Semiconductor laser heat sink

Abstract

The application discloses a kind of semiconductor laser heat dissipation device in the technical field of semiconductor laser, including water tank, the outer wall of water tank is provided with water inlet, water inlet, water outlet and drain, the inner chamber of water tank is connected with assembly sheet metal part, the inner chamber bottom wall of assembly sheet metal part is screwed with jet pump, the inner chamber bottom wall of assembly sheet metal part is screwed with heat dissipation module, heat dissipation module includes fin radiator, the air outlet of jet pump is in contact with the outer wall of fin radiator, the top wall of fin radiator is fixedly installed with water-cooling base plate, the inner chamber of water-cooling base plate is provided with water flow channel, the top wall inner chamber of water-cooling base plate is provided with semiconductor refrigerator, the top wall of water-cooling base plate is screwed with heat-conducting panel, the top wall of heat dissipation module is installed with laser module, the outer wall of laser module is screwed with M6 screw, one end of M6 screw is screwed with the top wall of fin radiator, the device effectively reduces the volume and noise of semiconductor laser generator heat dissipation device, small in size, easy to assemble and maintain.

Description

Technical Field

[0001] The invention discloses a semiconductor laser heat dissipation device, in particular to the technical field of semiconductor lasers. Background Art

[0002] After years of development, semiconductor lasers have been widely used in many fields closely related to human life, such as optical fiber communication, optoelectronic integration, optical disk storage, pump light source, atmospheric environment detection, trace toxic gas analysis and molecular spectroscopy, due to their small size, light weight, low voltage and high power. Some of these applications have continuously put forward higher requirements for the output power of semiconductor lasers. Generally speaking, increasing the ridge width and operating current of semiconductor lasers are the most direct ways to increase the output power, but at the same time, it will also lead to an increase in the temperature of the active region of the semiconductor laser during operation. The temperature of the semiconductor laser during operation has a significant impact on its threshold current density, slope efficiency and spectral stability. Overheating of the light-emitting area can cause damage to the cavity surface of the light-emitting area or even device degradation, ultimately causing device failure. Therefore, effective heat dissipation is required. Usually, effective means to improve the heat dissipation of semiconductor lasers mainly include using device reverse soldering, using high thermal conductivity materials as device insulation layers, using buried heterojunction structures, and using high thermal conductivity heat sink materials.

[0003] Existing technologies primarily use materials such as copper or aluminum nitride as heat sinks. Copper offers lower costs and is suitable for large-scale deployment, but its thermal conductivity still lags behind some high-thermal-conductivity materials. Aluminum nitride, a new high-thermal-conductivity material, has a linear expansion coefficient that matches that of semiconductor materials, but it is easily corroded by aqueous solutions. Furthermore, the preparation process for aluminum nitride single crystals is complex and extremely expensive. Furthermore, under laboratory testing conditions, auxiliary methods such as circulating cooling water or even liquid nitrogen can generally be used to dissipate heat from the laser. However, such heat sinks are often bulky and complex, making modularization and miniaturization difficult. Summary of the Invention

[0004] The object of the present invention is to provide a semiconductor laser heat dissipation device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solution: a semiconductor laser heat dissipation device, comprising a water tank, wherein the outer wall of the water tank is provided with a water filling port, a water supply inlet, a water supply outlet and a drain port, the inner cavity of the water tank is provided with a water pump, and the water outlet port of the water pump is connected to the water supply outlet, the inner cavity of the water tank is clamped with an assembly sheet metal part, the inner cavity bottom wall of the assembly sheet metal part is screwed with a jet pump, the inner cavity bottom wall of the assembly sheet metal part is screwed with a heat dissipation module, the heat dissipation module comprises a fin radiator, the air outlet of the jet pump is in contact with the outer wall of the fin radiator, and the bottom wall of the fin radiator is in contact with the inner cavity bottom wall of the assembly sheet metal part. The top wall of the fin heat sink is fixedly mounted with a water-cooled base plate, the inner cavity of the water-cooled base plate is provided with a water flow channel, the inner cavities at both ends of the water flow channel are clamped with pagoda interfaces, the water supply inlet and the water supply outlet are respectively connected to the pagoda interfaces through pipes, the top wall inner cavity of the water-cooled base plate is provided with a semiconductor refrigerator, the top wall of the water-cooled base plate is screwed with a heat-conducting panel, the hot and cold end faces of the semiconductor refrigerator are respectively in contact with the outer wall of the heat-conducting panel and the water-cooled base plate, the top wall of the heat dissipation module is mounted with a laser module, the outer wall of the laser module is screwed with an M screw, and one end of the M screw is screwed with the top wall of the fin heat sink.

[0006] Preferably, the inner cavity of the water injection port is provided with a filter screen.

[0007] Preferably, a water level gauge is provided on the front wall of the water tank.

[0008] Preferably, the outer wall of the heat-conducting panel is coated with a thermal grease or a thermal silica gel layer.

[0009] Preferably, an NTC temperature sensor is provided on the bottom wall of the heat-conducting panel.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] 1) This device is equipped with a heat conduction panel, a semiconductor cooler, a heat dissipation module, and a jet pump. When the laser module is working, the cold surface of the semiconductor cooler contacts the heat conduction panel at the bottom of the laser module. The heat generated by the laser module is exchanged with the cold surface of the semiconductor cooler through the heat conduction panel. The heat generated by the hot surface of the semiconductor cooler is dissipated by circulating water cooling and cooling fins through forced air cooling by the jet pump. The jet pump is used to blow air to cool the cooling fins and the cooling water path, effectively reducing the size and noise of the semiconductor laser generator heat dissipation device.

[0012] 2) The device is provided with assembly sheet metal parts and a water tank. The water tank is separated from the heat dissipation module by the sheet metal parts. The assembly sheet metal parts seal the bottom of the fin radiator to form an air duct, so that the airflow generated by the jet pump can effectively take away the heat generated by the heat dissipation module. The assembly sheet metal parts can concentrate the modules, reduce the volume, and facilitate assembly and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of a semiconductor laser heat sink according to the present invention;

[0014] Figure 2 This is a front view schematic diagram of the water tank of the present invention;

[0015] Figure 3 This is a schematic top view of the water tank of the present invention;

[0016] Figure 4 This is a schematic front view of the jet pump of the present invention;

[0017] Figure 5 This is a front view schematic diagram of the heat dissipation module of the present invention.

[0018] In the figure: 100 water tank, 110 water filling port, 120 water supply inlet, 130 water supply outlet, 140 water level gauge, 200 assembly sheet metal, 210 jet pump, 300 heat dissipation module, 310 fin heat sink, 320 water-cooled base plate, 321 water flow channel, 330 semiconductor cooler, 340 thermal conductive panel, 400 laser module, 410 M6 screws. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] The present invention provides a semiconductor laser heat sink, which effectively reduces the size and noise of the semiconductor laser generator heat sink. The modules are centralized, the size is reduced, and the assembly and maintenance are convenient. Figure 1 、 Figure 2 and Figure 3 , comprising a water tank 100, the outer wall of the water tank 100 is provided with a water filling port 110, a water supply inlet 120, a water supply outlet 130 and a drain port, the inner cavity of the water tank 100 is provided with a water pump, and the water outlet port of the water pump is connected to the water supply outlet 130, and the water inlet of the water pump is sunk into the bottom of the inner cavity of the water tank 100 through a pipe;

[0021] See also Figure 1 and Figure 4 The inner cavity of the water tank 100 is clamped with an assembly sheet metal 200, and the inner cavity bottom wall of the assembly sheet metal 200 is screwed with a jet pump 210. The assembly sheet metal 200 is used to carry the jet pump 210, and the jet pump 210 is used to blow away the heat generated by the heat dissipation module 300 by blowing air;

[0022] See also Figure 1 and Figure 5 The bottom wall of the inner cavity of the assembled sheet metal 200 is screwed with a heat dissipation module 300, and the heat dissipation module 300 includes a fin radiator 310. The air outlet of the jet pump 210 contacts the outer wall of the fin radiator 310, and the bottom wall of the fin radiator 310 contacts the bottom wall of the inner cavity of the assembled sheet metal 200. A water-cooled base plate 320 is fixedly installed on the top wall of the fin radiator 310. The inner cavity of the water-cooled base plate 320 is provided with a water flow channel 321. The inner cavities at both ends of the water flow channel 321 are both connected with pagoda interfaces. The water supply inlet 120 and the water supply outlet 130 are respectively connected to the pagoda interfaces through pipes. The inner cavity of the top wall of the water-cooled base plate 320 is provided with a semiconductor refrigerator 330. A heat-conducting panel 340 is screwed onto the top wall of the base plate 320. The hot and cold end surfaces of the semiconductor cooler 330 contact the heat-conducting panel 340 and the outer wall of the water-cooled base plate 329, respectively. The finned heat sink 310 is used to increase the heat dissipation area of ​​the heat dissipation module 300. The water-cooled base plate 320 is used to exchange heat with the hot end of the semiconductor cooler 330 and the finned heat sink 310 through the water flow channel 321. The cold end of the semiconductor cooler 330 is used to exchange heat with the heat-conducting panel 340. The heat-conducting panel 340 is used to increase the heat dissipation area of ​​the laser module 400. The heat-conducting panel 340 is used to exchange heat from the laser module 400 with the cold end of the semiconductor cooler 330.

[0023] See also Figure 1 The laser module 400 is mounted on the top wall of the heat dissipation module 300 , and the outer wall of the laser module 400 is screwed with an M6 screw 410 , and one end of the M6 ​​screw 410 is screwed with the top wall of the fin heat sink 310 ;

[0024] See also Figure 1 and Figure 2 , the inner cavity of the water injection port 110 is provided with a filter screen for filtering impurities in the injected water;

[0025] See also Figure 2 , the front wall of the water tank 100 is provided with a water level gauge 140 to indicate the water level. There is a red buoy inside, which is connected to the water tank 100. When the water level of the water tank 100 is higher than the interface level, water will flow into the water level gauge 140, and the buoy in the water level gauge 140 can reflect the water filling situation of the water tank;

[0026] The outer wall of the heat-conducting panel 340 is coated with a thermal grease or a thermal silica gel layer to increase the effective heat-conducting area of ​​the heat-conducting panel 340;

[0027] An NTC temperature sensor is installed on the bottom wall of the heat-conducting panel 340 to monitor temperature changes. This sensor also provides feedback for the temperature control of the semiconductor cooler 330. The semiconductor cooler 330 controls the temperature by supplying power to the semiconductor cooler 330 based on the set temperature and the monitored temperature to ensure a stable temperature of the heat-conducting panel 340.

[0028] Although the present invention has been described above with reference to certain embodiments, various modifications may be made thereto and components may be replaced with equivalent components without departing from the scope of the present invention. In particular, as long as there are no structural conflicts, the various features of the various embodiments disclosed herein may be combined with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is solely for the sake of space and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions within the scope of the claims.

Claims

1. A semiconductor laser heat sink, characterized in that: The invention comprises a water tank (100), wherein the outer wall of the water tank (100) is provided with a water filling port (110), a water supply inlet (120), a water supply outlet (130) and a drain port; the inner cavity of the water tank (100) is provided with a water pump, and the water outlet port of the water pump is connected to the water supply outlet (130); the inner cavity of the water tank (100) is clamped with an assembly sheet metal part (200); the inner cavity bottom wall of the assembly sheet metal part (200) is screwed with a jet pump (210); the assembly sheet metal part (200) is provided with a water pump (110); the inner cavity bottom wall of the assembly sheet metal part (200) is screwed with a jet pump (210); the inner cavity bottom wall of the assembly sheet metal part (200) is provided with a water pump (1 ... The bottom wall of the inner cavity is screwed with a heat dissipation module (300), the heat dissipation module (300) includes a finned heat sink (310), the air outlet of the jet pump (210) contacts the outer wall of the finned heat sink (310), the bottom wall of the finned heat sink (310) contacts the bottom wall of the inner cavity of the assembly sheet metal (200), the water tank is separated from the heat dissipation module by the sheet metal, and the assembly sheet metal seals the bottom of the finned heat sink to form an air duct, so that the airflow generated by the jet pump effectively removes the heat generated by the heat dissipation module; A water-cooling base plate (320) is fixedly mounted on the top wall of the finned heat sink (310), a water flow channel (321) is provided in the inner cavity of the water-cooling base plate (320), and pagoda interfaces are clamped at the inner cavities at both ends of the water flow channel (321), the water supply inlet (120) and the water supply outlet (130) are respectively connected to the pagoda interfaces via pipes, a semiconductor cooler (330) is provided in the inner cavity of the top wall of the water-cooling base plate (320), and a heat conducting Panel (340), the hot and cold end surfaces of the semiconductor cooler (330) are in contact with the outer wall of the heat-conducting panel (340) and the water-cooling base plate (329) respectively, the cold surface of the semiconductor cooler is in contact with the heat-conducting panel at the bottom of the laser module, the heat generated by the laser module is exchanged with the cold surface of the semiconductor cooler through the heat-conducting panel, the heat generated by the hot surface of the semiconductor cooler is dissipated by circulating water cooling and cooling fins through jet pump forced air cooling, and the jet pump is used to blow air to cool the cooling fins and the cooling water channel; The outer wall of the heat-conducting panel (340) is coated with a heat-conducting silicone grease or a heat-conducting silica gel layer, which is used to increase the effective heat-conducting area of ​​the heat-conducting panel 340; A laser module (400) is mounted on the top wall of the heat dissipation module (300), an M6 screw (410) is screwed onto the outer wall of the laser module (400), and one end of the M6 ​​screw (410) is screwed onto the top wall of the fin heat sink (310); The inner cavity of the water injection port (110) is provided with a filter screen.

2. A semiconductor laser heat sink according to claim 1, characterized in that: A water level gauge (140) is provided on the front wall of the water tank (100).

3. The semiconductor laser heat dissipation device according to claim 1, characterized in that: The bottom wall of the heat-conducting panel (340) is provided with an NTC temperature sensor.

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