Processing device

Abstract

A processing device is provided, which can effectively remove static electricity when a chip is removed from a holding member. While gradually increasing the area of ​​the portion of the lower surface of the dicing tape (T1) that is separated from the holding surface (23) of the chuck worktable (20), ionized air (A1) is blown toward the portion, thereby removing static electricity carried by the dicing tape (T1). Therefore, it is possible to suppress the dicing tape (T1) that is separated from the holding surface (23) of the chuck worktable (20) from being charged, and while removing static electricity carried by the dicing tape (T1), the workpiece group (W1) can be moved out of the holding surface (23). Therefore, the dicing tape (T1) that is separated from the holding surface (23) of the chuck worktable (20) is not easily charged with static electricity. Therefore, it is possible to suppress the reduction in the quality of the device formed on the chip (W) of the workpiece group (W1).

Description

Technical Field

[0001] The present invention relates to a processing device. Background Art

[0002] In the cutting apparatuses for cutting a wafer disclosed in Patent Documents 1 and 2, the wafer is cut while being held by a holding member via a dicing tape adhered to one surface thereof.

[0003] In such a cutting device, after the cutting process, the dicing tape attached to the wafer is charged with static electricity, so the quality of the device formed on the wafer may be reduced. Therefore, in order to remove the static electricity charged on the dicing tape, ionized air is blown toward the dicing tape.

[0004] For example, in the cutting device disclosed in Patent Document 1, after a chip with a dicing tape attached thereto and held by a holding member is separated from the holding member by a conveying member, the spray direction of the air is changed in a manner to follow the rising chip held by the conveying member so that the ionized air collides with the dicing tape.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-049359

[0006] Patent Document 2: Japanese Patent Application Publication No. 2015-112552

[0007] However, in conventional cutting devices, ionized air is blown toward the dicing tape after the wafer is completely separated from the holding surface. Therefore, static electricity may remain on the dicing tape, and the quality of the device may be reduced. Summary of the invention

[0008] Therefore, an object of the present invention is to suppress degradation of device quality by effectively eliminating static electricity when a wafer is separated from a holding member.

[0009] The first processing device of the present invention comprises: a holding member having a holding surface for holding a workpiece group via a dicing tape, the workpiece group being obtained by adhering the dicing tape to an annular frame and a workpiece arranged at an opening of the annular frame and integrating them; a processing member for processing the workpiece of the workpiece group held by the holding surface while supplying water to the workpiece; a lifting member for moving a frame holding portion in a direction perpendicular to the holding surface, the frame holding portion having at least three holding portions for holding the annular frame of the workpiece group held by the holding surface; and an ion generator for applying water to the lower surface of the dicing tape. Blowing ionized air to remove static electricity from the scribing tape, wherein the lifting component is configured to raise the frame holding portion that holds the annular frame of the workpiece group so that the lower surface of the scribing tape of the workpiece group gradually separates from the holding surface from the peripheral portion toward the center, and the ion generator is configured to continuously blow ionized air toward the portion of the lower surface of the scribing tape that is separated from the holding surface until the lower surface of the scribing tape completely separates from the holding surface and the lower surface of the scribing tape further separates from the holding surface by a specified distance, and the processing device removes static electricity from the scribing tape while moving the workpiece out of the holding surface.

[0010] The second processing device of the present invention comprises: a holding member having a holding surface for holding a workpiece via a protective member, the workpiece having the protective member on one surface; a processing member for processing the workpiece held by the holding surface; a lifting member for moving a conveying pad in a direction perpendicular to the holding surface, the conveying pad having an adsorption surface for adsorbing and holding the other surface of the workpiece held on one surface by the holding surface; an ion generator for blowing ionized air toward the lower surface of the protective member to remove static electricity carried by the protective member, wherein the processing device further comprises an inclination changing member, the inclination changing member changing the relative inclination of the adsorption surface of the conveying pad and the holding surface, The inclination changing component is configured to gradually increase the relative inclination of the adsorption surface of the conveying pad that adsorbs and holds the workpiece held by the holding surface and the holding surface from a state in which the adsorption surface and the holding surface are parallel to each other, thereby gradually increasing the area of ​​the portion of the lower surface of the protective component of the workpiece that is separated from the holding surface. The ion generator is configured to continuously blow ionized air to the portion of the lower surface of the protective component that is separated from the holding surface until the lower surface of the protective component is completely separated from the holding surface and the lower surface of the protective component is further separated from the holding surface by a specified distance. The processing device removes the static electricity carried by the protective component while moving the workpiece out of the holding surface.

[0011] In the first processing device, the area of ​​the portion of the lower surface of the dicing tape that is separated from the holding surface of the holding member is gradually increased, and at the same time, the ion generator blows ionized air to the portion, thereby removing the static electricity carried by the dicing tape. Therefore, it is possible to suppress the dicing tape that leaves the holding surface of the holding member from being charged, and while removing the static electricity carried by the dicing tape, the workpiece group can be moved out of the holding surface. As a result, the dicing tape that leaves the holding surface of the holding member is not easily charged with static electricity. Therefore, it is possible to suppress the reduction in the quality of the device formed on the workpiece to be processed in the workpiece group.

[0012] In the second processing device, the area of ​​the portion of the lower surface of the protective component that is separated from the holding surface of the holding member is gradually increased, and the ion generator blows ionized air to the portion, thereby removing the static electricity carried by the protective component. Therefore, it is possible to suppress the charging of the protective component that has separated from the holding surface of the holding member, and it is possible to remove the static electricity carried by the protective component while removing the static electricity carried by the protective component. As a result, the protective component that has separated from the holding surface of the holding member is not easily charged with static electricity. Therefore, it is possible to suppress the reduction in the quality of the device formed on the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective view of the processing device of this embodiment.

[0014] Figure 2 It is an explanatory diagram showing a cutting mechanism.

[0015] Figure 3 It is a perspective view showing the structure of an ion generator.

[0016] Figure 4 This is an explanatory diagram showing a state in which a conveying member is arranged on a workpiece group held on a holding surface of a chuck table.

[0017] Figure 5 This is an explanatory diagram showing a state in which the annular frame of the workpiece group is held by the holding portion of the conveying member.

[0018] Figure 6 This is an explanatory diagram showing a state in which the annular frame of the workpiece group is lifted up by the holding portion of the conveying member.

[0019] Figure 7 This is an explanatory diagram showing a state in which the outer peripheral portion of the lower surface of the dicing tape in the workpiece group is separated from the holding surface.

[0020] Figure 8 This is an explanatory diagram showing a state in which the lower surface of the dicing tape is separated from the holding surface of the chuck table by a predetermined distance.

[0021] Fig. 9 It is a block diagram showing the structure of a grinding device.

[0022] Fig.10 This is an explanatory diagram showing a state in which a transfer member is arranged on a wafer held on a holding surface of a chuck table.

[0023] Fig.11 This is an explanatory diagram showing a state in which a part of the lower surface of the protective tape of the wafer is separated from the holding surface of the chuck table.

[0024] Fig.12 This is an explanatory diagram showing a state in which the lower surface of the protective tape is separated from the holding surface of the chuck table by a predetermined distance.

[0025] Description of symbols

[0026] 1: cutting device; 12: housing; 14: control unit; 16: box carrier; 20: chuck table; 22: fixture; 23: holding surface; 24: rotating cleaning unit; 27: rotating table; 28: rotating holding surface; 30: conveying member; 31: frame holding part; 32: holding part; 33: frame holding part moving mechanism; 35: frame holding part lifting mechanism; 41: cutting mechanism; 42: spindle; 43: cutting tool; 51: Ion generator; 53: air supply port; W1: workpiece group; F: annular frame; T1: dicing belt; 2: grinding device; 55: processing member; 57: control unit; 60: chuck table; 63: holding surface; 71: conveying mechanism; 72: conveying pad; 73: adsorption surface; 74: conveying arm; 75: lifting member; 76: connecting part; 81: diameter expansion part; 85: inclination changing member; 86: wedge part; W: wafer; T2: protective belt. DETAILED DESCRIPTION

[0027] like Figure 1 As shown, a cutting device 1 according to the present embodiment is an example of a processing device, and performs cutting processing on a wafer W as a workpiece.

[0028] The wafer W has a substantially circular shape, and a grid-like planned dividing line L is formed on the front surface. Various devices (not shown) are formed in each region partitioned by the planned dividing line L.

[0029] A dicing tape T1 is attached to the back surface of the wafer W. An annular frame F is attached to the outer periphery of the dicing tape T1. That is, the workpiece set W1 is formed by attaching the dicing tape T1 to the annular frame F and the wafer W disposed at the opening of the annular frame F and integrating them.

[0030] In this way, the wafer W is processed in the cutting device 1 in a state where the workpiece group W1 is supported by the ring frame F via the dicing tape T1. The workpiece group W1 is stored in a cassette (not shown) and carried into the cutting device 1.

[0031] The cutting device 1 includes a support table 10 , a chuck table 20 provided on the support table 10 , and a rectangular parallelepiped housing 12 provided upright on the support table 10 .

[0032] A cassette stage 16 is provided on one end side of the support table 10 , and a cassette (not shown) for holding a plurality of workpiece groups W1 is placed on the cassette stage 16 .

[0033] A push-pull member 17 for conveying the workpiece group W1 is provided between the cassette stage 16 and the chuck table 20. The push-pull member 17 includes a push-pull arm 171 for taking out or putting in the wafer W from the cassette and a push-pull arm moving mechanism 172 for reciprocating the push-pull arm 171 in the Y-axis direction.

[0034] Furthermore, a temporary placement member 18 for temporarily placing the workpiece group W1 is provided on the housing 12 side of the chuck table 20. The push-pull member 17 transfers the workpiece group W1 before processing from the cassette on the cassette stage 16 and places it on the temporary placement member 18. The temporary placement member 18 positions the workpiece group W1 in the X-axis direction.

[0035] A conveying member 30 is provided on the front surface of the housing 12 above the chuck table 20. The conveying member 30 holds the workpiece group W1 on the temporary placement member 18 and conveys and places the workpiece group W1 on the chuck table 20. The conveying member 30 conveys the workpiece group W1 between the chuck table 20 and the spin cleaning unit 24.

[0036] The conveying member 30 includes a frame holding portion 31 that holds the workpiece set W1 , a frame holding portion moving mechanism 33 that moves the frame holding portion 31 in the Y-axis direction, and a frame holding portion lifting mechanism 35 that lifts the frame holding portion 31 in the Z-axis direction.

[0037] The frame holding part 31 has four holding parts 32 for holding the annular frame F of the workpiece group W1. The holding part 32 is a so-called suction cup, and can hold the annular frame F of the workpiece group W1 by suction.

[0038] The frame holding portion lifting mechanism 35 moves the frame holding portion 31 in a direction perpendicular to the holding surface 23 of the chuck table 20 and is an example of a lifting member.

[0039] The chuck table 20 is fixed on the moving plate 21. The moving plate 21 covers the opening in the center of the upper surface of the support table 10 together with the corrugated waterproof cover C. A cutting feed mechanism (not shown), such as a ball screw type, is provided below the moving plate 21 and the waterproof cover C to move the moving plate 21 and the chuck table 20 in the X-axis direction.

[0040] The chuck table 20 is an example of a holding member and has a holding surface 23 made of a porous ceramic material. The workpiece group W1 is attracted and held via the dicing tape T1 by the negative pressure generated on the holding surface 23. Four clamps 22 are provided around the chuck table 20. The clamps 22 clamp and fix the annular frame F of the workpiece group W1 from all sides.

[0041] The chuck table 20 is transported from the support table 10 to the processing space inside the housing 12 by the cutting feed mechanism together with the moving plate 21 while holding the workpiece group W1. Figure 2 The cutting mechanism 41 is shown. In the processing space, the wafer W is cut by the cutting mechanism 41.

[0042] The cutting mechanism 41 processes (cuts) the wafers W of the workpiece group W1 held on the holding surface 23 of the chuck table 20 while supplying water (cutting water) to the wafers W, and is an example of a processing member.

[0043] like Figure 2 As shown, the cutting mechanism 41 includes: a spindle 42 having a horizontal rotation axis; and a cutting tool 43 that can rotate together with the spindle 42 .

[0044] During cutting, the cutting tool 43 is lowered while the spindle 42 is rotated, and the cutting tool 43 contacts the wafer W. Cutting water is supplied to the contact portion between the cutting tool 43 and the wafer W by a cutting water supply member (not shown). Next, the chuck table 20 holding the workpiece set W1 moves in a direction perpendicular to the rotation axis of the spindle 42 within a horizontal plane.

[0045] In this way, the cutting tool 43 is cut along the planned dividing line L (see Figure 1 ) The chip W is cut.

[0046] After the wafer W is cut, Figure 1 The chuck table 20 and the moving plate 21 shown are returned to the support table 10 by the cutting and feeding mechanism. Then, the workpiece group W1 is sent from the chuck table 20 to the spin cleaning unit 24 on the inner side of the chuck table 20 by the conveying means 30 .

[0047] The spin cleaning unit 24 includes a spin table 27 that holds the workpiece group W1 , and various nozzles (not shown) that spray cleaning water and dry air toward the workpiece group W1 held by the spin table 27 .

[0048] The rotary table 27 is an example of a holding member, and has a rotary holding surface 28 that holds the workpiece group W1 via the dicing tape T1.

[0049] In the spin cleaning unit 24, the spin table 27 holding the workpiece group W1 is rotated at high speed. Then, cleaning water is sprayed toward the workpiece group W1 rotating at high speed to clean the workpiece group W1. Then, dry air is sprayed to dry the workpiece group W1.

[0050] The dried workpiece group W1 is removed from the rotary table 27 by the conveying means 30 .

[0051] As described above, the spin cleaning unit 24 processes (cleans) the wafers W of the workpiece group W1 held on the rotation holding surface 28 of the rotary table 27 while supplying water (cleaning water) to the wafers W, and is an example of a processing member.

[0052] A touch panel 40 is provided on the side of the housing 12. Various information such as processing conditions related to the cutting device 1 is displayed on the touch panel 40. In addition, the touch panel 40 is used to set various information such as processing conditions. In this way, the touch panel 40 functions as a display member (display screen) for displaying various information, and also functions as an input member for inputting information.

[0053] Furthermore, a control unit 14 for controlling each component of the cutting device 1 is provided inside the housing 12 .

[0054] A pair of ion generators 51 are provided on the -Y direction side and the +Y direction side of the chuck table 20 so as to sandwich the chuck table 20 along the Y axis direction. A pair of ion generators 51 are provided on the -Y direction side and the +Y direction side of the spin cleaning unit 24 so as to sandwich the spin table 27 along the Y axis direction.

[0055] like Figure 3 As shown, the ion generator 51 has a plurality of air outlets 53. The ion generator 51 is configured to have a built-in fan (not shown), and to take in air from the outside by rotating the fan and blow it out from the air outlets 53 as ionized air.

[0056] The ion generator 51 may be configured not to use a fan. In this case, the ion generator 51 is connected to an air supply source and the air supplied from the air supply source is blown out from the air supply port 53 as ionized air.

[0057] The ion generators 51 are arranged so as to sandwich the chuck table 20, and are arranged so that the air supply ports 53 face the chuck table 20. The ion generators 51 blow ionized air toward the holding surface 23 of the chuck table 20. Therefore, when the workpiece group W1 leaves the holding surface 23, the ion generators 51 blow ionized air toward the lower surface of the dicing tape T1 of the workpiece group W1. Thus, the ion generators 51 remove static electricity from the dicing tape T1.

[0058] On the other hand, the ion generator 51 provided in a manner sandwiching the rotary table 27 of the rotary cleaning unit 24 is provided so that the air supply port 53 faces the rotary table 27. These ion generators 51 blow ionized air toward the rotation holding surface 28 of the rotary table 27. Therefore, the ion generator 51 blows ionized air toward the lower surface of the dicing tape T1 of the workpiece group W1 when the workpiece group W1 leaves the rotation holding surface 28. Thus, the ion generator 51 removes static electricity from the dicing tape T1.

[0059] Next, a description will be given of a conveying operation of the workpiece group W1 by the conveying means 30 of the cutting device 1. The following operation is performed under the control of the control unit 14, for example.

[0060] The workpiece group W1 placed on the chuck table 20 is Figure 2 The cutting mechanism 41 shown performs cutting processing, and after the chuck table 20 returns to the support table 10 , the control unit 14 controls the conveying means 30 to remove the workpiece set W1 from the chuck table 20 and convey it to the spin cleaning unit 24 .

[0061] That is, first, Figure 4 As shown in FIG. 1 , the conveying member 30 is arranged above the workpiece group W1 placed on the holding surface 23 of the chuck table 20. As shown in the figure, the holding portion 32 of the frame holding portion 31 is connected to the suction source 37 via the suction valve 36. By opening the suction valve 36, the holding portion 32 is connected to the suction source 37, so that the holding portion 32 has suction. Figure 4 In the illustrated state, the suction valve 36 is closed.

[0062] Afterwards, if Figure 5 As shown, the clamp 22 fixing the annular frame F of the workpiece group W1 is detached from the annular frame F. Next, the suction valve 36 is opened, and at the same time, the frame holding portion lifting mechanism 35 of the conveying member 30 moves the frame holding portion 31 downward (-Z direction) until the holding portion 32 thereof holds the annular frame F by suction.

[0063] After the holding portion 32 has adsorbed and held the annular frame F, Figure 6 As shown, the frame holding portion lifting mechanism 35 moves the frame holding portion 31 upward (in the +Z direction).

[0064] At this time, if Figure 6 and Figure 7 As shown, the frame holding portion lifting mechanism 35 raises the frame holding portion 31 holding the annular frame F so that the lower surface of the dicing tape T1 of the workpiece group W1 gradually separates from the holding surface 23 from the outer peripheral portion toward the center.

[0065] That is, when the frame holding part 31 (workpiece group W1) starts to rise, the outer peripheral portion of the soft dicing tape T1 is lifted via the holding part 32 of the frame holding part 31 and the annular frame F. As a result, the dicing tape T1 is bent in a manner that the center becomes lower, and deformed in a manner that the peripheral portion is warped upward. Then, as the frame holding part 31 rises, the portion of the lower surface of the dicing tape T1 that is separated from the holding surface 23 expands toward the central portion. That is, as the frame holding part 31 rises, the area of ​​the portion of the lower surface of the dicing tape T1 that is separated from the holding surface 23 of the chuck table 20 gradually increases.

[0066] And, at this time, if Figure 7 As shown, the ion generator 51 blows ionized air A1 toward a portion of the lower surface of the dicing tape T1 that is away from the holding surface 23 , for example, from the time when the outer peripheral portion of the lower surface of the dicing tape T1 starts to separate from the holding surface 23 .

[0067] Then, if Figure 7 and Figure 8 As shown, the ion generator 51 continues to blow ionized air A1 toward the portion of the lower surface of the dicing tape T1 away from the holding surface 23 until the lower surface of the dicing tape T1 completely leaves the holding surface 23 and further leaves the lower surface of the dicing tape T1 a specified distance D1 away from the holding surface 23.

[0068] The distance D1 is, for example, a distance at which electrostatic interaction between the holding surface 23 and the lower surface of the dicing tape T1 is negligibly small.

[0069] As described above, in this embodiment, the area of ​​the portion of the lower surface of the dicing tape T1 that is separated from the holding surface 23 of the chuck table 20 is gradually increased, and the ion generator 51 blows ionized air A1 to the portion, thereby removing the static electricity on the dicing tape T1. Therefore, it is possible to suppress the dicing tape T1 from being charged after leaving the holding surface 23 of the chuck table 20, and it is possible to remove the static electricity on the dicing tape T1 while removing the static electricity on the dicing tape T1. As a result, the dicing tape T1 that is separated from the holding surface 23 of the chuck table 20 is not easily charged with static electricity. Therefore, it is possible to suppress the reduction in the quality of the devices formed on the wafer W of the workpiece group W1.

[0070] In addition, “the lower surface of the dicing tape T1 gradually separates from the retaining surface 23 from the peripheral portion toward the center” means, for example, first, only the peripheral portion of the lower surface of the dicing tape T1 separates from the retaining surface 23, while the other portions are in contact with the retaining surface 23, and then, the portion of the lower surface of the dicing tape T1 that separates from the retaining surface 23 expands toward the central portion as the frame retaining portion 31 rises, and when the central portion separates, the lower surface of the dicing tape T1 separates from the retaining surface 23 as a whole.

[0071] Furthermore, in the present embodiment, as an example of the conveying operation of the conveying member 30 conveying the workpiece group W1, the operation of removing the workpiece group W1 from the holding surface 23 of the chuck table 20 is described. Figure 1 When the workpiece group W1 is removed from the rotating holding surface 28 of the rotating table 27 of the rotating cleaning unit 24 shown in the figure, the conveying member 30 and the ion generator 51 also perform the same operation.

[0072] That is, with the use Figures 4 to 8 Similarly to the operation shown, the frame holding portion lifting mechanism 35 of the conveying member 30 raises the workpiece group W1 from the rotating holding surface 28 so that the area of ​​the portion of the lower surface of the dicing tape T1 away from the rotating holding surface 28 of the rotating table 27 gradually increases. At this time, the ion generator 51 provided in a manner sandwiching the rotary cleaning unit 24 blows ionized air toward the portion of the dicing tape T1 away from the rotating holding surface 28.

[0073] Thus, the dicing tape T1 leaving the rotating holding surface 28 is prevented from being charged, and static electricity on the dicing tape T1 is removed. Therefore, the dicing tape T1 leaving the rotating holding surface 28 is not easily charged with static electricity. Therefore, it is possible to prevent the quality of the devices formed on the wafers W of the workpiece group W1 from being reduced.

[0074] Furthermore, in the present embodiment, the holding portion 32 included in the frame holding portion 31 of the conveying member 30 is a suction cup.

[0075] Furthermore, in the present embodiment, the frame holding portion 31 has four holding portions 32. In this regard, the frame holding portion 31 only needs to have at least three holding portions 32.

[0076] Furthermore, in the present embodiment, as a processing device for processing a workpiece, a cutting device 1 for cutting a wafer W is exemplified. Alternatively, the processing device of the present embodiment may be, for example, a grinding device for grinding a workpiece, a laser processing device for processing a workpiece by laser, a tool cutting device for cutting a workpiece by lathe, an expanding device for dividing a workpiece into chips, or a tape mounting device for mounting a tape on the workpiece.

[0077] Here, a case where the processing device of the present embodiment is a grinding device will be described.

[0078] like Fig. 9 As shown, the grinding device 2 includes a chuck table 60 as a holding member for holding a workpiece, a processing member 55 for grinding the workpiece, a conveying mechanism 71 for conveying (carrying in and out) the workpiece to the chuck table 60, Figure 3The ion generator 51 shown in the figure and the control unit 57 for controlling each component of the grinding device 2.

[0079] like Fig.10 As shown in FIG. 1 , a device not shown is formed on one surface of a wafer W, that is, the front surface Wa, which is a workpiece. Fig.10 The wafer W faces downward and is protected by a protective tape T2 as a protective member. The other surface of the wafer W, that is, the back surface Wb, is a processed surface to be ground.

[0080] The chuck table 60 has a holding surface 63 made of a porous ceramic material. The negative pressure generated on the holding surface 63 attracts and holds the wafer W via the protective tape T2.

[0081] Fig. 9 The processing member 55 shown performs a grinding process on the wafer W held by the holding surface 63 .

[0082] And, if Fig.10 As shown, the transfer mechanism 71 includes a transfer pad 72 for holding the wafer W, a transfer arm 74 for holding the transfer pad 72 via a connection portion 76 , and a lifting member 75 for lifting and lowering the transfer pad 72 and the transfer arm 74 .

[0083] The transfer pad 72 has a downward suction surface 73 parallel to the holding surface 63 of the chuck table 60 for holding the wafer W. When the wafer W held by the holding surface 63 of the chuck table 60 is carried out by the transfer mechanism 71, the suction surface 73 suction-holds the back side Wb of the wafer W held by the holding surface 63.

[0084] The transfer pad 72 is attached to the front end of the transfer arm 74 via a connecting portion 76 .

[0085] The connection part 76 is attached to the transfer arm 74 while passing through a through hole 77 provided at the front end of the transfer arm 74. The connection part 76 has an enlarged diameter part 81 at the upper end, and the connection part 76 is prevented from falling out of the through hole 77.

[0086] The lower end of the connection portion 76 is attached to the upper surface of the conveying pad 72. A spring 83 is provided between the lower surface of the conveying arm 74 and the upper surface of the conveying pad 72 so as to surround the connection portion 76. The spring 83 applies force to the lower surface of the conveying arm 74 and the upper surface of the conveying pad 72 in a direction in which they are separated from each other.

[0087] The base end side of the transfer arm 74 is attached to the lifting member 75. The lifting member 75 lifts and lowers the transfer pad 72 and the transfer arm 74 in the Z-axis direction which is a direction perpendicular to the holding surface 63 of the chuck table 60.

[0088] Furthermore, an inclination changing member 85 is mounted on the upper surface 74a of the transfer arm 74. The inclination changing member 85 changes the relative inclination between the suction surface 73 of the transfer pad 72 and the holding surface 23 of the chuck table 20. The inclination changing member 85 is configured to move along the extending direction of the transfer arm 74 under the control of the control unit 57.

[0089] The inclination changing member 85 has a wedge-shaped wedge portion 86 at its front end. The inclination changing member 85 moves toward the front end of the transfer arm 74 on the upper surface 74a of the transfer arm 74 so that the wedge portion 86 can enter between the upper surface 74a and the enlarged diameter portion 81 of the connection portion 76.

[0090] and, Figure 3 The ion generator 51 shown is installed on the −X side of the chuck table 60 in a state where the air outlet 53 thereof faces the chuck table 60. The ion generator 51 blows ionized air toward the holding surface 63 of the chuck table 60.

[0091] Therefore, when the wafer W is separated from the holding surface 63 by the transfer pad 72, the ionizer 51 blows ionized air toward the lower surface of the protective tape T2 of the wafer W. Thus, the ionizer 51 removes static electricity on the protective tape T2.

[0092] Here, the transport operation of the transport mechanism 71 for transporting the wafer W will be described. The following operation is performed under the control of the control unit 57, for example.

[0093] The wafer W placed on the chuck table 60 is Fig. 9 After the processing member 55 shown is ground, the control unit 57 controls the transport mechanism 71 to remove the wafer W from the chuck table 60 .

[0094] That is, first, Fig.10 As shown in FIG. 1 , the transport mechanism 71 is arranged above the wafer W placed on the holding surface 63 of the chuck table 60. As shown in the figure, the adsorption surface 73 of the transport pad 72 mounted on the transport arm 74 is connected to the suction source 92 via the suction valve 91. By opening the suction valve 91, the adsorption surface 73 is connected to the suction source 92, and the adsorption surface 73 has an attraction force. Fig.10 In the illustrated state, the suction valve 91 is closed.

[0095] Thereafter, the suction valve 91 is opened, and the lifting member 75 of the transfer mechanism 71 moves the transfer arm 74 downward (in the −Z direction) until the wafer W is held (adsorbed) by the adsorption surface 73 of the transfer pad 72 .

[0096] After the wafer W is held by the suction surface 73, Fig.11As shown, the inclination changing member 85 moves on the upper surface 74 a of the transfer arm 74 toward the front end direction (+X direction) of the transfer arm 74 , so that the wedge portion 86 gradually enters between the upper surface 74 a and the enlarged diameter portion 81 of the connecting portion 76 .

[0097] When the wedge portion 86 gradually enters between the upper surface 74a of the transfer arm 74 and the enlarged diameter portion 81 of the connecting portion 76, the base end side (-X side) of the transfer arm 74 in the connecting portion 76 is gradually lifted by the wedge portion 86. As a result, the adsorption surface 73 of the transfer pad 72 supported by the connecting portion 76 gradually inclines relative to the holding surface 63 of the chuck table 60 in a manner that the -X side becomes higher.

[0098] In this way, the inclination changing member 85 gradually increases the relative inclination between the adsorption surface 73 of the transfer pad 72 that adsorbs and holds the wafer W held by the holding surface 63 and the holding surface 63 from the state where the adsorption surface 73 and the holding surface 63 are parallel to each other. That is, the inclination changing member 85 gradually inclines the adsorption surface 73 of the transfer pad 72 from the state where the adsorption surface 73 is parallel to the holding surface 63 of the chuck table 60 (the state where the inclination difference is zero) (the state where the inclination difference is increasing). As a result, the -X side of the lower surface of the protective band T2 of the wafer W gradually moves away from the holding surface 63. In this way, the inclination changing member 85 gradually increases the area of ​​the portion of the lower surface of the protective band T2 of the wafer W that moves away from the holding surface 63.

[0099] And, at this time, if Fig.11 As shown, the ion generator 51 on the −X side of the chuck table 60 blows ionized air A2 toward a portion of the lower surface of the protective tape T2 away from the holding surface 63 , for example, when a portion of the protective tape T2 begins to separate from the holding surface 63 .

[0100] Thereafter, the lifting member 75 moves the conveying arm 74 upward (in the +Z direction). As a result, a larger portion of the lower surface of the protective tape T2 that is separated from the holding surface 63 is exposed.

[0101] Then, if Fig.11 and Fig.12 As shown, the ion generator 51 continues to blow ionized air A2 toward the portion of the lower surface of the protective tape T2 that is away from the holding surface 63 until the lower surface of the protective tape T2 is completely away from the holding surface 63 and further away from the holding surface 63 by a specified distance D2.

[0102] The distance D1 is, for example, a distance at which electrostatic interaction between the holding surface 63 and the lower surface of the protective tape T2 is negligibly small.

[0103] In this way, in the grinding device 2, the area of ​​the portion of the lower surface of the protective tape T2 that is separated from the holding surface 63 is gradually increased, and the ion generator 51 blows ionized air A2 to the portion, thereby removing the static electricity on the protective tape T2. Therefore, it is possible to suppress the protective tape T2 from being charged after leaving the holding surface 63 of the chuck table 60, and the wafer W can be unloaded from the holding surface 63 while removing the static electricity on the protective tape T2. Therefore, the protective tape T2 that is separated from the holding surface 63 is not easily charged with static electricity. Therefore, it is possible to suppress the degradation of the quality of the device formed on the wafer W.

[0104] Moreover, the grinding device 2 has one ion generator 51. Alternatively, the grinding device 2 may have a plurality of ion generators 51.

[0105] Furthermore, in the present embodiment, the inclination changing member 85 is configured to incline the adsorption surface 73 of the conveying pad 72. The present invention is not limited to this, and the inclination changing member can be used as long as it can change the relative inclination between the adsorption surface 73 of the conveying pad 72 and the holding surface 63 of the chuck table 60. For example, the grinding device 2 may also include an inclination changing member that changes (adjusts) the inclination of the holding surface 63 of the chuck table 60 instead of the inclination changing member 85. Such an inclination changing member is disclosed in, for example, Japanese Patent Application Laid-Open No. 2013-119123.

[0106] In this structure, the inclination changing member gradually inclines the holding surface 63 of the chuck table 60 holding the wafer W from a state parallel to the adsorption surface 73 of the transfer pad 72 adsorbing and holding the wafer W. In this structure, the area of ​​the portion of the lower surface of the protective tape T2 of the wafer W away from the holding surface 63 can be gradually increased, and the ion generator 51 blows ionized air to this portion.

Claims

1. A processing device, comprising: A holding member having a holding surface for holding a workpiece group via a dicing tape, wherein the workpiece group is integrated by adhering the dicing tape to an annular frame and a workpiece disposed at an opening of the annular frame; a processing member for processing the workpieces held by the holding surface while supplying water to the workpieces; a lifting member that moves a frame holding portion in a direction perpendicular to the holding surface, the frame holding portion having at least three holding portions that hold the annular frame of the workpiece group held by the holding surface; as well as An ion generator blows ionized air toward the lower surface of the dicing tape to remove static electricity from the dicing tape. in, The lifting member is configured to raise the frame holding portion holding the annular frame of the workpiece group so that the lower surface of the dicing tape of the workpiece group gradually separates from the holding surface from the outer peripheral portion toward the center. The ion generator is configured to continuously blow ionized air toward a portion of the lower surface of the scribe tape that is away from the holding surface until the lower surface of the scribe tape is completely away from the holding surface and the lower surface of the scribe tape is further away from the holding surface by a predetermined distance. The processing device removes the workpiece from the holding surface while removing static electricity from the dicing tape.

2. A processing device, comprising: A holding member having a holding surface for holding a workpiece via a protective member, wherein the workpiece has the protective member on one surface; a processing member for processing the workpiece held by the holding surface; a lifting member that moves a conveying pad in a direction perpendicular to the holding surface, the conveying pad having an adsorption surface that adsorbs and holds the other surface of a workpiece held on the holding surface; An ion generator blows ionized air toward the lower surface of the protective component to remove static electricity from the protective component. in, The processing device further comprises an inclination changing member, which changes the relative inclination between the adsorption surface and the holding surface of the conveying pad. The inclination changing member is configured to gradually increase the relative inclination between the adsorption surface of the conveying pad for adsorbing and holding the workpiece held by the holding surface and the holding surface from a state in which the adsorption surface and the holding surface are parallel to each other, thereby gradually increasing the area of ​​the portion of the lower surface of the protective member of the workpiece that is away from the holding surface. The ion generator is configured to continuously blow ionized air toward a portion of the lower surface of the protective component that is away from the holding surface until the lower surface of the protective component is completely away from the holding surface and the lower surface of the protective component is further away from the holding surface by a predetermined distance. The processing device removes the workpiece from the holding surface while removing static electricity from the protective member.

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