A heat dissipation device

Abstract

The present invention provides a heat dissipation device, which is arranged on a mainboard, and includes: a heat dissipation fan, which is arranged on the mainboard; a heat sink, which is arranged on the mainboard and one side of which is in contact with the heating device on the mainboard, and the heat sink is respectively arranged at the air inlet and the air outlet of the fan, so that a heat dissipation and exhaust passage is formed between the heat sink and the heat dissipation fan. The beneficial effect of the technical solution is that, through the rotation of the heat dissipation fan, the air on one side forms a negative pressure, and because the end face of the radiator is in close contact with the inlet and outlet faces of the fan, the cold air enters from the end face hole of the radiator on one side, passes through the fan, and is discharged through the radiator on the other side, taking away the heat conducted to the radiator by the heating element, thereby improving the heat dissipation efficiency and effectively utilizing the space.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation device. Background Art

[0002] With the development of society, people have higher and higher requirements for electronic products, and small size and low price have become the trend. Usually, there are heating components in electronic products. The smaller the product size, the higher the requirement for heat dissipation of internal components. The existing technology basically fixes the cooling fan on one side of the radiator. Figure 1 As shown, the disadvantages of this method are: the utilization rate of the cooling fan is low, the cooling efficiency is not high, the product volume is large, and the increase in the number of radiators is not proportional to the cooling effect. The irregular arrangement will affect the cooling effect of the entire cooling device. Summary of the invention

[0003] Aiming at the problems of low heat dissipation efficiency and low utilization rate of heat dissipation fans in existing heat dissipators, a heat dissipation device is provided which can effectively improve the utilization rate of fans, improve heat dissipation efficiency and effectively utilize space.

[0004] Specifically include the following:

[0005] A heat dissipation device is provided on a mainboard, and includes:

[0006] A heat dissipation fan is arranged on the mainboard;

[0007] The heat sink is arranged on the mainboard and one side thereof is in contact with the heating device on the mainboard. The heat sink is respectively arranged at the air inlet and the air outlet of the fan, so that a heat dissipation and exhaust passage is formed between the heat sink and the heat dissipation fan.

[0008] Preferably, the end surfaces of the air inlet and the air outlet of the radiator remain flush.

[0009] Preferably, the radiator comprises:

[0010] A body having a heat dissipation duct;

[0011] A heat dissipation fin protruding outward is arranged near the upper part of the body;

[0012] The outer side wall formed by the heat dissipation fins and the body is in contact with the heating device.

[0013] Preferably, the width of the heat dissipation fin is greater than the width of the heating device.

[0014] Preferably, a plurality of pipes which are closed around and connected at both ends are arranged in the body from top to bottom.

[0015] Preferably, the main body is provided with corresponding fixing holes at the fixing positions corresponding to the heating device, so as to cooperate with the fixing of the heating device.

[0016] Preferably, a fixing structure that cooperates with the mainboard and is fixed to the bottom of the radiator is provided to fix the radiator on the mainboard.

[0017] Preferably, the cross section of the heat sink is T-shaped.

[0018] Preferably, the heat sink is an integrally formed structure.

[0019] Preferably, the height of the radiator is consistent with the height of the fan.

[0020] The above technical solution has the following advantages or beneficial effects: through the rotation of the heat dissipation fan, negative pressure is formed on one side of the air. Since the end face of the radiator is in close contact with the inlet and outlet faces of the fan, cold air enters from the end face hole of the radiator on one side, passes through the fan, and is discharged through the radiator on the other side, taking away the heat conducted to the radiator by the heating element, thereby improving the heat dissipation efficiency and effectively utilizing the space. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of an existing radiator in the background technology part of the present invention;

[0022] Figure 2 is a structural schematic diagram of an embodiment of a heat dissipation device in the present invention;

[0023] Figure 3 It is a schematic diagram of the exploded structure of an embodiment of a heat dissipation device in the present invention.

[0024] The above-mentioned reference numerals represent:

[0025] 1. Mainboard; 3. Cooling fan; 2. Radiator; 4. Heat generating device; 21. Main body; 22. Cooling fins; 23. Cooling pipe. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0029] Specifically include the following:

[0030] like Figure 2 As shown, an embodiment of a heat dissipation device is arranged on a mainboard 1, and includes:

[0031] A heat dissipation fan 3 is arranged on the main board 1;

[0032] The heat sink 2 is disposed on the mainboard 1 and one side thereof is in contact with the heating element 4 on the mainboard 1 . The heat sink 2 is respectively arranged at the air inlet and the air outlet of the fan, so that a heat dissipation and exhaust passage is formed between the heat sink 2 and the heat dissipation fan 3 .

[0033] In view of the problem that the heat dissipation efficiency of the radiator 2 in the prior art is not high in actual work, and simply increasing the number of radiators 2 is not proportional to the improvement of the heat dissipation efficiency, configuring multiple radiators 2 will cause heat dissipation interference and reduce the heat dissipation effect.

[0034] The technical solution of the present invention is to respectively configure radiators 2 on the inlet and outlet end faces of the heat dissipation fan 3. When the equipment is working, the air on one side forms a negative pressure through the rotation of the heat dissipation fan 3. Since the end face of the radiator 2 is in close contact with the inlet and outlet faces of the fan, cold air enters from the end face hole of the radiator 2 on one side, passes through the fan, and is discharged through the radiator 2 on the other side, taking away the heat conducted to the radiator 2 by the heating element, thereby improving the heat dissipation efficiency and effectively utilizing the space. Even if the number of radiators 2 is increased, as long as an exhaust passage is formed between the radiator 2 and the heat dissipation fan 3, the heat dissipation effect can be stably improved without the problem of mutual interference between the radiators 2.

[0035] In a preferred embodiment, the end surfaces of the air inlet and the air outlet of the radiator 2 remain flush.

[0036] In the above technical solution, the close fit between the radiator 2 and the cooling fan 3 can be ensured by keeping the end faces flush, so that the ventilation efficiency of the cooling and exhaust passage is higher, thereby further improving the cooling efficiency of the entire device.

[0037] In a preferred embodiment, Figure 3 As shown, the radiator 2 comprises:

[0038] A body 21 having a heat dissipation pipe 23;

[0039] The upper part of the body 21 is provided with heat dissipation fins 22 protruding outward, wherein the heat dissipation fins 22 are provided on opposite sides of the body;

[0040] The outer side wall formed by the heat dissipation fins 22 and the body 21 is in contact with the heating element 4 .

[0041] In a preferred embodiment, the width of the heat dissipation fin 22 is greater than the width of the heating device 4 .

[0042] In a preferred embodiment, a plurality of pipes which are closed around and connected at both ends are arranged in the main body 21 from top to bottom.

[0043] In a preferred embodiment, the main body 21 is provided with corresponding fixing holes at the fixing positions corresponding to the heating device 4 , so as to cooperate with the fixing of the heating device 4 .

[0044] In a preferred embodiment, a fixing structure that cooperates with the mainboard 1 is disposed at the bottom of the heat sink 2 to fix the heat sink 2 on the mainboard 1 .

[0045] In the above technical solution, the heat sink 2 can be made of metal material, such as aluminum or copper.

[0046] In a preferred embodiment, the cross section of the heat sink 2 is T-shaped.

[0047] In a preferred embodiment, the heat sink 2 is an integrally formed structure.

[0048] In a preferred embodiment, the height of the radiator 2 is consistent with the height of the fan.

[0049] In the above technical solution, multiple heat sinks 2 can be configured on the mainboard 1. It is only necessary to ensure that a heat dissipation and exhaust channel is formed between the heat sink 2 and the heat dissipation fan 3 to ensure the high-efficiency operation of the entire heat dissipation system.

[0050] The above are only preferred embodiments of the present invention, and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation device, arranged on a mainboard, characterized in that: include: A heat dissipation fan is arranged on the mainboard; A heat sink is disposed on the mainboard and one side of the heat sink is in contact with the heat generating device on the mainboard. The heat sink is respectively disposed at the air inlet and the air outlet of the fan, so that a heat dissipation and exhaust passage is formed between the heat sink and the heat dissipation fan; The ports of the radiator are respectively in close contact with the air inlet and the air outlet of the fan, and the end faces of the air inlet and the air outlet of the radiator are kept flush.

2. The heat sink according to claim 1, characterized in that: The radiator comprises: A body having a heat dissipation duct; A heat dissipation fin protruding outward is arranged near the upper part of the body; The outer side wall formed by the heat dissipation fins and the main body is in contact with the heating element.

3. The heat dissipation device according to claim 2, characterized in that: The width of the heat dissipation fin is greater than the width of the heat generating device.

4. The heat dissipation device according to claim 2, characterized in that: A plurality of pipelines which are closed around and communicated at both ends are arranged in the body from top to bottom.

5. The heat sink according to claim 2, characterized in that: The main body is provided with corresponding fixing holes at the fixing positions corresponding to the heating device, so as to cooperate with the fixing of the heating device.

6. The heat dissipation device according to claim 1, characterized in that: The bottom of the radiator is provided with a fixing structure which cooperates with the mainboard and is fixed to fix the radiator on the mainboard.

7. The heat dissipation device according to claim 1, characterized in that: The cross section of the radiator is T-shaped.

8. The heat dissipation device according to claim 1, characterized in that: The radiator is an integrally formed structure.

9. The heat dissipation device according to claim 1, characterized in that: The height of the radiator is consistent with the height of the fan.

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