A standard flexible packaging structure for components and its manufacturing process

Abstract

The present invention relates to a standard flexible packaging structure for components and a manufacturing process thereof, and belongs to the field of flexible electronic technology. The standard flexible packaging structure for components of the present invention comprises a hard device and a flexible packaging body, wherein the hard device is wrapped or supported by the flexible packaging body, a flexible lead is provided between the hard device and the flexible packaging body, an extended interface pad is provided on the surface of the flexible packaging body, a hard device interface pad is provided on the surface of the hard device, and a flexible lead connects the extended interface pad and the hard device interface pad. The packaging structure is simple to manufacture and has strong designability, and can make hard components flexible through the flexible packaging method of the present invention, thereby meeting the demand for components in flexible electronics.

Description

Technical Field

[0001] The invention relates to a component standard flexible packaging structure and a manufacturing process thereof, belonging to the technical field of flexible electronics. Background Art

[0002] As one of the ten greatest inventions in the world in the early 20th century, flexible electronics, with its lightness, bendability, strong human-computer interaction and other characteristics, has shown great advantages in new fields such as wearable devices, AI, Internet of Things, and human information detection, and has greatly promoted the development of new fields. In addition, with the end of Moore's Law, people's desire for new technological experiences has not diminished, which makes flexible electronics a major innovation point after Moore's Law, a new outlet for human technological revolution, and has been focused on by countless companies and users.

[0003] However, with the continuous rise of flexible technology, display screens and mechanical casings have been made flexible, but many devices in electronic circuits are still facing the bottleneck of being difficult to make flexible. On the one hand, flexible devices with the same function are difficult to reach the performance level of rigid devices. On the other hand, many devices have not yet found ways to make them flexible. These problems have hindered the development of flexible electronics to a certain extent. Summary of the invention

[0004] The purpose of the present invention is to overcome the above-mentioned defects of the prior art and provide a standard flexible packaging structure for components and a manufacturing process thereof. The packaging structure is simple to manufacture and has strong designability. Hard components can be made flexible through the flexible packaging method of the present invention, thereby meeting the needs of flexible electronics for components.

[0005] The present invention is achieved by adopting the following technical solutions:

[0006] A standard flexible packaging structure for components includes a hard device and a flexible packaging body, wherein the hard device is wrapped or supported by the flexible packaging body, a flexible lead is arranged between the hard device and the flexible packaging body, an extended interface pad is arranged on the surface of the flexible packaging body, a hard device interface pad is arranged on the surface of the hard device, and the flexible lead connects the extended interface pad and the hard device interface pad.

[0007] Furthermore, a lead interface pad is provided on the surface of the flexible package, and the lead interface pad and the hard device interface pad are connected by an enhanced adhesion layer. The starting point of one end of the flexible lead is the lead interface pad, so that the hard device interface pad can be expanded and moved according to the specific needs of the subsequent electronic circuit, thereby realizing the change and enrichment of the interface pad mode.

[0008] Furthermore, the flexible package is composed of two or more flexible basic units.

[0009] Furthermore, the expansion interface pad is located on the outer surface of the flexible package.

[0010] Furthermore, the flexible lead is adhered and fixed to the flexible package, and is built-in or externally surfaced. The flexible lead is made of a flexible material with good electrical conductivity, and can be a metal, compound, liquid metal, etc. with tensile toughness. For materials with poor stretchability, in order to meet their flexibility requirements, the material can be made into a serpentine line, and the redundancy of the lead can be increased in an appropriate space to enhance its stretchability.

[0011] Furthermore, the flexible lead is manufactured by a physical method such as sputtering, evaporation or spin coating of a metal or conductive paste, or by a chemical deposition method of a compound conductor lead, and the thickness of the flexible lead is 5-50 nm.

[0012] Furthermore, the lead interface pad is manufactured by a physical method of sputtering, evaporation or spin coating to form a metal or conductive paste pad, or by a chemical deposition method to form a compound conductive pad, and the lead interface pad has a pad thickness of 5-50 nm.

[0013] Furthermore, the enhanced adhesion layer is manufactured by a physical method such as sputtering, evaporation or spin coating to form an adhesion layer of a high-adhesion metal or conductive paste, or by a chemical deposition method to form a compound adhesion layer, and the thickness of the adhesion layer is 50-200 nm.

[0014] Furthermore, the extended interface pad is manufactured by a physical method of sputtering, evaporation or spin coating of a metal or conductive paste pad, or by a chemical deposition method of a compound conductive pad, and the thickness of the extended interface pad is 50-500nm.

[0015] A process for manufacturing the above-mentioned standard flexible packaging structure of components comprises the following steps:

[0016] (1) Establish standard dimensions for flexible device packaging

[0017] According to the size requirements, the standard size after flexible packaging is established. In fact, it is to determine the size of the flexible package, because the hard device is encapsulated inside or on the surface of the flexible package, and the external connection is also connected through the expansion interface on the flexible body. The mold can be made or the size scale can be used for marking and recording.

[0018] (2) Determine the routing pattern of the leads and the positions of the internal and external pads

[0019] Determine and plan the routing of the leads connecting the hard device interface and the extended interface, and determine the location of the solder pad at the interface based on the hard device interface and the extended interface requirements determined by actual needs. And manufacture the mask for the later manufacture of leads and pads.

[0020] (3) Constructing flexible basic units

[0021] The flexible package is composed of two or more flexible basic units. For the manufacture of the flexible basic unit, the mold and the hard device to be packaged can be combined to construct the structure of the entire flexible package, and then the entire flexible package can be cut into flexible basic units. Dispersed flexible basic units can also be constructed according to standard sizes and lead positions. Flexible polymer materials such as PDMS can be used for production.

[0022] (4) Lead manufacturing

[0023] The leads are manufactured on the flexible unit according to the determined routing form. The leads of metal or conductive paste can be manufactured by physical methods such as sputtering, evaporation, spin coating, etc., or compound conductor leads can be manufactured by chemical deposition and other methods, with a thickness of 5-50nm.

[0024] (5) Constituent part of the flexible package

[0025] The dispersed flexible units with flexible leads are partially bonded to form a phased product of a flexible package with flexible leads. At this time, the flexible package is only partially assembled, and the hard device is not encapsulated. Bonding can be achieved by physical methods such as heating, pressing, gluing, or chemical methods such as catalysis and growth promotion.

[0026] (6) Lead interface pad manufacturing

[0027] The pads are manufactured at the positions of the lead interface pads determined in the above steps (1) and (2). The pads of metal or conductive paste can be manufactured by physical methods such as sputtering, evaporation, spin coating, etc., or compound conductive pads can be manufactured by chemical deposition and other methods, with a thickness of 5-50nm.

[0028] (7) Enhanced Adhesion Layer Manufacturing

[0029] The enhanced adhesion layer is manufactured on the pad. The enhanced adhesion layer of high-adhesion metal or conductive paste can be manufactured by physical methods such as sputtering, evaporation, spin coating, etc., or the enhanced adhesion layer of compound can be manufactured by chemical deposition and other methods, with a thickness of 50-200nm.

[0030] (8) Bonding of hard devices and lead interface pads

[0031] The adhesion of the enhanced adhesive layer is used to bond the hard device interface pad and the lead interface pad. The bonding can be performed by heating, pressing, compound reaction, etc.

[0032] (9) Single integrated combination of rigid devices and flexible packaging

[0033] The dispersed flexible units or even part of the flexible package are bonded together to form a single integrated combination of the hard device and the flexible package. The single integrated combination can be achieved by physical methods such as heating, pressing, gluing, or by chemical methods such as catalysis and growth promotion.

[0034] (10) External expansion interface pad manufacturing

[0035] According to the determined position of the external expansion interface pad, the external expansion interface pad is manufactured. The pad of metal or conductive paste can be manufactured by physical methods such as sputtering, evaporation, spin coating, etc., or compound conductive pad can be manufactured by chemical deposition, etc., with a thickness of 50-500nm.

[0036] The beneficial effects of the present invention are:

[0037] The flexible packaging method of the present invention can make rigid components flexible, realize the expansion of interface pads of rigid components and the change of interface pad mode, and meet the needs of flexible electronics for components; and the flexible components can be set to international size standards to meet certain international standard sizes; while realizing the flexibility of rigid components, the pins can be expanded, the device pin arrangement method can be changed, etc., and flexible packaging design can be carried out according to the specific needs of flexible electronics for different devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic diagram of the flexible structure encapsulated inside the flexible encapsulation body;

[0039] Figure 2 is a schematic diagram of a flexible structure for external packaging of a flexible packaging body;

[0040] Figure 3 A schematic diagram of a basic unit of a flexible package with flexible leads;

[0041] Figure 4 Schematic diagram of part of the flexible package.

[0042] Description of reference numerals:

[0043] 1 flexible package; 11 flexible package basic unit; 2 hard device; 31 lead interface pad; 41 enhanced adhesion layer; 51 extended interface pad; 61 flexible lead; 71 hard device interface pad. DETAILED DESCRIPTION

[0044] The present invention will be further described below in conjunction with the accompanying drawings.

[0045] Embodiment 1

[0046] The standard flexible packaging structure of components of the present invention includes a hard device 2 and a flexible packaging body 1, the hard device 2 is wrapped or supported by the flexible packaging body 1, a flexible lead 61 is provided between the hard device 2 and the flexible packaging body 1, an extended interface pad 51 is provided on the surface of the flexible packaging body 1, a hard device interface pad 71 is provided on the surface of the hard device 2, the flexible lead 61 connects the extended interface pad 51 and the hard device interface pad 71, a lead interface pad 31 is provided on the surface of the flexible packaging body 1, the lead interface pad 31 and the hard device interface pad 71 are connected by an enhanced adhesion layer 41, the starting point of one end of the flexible lead 61 is the lead interface pad 31, and the other end of the flexible lead 61 is connected to the extended interface pad 51 on the outer surface of the flexible packaging body 1, so that the hard device interface pad 71 can be expanded and the interface pad can be moved according to the specific needs of the subsequent electronic circuit, so as to realize the change and enrichment of the interface pad mode.

[0047] The enhanced adhesion layer 41 is located between the lead interface pad 31 and the hard device interface pad 71 of the flexible package 1, and plays a role in connection and signal transmission. The lead interface pad 31 and the hard device interface pad 71 are tightly connected by bonding or spin coating with a highly adhesive conductive metal or a highly adhesive conductive colloid, thereby ensuring the reliability of the package and the integrity of the signal transmission.

[0048] The entire flexible package 1 is in a solid state or a hollow state. The solid state is that the hard device 2 is encapsulated in the upper part as shown in FIG. 2 , and the hollow state is that the hard device 2 is encapsulated in the inner part as shown in FIG. Figure 1 As shown, the size and shape of the hollow space are determined according to the size and shape of the hard device 2. When the flexible package 1 encapsulates the hard device 2, the air filling state inside is kept as small as possible to prevent the hard device 2 from sliding too much relative to each other. The hard device 2 is combined with the flexible package 1, and the size of the packaging layer can be designed according to the device standard of actual needs, so that the encapsulated flexible device can meet the standard size requirements and is convenient for subsequent use.

[0049] The flexible package 1 is generally made of a material with flexible properties, which can be deformed under stress and can disappear after the stress is removed. The flexible material can have some functions, such as acid and alkali corrosion resistance, electromagnetic interference resistance, light weight, and even transparent color. The flexible package 1 can be specially processed according to actual needs, or flexible materials with specific functions can be added inside or outside the material body according to special needs. All the above-mentioned materials are contained in a flexible package 1, which plays the function of the flexible package 1 described in the present invention.

[0050] Embodiment 2

[0051] In this embodiment, a dual-interface SML-D22MUW LED chip is flexibly packaged, and an extended interface is extended to achieve a flexible device with 4 extended interfaces and 2012 standard size.

[0052] The standard flexible packaging structure of components of the present embodiment includes a hollow flexible packaging body 1, an enhanced adhesive layer 41, a flexible lead 61, a lead interface pad 31 and an extended interface pad 51, as shown in the schematic diagram. Figure 1 As shown. In general, the hard device 2 is wrapped by the flexible package 1, and a certain number of flexible leads 61 are distributed inside the flexible package 1. The flexible leads 61 are fixed on the flexible substrate. Further, the hard device 2 and the flexible package 1 are connected together. The surface of the flexible package 1 is provided with a lead interface pad 31. The lead interface pad 31 and the hard device interface pad 71 are connected through the enhanced adhesive layer 41. One end of the flexible lead 61 is connected to the lead interface pad 31, and the other end of the flexible lead 61 is connected to the extended interface pad 51 on the outer surface of the flexible package 1.

[0053] Among them, the flexible package body 1 is made of PDMS material, the enhanced adhesion layer 41 is made of SX-9313 two-component strong copper powder conductive glue, the flexible lead 61 is made by physically depositing serpentine copper wire, the lead interface pad 31 is made by physically depositing titanium metal, and the expansion port pad is made by physically depositing titanium metal.

[0054] First, according to the design requirements, a 2012-size template is manufactured to determine the location of the hard device interface and the expansion interface, the routing method of the leads and the location of the internal and external pads, and a mask is manufactured for the subsequent manufacture of leads and pads.

[0055] Further, the liquid PDMS mixture is injected into the template to cover the bottom of the template, and the package is left to solidify. The bottom of the package is manufactured, and a proportional model of the hard device 2 is placed, and the PDMS liquid is introduced to fill the mold, and it is left to solidify. The flexible package 1 material is cut to be divided into 8 flexible basic units 11. Further, a mask made according to a specific shape is used to cover the flexible basic unit 11, and copper metal is used for magnetron sputtering to manufacture the flexible lead 61, with a thickness of 20nm, as shown in FIG. Figure 3 Further, the partially dispersed flexible units with flexible leads 61 are heat-pressed and bonded to form a partially flexible package 1 with flexible leads 61, as shown in FIG. Figure 4As shown. Further, using the prepared mask, the interface pads of part of the flexible package 1 are manufactured by physically depositing titanium metal, with a thickness of 50nm. Further, the enhanced adhesion layer 41 is manufactured by using SX-9313 two-component strong copper powder conductive glue, with a thickness of 200nm. Further, the dispersed flexible package 1 is bonded to the hard device 2 in a single integrated manner to form a combination of the hard device 2 and the flexible package 1. Further, using the prepared mask, the extended interface pad 51 is manufactured on the surface of the single integrated flexible package 1 by physically depositing titanium metal, with a thickness of 500nm.

[0056] Embodiment 3

[0057] This embodiment uses an LTCC ceramic microwave filter chip to flexibly package a four-interface LTCC chip, and expands the extended interface to achieve a 3216 standard size flexible device and achieve an extended interface position that meets the flexible packaging requirements.

[0058] The flexible package body 1 of this embodiment is in a solid state, and the hard component 2 is located on the surface of the flexible package body 1, as shown in the schematic diagram. Figure 2 As shown. The structure includes a flexible package 1, an enhanced adhesive layer 41, a flexible lead 61, a lead interface pad 31 and an extended interface pad 51. In general, the hard device is supported by the flexible package 1, and a certain flexible lead 61 is distributed on the upper layer of the flexible package 1. The flexible lead 61 is fixed on the flexible substrate. Further, the hard device 2 and the flexible package 1 are connected together. The surface of the flexible package 1 is provided with a lead interface pad 31, and the lead interface pad 31 and the hard device interface pad 71 are connected through the enhanced adhesive layer 41. One end of the flexible lead 61 is connected to the lead interface pad 31, and the other end of the flexible lead 61 is connected to the extended interface pad 51 on the outer surface of the flexible package 1, and the extended interface pad 51 is located on the lower surface of the flexible package 1.

[0059] Among them, the flexible package 1 is made of PI material, the enhanced adhesion layer 41 is made of a mixed solution of graphene and a tackifier, the flexible lead 61 is made by physically depositing a 50 ohm matching gold wire, the lead interface pad 31 is made by physically depositing titanium metal, and the extension port pad is made by physically depositing titanium metal.

[0060] First, according to the design requirements, a 3216-size template is manufactured, the positions of the hard device interface and the expansion interface are determined, and the leads with 50-ohm impedance matching are designed to facilitate the transmission of microwave signals. The routing method of the leads and the positions of the internal and external pads are determined, and a mask is manufactured for the subsequent manufacture of leads and pads.

[0061] Further, the template is filled with liquid PI liquid, and the package is left to solidify, completing the manufacture of the flexible package 1. The flexible package 1 material is cut to be divided into 6 flexible basic units 11. Further, a mask made in a specific shape is used to cover the flexible basic unit 11, and gold metal is used for magnetron sputtering to manufacture the flexible lead 61, with a thickness of 50nm, such as Figure 3 Further, the partially dispersed flexible units with flexible leads 61 are heat-pressed and bonded to form a partially flexible package 1 with flexible leads 61, as shown in FIG. Figure 4 As shown. Further, using the prepared mask, the interface pads of part of the flexible package 1 are manufactured by physically depositing titanium metal, with a thickness of 20nm. Further, the enhanced adhesion layer 41 is manufactured by using a mixed solution of graphene and a tackifier, with a thickness of 200nm. Further, the flexible package 1 is bonded to the hard device 2 to form a combination of the hard device 2 and the flexible package 1.

[0062] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A standard flexible packaging structure for components, characterized in that: The invention comprises a hard device and a flexible package, wherein the hard device is wrapped or supported by the flexible package, a flexible lead is arranged between the hard device and the flexible package, the flexible lead is fixed on the flexible package, an extension interface pad is arranged on the surface of the flexible package, a hard device interface pad is arranged on the surface of the hard device, the flexible lead connects the extension interface pad and the hard device interface pad, a lead interface pad is arranged on the surface of the flexible package, and the lead interface pad and the hard device interface pad are connected through an enhanced adhesion layer. The starting point of one end of the flexible lead is the lead interface pad. The enhanced adhesion layer is manufactured by a physical method of sputtering, evaporation or spin coating to form an adhesion layer of a high-adhesion metal or conductive paste, or by a chemical deposition method to form a compound adhesion layer, and the thickness of the adhesion layer is 50-200nm. The lead interface pad is manufactured by a physical method of sputtering, evaporation or spin coating to form a pad of a metal or conductive paste, or by a chemical deposition method to form a compound conductive pad, and the pad thickness of the lead interface pad is 5-50nm.

2. The component standard flexible packaging structure according to claim 1, characterized in that: The flexible package is composed of two or more flexible basic units.

3. The component standard flexible packaging structure according to claim 1, characterized in that: The expansion interface pad is located on the outer surface of the flexible package body.

4. The component standard flexible packaging structure according to claim 1, characterized in that: The flexible lead is adhered and fixed to the flexible packaging body, and is of built-in type or external surface type.

5. The component standard flexible packaging structure according to claim 1, characterized in that: The flexible lead is manufactured by a physical method such as sputtering, evaporation or spin coating to form a metal or conductive paste lead, or by a chemical deposition method to form a compound conductor lead. The thickness of the flexible lead is 5-50 nm.

6. The component standard flexible packaging structure according to claim 1, characterized in that: The extended interface pad is manufactured by a physical method such as sputtering, evaporation or spin coating to form a metal or conductive paste pad, or by a chemical deposition method to form a compound conductive pad. The extended interface pad has a thickness of 50-500 nm.

7. A process for manufacturing a standard flexible packaging structure for components as claimed in any one of claims 1 to 6, characterized in that it comprises the following steps: (1) Establish the standard size of the device after flexible packaging; (2) Determine the routing pattern of the leads and the location of the internal and external pads; (3) Construct the flexible basic unit; (4) Lead manufacturing; (5) Construct part of the flexible package; (6) Lead interface pad manufacturing; (7) Enhanced adhesion layer manufacturing; (8) Bonding of hard devices and lead interface pads; (9) Single integrated combination of hard devices and flexible package; (10) External expansion interface pad manufacturing.

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