Heat exchange substrate components, heat exchange modules, controllers, air conditioners

Abstract

The present invention provides a heat exchange substrate assembly, a heat exchange module, a controller, and an air conditioner, wherein the heat exchange substrate assembly includes a substrate body and a temperature sensing package. A cooling channel is constructed in the substrate body, the cooling channel has an inlet pipe, and the inlet pipe has a flow regulating device. The temperature sensing package is connected to the flow regulating device and is infused with a thermal medium. The thermal medium can adjust the flow of the cooling medium flowing in the flow regulating device according to the temperature change of the preset area detected by the temperature sensing package and / or the temperature change of the cooling medium in the inlet pipe. According to a heat exchange substrate assembly, a heat exchange module, a controller, and an air conditioner of the present invention, the flow of the cooling medium flowing in the flow regulating device is adjusted in real time by the thermal medium, without the need for external control components, so that the cooling load and the heat load of the cooling fluid in the heat exchange substrate assembly are matched and balanced.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat dissipation, and in particular relates to a heat exchange substrate assembly, a heat exchange module, a controller, and an air conditioner. Background Art

[0002] With the extensive application of 4G and the gradual popularization of 5G, the heat generated by various data processing equipment is getting higher and higher. The data center has higher and higher requirements for the cooling capacity and energy saving of air-conditioning equipment. The heat dissipation problem of the controller of variable frequency refrigeration equipment is also becoming more and more serious. For example, poor heat dissipation of control modules such as IGBT modules can easily cause the built-in protection of the module to be activated or even burn the chip.

[0003] There are several conventional IGBT heat dissipation methods: one is to place the radiator through the controller box and place it in the air duct, and use forced air flow to dissipate the heat. Due to the relatively small heat dissipation capacity of air cooling, this fin-type radiator occupies a large space, which is a difficult problem in structural design and performance matching; another is to embed heat pipes in the heat dissipation aluminum alloy plate, and use the heat pipes to take the heat to other places for discharge; another is to embed copper tubes in the aluminum alloy radiator, and pass cooling media such as cooling water and low-temperature refrigerants through the copper tubes to cool the radiator; there is also a method of using semiconductor refrigeration for heat dissipation, but this is relatively rare. Generally speaking, the aforementioned various designs are only designed based on empirical values, which can easily lead to excessive or insufficient cooling capacity. When the cooling capacity is too large, it is easy to cause the surface temperature of the radiator to be too low. When it is lower than the dew point temperature of the surrounding air, condensation water will condense on the low-temperature surface, and condensation water is a very big threat to electrical safety, which is not allowed to occur; when the cooling capacity is too small, the heat dissipation is poor, which can easily cause the surface temperature of the module to rise, and in severe cases, it will trigger the built-in protection and even burn the chip. Therefore, it is particularly important to propose a heat exchange module that can adjust the flow rate of cooling fluid according to the real-time temperature of the heat dissipation module. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present invention is to provide a heat exchange substrate assembly, a heat exchange module, a controller, and an air conditioner, in which the flow rate of the cooling medium flowing in the flow regulating device is adjusted in real time by the thermal medium, without the need for external control components, so as to achieve a matching balance between the cooling load and the heat load of the cooling fluid in the heat exchange substrate assembly, thereby preventing shutdown protection caused by excessively high temperature of the heat dissipation substrate and condensation caused by excessively low temperature.

[0005] In order to solve the above problems, the present invention provides a heat exchange substrate assembly, including a substrate body and a temperature sensing bag. A cooling channel is constructed in the substrate body, and the cooling channel has an inlet pipe. The inlet pipe has a flow regulating device. The temperature sensing bag is connected to the flow regulating device and is filled with a thermal medium. The thermal medium can follow the temperature changes of a preset area detected by the temperature sensing bag and / or the temperature changes of the cooling medium in the inlet pipe to adjust the flow of the cooling medium flowing in the flow regulating device.

[0006] Optionally, the preset area is a most unfavorable area of ​​heat dissipation of the substrate body obtained through experimental testing and / or simulation.

[0007] Optionally, the flow regulating device includes a throat, an elastic tube, and a conical needle connected to the inner wall of the inlet pipe, the conical head of the conical needle passes through the flow hole of the throat, the lumen of the elastic tube is connected to the inner cavity of the temperature sensing bag to infuse the thermal medium, and under the action of the thermal medium, the length of the elastic tube can be adjusted and can drive the conical needle to produce a linear displacement away from or close to the throat.

[0008] Optionally, a connecting rod is provided between the tapered needle and the elastic tube, and the length of the connecting rod can be adjusted.

[0009] Optionally, the connecting rod is threadedly connected to the tapered needle.

[0010] Optionally, the lumen of the elastic tube is connected to the inner cavity of the temperature sensing package through a capillary tube.

[0011] Optionally, the flow regulating device also includes a first perforated ring, which is supported and connected to the inner wall of the inlet pipe, and the first perforated ring has a central through hole, and the conical needle passes through the central through hole; and / or, the flow regulating device also includes a second perforated ring, which is supported and connected to the inner wall of the inlet pipe, and one end of the elastic tube is fixedly connected to the second perforated ring.

[0012] Optionally, there are multiple cooling channels, and a first head is provided on the liquid inlet side of the multiple cooling channels, and the first head is configured with a diversion groove corresponding to the inlet of the multiple cooling channels, and a second head is provided on the liquid outlet side of the multiple cooling channels, and the second head is configured with a collecting groove corresponding to the outlet of the multiple cooling channels.

[0013] Optionally, an inlet is configured on the first end cover, and an outlet is configured on the second end cover, and the inlet and the outlet are respectively located at diagonal positions of the substrate body.

[0014] Optionally, the inlet pipe is connected to the inlet, the outlet pipe is connected to the outlet, the inlet pipe and the pipe clamp hole of the positioning block are interference fit, and the positioning block and the base plate body are detachably connected; and / or, the outlet pipe and the pipe clamp hole of the positioning block are interference fit, and the positioning block and the base plate body are detachably connected.

[0015] The present invention provides a heat exchange module, comprising the above-mentioned heat exchange substrate assembly.

[0016] The present invention provides a controller, comprising the above-mentioned heat exchange module.

[0017] The present invention provides an air conditioner, comprising the above-mentioned controller.

[0018] The present invention provides a heat exchange substrate assembly, a heat exchange module, a controller, and an air conditioner, in which a flow regulating device is arranged in the inlet pipe of the substrate body, and the flow regulating device is connected to a temperature sensing package through a thermal medium. The flow of the cooling medium flowing in the flow regulating device is adjusted in real time by the thermal medium without the need for external control components, so as to achieve a matching balance between the cooling load and the heat load of the cooling fluid in the heat exchange substrate assembly, thereby preventing shutdown protection caused by excessively high temperature of the heat dissipating substrate and condensation caused by excessively low temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the front view of the heat exchange substrate assembly according to an embodiment of the present invention, in which arrows indicate the flow direction of the cooling medium in the substrate body;

[0020] Figure 2 for Figure 1 A top view of

[0021] Figure 3 for Figure 1 A schematic diagram of the structure of the flow regulating device in FIG.

[0022] Figure 4 for Figure 1 A schematic diagram of the structure of the first end cap or the second end cap in one embodiment;

[0023] Figure 5 for Figure 1 A schematic diagram of the structure of the first end cap or the second end cap in another embodiment

[0024] Figure 6 for Figure 1 A schematic structural diagram of the first end cap or the second end cap in yet another embodiment;

[0025] Figure 7 It is a schematic structural diagram of a heat exchange module according to another embodiment of the present invention.

[0026] The reference numerals are:

[0027] 1. Base plate body; 11. Inlet pipe; 12. Outlet pipe; 13. Positioning block; 2. Flow regulating device; 21. Throat; 211. Flow hole; 22. Elastic tube; 23. Conical needle; 231. Conical head; 24. Connecting rod; 25. Capillary; 26. First perforated ring; 27. Second perforated ring; 3. Temperature sensing package; 31. Process pipe; 41. First end cap; 411. Inlet; 412. Diverter slot; 42. Second end cap; 421. Outlet; 422. Collecting slot; 100. Power module. DETAILED DESCRIPTION

[0028] See also Figures 1 to 7 As shown, according to an embodiment of the present invention, a heat exchange substrate assembly is provided, comprising a substrate body 1 and a temperature sensing package 3. A cooling channel is constructed in the substrate body 1. The cooling channel has an inlet pipe 11. The inlet pipe 11 has a flow regulating device 2. The temperature sensing package 3 is connected to the flow regulating device 2 and is filled with a thermal medium. The thermal medium can follow the temperature change of the preset area detected by the temperature sensing package 3 and / or the temperature change of the cooling medium in the inlet pipe 11 to adjust the flow of the cooling medium flowing in the flow regulating device 2. The thermal medium is, for example, a refrigerant such as R134a, R32, R22, or R245fa. In this technical solution, a flow regulating device is arranged in the inlet pipe of the substrate body. The flow regulating device is connected to the temperature sensing package through the thermal medium. The flow of the cooling medium flowing in the flow regulating device is adjusted in real time through the thermal medium. No external control components are required, so that the cooling load and the heat load of the cooling fluid in the heat exchange substrate assembly are matched and balanced, and the shutdown protection caused by the excessively high temperature of the heat dissipation substrate and the condensation phenomenon caused by the excessively low temperature are prevented. Specifically, the flow regulating device 2 in the present invention is arranged in the inlet pipe 11 and is also connected to the external temperature sensing bag 3 and infused with thermal medium. Therefore, the thermal medium can sense the temperature of the setting position of the temperature sensing bag 3 and the setting position of the flow regulating device 2 of the inlet pipe 11 in real time, and adjust the real-time flow of the cooling medium in the flow regulating device 2 in real time according to the detected temperature, thereby adjusting the heat exchange capacity of the heat exchange substrate assembly. The aforementioned preset area is the most unfavorable heat dissipation area of ​​the substrate body 1 obtained through experimental testing and / or simulation. The temperature sensing bag 3 is arranged in the most unfavorable heat dissipation area described here, which can match the flow of the cooling medium with its real-time temperature. At the same time, the flow regulating device 2 is arranged in the inlet pipe 11, which can detect and match the real-time temperature of the cooling medium here, and prevent the adverse effects caused by the real-time temperature being too high or too low.

[0029] In some embodiments, the flow regulating device 2 includes a throat 21, an elastic tube 22, and a conical needle 23 connected to the inner wall of the inlet pipe 11. The conical head 231 of the conical needle 23 passes through the flow hole 211 of the throat 21. The lumen of the elastic tube 22 is connected to the inner cavity of the temperature sensing bag 3 to be infused with the thermal medium. Under the action of the thermal medium, the length of the elastic tube 22 can be adjusted and can drive the conical needle 23 to produce a linear displacement away from or close to the throat 21. It can be understood that the flow rate of the cooling medium in the flow regulating device 2 is adjusted by changing the relative position of the conical head 231 of the conical needle 23 and the flow hole 211, that is, the size of the annular gap between the conical head 231 and the flow hole 211 changes, and the change in the relative position depends on the change in the length of the elastic tube 22, and the change in the length of the elastic tube 22 is determined by the state of the thermal medium in its tube cavity. Specifically, the thermal medium is a medium whose volume expands when the temperature increases and decreases when the temperature decreases. Due to this characteristic , the elastic tube 22 becomes longer when the volume of the thermal medium inside it expands, and when the volume of the thermal medium decreases, the elastic tube 22 shrinks and decreases in length under the action of its own elastic restoring force, thereby achieving that when the preset area and / or the inlet temperature of the cooling medium is high, the cooling medium flow in the flow regulating device 2 increases, and the annular gap between the conical head 231 and the throat 21 increases; when the preset area and / or the inlet temperature of the cooling medium is low, the cooling medium flow in the flow regulating device 2 decreases, and the annular gap between the conical head 231 and the throat 21 decreases. As mentioned above, the elasticity of the elastic tube 22 enables it to change in length as the volume of the thermal medium expands or decreases, and in specific implementation, it can be achieved by using a memory alloy.

[0030] Optionally, a connecting rod 24 is provided between the conical needle 23 and the elastic tube 22, and the length of the connecting rod 24 can be adjusted. For example, the connecting rod 24 and the conical needle 23 are threadedly connected, and the initial position between the conical needle 23 and the throat 21 is adjusted by the screwing length of the threaded connection between the connecting rod 24 and the conical needle 23. The calibration of the initial position can be carried out through experiments or simulations.

[0031] Specifically, the lumen of the elastic tube 22 is connected to the inner lumen of the temperature-sensing package 3 through the capillary 25. It can be understood that the temperature-sensing package 3 also has a process tube 31, through which the thermal medium can be filled into its inner lumen, the capillary 25 and the lumen of the elastic tube 22. In this technical solution, the flexibility of the capillary 25 itself can ensure that when the temperature-sensing package is arranged in different places, the structure of the capillary 25 will not be damaged, that is, the flexibility of the capillary can adapt to complex spatial arrangements, while thicker copper tubes usually cannot be adjusted and bent at will.

[0032] As a supporting and installing mode of the flow regulating device 2, optionally, the flow regulating device 2 further comprises a first perforated ring 26, the first perforated ring 26 is supported and connected to the inner peripheral wall of the inlet pipe 11, the first perforated ring 26 has a central through hole, and the conical needle 23 passes through the central through hole; and / or, the flow regulating device 2 further comprises a second perforated ring 27, the second perforated ring 27 is supported and connected to the inner peripheral wall of the inlet pipe 11, one end of the elastic tube 22 is fixedly connected to the second perforated ring 27, and the The design of the first perforated ring 26 can provide reliable support for the conical needle 23 and this reliable support continues during the linear displacement process of the conical needle 23; the second perforated ring 27 is used to support the end of the elastic tube 22 away from the conical needle 23. The design of the first perforated ring 26 and the second perforated ring 27 can make the elastic tube 22, the conical needle 23 and the connecting rod 24 centrally arranged in the inlet pipe 11. The perforations in the first perforated ring 26 and the second perforated ring 27 are designed to be relatively large to minimize obstruction to the cooling medium.

[0033] There are multiple cooling channels, and a first head 41 is provided on the liquid inlet side of the multiple cooling channels, and a diverter groove 412 corresponding to the inlet of the multiple cooling channels is constructed on the first head 41, and a second head 42 is provided on the liquid outlet side of the multiple cooling channels, and a collecting groove 422 corresponding to the outlet of the multiple cooling channels is constructed on the second head 42. The design purpose of the diverter groove 412 and the collecting groove 422 is to realize unified packaging of the inlet or outlet of the multiple cooling channels through the first head 41 and the second head 42, so as to simplify the design of the liquid supply or return flow path of the cooling channel. It can be understood that the groove width of the diverter groove 412 and the collecting groove 422 should be adapted to match the pipe diameter of the multiple cooling channels. Figures 4 to 6As shown, the structures of the first head 41 and the second head 42 can be completely the same, thereby simplifying the types of parts to be processed, and in terms of specific assembly, a 180° rotation method can be adopted. Specifically, the first head 41 is configured with an inlet 411, and the second head 42 is configured with an outlet 421. The inlet 411 and the outlet 421 are respectively located at diagonal positions of the substrate body 1, thereby achieving the same-path arrangement of the cooling medium of the heat exchange substrate assembly and improving the uniformity of heat exchange.

[0034] Optionally, the inlet pipe 11 is connected to the inlet 411, the outlet pipe 12 is connected to the outlet 421, the inlet pipe 11 and the pipe hoop hole of the positioning block 13 are interference-fitted, and the positioning block 13 and the substrate body 1 are detachably connected; and / or, the outlet pipe 12 and the pipe hoop hole of the positioning block 13 are interference-fitted, and the positioning block 13 and the substrate body 1 are detachably connected. The inlet pipe 11, the outlet pipe 12 and the positioning block 13 are all arranged on one side of the substrate body 1 to facilitate the layout of the overall structure of the heat exchange module.

[0035] After the substrate body 1 and the first head 41 and the second head 42 in the heat exchange substrate assembly of the present invention are aligned and assembled, they are sent to a high-temperature furnace for automatic melting welding. After completion, the corresponding flow regulating device is assembled. The flow regulating device is, for example, encapsulated in an independent shell. Specifically, the capillary 25 is welded to the through hole of the inlet pipe 11, and the two ends of the independent flow regulating device are welded to the inlet pipe 11. During welding, the flow regulating device is cooled and protected to prevent the high temperature of welding from damaging the interior.

[0036] According to an embodiment of the present invention, a heat exchange module is provided, comprising the above heat exchange substrate assembly. Specifically, a power module 100 is arranged on a side of the substrate body 1 away from the inlet pipe 11 or the outlet pipe 12, and heat dissipation silicone grease is preferably applied between the two.

[0037] According to an embodiment of the present invention, a controller is provided, comprising the above-mentioned heat exchange module.

[0038] According to an embodiment of the present invention, there is provided an air conditioner, comprising the above-mentioned controller.

[0039] It is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous methods can be freely combined and superimposed.

[0040] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention. The above are only preferred embodiments of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present invention, and these improvements and variations should also be regarded as the protection scope of the present invention.

Claims

1. A heat exchange substrate assembly, characterized in that: The invention comprises a substrate body (1) and a temperature sensing package (3), wherein a cooling channel is constructed in the substrate body (1), wherein the cooling channel has an inlet pipe (11), wherein a flow regulating device (2) is arranged in the inlet pipe (11), wherein the temperature sensing package (3) is connected to the flow regulating device (2) and is filled with a thermal medium, wherein the thermal medium can follow the temperature change of a preset area detected by the temperature sensing package (3) and / or the temperature change of the cooling medium in the inlet pipe (11), and adjust the flow rate of the cooling medium flowing in the flow regulating device (2); wherein the flow regulating device (2) comprises a throat (21) connected to the inner peripheral wall of the inlet pipe (11), an elastic tube (22), and a conical needle (23), wherein the conical head (231) of the conical needle (23) penetrates the inner peripheral wall of the inlet pipe (11) and the conical head (231) of the conical needle (23) is inserted into the conical head (231) of the conical needle (23). The elastic tube (22) is arranged in the flow hole (211) of the throat (21), the lumen of the elastic tube (22) is connected with the inner lumen of the temperature sensing package (3) to inject the thermal medium, and under the action of the thermal medium, the length of the elastic tube (22) can be adjusted and can drive the conical needle (23) to produce a linear displacement away from or close to the throat (21); the elastic tube (22) and the conical needle (23) are respectively located on both sides of the flow hole (211); when the temperature of the preset area and / or the cooling medium inlet is high, the annular gap between the conical head (231) and the throat (21) increases; when the temperature of the preset area and / or the cooling medium inlet is low, the annular gap between the conical head (231) and the throat (21) decreases.

2. The heat exchange substrate assembly according to claim 1, characterized in that: The preset area is the most unfavorable area of ​​heat dissipation of the substrate body (1) obtained through experimental testing and / or simulation.

3. The heat exchange substrate assembly according to claim 1, characterized in that: A connecting rod (24) is provided between the tapered needle (23) and the elastic tube (22), and the length of the connecting rod (24) can be adjusted.

4. The heat exchange substrate assembly according to claim 3, characterized in that: The connecting rod (24) is threadedly connected to the tapered needle (23).

5. The heat exchange substrate assembly according to claim 1, characterized in that: The lumen of the elastic tube (22) is connected to the inner lumen of the temperature sensing package (3) through a capillary tube (25).

6. The heat exchange substrate assembly according to claim 1, characterized in that: The flow regulating device (2) further comprises a first perforated ring (26), the first perforated ring (26) being supported and connected to the inner peripheral wall of the inlet pipe (11), the first perforated ring (26) having a central through hole, the conical needle (23) passing through the central through hole; and / or the flow regulating device (2) further comprises a second perforated ring (27), the second perforated ring (27) being supported and connected to the inner peripheral wall of the inlet pipe (11), one end of the elastic tube (22) being fixedly connected to the second perforated ring (27).

7. The heat exchange substrate assembly according to claim 1, characterized in that: The cooling channels are provided with a plurality of cooling channels, a first sealing head (41) is provided on the liquid inlet side of the plurality of cooling channels, a flow dividing groove (412) corresponding to the inlet of the plurality of cooling channels is constructed on the first sealing head (41), a second sealing head (42) is provided on the liquid outlet side of the plurality of cooling channels, and a flow collecting groove (422) corresponding to the outlet of the plurality of cooling channels is constructed on the second sealing head (42).

8. The heat exchange substrate assembly according to claim 7, characterized in that: The first sealing head (41) is provided with an inlet (411), and the second sealing head (42) is provided with an outlet (421), wherein the inlet (411) and the outlet (421) are respectively located at diagonal positions of the substrate body (1).

9. The heat exchange substrate assembly according to claim 8, characterized in that: The inlet pipe (11) is connected to the inlet (411), the outlet pipe (12) is connected to the outlet (421), the inlet pipe (11) and the pipe clamp hole of the positioning block (13) are interference-fitted, and the positioning block (13) and the base plate body (1) are detachably connected; and / or, the outlet pipe (12) and the pipe clamp hole of the positioning block (13) are interference-fitted, and the positioning block (13) and the base plate body (1) are detachably connected.

10. A heat exchange module, characterized in that: The heat exchange substrate assembly comprises the heat exchange substrate assembly according to any one of claims 1 to 9.

11. A controller, characterized in that: Comprising the heat exchange module according to claim 10.

12. An air conditioner, characterized in that: Includes the controller as claimed in claim 11.

Images