Ultrasonic fingerprint recognition module and manufacturing method thereof, display panel and display device

Abstract

The present disclosure relates to an ultrasonic fingerprint recognition module and a manufacturing method thereof, a display panel and a display device. The ultrasonic fingerprint recognition module includes: a substrate; a first electrode layer, which is arranged on one side of the substrate and has a plurality of first electrodes and isolation lines; the first electrodes are in a strip-shaped structure extending along a first direction, and each first electrode is arranged at intervals along a second direction; the isolation lines extend along the first direction and are alternately distributed with each first electrode along the second direction, the isolation lines are made of a conductive material, and there is a gap between adjacent isolation lines and first electrodes in the second direction; a piezoelectric layer, which is located on a surface of the first electrode layer away from the substrate; a second electrode layer, which is located on a surface of the piezoelectric layer away from the substrate and has a plurality of second electrode regions, each second electrode region having a plurality of second electrodes distributed at intervals; and a circuit layer, which is located on a side of the second electrode layer away from the substrate and is connected to the second electrode. The ultrasonic fingerprint recognition module can improve capacitive crosstalk and recognition accuracy.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to an ultrasonic fingerprint recognition module and a manufacturing method thereof, a display panel and a display device. Background Art

[0002] At present, in the field of display technology, since any two metal substrates have capacitance, capacitance will be generated between two adjacent electrodes, so that capacitive crosstalk will occur between the two adjacent electrodes, resulting in a deviation between the voltage phase loaded on different electrodes and the theoretical voltage phase, and the emitted ultrasonic wave cannot be focused. However, there is currently no technology to improve the capacitive crosstalk between two adjacent electrodes.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0004] The purpose of the present disclosure is to overcome the deficiencies of the above-mentioned prior art and to provide an ultrasonic fingerprint recognition module and a manufacturing method thereof, a display panel and a display device, which can effectively improve the capacitive crosstalk between two adjacent electrodes.

[0005] The first aspect of the present disclosure provides an ultrasonic fingerprint recognition module, comprising:

[0006] substrate;

[0007] a first electrode layer, arranged on one side of the substrate, the first electrode layer having a plurality of first electrodes and isolation lines; the first electrodes are in a strip-shaped structure extending along a first direction, and the first electrodes are arranged at intervals along a second direction, the first direction is different from the second direction; the isolation lines extend along the first direction, and are alternately distributed with the first electrodes along the second direction, the isolation lines are made of a conductive material, and there is a gap between the isolation lines and the first electrodes adjacent to each other in the second direction;

[0008] A piezoelectric layer is located on a surface of the first electrode layer away from the substrate;

[0009] A second electrode layer is located on a surface of the piezoelectric layer away from the substrate, and the second electrode layer has a plurality of second electrode regions, each of which has a plurality of second electrodes distributed at intervals;

[0010] The circuit layer is located on a side of the second electrode layer away from the substrate and is connected to the second electrode.

[0011] In an exemplary embodiment of the present disclosure, the first electrode layer further includes:

[0012] The connecting line extends along the second direction; the first electrode and the isolation line are located on the same side of the connecting line, and the connecting line is connected to the isolation line; and there is a gap between the first electrode and the connecting line.

[0013] In an exemplary embodiment of the present disclosure, the isolation line comprises:

[0014] There are a plurality of first isolation lines and at least one second isolation line, at least one first isolation line is disposed between two adjacent first electrodes, and each of the first isolation lines has a first isolation body and a second isolation body.

[0015] In an exemplary embodiment of the present disclosure, the substrate comprises:

[0016] A passivation layer, located on a side of the first electrode layer away from the piezoelectric layer;

[0017] a reflective layer, located on a side of the passivation layer away from the first electrode layer;

[0018] The first electrode layer further comprises:

[0019] at least one third insulator, which is located on a side of the passivation layer close to the first electrode and extends along the first direction, and the isolation line is located on a surface of the third insulator on a side away from the reflective layer, the first electrode is located on a side of the third insulator away from the reflective layer, the third insulator is made of a conductive material, and each of the third insulators is connected to the connecting line;

[0020] a first insulating layer, located between the third isolator and each of the first electrodes;

[0021] The second insulating layer is filled in the gap between the isolation line and the first electrode.

[0022] In an exemplary embodiment of the present disclosure, the density of the material of the reflective layer is greater than the density of the material of the piezoelectric layer.

[0023] In an exemplary embodiment of the present disclosure, the substrate comprises:

[0024] A passivation layer is located on a side of the first electrode layer away from the piezoelectric layer, and a surface of the passivation layer close to the first electrode layer has at least one groove extending along the first direction;

[0025] a reflective layer, located on a side of the passivation layer away from the first electrode layer;

[0026] The first electrode layer further comprises:

[0027] at least one third isolator, located in the groove and extending along the first direction, and one third isolator is disposed in each of the grooves, the isolation line is located on a surface of the third isolator on a side away from the reflective layer, the first electrode is located on a side of the third isolator away from the reflective layer, the third isolator is made of a conductive material, and each of the third isolators is connected to the connecting line;

[0028] a first insulating layer, located between the third isolator and each of the first electrodes;

[0029] The second insulating layer is filled in the gap between the isolation line and the first electrode.

[0030] In an exemplary embodiment of the present disclosure, the second electrode layer further includes:

[0031] A plurality of fourth insulators are located on a surface of the piezoelectric layer away from the substrate and are alternately distributed with the second electrodes along the first direction and the second direction, wherein the fourth insulators are made of a conductive material, and there are gaps between the fourth insulators and the second electrodes adjacent to each other in the first direction and the second direction;

[0032] The third insulating layer is filled in the gap between the fourth insulator and the second electrode.

[0033] A second aspect of the present disclosure provides a method for manufacturing an ultrasonic fingerprint recognition module, comprising:

[0034] Forming a first electrode on one side of the substrate, wherein the first electrode is in a strip-shaped structure extending along a first direction, and each of the first electrodes is arranged at intervals along a second direction, and the first direction is different from the second direction;

[0035] forming an isolation line on one side of the substrate, the isolation line extending along the first direction and alternately distributed with each of the first electrodes along the second direction, and having a gap between the adjacent isolation lines and the first electrodes in the second direction;

[0036] forming a piezoelectric layer on a surface of the first electrode layer away from the substrate;

[0037] Forming a second electrode layer on a surface of the piezoelectric layer away from the substrate, the second electrode layer having a plurality of second electrode regions, each of the second electrode regions having a plurality of second electrodes distributed at intervals;

[0038] A circuit layer is formed on a side of the second electrode layer away from the substrate and connected to the second electrode.

[0039] A third aspect of the present disclosure provides a display panel, comprising:

[0040] Display substrate;

[0041] The ultrasonic fingerprint recognition module described in any of the above items is located on one side of the display substrate.

[0042] A fourth aspect of the present disclosure provides a display device, comprising any of the display panels described above.

[0043] The technical solution provided by the present disclosure can achieve the following beneficial effects:

[0044] The ultrasonic fingerprint recognition module provided by the present disclosure is provided with an isolation line, which extends along the first direction and is alternately distributed with the first electrode along the second direction, so that the isolation line can be located between two adjacent first electrodes, thereby isolating the two adjacent first electrodes. Since the material of the isolation line is a conductor material, the capacitance formed between the two adjacent first electrodes can be eliminated, and thus the problem of capacitive crosstalk between the two adjacent first electrodes can be improved, and the voltage phase loaded on different first electrodes can be the same as the theoretical voltage phase, so that the emitted ultrasonic wave can be better focused.

[0045] Furthermore, since the material of the isolation line is a conductive material, the present disclosure sets a gap between adjacent isolation lines and first electrodes in the second direction, which can prevent a short circuit between the isolation line and the adjacent first electrode from causing damage to the ultrasonic fingerprint recognition module.

[0046] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0048] Figure 1 A schematic structural diagram of an ultrasonic fingerprint recognition module according to a first exemplary embodiment of the present disclosure is shown;

[0049] Figure 2 Shows Figure 1 Structural diagram of the AA section;

[0050] Figure 3 A schematic structural diagram of an ultrasonic fingerprint recognition module according to a second exemplary embodiment of the present disclosure is shown;

[0051] Figure 4A schematic structural diagram of an ultrasonic fingerprint recognition module according to a third exemplary embodiment of the present disclosure is shown;

[0052] Figure 5 A schematic structural diagram of an ultrasonic fingerprint recognition module according to a fourth exemplary embodiment of the present disclosure is shown;

[0053] Figure 6 A schematic structural diagram of an ultrasonic fingerprint recognition module according to a fifth exemplary embodiment of the present disclosure is shown;

[0054] Figure 7 A schematic structural diagram of an ultrasonic fingerprint recognition module according to a sixth exemplary embodiment of the present disclosure is shown;

[0055] Figure 8 A schematic structural diagram of an ultrasonic fingerprint recognition module according to a seventh exemplary embodiment of the present disclosure is shown;

[0056] Fig. 9 shows a schematic structural diagram of an ultrasonic fingerprint recognition module according to an eighth exemplary embodiment of the present disclosure;

[0057] Fig.10 Shows Fig. 9 Structural diagram of the middle BB section;

[0058] Fig.11 A schematic diagram showing a process of manufacturing an ultrasonic fingerprint recognition module according to an exemplary embodiment of the present disclosure;

[0059] Fig.12 A schematic structural diagram of a display panel according to an exemplary embodiment of the present disclosure is shown.

[0060] Description of reference numerals:

[0061] 1. Substrate; 2. First electrode layer; 3. Piezoelectric layer; 4. Second electrode layer; 5. Circuit layer; 6. Display substrate; 11. Passivation layer; 12. Reflective layer; 13. Protective layer; 21. First electrode; 22. First isolation line; 23. Second isolation line; 24. Connecting line; 25. First insulating layer; 26. Third insulator; 27. Second insulating layer; 41. Second electrode region; 42. Third insulating layer; 43. Fourth insulator; 221 First insulator; 222. Second insulator; 411. Second electrode. DETAILED DESCRIPTION

[0062] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0063] In addition, in the following detailed description, for the purpose of explanation, numerous specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is apparent that one or more embodiments may also be implemented without these specific details.

[0064] It should be noted that the terms “on…”, “formed on…” and “disposed on…” mentioned herein may mean that one layer is directly formed or disposed on another layer, or may mean that one layer is indirectly formed or disposed on another layer, i.e., there are other layers between the two layers.

[0065] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.

[0066] It should be noted that, although the terms "first", "second", etc. may be used herein to describe various parts, components, elements, regions, layers and / or parts, these parts, components, elements, regions, layers and / or parts should not be limited by these terms. Instead, these terms are used to distinguish one part, component, element, region, layer and / or part from another.

[0067] In the present disclosure, unless otherwise specified, the term "same-layer arrangement" is used to mean that two layers, parts, components, elements or portions can be formed by the same patterning process, and the two layers, parts, components, elements or portions are generally formed of the same material.

[0068] During ultrasonic fingerprint recognition, an AC voltage with a preset phase is usually applied to the transmitting electrode by a driving circuit outside the ultrasonic fingerprint recognition module, so that the piezoelectric material corresponding to the generating electrode vibrates and generates ultrasonic waves. Different ultrasonic waves are focused in a predetermined area, which can be the area where the user's finger is placed. When the ultrasonic wave passes through the valley or ridge on the finger fingerprint, it will be reflected back to the ultrasonic fingerprint recognition module. Since the energy reflected back when the ultrasonic wave passes through the valley on the finger fingerprint is different from the energy reflected back when the ultrasonic wave passes through the ridge, the valley or ridge on the fingerprint can be reflected by the different energy of the ultrasonic wave.

[0069] After the ultrasonic wave is reflected back to the ultrasonic fingerprint recognition module by the finger, it will cause the piezoelectric layer to vibrate and generate a corresponding AC voltage. At the same time, the receiving electrode will receive the AC voltage generated by the piezoelectric layer. Since the receiving electrodes are distributed in an array on the surface of the piezoelectric layer, the receiving electrode circuit can control the voltage data on the receiving electrode to be read through the switch line and the reading line connected to each receiving electrode. For example: each row of receiving electrodes constitutes a receiving electrode area, and multiple receiving electrodes in each receiving electrode area are connected to a switch line, and multiple receiving electrodes in the same column of multiple receiving electrode areas are connected to a reading line, so that when a switch line and a reading line are turned on, the receiving electrode to be read can be locked. Therefore, by reading the voltage data on each receiving electrode, the specific position of the valleys and ridges of the user's fingerprint can be obtained, and the user's fingerprint pattern can be accurately identified.

[0070] The first aspect of the present disclosure provides an ultrasonic fingerprint recognition module, such as Figures 1 to 10 As shown, the ultrasonic fingerprint recognition module may include: a substrate 1, a first electrode layer 2, a piezoelectric layer 3, a second electrode layer 4 and a circuit layer 5. Among them, the first electrode layer 2 may be arranged on one side of the substrate 1; the piezoelectric layer 3 may be located on the surface of the first electrode layer 2 away from the substrate 1; the second electrode layer 4 may be located on the surface of the piezoelectric layer 3 away from the substrate 1; the circuit layer 5 may be located on the side of the second electrode layer 4 away from the substrate 1, and connected to the second electrode 411.

[0071] The ultrasonic fingerprint recognition module can eliminate the capacitance formed between two adjacent first electrodes 21, thereby improving the capacitive crosstalk problem between two adjacent first electrodes 21, and can therefore make the voltage phase loaded on different first electrodes 21 the same as the theoretical voltage phase, thereby better focusing the emitted ultrasonic waves.

[0072] Specifically, the substrate 1 may be a flexible substrate 1, and the material of the substrate 1 may be an insulating material. By setting the material of the substrate 1 to be an insulating material, it is possible to prevent a short circuit between the substrate 1 and the first electrode layer 2, thereby preventing the ultrasonic fingerprint recognition module from being damaged. However, the invention is not limited thereto, and the substrate 1 may also be a rigid substrate 1, which may be used according to actual needs, and this is within the scope of protection of the present disclosure.

[0073] In one embodiment of the present disclosure, Figure 3 As shown, the substrate 1 may have multiple layers, for example, the substrate 1 may include a passivation layer 11 and a reflective layer 12 .

[0074] The passivation layer 11 may be located on a side of the first electrode layer 2 away from the piezoelectric layer 3, and the material of the passivation layer 11 may be an insulating material, for example, the material of the passivation layer 11 may be tetrafluoroethylene, but is not limited thereto, and may also be other materials with insulating properties. By setting the material of the passivation layer 11 to be an insulating material, it is possible to prevent the first electrode layer 2 and the reflective layer 12 from contacting and causing a short circuit.

[0075] The reflective layer 12 may be located on a side of the passivation layer 11 away from the first electrode layer 2, and is used to reflect the ultrasonic waves emitted by the piezoelectric layer 3 to increase the intensity of the ultrasonic waves, thereby improving the sensitivity and accuracy of fingerprint recognition.

[0076] Furthermore, the density of the material of the reflective layer 12 can be greater than the density of the material of the piezoelectric layer 3. Since the greater the difference in acoustic impedance between the two media, the greater the difference in mass of the media, the greater the change in the speed of sound. Therefore, the greater the difference in acoustic impedance between the two media, the greater the inertia of the phonon, which makes the energy of the ultrasonic wave greater, thereby creating energy conditions for ultrasonic wave reflection. Therefore, the greater the difference in acoustic impedance between the two media, the greater the reflection ability of the ultrasonic wave.

[0077] Since the acoustic impedance is the product of the density of the medium and the speed of sound of the ultrasonic wave in the medium, it can be known that the acoustic impedance is proportional to the density of the medium. Therefore, the present disclosure enables the ultrasonic wave generated by the piezoelectric layer 3 to be reflected as much as possible to the user's fingerprint through the reflective layer 12 by making the density of the material of the reflective layer 12 equal to the density of the material of the piezoelectric layer 3, thereby further improving the fingerprint recognition accuracy.

[0078] The material of the reflective layer 12 can be silver, but is not limited thereto. Other materials with high density can also be used, which are all within the protection scope of the present disclosure.

[0079] Furthermore, in order to prevent the reflective layer 12 from being exposed, Figure 4 As shown, the substrate 1 may further have a protective layer 13, and the protective layer 13 may be located on a side of the reflective layer 12 away from the passivation layer 11 to provide protection for the ultrasonic fingerprint recognition module.

[0080] In one embodiment of the present disclosure, Figures 1-2 As shown, the first electrode layer 2 may have a plurality of first electrodes 21 and isolation lines. The first electrode 21 may be in a strip-shaped structure extending along the first direction X. It can be understood that the first direction X is the extension direction of the first electrode 21. The shape of the first electrode 21 may be a strip-shaped rectangular or oblong, etc., as long as the length of the first electrode 21 is greater than the width. However, it is not limited thereto, and the first electrode 21 may not be a strip-shaped structure, for example: square, circular, etc., and may be set according to actual needs, which is within the protection scope of the present disclosure.

[0081] Further, each first electrode 21 may be arranged at intervals along the second direction Y, that is, a gap may be provided between two adjacent first electrodes 21 in the second direction Y. The width of the gap may be 2 to 3 times the line width of the first electrode 21, but is not limited thereto, and the width of the gap may also be other values. In addition, it should be noted that the first direction X and the second direction Y are different, for example, the first direction X and the second direction Y may be perpendicular.

[0082] The first electrode 21 may be a transmitting electrode, and each first electrode 21 may have an input end, which may be located at any side of the first electrode 21, and after the plurality of first electrodes 21 are arranged at intervals along the second direction Y, the input ends of the first electrodes 21 are all on the same side. The input end of each first electrode 21 may be connected to a driving circuit of the ultrasonic fingerprint recognition module to input an AC voltage to the first electrode 21 through the driving circuit. The driving circuit may be located outside the ultrasonic fingerprint recognition module or inside the ultrasonic fingerprint recognition module, and may be set according to actual needs.

[0083] In one embodiment of the present disclosure, the driving circuit inputs the AC voltage to each first electrode 21 at different times. For example, when a first electrode 21 is located far away from the ultrasonic focusing area, the driving circuit may first input the AC voltage to the first electrode 21, and the driving circuit inputs the AC voltage to the first electrode 21 closer to the ultrasonic focusing area later. By adopting a method of transmitting the AC voltage to each first electrode 21 at different times, it is possible to ensure that the phases of the ultrasonic waves at each first electrode 21 are the same when they converge in the ultrasonic focusing area.

[0084] Furthermore, in order to prevent interference during the transmission and reception of ultrasonic waves, the driving circuit can adopt a time-sharing driving mode, that is, the driving circuit can continuously and intermittently input an AC voltage to the first electrode 21. For example, after the driving circuit inputs an AC voltage to the first electrode 21 each time, it can input an AC voltage to the first electrode 21 again after an interval of 500ns. The present disclosure does not limit the specific time of the interval, which can be set according to actual needs and is within the protection scope of the present disclosure.

[0085] There may be a plurality of isolation lines, each of which may extend along the first direction X and be alternately distributed with each first electrode 21 along the second direction Y. It is understandable that the isolation line may also be a strip structure, and the isolation line may be arranged in the same layer as the first electrode 21, and the isolation line may be located between two adjacent first electrodes 21, or may be located on a side of the first first electrode 21 arranged in the second direction Y away from the last first electrode 21, and on a side of the last first electrode 21 arranged in the second direction Y away from the first first electrode 21.

[0086] In one embodiment of the present disclosure, an isolation line may be provided between two adjacent first electrodes 21, and an isolation line may be provided on the side of the first first electrode 21 disposed in the second direction Y away from the last first electrode 21 and on the side of the last first electrode 21 disposed in the second direction Y away from the first first electrode 21. However, it is not limited thereto, and a plurality of first isolation lines 22 may be provided between two adjacent first electrodes 21, and a plurality of isolation lines may be provided on the side of the first first electrode 21 disposed in the second direction Y away from the last first electrode 21 and on the side of the last first electrode 21 disposed in the second direction Y away from the first first electrode 21, according to actual needs.

[0087] Further, such as Figure 2 As shown, the extension length of the isolation line in the first direction X can be the same as that of the first electrode 21. When the length of the isolation line is the same as that of the first electrode 21, in the first electrode layer 2, both ends of each first electrode 21 and both ends of each isolation line are flush. By setting the extension length of the isolation line in the first direction X to be the same as the extension length of the first electrode 21 in the first direction X, the capacitance generated between two adjacent first electrodes 21 can be effectively weakened, thereby improving the capacitive crosstalk effect between the two adjacent first electrodes 21.

[0088] At the same time, by providing isolation lines outside the first first electrode 21 and the last first electrode 21 arranged along the second direction Y, it is possible to further prevent other devices from interfering with the first first electrode 21 and the last first electrode 21 .

[0089] However, the present disclosure does not limit the length of the isolation line, and the extension length of the isolation line in the first direction X may be greater than or less than the extension length of the first electrode 21 in the first direction X, and may be set according to actual needs, which is within the protection scope of the present disclosure.

[0090] In one embodiment of the present disclosure, the width of the isolation line (i.e., the length of the isolation line in the second direction Y) may be the same as or different from the line width of the first electrode 21. When the width of the isolation line is larger, it can better prevent the capacitance generated between two adjacent first electrodes 21.

[0091] Furthermore, the thickness of the isolation line can be the same as that of the first electrode 21. By setting the thickness of the isolation line to be the same as that of the first electrode 21, the isolation line can better shield two adjacent first electrodes 21, thereby further preventing capacitive crosstalk between the two adjacent first electrodes 21.

[0092] In one embodiment of the present disclosure, the material of the isolation line may be a conductive material, such as indium tin oxide or a metal material, etc. Each isolation line may be connected to a fixed potential, such as a ground potential, that is, the isolation line may be a ground line, but is not limited thereto, and the fixed potential may not be a ground potential, as long as it is a potential with a fixed voltage.

[0093] Furthermore, there may be a gap between the adjacent isolation lines and the first electrode 21 in the second direction Y. Since the material of the isolation line is a conductive material, by setting a gap between the adjacent isolation lines and the first electrode 21, it is possible to prevent the isolation line from contacting the first electrode 21 and causing a short circuit, thereby preventing the ultrasonic fingerprint recognition module from being damaged. The gap between the adjacent isolation lines and the first electrode 21 may be the same as the line width of the first electrode 21, but is not limited thereto, and may also be set according to actual needs.

[0094] In one embodiment of the present disclosure, Figures 1-2 As shown, the isolation line may include a plurality of first isolation lines 22 and at least one second isolation line 23. At least one first isolation line 22 may be disposed between two adjacent first electrodes 21. Figure 5 As shown, the first isolation line 22 may have a first isolation body 221 and a second isolation body 222. The first isolation body 221 and the second isolation body 222 may extend along the first direction X and be respectively close to the first electrode 21 adjacent thereto. It is understood that each first isolation line 22 may be divided into two isolation bodies, namely: the first isolation body 221 and the second isolation body 222, and the first isolation body 221 and the second isolation body 222 may be arranged between two adjacent first electrodes 21 along the second direction Y. Moreover, each isolation body may be close to the first electrode 21 closest thereto in the second direction Y, and it is understood that the spacing between each first electrode 21 and the adjacent isolation body may be smaller than the spacing between the adjacent first isolation body 221 and the second isolation body 222.

[0095] At the same time, in order to prevent short circuit between the first separator 221 and the second separator 222 and the adjacent first electrode 21, a gap may be provided between the first separator 221 and the second separator 222 and the adjacent first electrode 21. The present disclosure does not limit the specific value of the gap.

[0096] Further, the first isolator 221 and the second isolator 222 may have the same shape, that is, the lengths of the first isolator 221 and the second isolator 222 extending in the first direction X may be the same, and may be the same as the length of the first isolation line 22 extending in the first direction X. At the same time, the widths of the first isolator 221 and the second isolator 222 may be half the width of the first isolation line 22. However, the shapes of the first isolator 221 and the second isolator 222 may also be different, and may be set according to actual needs.

[0097] By dividing the first isolation line 22 into a first isolation body 221 and a second isolation body 222 and placing the first isolation body 221 and the second isolation body 222 close to the first electrode 21 closest to the first electrode 21 in the second direction Y, two adjacent first electrodes 21 can be further isolated, thereby further reducing the capacitive crosstalk between the two adjacent first electrodes 21.

[0098] In addition, the second isolation line 23 may be an isolation line disposed on a side of the first first electrode 21 disposed in the second direction Y away from the last first electrode 21 and on a side of the last first electrode 21 disposed in the second direction Y away from the first first electrode 21 .

[0099] In one embodiment of the present disclosure, Figure 2 As shown, the first electrode layer 2 may also have a connecting line 24. The connecting line 24 may extend along the second direction Y, and the first electrode 21 and the isolation line may be located on the same side of the connecting line 24. The connecting line 24 may be connected to each isolation line and may be connected to a fixed potential. By providing the connecting line 24, each isolation line can be connected together through the connecting line 24, and uniformly connected to a fixed potential through the connecting line 24, thereby simplifying the wiring difficulty of the ultrasonic fingerprint recognition module.

[0100] Furthermore, the material of the connection line 24 may be a conductive material, and there may be a gap between the connection line 24 and the first electrode 21 , so as to prevent a short circuit between the connection line 24 and the first electrode 21 .

[0101] When there is a gap between the connecting line 24 and the first electrode 21, the length of each isolation line extending in the first direction X can be greater than the length of the first electrode 21 extending in the first direction X, so that one end of each isolation line close to the input end of the first electrode 21 can be flush with the input end of the first electrode 21, while the other end of each isolation line can be connected to the connecting line 24.

[0102] The width of the connecting line 24 (i.e., the length of the connecting line 24 in the first direction X) can be the same as that of the isolation line, and the length of the connecting line 24 extending in the second direction Y can be the same as the length of the first electrode layer 2 extending in the second direction Y, but is not limited to this. The width of the connecting line 24 and the length extending in the second direction Y can be set according to actual needs.

[0103] In one embodiment of the present disclosure, Figures 6 to 9 As shown, the first electrode layer 2 may further include at least one third spacer 26. The third spacer 26 may be located on a side of the passivation layer 11 close to the first electrode 21 and extend along the first direction X. At the same time, the isolation line may be located on a surface of the third spacer 26 away from the reflective layer 12, and the first electrode 21 may be located on a side of the third spacer 26 away from the reflective layer 12 and insulated from the third spacer 26 to prevent the third spacer 26 from short-circuiting with the first electrode 21.

[0104] The third isolator 26 can be one, which can be disposed in a whole layer on the side of the passivation layer 11 close to the first electrode 21, and the isolation line and the first electrode 21 are disposed on the third isolator 26 disposed in a whole layer. By providing the third isolator 26, the first electrode 21 and the reflective layer 12 can be blocked to prevent the first electrode 21 and the reflective layer 12 from generating capacitance and generating capacitive crosstalk. Therefore, the capacitive crosstalk generated in the ultrasonic fingerprint recognition module is further eliminated.

[0105] In addition, there may be a plurality of third isolators 26, and the plurality of third isolators 26 may be disposed separately, and a third isolator 26 may be disposed on a side of each first electrode 21 close to the passivation layer 11. The width of the third isolator 26 in the second direction Y is greater than the line width of the first electrode 21, and it is required that the isolation lines on the adjacent two sides of the first electrode 21 are both located on the third isolator 26.

[0106] Further, such as Figure 8 As shown, when the first isolation line 22 has a first isolation body 221 and a second isolation body 222 , the isolation bodies on two adjacent sides of the first electrode 21 are both located on the third isolation body 26 .

[0107] In one embodiment of the present disclosure, the surface of the passivation layer 11 close to the first electrode layer 2 may have at least one groove extending along the first direction X, the third insulator 26 may be located in the groove, and each groove may be provided with a third insulator 26. The depth of the groove may be the same as the thickness of the third insulator 26, but may also be less than the thickness of the third insulator 26. The present disclosure prevents the third insulator 26 from being in the groove, which can reduce the overall thickness of the ultrasonic fingerprint recognition module.

[0108] In one embodiment of the present disclosure, the first electrode layer 2 may further include a first insulating layer 25, which may be located between the third separator 26 and each first electrode 21 to prevent a short circuit between the first electrode 21 and the third separator 26.

[0109] In one embodiment of the present disclosure, the first electrode layer 2 may further include a second insulating layer 27, which may fill the gap between the isolation line and the first electrode 21. The material of the second insulating layer 27 may be tetrafluoroethylene, but is not limited thereto, and may also be other materials with insulating capabilities. By providing the second insulating layer 27, support can be provided for the first electrode 21 and the isolation line, and the first electrode layer 2 may be flattened so as to provide the piezoelectric layer 3.

[0110] Furthermore, the thickness of the second insulating layer 27 may be the same as the height of the first electrode 21 and the isolation line.

[0111] In one embodiment of the present disclosure, the material of the piezoelectric layer 3 may be a piezoelectric material, which may be polyvinylidene fluoride, or other inorganic or organic piezoelectric materials such as aluminum nitride, lead zirconate titanate, and zinc oxide. By providing the piezoelectric layer 3, when an alternating voltage is input to the first electrode 21, deformation can be generated, and ultrasonic waves can be generated, which are then transmitted. When the piezoelectric layer 3 receives the reflected ultrasonic wave, vibration can be generated to generate a voltage, which is then input to the receiving electrode.

[0112] In one embodiment of the present disclosure, Figure 1 As shown, the second electrode layer 4 may have a plurality of second electrode regions 41, and the orthographic projection of each second electrode region 41 on the substrate 1 coincides with the orthographic projection of each first electrode 21 on the substrate 1 one by one. It can be understood that the shape of each second electrode region 41 may be the same as the shape of the first electrode 21, and the plurality of second electrode regions 41 are arranged at intervals along the second direction Y. By coinciding the orthographic projection of each second electrode region 41 on the substrate 1 with the orthographic projection of each first electrode 21 on the substrate 1 one by one, the ultrasonic wave transmission can be made more accurate, thereby improving the sensitivity and accuracy of fingerprint recognition. In addition, the orthographic projections of the plurality of second electrode regions 41 on the substrate 1 may coincide with the orthographic projection of one first electrode 21 on the substrate 1, that is, one first electrode 21 may correspond to a plurality of second electrode regions 41, which is also within the scope of protection of the present disclosure.

[0113] Further, such as Fig.10As shown, each second electrode region 41 may have a plurality of second electrodes 411 distributed at intervals. The plurality of second electrodes 411 distributed at intervals may be arranged along the first direction X. That is, a plurality of second electrodes 411 arranged in an array may be provided on the second electrode layer 4. The second electrode 411 may be a receiving electrode for receiving an AC voltage output by the piezoelectric material.

[0114] In one embodiment of the present disclosure, Fig.10 As shown, the second electrode layer 4 may further include a plurality of fourth insulators 43. The fourth insulators 43 may be located on the surface of the piezoelectric layer 3 away from the substrate 1, and each fourth insulator 43 and each second electrode 411 are alternately distributed along the first direction X and the second direction Y. It can be understood that at least one fourth insulator 43 is provided between two adjacent second electrodes 411. By providing the fourth insulator 43, two adjacent second electrodes 411 can be separated, thereby preventing capacitive crosstalk between the two adjacent second electrodes 411.

[0115] Furthermore, at least one fourth insulator 43 may be provided on both sides of the second electrode 411 located at the outermost side of the second electrode layer 4, so as to prevent the second electrode 411 located at the outermost side of the second electrode layer 4 from being interfered by other devices. It should be noted that the present disclosure does not limit the shape and width of the fourth insulator 43, and it can be set according to actual needs.

[0116] The material of the fourth insulator 43 may be a conductive material, for example, indium tin oxide or a metal material. In order to prevent a short circuit between the fourth insulator 43 and the second electrode 411, a gap may be provided between the fourth insulator 43 and the second electrode 411 adjacent in the first direction X and the second direction Y. The present disclosure does not limit the size of the gap, which is within the protection scope of the present disclosure. In addition, a plurality of fourth insulators 43 may be connected to a fixed potential, for example, they may be grounded.

[0117] In one embodiment of the present disclosure, the second electrode layer 4 may further include a third insulating layer 42, which may fill the gap between the fourth insulator 43 and the second electrode 411 to provide support for the fourth insulator 43 and the second electrode 411, and to flatten the second electrode layer 4 to facilitate the setting of the circuit layer 5.

[0118] Further, the thickness of the third insulating layer 42 may be the same as the thickness of the second electrode 411 and the fourth separator 43 , but is not limited thereto.

[0119] The circuit layer 5 may be connected to the second electrodes 411 to read data from each second electrode 411 .

[0120] In one embodiment of the present disclosure, the materials of the first electrode 21, the second electrode 411, the isolation line, the connecting line 24, the third insulator 26 and the fourth insulator 43 may be the same, but not limited thereto, and their materials may also be different, which is within the protection scope of the present disclosure.

[0121] A second aspect of the present disclosure provides a method for manufacturing an ultrasonic fingerprint recognition module. The method for manufacturing an ultrasonic fingerprint recognition module can be used to manufacture the above-mentioned ultrasonic fingerprint recognition module, but is not limited to manufacturing the above-mentioned ultrasonic fingerprint recognition module.

[0122] like Fig.11 As shown, the manufacturing method of the ultrasonic fingerprint recognition module may include:

[0123] Step S10 , forming a first electrode 21 on one side of the substrate 1 , wherein the first electrode 21 is in a strip-shaped structure extending along a first direction X, and each first electrode 21 is arranged at intervals along a second direction Y, and the first direction X and the second direction Y are different.

[0124] Step S20 , forming isolation lines on one side of the substrate 1 , the isolation lines extending along the first direction X and alternately distributed with the first electrodes 21 along the second direction Y, and having gaps between adjacent isolation lines and first electrodes 21 in the second direction Y.

[0125] Step S30 , forming a piezoelectric layer 3 on a surface of the first electrode layer 2 away from the substrate 1 .

[0126] Step S40 , forming a second electrode layer 4 on a surface of the piezoelectric layer 3 away from the substrate 1 , wherein the second electrode layer 4 has a plurality of second electrode regions 41 , and each second electrode region 41 has a plurality of second electrodes 411 distributed at intervals.

[0127] Step S50 , forming a circuit layer 5 on a side of the second electrode layer 4 away from the substrate 1 , and connecting the circuit layer 5 to the second electrode 411 .

[0128] The above steps are described in detail below:

[0129] In step S10 , the material for forming the first electrode 21 may be laid on the substrate 1 , and the first electrode 21 may be formed by photolithography or the like, and the first electrode 21 may be in a strip structure extending along the first direction X, and the first electrodes 21 may be arranged at intervals along the second direction Y.

[0130] In step S20, the material forming the isolation line can be laid on the substrate 1 leaking out after the first electrode 21 is photolithographically formed, and the isolation line can be formed by photolithography, etc. At the same time, the isolation line extends along the first direction X and is alternately distributed with each first electrode 21 along the second direction Y.

[0131] When the first electrode layer 2 has the connection line 24, the isolation line and the connection line 24 may be photolithographically processed together to form the isolation line and the connection line 24 connected to each other.

[0132] It should be noted that the above steps S10 and S20 can be performed in an interchangeable order, that is, step S20 can be performed first, and then step S10.

[0133] In one embodiment of the present disclosure, when the first electrode layer 2 has the third spacer 26, before steps S10 and S20, that is, before forming the first electrode 21 and the isolation line, the material of the third spacer 26 can be laid on the substrate 1, and the required third spacer 26 can be formed by photolithography or the like. After the third spacer 26 is formed, a first insulating layer 25 is formed on the surface of the third spacer 26 corresponding to the first electrode 21 to insulate the first electrode 21 from the third spacer 26.

[0134] In addition, after steps S10 and S20 and before step S30, that is, after forming the first electrode 21 and the isolation line and before forming the piezoelectric layer 3, the second insulating layer 27 can be filled in the gap between the first electrode 21 and the isolation line, and the first electrode layer 2 can be flattened.

[0135] In step S30 , a piezoelectric material for forming the piezoelectric layer 3 may be laid on a surface of the first electrode layer 2 away from the substrate 1 to form the piezoelectric layer 3 , and the piezoelectric layer 3 may be planarized.

[0136] In step S40 , the material for forming the second electrode 411 may be laid on the surface of the piezoelectric layer 3 away from the substrate 1 , and a plurality of second electrodes 411 arranged in an array may be formed by photolithography or the like.

[0137] Furthermore, after step S40 and before step S50, a third insulating layer 42 may be filled between adjacent second electrodes 411, and the second electrode layer 411 may be planarized.

[0138] When the second electrode layer 4 is provided with a fourth insulator 43, before filling the third insulating layer 42, the material for forming the fourth insulator 43 can be laid on the surface of the piezoelectric layer 3 away from the substrate 1, and the required fourth insulator 43 can be formed by photolithography or the like.

[0139] In step S50 , a material for forming a circuit layer 5 may be disposed on a side of the second electrode layer 4 away from the substrate 1 , and a required second electrode 411 circuit may be formed by photolithography or the like, and connected to the second electrode 411 .

[0140] A third aspect of the present disclosure provides a display panel, such as Fig.12As shown, the display panel may include: a display substrate 6 and an ultrasonic fingerprint recognition module. The ultrasonic fingerprint recognition module may be the ultrasonic fingerprint recognition module mentioned above.

[0141] By setting the above-mentioned ultrasonic fingerprint recognition module in the display panel, the capacitance formed between two adjacent first electrodes 21 can be eliminated, thereby improving the problem of capacitive crosstalk between two adjacent first electrodes 21. Therefore, the voltage phase loaded on different first electrodes 21 can be made the same as the theoretical voltage phase, so that the emitted ultrasonic wave can be better focused, thereby improving the sensitivity and accuracy of fingerprint recognition.

[0142] The ultrasonic fingerprint recognition module may be located on one side of the display substrate 6 , that is, the ultrasonic fingerprint recognition module may be located on the light emitting side of the display substrate 6 or on the backlight side of the display substrate 6 .

[0143] When the ultrasonic fingerprint recognition module is located on the light-emitting side of the display substrate 6, the substrate 1 may be located on the surface of the light-emitting side of the display substrate 6. When the ultrasonic fingerprint recognition module is located on the backlight side of the display substrate 6, the backlight side of the display substrate 6 may be located on the side of the circuit layer 5 away from the substrate 1. For example: the backlight side of the display substrate 6 may be located on the surface of the second electrode 411 circuit away from the substrate 1.

[0144] When the substrate 1 has a reflective layer 12 , the ultrasonic fingerprint recognition module needs to be located on the backlight side of the display substrate 6 to prevent the reflective layer 12 from affecting the display of the display substrate 6 .

[0145] The fourth aspect of the present disclosure provides a display device, which may include the display panel described above. For example, the display device may be a display device that needs to use a display panel, such as a mobile phone, a television, a computer, etc. By providing the above-mentioned display panel in the display device, the capacitance formed between two adjacent first electrodes 21 can be eliminated, thereby improving the problem of capacitive crosstalk between two adjacent first electrodes 21, and thus making the voltage phase loaded on different first electrodes 21 the same as the theoretical voltage phase, so that the emitted ultrasonic wave can be better focused, thereby improving the sensitivity and accuracy of fingerprint recognition.

[0146] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. An ultrasonic fingerprint recognition module, characterized in that: include: substrate; A first electrode layer, disposed on one side of the substrate, the first electrode layer having a plurality of first electrodes, isolation lines and connection lines; The first electrodes are in a strip-shaped structure extending along a first direction, and the first electrodes are arranged at intervals along a second direction, and the first direction is different from the second direction; the isolation lines extend along the first direction and are alternately distributed with the first electrodes along the second direction, the isolation lines are made of conductive material, and there is a gap between the adjacent isolation lines and the first electrodes in the second direction; the connecting line extends along the second direction, the first electrode and the isolation line are located on the same side of the connecting line, and the connecting line is connected to the isolation line; There is a gap between the first electrode and the connecting line; A piezoelectric layer is located on a surface of the first electrode layer away from the substrate; A second electrode layer is located on a surface of the piezoelectric layer away from the substrate, and the second electrode layer has a plurality of second electrode regions, each of which has a plurality of second electrodes distributed at intervals; a circuit layer, located on a side of the second electrode layer away from the substrate and connected to the second electrode; Wherein, the substrate comprises: a passivation layer and a reflective layer, the passivation layer is located on a side of the first electrode layer away from the piezoelectric layer; the reflective layer is located on a side of the passivation layer away from the first electrode layer; The first electrode layer also includes: at least one third insulator, a first insulating layer and a second insulating layer, the at least one third insulator is located on the side of the passivation layer close to the first electrode and extends along the first direction, and the isolation line is located on the surface of the third insulator on the side away from the reflective layer, the first electrode is located on the side of the third insulator away from the reflective layer, the third insulator is a conductive material, and each of the third insulators is connected to the connecting line; the first insulating layer is located between the third insulator and each of the first electrodes; the second insulating layer fills the gap between the isolation line and the first electrode.

2. The ultrasonic fingerprint recognition module according to claim 1, characterized in that: The isolation line comprises: There are a plurality of first isolation lines and at least one second isolation line, at least one first isolation line is disposed between two adjacent first electrodes, and each of the first isolation lines has a first isolation body and a second isolation body.

3. The ultrasonic fingerprint recognition module according to claim 1, characterized in that: The density of the material of the reflective layer is greater than the density of the material of the piezoelectric layer.

4. The ultrasonic fingerprint recognition module according to claim 1, characterized in that: The substrate comprises: A passivation layer is located on a side of the first electrode layer away from the piezoelectric layer, and a surface of the passivation layer close to the first electrode layer has at least one groove extending along the first direction; a reflective layer, located on a side of the passivation layer away from the first electrode layer; The first electrode layer further comprises: at least one third isolator, located in the groove and extending along the first direction, and one third isolator is disposed in each of the grooves, the isolation line is located on a surface of the third isolator on a side away from the reflective layer, the first electrode is located on a side of the third isolator away from the reflective layer, the third isolator is made of a conductive material, and each of the third isolators is connected to the connecting line; a first insulating layer, located between the third isolator and each of the first electrodes; The second insulating layer is filled in the gap between the isolation line and the first electrode.

5. The ultrasonic fingerprint recognition module according to claim 1, characterized in that: The second electrode layer further comprises: A plurality of fourth insulators are located on a surface of the piezoelectric layer away from the substrate and are alternately distributed with the second electrodes along the first direction and the second direction, wherein the fourth insulators are made of a conductive material, and there are gaps between the fourth insulators and the second electrodes adjacent to each other in the first direction and the second direction; The third insulating layer is filled in the gap between the fourth insulator and the second electrode.

6. A method for manufacturing an ultrasonic fingerprint recognition module, characterized in that: The method for manufacturing the ultrasonic fingerprint recognition module is used to manufacture the ultrasonic fingerprint recognition module according to any one of claims 1 to 5, and the method for manufacturing the ultrasonic fingerprint recognition module comprises: Forming a first electrode on one side of the substrate, wherein the first electrode is in a strip-shaped structure extending along a first direction, and each of the first electrodes is arranged at intervals along a second direction, and the first direction is different from the second direction; forming an isolation line on one side of the substrate, the isolation line extending along the first direction and alternately distributed with each of the first electrodes along the second direction, and having a gap between the isolation line and the first electrode adjacent to each other in the second direction; forming a piezoelectric layer on a surface of the first electrode layer away from the substrate; Forming a second electrode layer on a surface of the piezoelectric layer away from the substrate, the second electrode layer having a plurality of second electrode regions, each of the second electrode regions having a plurality of second electrodes distributed at intervals; A circuit layer is formed on a side of the second electrode layer away from the substrate and connected to the second electrode.

7. A display panel, characterized in that: include: Display substrate; The ultrasonic fingerprint recognition module according to any one of claims 1 to 5 is located on one side of the display substrate.

8. A display device, characterized in that: The display panel comprises the display panel as claimed in claim 7.

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