A bending device for electronic device pins

Abstract

The present invention belongs to the field of automation technology, and specifically discloses a bending device for electronic device pins, including a feeding device and a bending device, wherein the feeding device is used to sequentially convey the material to be processed to the bending station; the bending station is provided with the bending station and is connected to the feeding device, the bending device includes a material receiving component matched with the material outlet of the feeding device, and a bending component is provided on both sides and above the material receiving component, and the bending component includes a first bending component and a second bending component. The bending device designed with this structure, after completing automatic material loading through the feeding device, then respectively performs pin bending and forming through the first bending component and the second bending component, the pin bending consistency is good, and the bending efficiency is high.

Description

Technical Field

[0001] The invention relates to the field of automation technology, and in particular to a bending device for electronic device pins. Background Art

[0002] In the related art, when bending the pins of plug-in electronic devices (such as capacitors, resistors, etc.), due to the lack of necessary bending equipment, the pin bending consistency is poor, the bending efficiency is low, and it is time-consuming and labor-intensive. Therefore, it is necessary to improve it. Summary of the invention

[0003] The object of the present invention is to provide a bending device for the pins of electronic devices, which has high automatic bending efficiency and good pin bending consistency, and can effectively improve the bending efficiency of the pins.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A bending device for electronic device pins, comprising:

[0006] A material conveying device is used to sequentially convey the materials to be processed to the bending stations;

[0007] A bending device is provided with the bending station and is connected to the feeding device. The bending device includes a material receiving component that cooperates with the material outlet of the feeding device, and bending components are arranged on the opposite sides and above the material receiving component. The bending components include a first bending component for bending the material once, and a second bending component for cooperating with the first bending component to complete the secondary bending of the material.

[0008] Wherein, the feeding device includes a vibrating plate, a feeding rail connected to the discharge port of the vibrating plate, and a loading mechanism connected to the discharge port of the feeding rail.

[0009] Wherein, the material receiving assembly includes a positioning seat and a first cylinder arranged on the bottom surface of the workbench to drive the positioning seat to rise and fall.

[0010] Among them, the loading mechanism includes a carrier arranged at the end of the conveyor rail for transferring materials, a loading seat cooperating with the carrier, a second cylinder for driving the carrier to slide along the width direction of the conveyor rail, and a loading piece slidably cooperated with the carrier and the loading seat, and a third cylinder driving the loading piece to move back and forth along the length direction of the conveyor rail.

[0011] The material loading seat and the carrier are both penetrated by a slideway which is in communication with the positioning seat, and the material slides into the storage position of the positioning seat under the driving action of the material loading member.

[0012] Among them, the first bending assembly includes a lower mold arranged on one side of the positioning seat, an upper mold arranged above the positioning seat, a fourth cylinder for driving the lower mold to move back and forth horizontally, and a fifth cylinder for driving the upper mold and the lower mold to close the mold.

[0013] Among them, the second bending assembly is arranged on the side of the positioning seat away from the lower mold, and the second bending assembly includes a slider arranged along the length direction of the feed rail, a sixth cylinder for driving the slider to slide back and forth, a seventh cylinder fastened to the slider and arranged along the width direction of the feed rail, and a pressure head connected to the seventh cylinder for secondary bending of the material.

[0014] Wherein, a bracket is arranged between the lower die and the pressing head, and the fifth cylinder is arranged along the height direction of the bracket.

[0015] Wherein, a protrusion is arranged in the middle of the lower end surface of the upper mold, and a circular arc is arranged at the root of the protrusion.

[0016] Wherein, the lower mold includes a mold base and two forming rods extending outwardly from one side of the mold base at an interval, and the tops of the two forming rods match the circular arc.

[0017] The beneficial effects of the present invention are as follows: the present invention discloses a bending device for electronic device pins, including a feeding device and a bending device, wherein the feeding device is used to sequentially convey the material to be processed to the bending station; the bending device is provided with the bending station and connected to the feeding device, the bending device includes a material receiving assembly matched with the material outlet of the feeding device, and a bending assembly provided on both sides and above the material receiving assembly, the bending assembly includes a first bending assembly and a second bending assembly. The bending device designed with this structure, after completing automatic material loading through the feeding device, then respectively performs pin bending and forming through the first bending assembly and the second bending assembly, the pin bending consistency is good, and the bending efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The invention discloses an axonometric diagram of a bending device for electronic device pins.

[0019] Figure 2 yes Figure 1 Axonometric view of the middle feeding mechanism and the first bending component after assembly.

[0020] Figure 3 yes Figure 1 Axonometric drawing after removing the vibrating plate and feed rail.

[0021] Figure 4 It is an axonometric view of the finished capacitor after bending and forming of the present invention.

[0022] In the figure:

[0023] 1. Feeding device; 11. Vibrating plate; 12. Feeding rail; 13. Loading mechanism; 131. Carrier; 132. Loading seat; 133. Second cylinder; 134. Loading piece; 135. Third cylinder;

[0024] 2. Bending device; 21. Material receiving assembly; 211. Positioning seat; 212. First cylinder; 221. First bending assembly; 2211. Lower die; 2211a. Die seat; 2211b. Forming rod; 2212. Upper die; 2212a. Protrusion; 2212b. Arc; 23. Bracket; 2215. Fourth cylinder; 2216. Fifth cylinder; 222. Second bending assembly; 2221. Slider; 2222. Sixth cylinder; 2223. Seventh cylinder; 2224. Press head. DETAILED DESCRIPTION

[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0026] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0028] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0029] Combination Figures 1 to 4 As shown, this embodiment provides a bending device for electronic device pins, including a feeding device 1 and a bending device 2. Specifically, the feeding device 1 is mainly used to sequentially convey the materials to be processed to the bending stations. Further specifically, the feeding device 1 includes a vibration plate 11, a feeding rail 12 connected to the discharge port of the vibration plate 11, and a loading mechanism 13 connected to the discharge port of the feeding rail 12.

[0030] Furthermore, the loading mechanism 13 includes a carrier 131 for transferring materials arranged at the end of the feed rail 12, a loading seat 132 matched with the carrier 131, a second cylinder 133 for driving the carrier 131 to slide along the width direction of the feed rail 12, a loading piece 134 slidably matched with the carrier 131 and the loading seat 132, and a third cylinder 135 for driving the loading piece 134 to move back and forth along the length direction of the feed rail 12; preferably, in this embodiment, a slideway is provided on the loading seat 132 and the carrier 131. When the carrier 131 transfers the materials output from the feed rail 12 to one side of the loading seat 132 through the action of the second cylinder 133, the loading piece 134, under the driving action of the third cylinder 135, drives the materials to slide along the slideway toward the above-mentioned bending device 2 for bending operation.

[0031] To be more specific, the bending device 2 in this embodiment is provided with a bending station and is connected to the feeding device 1. Furthermore, the bending device 2 includes a material receiving component 21 that cooperates with the discharge port of the feeding device 1, and bending components are arranged on both sides and above the material receiving component 21. The bending components include a first bending component 221 for bending the material once, and a second bending component 222 for cooperating with the first bending component 221 to complete the secondary bending of the material; preferably, the material receiving component 21 includes a positioning seat 211, and a first cylinder 212 arranged on the bottom surface of the workbench for driving the positioning seat 211 to rise and fall.

[0032] Further preferably, a storage position which is connected with the slide is provided on the positioning seat 211. When the loading piece 134 is driven by the third cylinder 135 to slide along the slide toward the above-mentioned bending device 2, the positioning seat 211 is first lifted upward by the first cylinder 212 so that the storage position on the positioning seat 211 is aligned with the slide, that is, the piece that slides out of the slide slides into the storage position, so as to facilitate subsequent process operations.

[0033] To be more specific, the first bending assembly 221 in the present embodiment includes a lower mold 2211 arranged on one side of the positioning seat 211, an upper mold 2212 arranged above the positioning seat 211, a fourth cylinder 2215 for driving the lower mold 2211 to move back and forth horizontally, and a fifth cylinder 2216 for driving the upper mold 2212 to close the mold with the lower mold 2211; for ease of understanding, the material in the present embodiment is preferably a capacitor 3 with two pins. After the capacitor 3 is transferred to the storage groove of the positioning seat 211, the lower mold 2211 is driven by the fourth cylinder 2215 to move to one side of the capacitor 3. Preferably, in the present embodiment, in order to facilitate the two pins 31 of the capacitor 3 to be Under the action of the upper mold 2212 and the lower mold 2211, one-step molding is completed. The lower mold 2211 includes a mold base 2211a and two molding rods 2211b that are spaced and extend outward on one side of the mold base 2211a. In order to facilitate bending, the two molding rods 2211b are horizontally inserted on the outside of the two pins 31. A protrusion 2212a is provided in the middle of the lower end surface of the upper mold 2212, and an arc 2212b that matches the top of the two molding rods 2211b is provided at the root of the protrusion 2212a. When the upper and lower molds 2211 are closed, the protrusion 2212a is pressed between the two inverted pins 31 and drives the two pins to turn outward through the molding rods 2211b, thereby completing the one-step molding of the pins.

[0034] Furthermore, in this embodiment, the second bending component 222 is arranged on the side of the positioning seat 211 away from the lower mold 2211, and the second bending component 222 includes a slider 2221 arranged along the length direction of the feed rail 12, a sixth cylinder 2222 for driving the slider 2221 to slide back and forth, a seventh cylinder 2223 fastened to the slider 2221 and arranged along the width direction of the feed rail 12, and a pressing head 2224 connected to the seventh cylinder 2223 for secondary bending of the material. Furthermore, in this embodiment, a bracket 23 is erected between the lower mold 2211 and the pressing head 2224, and the fifth cylinder 2216 is erected along the height direction of the bracket 23.

[0035] Through the setting of the above-mentioned second bending component 222, when the two pins of capacitor 3 are bent once, under the action of the sixth cylinder 2222 and the seventh cylinder 2223, the pressing head 2224 is driven to press the horizontal pin arm after the once forming to a downward inclined state, and then cooperate with the repeated operation of the upper mold 2212 and the lower mold 2211 in the above-mentioned first bending component 221 to completely complete the secondary forming of the pins of capacitor 3.

[0036] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A bending device for electronic device pins, characterized in that: include: A material conveying device (1) is used to sequentially convey the materials to be processed to the bending stations; A bending device (2) is provided with the station to be bent and is connected to the feeding device (1), the bending device (2) comprises a material receiving assembly (21) matched with the material outlet of the feeding device (1), and bending assemblies arranged on opposite sides and above the material receiving assembly (21), the bending assemblies comprising a first bending assembly (221) for primary bending of a material, and a second bending assembly (222) for cooperating with the first bending assembly (221) to complete secondary bending of the material; The feeding device (1) comprises a vibrating plate (11), a feeding rail (12) connected to a discharge port of the vibrating plate (11), and a loading mechanism (13) connected to the discharge port of the feeding rail (12); The material receiving assembly (21) comprises a positioning seat (211) and a first cylinder (212) arranged on the bottom surface of the workbench and used for driving the positioning seat (211) to move up and down; The first bending assembly (221) comprises a lower die (2211) arranged on one side of the positioning seat (211), an upper die (2212) arranged above the positioning seat (211), a fourth cylinder (2215) for driving the lower die (2211) to move horizontally back and forth, and a fifth cylinder (2216) for driving the upper die (2212) to engage with the lower die (2211); The second bending assembly (222) is arranged on a side of the positioning seat (211) away from the lower die (2211), and the second bending assembly (222) comprises a slider (2221) arranged along the length direction of the feed rail (12), a sixth cylinder (2222) used to drive the slider (2221) to slide back and forth, a seventh cylinder (2223) fastened to the slider (2221) and arranged along the width direction of the feed rail (12), and a pressure head (2224) connected to the seventh cylinder (2223) and used for secondary bending of the material piece; A protrusion (2212a) is provided in the middle of the lower end surface of the upper mold (2212), and a circular arc (2212b) is provided at the root of the protrusion (2212a).

2. The bending device for electronic device pins according to claim 1, characterized in that: The loading mechanism (13) comprises a carrier (131) disposed at the end of the conveyor rail (12) for transferring materials, a loading seat (132) matched with the carrier (131), a second cylinder (133) for driving the carrier (131) to slide along the width direction of the conveyor rail (12), a loading piece (134) slidably matched with the carrier (131) and the loading seat (132), and a third cylinder (135) for driving the loading piece (134) to move back and forth along the length direction of the conveyor rail (12).

3. The bending device for electronic device pins according to claim 2, characterized in that: The material loading seat (132) and the carrier (131) are both penetrated by a slideway which is in communication with the positioning seat (211); the material piece slides into the storage position of the positioning seat (211) under the driving action of the material loading piece (134).

4. The bending device for electronic device pins according to claim 1, characterized in that: A bracket (23) is arranged between the lower die (2211) and the pressing head (2224), and the fifth cylinder (2216) is arranged along the height direction of the bracket (23).

5. The bending device for electronic device pins according to claim 1, characterized in that: The lower mold (2211) comprises a mold base (2211a) and two molding rods (2211b) extending outwardly from one side of the mold base (2211a) at an interval, and the tops of the two molding rods (2211b) match the circular arc (2212b).

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