A new type of heat dissipation device

Abstract

The present invention provides a novel heat dissipation device, including a mainboard and a heat dissipation fan, wherein the heat dissipation device includes: a heat sink, which is arranged on the mainboard and is in close contact with one end of the exhaust port of the heat dissipation fan; the heat dissipation device includes: a trough body, which is used to accommodate the heating element arranged on the mainboard; heat dissipation fins, which are distributed inside the heat dissipation device and are located on both sides of the trough body; and an exhaust and heat dissipation channel is formed between the inside of the heat dissipation device and the exhaust port of the heat dissipation fan. The beneficial effect of the technical solution is that other heating elements are placed in the heat dissipation device, the space in the heat dissipation device is fully utilized, and the fan is used to dissipate heat to the heat dissipation device and the heating element in the middle at the same time, thereby increasing the utilization rate of the fan, improving the heat dissipation efficiency, and effectively utilizing the space.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of equipment and devices, and in particular to a novel heat dissipation device. Background Art

[0002] With the development of society, people have higher and higher requirements for electronic products, and small size and low price have become a trend. Usually, there are heating components in electronic products. The smaller the size of the product, the higher the requirement for heat dissipation of internal components. The existing heat dissipation method is mainly to set a heat dissipation fan on the circuit board, and form air heat exchange through the work of the heat dissipation fan, thereby cooling the high temperature inside the device. However, this cooling method is not very effective, especially for centrally placed heating components. Therefore, how to provide an effective heat dissipation method for the heating components and improve the utilization efficiency of the heat dissipation fan is a problem that needs to be solved urgently. Summary of the invention

[0003] In view of the above-mentioned problems existing in the prior art in heat dissipation of heating elements on a device mainboard, a new heat dissipation device is now provided to improve the utilization efficiency of a fan and the overall heat dissipation efficiency.

[0004] The specific technical solutions are as follows:

[0005] A novel heat dissipation device includes a mainboard and a heat dissipation fan, including:

[0006] A heat sink is arranged on the mainboard and is in close contact with one end of the exhaust port of the heat dissipation fan;

[0007] The radiator comprises:

[0008] The slot body is used to accommodate the heating element arranged on the main board;

[0009] Heat dissipation fins are distributed inside the heat sink and located on both sides of the tank body;

[0010] An exhaust and heat dissipation channel is formed between the interior of the radiator and the exhaust port of the heat dissipation fan.

[0011] Preferably, the radiator is mainly composed of bilaterally symmetrical heat dissipation units.

[0012] Preferably, a pair of the heat dissipation units are fixedly connected via a connecting component.

[0013] Preferably, the radiator is provided with a fixing position corresponding to the setting position of the heat dissipation fan, and the heat dissipation fan is arranged at the fixing position by a fastening structure.

[0014] Preferably, a sliding groove is provided on the top of the radiator in the horizontal direction, and the connecting component is provided with a sliding block matching the sliding groove, and a sliding fixation is formed between the sliding block and the sliding groove.

[0015] Preferably, the heat dissipation unit is relatively provided with a groove, and a hook-shaped structure is provided inside the end of the groove;

[0016] A pair of the grooves constitute the sliding slot structure;

[0017] The slider structure comprises a fixing bar arranged in a vertical direction and a fixing plate arranged in a horizontal direction, and a clamping structure which is reversely matched with the groove is arranged at the end of the fixing plate.

[0018] Preferably, the heat dissipation fins are regularly arranged from top to bottom.

[0019] Preferably, the radiator is respectively provided with a fixing hole one at the four corners, the heat dissipation fan is provided with a fixing hole two corresponding to the fixing hole one at the four corners, and the fixing hole one and the fixing hole two are fixed by threads.

[0020] Preferably, the outer side wall of the radiator is in close contact with a row of heating components arranged on the mainboard.

[0021] Preferably, the cross-sectional area of ​​the air inlet and outlet of the heat dissipation fan is less than or equal to the cross-sectional area of ​​one end of the radiator.

[0022] The above technical solution has the following advantages or beneficial effects: other heating elements are placed in the radiator to fully utilize the space in the radiator, and the fan is used to dissipate heat from the radiator and the heating elements in the middle at the same time, thereby increasing the utilization rate of the fan, improving the heat dissipation efficiency, and effectively utilizing the space. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The embodiments of the present invention will be described more fully with reference to the attached drawings, which are provided for illustration and description only and are not intended to limit the scope of the present invention.

[0024] Figure 1 This is a schematic diagram of the exploded structure of a novel heat dissipation device embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the exploded structure of a novel heat dissipation device embodiment of the present invention;

[0026] Figure 3 The exploded structure diagram of a novel heat dissipation device embodiment of the present invention.

[0027] The above-mentioned reference numerals represent:

[0028] 1. Main board; 2. Radiator; 3. Heating element; 4. Cooling fan; 21. Tank body; 22. Fins; Cooling unit (23, 24); 25. Sliding slot; 26. Fixing position; 27. Connecting parts. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0031] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0032] The present invention comprises a novel heat dissipation device.

[0033] like Figures 1 to 3 As shown, a novel heat dissipation device includes a mainboard 1 and a heat dissipation fan 4, which includes:

[0034] The heat sink 2 is arranged on the main board 1 and is in close contact with one end of the exhaust port of the heat dissipation fan 4;

[0035] Radiator 2 includes:

[0036] The slot 21 is used to accommodate the heating element 3 disposed on the main board 1;

[0037] The heat dissipation fins 22 are distributed inside the heat sink 2 and located on both sides of the tank body 21;

[0038] An exhaust and heat dissipation channel is formed between the interior of the radiator 2 and the exhaust port of the heat dissipation fan 4 .

[0039] In the above technical solution, by placing other heating elements 3 in the radiator 2, the space between the two radiators 2 is fully utilized, and the fan is used to dissipate heat from the radiator 2 and the heating element 3 in the middle at the same time. When working, the fan rotates, and the air on one side forms a negative pressure. Since one side of the radiator 2 is in close contact with the end face of one side of the fan, the cold air enters from the end hole of the radiator 2 through the action of the fan, passes through the heating element 3 arranged in the middle of the radiator 2, and is discharged from the other side of the radiator 2, taking away the heat on the radiator 2 while also taking away the heat of the heating element 3 arranged in the middle of the radiator 2, thereby improving the heat dissipation efficiency and effectively utilizing the space.

[0040] In a preferred embodiment, the radiator 2 is mainly composed of bilaterally symmetrical heat dissipation units (23, 24).

[0041] In a preferred embodiment, a pair of heat dissipation units (23, 24) are fixedly connected by a connecting component 27.

[0042] In a preferred embodiment, the radiator 2 is provided with a fixing position 26 corresponding to the setting position of the heat dissipation fan 4, and the heat dissipation fan 4 is arranged at the fixing position 26 by a fastening structure.

[0043] In a preferred embodiment, a sliding groove 25 is provided on the top of the radiator 2 in the horizontal direction, and a sliding block matching the sliding groove 25 is provided on the connecting component 27 , so that a sliding fixation is formed between the sliding block and the sliding groove 25 .

[0044] In a preferred embodiment, the heat dissipation units (23, 24) are provided with grooves opposite to each other, and a hook-shaped structure is provided inside the end of the groove;

[0045] A pair of grooves constitutes a sliding groove 25 structure;

[0046] The slider structure (not shown in the figure) includes a fixing bar arranged in the vertical direction and a fixing plate arranged in the horizontal direction, and a locking structure with reverse matching of grooves is arranged at the end of the fixing plate.

[0047] In the above technical solution, the heat dissipation units (23, 24) can be made of metal materials, such as aluminum, alloy materials, etc., and corresponding fixing fits are arranged between the bottom of the heat dissipation units (23, 24) and the mainboard 1, such as screw thread fixing fits, and no specific restrictions are made here.

[0048] In a preferred embodiment, the heat dissipation fins 22 are regularly arranged from top to bottom.

[0049] In a preferred embodiment, the radiator 2 is provided with fixing holes 1 at four corners, and the heat dissipation fan 4 is provided with fixing holes 2 corresponding to the fixing holes 1 at four corners, and the fixing holes 1 and 2 are fixed by threads.

[0050] In a preferred embodiment, the outer wall of the heat sink 2 is in close contact with a row of heating components disposed on the mainboard 1 .

[0051] In a preferred embodiment, the cross-sectional area of ​​the air inlet and outlet of the heat dissipation fan 4 is smaller than or equal to the cross-sectional area of ​​one end of the radiator 2 .

[0052] In the above technical solution, other heating elements 3 are placed between the two mutually combined heat dissipation units (23, 24), and the space between the two heat dissipation units (23, 24) is fully utilized. The fan is used to dissipate heat from the radiator 2 and the intermediate heating element 3 at the same time, thereby increasing the utilization rate of the fan, improving the heat dissipation efficiency, and effectively utilizing the space.

[0053] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A novel heat dissipation device, comprising a mainboard and a heat dissipation fan, characterized in that: include: A heat sink is arranged on the mainboard and is in close contact with one end of the exhaust port of the heat dissipation fan; The radiator comprises: The slot body is used to accommodate the heating element arranged on the main board; Heat dissipation fins are distributed inside the heat sink and located on both sides of the tank body; An exhaust and heat dissipation channel is formed between the interior of the radiator and the exhaust port of the heat dissipation fan; The radiator is mainly composed of bilaterally symmetrical heat dissipation units, a pair of the heat dissipation units are fixedly connected by connecting components, a sliding groove is arranged on the top of the radiator in the horizontal direction, the connecting component is provided with a slider matching the sliding groove, a sliding fixation is formed between the slider and the sliding groove, and a space is enclosed in the middle of the heat dissipation unit for arranging the heating element.

2. The novel heat dissipation device according to claim 1 is characterized in that: The radiator is provided with a fixing position corresponding to the setting position of the heat dissipation fan, and the heat dissipation fan is arranged at the fixing position through a fastening structure.

3. The novel heat dissipation device according to claim 1 is characterized in that: The heat dissipation unit is relatively provided with a groove, and a hook-shaped structure is provided inside the end of the groove; A pair of the grooves constitute the sliding slot structure; The slider structure comprises a fixing bar arranged in a vertical direction and a fixing plate arranged in a horizontal direction, and a clamping structure which is reversely matched with the groove is arranged at the end of the fixing plate.

4. The novel heat dissipation device according to claim 1 is characterized in that: The heat dissipation fins are regularly arranged from top to bottom.

5. The novel heat dissipation device according to claim 2 is characterized in that: The radiator is respectively provided with fixing holes one at the four corners, and the heat dissipation fan is provided with fixing holes two corresponding to the fixing holes one at the four corners, and the fixing holes one and two are fixed by threads.

6. The novel heat dissipation device according to claim 1 is characterized in that: The outer side wall of the radiator is in close contact with a row of heating components arranged on the mainboard.

7. The novel heat dissipation device according to claim 1 is characterized in that: The cross-sectional area of ​​the air inlet and outlet of the heat dissipation fan is smaller than or equal to the cross-sectional area of ​​one end of the radiator.

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