Backplane film including ultraviolet (UV) curing adhesive layer and method for manufacturing organic light emitting display device using the same

Abstract

The present invention relates to a backplane film, comprising a substrate film layer and a semi-cured adhesive layer, wherein the bonding force (A) between the substrate film layer and the semi-cured adhesive layer is greater than or less than the bonding force (B) between the adhesive layers of the organic light emitting diode (OLED) panel substrate, and the smaller bonding force between the bonding force (A) and the bonding force (B) is less than 50 gf / in.

Description

Technical Field

[0001] The invention relates to a novel organic light emitting display device manufacturing method and a backplane film applicable thereto. Background Art

[0002] With the development of information technology, the market for display devices, which are the connection medium between users and information, is growing. As a result, the use of display devices such as liquid crystal display (LCD), organic light emitting diode display (OLED), electrophoretic display (EPD) and plasma display panel (PDP) is increasing.

[0003] Moreover, recently, with the development of multimedia, the importance of flexible electronic devices has increased. Therefore, it is necessary to manufacture organic light emitting diodes (OLED), liquid crystal display devices (LCD), electrophoretic display devices (EPD), plasma display panels (PDP), thin-film transistors (TFT), microprocessors (microprocessors), random access memories (RAM), solar cells, etc. on flexible substrates, and it is also necessary to attach a backplane film to the flexible substrate to protect and strengthen the panel. Moreover, the backplane film has the function of preventing the flexible organic light emitting diode panel from curling and protecting the panel, and requires strong adhesion to the flexible organic light emitting diode panel.

[0004] In the previous manufacturing process of flexible organic light-emitting diodes, after the backplane film is attached to the organic light-emitting diode panel substrate, a band gap is formed by utilizing a laser engraving process, etching the backplane film with a laser, or utilizing a process of using an already patterned backplane film. In this case, there are limitations such as unit damage and high manufacturing process costs.

[0005] Therefore, in order to solve the conventional problems, the present inventors provide a backplane film including an ultraviolet (UV) curable adhesive layer and a method for manufacturing an organic light emitting display device using the backplane film. Summary of the invention

[0006] The present invention provides a method for manufacturing an organic light emitting display device which reduces manufacturing costs and simplifies conventional processes.

[0007] Furthermore, the present invention provides a back sheet film including an ultraviolet (UV) curable adhesive layer having excellent durability and reliability.

[0008] An example of the present invention provides a backplate film, including a substrate film layer and a semi-cured adhesive layer, wherein the bonding force A between the substrate film layer and the semi-cured adhesive layer is greater than or less than the bonding force B between the adhesive layers of the organic light emitting diode panel substrate, and the smaller bonding force between the bonding force A and the bonding force B is less than 50 gf / in.

[0009] In one embodiment of the present invention, the semi-cured adhesive layer is attached to the organic light emitting diode panel substrate so that the adhesive force after ultraviolet (UV) curing reaches more than 1000 gf / in.

[0010] In one embodiment of the present invention, the substrate film layer is selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polyacrylonitrile, polyamide, polyamideimide, polyimide, and polyolefin.

[0011] In an example of the present invention, the organic light emitting diode panel substrate is selected from the group consisting of glass, polyimide, polyetheretherketon, polyethersulfone, polyetherimide and polycarbonate.

[0012] In one embodiment of the present invention, the adhesive layer is prepared from an adhesive composition comprising a rubber resin, an ultraviolet curable oligomer and a photoinitiator.

[0013] In one example of the present invention, a release film layer is further included on the upper portion of the adhesive layer.

[0014] Another example of the present invention provides a method for manufacturing an organic light-emitting display device, comprising: step (a), wherein the semi-cured adhesive layer in the backplane film is attached to an organic light-emitting diode panel substrate including a plurality of units; step (b), laser cutting a portion of the backplane film corresponding to a boundary of a band area of ​​the organic light-emitting diode panel substrate; step (c), removing a portion or all of the backplane film corresponding to the band area of ​​the organic light-emitting diode panel substrate; step (d), ultraviolet treatment of the organic light-emitting diode panel substrate of the backplane film remaining after removing a portion or all of the backplane film corresponding to the band area to enhance the bonding force; and step (e), irradiating the boundaries of the plurality of units with a laser and separating the plurality of units in units.

[0015] In one example of the present invention, the step (b) includes the step of laser cutting the backsheet film in such a manner that the depth reaches a depth greater than the thickness of the substrate film layer and less than the thickness of the backsheet film.

[0016] In one example of the present invention, when the bonding force A between the base film layer and the semi-cured adhesive layer is greater than the bonding force B between the adhesive layers to the organic light-emitting diode panel substrate, in the step (c), the entire backplane film corresponding to the band area of ​​the organic light-emitting diode panel substrate is removed.

[0017] In one example of the present invention, when the bonding force A between the base film layer and the semi-cured adhesive layer is smaller than the bonding force B between the adhesive layers to the organic light-emitting diode panel substrate, in the step (c), the base film layer of the backplane film corresponding to the band area of ​​the organic light-emitting diode panel substrate is removed.

[0018] In one example of the present invention, in the step (d), the back sheet film remaining after removing a part or all of the back sheet film corresponding to the band area is subjected to ultraviolet treatment, whereby the bonding force of the adhesive layer reaches more than 1000 gf / in.

[0019] Specific matters of other embodiments are included in the detailed description and drawings.

[0020] Effects of the Invention

[0021] The method for manufacturing an organic light emitting display device of the present invention provides a method for preventing damage to the unit by not using laser engraving, eliminating unnecessary processes and not using additional films, thereby reducing manufacturing costs.

[0022] The organic light emitting display device manufactured according to the method of the present invention has excellent durability, reliability and lifespan characteristics. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1a and Figure 1b FIG. 1 is a schematic cross-sectional view of a back sheet film for illustrating an embodiment of the present invention.

[0024] Figure 2a and Figure 2b The figure is a cross-sectional view of a process for describing a method for manufacturing an organic light emitting display device according to an embodiment of the present invention.

[0025] Figure 3a to Figure 3c FIG. 4 is a simplified flowchart for illustrating a method for manufacturing an organic light emitting display device according to an embodiment of the present invention.

[0026] Description of Reference Numerals

[0027] 10: Back sheet film

[0028] 11: Adhesive layer

[0029] 12: Base material film layer

[0030] 13: Release film layer

[0031] 100: Organic light-emitting diode panel substrate

[0032] D: Back sheet film thickness

[0033] d1: Thickness of the substrate film

[0034] BA: Band Area DETAILED DESCRIPTION

[0035] Hereinafter, examples of the present invention will be described in detail, but this is for illustration only and the present invention is not limited thereto, but is defined by the scope of the claims.

[0036] In the drawings, the thickness is exaggerated to clearly express each layer and region. In addition, in the drawings, the thickness of some layers and regions is exaggerated for the convenience of explanation.

[0037] Hereinafter, forming a structure on the "upper part (or lower part)" of a substrate or "above (or below)" a substrate not only means that a structure is formed in contact with the upper side (or lower side) of the substrate, but also means that other structures are included between the description and a structure formed on (or below) the substrate.

[0038] An example of the present invention relates to a backplane film including a UV-curable adhesive layer and a method for manufacturing an organic light-emitting display device using the same. More specifically, a method for manufacturing an organic light-emitting display device that forms a band gap regardless of damage to an organic light-emitting diode panel substrate and a backplane film suitable for use therewith are provided.

[0039] In one example of the present invention, a backplane film is provided, comprising a substrate film layer and a semi-cured adhesive layer, wherein the bonding force A between the substrate film layer and the semi-cured adhesive layer is greater than or less than the bonding force B between the adhesive layers of the organic light emitting diode panel substrate, and the smaller bonding force between the bonding force A and the bonding force B is less than 50 gf / in.

[0040] In one example of the present invention, a release film layer may be further included on the upper portion of the semi-cured adhesive layer.

[0041] Figure 1a FIG. 1 is a schematic cross-sectional view of a back sheet film 10 including a substrate film layer 12 and a semi-cured adhesive layer 11 according to an embodiment of the present invention.

[0042] Figure 1b It is a simplified cross-sectional view of a back sheet film 10 including a substrate film layer 12 , a semi-cured adhesive layer 11 and a release film layer 13 according to an embodiment of the present invention.

[0043] The semi-cured adhesive layer 11 is located on the upper portion of the base film layer 12 and is attached to the organic light emitting diode panel substrate 100 in a facing manner.

[0044] The semi-cured adhesive layer 11 can be prepared by laminating an adhesive composition including a rubber resin, an ultraviolet curable oligomer and a photoinitiator on a substrate film layer. The thickness of the semi-cured adhesive layer 11 is about 5 μm to about 50 μm. The thickness of the semi-cured adhesive layer 11 can be maintained within the above range to ensure the desired bonding force.

[0045] The rubber-based resin may be one or more selected from the group consisting of styrene-isobutylene-styrene (SIBS)-based rubber, styrene-isobutylene (SIB)-based rubber, styrene-butadiene-styrene (SBS)-based rubber, styrene-butadiene (SB)-based rubber, styrene-isoprene-styrene (SIS)-based rubber, styrene-ethylene-butylene-styrene (SEBS)-based rubber, butyl rubber, polyisobutylene (PIB)-based rubber, propylene rubber, urethane rubber, etc. Preferably, the rubber-based resin is a rubber-based resin containing styrene.

[0046] The ultraviolet curable oligomer can be an ultraviolet curable resin with excellent bonding strength after curing. For example, it can be selected from polymers containing acrylate resins, methacrylate resins, isocyanate resins, melamine resins, urethane resins, epoxy resins, acid anhydrides, polyamine resins and carboxyl groups. The ultraviolet curable oligomer can utilize rubber resins and fine phase separation phenomena to achieve low bonding strength in the steps before irradiating ultraviolet rays. Therefore, before curing, the semi-cured adhesive layer containing the ultraviolet curable oligomer can have low bonding strength relative to the organic light emitting diode panel substrate or the base film layer, for example, it can have a bonding strength of less than 50gf / in.

[0047] Preferably, the ultraviolet curable oligomer can be an epoxy resin, containing more than two functional groups, and can be an epoxy oligomer with an epoxy equivalent of 100g / eq to 1500g / eq. The epoxy resin can have a ring structure in the molecular structure, for example, it can be an aromatic group (for example, phenyl), an aromatic epoxy compound that undergoes a hydrogenation reaction. In this case, the hydrogen atoms constituting the alicyclic ring can be substituted by substituents such as alkyl. As a specific example of an epoxy compound containing an aromatic group, bisphenol epoxy resins (bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD ​​type epoxy resin), ester-aldehyde type epoxy resin, oligomeric xylose type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, trisphenol methane type epoxy resin and glycidylamine type epoxy resin, etc., are oligomer forms, but are not limited thereto.

[0048] The type of the photoinitiator is not particularly limited. For example, known cationic initiators such as aromatic diazonium salts, aromatic iodonium aluminum salts, aromatic sulfonium salts, or iron-arene complexes can be used. Among them, aromatic sulfonium salts can be used, but are not limited thereto.

[0049] The adhesive composition comprises the rubber resin, ultraviolet curable oligomer and photoinitiator, and in addition, may further comprise one or more selected from the group consisting of adhesion promoter, thermal initiator, multifunctional acrylate, antistatic agent, silane coupling agent, antioxidant, filler and plasticizer, pigment, dispersant, defoamer and thickener. The additives may be appropriately adjusted within the range that does not inhibit the physical properties of the adhesive composition.

[0050] In an example of the present invention, the bonding force A between the base film layer 12 and the semi-cured adhesive layer 11 is greater than or less than the bonding force B between the adhesive layer 11 of the organic light emitting diode panel substrate 100 .

[0051] In one example of the present invention, the bonding force A between the base film layer 12 and the semi-cured adhesive layer 11 and the bonding force B between the adhesive layer 11 and the organic light-emitting diode panel substrate 100 are set to be different, and all or part of the backplane film 10 corresponding to the band area can be removed without laser engraving.

[0052] The semi-cured adhesive layer 11 may have a low adhesive force relative to the organic light emitting diode panel substrate 100 or the base film layer 12, for example, an adhesive force of 50 gf / in or less, preferably, an adhesive force of 30 gf / in or less, and more preferably, an adhesive force of 20 gf / in or less. Therefore, after laser cutting, when a scraping process is performed, the semi-cured adhesive layer 11 may remain on the organic light emitting diode panel substrate 100 corresponding to the band area or be completely removed together with the base film layer 12.

[0053] After the semi-cured adhesive layer 11 is attached to the OLED panel substrate 100 and cured by ultraviolet light, it can have an adhesive force of more than 1000 gf / in, preferably, more than 1300 gf / in, and more preferably, more than 1500 gf / in.

[0054] The substrate film layer 12 may be selected from one or more materials selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polyacrylonitrile, polyamide, polyamideimide, polyimide, and polyolefin, but is not limited thereto, and various known film layers may be used.

[0055] The OLED panel substrate 100 may be selected from the group consisting of glass, polyimide, polyetheretherketon, polyethersulfone, polyetherimide and polycarbonate, but is not limited thereto, and various known film layers may be used.

[0056] Another example of the present invention provides a method for manufacturing an organic light-emitting display device, comprising: step (a), attaching the semi-cured adhesive layer in the backplane film 10 to an organic light-emitting diode panel substrate 100 including a plurality of units; step (b), laser cutting a portion of the backplane film 10 corresponding to a boundary of a band area BA of the organic light-emitting diode panel substrate 100; step (c), removing a portion or all of the backplane film 10 corresponding to the band area BA of the organic light-emitting diode panel substrate 100; step (d), ultraviolet treatment of the organic light-emitting diode panel substrate 100 of the backplane film 10 remaining after removing a portion or all of the backplane film 10 to enhance the adhesive force; and step (e), irradiating the boundaries of the plurality of units with a laser and separating the plurality of units in units.

[0057] Figure 2a and Figure 2b FIG. 1 is a process diagram for describing a method for manufacturing an organic light emitting display device according to an embodiment of the present invention.

[0058] In one embodiment of the present invention, the semi-cured adhesive layer 11 of the backplane film 10 is attached to the organic light-emitting diode panel substrate 100 in a manner facing the organic light-emitting diode panel substrate 100, and the portion of the backplane film 10 corresponding to the boundary of the band area BA of the organic light-emitting diode panel substrate 100 is laser cut ( Figure 2a and Figure 2b step (a)).

[0059] In this case, the backplane film 10 is laser cut in such a manner that the depth reaches a depth greater than the thickness d1 of the substrate film layer 12 and less than the thickness D of the backplane film 10 (step (b)). That is, the laser cutting is performed in such a manner that the depth reaches a part or all of the thickness D-d1 of the semi-cured adhesive layer 11, and when the scraping process is performed, it can be easily dropped together with the substrate film. In addition, the depth of the laser cutting of the present invention is less than the thickness D of the backplane film 10, so that, unlike the laser engraving process, the organic light-emitting diode panel substrate 100 is not damaged. In the case where the bonding force A between the substrate film layer 12 and the semi-cured adhesive layer 11 is greater than the bonding force B between the semi-cured adhesive layer 11 and the organic light-emitting diode panel substrate 100, in the step (c), the entire backplane film 10 corresponding to the band area BA of the organic light-emitting diode panel substrate 100 can be removed.

[0060] As an example, in the scraping process, the semi-cured adhesive layer 11 and the base film layer 12 ( Figure 2a step (c1)).

[0061] As another example, when the bonding force A between the base film layer 12 and the semi-cured adhesive layer 11 is less than the bonding force B between the semi-cured adhesive layer 11 and the organic light emitting diode panel substrate 100, the base film layer 12 of the backplane film 10 corresponding to the band area BA of the organic light emitting diode panel substrate 100 is removed, and the semi-cured adhesive layer 11 remains on the upper part of the organic light emitting diode panel substrate 100 ( Figure 2b step (c2)).

[0062] The remaining backplane film 10 after removing part or all of the backplane film 10 corresponding to the band area BA of the organic light emitting diode panel substrate 100 is subjected to ultraviolet treatment, and laser is irradiated to the boundary of the unit, and a plurality of units are separated in units ( Figure 2a and Figure 2b (d) and (e)).

[0063] The following examples and comparative examples of the present invention are described below. The following examples are only examples of the present invention, and the present invention is not limited to the following examples.

[0064] Example

[0065] Example 1: Preparation of backsheet film

[0066] An adhesive composition was prepared by mixing 61 parts by weight of a styrene-isoprene-styrene (SIS) resin, 39 parts by weight of an alicyclic epoxy compound, adding 0.5 parts by weight of triarylsulfonamide hexafluoroantimonate as a cationic photoinitiator, and diluting with toluene so that the solid content becomes 30 weight percent. The styrene-isoprene-styrene (SIS) resin is composed of a styrene-isoprene-styrene interpolymer and contains 19 weight percent of styrene.

[0067] The adhesive composition prepared in the above content is applied on polyethylene terephthalate (PET) as a substrate film, dried in an oven at a temperature of 120°C for 3 minutes, and after coating in a manner such that the thickness of the adhesive layer becomes 25 μm, a backplane film is prepared by laminating a release film to protect the coated adhesive surface.

[0068] Example 2: Preparation of backsheet film

[0069] A binder composition is prepared by mixing 84 parts by weight of a styrene-isobutylene-styrene (SIBS) resin, 16 parts by weight of an alicyclic epoxy compound, adding 0.5 parts by weight of triarylsulfonamide hexafluoroantimonate as a cationic photoinitiator, and diluting with toluene so that the solid content becomes 30 weight percent. The styrene-isobutylene-styrene (SIBS) resin is composed of a styrene-isobutylene-styrene interpolymer and contains 13 weight percent of styrene.

[0070] The adhesive composition prepared in the above content is applied on polyethylene terephthalate (PET) as a substrate film, dried in an oven at a temperature of 120°C for 3 minutes, and after coating in a manner such that the thickness of the adhesive layer becomes 25 μm, a backplane film is prepared by laminating a release film to protect the coated adhesive surface.

[0071] Example 3: Preparation of backsheet film

[0072] An adhesive composition is prepared by mixing 73 parts by weight of styrene-isobutylene-styrene (SIBS) resin, 27 parts by weight of alicyclic epoxy compounds, adding 0.5 parts by weight of triarylsulfonamide hexafluoroantimonate as a cationic photoinitiator, and 15 parts by weight of a hydrocarbon resin as a tackifier, and diluting with toluene so that the solid content becomes 30 weight percent. The styrene-isobutylene-styrene (SIBS) resin is composed of a styrene-isobutylene-styrene interpolymer and contains 13 weight percent of styrene.

[0073] The adhesive composition prepared in the above content is applied on polyethylene terephthalate (PET) as a substrate film, dried in an oven at a temperature of 120°C for 3 minutes, and after coating in a manner such that the thickness of the adhesive layer becomes 25 μm, a backplane film is prepared by laminating a release film to protect the coated adhesive surface.

[0074] Comparative Example 1: Preparation of backsheet film

[0075] To 100 parts by weight of an propylene copolymer composed of 98.5 parts by weight of 2-ethylhexyl acrylate (2-EHA) and 1.5 parts by weight of hydroxyethyl methacrylate (2-HEMA), 1.2 parts by weight of a crosslinking agent (isocyanate trimethylolpropane toluene diisocyanate adduct (TDI)) was added, and the mixture was diluted with ethyl acetate so that the solid content became 30% by weight to prepare an adhesive composition.

[0076] The adhesive composition prepared in the above content is applied on polyethylene terephthalate (PET) as a substrate film, dried in an oven at a temperature of 120°C for 3 minutes, and applied in a manner such that the thickness of the adhesive layer becomes 25 μm. Then, a backplane film is prepared by laminating a release film to protect the coated adhesive surface.

[0077] Experimental example: Evaluation of the physical properties of backsheet films

[0078] (1) Testing the adhesive strength before irradiation with ultraviolet light (UV)

[0079] The backplane film prepared in the embodiment and the comparative example was cut to a width of 25 mm and a length of 200 mm to produce a test piece. After removing the release film, the test piece was attached to a polyimide substrate via the adhesive layer of the test piece using a 2 kg roller and left at room temperature for 30 minutes. The backplane film was peeled off at a peeling speed of 5 mm / sec and a peeling angle of 180 degrees using a tensile tester, and the peeling force and the separated surface were observed as described below.

[0080] (2) Testing the adhesion after ultraviolet (UV) irradiation

[0081] The backsheet film prepared in the embodiment and the comparative example was cut to a width of 25 mm and a length of 200 mm to produce a test piece. The test piece was attached to a polyimide substrate via the adhesive layer of the test piece using a 2 kg roller and left at room temperature for 30 minutes. A mercury lamp was used to provide a light intensity of 2000 mJ / cm 2 The film was irradiated with ultraviolet light and left for 2 hours. The back sheet film was peeled off at a peeling speed of 5 mm / sec and a peeling angle of 180 degrees using a tensile testing machine to detect the peeling force.

[0082] (3) Durability and reliability

[0083] The back sheet film prepared in the embodiment and the comparative example was cut to a width of 100 mm and a length of 200 mm to produce a test piece. The test piece was attached to a polyimide substrate via the adhesive layer of the test piece using a 2 kg roller, and a mercury lamp was used to light the test piece at a light intensity of 2000 mJ / cm 2 The sample prepared as described above was left at 85° C., 90% RH, and 500 hr, and the appearance was evaluated as described below.

[0084] Evaluation Benchmarks

[0085] O: No defects such as bubbles, peeling, and warping

[0086] X: Defects such as bubbles, peeling, and warping

[0087] Table 1

[0088]

[0089] * Adhesion strength between semi-cured adhesive layer and substrate film polyethylene terephthalate (PET) A

[0090] * Adhesion between semi-cured adhesive layer and polyimide substrate B

[0091] * Adhesive layer and substrate film PET surface: a

[0092] * Adhesive layer and polyimide board surface: b

[0093] In Example 1 and Example 2, before curing, when peeling off the backing film, the adhesive layer is removed from the polyimide substrate together with the substrate film of polyethylene terephthalate (PET). Before curing, the adhesive force of the semi-cured adhesive layer with respect to the polyimide substrate is less than 50 gf / in, and the adhesive force A of the adhesive layer with respect to the substrate film of polyethylene terephthalate (PET) is greater than the adhesive force B of the adhesive layer with respect to the polyimide substrate. Therefore, in Example 1 and Example 2, according to one embodiment of the present invention, Figure 2a When the scraping process disclosed in the process is performed, it is peeled off from the panel substrate together with the backplane substrate. In this case, when the scraping process is performed according to the method of the present invention, the adhesive layer in the band area is easily removed, and after irradiation with ultraviolet rays, the adhesive layer has an adhesive force of more than 1000gf / in relative to the polyimide layer.

[0094] In Example 3, before curing, when the back sheet is peeled off, the adhesive layer remains on the polyimide substrate. Before curing, the adhesive force of the semi-cured adhesive layer related to the substrate film of polyethylene terephthalate (PET) is less than 50 gf / in, and the adhesive force B of the semi-cured adhesive layer related to the polyimide substrate is greater than the adhesive force A of the semi-cured adhesive layer related to the substrate film of polyethylene terephthalate (PET). Therefore, when the back sheet is peeled off, the adhesive layer remains on the polyimide substrate. Therefore, in Example 3, according to an example of the present invention, Figure 2b After the scraping step according to the process disclosed in the invention, the adhesive layer remains on the panel substrate and has an adhesive force of 1000 gf / in or more with respect to the polyimide layer after curing.

[0095] However, in the case of Comparative Example 1, after irradiation with ultraviolet rays, the adhesive force to the polyimide layer was far less than 1000 gf / in. Therefore, the method of the present invention cannot be applied, and an organic light-emitting display device having excellent durability reliability and life characteristics cannot be provided.

[0096] The preferred embodiments of the present invention are described in detail above, but the scope of the present invention is not limited thereto. Various modifications and improvements made by ordinary technicians using the basic concepts of the present invention defined in the scope of protection of the invention also fall within the scope of the present invention.

Claims

1. A back sheet film, comprising a substrate film layer and a semi-cured adhesive layer, characterized in that: The bonding force A between the substrate film layer and the semi-cured adhesive layer is less than the bonding force B between the semi-cured adhesive layer and the organic light-emitting diode panel substrate, and the bonding force A is less than 50 gf / in; The semi-cured adhesive layer is prepared from an adhesive composition comprising a rubber resin, an ultraviolet curable oligomer and a photoinitiator, wherein the rubber resin comprises styrene and the ultraviolet curable oligomer is an epoxy resin.

2. The back sheet film according to claim 1, characterized in that: The semi-cured adhesive layer is attached to the organic light emitting diode panel substrate so that the adhesive force after ultraviolet curing reaches more than 1000 gf / in.

3. The back sheet film according to claim 1, characterized in that: The substrate film layer is formed of one or more materials selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polyacrylonitrile, polyamide, polyamideimide, polyimide, and polyolefin.

4. The back sheet film according to claim 1, characterized in that: The organic light emitting diode panel substrate is selected from the group consisting of glass, polyimide, polyetheretherketone, polyethersulfone, polyetherimide and polycarbonate.

5. The back sheet film according to claim 1, characterized in that: A release film layer is also included on the upper portion of the semi-cured adhesive layer.

6. A method for manufacturing an organic light emitting display device, characterized in that: include: Step (a), attaching the semi-cured adhesive layer in the backplane film according to any one of claims 1 to 5 to an organic light emitting diode panel substrate including a plurality of units; Step (b), laser cutting a portion of the backplane film corresponding to a boundary of a band area of ​​the organic light emitting diode panel substrate; Step (c), removing a portion of the backplane film corresponding to the band area of ​​the organic light emitting diode panel substrate; Step (d), treating the organic light emitting diode panel substrate with ultraviolet light after removing a portion of the backplane film corresponding to the band area to enhance the bonding force; as well as Step (e) irradiates the boundaries of the plurality of cells with a laser and separates the plurality of cells in units of cells.

7. The method for manufacturing an organic light emitting display device according to claim 6, wherein: The step (b) includes the step of laser cutting the back sheet film in a manner such that the depth reaches a depth greater than the thickness of the substrate film layer and less than the thickness of the back sheet film.

8. The method for manufacturing an organic light emitting display device according to claim 7, wherein: The bonding force A between the base film layer and the semi-cured adhesive layer is smaller than the bonding force B between the semi-cured adhesive layer and the organic light-emitting diode panel substrate. In the step (c), the base film layer of the back panel film corresponding to the band area of ​​the organic light-emitting diode panel substrate is removed.

9. The method for manufacturing an organic light emitting display device according to claim 6, wherein: In the step (d), the back sheet film remaining after removing a portion of the back sheet film corresponding to the tape region is subjected to ultraviolet treatment, whereby the adhesive force of the semi-cured adhesive layer reaches 1000 gf / in or more.

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