Mold for encapsulating electronic components, mold insert, method for manufacturing the insert, and method for encapsulating electronic components

Abstract

The present invention relates to a mold for encapsulating an electronic component mounted on a carrier, the mold comprising at least two relatively movable mold parts, at least one of the mold parts having a recessed cavity on a contact side, the mold parts being configured to engage with the cavity around the electronic component to be encapsulated, wherein at least a part of the cavity is formed by an insert having a flexible three-dimensional molding surface facing the electronic component. The present invention also relates to an insert for the mold and a method for encapsulating an electronic component mounted on a carrier by means of the mold.

Description

[0001] The present invention relates to a mold for encapsulating an electronic component mounted on a carrier, the mold comprising at least two mold parts movable relative to each other, at least one of the mold parts being provided with a recessed cavity on a contact side, the mold parts being configured to engage with the cavity around the electronic component to be encapsulated. The present invention also provides a method for encapsulating an electronic component mounted on a carrier using the mold, comprising the following processing steps: a) positioning a carrier carrying one or more electronic components between two mold parts such that the electronic components face the cavity; b) moving the mold parts relative to each other to clamp the carrier between the mold parts, at least one of the cavities surrounding the electronic component to be encapsulated, and the insert contacting at least one of the electronic components; c) introducing a molding material into the cavity; d) separating the mold parts from each other and removing the carrier carrying the molded electronic components from the mold parts, thereby removing the insert from the electronic components. In addition, the present invention provides an insert used in the mold and method according to the present invention, and a method for manufacturing the insert.

[0002] Techniques are known for encapsulating electronic components mounted on a carrier, often also referred to as a "substrate". On an industrial scale, the electronic component has an encapsulation, typically a cured epoxy resin or resin encapsulation with added filler material. There is a trend in the market to encapsulate large numbers of various-sized electronic components simultaneously, and the precision requirements are still increasing. This can result in products with different combinations of electronic components being encapsulated in a single package. Here, electronic components such as semiconductors, which are generally getting smaller and smaller (chips, although LEDs are also considered semiconductors in this regard), once the molding material has been set, the collectively encapsulated electronic components are placed in an encapsulation (package) that is provided on one side of the carrier, and sometimes also on both sides of the carrier. The molding or encapsulation material typically takes the form of a flat layer connected to the carrier, in which the electronic components are fully or partially embedded / encapsulated within the flat layer. The carrier can consist of a lead frame, a multi-layer carrier (also referred to as a board or substrate, etc.) partially made of epoxy resin, or another carrier structure.

[0003] In the process of encapsulating electronic components mounted on a carrier, a commonly used method is to utilize a packaging press with two half - molds in the prior art, with at least one of the two half - molds being concave to form one or more cavities. After placing the carrier with the electronic components to be encapsulated between the half - molds, the movable half - molds, such as moving towards each other, can clamp the carrier. Then, a generally heated liquid encapsulation material is usually fed into the cavities by transfer molding. As an alternative, the encapsulation material can also be introduced into the cavities before closing the mold components, and this alternative process of transfer molding is called compression molding. After at least partially (chemically) curing the encapsulation material in the cavities, the carrier with the encapsulated electronic components is removed from the packaging press, and the encapsulated products can be separated from each other during further processing. Foil can be used during the encapsulation process to shield a part of the electronic components, thus preventing the part of the electronic components covered by the foil from being covered by the molding material. Partially encapsulated products (electronic components that are not fully molded are also called "die" or "naked mold" products) can be used in various applications; for example, various types of sensor components, ultra - low - profile or heat - dissipation components. The encapsulation method is applicable to large - scale industrial production and can achieve well - controlled encapsulation of partially uncoated electronic components. The problem with the encapsulation process in the prior art that results in partially uncoated electronic components is that this process is only suitable for encapsulating a large number of electronic components with flat areas of the same height on the exposed electronic components, which limits the flexibility of the exposed electronic component area and the possibility of simultaneously partially exposing and encapsulating electronic components with different heights.

[0004] The present invention aims to provide an alternative mold and method for encapsulating electronic components, enabling partial bare encapsulation of electronic components with various sizes and / or with various shapes of uncoated parts.

[0005] The present invention provides a mold for encapsulating an electronic component mounted on a carrier, wherein at least a part of the cavity is formed by an insert having a flexible three-dimensional molding surface for facing the electronic component. The flexibility of the insert molding surface herein should be interpreted as being soft relative to the rigid structure of the mold part. The insert may also be referred to as a "liner" and is capable of forming a contact surface having any desired shape. The molding surface of the insert is generally shaped to closely adhere to the shape of the electronic component to be encapsulated. Since a contact surface having any desired shape can be formed, the mold according to the present invention gives greater freedom in shaping the molded electronic component, allowing the insert to be adapted to various combinations of electronic components of different sizes, as well as combinations of electronic components of the same size with different "coverage rate" requirements. For example, various electronic components having different heights within a single package can be molded by "chip", leaving the upper surface of the small electronic component and the surface of the high electronic component uncovered. The flexible three-dimensional molding surface of the insert is configured to contact the parts of the electronic component that need to be exposed during molding. In addition to or instead of contacting one or more electronic components, the insert can be configured to contact (a part of) the carrier such that a part of the carrier remains exposed. The exposed part of the carrier can be used as a connector and / or as a mounting surface for subsequent mounting of one or more components. Local height variations of the cured molding material can also be achieved through the topology of the molding surface of the insert. Moreover, due to the flexibility of the insert molding surface, the insert can compensate for the height tolerance of the electronic component by deformation. Thus, even if the flexible three-dimensional molding surface does not perfectly match the shape of the electronic component, excessive pressure will not be applied to the electronic component during molding.

[0006] The three-dimensional molding surface of the insert can generally be formed by a continuous surface configured to cover a plurality of electronic components. Thus, generally the plurality of electronic components are mounted on the same carrier. In order for the molding surface to cover a plurality of electronic components, the surface itself must be large enough and adapted to the layout of the plurality of electronic components. Since the same three-dimensional molding surface can cover a plurality of electronic components, a large number of electronic components can be encapsulated simultaneously. Since the topology of the three-dimensional molding surface matches the topology of the electronic components mounted on the carrier, the electronic components can have different sizes (especially different heights).

[0007] In addition, the three-dimensional molding surface of the insert may include a plurality of contact areas for contacting at least a portion of the upper surface of the electronic component, wherein the distances from at least two of the contact areas to the side of the insert opposite the three-dimensional molding surface are different. The distance from the contact area to the side of the insert opposite the three-dimensional molding surface corresponds to the height or thickness of the insert at the position of the relevant contact area. This distance or height determines the depth to which the molding surface of the insert extends into the mold cavity. The distance from the contact area to the side of the insert opposite the three-dimensional molding surface is selected such that during molding, when the carrier is clamped between the mold parts and the molding material is introduced into the mold cavity, each of the contact areas contacts at least a portion of the upper surface of the electronic component. This is achieved by selecting the distance from the contact area to the side of the insert opposite the three-dimensional molding surface based on the height of the electronic component covered by the contact area. Eventually, the upper surface portion of the electronic component covered by the contact area will be free of the molding material. Since the distances from the contact areas to the side of the insert opposite the three-dimensional molding surface are different, a plurality of electronic components of different heights can be molded simultaneously, and preferably all the electronic components mounted on one or more carriers can be molded. Typically, the plurality of contact areas are each formed by a flat surface substantially parallel to the upper surface of the electronic component covered by the corresponding contact area. This generally indicates that the directions of the plurality of contact areas are parallel to the side of the insert opposite the three-dimensional molding surface.

[0008] In addition to the contact areas, the molding surface may further include other areas configured not to contact the electronic component. By changing the distance from the other areas to the side of the insert opposite the three-dimensional molding surface, the thickness of the molding material layer at the position directly below the other areas can be correspondingly controlled and changed.

[0009] In one embodiment of the mold according to the present invention, the three-dimensional molding surface of the insert is made of a polymeric material, such as: made of vulcanized synthetic rubber or more specifically fluororubber. In a conventional variant, the insert includes FKM type rubber. The advantage of using vulcanized synthetic rubber, especially fluororubber, as the three-dimensional molding surface of the insert is that such materials have heat resistance at the processing temperature of the molding material, while also having flexibility and chemical resistance. Since a processing temperature of 100 - 200 °C is typically required during the introduction of the molding material into the mold cavity, heat resistance is needed. Fluororubber generally has better heat resistance and chemical resistance.

[0010] The insert can be detachably connected to the mold parts, so the insert can be replaced. This allows different layouts of electronic components to be encapsulated during production runs without replacing the mold parts, and worn inserts can also be replaced.

[0011] As a further solution for increasing the versatility of the mold, the mold may include a plurality of flexible inserts having a three-dimensional molding surface for facing electronic components. Thus, the three-dimensional molding surfaces of each insert may have different layouts such that electronic components with different layouts can be molded simultaneously in the same mold. However, if the groups of electronic components to be encapsulated are molded into packages having the same shape, the molding surfaces of the inserts may have similar shapes. Another advantage of using a plurality of inserts is that the inserts can be replaced independently of each other in case of, for example, wear or damage.

[0012] As another way of increasing the versatility of the mold, the mold may include at least two mold parts facing each other, and the contact sides of the mold parts have concave mold cavities, wherein the mold cavities are at least partially formed by inserts having a flexible three-dimensional molding surface. By providing mold cavities on the contact sides of two mold parts facing each other, a space can be left between the carrier and / or the electronic components on the opposite side of the carrier to fill molding material during molding. Thus, (part of) the carrier and / or the electronic components located on the opposite side of the carrier can be encapsulated simultaneously. In addition, since the two mold cavities can be at least partially formed by inserts having a flexible three-dimensional molding surface, the degree of freedom in the shape of the molded electronic components and the ability to compensate for the height tolerances of the electronic components are applicable to the electronic components mounted on the opposite sides of the carrier.

[0013] Alternatively, one of the mutually facing flexible three-dimensional molding surfaces of a pair of opposing inserts can be used as a flexible support surface for an electronic component, which electronic component may or may not be packaged on one side of a carrier, while the other mutually facing flexible three-dimensional molding surface can form at least part of a mold cavity that encloses the electronic component on the other opposite side of the carrier. Thus, the flexible three-dimensional molding surface used as the support surface preferably has a topology that follows the topology of the electronic component and the carrier to be supported. The advantage of using the flexible three-dimensional molding surface of the insert as the support surface is that the shape of the surface supported by the support surface has a degree of freedom. In addition, the flexible three-dimensional molding surface used as the support surface can compensate for the dimensional tolerances of the supported surface, especially when the supported surface includes an already encapsulated electronic component. By means of an embodiment of the mold according to the invention, electronic components on only one side of the carrier can be encapsulated, while the carrier may have electronic components mounted on its opposite side. Thus, it is possible that the electronic components on one side of the carrier are not encapsulated, but after inverting the carrier after the first molding operation, the electronic components on the opposite side of the carrier can be subsequently encapsulated.

[0014] In a preferred embodiment of the mold according to the present invention, the ASTM D2240 Type A hardness of the three-dimensional molded surface of the insert is between 70 and 100 Sh-A, preferably between 80 and 90 Sh-A. The results show that the mold surface within this hardness range achieves an appropriate balance between flexibility and dimensional stability. The insert molded surface should have sufficient flexibility to accommodate the dimensional tolerances of the electronic components. Through its flexibility, the molded surface can contact various parts of the exposed electronic components after packaging without applying high pressure to the electronic components. On the other hand, the insert molded surface should have sufficient stiffness to maintain dimensional stability during the molding process, especially when inserting the molding material into the mold cavity. Therefore, the molded surface should adhere tightly to the parts of the electronic components to be kept exposed and thus remove (the exposed) molding material. This ensures that the molding material encapsulates the electronic components only at the required positions.

[0015] The insert may include a rigid connecting part carrying the flexible three-dimensional molded surface. This rigid connecting part can thus be made of a substantially rigid material such as metal. Generally, the rigid connecting part is provided on the back side of the side facing the electronic components to be molded. The rigid connecting part of the insert provides controlled support for the flexible molded surface. This is beneficial to the dimensional stability of the insert. In addition, the rigid connecting part can facilitate the connection of the insert to the mold. To facilitate connection to the mold part, the rigid connecting part may be provided with connecting means.

[0016] To ensure that the molding material inserted into the mold cavity remains inside the mold cavity and does not leak through the insert, it is preferred that the three-dimensional molded surface of the insert is not permeable to the molding material. By making the three-dimensional molded surface of the insert not permeable to the molding material, a good seal of the mold cavity can be achieved without additional covering of the insert, for example: using a cover sheet or foil.

[0017] In another embodiment of the mold according to the present invention, the mold part having a mold cavity and configured to accommodate the mold insert includes an opening. This opening thus connects the mold cavity and the insert connected thereto to the outside of the mold. The opening can be connected to a low-pressure device to create a local vacuum in the mold cavity and, in certain cases, at the flexible three-dimensional molded surface of the insert. To connect the opening to the insert molded surface, a space may be left between the insert and the side of the mold cavity recessed in one of the mold parts. Alternatively or additionally, the insert may be provided with suction holes extending from the molded surface to the rear side of the insert opposite the molded surface. If a foil layer is inserted between the three-dimensional molded surface of the insert and the electronic components to be encapsulated, the pressure applied between the molded surface and the foil layer will adsorb the foil layer on the molded surface. This ensures that the foil layer will follow the three-dimensional topography of the molded surface. The application of the foil layer can especially facilitate the separation of the molded electronic components from the mold cavity.

[0018] The present invention also relates to an insert for a mold of the present invention, the insert comprising a flexible three-dimensional molding surface, the advantages of which have been described above with respect to the mold of the present invention.

[0019] The present invention also relates to a method of manufacturing the insert of the present invention, the method comprising vulcanizing a polymer material to a rigid connecting member by molding the polymer material together with a curing agent between the rigid connecting member and a counter mold. By vulcanizing the polymer material to the rigid connecting member, the flexible three-dimensional molding surface and the rigid connecting member can be firmly bonded. During vulcanization, crosslinks are formed between the polymer chains, significantly improving the strength and durability of the polymer material, and thus improving the strength and durability of the flexible three-dimensional molding surface of the insert. However, post-curing processes such as high-pressure curing may be required to achieve optimal curing.

[0020] Finally, the present invention also relates to a method of using a mold according to the present invention to encapsulate an electronic component mounted on a carrier, comprising the following processing steps: a) positioning a carrier carrying one or more electronic components between two mold parts such that the electronic components face the mold cavity, b) moving the mold parts relative to each other to clamp the carrier between the mold parts, at least one of the mold cavities surrounding the electronic component to be encapsulated, and the insert contacting at least one of the electronic component and / or the carrier, c) introducing a molding material into the mold cavity, d) separating the mold parts from each other and removing the carrier carrying the molded electronic component from the mold parts, thereby removing the insert from the electronic component. By implementing this method, a encapsulated product is obtained, wherein the electronic component and the carrier are at least partially coated with the molding material except at at least one position where the insert contacts the electronic component and / or the carrier during molding. As described above, due to the use of the flexible insert molding surface, the insert can compensate for height tolerances in the dimensions of the electronic component by limited deformation. This can prevent excessive pressure from being applied to the electronic component during molding. By using the insert of the present invention, height tolerances of up to 50 μm can even be compensated.

[0021] Before the carrier carrying one or more electronic components is clamped between the mold parts, a foil layer can be at least partially coated on the flexible three-dimensional molding surface of the insert in the mold cavity. The foil layer can be used as a release foil to facilitate separation of the partially molded electronic component from the mold cavity. In particular, during processing step c), while the mold parts are moving relative to each other, the foil layer is clamped between the insert and the electronic component and / or the carrier. Preferably, a negative pressure is applied through an opening in the mold part between the foil layer and the flexible three-dimensional molding surface of the insert. The negative pressure ensures that the foil layer closely adheres to the three-dimensional topography of the molding surface and remains on the molding surface throughout the molding process.

[0022] In one embodiment of the method for encapsulating an electronic component mounted on a carrier according to the present invention, a liquid molding material is transferred into a mold cavity enclosing the electronic component by applying pressure to the molding material. After the mold parts are moved relative to each other according to method step b) of the method, the molding material is introduced into the mold cavity according to method step c) of the method. This method is also referred to as "transfer molding". Therefore, at least a part of the molding material is cured before separating the mold parts from each other so that the molded product does not deform during demolding. In another molding process, the encapsulating material can be introduced into the mold cavity according to method step c) before the mold parts are moved relative to each other according to method step b). This molding process is also referred to as "compression molding". The present invention can be implemented independently of a specific type of molding process. Generally, the encapsulating material is heated before and / or during the molding process, but this does not limit the present invention.

[0023] The present invention will be further illustrated by non - limiting exemplary embodiments shown in the following figures, wherein:

[0024] Figure 1 shows a cross - section of a mold of the present invention that holds a carrier with an electronic component mounted thereon,

[0025] Figures 2a-2d shows a schematic view of the method steps for encapsulating an electronic component mounted on one side of a carrier by a mold of the present invention,

[0026] Figures 3a-3d shows a schematic view of the method steps for encapsulating electronic components mounted on two opposite sides of a carrier by a mold of the present invention.

[0027] Figure 1A cross-section of a mold (1) according to the present invention is shown. The mold (1) holds a carrier or substrate (2) carrying a plurality of electronic components (3) for loading into a single package. The mold (1) includes two mold parts (4, 5), and a cavity (6) is recessed on the contact side (7) of the upper mold part (5). One side of the cavity (6) is defined by an insert (8), and the insert (8) has a flexible three-dimensional molding surface (9) facing the electronic components (3). On the side of the upper mold part (5) opposite to the three-dimensional molding surface (9), the insert (8) includes a rigid connecting part (10) for supporting the molding surface (9). The insert (8) is detachably connected to the upper mold part (5) by bolts (11) serving as connecting means, and the bolts (11) are provided on the rigid connecting part (10). The upper mold part (5) is also provided with suction holes (12), and one end of the suction holes (12) is connected to the outside of the mold (1) connected to a low-pressure device (13). The holes (12) pass through the cavity (6), and a space is left between the insert (8) and the side of the cavity (6), which ensures that a negative pressure is applied between the flexible three-dimensional molding surface (9) and the foil layer (14). The foil layer (14) can be clamped between the insert (8) and the electronic components (3), and also between the insert (8) and the carrier (2), thus at least partially covering the flexible three-dimensional molding surface (9). The surfaces (15) of the electronic components (3) and the surfaces (16) of the carrier (2) in contact with the foil layer (14) are exposed after molding. When the carrier (2) with the molded electronic components (3) is demolded from the mold parts (4, 5), the foil layer (14) will serve as a release foil.

[0028] Figures 2a to 2d A schematic diagram showing the method steps of encapsulating electronic components mounted on one side of a carrier by the mold according to the present invention is shown. In the figure, similar elements are denoted by similar reference numerals. As Figure 1 , Figures 2a-2d A mold insert (20) is shown, which closes a part of the cavity (21) of the mold (not further shown in the figure). The insert (20) includes a flexible three-dimensional molding surface (22) and a rigid connecting part (23) connected to the flexible three-dimensional molding surface (22). The rigid connecting part (23) is configured to be connected to the mold part. The flexible three-dimensional molding surface (22) faces a carrier or substrate (24) provided with a plurality of electronic components (25, 26, 27) on one side. Figure 2a It is shown that there is a height difference (h) between two electronic components (26, 27) due to differences such as production tolerances and / or types of electronic components. Figure 2bShows the situation after the mold components have moved relative to each other, where the flexible three-dimensional molding surface (22) of the insert (20) contacts the electronic components (25, 26, 27). As can be seen from the figure, the height difference (h) is compensated by the flexible molding surface (22). After enclosing the carrier (24) and the electronic components (25, 26, 27) mounted thereon between the mold components, as Figure 2c shown, the molding material (28) is introduced into the mold cavity (21), where the arrow (29) indicates the introduction direction. After the mold cavity (21) is completely filled, the mold components are separated from each other, and the flexible three-dimensional molding surface (22) is lifted from the electronic components (25, 26, 27). Figure 2d Shows the encapsulated product (30) obtained by the method of the present invention, where some of the electronic components (25, 26, 27) are encapsulated by the molding material (28). The parts of the electronic components (25, 26, 27) that are covered by the flexible three-dimensional molding surface (22) during the molding process thus remain exposed.

[0029] Figures 3a to 3d Schematic diagram showing the method steps for encapsulating electronic components (45, 46, 47, 48, 49, 50) mounted on two opposite sides of a carrier or substrate (44) by another embodiment of the mold of the present invention. In the figure, similar elements are also denoted by similar reference numerals. Figures 3a-3d The method steps shown in Figures 2a-2d are very similar to the method steps shown in Figure 3b However, an important difference is that here the mold (not further shown in the figure) includes two mold inserts (40, 41), and each mold insert (40, 41) forms a part of a different mold cavity in two opposite mold cavities (42, 43). The mold cavities (42, 43) are thus configured to enclose one of the two opposite sides of the carrier or substrate (44) respectively, and the opposite sides respectively include the electronic components (45, 46, 47, 48, 49, 50) and the part of the carrier (44) to be encapsulated. Each of the inserts (40, 41) includes a flexible three-dimensional molding surface (51, 52) and a rigid connecting member (53, 54) connected to the flexible three-dimensional molding surface (51, 52). Figure 3cShows the successive steps of introducing molding material (56) into the mold cavities (42, 43), with the introduction direction indicated by the arrow (57). After the mold cavities (42, 43) are completely filled, the mold parts are separated from each other, and the flexible three-dimensional molding surfaces (51, 52) are lifted from the electronic components (45, 46, 47, 48, 49, 50). Figure 3d Shows the resulting encapsulated product (58), in which some of the electronic components (45, 46, 47, 48, 49, 50) are encapsulated by the molding material (56). The parts (55) of the electronic components (45, 46, 47, 48, 49, 50) and the carrier (44) that are covered by the flexible three-dimensional molding surfaces (51, 52) during molding thus remain exposed.

Claims

1. A mold for encapsulating an electronic component mounted on a carrier, comprising at least two relatively movable mold parts, at least one of said mold parts having a recessed cavity on a contact side, and said mold parts being configured to engage with said cavity around the electronic component to be encapsulated; Among them, At least a part of said cavity is formed by an insert having a flexible three-dimensional molding surface facing the electronic component; Wherein, the three-dimensional molding surface of said insert is configured to be a continuous surface covering a plurality of electronic components; Wherein, the three-dimensional molding surface of said insert includes a plurality of contact areas, each contact area being configured to contact at least a part of the upper surface of the electronic component, and for at least two of said contact areas, the distances from the contact areas to the side of the insert opposite to the three-dimensional molding surface are different; Wherein, the hardness of the three-dimensional molding surface of said insert is between 70-100 Sh-A.

2. The mold according to claim 1, characterized in that, The three-dimensional molding surface of said insert is made of a polymer material.

3. The mold according to claim 1, characterized in that, Said insert is detachably connected to said mold part.

4. The mold according to claim 1, characterized in that, The hardness of the three-dimensional molding surface of said insert is between 80-90 Sh-A.

5. The mold according to claim 1, characterized in that, Said insert includes a rigid connecting part carrying said flexible three-dimensional molding surface.

6. The mold according to claim 5, characterized in that, Said rigid connecting part is provided with connecting means for connecting said insert to the mold part.

7. The mold according to any one of claims 1-6, characterized in that, The three-dimensional molding surface of said insert cannot be penetrated by the molding material.

8. The mold according to any one of claims 1-6, characterized in that, Said mold includes a plurality of flexible inserts having a three-dimensional molding surface facing said electronic component.

9. The mold according to claim 8, characterized in that, Said mold includes at least two opposite mold parts, each mold part having a contact side provided with a recessed cavity, wherein at least part of the cavity is formed by an insert having a flexible three-dimensional molding surface.

10. The mold according to any one of claims 1-6, characterized in that, The opening in said mold part for accommodating said insert is connected to a low-pressure device.

11. An insert for a mold according to any one of claims 1-10, comprising a flexible three-dimensional molding surface; Among them, The three-dimensional molding surface of said insert is configured to be a continuous surface covering a plurality of electronic components; Wherein, the three-dimensional molding surface of said insert includes a plurality of contact areas, each contact area being configured to contact at least a part of the upper surface of the electronic component, and for at least two of said contact areas, the distances from the contact areas to the side of the insert opposite to the three-dimensional molding surface are different; Wherein, the hardness of the three-dimensional molding surface of said insert is between 70-100 Sh-A.

12. A method for manufacturing an insert according to any one of claims 1-11, comprising: By molding a polymer material together with a curing agent between the rigid connecting part and the counter mold, the polymer material is vulcanized onto the rigid connecting part.

13. A method for encapsulating an electronic component mounted on a carrier by using a mold according to any one of claims 1 to 10, comprising the following processing steps: a) Positioning a carrier with one or more electronic components between two mold parts so that the electronic components face the cavity; b) Moving said mold parts relative to each other to clamp the carrier between the mold parts, at least one of said cavities surrounding the electronic component to be encapsulated, and said insert contacting at least one of the electronic component and / or the carrier; c) Introducing a molding material into said cavity; d) Separate the mold parts from each other, and remove the carrier with the molded electronic component from the mold parts, thereby removing the insert from the electronic component.

14. The method according to claim 13, wherein Introduce a foil layer into the mold cavity, the foil layer at least partially covering the flexible three-dimensional molding surface of the insert.

15. The method according to claim 14, characterized in that, During the execution of process step c), while moving the mold parts relative to each other, clamp the foil between the insert and the electronic component and / or the carrier.

16. The method according to claim 14 or 15, characterized in that, Apply a negative pressure between the foil layer and the flexible three-dimensional molding surface of the insert through the opening of the mold part.

17. The method according to any one of claims 13 to 15, characterized in that Transfer the liquid molding material into the mold cavity enclosing the electronic component by applying pressure to the molding material. After moving the mold parts relative to each other according to method step b), introduce the molding material into the mold cavity according to method step c).

18. The method according to any one of claims 13 to 15, characterized in that The processing temperature when the molding material is introduced into the mold cavity is 100 - 200 °C.

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