong magnetic ring 2 and the lower strong magnetic ring 4 are both wrapped with a polytetrafluoroethylene coating resistant to acid and alkali corrosion; the thickness of the substrate is 1 mm; the thickness of the adhesive film 1-1 is h 胶膜 40 μm; the thickness of the thin sheet-like fine electrocasting part 1-2 is 30 μm; the thickness of the cover plate 3 is 1.5 mm; the arc length of the positioning column 3-1 is 1.5 mm; the interval between the positioning columns 3-1 is 0.5 mm; the height h of the positioning column 3-1 定位柱 850μm; height h of the edge 3-2-1 挡沿 is 0.8 mm; the height of the cavity formed between the cover plate 3 and the substrate 1 is 50 μm; the upper surface of the cover plate 3 is a plane, and the middle area of ​​the lower surface of the cover plate 3 is a plane; the height h of the edge 3-2-1 is 挡沿 (0.8mm) greater than the thickness h of the film 1-1 胶膜 (40μm) but less than the thickness of the substrate 1 (1mm), the height (50μm) of the cavity formed between the cover plate 3 and the substrate 1 is greater than the thickness (30μm) of the thin sheet-like micro-electroplating part 1-2 but less than twice the thickness of the thin sheet-like micro-electroplating part 1-2, and the interval (0.5mm) between the positioning posts 3-1 is less than the minimum value (1mm) of the outer dimensions of the thin sheet-like micro-electroplating part 1-2.

[0022] The steps for using the degumming fixture are as follows:

[0023] (a) Assembly jig. Install the upper strong magnetic ring 2, cover plate 3, substrate 1, and lower strong magnetic ring 4 in order from top to bottom;

[0024] (b) Clamping fixture. The external device clamps the fixture through the clamping handle 3-3;

[0025] (c) Film removal. The clamped fixture is placed in a film removal solution to remove the film. After the film 1-1 is removed, the thin sheet-like micro-electroformed parts 1-2 originally formed in the concave cavity of the pattern structure of the film 1-1 are laid flat on the cover plate 3 or the substrate 1 without turning over or stacking.

[0026] (d) Observation and inspection of electroformed parts. The jig after the film is removed is cleaned and dried, and then placed horizontally on the platform of the observation equipment. The morphology and geometric dimensions of the thin sheet-like micro-electroformed parts 1-2 after the film is removed are observed through the cover plate 3.

[0027] The above description illustrates the technical field, main technical features, technical problems solved, beneficial effects and specific implementation methods of the present invention. The present invention is not limited by the specific drawings, the present invention is not limited by the specific implementation methods, and the present invention may have various changes, improvements and extensions without departing from the spirit and scope of the present invention, and these changes, improvements and extensions fall within the scope of the present invention to be protected, and the scope of the present invention to be protected is defined by the attached claims and their equivalents.

Claims

1. A debonding jig for a thin sheet-like fine electrocasting part, comprising a substrate (1), a glue film (1-1) attached to a surface of the substrate (1), and a thin sheet-like fine electrocasting part (1-2) placed in the glue film (1-1), characterized in that: It also includes a cover plate (3), an upper strong magnetic ring (2), and a lower strong magnetic ring (4); the periphery of the lower surface of the cover plate (3) is provided with positioning columns (3-1) arranged at equal intervals; the side of the cover plate (3) is provided with a clamping handle (3-3) with a through hole (3-3-1); the top of the positioning column (3-1) is provided with a positioning platform (3-2) with a stop edge (3-2-1); the substrate (1) is placed on the positioning platform (3-2) and the thin sheet-like fine electroformed part (1-2) on the substrate (1) faces the cover plate (3); the height h of the stop edge (3-2-1) is 挡沿 Greater than the thickness h of the film (1-1) 胶膜 but less than the thickness of the substrate (1); the height of the cavity formed between the cover plate (3) and the substrate (1) is greater than the thickness of the thin sheet-like fine electroforming part (1-2) but less than twice the thickness of the thin sheet-like fine electroforming part (1-2); the upper strong magnetic ring (2) and the lower strong magnetic ring (4) are respectively placed on the cover plate (3) and the substrate (1); the cover plate (3) is made of quartz glass with good transparency; The interval between the positioning pillars (3-1) is smaller than the minimum value of the outer dimensions of the thin sheet-like micro-electroforming part (1-2); The outer surfaces of the upper strong magnetic ring (2) and the lower strong magnetic ring (4) are both coated with a polytetrafluoroethylene coating that is resistant to acid and alkali corrosion; The thickness of the thin sheet-like fine electrocasting product is 30 μm.

2. The debonding jig for thin-sheet micro-electroforming parts according to claim 1, characterized in that: The thickness of the cover plate (3) is 1 mm to 2 mm.

3. The debonding jig for thin-sheet micro-electroforming parts according to claim 1, characterized in that: The width or arc length of the positioning column (3-1) is 1 mm to 2 mm.

4. The debonding jig for thin-sheet micro-electroforming parts according to claim 1, characterized in that: The upper surface of the cover plate (3) is a plane, and the middle area of ​​the lower surface of the cover plate (3) is a plane.

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