Cooling unit and substrate processing device including the same

Abstract

A cooling unit for cooling a substrate comprises: a plate in which a fluid channel is formed; and a fluid supply member that supplies a fluid into the fluid channel. The fluid channel comprises a plurality of first fluid channels, each of which is connected to the fluid supply member at one end thereof; and a second fluid channel that is connected to the opposite end of the plurality of first fluid channels and discharges the fluid. A buffer space is formed inside the plate, and the buffer space connects the opposite end of the plurality of first fluid channels with one end of the second fluid channel.

Description

Technical Field

[0001] Embodiments of the inventive concepts described herein relate to a cooling unit and a substrate treating apparatus including the cooling unit. Background Art

[0002] Generally, various processes such as cleaning, deposition, photolithography, etching, ion implantation, etc. are performed to manufacture semiconductor elements. A photolithography process for forming a pattern plays an important role in realizing high-density integration of semiconductor elements.

[0003] A photolithography process is performed to form a pattern on a substrate. In the photolithography process, a coating process, an exposure process, and a development process are sequentially performed, and each process includes a plurality of substrate processing steps. After performing one of the substrate processing steps, the substrate is temporarily stored for the next step. Since the processed substrate is generally kept in a high temperature state, a process of cooling the substrate is performed while temporarily storing the substrate. Therefore, a substrate processing apparatus for performing a photolithography process on a substrate generally includes a cooling plate for cooling the substrate while temporarily storing the substrate.

[0004] Figure 1 is a perspective view showing a general cooling plate. Figure 1 , the cooling plate 5000 generally has a cooling line 5100 formed therein, in which a cooling fluid flows. One end of the cooling line 5100 is connected to a supply line 5202 for supplying the cooling fluid. The supply line 5202 is connected to a refrigerant supply source 5200. The opposite end of the cooling line 5100 is connected to a discharge line 5204. The refrigerant supply source 5200 supplies the cooling fluid into the cooling line 5100. The cooling fluid supplied into the cooling line 5100 flows through the cooling line 5100 and is discharged to the outside through the discharge line 5204.

[0005] When the cooling fluid flows along the cooling line 5100, the cold heat of the cooling fluid lowers the temperature of the cooling plate 5000. The cooling plate 5000 exchanges heat with the substrate placed on the cooling plate 5100. However, the temperatures of the cooling fluid flowing in the cooling line 5100 are different from each other according to the regions of the cooling line 5100. For example, the temperature of the cooling fluid at one end of the cooling line connected to the supply line 5202 is different from the temperature of the cooling fluid at the opposite end of the cooling line 5100 connected to the exhaust line 5204. Therefore, the substrate may not be cooled uniformly. Summary of the invention

[0006] Embodiments of the inventive concept provide a cooling unit for efficiently processing a substrate and a substrate processing apparatus including the cooling unit.

[0007] Furthermore, embodiments of the inventive concept provide a cooling unit for efficiently cooling a substrate and a substrate treating apparatus including the same.

[0008] Furthermore, embodiments of the inventive concept provide a cooling unit for uniformly cooling a substrate and a substrate treating apparatus including the cooling unit.

[0009] Furthermore, embodiments of the inventive concept provide a cooling unit for minimizing stagnation of a temperature-adjusting fluid in a fluid channel when the temperature-adjusting fluid is discharged from a temperature-adjusting plate, and a substrate treating apparatus including the same.

[0010] Technical problems to be solved by the present inventive concept are not limited to the above-mentioned problems, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the present inventive concept belongs from the following description.

[0011] According to an exemplary embodiment, a substrate processing device includes: an indexing module including a loading port on which a carrier containing a substrate is placed; and a processing module that processes the substrate transferred from the indexing module. The processing module includes: a processing chamber that processes the substrate; and a buffer chamber that temporarily stores the substrate. The buffer chamber includes: a housing having a space therein; and a cooling unit that cools the substrate in the space. The cooling unit includes: a temperature regulating plate in which a fluid channel is formed; and a fluid supply member that supplies a temperature regulating fluid into the fluid channel. The fluid channel includes: a plurality of first fluid channels, each of which is connected to the fluid supply member at one end thereof; and a second fluid channel that is connected to the opposite end of the plurality of first fluid channels and discharges the temperature regulating fluid. A buffer space is formed inside the temperature regulating plate, and the buffer space connects the opposite end of the plurality of first fluid channels with one end of the second fluid channel.

[0012] According to one embodiment, a diameter of the buffer space may be greater than a diameter of the plurality of first fluid channels.

[0013] According to one embodiment, a diameter of the buffer space may be greater than a diameter of the second fluid channel.

[0014] According to one embodiment, the opposite ends of the plurality of first fluid channels may be connected to the buffer space, and the one end of the second fluid channel may be connected to the buffer space.

[0015] According to one embodiment, the buffer space may be formed in a central region of the temperature regulating plate when viewed from above.

[0016] According to one embodiment, the plurality of first fluid channels may be formed in a region above the second fluid channel when viewed in a vertical cross-section of the temperature regulating plate.

[0017] According to one embodiment, the buffer space may be formed in a region between the plurality of first fluid channels and the second fluid channel when viewed in the vertical cross-section of the temperature regulating plate.

[0018] According to one embodiment, the temperature regulating plate may include: a first plate; and a second plate, the second plate being disposed below the first plate. The plurality of first fluid channels may be formed inside the first plate, and the second fluid channel may be formed inside the second plate.

[0019] According to one embodiment, the buffer space may be formed inside the first plate.

[0020] According to one embodiment, the temperature adjustment plate may be formed of a material including aluminum, copper, or a carbon-based composite material.

[0021] According to an exemplary embodiment, a cooling unit for cooling a substrate includes: a plate in which a fluid channel is formed; and a fluid supply member that supplies a fluid into the fluid channel. The fluid channel includes a plurality of first fluid channels, each of which is connected to the fluid supply member at one end thereof; and a second fluid channel that is connected to the opposite end of the plurality of first fluid channels and discharges the fluid. A buffer space is formed inside the plate, and the buffer space connects the opposite end of the plurality of first fluid channels to one end of the second fluid channel.

[0022] According to one embodiment, a diameter of the buffer space may be greater than diameters of the plurality of first fluid channels and the second fluid channel.

[0023] According to one embodiment, the opposite ends of the plurality of first fluid channels may be connected to the buffer space, and the one end of the second fluid channel may be connected to the buffer space.

[0024] According to one embodiment, the buffer space may be formed in a central region of the plate when viewed from above.

[0025] According to one embodiment, the plurality of first fluid channels may be formed in a region above the second fluid channels when viewed in a vertical cross-section of the plate.

[0026] According to one embodiment, the buffer space may be formed in a region between the plurality of first fluid channels and the second fluid channel when viewed in the vertical cross-section of the plate.

[0027] According to one embodiment, the plate may include a first plate; and a second plate, the second plate being disposed below the first plate. The plurality of first fluid channels may be formed inside the first plate, and the second fluid channel may be formed inside the second plate.

[0028] According to one embodiment, the buffer space may be formed inside the first plate.

[0029] According to one embodiment, the plate may be a temperature regulating plate that regulates the temperature of the substrate supported on the temperature regulating plate, and the fluid may be a temperature regulating fluid that changes the temperature of the temperature regulating plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and wherein:

[0031] Figure 1 is a perspective view showing a general cooling plate;

[0032] Figure 2 is a schematic perspective view showing a substrate processing device according to the present invention;

[0033] Figure 3 It is shown Figure 2 A cross-sectional view of a coating block and a developing block of a substrate processing device;

[0034] Figure 4 It is shown Figure 2 A plan view of a substrate processing device;

[0035] Figure 5 The diagram shows Figure 4 A hand portion of a transmission unit;

[0036] Figure 6 It is shown Figure 4 A schematic horizontal cross-sectional view of a heat treatment chamber;

[0037] Figure 7 It is shown Figure 6 A front cross-sectional view of a heat treatment chamber;

[0038] Figure 8 It is shown Figure 4 A schematic perspective view of a buffer chamber;

[0039] Fig. 9 It is shown Figure 8 A three-dimensional diagram of a cooling unit, a buffer plate and a support shaft;

[0040] Fig.10 is a plan view showing a cooling unit according to an embodiment of the present inventive concept;

[0041] Fig.11 It is shown Fig.10 A cross-sectional view of a cooling unit;

[0042] Fig.12 The temperature of the fluid is shown in Fig.10 The state of the flow in the cooling unit; and

[0043] Fig.13 is a cross-sectional view illustrating a cooling unit according to another embodiment of the present inventive concept. DETAILED DESCRIPTION

[0044] Hereinafter, embodiments of the inventive concept will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the inventive concept belongs can easily implement the inventive concept. However, the inventive concept can be implemented in various different forms and is not limited to the embodiments described herein. In addition, when describing the embodiments of the inventive concept, when detailed descriptions related to known functions or configurations may unnecessarily make the subject matter of the inventive concept unclear, they will be omitted. In addition, throughout the accompanying drawings, components that perform similar functions and operations have the same reference numerals.

[0045] The terms "comprising" and "including" in the specification are "open" expressions, which are only used to indicate the existence of corresponding components, and unless there is a specific description to the contrary, other components are not excluded but may be included. Specifically, it should be understood that the terms "comprising", "including" and "having" when used in this document specify the existence of the features, wholes, steps, operations, components and / or parts, but do not exclude the existence or addition of one or more other features, wholes, steps, operations, components, parts and / or groups.

[0046] Unless otherwise specified, terms in the singular form may include plural forms. Furthermore, in the drawings, the shapes and sizes of components may be exaggerated for clarity of explanation.

[0047] Figure 2 is a schematic perspective view illustrating a substrate processing apparatus according to the present inventive concept. Figure 3 It shows Figure 2 A cross-sectional view of a coating block and a developing block of a substrate processing device. Figure 4 It shows Figure 2 A plan view of a substrate processing apparatus.

[0048] refer to Figures 2 to 4 , the substrate processing device 1 includes an indexing module 20, a processing module 30 and an interface module 40. According to one embodiment, the indexing module 20, the processing module 30 and the interface module 40 are arranged in a row. Hereinafter, the direction in which the indexing module 20, the processing module 30 and the interface module 40 are arranged is referred to as an X-axis direction 12, the direction perpendicular to the X-axis direction 12 when viewed from above is referred to as a Y-axis direction 14, and the direction perpendicular to both the X-axis direction 12 and the Y-axis direction 14 is referred to as a Z-axis direction 16.

[0049] The indexing module 20 transfers the substrate W from the carrier 10 in which the substrate W is accommodated to the processing module 30 and places the completely processed substrate W in the carrier 10. The length direction of the indexing module 20 is parallel to the Y-axis direction 14. The indexing module 20 may have a loading port 22 on which the carrier 10 in which the substrate W is accommodated is placed. In addition, the indexing module 20 has an indexing frame 24. With respect to the indexing frame 24, the loading port 22 is located at the opposite side relative to the processing module 30. The carrier 10 in which the substrate W is accommodated is placed on the loading port 22. The loading port 22 may be arranged along the Y-axis direction 14.

[0050] An airtight carrier 10 such as a front opening unified unit (FOUP) may be used as the carrier 10. The carrier 10 may be placed on the load port 22 by a transfer device (not shown) such as an overhead conveyor, an overhead conveyor, an automatic guided vehicle, or by an operator.

[0051] The indexing robot 2200 is arranged in the indexing frame 24. The guide rail 2300 is arranged in the indexing frame 24, and its length direction is parallel to the Y-axis direction 14. The indexing robot 2200 can move on the guide rail 2300. The indexing robot 2200 includes: a hand 2220, on which the substrate W is placed, and the hand 2220 can move forward and backward, can rotate around an axis oriented along the Z-axis direction 16, and can move along the Z-axis direction 16.

[0052] The processing module 30 can process the substrate W transferred from the indexing module 20. The processing module 30 performs a coating process and a developing process on the substrate W. The processing module 30 has a coating block 30a and a developing block 30b. The coating block 30a performs a coating process on the substrate W, and the developing block 30b performs a developing process on the substrate W. The coating blocks 30a are stacked on each other. The developing blocks 30b are stacked on each other. Figure 3In an embodiment, two coating blocks 30a and two developing blocks 30b are provided. The coating block 30a may be arranged below the developing block 30b. According to one embodiment, the two coating blocks 30a may perform the same process and may have the same structure. In addition, the two developing blocks 30b may perform the same process and may have the same structure.

[0053] refer to Figure 4 , the coating block 30a has a heat treatment chamber 3200, a transfer chamber 3400, a liquid treatment chamber 3600 and a buffer chamber 3800. The heat treatment chamber 3200 performs a heat treatment process on the substrate W. The heat treatment process includes a cooling process and a heating process. The liquid treatment chamber 3600 forms a liquid film on the substrate W by dispensing liquid onto the substrate W. The liquid film can be a photoresist film or an anti-reflection film. The transfer chamber 3400 transfers the substrate W between the heat treatment chamber 3200 and the liquid treatment chamber 3600 in the coating block 30a.

[0054] The transfer chamber 3400 is arranged so that its length direction is parallel to the X-axis direction 12. A transfer unit 3420 is provided in the transfer chamber 3400. The transfer unit 3420 transfers the substrate W between the heat treatment chamber 3200, the liquid treatment chamber 3600, and the buffer chamber 3800. According to one embodiment, the transfer unit 3420 has a hand A for placing the substrate W, the hand A can move forward and backward, can rotate around an axis oriented in the Z-axis direction 16, and can move in the Z-axis direction 16. A guide rail 3300 is provided in the transfer chamber 3400, and its length direction is parallel to the X-axis direction 12. The transfer unit 3420 is movable on the guide rail 3300.

[0055] Figure 5 It is shown Figure 4 An example of a hand portion of a transfer unit. Figure 5 , the hand-shaped portion A has a base 3428 and a supporting protrusion 3429. The base 3428 may have a ring shape, the periphery of which is partially curved. The inner diameter of the base 3428 is larger than the diameter of the substrate W. The supporting protrusion 3429 extends inward from the base 3428. The supporting protrusion 3429 supports the edge area of ​​the substrate W. According to one embodiment, four supporting protrusions 3429 may be provided at equal intervals.

[0056] Reference again Figure 3 and Figure 4 , a plurality of heat treatment chambers 3200 are provided. The heat treatment chambers 3200 are arranged along the X-axis direction 12. The heat treatment chambers 3200 are located at one side of the transfer chamber 3400.

[0057] Figure 6 It is shown Figure 4 A schematic horizontal cross-sectional view of a heat treatment chamber, Figure 7 It is shown Figure 6Front view cross section of the heat treatment chamber Figure 6 The thermal treatment chamber 3200 includes a treatment container 3201 , a cooling unit 3220 , and a heating unit 3230 .

[0058] The processing container 3201 has an inner space 3202. The processing container 3201 has a substantially rectangular parallelepiped shape. The processing container 3201 has an inlet / outlet (not shown) on its side wall, through which the substrate W enters or leaves the processing container 3201. In addition, a door (not shown) may be provided to open or close the inlet / outlet. Optionally, the inlet / outlet opening may remain open. The inlet / outlet may be formed in an area adjacent to the cooling unit 3220. A cooling unit 3220, a heating unit 3230, and a measuring unit 3240 are provided in the inner space 3202 of the processing container 3201. The cooling unit 3220 and the heating unit 3230 are arranged side by side along the Y-axis direction 14. An exhaust line 3210 may be connected to the processing container 3201. The exhaust line 3210 may release the gas supplied by the fan unit 3250 to the outside of the processing container 3201. The exhaust line 3210 may be connected to the bottom of the processing container 3201. However, not limited thereto, the exhaust line 3210 may be connected to the side of the processing container 3201 .

[0059] The cooling unit 3220 has a cooling plate 3222. The cooling plate 3222 can place the substrate W thereon. When viewed from above, the cooling plate 3222 can have a substantially circular shape. A cooling member (not shown) is provided inside the cooling plate 3222. According to one embodiment, the cooling member can be formed inside the cooling plate 3222 and can be used as a fluid channel for a cooling fluid to flow therein. Therefore, the cooling plate 3222 can cool the substrate W. The cooling plate 3222 can have a diameter corresponding to the substrate W. The cooling plate 3222 can have a notch formed at its edge. The notch can have a shape corresponding to the support protrusion 3429 formed in the above-mentioned hand A. In addition, as many notches as the support protrusion 3429 formed in the hand A can be formed at a position corresponding to the support protrusion 3429. When the vertical positions of the hand A and the cooling plate 3222 are changed, the substrate W is transferred between the hand A and the cooling plate 3222. A plurality of slit-shaped guide grooves 3224 are formed in the cooling plate 3222. The guide grooves 3224 extend inward from the edge of the cooling plate 3222. The length direction of the guide grooves 3224 is parallel to the Y-axis direction 14, and the guide grooves 3224 are positioned to be spaced apart from each other along the X-axis direction 12. When the substrate W is transferred between the cooling plate 3222 and the heating unit 3230, the guide grooves 3224 prevent the cooling plate 3222 and the lifting pins 3236 from interfering with each other.

[0060] The cooling plate 3222 may be supported by a support member 3227. The support member 3227 may include a first support member having a rod shape and a second support member coupled to the center of the first support member. One end and the opposite end of the first support member are coupled to an actuator 3226. The actuator 3226 is mounted on a guide rail 3229. When viewed from above, the length direction of the guide rail 3229 may be parallel to the Y-axis direction 14, and the guide rail 3229 may be disposed on the opposite side of the processing container 3201. The cooling plate 3222 may be moved along the Y-axis direction 14 by the actuator 3226 mounted on the guide rail 3229.

[0061] The heating unit 3230 may include a housing 3232, a heating plate 3234, a heater 3235, a lifting pin 3236, and a driving member 3238. The housing 3232 may include a main body and a cover. The main body may be arranged below the cover. The main body may have a shape that is open at the top. The main body may have a columnar shape that is open at the top. The cover may cover the open top of the main body. The cover may have a columnar shape that is open at the bottom. Alternatively, the cover may have a plate shape that covers the open top of the main body. The main body and the cover may be combined to form a processing space 3233. In addition, the cover may be connected to a driving member 3238 that moves the cover in the up-down direction. Therefore, the cover may move in the up-down direction to open or close the processing space 3233. For example, when the substrate W is loaded into or unloaded from the processing space 3233, the cover may move upward to open the processing space 3233. In addition, when the substrate W is processed in the processing space 3233, the cover may move downward to close the processing space 3233.

[0062] The heating plate 3234 can support the substrate W in the processing space 3233. The heating plate 3234 can place the substrate W thereon. When viewed from above, the heating plate 3234 has a substantially circular shape. The heating plate 3234 has a larger diameter than the substrate W. The heating plate 3234 is equipped with a heater 3235. The heater 3235 can be implemented by a resistive heating element to which an electric current is applied. Therefore, the heating plate 3234 can heat the substrate W. The heating plate 3234 has a lifting pin 3236 that can move vertically along the Z-axis direction 16. The lifting pin 3236 receives the substrate W from a conveying device outside the heating unit 3230 and puts the substrate W on the heating plate 3234, or lifts the substrate W off the heating plate 3234 and conveys the substrate W to a conveying device outside the heating unit 3230. According to one embodiment, three lifting pins 3236 may be provided.

[0063] Reference again Figure 3 and Figure 4, a plurality of buffer chambers 3800 are provided. Some of the buffer chambers 3800 are provided between the indexing module 20 and the transfer chamber 3400. Hereinafter, these buffer chambers are referred to as front buffers 3802. The front buffers 3802 are stacked one on top of another in the up-down direction. Other buffer chambers 3800 are provided between the transfer chamber 3400 and the interface module 40. These buffer chambers are referred to as rear buffers 3804. The rear buffers 3804 are stacked one on top of another in the up-down direction. The front buffer 3802 and the rear buffer 3804 temporarily store a plurality of substrates W. The substrates W stored in the front buffer 3802 are loaded or unloaded by the indexing robot 2200 and the transfer unit 3420. The substrates W stored in the rear buffer 3804 are loaded or unloaded by the transfer unit 3420 and the first robot 4602.

[0064] Figure 8 It is shown Figure 4 A schematic perspective view of a buffer chamber. Figure 8 , the buffer chamber 3800 may include a housing 3810 , a buffer plate 3820 , and a cooling unit 4000 .

[0065] The housing 3810 has an internal space inside. The internal space of the housing 3810 is used as a space for temporarily storing the substrate W. The housing 3810 has a substantially rectangular parallelepiped shape. The housing 3810 is open at its opposite sides. For example, the opposite open sides of the housing 3810 are positioned relative to each other, and one of the opposite open sides of the housing 3810 is arranged to face the index module 20. The opposite open sides of the housing 3810 are used as an entrance / exit through which the substrate W enters or leaves the housing 3810.

[0066] The housing 3810 has a support portion 3812 therein. The support portion 3812 can be implemented with a rectangular plate. A plurality of support portions 3812 can be provided. The support portions 3812 are positioned to be spaced apart from each other in the up-down direction. Therefore, the internal space of the housing 3812 is divided into a plurality of internal spaces in the up-down direction. For example, three support portions 3812 can be provided. Alternatively, two or fewer support portions 3812 or four or more support portions 3812 can be provided.

[0067] Fig. 9 It is shown Figure 8 A perspective view of the cooling unit, buffer plate and support shaft. Fig. 9, the buffer plate 3820 and the cooling unit 4000 are located in each of the multiple internal spaces separated from each other of the housing 3810. The buffer plate 3820 and the cooling unit 4000 may be positioned to be spaced apart from each other in the up-down direction. The buffer plate 3820 and the cooling unit 4000 are arranged in sequence in the up-down direction. According to one embodiment, a plurality of cooling units 4000 may be provided, and the buffer plate 3820 and the plurality of cooling units 4000 may be arranged in sequence. Alternatively, a plurality of buffer plates 3820 may be provided. The buffer plate 3820 and the cooling unit 4000 may have a circular plate shape.

[0068] A plurality of cooling units 4000 may be disposed between the support portion 3812 and the buffer plate 3820 . The plurality of cooling units 4000 are positioned to be spaced apart from each other in the up-and-down direction. The plurality of cooling units 4000 are stacked adjacent to each other. A substrate W may be placed on the cooling units 4000 .

[0069] The support shaft 3850 supports the buffer plate 3820 and the cooling unit 4000. The support shaft 3850 may include a plurality of support blocks 3850a, 3850b, 3850c, 3850d, and 3850e. The support blocks 3850a, 3850b, 3850c, 3850d, and 3850e are arranged to be stacked on each other. The support blocks 3850a, 3850b, 3850c, 3850d, and 3850e are implemented by blocks having a rectangular parallelepiped shape. The support blocks 3850a, 3850b, 3850c, 3850d, and 3850e support the cooling unit 4000, respectively.

[0070] Fig.10 is a plan view showing a cooling unit according to an embodiment of the present inventive concept, Fig.11 It is shown Fig.10 4000 is a cross-sectional view of a cooling unit. The cooling unit 4000 can adjust the temperature of the substrate W supported on the cooling unit 4000. The cooling unit 4000 can reduce the temperature of the substrate W supported on the cooling unit 4000. For example, the cooling unit 4000 can provide coldness to the substrate W supported on the cooling unit 4000. Alternatively, the cooling unit 4000 can provide warm heat to the substrate W supported on the cooling unit 4000. The cooling unit 4000 includes a temperature regulating plate 4100, a fluid supply member 4200, an exhaust line 4300, and a decompression member 4400.

[0071] When viewed from above, the temperature regulating plate 4100 may have a generally circular shape. The support plate 4100 may have a notch formed in an edge portion thereof. A plurality of notches may be formed. The temperature regulating plate 4100 may be formed of a material comprising a metal. For example, the temperature regulating plate 4100 may be formed of a material comprising aluminum or copper. Alternatively, the temperature regulating plate 4100 may be formed of a material comprising a carbon-based composite material. For example, the temperature regulating plate 4100 may be formed of a material comprising a carbon-based composite material (including graphite) and copper.

[0072] The temperature regulating plate 4100 may include a first plate 4101 and a second plate 4102. The second plate 4102 may be arranged below the first plate 4101. For example, the lower surface of the first plate 4101 and the upper surface of the second plate 4102 may contact each other. The first plate 4101 and the second plate 4102 may be formed of the same material. For example, the first plate 4101 and the second plate 4102 may be formed of a material containing a metal. Alternatively, the first plate 4101 and the second plate 4102 may be formed of a material containing a carbon-based composite material.

[0073] The temperature adjustment plate 4100 may have fluid channels 4110 and 4120 formed therein. The fluid channels 4110 and 4120 may include a first fluid channel 4110 and a second fluid channel 4120.

[0074] The temperature regulating fluid may be supplied into the first fluid channel 4110. The first fluid channel 4110 may include a plurality of fluid channels. For example, the first fluid channel 4110 may include a fluid channel 1-1 4111, a fluid channel 1-2 4112, a fluid channel 1-3 4113, and a fluid channel 1-4 4114. The first fluid channel 4110 may be formed in the middle region and the edge region of the temperature regulating plate 4100. For example, when viewed from above, the fluid channel 1-1 4111, the fluid channel 1-2 4112, the fluid channel 1-3 4113, and the fluid channel 1-4 4114 may be formed in the middle region and the edge region of the temperature regulating plate 4100. Portions of the fluid channel 1-1 4111, the fluid channel 1-2 4112, the fluid channel 1-3 4113, and the fluid channel 1-4 4114 may have a curved shape. One end of each of the plurality of first fluid channels 4110 may be connected to the fluid supply member 4200. The temperature regulating fluid supplied by the fluid supply member 4200 may be supplied into the plurality of first fluid channels 4110. The plurality of first fluid channels 4110 may be formed inside the first plate 4101.

[0075] The second fluid channel 4120 may discharge the temperature regulating fluid supplied to the plurality of first fluid channels 4110 to the outside. The second fluid channel 4120 may be connected to the opposite ends of the plurality of first fluid channels 4110. Only one second fluid channel 4120 may be provided. The opposite end of the second fluid channel 4120 may be connected to the discharge line 4300. When viewed in a vertical section of the temperature regulating plate 4100, the plurality of first fluid channels 4110 may be formed in an area above the second fluid channel 4120. The second fluid channel 4120 may be formed inside the second plate 4102.

[0076] The temperature regulating plate 4100 may have a buffer space 4150 formed therein.

[0077] The buffer space 4150 may be formed inside the temperature regulating plate 4100. The buffer space 4150 may connect the plurality of first fluid channels 4110 and the second fluid channel 4120. The opposite ends of the plurality of first fluid channels 4110 may be connected to the buffer space 4150. In addition, one end of the second fluid channel 4120 may be connected to the buffer space 4150. When the temperature regulating plate 4100 is viewed from above, the buffer space 4150 may be formed in the central region of the temperature regulating plate 4100. When viewed in a vertical section of the temperature regulating plate 4100, the buffer space 4150 may be formed in a region between the first fluid channel 4110 and the second fluid channel 4120. The diameter of the buffer space 4150 may be greater than the diameter of the first fluid channel 4110. The diameter of the buffer space 4150 may be greater than the diameter of the second fluid channel 4120. In addition, the buffer space 4150 may be formed inside the first plate 4101 of the temperature regulating plate 4100.

[0078] A vacuum line 4160 may be formed inside the temperature regulating plate 4100. The decompression member 4400 may apply negative pressure to the vacuum line 4160. The vacuum line 4160 may apply negative pressure to the lower surface of the substrate W located on the temperature regulating plate 4100. The vacuum line 4160 may be formed inside the temperature regulating plate 4100. When viewed from above, the vacuum line 4160 may be formed between the first fluid channels 4110. For example, when viewed from above, the vacuum line 4160 may be formed between the first fluid channels 4110 adjacent to each other. The vacuum line 4160 may be divided. For example, the vacuum line 4160 may be divided into a plurality of branch lines. Each branch line may be provided between the first fluid channels 4110 adjacent to each other.

[0079] One end of the vacuum line 4160 may be connected to the decompression member 4400. The opposite end of the vacuum line 4160 may be connected to the suction hole 4162. The suction hole 4162 may be formed in the upper surface of the temperature regulating plate 1400. The vacuum line 4160 may be formed inside the temperature regulating plate 4100 and may extend to the upper surface of the temperature regulating plate 4100. Therefore, the vacuum line 4160 may be connected to the suction hole 4162.

[0080] The decompression member 4400 may apply negative pressure to the vacuum line 4160. The decompression member 4400 may be a pump. However, the decompression member 4400 is not limited thereto, and may be implemented with various known devices capable of applying negative pressure to the vacuum line 4160.

[0081] The fluid supply member 4200 can adjust the temperature of the temperature regulating plate 4100. The fluid supply member 4200 may include a fluid supply source 4210, a fluid supply line 4212, and a valve 4220. The fluid supply source 4210 may store a fluid. The fluid stored in the fluid supply source 4210 may be a temperature regulating fluid. The temperature regulating fluid may be a cooling fluid. For example, the temperature regulating fluid may be cooling water. However, it is not limited thereto, and the temperature regulating fluid may be replaced by various fluids capable of regulating the temperature of the temperature regulating plate 4100.

[0082] The fluid supply source 4210 may be connected to the fluid supply line 4212. The fluid supply line 4212 may be connected to the first fluid channel 4110. The fluid supply line 4212 may receive a temperature regulating fluid from the fluid supply source 4210. Therefore, the fluid supply line 4212 may supply the temperature regulating fluid to the first fluid channel 4110. The fluid supply lines 4212 may be separated from each other. The fluid supply lines 4212 separated from each other may be connected to the first fluid channel 4110, respectively. In addition, the fluid supply lines 4212 may be respectively equipped with valves 4220. The valve 4220 may be an on / off valve. Alternatively, the valve 4220 may be a flow control valve. The valve 4220 may include a first valve 4221, a second valve 4222, a third valve 4223, and a fourth valve 4224. The fluid supply line 4212 equipped with the first valve 4221 may be connected to the fluid channel 1-1 4111. The supply line 4212 equipped with the second valve 4222 may be connected to the fluid channel 1-2 4112. The fluid supply line 4212 equipped with the third valve 4223 may be connected to the fluid channel 1-3 4113. The fluid supply line 4212 equipped with the fourth valve 4224 may be connected to the fluid channel 1-4 4114. That is, whether to supply the temperature regulating fluid flowing in the first fluid channel 4110 may vary according to the opening / closing of the valve 4220. In addition, the supply flow rate per unit time of the temperature regulating fluid flowing in each of the first fluid channels 4110 may vary according to the valve opening of the corresponding valve 4220.

[0083] A general cooling plate has a fluid channel formed therein, in which a cooling fluid flows. The cooling fluid flowing in the fluid channel can adjust the temperature of the cooling plate. The cooling plate adjusts the temperature of the substrate by exchanging heat with the substrate placed on the cooling plate. However, in the process in which the cooling plate and the substrate exchange heat with each other, the temperature of the cooling plate cannot be uniformly maintained. For example, the temperature of the cooling fluid flowing in the fluid channel adjacent to the refrigerant supply source is different from the temperature of the cooling fluid flowing in the fluid channel away from the refrigerant supply source. The temperature of the cooling fluid flowing in the fluid channel adjacent to the refrigerant supply source may be lower than the temperature of the cooling fluid flowing in the fluid channel away from the refrigerant supply source. Therefore, the temperature of the cooling plate cannot be uniformly maintained. Therefore, the substrate may not be cooled uniformly.

[0084] However, according to an embodiment of the present invention, the temperature regulating plate 4100 has a plurality of first fluid channels 4110 formed therein. In addition, the temperature regulating fluid flowing in the plurality of first fluid channels 4110 is discharged to the outside through a single second fluid channel 4120. In other words, the first fluid channel 4110 formed inside the temperature regulating plate 4100 has a short length. Therefore, the deviation of the temperature of the temperature regulating fluid flowing in the first fluid channel 4110 is small. Therefore, the temperature of the temperature regulating plate 4100 can be uniformly maintained. In the case where the temperature regulating fluid flowing in the plurality of first fluid channels 4110 is discharged to the outside through a single second fluid channel 4120, the flow of the temperature regulating fluid may stagnate. However, according to an embodiment of the present invention, the first fluid channel 4110 and the second fluid channel 4120 are connected by a buffer space 4150. The buffer space 4150 has a larger diameter than the first fluid channel 4110 and the second fluid channel 4120. Therefore, as Fig.12 As shown, in a process in which the temperature regulating fluid flowing in the first fluid channel 4110 is discharged to the outside through the second fluid channel 4120, stagnation of the temperature regulating fluid may be minimized.

[0085] Reference again Figures 2 to 4 , the developing block 30b has a heat treatment chamber 3200, a conveying chamber 3400 and a liquid treatment chamber 3600. The heat treatment chamber 3200, the conveying chamber 3400 and the liquid treatment chamber 3600 of the developing block 30b are arranged in a structure substantially similar to the structure of the heat treatment chamber 3200, the conveying chamber 3400 and the liquid treatment chamber 3600 of the coating block 30a. Therefore, description thereof will be omitted. However, the liquid treatment chamber 3600 in the developing block 30b is arranged as a developing chamber 3600, and they all distribute developer in the same way to perform development processing on the substrate W.

[0086] The interface module 40 connects the process module 30 with the external exposure device 50. The interface module 40 has an interface frame 4100, an additional process chamber 4200, an interface buffer 4400, and a transfer member 4600.

[0087] The interface frame 4100 may have a fan filter unit at its top, which forms a downward airflow in the interface frame 4100. The additional processing chamber 4200, the interface buffer 4400 and the conveying member 4600 are arranged in the interface frame 4100. Before the substrate W processed in the coating block 30a is transferred to the exposure device 50, the additional processing chamber 4200 can perform a predetermined additional processing on the substrate W. Selectively, before the substrate W processed in the exposure device 50 is transferred to the developing block 30b, the additional processing chamber 4200 can perform a predetermined additional processing on the substrate W. According to one embodiment, the additional processing can be an edge exposure processing that exposes the edge area of ​​the substrate W to light, a top side cleaning processing that cleans the top side of the substrate W, or a back side cleaning processing that cleans the back side of the substrate W. A plurality of additional processing chambers 4200 may be provided. The additional processing chambers 4200 may be stacked up and down one another. The additional processing chambers 4200 may all perform the same processing. Selectively, some of the additional processing chambers 4200 may perform different processing.

[0088] The interface buffer 4400 provides a space for temporarily staying the substrate W transferred between the coating block 30a, the additional processing chamber 4200, the exposure device 50, and the developing block 30b. A plurality of interface buffers 4400 may be provided. The interface buffers 4400 may be stacked one above the other.

[0089] According to one embodiment, the additional process chamber 4200 may be disposed on one side of an extension line oriented in a length direction of the transfer chamber 3400 , and the interface buffer 4400 may be disposed on an opposite side of the extension line.

[0090] The conveying member 4600 conveys the substrate W between the coating block 30a, the additional processing chamber 4200, the exposure device 50, and the developing block 30b. The conveying member 4600 can be implemented with one or more robots. According to one embodiment, the conveying member 4600 has a first robot 4602 and a second robot 4606. The first robot 4602 can convey the substrate W between the coating block 30a, the additional processing chamber 4200, and the interface buffer 4400. The interface robot 4606 can convey the substrate W between the interface buffer 4400 and the exposure device 50. The second robot 4606 can convey the substrate W between the interface buffer 4400 and the developing block 30b.

[0091] Each of the first robot 4602 and the second robot 4606 includes a hand portion for placing a substrate W thereon, which can move forward and backward, can rotate around an axis parallel to the Z-axis direction 16, and can move along the Z-axis direction 16.

[0092] Although the temperature regulating plate 4100 has been exemplified as including the first plate 4101 and the second plate 4102, the temperature regulating plate 4100 is not limited thereto. Fig.13 As shown, the temperature adjustment plate 4100 may have a configuration in which a first plate 4101 and a second plate 4102 are integrated with each other.

[0093] As described above, according to embodiments of the inventive concept, a cooling unit and a substrate treating apparatus including the cooling unit may effectively treat a substrate.

[0094] Furthermore, according to an embodiment of the inventive concept, a cooling unit and a substrate treating apparatus including the cooling unit may effectively cool a substrate.

[0095] Furthermore, according to an embodiment of the inventive concept, a cooling unit and a substrate treating apparatus including the cooling unit may uniformly cool a substrate.

[0096] In addition, according to an embodiment of the inventive concept, a cooling unit and a substrate treating apparatus including the cooling unit may minimize stagnation of the temperature-adjusting fluid in a fluid channel when the temperature-adjusting fluid is discharged from the temperature-adjusting plate.

[0097] The effects of the present inventive concept are not limited to the above-mentioned effects, and any other effects not mentioned herein can be clearly understood by those skilled in the art to which the present inventive concept belongs from this specification and the accompanying drawings.

[0098] The above description illustrates the inventive concept. In addition, the above content describes exemplary embodiments of the inventive concept, and the inventive concept can be used in various other combinations, changes and environments. That is, the inventive concept can be modified or modified without departing from the scope of the inventive concept disclosed in the specification, the scope equivalent to the written disclosure and / or the technology or knowledge scope of those skilled in the art. The written implementation describes the best state of the technical spirit for realizing the inventive concept, and various changes required for the specific application and purpose of the inventive concept can be made. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed implementation state. In addition, it should be interpreted that the attached claims include other implementations.

[0099] Although the present invention has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, it should be understood that the above embodiments are not restrictive but illustrative.

Claims

1. A substrate processing device, comprising: an indexing module, the indexing module comprising a loading port on which a carrier containing a substrate is placed; and a processing module configured to process the substrate transferred from the indexing module, The processing module comprises: a processing chamber configured to process the substrate; and a buffer chamber configured to temporarily store the substrate; The buffer chamber comprises: a housing having a space therein; and a cooling unit configured to cool the substrate in the space, The cooling unit comprises: a temperature regulating plate having a fluid channel formed therein; and a fluid supply member configured to supply a temperature regulating fluid into the fluid channel, The fluid channel comprises: a plurality of first fluid channels, each of the plurality of first fluid channels being connected at one end thereof to the fluid supply member; and a second fluid channel connected to opposite ends of the plurality of first fluid channels and configured to discharge the temperature regulating fluid, A buffer space is formed inside the temperature regulating plate, and the buffer space is configured to connect the opposite ends of the plurality of first fluid channels with one end of the second fluid channel, and Wherein, when viewed in a vertical cross-section of the temperature regulating plate, the plurality of first fluid channels are formed in a region above the second fluid channel.

2. The device according to claim 1, wherein: A diameter of the buffer space is greater than a diameter of the plurality of first fluid channels.

3. The device according to claim 1, wherein: A diameter of the buffer space is greater than a diameter of the second fluid channel.

4. The device according to claim 1, wherein: The opposite ends of the plurality of first fluid channels are connected to the buffer space, and Wherein, the one end of the second fluid channel is connected to the buffer space.

5. The device according to any one of claims 1 to 4, wherein: The buffer space is formed in a central area of ​​the temperature regulating plate when viewed from above.

6. The device according to claim 1, wherein: The buffer space is formed in a region between the plurality of first fluid channels and the second fluid channel when viewed in the vertical cross section of the temperature regulating plate.

7. The device according to any one of claims 1 to 4, wherein: The temperature regulating plate comprises: First Board; and a second plate, the second plate being disposed below the first plate, wherein the plurality of first fluid channels are formed inside the first plate, and The second fluid channel is formed inside the second plate.

8. The device according to claim 7, wherein: The buffer space is formed inside the first plate.

9. The device according to any one of claims 1 to 4, wherein: The temperature regulating plate is formed of a material including aluminum, copper, or a carbon-based composite material.

10. A cooling unit for cooling a substrate, the cooling unit comprising: a plate having a fluid channel formed therein; and a fluid supply member configured to supply a fluid into the fluid channel, The fluid channel comprises: a plurality of first fluid channels, each of the plurality of first fluid channels being connected at one end thereof to the fluid supply member; and a second fluid channel connected to opposite ends of the plurality of first fluid channels and configured to discharge the fluid, wherein a buffer space is formed inside the plate, the buffer space being configured to connect the opposite ends of the plurality of first fluid channels with one end of the second fluid channel, and Wherein, when viewed in a vertical cross-section of the plate, the plurality of first fluid channels are formed in a region above the second fluid channel.

11. The cooling unit according to claim 10, wherein: A diameter of the buffer space is greater than diameters of the plurality of first fluid channels and the second fluid channel.

12. The cooling unit according to claim 10, wherein: The opposite ends of the plurality of first fluid channels are connected to the buffer space, and Wherein, the one end of the second fluid channel is connected to the buffer space.

13. The cooling unit according to any one of claims 10 to 12, wherein: The buffer space is formed in a central region of the plate when viewed from above.

14. The cooling unit according to claim 10, wherein: The buffer space is formed in a region between the plurality of first fluid channels and the second fluid channel when viewed in the vertical cross-section of the plate.

15. The cooling unit according to any one of claims 10 to 12, wherein: The board includes: First Board; and a second plate, the second plate being disposed below the first plate, wherein the plurality of first fluid channels are formed inside the first plate, and The second fluid channel is formed inside the second plate.

16. The cooling unit according to claim 15, wherein: The buffer space is formed inside the first plate.

17. The cooling unit according to any one of claims 10 to 12, wherein: The plate is a temperature regulating plate configured to regulate the temperature of the substrate supported on the temperature regulating plate, and Wherein, the fluid is a temperature regulating fluid configured to change the temperature of the temperature regulating plate.

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