Display device

Abstract

The display device includes: a substrate, the substrate includes an opening area, a display area, and a non-display area between the opening area and the display area; a pixel array, the pixel array includes a plurality of pixels located in the display area, each of the plurality of pixels having a pixel electrode, a relative electrode facing the pixel electrode, and an intermediate layer between the pixel electrode and the relative electrode; a plurality of data lines bypassing the opening area in the non-display area; a first insulating layer and a second insulating layer covering the plurality of data lines; a conductive layer between the first insulating layer and the second insulating layer; and a thin film encapsulation layer covering the pixel array, the thin film encapsulation layer including at least one organic encapsulation layer and at least one inorganic encapsulation layer, wherein a first groove defined in the first insulating layer, the conductive layer, and the second insulating layer is located in the non-display area.

Description

Technical Field

[0001] The present disclosure relates to a display device. Background Art

[0002] Recently, display devices have been used in various fields. Also, as display devices have become thinner and lighter, their scope of use has gradually expanded.

[0003] As the area occupied by the display area of ​​the display device increases, the number of functions that can be combined or associated with the display device has increased. As a way to add various functions to the display device while increasing the display area, a display device having an opening formed in the display area has been studied. Summary of the invention

[0004] Technical issues

[0005] When forming a display device having an opening, as a bonding force between the encapsulation member and the structure is weakened, the encapsulation member may move upward from the structure therebelow.

[0006] The present disclosure is to solve many problems including the above problems, and to provide a display device in which an encapsulation member is prevented from moving upward. However, this object is only an example, and the scope of the present disclosure is not limited thereto.

[0007] Problem Solution

[0008] According to aspects of the present disclosure, a display device includes: a substrate including an opening area, a display area, and a non-display area between the opening area and the display area; a pixel array including a plurality of pixels located in the display area, each of the plurality of pixels having a pixel electrode, a relative electrode facing the pixel electrode, and an intermediate layer between the pixel electrode and the relative electrode; a plurality of data lines bypassing the opening area in the non-display area; a first insulating layer and a second insulating layer covering the plurality of data lines; a conductive layer between the first insulating layer and the second insulating layer; and a thin film encapsulation layer covering the pixel array, the thin film encapsulation layer including at least one organic encapsulation layer and at least one inorganic encapsulation layer, wherein a first groove defined in the first insulating layer, the conductive layer, and the second insulating layer is located in the non-display area.

[0009] The first groove may overlap the plurality of data lines.

[0010] A width of an open region of the conductive layer corresponding to the first groove may be smaller than a width of an open region of the first insulating layer corresponding to the first groove.

[0011] At least one of the intermediate layer and the opposite electrode may extend toward the opening region and may be disconnected around the first groove.

[0012] A portion of the at least one organic encapsulating layer may be located in the first groove.

[0013] The at least one inorganic encapsulation layer may completely cover the inner surface of the first groove.

[0014] The first groove may surround the opening area.

[0015] The display device may further include a multi-insulating layer disposed between the substrate and the first insulating layer, and a second groove defined in the multi-insulating layer and the substrate.

[0016] The second groove may be between the opening area and the first groove and surround the opening area.

[0017] At least one organic encapsulation layer may extend toward the opening region and may be disconnected around the second groove.

[0018] The second insulating layer may cover edges of the pixel electrode.

[0019] According to another aspect of the present disclosure, a display device includes: a substrate including an opening; a pixel array including a plurality of pixels located on the substrate and surrounding the opening, each of the plurality of pixels including a display element including a pixel electrode, an intermediate layer on the pixel electrode, and a relative electrode on the intermediate layer; a plurality of data lines located between the opening and the pixel array, the plurality of data lines bypassing along edges of the opening; and a plurality of layers arranged on the plurality of data lines, the plurality of layers having a first groove defined therein.

[0020] At least one of the intermediate layer and the opposite electrode may be disconnected around the first groove.

[0021] The multiple layers may include a first layer having a first open area; a second layer arranged below the first layer, the second layer having a second open area; and a third layer arranged on the first layer, the third layer having a third open area, wherein a width of the first open area may be smaller than a width of the second open area.

[0022] The first layer may include the same material as the pixel electrode, and the second and third layers may include insulating materials.

[0023] The display device may further include a thin film encapsulation layer covering the pixel array, the thin film encapsulation layer including at least one organic encapsulation layer and at least one inorganic encapsulation layer.

[0024] A portion of the at least one organic encapsulating layer may be located in the first groove.

[0025] At least one organic encapsulation layer may extend toward the opening and may be disconnected in a region between the opening and the first groove.

[0026] The display device may further include a multi-insulating layer between the substrate and the multi-layer, and a second groove defined in the multi-insulating layer and the substrate.

[0027] The second slot may be between the opening and the first slot and surround the opening.

[0028]

[0013] Further aspects, features, and advantages in addition to those described above will become apparent from the following drawings, claims, and detailed description of the present disclosure.

[0029] Advantageous Effects of the Present Disclosure

[0030] According to the embodiments of the present disclosure, it is possible to effectively prevent the thin film encapsulation layer from lifting around the opening, in particular, to prevent the phenomenon in which the thin film encapsulation layer is lifted relative to the data line bypassing around the opening, and thus prevent damage to the pixels around the opening. However, these effects are exemplary, and the scope of the present disclosure is not limited thereto. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic plan view showing a display device according to an embodiment of the present disclosure;

[0032] Figure 2 is an equivalent circuit diagram of a pixel of a display device according to an embodiment of the present disclosure;

[0033] Figure 3 is a plan view showing the periphery of an opening in a display device according to an embodiment of the present disclosure;

[0034] Figure 4 is a cross-sectional view of a display device according to an embodiment of the present disclosure;

[0035] Figure 5A is a cross-sectional view showing a first groove of a display device according to an embodiment of the present disclosure;

[0036] Figure 5B A cross-sectional view showing a first groove and a stacked structure thereon;

[0037] Fig. 6A is a cross-sectional view showing a second groove of a display device according to an embodiment of the present disclosure;

[0038] Figure 6B A cross-sectional view showing a second groove and a stacked structure thereon;

[0039] Figure 7 A plan view showing a groove around an opening in a display device according to an embodiment of the present disclosure;

[0040] Figure 8 A plan view showing an organic encapsulation layer around an opening in a display device according to an embodiment of the present disclosure;

[0041] Fig. 9A schematic plan view showing a display device according to another embodiment of the present disclosure;

[0042] Fig.10 A schematic plan view showing a display device according to another embodiment of the present disclosure;

[0043] Fig.11 is a plan view showing a groove around an opening in a display device according to another embodiment of the present disclosure; and

[0044] Fig.12 FIG. 4 is a plan view showing an organic encapsulation layer around an opening in a display device according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0045] Since the present disclosure can have various modifications and several embodiments, the embodiments are shown in the drawings and will be described in detail. Figure 1 However, the embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein.

[0046] Hereinafter, the present disclosure will be described in detail by explaining embodiments of the present disclosure with reference to the accompanying drawings, and the same reference numerals in the drawings denote the same elements and thus their description will be omitted.

[0047] It should be understood that although the terms “first”, “second”, etc. may be used herein to describe various components, these components should not be limited by these terms and these terms are only used to distinguish one component from another.

[0048] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0049] It should be further understood that the terms “includes,” “including,” “has” and / or “having” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0050] It will be understood that when a layer, region or component is referred to as being "formed on" another layer, region or component, it may be directly or indirectly formed on the other layer, region or component. That is, for example, intervening layers, regions or components may be present.

[0051] For the convenience of description, the size of the elements in the drawings may be enlarged or reduced. In other words, since the size and thickness of the components in the drawings are arbitrarily shown for the convenience of description, the following embodiments are not limited thereto.

[0052] When a certain embodiment can be implemented differently, the specific process order can be performed differently from the described order. For example, two processes described in succession can be performed substantially simultaneously or in the reverse order of the described order.

[0053] It should be understood that when a layer, region, or component is referred to as being “connected” to another layer, region, or component, it may be “directly connected” to the other layers, regions, or components; or it may be “indirectly connected” to the other layers, regions, or components with another layer, region, or component interposed therebetween. For example, it should be understood that when a layer, region, or component is referred to as being “connected or electrically connected” to another layer, region, or component, it may be “directly electrically connected” to the other layers, regions, or components; or it may be “indirectly connected or electrically connected” to the other layers, regions, or components with another layer, region, or component interposed therebetween.

[0054] The display device may include an organic light-emitting display device, an inorganic electroluminescent (EL) display device (or an inorganic light-emitting display device), or a quantum dot light-emitting display device, etc. Hereinafter, as a display device according to an embodiment of the present disclosure, an organic light-emitting display device is described as an example. However, the display device of the present disclosure is not limited thereto, and various types of display devices may be used.

[0055] Figure 1 1 is a schematic plan view showing a display device 1 according to an embodiment of the present disclosure.

[0056] refer to Figure 1 The display device 1 includes a display area DA and a non-display area NDA. The display area DA is an area for providing a certain image and includes a pixel array including a plurality of pixels P. Each of the pixels P may include a display element such as an organic light emitting diode (OLED).

[0057] The pixel P may emit red, green, blue or white light through an organic light emitting diode. The pixel P in this specification may be understood as a pixel that emits any one of red, green, blue and white light as described above. The display area DA may be covered with an encapsulation member and thus may be protected from external air or moisture.

[0058] The opening OP may be provided inside the display area DA. The opening OP may be surrounded by the pixels P. The opening OP may be an area for a separate electronic component used for the function of the display device 1, or an area for a separate electronic component used to add a new function. For example, when the display device 1 includes an electronic component (such as a camera, an acoustic element, or a sensor for recognizing a distance or a fingerprint, etc.), the electronic component may be arranged to overlap with the opening OP.

[0059] The non-display area NDA may include a first non-display area NDA1 adjacent to an inner edge of the display area DA, and a second non-display area NDA2 adjacent to an outer edge of the display area DA. The first non-display area NDA1 and the second non-display area NDA2 may be spaced apart from each other with the display area DA therebetween.

[0060] The first non-display area NDA1 is an area that does not provide an image, and may be located between the opening OP of the display area DA and the pixel array. The first non-display area NDA1 may surround the opening OP. The first non-display area NDA1 may be surrounded by the pixel array of the display area DA. In the first non-display area NDA1, wiring that provides an electrical signal to the pixel P adjacent to the opening OP may be bypassed, and the wiring may be bent along the edge of the opening OP.

[0061] The second non-display area NDA2 is an area that does not provide an image, and a driver (eg, a scan driver, a data driver, etc.) and wiring for transmitting an electrical signal or power that is transmitted to each pixel P may be arranged in the second non-display area NDA2.

[0062] Figure 1 It can be understood as the state of the substrate 100 in the display device 1. For example, it can be understood that the substrate 100 has an opening area corresponding to the opening OP, a display area DA, and a first non-display area NDA1 and a second non-display area NDA2. The substrate 100 may include a material such as glass, metal, or an organic material. According to an embodiment, the substrate 100 may include a flexible material. For example, the substrate 100 may include a metal material that can be bent or curled well, or a material such as an organic polymer resin, which includes a polymer such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyimide.

[0063] Figure 2 is an equivalent circuit diagram of a pixel P of a display device according to an embodiment of the present disclosure.

[0064] refer to Figure 2 , the pixel P includes a pixel circuit PC and a display element connected to the pixel circuit PC. Figure 2, an organic light emitting diode OLED is shown as a display element. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst.

[0065] The second thin film transistor T2 is a switching thin film transistor and is connected to the scan line SL and the data line DL, and may be configured to transmit a data voltage input from the data line DL to the first thin film transistor T1 in response to a switching voltage input from the scan line SL. The storage capacitor Cst may be connected to the second thin film transistor T2 and the driving voltage line PL, and may store a voltage corresponding to a difference between a voltage transmitted from the second thin film transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0066] The first thin film transistor T1 is a driving thin film transistor and may be connected to the driving voltage line PL and the storage capacitor Cst, and may control a driving current flowing from the driving voltage line PL through the organic light emitting diode OLED in response to a voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED may emit light having a certain brightness by using the driving current. An opposite electrode (e.g., a cathode) of the organic light emitting diode OLED may receive a second power supply voltage ELVSS.

[0067] Despite Figure 2 The pixel circuit PC shown in FIG. 1 includes two thin film transistors and one storage capacitor, but the present disclosure is not limited thereto. The number of thin film transistors and the number of storage capacitors may be variously modified depending on the design of the pixel circuit PC.

[0068] Figure 3 is a plan view showing the periphery of an opening in a display device according to an embodiment of the present disclosure.

[0069] refer to Figure 3 , a plurality of pixels P are arranged around the opening OP. Figure 2 As described, each of the pixels P may include an organic light emitting diode, and the organic light emitting diode is electrically connected to a scan line, a data line, and the like. Figure 3 Display data line DL.

[0070] The data lines DL are electrically connected to the data driver 1100. The data driver 1100 may be a chip on panel (COP) type and arranged in the second non-display area NDA2 (see FIG. Figure 1 ), or may be a chip on film (COF) type and arranged on a flexible circuit board (not shown) electrically connected to terminals provided in the second non-display area NDA2.

[0071] Some of the data lines DL located around the opening OP may be bent to detour along the edge of the opening OP in the first non-display area NDA1 .

[0072] Despite Figure 3 Although not shown in the figure, the scan line may extend in a direction (e.g., x direction) intersecting the data line DL and may be bent along the edge of the opening OP in the first non-display area NDA1 like the data line DL. Alternatively, the scan line may be cut around the opening OP. In this case, each of the scan line connected to the pixel P arranged on the left side of the opening OP and the scan line connected to the pixel P arranged on the right side of the opening OP may be separately connected to the scan driver.

[0073] Figure 4 is a cross-sectional view of a display device according to an embodiment of the present disclosure, and corresponds to a cross-sectional view along Figure 3 A cross-sectional view taken along line IV-IV'. Figure 5A is a cross-sectional view showing a first groove of a display device according to an embodiment of the present disclosure, and Figure 5B FIG. 4 is a cross-sectional view showing a first groove and a stacked structure thereon. Fig. 6A is a cross-sectional view showing a second groove of a display device according to an embodiment of the present disclosure, and Figure 6B FIG. 4 is a cross-sectional view showing the second groove and the stacked structure thereon. Figure 7 is a plan view showing a groove around an opening in a display device according to an embodiment of the present disclosure, and Figure 8 is a plan view showing an organic encapsulation layer around an opening in a display device according to an embodiment of the present disclosure.

[0074] refer to Figure 4 , the substrate 100 includes an opening area OA corresponding to the opening OP, a display area DA in which a display element is arranged, and a first non-display area NDA1 between the opening area OA and the display area DA.

[0075] The substrate 100 may have a multi-layer structure including a base layer and a barrier layer. In this regard, Figure 4 The substrate 100 is shown to include a first base layer 101 , a first barrier layer 102 , a second base layer 103 , and a second barrier layer 104 which are sequentially stacked.

[0076] The first substrate layer 101 and the second substrate layer 103 may each include a polymer resin, such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), or cellulose acetate propionate (CAP).

[0077] The first barrier layer 102 and the second barrier layer 104 may each include silicon oxide or silicon nitride, etc. In a non-limiting embodiment of the present disclosure, the first barrier layer 102 may be a multilayer including an amorphous silicon layer and a silicon oxide layer to improve adhesion between adjacent layers, and the second barrier layer 104 may be a silicon oxide layer. However, the present disclosure is not limited thereto.

[0078] A buffer layer 110 (which is formed to prevent impurities from penetrating into the semiconductor layer of the thin film transistor) may be disposed on the substrate 100. The buffer layer 110 may include an inorganic insulating material, such as silicon nitride or silicon oxide, and may be a single layer or multiple layers including the above inorganic insulating material. In some embodiments, the second barrier layer 104 of the substrate 100 may be understood as a portion of the buffer layer 110 having a multilayer structure.

[0079] The first and second thin film transistors T1 and T2 , a storage capacitor Cst, and the like may be disposed on the buffer layer 110 .

[0080] The first thin film transistor T1 may be a driving thin film transistor and may include a semiconductor layer Act1, a gate electrode G1, a source electrode S1, and a drain electrode D1. The second thin film transistor T2 may be a switching thin film transistor and may include a semiconductor layer Act2, a gate electrode G2, a source electrode S2, and a drain electrode D2. The source electrode S2 of the second thin film transistor T2 may be understood as the above reference Figure 2 A portion of the data line is described. In the present embodiment, a top gate type is shown in which the gate electrodes G1 and G2 are respectively arranged on the semiconductor layers Act1 and Act2 (with the gate insulating layer 130 therebetween). However, according to another embodiment, the first thin film transistor T1 and the second thin film transistor T2 may be a bottom gate type.

[0081] The semiconductor layers Act1 and Act2 may each include polycrystalline silicon. Alternatively, the semiconductor layers Act1 and Act2 may each include amorphous silicon, an oxide semiconductor, or an organic semiconductor.

[0082] The gate electrodes G1 and G2 may each include a low resistance metal material. For example, the gate electrodes G1 and G2 may each include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), or titanium (Ti), and may each include a multilayer or single layer including the material.

[0083] The gate insulating layer 130 is between the semiconductor layers Act1 and Act2 and the gate electrodes G1 and G2 , and the gate insulating layer 130 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, or hafnium oxide.

[0084] The source electrodes S1 and S2 and the drain electrodes D1 and D2 may each include a material having good electrical conductivity. For example, the source electrodes S1 and S2 and the drain electrodes D1 and D2 may each include a conductive material including Mo, Al, Cu, or Ti, etc., and may each include a multilayer or a single layer including the material. In a non-limiting embodiment, the source electrodes S1 and S2 and the drain electrodes D1 and D2 may each include a multilayer of Ti / Al / Ti.

[0085] The storage capacitor Cst includes a lower electrode C1 and an upper electrode C2 overlapping each other with the first interlayer insulating layer 150 therebetween. The storage capacitor Cst may overlap the first thin film transistor T1. In this regard, Figure 4 It is shown that the gate electrode G1 of the first thin film transistor T1 is the lower electrode C1 of the storage capacitor Cst, and the storage capacitor Cst is covered by the second interlayer insulating layer 170. However, the present disclosure is not limited thereto. In another embodiment, the storage capacitor Cst may not overlap with the first thin film transistor T1.

[0086] The first interlayer insulating layer 150 and the second interlayer insulating layer 170 may each include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, titanium oxide, tantalum oxide, or hafnium oxide.

[0087] The pixel circuit including the first and second thin film transistors T1 and T2 and the storage capacitor Cst is covered by the first insulating layer 180. The first insulating layer 180 is a planarizing insulating layer and may include an organic insulating material, such as a general polymer (e.g., polymethyl methacrylate (PMMA) or polystyrene (PS)), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, or a blend thereof.

[0088] The organic light emitting diode OLED is arranged on the first insulating layer 180. The pixel electrode 210 of the organic light emitting diode OLED is arranged on the first insulating layer 180, but the edge of the pixel electrode 210 is covered by the second insulating layer 190 (which is a pixel defining layer). The pixel electrode 210 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). In another embodiment, the pixel electrode 210 may include a reflective layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or a compound thereof. In another embodiment, the pixel electrode 210 may further include a reflective layer including ITO, IZO, ZnO or In on or below the reflective layer. 2 O 3 layer.

[0089] The second insulating layer 190 includes an opening that exposes the top surface of the pixel electrode 210, but covers the edge of the pixel electrode 210. The second insulating layer 190 may include an organic insulating material, such as a general polymer (e.g., PMMA or PS), a polymer derivative with a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer or a blend thereof. As an embodiment, the first insulating layer 180 and the second insulating layer 190 may each include polyimide. Alternatively, the second insulating layer 190 may include an inorganic insulating material, or both an inorganic insulating material and an organic insulating material.

[0090] The intermediate layer 220 includes an emission layer. The emission layer may include a high molecular weight or low molecular weight organic material that emits light of a certain color. The intermediate layer 220 may include at least one functional layer, that is, at least one of a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0091] Some of the multiple layers constituting the intermediate layer 220, for example, one or more functional layers, may be arranged not only in the display area DA but also in the first non-display area NDA1, and may be disconnected in the first non-display area NDA1 by first and second grooves 410 and 420 described later.

[0092] The opposing electrode 230 is arranged to face the pixel electrode 210, with the intermediate layer 220 between them. The opposing electrode 230 may include a conductive material having a low work function. For example, the opposing electrode 230 may include a (semi) transparent layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), calcium (Ca) or an alloy thereof. Alternatively, the opposing electrode 230 may further include a conductive layer including ITO, IZO, ZnO or In on the (semi) transparent layer including the above materials. 2 O 3 layer.

[0093] The organic light emitting diode OLED is covered with a thin film encapsulation layer 300. The thin film encapsulation layer 300 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. Figure 4 The thin film encapsulation layer 300 is shown to include a first inorganic encapsulation layer 310 and a second inorganic encapsulation layer 330 with an organic encapsulation layer 320 therebetween, but the stacking order and number of layers may vary.

[0094] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may each include one or more inorganic insulating materials selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride, and may be formed by chemical vapor deposition (CVD). The organic encapsulation layer 320 may include a polymer material. Examples of polymer materials may include acrylic resins, epoxy resins, polyimide, and polyethylene.

[0095] refer to Figure 4 , the first non-display area NDA1 may include first to third areas A1, A2, and A3.

[0096] The first area A1 is an area for ensuring a cutting margin in a process of removing the substrate 100 corresponding to the opening area OA and the stacked structure thereon to form the opening OP, and the second area A2 is an area having a recessed structure to prevent side moisture from penetrating. The second groove 420 may be located in the second area A2. The second groove 420 may be defined in the substrate 100 and the multi-insulating layer on the substrate 100. Figure 4 It is shown that two second grooves 420 are formed, and it is shown that the organic encapsulation layer 320 is disconnected around one of the two second grooves 420. Among the layers formed on the substrate 100, the layer including the organic material may be a penetration path of foreign substances such as moisture or oxygen, but because the organic encapsulation layer 320 is disconnected in the second area A2, moisture can be prevented from penetrating in the lateral direction (i.e., the x direction).

[0097] The third area A3 is an area in which the data lines DL bypassed along the edge of the opening OP are arranged around the opening OP. The data lines DL located in the third area A3 may be alternately arranged with an insulating layer between them. For example, adjacent data lines DL may be arranged below and above, respectively, with an insulating layer (e.g., a second interlayer insulating layer 170) between them, thereby reducing the distance (spacing) between adjacent data lines DL. With this structure, the width of the third area A3 may be reduced, and the width of the first non-display area NDA1 may also be reduced.

[0098] In the process of manufacturing a display device having an opening OP, a process of removing the substrate 100 corresponding to the opening area OA and the stacked structure thereon is performed as described above. In this case, the removal process may be performed using a laser. Because an impact is transmitted due to the removal process for forming the opening OP, lifting of the thin film encapsulation layer 300 may occur, and the lifting phenomenon of the thin film encapsulation layer 300 is likely to occur in the third area A3 where the bonding force with the thin film encapsulation layer 300 is relatively weak. However, according to an embodiment of the present disclosure, since the first groove 410 is located in the third area A3, the bonding force between the thin film encapsulation layer 300 and the structure thereunder may be enhanced, thereby preventing or reducing the lifting phenomenon of the thin film encapsulation layer 300. The first groove 410 is located on the data line DL. The first groove 410 may overlap with the data line DL.

[0099] refer to Figure 5A , the first groove 410 is defined in the multi-layer ML. The multi-layer ML may cover the above reference Figure 4 The data line DL of the third area A3 described above may include a first insulating layer 180, a conductive layer 185, and a second insulating layer 190 sequentially stacked. The conductive layer 185 may be connected to the reference Figure 4 The pixel electrode 210 is described to include the same material.

[0100] The first groove 410 may be formed to have a certain depth along the depth direction of the multilayer ML. The first groove 410 may be formed by removing a portion of the second insulating layer 190, the conductive layer 185, and the first insulating layer 180. The first groove 410, which is formed while a portion of the second insulating layer 190, the conductive layer 185, and the first insulating layer 180 is opened, may have different widths depending on its position.

[0101] The first width W1 of the open area (opening) of the conductive layer 185 is smaller than the second width W2 of the open area (opening) of the first insulating layer 180 below the conductive layer 185. The third width W3 of the open area of ​​the second insulating layer 190 may be greater than the first width W1. In other words, the inner edge of the conductive layer 185 may extend further toward the central axis of the first groove 410 than the inner edges of the first insulating layer 180 and the second insulating layer 190. The first groove 410 may be formed using a laser or by an etching (dry / wet) process.

[0102] exist Figure 5A In the embodiment, the open areas of the second insulating layer 190 and the conductive layer 185 may be formed to penetrate the second insulating layer 190 and the conductive layer 185 in the thickness direction thereof, but the open areas of the first insulating layer 180 may be formed to be concave relative to the top surface of the first insulating layer 180. In another embodiment, the open areas of the first insulating layer 180 may be formed to penetrate the first insulating layer 180 in the thickness direction thereof, but in this case, the data line DL (see Figure 4) may be covered with another insulating layer to prevent exposure through the first groove 410.

[0103] like Figure 5A , when the intermediate layer 220 and the opposite electrode 230 are formed on the substrate 100 having the first groove 410, at least one of the intermediate layer 220 and the opposite electrode 230 may be disconnected around the first groove 410. In this regard, Figure 5B It is shown that the intermediate layer 220 and the opposite electrode 230 are disconnected by the first groove 410 .

[0104] The intermediate layer 220 and the opposite electrode 230 may be deposited by an evaporation method using a mask. In this case, the intermediate layer 220 and the opposite electrode 230 are disconnected by an eaves structure (undercut structure) formed by the conductive layer 185 (which is a layer extending toward the central axis of the first groove 410) and the first insulating layer 180 therebelow. Figure 7 , the first groove 410 completely surrounds the opening OP in the first non-display area NDA1. Therefore, the disconnection area of ​​the intermediate layer 220 and the opposite electrode 230 may also have a ring shape surrounding the opening OP.

[0105] like Figure 5B 4 shows that, because the first inorganic encapsulation layer 310 has relatively excellent step coverage unlike the intermediate layer 220 and the opposite electrode 230, the first inorganic encapsulation layer 310 can be continuously formed without disconnection to cover the entire inner surface of the first groove 410. For example, the first inorganic encapsulation layer 310 can completely cover the side surface of the second insulating layer 190, a portion of the top surface, the side surface and the bottom surface of the conductive layer 185, and the side surface and the bottom surface of the first insulating layer 180.

[0106] A portion of the organic encapsulation layer 320 may be located in the first groove 410. Since at least one of the intermediate layer 220 and the opposite electrode 230 is disconnected by the first groove 410 and the first inorganic encapsulation layer 310, and the organic encapsulation layer 320 fills the inner space of the first groove 410, the peeling of the thin film encapsulation layer 300 that may occur in the opening OP formation process can be effectively prevented. The bonding force between the thin film encapsulation layer 300 and the structure therebelow (i.e., the first groove 410) can be further increased by the shape (anchor shape) of the first groove 410 having different widths depending on its position.

[0107] refer to Fig. 6A , similar to the first groove 410, the second groove 420 may also have an anchor shape having different widths depending on its position.

[0108] The second groove 420 is defined in the multi-insulating layer MIL. The multi-insulating layer MIL may include the above reference Figure 4The substrate 100 , the buffer layer 110 , the gate insulating layer 130 , the first interlayer insulating layer 150 , and the second interlayer insulating layer 170 are described. Fig. 6A The second base layer 103 and the second barrier layer 104 of the substrate 100 are shown to be parts of the multi-insulating layer MIL.

[0109] The second groove 420 may be formed to have a certain depth in the depth direction of the multi-insulating layer MIL. For example, the second groove 420 may be formed by partially removing the second interlayer insulating layer 170, the first interlayer insulating layer 150, the gate insulating layer 130, the buffer layer 110, the second barrier layer 104, and the second base layer 103.

[0110] In an embodiment, a stacked body (hereinafter, referred to as an upper layer) including the second interlayer insulating layer 170, the first interlayer insulating layer 150, and the gate insulating layer 130 may be formed in a manner similar to that of an upper layer. Figure 4 The contact holes for contact between the source electrodes S1 and S2 or the drain electrodes D1 and D2 in the display area DA and the semiconductor layers Act1 and Act2 are removed in the process described above. Subsequently, a process of removing a portion of the stacked body (hereinafter, referred to as the middle layer) including the buffer layer 110 and the second barrier layer 104 and a portion of the second base layer 103 (hereinafter, referred to as the lower layer) may be performed. Portions of the middle layer and the lower layer may be removed in the process (laser, etching, etc.) of forming the first groove 410.

[0111] The fourth width W4 of the open area of ​​the middle layer is smaller than the fifth width W5 of the open area of ​​the lower layer below the middle layer. The sixth width W6 of the open area of ​​the upper layer may be greater than the fourth width W4. In other words, the inner edge of the middle layer may extend further toward the central axis of the second groove 420 than the inner edges of the lower and upper layers.

[0112] like Fig. 6A , when the intermediate layer 220 and the opposite electrode 230 are formed on the substrate 100 having the second groove 420, at least one of the intermediate layer 220 and the opposite electrode 230 may be disconnected around the second groove 420. In this regard, Figure 6B The intermediate layer 220 and the opposite electrode 230 are shown to be disconnected by the second groove 420. Figure 7 , the second groove 420 completely surrounds the opening OP in the first non-display area NDA1. Therefore, the disconnection area of ​​the intermediate layer 220 and the opposite electrode 230 may also have a ring shape surrounding the opening OP.

[0113] like Figure 6B As shown in FIG. 4 , since the first inorganic encapsulating layer 310 has relatively excellent step coverage as described above, the first inorganic encapsulating layer 310 may be continuously formed without being disconnected to cover the entire inner surface of the second groove 420 .

[0114] When the plurality of second slots 420 are Figure 6BWhen positioned as shown in FIG. 1 , the organic encapsulation layer 320 may be located in any one of the second grooves 420. However, the organic encapsulation layer 320 is not located in at least one second groove 420 adjacent to the opening OP among the plurality of second grooves 420. Figure 4 and Figure 8 4, the organic encapsulation layer 320 is disconnected around at least one second groove 420 adjacent to the opening OP. For example, the organic encapsulation layer 320 may include an inner portion and an outer portion spaced apart from each other along the second groove 420, and the inner portion may have a ring shape surrounding the opening OP. Even if foreign matter, such as moisture, penetrates through the organic encapsulation layer 320 in a lateral direction from the opening OP toward the display area DA, the foreign matter may be prevented from reaching the organic light emitting diode of the display area DA because the organic encapsulation layer 320 is disconnected.

[0115] Although reference Figure 5A and Figure 5B The first groove 410 described above has been mainly described as being arranged in the third area A3, but the embodiments of the present disclosure are not limited thereto. Figure 4 , the first groove 410 may also be located in the first area A1. Therefore, also in the first area A1, at least a portion of the intermediate layer 220 and the opposite electrode 230 may be removed around the first groove 410, and since a portion of the thin film encapsulation layer 300 is located in the first groove 410, peeling of the thin film encapsulation layer 300 may be minimized.

[0116] Fig. 9 1 is a schematic plan view showing a display device 2 according to another embodiment of the present disclosure.

[0117] refer to Fig. 9 , the display device 2 may include a plurality of openings OP. The opening OP may be located in the display area DA. The first non-display area NDA1 is arranged between the opening OP and the display area DA, and the first non-display area NDA1 may surround the opening OP. The display area DA may be surrounded by the second non-display area NDA2. Because the structure centered on each opening OP is similar to the above reference Figures 2 to 8 The descriptions are the same, so duplicate descriptions are omitted.

[0118] Fig.10 2 is a schematic plan view showing a display device 3 according to another embodiment of the present disclosure. Fig.11 is a plan view showing a groove around an opening in a display device according to another embodiment of the present disclosure, and Fig.12 FIG. 4 is a plan view showing an organic encapsulation layer around an opening in a display device according to another embodiment of the present disclosure.

[0119] refer to Fig.10, the display device 3 may include a plurality of openings OP. The openings OP may be located in the display area DA. The first non-display area NDA1 is arranged between the openings OP and the display area DA, and the first non-display area NDA1 may completely surround the plurality of openings OP. The display area DA may be surrounded by the second non-display area NDA2.

[0120] like Fig.11 As shown in FIG. 1 , each of the plurality of openings OP arranged in the first non-display area NDA1 may be surrounded by the first groove 410 and the second groove 420, and the cross-sectional structure of the first groove 410 and the second groove 420 is as shown in FIG. 1 . Figures 4 to 6B describe.

[0121] As mentioned above, the thin film encapsulation layer (i.e., Figure 4 The thin film encapsulation layer 300 in the organic encapsulation layer not only covers the display area DA, but also covers the first non-display area NDA1. Figure 4 The organic encapsulation layer 320 in the embodiment may provide a penetration path for moisture and thus may be formed discontinuously around the opening OP. Fig.12 , the organic encapsulation layer 320 may be disconnected around the second groove 420 surrounding each of the plurality of openings OP arranged in the first non-display area NDA1. The organic encapsulation layer 320 may include an inner portion and an outer portion disconnected around the second groove 420, and the inner portion of the organic encapsulation layer 320 may have a ring shape surrounding each of the openings OP. The outer portion of the organic encapsulation layer 320 is spaced apart from the inner portion by a certain interval and may cover an area between the display area DA and the adjacent openings OP in the first non-display area NDA1.

[0122] although Figures 1 to 12 A case where the opening OP is circular is shown, but the present disclosure is not limited thereto. The opening OP may have various shapes such as a polygonal shape (eg, a square) or an elliptical shape, and the number of the openings OP may be variously changed.

[0123] although Figures 1 to 12 The case where the shape of the first non-display area NDA1 around the opening OP along the opening OP is a circle is shown, but the present disclosure is not limited thereto. The first non-display area NDA1 may have various shapes such as a polygon (eg, a square) or an ellipse, and the shape of the first non-display area NDA1 is not limited.

[0124] although Figures 1 to 12A case where the display area DA is roughly square is shown, but the present disclosure is not limited to this. The display area DA may have various shapes, such as a polygon (such as a triangle or a pentagon), a circle, or an ellipse. It should be understood that the embodiments described herein should be considered only in a descriptive sense and not for the purpose of limitation. The description of features or aspects in each embodiment should generally be considered to be applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the following claims.

Claims

1. A display device, include: A substrate, the substrate comprising an opening area, a display area, and a non-display area between the opening area and the display area; A pixel array, the pixel array comprising a plurality of pixels located in the display area, each of the plurality of pixels comprising a pixel electrode, an opposing electrode facing the pixel electrode, and an intermediate layer between the pixel electrode and the opposing electrode; A plurality of data lines in the non-display area bypassing the opening area; a first insulating layer and a second insulating layer covering the plurality of data lines; a conductive layer between the first insulating layer and the second insulating layer; as well as a thin film encapsulation layer covering the pixel array, the thin film encapsulation layer comprising at least one organic encapsulation layer and at least one inorganic encapsulation layer, wherein a first groove defined in the first insulating layer, the conductive layer and the second insulating layer is located in the non-display area, The conductive layer includes a protruding portion extending further toward the central axis of the first groove than a point where a side surface of the first insulating layer and a bottom surface of the conductive layer intersect, and The at least one inorganic encapsulation layer is continuously formed without being disconnected to overlap the entire inner surface of the first groove and directly contact the bottom surface of the protruding portion. 2 . The display device of claim 1 , wherein the first groove overlaps the plurality of data lines. 3 . The display device of claim 1 , wherein a width of an open area of ​​the conductive layer corresponding to the first groove is smaller than a width of an open area of ​​the first insulating layer corresponding to the first groove. 4 . The display device of claim 1 , wherein at least one of the intermediate layer and the opposing electrode extends toward the opening region and is disconnected around the first groove. 5 . The display device of claim 1 , wherein a portion of the at least one organic encapsulation layer is located in the first groove. The display device of claim 1 , wherein the first groove surrounds the opening area in a plan view.

7. The display device according to claim 1, further comprising: include: a plurality of insulating layers disposed between the substrate and the first insulating layer; as well as A second trench is defined in the plurality of insulating layers and the substrate. 8 . The display device of claim 7 , wherein the second groove is between the opening area and the first groove, and surrounds the opening area. 9 . The display device of claim 7 , wherein the at least one organic encapsulation layer extends toward the opening area and is disconnected around the second groove.

10. The display device of claim 1, wherein the second insulating layer covers an edge of the pixel electrode.

11. A display device, include: a substrate, the substrate comprising an opening; a pixel array, the pixel array comprising a plurality of pixels located on the substrate and surrounding the opening, each of the plurality of pixels comprising a display element, the display element comprising a pixel electrode, an intermediate layer on the pixel electrode, and an opposite electrode on the intermediate layer; a plurality of data lines located between the opening and the pixel array, the plurality of data lines being detoured along edges of the opening; a plurality of layers disposed on the plurality of data lines, the plurality of layers having first grooves defined therein, and a thin film encapsulation layer covering the pixel array, the thin film encapsulation layer comprising a first inorganic encapsulation layer, a second inorganic encapsulation layer and an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer, wherein the multiple layers include a first insulating layer, a second insulating layer, and a conductive layer between the first insulating layer and the second insulating layer, The conductive layer includes a protruding portion extending further toward the central axis of the first groove than a point where a side surface of the first insulating layer and a bottom surface of the conductive layer intersect, and The first inorganic encapsulation layer is continuously formed without being disconnected to overlap the entire inner surface of the first groove and directly contact a bottom surface of the protruding portion. 12 . The display device of claim 11 , wherein at least one of the intermediate layer and the opposite electrode is disconnected around the first groove.

13. The display device according to claim 11, wherein the first grooves of the multilayer include: defining a first open region in the conductive layer; a second open region defined in the first insulating layer; as well as defining a third open region in the second insulating layer, The width of the first open area is smaller than the width of the second open area. The display device of claim 13 , wherein the conductive layer and the pixel electrode comprise the same material. 15 . The display device of claim 11 , wherein a portion of the organic encapsulation layer is located in the first groove. 16 . The display device of claim 11 , wherein the organic encapsulation layer extends toward the opening and is disconnected in a region between the opening and the first groove. 17 . The display device of claim 11 , further comprising a multi-insulating layer between the substrate and the multi-layer, and a second groove defined in the multi-insulating layer and the substrate. 18 . The display device of claim 17 , wherein the second groove is between the opening and the first groove and surrounds the opening.

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