Wafer bonding machine

Abstract

The present application relates to a wafer placement machine, including a component placement component, a workpiece conveying mechanism, a placement component forward and backward moving mechanism, a placement component left and right moving mechanism, a wafer tray mechanism, a tray forward and backward moving mechanism and a tray left and right moving mechanism; the workpiece conveying mechanism is arranged horizontally; the placement component forward and backward moving mechanism is arranged at the conveying direction end of the workpiece conveying mechanism, the placement component left and right moving mechanism is arranged on the top of the workpiece conveying mechanism, and the placement component left and right moving mechanism is slidably connected with the placement component forward and backward moving mechanism; the component placement component is slidably mounted on the placement component left and right moving mechanism; the tray forward and backward moving mechanism is arranged on one side of the workpiece conveying mechanism, and the tray forward and backward moving mechanism is arranged adjacent to the workpiece conveying mechanism; the tray left and right moving mechanism is slidably mounted on the top of the tray forward and backward moving mechanism; the wafer tray mechanism is fixedly mounted on the top of the tray left and right moving mechanism. It can perform placement on ordinary components and wafers on the same device.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor processing equipment, and in particular to a wafer bonding machine. Background Art

[0002] Wafer mounter is a device used to place components at high speed and high precision. It is the most critical and complex equipment in the entire SMI production. Wafer mounter is a mounting device used in SMT production. Now, wafer mounter has developed from the early low-speed mechanical wafer mounter to high-speed optical centering wafer mounter, and has developed towards multi-functional, flexible connection modularization.

[0003] The existing wafer mounter cannot simultaneously mount wafers and other electronic components on the same wafer mounter. Summary of the invention

[0004] In view of this, the present disclosure proposes a wafer bonding machine, which can bond ordinary components on a workpiece conveying mechanism and wafers on a wafer tray mechanism with high precision on the same device.

[0005] According to one aspect of the present disclosure, there is provided a wafer placement machine, comprising a component placement component, a workpiece conveying mechanism, a placement component forward and backward moving mechanism, a placement component left and right moving mechanism, a wafer tray mechanism, a tray forward and backward moving mechanism, and a tray left and right moving mechanism;

[0006] Wherein, the workpiece conveying mechanism is horizontally arranged and used for conveying components in a horizontal direction;

[0007] The mounting component forward and backward moving mechanism is arranged at the conveying direction end of the workpiece conveying mechanism, the mounting component left and right moving mechanism is arranged at the top of the workpiece conveying mechanism, and the mounting component left and right moving mechanism is slidably connected with the mounting component forward and backward moving mechanism;

[0008] The component mounting component is slidably mounted on the mounting component left-right moving mechanism, and the mounting head of the component mounting component is arranged toward the workpiece conveying mechanism;

[0009] The pallet forward and backward moving mechanism is arranged on one side of the workpiece conveying mechanism, and the pallet forward and backward moving mechanism is arranged adjacent to the workpiece conveying mechanism;

[0010] The tray left-right moving mechanism is slidably mounted on the top of the tray front-back moving mechanism, and an angle is provided between the tray front-back moving mechanism and the tray left-right moving mechanism;

[0011] The wafer tray mechanism is fixedly mounted on the top of the tray left-right moving mechanism and is used for placing wafers mounted by the component mounting part.

[0012] In a possible implementation, the tray forward and backward movement mechanism includes a first driving member, a first slideway and a first connecting seat;

[0013] The first slideway is arranged at one side of the workpiece conveying mechanism, and the first slideway is arranged along the forward and backward movement mechanism of the mounting component;

[0014] The first driving member is fixedly mounted on a side of the first slideway away from the workpiece conveying mechanism, the output shaft of the first driving member is arranged toward the workpiece conveying mechanism, a first lead screw is fixedly mounted on the output shaft of the first driving member, the first connecting seat is threadedly connected to the first lead screw, and the first connecting seat is slidably connected to the first slideway;

[0015] The tray left-right moving mechanism is fixedly installed on the top of the first connecting seat.

[0016] In a possible implementation, the first slide includes a first box body with an opening on the top and a first top plate;

[0017] The first box body is arranged along the forward and backward movement mechanism of the mounting component, the first driving member is fixedly installed on a side of the first box body away from the workpiece conveying mechanism, and the output shaft of the first driving member passes through the side wall of the first box body;

[0018] The first top plate is fixedly mounted at the top opening of the first box body, the size of the first top plate is smaller than the size of the top opening of the first box body, and the first top plate is located in the middle of the opening of the first box body;

[0019] The first connecting seat is provided with a threaded hole matching the first lead screw, and the first connecting seat is slidably arranged inside the cavity of the first box body;

[0020] A first extension portion is provided on the top of the first connecting seat. The first extension portion penetrates and extends out of a gap formed between the first top plate and the first box body opening. The tray left-right moving mechanism is fixedly mounted on the top of the first extension portion.

[0021] In a possible implementation, a first placement platform is fixed on the side wall of the first box body, and the first placement platform is in the shape of a concave plate with an opening facing upward;

[0022] A first drag chain is fixed on the first placement table, and the first drag chain is used to arrange the line of the first driving member.

[0023] In a possible implementation, the tray forward and backward moving mechanism and the tray left and right moving mechanism are vertically arranged, and the tray forward and backward moving mechanism and the tray left and right moving mechanism have the same structure.

[0024] In a possible implementation, the wafer tray mechanism includes a wafer blue film tray, a wafer blue film ejector pin and a wafer blue film support;

[0025] The wafer blue film support is fixedly mounted on the top of the tray forward and backward moving mechanism, the wafer blue film tray is fixedly mounted on the top of the wafer blue film support, and the wafer blue film tray extends out of the tray forward and backward moving mechanism;

[0026] The wafer blue film ejector pin is arranged at the bottom of the wafer blue film tray and is used to eject the wafer after bonding.

[0027] In a possible implementation, the mounting component forward and backward movement mechanism includes a left bracket, a left slide, a left lead screw, a right bracket and a right slide;

[0028] The left bracket and the right bracket are both door-shaped, the left bracket is arranged at the left end of the workpiece conveying component in the conveying direction, and the right bracket is arranged at the right end of the workpiece conveying component in the conveying direction;

[0029] The left slide is fixedly mounted on the top of the left bracket, and the left slide is arranged along the length direction of the left bracket; the right slide is fixedly mounted on the top of the right bracket, and the right slide is arranged along the length direction of the right bracket;

[0030] The left lead screw is rotatably mounted on the top of the left bracket, the left lead screw is arranged parallel to the left slideway, and a left lead screw driving motor is arranged at one end of the left lead screw in the length direction;

[0031] Both ends of the mounting component left-right moving mechanism are slidably connected to the left slideway and the right slideway;

[0032] A left transmission component threadedly connected to the left lead screw is provided on one side of the mounting component left-right moving mechanism adjacent to the left lead screw.

[0033] In a possible implementation, the placement component left-right moving mechanism further includes a left slider, a rotating lead screw, a right slider and a placement mechanism slideway;

[0034] The left slider is fixedly mounted on one end of the slideway of the mounting mechanism in the sliding direction, and the right slider is fixedly mounted on the other end of the slideway of the mounting mechanism in the sliding direction;

[0035] The left slider is slidably connected to the left slideway, and the right slider is slidably connected to the right slideway;

[0036] One end of the rotating lead screw is rotatably mounted on the top of the left slider, and the other end of the rotating lead screw is fixedly mounted on the top of the right slider;

[0037] A mounting mechanism slider is provided on one side of the component mounting part adjacent to the rotating lead screw. The mounting mechanism slider is rotationally connected to the rotating lead screw, and the mounting mechanism slider is slidingly connected to the mounting mechanism slideway.

[0038] In a possible implementation, the workpiece conveying mechanism includes a first conveying path and a second conveying path arranged in parallel in a horizontal direction;

[0039] A first groove is formed on a side of the first conveying path facing the second conveying path, and the first groove is formed along the length direction of the first conveying path; a second groove is formed on a side of the second conveying path facing the first conveying path, and the second groove is formed along the length direction of the second conveying path;

[0040] A first belt conveying mechanism is disposed inside the first groove, and a second belt conveying mechanism is disposed inside the second groove. A carrier plate is overlapped on the top of the conveyor belt of the first belt transmission mechanism and the top of the conveyor belt of the second belt transmission mechanism for driving the carrier plate.

[0041] In a possible implementation, it further includes a component feeding component, which is arranged on a side of the workpiece conveying mechanism away from the wafer tray mechanism, and a feeding direction of the component feeding component is arranged toward the workpiece conveying mechanism.

[0042] The wafer placement machine of the embodiment of the present application is provided with a workpiece conveying mechanism and a wafer tray mechanism, which can be used to place ordinary components and wafers on the same device. Specifically, the placement component left and right moving mechanism is slidably connected to the placement component forward and backward moving mechanism, and the placement component forward and backward moving mechanism controls the placement component left and right moving mechanism to move along the Y-axis direction, thereby controlling the component placement component installed on the placement component left and right moving mechanism to move along the Y-axis direction, and at the same time, the placement component left and right moving mechanism can control the component placement component to move along the X-axis direction. Thus, the component placement component can place ordinary components on the workpiece conveying mechanism in any direction on the same horizontal plane. When placing wafers, the component placement component moves above the round wafer tray mechanism, and the tray forward and backward moving mechanism can control the tray left and right moving mechanism to move along the Y-axis, thereby controlling the wafer tray mechanism installed on the tray left and right moving mechanism to move along the Y-axis, and at the same time, the tray left and right moving mechanism can control the wafer tray mechanism to move along the X-axis, thereby, the component placement component can place wafers on the wafer tray mechanism at any position in the same plane. In summary, the wafer bonding machine according to the embodiment of the present application can bond ordinary components on the workpiece conveying mechanism and wafers on the wafer tray mechanism with high precision on the same device.

[0043] Further features and aspects of the present disclosure will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure.

[0045] Figure 1 An axonometric view of a wafer bonding machine according to an embodiment of the present disclosure is shown;

[0046] Figure 2 An axonometric view of the wafer bonding machine according to an embodiment of the present disclosure from another side is shown;

[0047] Figure 3 A top view of a wafer bonding machine according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0048] Various exemplary embodiments, features and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0049] Among them, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention or simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0050] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0051] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0052] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present disclosure can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present disclosure.

[0053] Figure 1 An axonometric view of a wafer bonding machine according to an embodiment of the present disclosure is shown. Figure 2 An axonometric view of the wafer bonding machine according to an embodiment of the present disclosure is shown from the other side. Figure 3 FIG. 2 shows a top view of a wafer bonding machine according to an embodiment of the present disclosure. Figure 1 , Figure 2 or Figure 3 As shown, the wafer placement machine includes: a component placement component 100, a workpiece conveying mechanism 200, a placement component forward and backward moving mechanism 300, a placement component left and right moving mechanism 400, a wafer tray mechanism 500, a tray forward and backward moving mechanism 600 and a tray left and right moving mechanism 700, and a machine base 800. Among them, the top of the machine base 800 is a working platform, and the workpiece conveying mechanism 200 is horizontally fixed on the top of the machine base 800. At this time, the workpiece on the workpiece conveying mechanism 200 is conveyed in the horizontal direction (i.e., the X-axis direction). The placement component forward and backward moving mechanism 300 is arranged at the conveying direction end of the workpiece conveying mechanism 200, and the placement component forward and backward moving mechanism 300 is fixed on the top of the machine base 800, and the placement component forward and backward moving mechanism 300 is arranged along the Y-axis. The placement component left and right moving mechanism 400 is arranged on the top of the workpiece conveying mechanism 200, and the placement component left and right moving mechanism 400 is slidably connected with the placement component forward and backward moving mechanism 300, and the placement component left and right moving mechanism 400 is arranged along the X-axis. The component placement component 100 is slidably mounted on the placement component left-right moving mechanism 400, and the placement head of the component placement component 100 is arranged toward the workpiece conveying mechanism 200. The tray forward and backward moving mechanism 600 is arranged on one side of the workpiece conveying mechanism 200, and the tray forward and backward moving mechanism 600 is arranged adjacent to the workpiece conveying mechanism 200, and the tray forward and backward moving mechanism 600 is fixed on the top of the machine base 800. The tray left-right moving mechanism 700 is slidably mounted on the top of the tray forward and backward moving mechanism 600, so that the tray forward and backward moving mechanism 600 controls the tray left-right moving mechanism 700 to move along the Y axis. An angle is set between the mechanism tray forward and backward moving mechanism 600 and the tray left-right moving mechanism 700. The wafer tray mechanism 500 is fixedly mounted on the top of the tray left-right moving mechanism 700, and is used to place the wafer mounted by the component placement component 100, and the tray left-right moving mechanism 700 controls the wafer tray mechanism 500 to move along the Y axis.

[0054] The wafer placement machine of the embodiment of the present application is provided with a workpiece conveying mechanism 200 and a wafer tray mechanism 500, which can place ordinary components and wafers on the same device. Specifically, the placement component left and right moving mechanism 400 is slidably connected to the placement component front and back moving mechanism 300, and the placement component front and back moving mechanism 300 controls the placement component left and right moving mechanism 400 to move along the Y-axis direction, thereby controlling the component placement component 100 installed on the placement component left and right moving mechanism 400 to move along the Y-axis direction, and at the same time, the placement component left and right moving mechanism 400 can control the component placement component to move along the X-axis direction. Therefore, the component placement component 100 can place ordinary components on the workpiece conveying mechanism 200 in any direction on the same horizontal plane. When the wafer is mounted, the component mounting part 100 moves to the top of the wafer tray mechanism, and the tray forward and backward moving mechanism 600 can control the tray left and right moving mechanism 700 to move along the Y-axis, thereby controlling the wafer tray mechanism 500 installed on the tray left and right moving mechanism 700 to move along the Y-axis. At the same time, the tray left and right moving mechanism 700 can control the wafer tray mechanism 500 to move along the X-axis, thereby allowing the component mounting part to mount the wafer on the wafer tray mechanism 500 at any position in the same plane. In summary, the wafer mounting machine of the embodiment of the present application can mount ordinary components on the workpiece conveying mechanism 200 and wafers on the wafer tray mechanism 500 with high precision on the same device.

[0055] In a possible implementation, the tray forward and backward movement mechanism 600 includes a first driving member 610, a first slide 620 and a first connecting seat, wherein the bottom of the first slide 620 is fixedly mounted on the top of the machine base 800, and the first slide 620 is arranged on one side of the workpiece conveying mechanism 200, and the first slide 620 is arranged along the mounting component forward and backward movement mechanism 300 (i.e., the first slide 620 is arranged along the Y-axis direction). The first driving member 610 is fixedly mounted on the side of the first slide 620 away from the workpiece conveying mechanism 200, and the output shaft of the first driving member 610 is arranged toward the workpiece conveying mechanism 200, and a first lead screw is fixedly mounted on the output shaft of the first driving member 610, and the first connecting seat is threadedly connected to the first lead screw, and the first connecting seat is slidably connected to the first slide 620. The tray left and right movement mechanism 700 is fixedly mounted on the top of the first connecting seat.

[0056] Here, it should be pointed out that the first driving member 610 can be a rotating motor, which will not be described in detail here.

[0057] Furthermore, in a possible implementation, the first slide 620 includes a first box body 621 with an opening at the top and a first top plate 622, and the bottom of the first box body 621 is fixedly mounted on the top of the machine base 800. The first box body 621 is arranged along the mounting component forward and backward moving mechanism 300, the first driving member 610 is fixedly mounted on the side of the first box body 621 away from the workpiece conveying mechanism 200, and the output shaft of the first driving member 610 passes through the side wall of the first box body 621. The first top plate 622 is fixedly mounted at the top opening of the first box body 621, the size of the first top plate 622 is smaller than the size of the top opening of the first box body 621, and the first top plate 622 is located in the middle of the opening of the first box body 621. The first connecting seat is provided with a threaded hole matching the first lead screw, and the first connecting seat is slidably arranged inside the cavity of the first box body 621. A first extension portion is disposed at the top of the first connecting seat. The first extension portion penetrates and extends out of a gap formed between the first top plate 622 and the opening of the first box body 621 . The tray left-right moving mechanism 700 is fixedly mounted on the top of the first extension portion.

[0058] Here, it should be pointed out that a rolling bearing can be arranged on the side of the first box body 621 away from the first driving member 610, the outer inner wall of the rolling bearing can be fixedly connected to the bottom inner wall of the first box body 621, and the inner side of the rolling bearing matches the first screw so that the first screw is supported on the rolling bearing.

[0059] Thus, the structure of the mechanism 600 for moving the tray forward and backward can be made more stable, and the first drive member 610 controls the rotation of the first lead screw, thereby controlling the first connection seat threadedly connected to the first lead screw to move along the Y axis. The gap formed between the first box body 621 and the first top plate 622 serves as a guide for the first connection seat, and the first extension portion is restricted in the gap formed between the first box body 621 and the first top plate 622, so that the first connection seat slides along the gap formed between the first box body 621 and the first top plate 622.

[0060] In a possible implementation, a first placement platform is fixed on the side wall of the first box body 621, and the first placement platform is in the shape of a concave plate with an opening facing upward. A first drag chain 630 is fixed on the first placement platform, and the first drag chain 630 is used to arrange the circuit of the first driving member 610. In this way, the exposed circuit is prevented from affecting the movement of the tray forward and backward moving mechanism 600 in the wafer bonding machine of the embodiment of the present application.

[0061] In a possible implementation, the tray forward and backward moving mechanism 600 and the tray left and right moving mechanism 700 are vertically arranged, and the tray forward and backward moving mechanism 600 and the tray left and right moving mechanism 700 have the same structure.

[0062] Here, it should be noted that the tray left-right moving mechanism 700 includes a second driving member 710, a second slide 720 and a second connecting seat 730, wherein the bottom of the second slide 720 is fixedly mounted on the top of the first connecting seat and is arranged perpendicularly to the first box body 621. The second driving member 710 is fixedly mounted on one side of the sliding direction of the second slide 720, the output shaft of the second driving member 710 is arranged perpendicularly to the output shaft of the first driving member 610, a second lead screw is fixedly mounted on the output shaft of the second driving member 710, the second connecting seat 730 is threadedly connected to the second lead screw, and the second connecting seat 730 is slidably connected to the second slide 720. The wafer tray mechanism is fixedly mounted on the top of the second connecting seat 730.

[0063] Furthermore, in a possible implementation, the second slide 720 includes a second box body with an opening at the top and a second top plate, the bottom of the second box body is fixedly mounted on the top of the first connecting seat, and forms a 90° angle with the first box body 621. The second driving member 710 is fixedly mounted on one side of the second box body, and the output shaft of the first driving member 610 is vertically arranged with the output shaft of the second driving member 710, and the output shaft of the second driving member 710 passes through the side wall of the second box body. The second top plate is fixedly mounted at the top opening of the second box body, the size of the second top plate is smaller than the size of the top opening of the second box body, and the second top plate is located in the middle of the opening of the second box body. The second connecting seat 730 is provided with a threaded hole matching the second lead screw, and the second connecting seat 730 is slidably arranged inside the cavity of the second box body. The top of the second connecting seat 730 is provided with a second extension portion, the second extension portion passes through and extends out of the gap formed between the second top plate and the opening of the second box body, and the wafer tray mechanism is fixedly mounted on the top of the second extension portion.

[0064] Here, it should be noted that a second placement platform is fixed on the side wall of the second box body, the second placement platform is in the shape of a concave plate with an opening facing upward, a second drag chain is fixed on the second placement platform, and the second drag chain is used to arrange the circuit of the second driving member 710. Thus, the exposed circuit is prevented from affecting the movement of the tray left-right moving mechanism 700 in the wafer bonding machine of the embodiment of the present application.

[0065] In a possible implementation, the wafer tray mechanism 500 includes a wafer blue film support 510, a wafer blue film tray 520 and a wafer blue film ejector pin 530. The wafer blue film support 510 is fixedly mounted on the top of the tray forward and backward moving mechanism 600. The wafer blue film tray 520 is fixedly mounted on the top of the wafer blue film support 510. The wafer blue film tray 520 extends out of the tray forward and backward moving mechanism 600. The wafer blue film ejector pin 530 is arranged at the bottom of the wafer blue film tray 520 to eject the wafer after bonding. The height of the wafer blue film support 510 is used to set the wafer blue film tray 520 to the most suitable height for wafer bonding. The wafer blue film ejector pin 530 can be used to eject the wafer after bonding from the wafer blue film tray 520. And here, it should be pointed out that the wafer blue film ejector pin 530 can be set on the machine base 800. After the wafer bonding is completed, the wafer blue film tray 520 moves to the appropriate position at the top of the wafer blue film ejector pin 530, and the wafer blue film ejector pin 530 ejects the wafer.

[0066] It should be pointed out here that the wafer blue film tray 520, the wafer blue film ejector pin 530 and the wafer blue film support 510 are all conventional technical means of relevant technical personnel in this field, and will not be described in detail here.

[0067] In a possible implementation, the mounting component forward and backward moving mechanism 300 includes a left bracket 310, a left slide 320, a left lead screw 330, a right bracket 340 and a right slide 350. The left bracket 310 and the right bracket 340 are both door-shaped. The left bracket 310 is arranged at the left end in the conveying direction of the workpiece conveying component, and the left bracket 310 is fixed to the top of the machine base 800. The right bracket 340 is arranged at the right end in the conveying direction of the workpiece conveying component, and the right bracket 340 is fixed to the bottom of the machine base 800. The left slide 320 is fixedly mounted on the top of the left bracket 310, and the left slide 320 is arranged along the length direction of the left bracket 310. The right slide 350 is fixedly mounted on the top of the right bracket 340, and the right slide 350 is arranged along the length direction of the right bracket 340. The left lead screw 330 is rotatably mounted on the top of the left bracket 310, and the left lead screw 330 is arranged parallel to the left slide 320. One end of the left lead screw 330 in the length direction is provided with a left lead screw 330 driving motor. Both ends of the mounting component left-right moving mechanism 400 are slidably connected to the left slide 320 and the right slide 350 . A left transmission component threadedly connected to the left lead screw 330 is provided on one side of the mounting component left-right moving mechanism 400 adjacent to the left lead screw 330 .

[0068] Here, it should be noted that the left slide 320 is arranged on a side of the left bracket 310 adjacent to the right bracket 340, the left lead screw 330 is arranged on a side of the left bracket 310 away from the right bracket 340, and a first rotating bracket and a second rotating bracket are arranged on the top of the left bracket 310. The first rotating bracket is block-shaped, and a first through hole matching the left lead screw 330 is provided on the first rotating bracket, and the first rotating bracket is arranged on one side in the length direction of the left bracket 310. The second rotating bracket is block-shaped, and a second through hole matching the left lead screw 330 is provided on the second rotating bracket, and the first through hole and the second through hole are arranged coaxially. The left lead screw 330 passes through the first through hole and the second through hole, so that the left lead screw 330 is mounted on the first rotating bracket and the second rotating bracket, and the left lead screw 330 driving motor can be fixedly installed on the side of the first rotating bracket away from the second rotating bracket, and the left lead screw 330 driving motor can be fixed to the left lead screw 330 through a coupling.

[0069] Here, it should also be pointed out that a light bar may be provided at the top end of the right bracket 340, and the light bar is arranged parallel to the right slide, thereby increasing the guiding effect on the left-right moving mechanism 400 of the mounted component.

[0070] In a possible implementation, the mounting component left-right moving mechanism 400 further includes a left slider 410, a rotating lead screw 420, a right slider 430 and a mounting mechanism slideway 440, wherein the left slider 410 is fixedly mounted at one end of the mounting mechanism slideway 440 in the sliding direction, and the right slider 430 is fixedly mounted at the other end of the mounting mechanism slideway in the sliding direction. The left slider 410 is slidably connected to the left slideway 320, and the right slider 430 is slidably connected to the right slideway 350. One end of the rotating lead screw 420 is rotatably mounted on the top of the left slider 410, and the other end of the rotating lead screw 420 is fixedly mounted on the top of the right slider 430. A mounting mechanism slider is provided on one side of the component mounting component 100 adjacent to the rotating lead screw 420, the mounting mechanism slider is rotatably connected to the rotating lead screw 420, and the mounting mechanism slider is slidably connected to the mounting mechanism slideway 440.

[0071] Here, it should be noted that the installation method of the rotating screw 420 can be the same as the installation method of the left screw 330, or it can be installed between the left slider 410 and the right slider 430 through a bearing frame.

[0072] Here, it should also be noted that a reinforcement member may be fixed between the left slider 410 and the right slider 430. The reinforcement member is in the shape of a rectangular plate. One side of the reinforcement member in the length direction is fixedly connected to the left slider 410, and the other side of the reinforcement member in the length direction is fixedly connected to the right slider 430. The mounting mechanism slide 440 is fixedly installed on the top of the reinforcement member. Here, it should also be noted that the mounting mechanism slide 440 may include two parallel tracks.

[0073] Here, it should also be noted that the mounting mechanism slider can be block-shaped, the bottom of the mounting mechanism slider is slidably connected to the mounting mechanism slideway 440, and the mounting mechanism slider is provided with a threaded hole matching the rotating lead screw 420 along the central axis direction of the rotating lead screw 420, so as to convert the movement of the rotating lead screw 420 in the rotation direction into the movement in a linear manner. Here, it should also be noted that the component mounting part 100 is a conventional technical means of relevant technical personnel in the field, and will not be described in detail here.

[0074] In a possible implementation, the workpiece conveying mechanism 200 includes a first conveying path 210 and a second conveying path 220 arranged in parallel in the horizontal direction, a first groove is provided on the side of the first conveying path 210 facing the second conveying path 220, and the first groove is provided along the length direction of the first conveying path 210, and a second groove is provided on the side of the second conveying path 220 facing the first conveying path 210, and the second groove is provided along the length direction of the second conveying path 220. A first belt conveying mechanism is provided inside the first groove, and a second belt conveying mechanism is provided inside the second groove, and a carrier plate is overlapped on the top of the conveying belt of the first belt transmission mechanism and the top of the conveying belt of the second belt transmission mechanism to drive the carrier plate.

[0075] It should be pointed out here that the configuration of the first belt conveying mechanism and the second belt conveying mechanism are conventional technical means of relevant technical personnel in the field, and will not be elaborated here.

[0076] In a possible implementation, a component feeding component 900 is further included, and the component feeding component 900 is arranged on a side of the workpiece conveying mechanism 200 away from the wafer tray mechanism 500, and the feeding direction of the component feeding component 900 is arranged toward the workpiece conveying mechanism 200. It should be pointed out here that the component feeding component 900 is a conventional technical means of those skilled in the art, and will not be described in detail here.

[0077] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A wafer bonding machine, characterized in that: It includes component placement parts, workpiece conveying mechanism, placement part forward and backward moving mechanism, placement part left and right moving mechanism, wafer tray mechanism, tray forward and backward moving mechanism and tray left and right moving mechanism; Wherein, the workpiece conveying mechanism is arranged horizontally and is used for conveying components in a horizontal direction; The mounting component forward and backward moving mechanism is arranged at the conveying direction end of the workpiece conveying mechanism, the mounting component left and right moving mechanism is arranged at the top of the workpiece conveying mechanism, and the mounting component left and right moving mechanism is slidably connected with the mounting component forward and backward moving mechanism; The component mounting component is slidably mounted on the mounting component left-right moving mechanism, and the mounting head of the component mounting component is arranged toward the workpiece conveying mechanism; The pallet forward and backward moving mechanism is arranged on one side of the workpiece conveying mechanism, and the pallet forward and backward moving mechanism is arranged adjacent to the workpiece conveying mechanism; The tray left-right moving mechanism is slidably mounted on the top of the tray front-back moving mechanism, and an angle is provided between the tray front-back moving mechanism and the tray left-right moving mechanism; The wafer tray mechanism is fixedly mounted on the top of the tray left-right moving mechanism and is used for placing wafers mounted by the component mounting part.

2. The wafer bonding machine according to claim 1, characterized in that: The tray forward and backward movement mechanism includes a first driving member, a first slideway and a first connecting seat; The first slideway is arranged at one side of the workpiece conveying mechanism, and the first slideway is arranged along the forward and backward movement mechanism of the mounting component; The first driving member is fixedly mounted on a side of the first slideway away from the workpiece conveying mechanism, the output shaft of the first driving member is arranged toward the workpiece conveying mechanism, a first lead screw is fixedly mounted on the output shaft of the first driving member, the first connecting seat is threadedly connected to the first lead screw, and the first connecting seat is slidably connected to the first slideway; The tray left-right moving mechanism is fixedly installed on the top of the first connecting seat.

3. The wafer bonding machine according to claim 2, characterized in that: The first slide includes a first box body with an opening on the top and a first top plate; The first box body is arranged along the forward and backward movement mechanism of the mounting component, the first driving member is fixedly installed on a side of the first box body away from the workpiece conveying mechanism, and the output shaft of the first driving member passes through the side wall of the first box body; The first top plate is fixedly mounted at the top opening of the first box body, the size of the first top plate is smaller than the size of the top opening of the first box body, and the first top plate is located in the middle of the opening of the first box body; The first connecting seat is provided with a threaded hole matching the first lead screw, and the first connecting seat is slidably arranged inside the cavity of the first box body; A first extension portion is provided on the top of the first connecting seat. The first extension portion penetrates and extends out of a gap formed between the first top plate and the first box body opening. The tray left-right moving mechanism is fixedly mounted on the top of the first extension portion.

4. The wafer bonding machine according to claim 3, characterized in that: A first placement platform is fixed on the side wall of the first box body, and the first placement platform is in the shape of a concave plate with an opening facing upward; A first drag chain is fixed on the first placement table, and the first drag chain is used to arrange the line of the first driving member.

5. The wafer bonding machine according to claim 1, characterized in that: The tray forward and backward moving mechanism is vertically arranged with the tray left and right moving mechanism, and the tray forward and backward moving mechanism has the same structure with the tray left and right moving mechanism.

6. The wafer bonding machine according to claim 1, characterized in that: The wafer tray mechanism comprises a wafer blue film tray, a wafer blue film ejector pin and a wafer blue film support; The wafer blue film support is fixedly mounted on the top of the tray forward and backward moving mechanism, the wafer blue film tray is fixedly mounted on the top of the wafer blue film support, and the wafer blue film tray extends out of the tray forward and backward moving mechanism; The wafer blue film ejector pin is arranged at the bottom of the wafer blue film tray and is used to eject the wafer after bonding.

7. The wafer bonding machine according to claim 1, characterized in that: The mounting component forward and backward movement mechanism comprises a left bracket, a left slide, a left lead screw, a right bracket and a right slide; The left bracket and the right bracket are both door-shaped, the left bracket is arranged at the left end of the workpiece conveying component in the conveying direction, and the right bracket is arranged at the right end of the workpiece conveying component in the conveying direction; The left slide is fixedly mounted on the top of the left bracket, and the left slide is arranged along the length direction of the left bracket; the right slide is fixedly mounted on the top of the right bracket, and the right slide is arranged along the length direction of the right bracket; The left lead screw is rotatably mounted on the top of the left bracket, the left lead screw is arranged parallel to the left slideway, and a left lead screw driving motor is arranged at one end of the left lead screw in the length direction; Both ends of the mounting component left-right moving mechanism are slidably connected to the left slideway and the right slideway; A left transmission component threadedly connected to the left lead screw is provided on one side of the mounting component left-right moving mechanism adjacent to the left lead screw.

8. The wafer bonding machine according to claim 7, characterized in that: The mounting component left-right moving mechanism also includes a left slider, a rotating lead screw, a right slider and a mounting mechanism slideway; The left slider is fixedly mounted on one end of the slideway of the mounting mechanism in the sliding direction, and the right slider is fixedly mounted on the other end of the slideway of the mounting mechanism in the sliding direction; The left slider is slidably connected to the left slideway, and the right slider is slidably connected to the right slideway; One end of the rotating lead screw is rotatably mounted on the top of the left slider, and the other end of the rotating lead screw is fixedly mounted on the top of the right slider; A mounting mechanism slider is provided on one side of the component mounting part adjacent to the rotating lead screw. The mounting mechanism slider is rotationally connected to the rotating lead screw, and the mounting mechanism slider is slidingly connected to the mounting mechanism slideway.

9. The wafer bonding machine according to claim 1, characterized in that: The workpiece conveying mechanism comprises a first conveying path and a second conveying path arranged in parallel in a horizontal direction; A first groove is formed on a side of the first conveying path facing the second conveying path, and the first groove is formed along the length direction of the first conveying path; a second groove is formed on a side of the second conveying path facing the first conveying path, and the second groove is formed along the length direction of the second conveying path; A first belt conveying mechanism is disposed inside the first groove, and a second belt conveying mechanism is disposed inside the second groove. A carrier plate is overlapped on the top of the conveyor belts of the first belt conveying mechanism and the second belt conveying mechanism for driving the carrier plate.

10. The wafer bonding machine according to claim 1, characterized in that: It also includes a component feeding component, which is arranged on a side of the workpiece conveying mechanism away from the wafer tray mechanism, and the feeding direction of the component feeding component is arranged toward the workpiece conveying mechanism.

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